CN114226185B - Conveying system based on Internet of things circuit board and manufacturing method thereof - Google Patents
Conveying system based on Internet of things circuit board and manufacturing method thereof Download PDFInfo
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- CN114226185B CN114226185B CN202210144077.0A CN202210144077A CN114226185B CN 114226185 B CN114226185 B CN 114226185B CN 202210144077 A CN202210144077 A CN 202210144077A CN 114226185 B CN114226185 B CN 114226185B
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- dispensing
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000003292 glue Substances 0.000 claims abstract description 132
- 238000001514 detection method Methods 0.000 claims abstract description 124
- 238000001035 drying Methods 0.000 claims abstract description 6
- 238000003860 storage Methods 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 239000002918 waste heat Substances 0.000 claims description 6
- 230000007306 turnover Effects 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 230000006855 networking Effects 0.000 claims 1
- 238000012216 screening Methods 0.000 abstract description 6
- 238000007711 solidification Methods 0.000 abstract description 3
- 230000008023 solidification Effects 0.000 abstract description 3
- 230000001133 acceleration Effects 0.000 abstract description 2
- 238000004891 communication Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/04—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to opposite sides of the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V9/00—Prospecting or detecting by methods not provided for in groups G01V1/00 - G01V8/00
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- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Geophysics (AREA)
- Coating Apparatus (AREA)
Abstract
The invention belongs to the technical field of circuit board conveying systems, and particularly relates to a conveying system based on an Internet of things circuit board and a manufacturing method thereof, wherein the conveying system comprises: the device comprises a first conveying device, a second conveying device, a first dispensing device, a second dispensing device, a detection plate and a first driving device; wherein, the first glue dispensing device is used for dispensing; the detection plate dries the dispensing position on the circuit board through the arc-shaped grooves and the embedding grooves and marks the L-shaped pins; the detection board is turned for 90 degrees to make glue at the dispensing position on the circuit board drop; the detection board is turned for 180 degrees to convey the circuit board and carry out glue dispensing; according to the invention, the joint of the front side and the back side of the circuit board and the pins can be subjected to dispensing, and the circuit board is clamped into the detection board to carry out drying and solidification acceleration on the dispensing position through the cooperation of the first conveying device and the detection board, and each pin or the front side and the back side of the circuit board are marked, so that unqualified products can be conveniently screened, and the conveying and screening efficiency can be improved.
Description
Technical Field
The invention belongs to the technical field of circuit board conveying systems, and particularly relates to a conveying system based on an internet of things circuit board and a manufacturing method thereof.
Background
A plurality of pins need to be inserted into each circuit board, the positions where the pins are connected with the circuit board need to be glued and fixed, the circuit board is glued in a manual mode in the traditional mode, the efficiency is low, meanwhile, the glue dispensing position needs to be naturally solidified, and the time period is too long.
Because the fixed region arranged on the circuit board is required to be inserted with pins, the pins are easy to be omitted in the production and manufacturing process of the circuit board, the pins need to be rechecked manually, and the detection efficiency is low.
Therefore, it is necessary to develop a new internet-of-things circuit board-based conveying system and a manufacturing method thereof to solve the above problems.
Disclosure of Invention
The invention aims to provide a conveying system based on an internet of things circuit board and a manufacturing method thereof.
In order to solve the technical problem, the invention provides a conveying system based on an internet of things circuit board, which comprises: the device comprises a first conveying device, a second conveying device, a first dispensing device, a second dispensing device, a detection plate and a first driving device; the first dispensing device and the second dispensing device are respectively arranged above the first conveying device and the second conveying device, the detection plate is positioned between the first conveying device and the second conveying device, and the movable part of the first driving device is connected with the detection plate; a plurality of pin holes are arranged on the circuit board, and corresponding L-shaped pins penetrate into the pin holes; the first conveying device conveys the circuit board to a first dispensing device, and the first dispensing device dispenses the joints of the pin holes and the corresponding L-shaped pins on the front surface of the circuit board; the detection plate is provided with a cavity, two opposite side surfaces of the detection plate are respectively provided with a first exposure hole and a second exposure hole, the first exposure hole and the second exposure hole are communicated with the cavity to form a conveying channel, the upper edge of the first exposure hole is provided with an arc-shaped groove, and the lower edge of the first exposure hole is provided with a plurality of embedded grooves; the first driving device drives the detection board to overturn so that the first exposed hole is aligned with the output position of the first conveying device, so that the circuit board conveyed by the first conveying device is inserted into the conveying channel in the detection board until the L-shaped pins on the circuit board are clamped into the arc-shaped grooves and the embedded grooves, and the detection board dries the dispensing positions on the circuit board and marks the L-shaped pins through the arc-shaped grooves and the embedded grooves; the first driving device drives the detection plate to turn 90 degrees to enable the second exposure hole to face downwards, so that glue at the dispensing position on the circuit board drips along the cavity and the second exposure hole; the first driving device drives the detection board to turn 180 degrees so that the first exposure hole is aligned with the input position of the second conveying device, the circuit board is separated from the detection board under the driving of the second conveying device and moves along the conveying direction, namely the second conveying device conveys the circuit board to the second glue dispensing device, the second glue dispensing device is used for dispensing glue at the joint of each pin hole and the corresponding L-shaped pin at the upper back of the circuit board, and the glue dispensing position on the circuit board is dried through waste heat; and a marking layer is arranged on the inner wall of the detection plate, and marking liquid is injected into the marking layer so as to mark the circuit board passing through the conveying channel.
Furthermore, the circuit board conveyed by the first conveying device is inserted into a conveying channel in the detection board, the bent part of the upper half part of the L-shaped pin is abutted against the arc-shaped groove, namely, a heat-conducting agent is coated in the arc-shaped groove, and a heating plate is arranged in the detection board to dry the dispensing part on the circuit board.
Furthermore, the lower half parts of the L-shaped pins penetrate out of the circuit board and abut against the corresponding embedded grooves, namely buffer layers are arranged in the embedded grooves, and marking liquid is filled in the buffer layers to mark the L-shaped pins embedded in the corresponding embedded grooves.
Further, a collecting box is arranged below the detection plate and used for collecting glue dripping along the cavity and the second exposure hole.
Further, the collecting box is connected with the first glue dispensing device and the second glue dispensing device, and glue collected in the collecting box is conveyed to the first glue dispensing device and the second glue dispensing device through a glue conveying pump.
Further, the first dispensing device and the second dispensing device have the same structure and both comprise: the glue dispensing device comprises a glue storage tank, a glue conveying pump, a glue conveying pipeline, a glue dispensing nozzle, a movable plate and a longitudinal rail; the dispensing nozzle is arranged on the moving plate and faces the first conveying device; the movable plate movable mounting is on vertical track, the glue bin is through defeated gluey pump, defeated gluey pipeline connection point glue nozzle, promptly the movable plate removes on vertical track through corresponding drive assembly, so that the glue bin is through defeated gluey pump, defeated gluey pipeline with glue carry to some glue nozzles, and by some glue nozzles carry out some glue to the circuit board.
Further, the first conveying device includes: a first conveyor belt; the first conveying belt is arranged in a slope mode, so that the circuit board is inserted into the detection board at the output position of the first conveying belt.
Further, the second conveying device includes: the detection module is arranged above the second conveying belt; the detection module detects the marked position on the circuit board conveyed by the second conveying belt so as to convey the circuit board to the corresponding position according to the corresponding detection result.
Further, the first driving device includes: rotating the motor; the movable part of the rotating motor is connected with the detection plate so as to drive the detection plate to turn over by a corresponding angle.
On the other hand, the invention provides a manufacturing method based on an internet of things circuit board, which comprises the following steps: conveying the circuit board to a first dispensing device through a first conveying device, and dispensing the joints of the pin holes and the corresponding L-shaped pins on the front surface of the circuit board through the first dispensing device; the detection plate is provided with a cavity, a first exposure hole and a second exposure hole are respectively arranged on two opposite side surfaces of the detection plate, the first exposure hole and the second exposure hole are communicated with the cavity to form a conveying channel, an arc-shaped groove is arranged on the upper edge of the first exposure hole, and a plurality of embedded grooves are arranged on the lower edge of the first exposure hole; the first driving device drives the detection plate to overturn so that the first exposed hole is aligned to the output position of the first conveying device, so that the circuit board conveyed by the first conveying device is inserted into the conveying channel in the detection plate until the L-shaped pins on the circuit board are clamped into the arc-shaped grooves and the embedded grooves, and the detection plate dries the dispensing positions on the circuit board and marks the L-shaped pins through the arc-shaped grooves and the embedded grooves; the first driving device drives the detection plate to turn 90 degrees to enable the second exposure hole to face downwards, so that glue at the dispensing position on the circuit board drips along the cavity and the second exposure hole; the first driving device drives the detection plate to turn 180 degrees so that the first exposed hole is aligned with an input position of the second conveying device, and the circuit board is driven by the second conveying device to be separated from the detection plate and move along the conveying direction; conveying the circuit board to a second glue dispensing device through a second conveying device, dispensing glue at the joint of each pin hole and the corresponding L-shaped pin at the back of the circuit board through the second glue dispensing device, and drying the glue dispensing position on the circuit board through waste heat; a marking layer is arranged on the inner wall of the detection plate, and marking liquid is injected into the marking layer to mark the circuit board passing through the conveying channel.
The invention has the advantages that the invention can carry out glue dispensing on the joints of the front and back sides of the circuit board and the pins, and simultaneously, the first conveying device is matched with the detection board, so that the circuit board is clamped into the detection board to carry out drying and solidification acceleration on the glue dispensing positions, and each pin or the front and back sides of the circuit board are marked, thereby facilitating the screening of unqualified products and improving the conveying and screening efficiency.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a self-contained view of an internet of things circuit board based delivery system of the present invention;
FIG. 2 is a block diagram of the wiring board of the present invention;
FIG. 3 is a block diagram of the detector plate of the present invention;
FIG. 4 is a cross-sectional view of the sensing plate of the present invention;
fig. 5 is a structural view of the first dispensing device of the present invention.
In the figure:
1. a first conveying device;
2. a second conveying device;
3. a first dispensing device; 31. glue storage box; 32. a glue conveying pipeline; 33. dispensing nozzles; 34. moving the plate; 35. a longitudinal rail;
4. a second glue dispensing device;
5. detecting a plate; 51. a first exposure hole; 52. a delivery channel; 53. an arc-shaped slot; 54. a groove is embedded; 55. a marking layer;
6. a first driving device; 61. rotating the motor;
7. a collection box;
8. a circuit board; 81. an L-shaped pin.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
In this embodiment, as shown in fig. 1 to 5, this embodiment provides a conveying system based on a circuit board of an internet of things, which includes: the device comprises a first conveying device 1, a second conveying device 2, a first glue dispensing device 3, a second glue dispensing device 4, a detection plate 5 and a first driving device 6; the first dispensing device 3 and the second dispensing device 4 are respectively arranged above the first conveying device 1 and the second conveying device 2, the detection plate 5 is positioned between the first conveying device 1 and the second conveying device 2, and the movable part of the first driving device 6 is connected with the detection plate 5; a plurality of pin holes are arranged on the circuit board 8, and corresponding L-shaped pins 81 penetrate into the pin holes; the first conveying device 1 conveys the circuit board 8 to a first dispensing device 3, and the first dispensing device 3 dispenses the joints of the pin holes and the corresponding L-shaped pins 81 on the front surface of the circuit board 8; the detection plate 5 is provided with a cavity, two opposite side surfaces of the detection plate 5 are respectively provided with a first exposure hole 51 and a second exposure hole, the first exposure hole 51 and the second exposure hole are communicated with the cavity to form a conveying channel 52, an arc-shaped groove 53 is formed in the upper edge of the first exposure hole 51, and a plurality of embedded grooves 54 are formed in the lower edge of the first exposure hole 51; the first driving device 6 drives the detection plate 5 to turn over so that the first exposure holes 51 are aligned with the output position of the first conveying device 1, so that the circuit board 8 conveyed by the first conveying device 1 is inserted into the conveying channel 52 in the detection plate 5 until the L-shaped pins 81 on the circuit board 8 are clamped into the arc-shaped grooves 53 and the embedded grooves 54, and the detection plate 5 dries the dispensing positions on the circuit board 8 and marks the L-shaped pins 81 through the arc-shaped grooves 53 and the embedded grooves 54; the first driving device 6 drives the detection plate 5 to turn 90 degrees to enable the second exposure hole to face downwards, so that glue at the dispensing position on the circuit board 8 drips along the cavity and the second exposure hole; the first driving device 6 drives the detection board 5 to turn over by 180 degrees so that the first exposure holes 51 are aligned with the input position of the second conveying device 2, so that the circuit board 8 is driven by the second conveying device 2 to be separated from the detection board 5 and move along the conveying direction, namely, the second conveying device 2 conveys the circuit board 8 to the second glue dispensing device 4, the second glue dispensing device 4 performs glue dispensing on the joints of the pin holes and the corresponding L-shaped pins 81 on the upper back surface of the circuit board 8, and the glue dispensing positions on the circuit board 8 are dried through waste heat; and a marking layer 55 is arranged on the inner wall of the detection plate 5, and marking liquid is injected into the marking layer 55 so as to mark the circuit board 8 passing through the conveying channel 52.
In this embodiment, this embodiment can carry out some glue to 8 positive and negative sides of circuit board and pin junction, cooperates with pick-up plate 5 through first conveyor 1 simultaneously for 8 cards of circuit board are gone into pick-up plate 5 and are dried solidification-accelerating to some glue department, and mark every pin or 8 positive and negative sides of circuit board, conveniently screen the defective products, can improve transport, screening efficiency.
First conveying device 1
The first conveyor device 1 mainly functions to convey the circuit board 8, and is capable of feeding the circuit board 8 to the detection board 5, so that the circuit board 8 is inserted into the detection board 5.
Second conveying device 2
The second conveying device 2 is used for driving the detection plate 5 to continue conveying along the conveying direction after contacting the detection plate 5, and meanwhile the second conveying device 2 can detect the marked positions of the circuit boards 8, namely the corresponding circuit boards 8 are conveyed to a qualified product area when a specified number of L-shaped pins 81 are detected, and the corresponding circuit boards 8 are conveyed to a corresponding unqualified product area when the specified number of L-shaped pins 81 are detected or the front and back surfaces of the circuit boards 8 are marked.
First dispensing device 3
The first dispensing device 3 mainly performs dispensing on the joints of the pin holes and the corresponding L-shaped pins 81 on the front surface of the circuit board 8, and can improve the dispensing efficiency.
Second glue dispensing device 4
The second glue dispensing device 4 mainly performs a glue dispensing function on the connection between each pin hole on the back surface of the circuit board 8 and the corresponding L-shaped pin 81, and can improve the glue dispensing efficiency.
The detection plate 5 mainly plays a role in drying and marking the circuit board 8, if the corresponding L-shaped pins 81 penetrate into the pin holes on the circuit board 8, the circuit board 8 can be clamped in the detection plate 5, meanwhile, the arc-shaped grooves 53 and the embedded grooves 54 dry glue dispensing positions on the circuit board 8 and mark the L-shaped pins 81, when the detection plate 5 is turned over for 90 degrees, redundant glue can fall into the collection box 7 along the conveying channel 52 to be reused, and when the detection plate 5 is turned over for 180 degrees, the circuit board 8 advances along the second conveying device 2 to dispense glue on a turning surface; if the corresponding L-shaped pins 81 do not penetrate into the pin holes on the circuit board 8, the circuit board 8 directly slides to the second conveying device 2 from the conveying channel 52 in the detection plate 5, and the front and back sides of the circuit board 8 are marked by the marking layers 55 on the inner wall of the detection plate 5 in the process, so that the second conveying device 2 can conveniently screen the circuit board.
First drive device 6
The first driving device 6 mainly plays a role of turning the detection plate 5, and realizes the form change of the detection plate 5.
In this embodiment, the circuit board 8 conveyed by the first conveying device 1 is inserted into the conveying channel 52 in the detection board 5, the upper half bending part of the L-shaped pin 81 abuts against the arc-shaped groove 53, that is, the heat conducting agent is coated in the arc-shaped groove 53, and the heating board is arranged in the detection board 5 to dry the dispensing part on the circuit board 8.
In this embodiment, the circuit board 8 is dried by the heat conducting agent, and at the same time, when the circuit board 8 travels to the second dispensing device 4, residual heat still exists, and the circuit board 8 is dried again by the residual heat.
In this embodiment, the lower half portions of the L-shaped pins 81 penetrate out of the circuit board 8 and abut against the corresponding embedded grooves 54, that is, a buffer layer is disposed in each embedded groove 54, and a marking liquid is filled in the buffer layer to mark the L-shaped pins 81 embedded in the corresponding embedded grooves 54.
In this embodiment, the buffer layer plays a role in marking the L-shaped pins 81, and can mark each L-shaped pin 81 on the circuit board 8, and the circuit board 8 can be summarized conveniently by detecting the mark of the L-shaped pin 81 at the second conveying device 2.
In this embodiment, a collecting box 7 is arranged below the detection plate 5 for collecting glue dripping down along the cavity and the second exposure hole.
In this embodiment, the collecting box 7 is connected to the first dispensing device 3 and the second dispensing device 4, and the glue collected in the collecting box 7 is delivered to the first dispensing device 3 and the second dispensing device 4 by a glue delivery pump.
In this embodiment, through setting up collecting box 7, realize glue reuse, practice thrift the processing cost.
In this embodiment, the first dispensing device 3 and the second dispensing device 4 have the same structure, and both include: a glue storage tank 31, a glue delivery pump, a glue delivery pipeline 32, a glue dispensing nozzle 33, a movable plate 34 and a longitudinal rail 35; the dispensing nozzle 33 is mounted on the moving plate 34, and the dispensing nozzle 33 is arranged towards the first conveying device 1; the movable plate 34 is movably mounted on the longitudinal rail 35, the glue storage tank 31 is connected with the glue dispensing nozzle 33 through the glue conveying pump and the glue conveying pipeline 32, namely, the movable plate 34 moves on the longitudinal rail 35 through the corresponding driving part, so that the glue storage tank 31 conveys glue to the glue dispensing nozzle 33 through the glue conveying pump and the glue conveying pipeline 32, and the glue is dispensed on the circuit board 8 through the glue dispensing nozzle 33.
In the present embodiment, the first conveyor 1 includes: a first conveyor belt; the first conveyor belt is sloped to allow the first conveyor belt to insert the circuit board 8 into the detection plate 5 at the output position.
In the present embodiment, the second conveyor 2 includes: the detection module is arranged above the second conveying belt; the detection module detects the marked position on the circuit board 8 conveyed by the second conveyor belt so as to convey the circuit board 8 to the corresponding position according to the corresponding detection result.
In the present embodiment, the first driving device 6 includes: a rotating motor 61; the movable part of the rotating motor 61 is connected with the detection plate 5 to drive the detection plate 5 to turn by a corresponding angle.
Example 2
On the basis of embodiment 1, the present embodiment provides a manufacturing method for a circuit board based on the internet of things, which includes: conveying the circuit board 8 to a first dispensing device 3 through a first conveying device 1, and dispensing the joints of the pin holes and the corresponding L-shaped pins 81 on the front surface of the circuit board 8 by the first dispensing device 3; the detection plate 5 is provided with a cavity, two opposite side surfaces of the detection plate 5 are respectively provided with a first exposure hole 51 and a second exposure hole, so that the first exposure hole 51 and the second exposure hole are communicated with the cavity to form a conveying channel 52, an arc-shaped groove 53 is arranged on the upper edge of the first exposure hole 51, and a plurality of embedded grooves 54 are arranged on the lower edge of the first exposure hole 51; the first driving device 6 drives the detection plate 5 to overturn so that the first exposure holes 51 are aligned with the output position of the first conveying device 1, so that the circuit board 8 conveyed by the first conveying device 1 is inserted into the conveying channel 52 in the detection plate 5 until the L-shaped pins 81 on the circuit board 8 are clamped into the arc-shaped grooves 53 and the embedded grooves 54, and the detection plate 5 dries the dispensing positions on the circuit board 8 and marks the L-shaped pins 81 through the arc-shaped grooves 53 and the embedded grooves 54; the first driving device 6 drives the detection plate 5 to turn over for 90 degrees to enable the second exposure hole to face downwards, so that glue at the dispensing position on the circuit board 8 drips along the cavity and the second exposure hole; the first driving device 6 drives the detection plate 5 to turn 180 degrees so that the first exposure holes 51 are aligned with the input position of the second conveying device 2, and the circuit board 8 is driven by the second conveying device 2 to be separated from the detection plate 5 and move along the conveying direction; conveying the circuit board 8 to a second glue dispensing device 4 through a second conveying device 2, dispensing glue at the joints of the pin holes and the corresponding L-shaped pins 81 on the upper back surface of the circuit board 8 through the second glue dispensing device 4, and drying the glue dispensing positions on the circuit board 8 through waste heat; a marking layer 55 is provided on the inner wall of the detection plate 5, and a marking liquid is injected into the marking layer 55 to mark the wiring board 8 passing through the conveyance path 52.
In this embodiment, the circuit board 8 conveyed by the first conveying device 1 is inserted into the conveying channel 52 in the detection board 5, the upper half bending part of the L-shaped pin 81 abuts against the arc-shaped groove 53, that is, the heat conducting agent is coated in the arc-shaped groove 53, and the heating board is arranged in the detection board 5 to dry the dispensing part on the circuit board 8.
In this embodiment, the circuit board 8 is dried by the heat conducting agent, and at the same time, when the circuit board 8 travels to the second dispensing device 4, residual heat still exists, and the circuit board 8 is dried again by the residual heat.
In this embodiment, the lower half portions of the L-shaped pins 81 penetrate out of the circuit board 8 and abut against the corresponding embedded grooves 54, that is, a buffer layer is disposed in each embedded groove 54, and a marking liquid is filled in the buffer layer to mark the L-shaped pins 81 embedded in the corresponding embedded grooves 54.
In this embodiment, the buffer layer plays a role in marking the L-shaped pins 81, and can mark each L-shaped pin 81 on the circuit board 8, and the circuit board 8 can be summarized conveniently by detecting the mark of the L-shaped pin 81 at the second conveying device 2.
In this embodiment, a collecting box 7 is arranged below the detection plate 5 for collecting glue dripping down along the cavity and the second exposure hole.
In this embodiment, the collecting box 7 is connected to the first dispensing device 3 and the second dispensing device 4, and the glue collected in the collecting box 7 is delivered to the first dispensing device 3 and the second dispensing device 4 by a glue delivery pump.
In this embodiment, through setting up collecting box 7, realize glue reuse, practice thrift the processing cost.
In this embodiment, the first dispensing device 3 and the second dispensing device 4 have the same structure, and both include: a glue storage tank 31, a glue delivery pump, a glue delivery pipeline 32, a glue dispensing nozzle 33, a movable plate 34 and a longitudinal rail 35; the dispensing nozzle 33 is mounted on the moving plate 34, and the dispensing nozzle 33 is arranged towards the first conveying device 1; the movable plate 34 is movably mounted on the longitudinal rail 35, the glue storage tank 31 is connected with the glue dispensing nozzle 33 through the glue conveying pump and the glue conveying pipeline 32, namely, the movable plate 34 moves on the longitudinal rail 35 through the corresponding driving part, so that the glue storage tank 31 conveys glue to the glue dispensing nozzle 33 through the glue conveying pump and the glue conveying pipeline 32, and the glue is dispensed on the circuit board 8 through the glue dispensing nozzle 33.
In the present embodiment, the first conveyor 1 includes: a first conveyor belt; the first conveyor belt is sloped to allow the first conveyor belt to insert the circuit board 8 into the detection plate 5 at the output position.
In the present embodiment, the second conveyor 2 includes: the detection module is arranged above the second conveying belt; the detection module detects the marked position on the circuit board 8 conveyed by the second conveyor belt so as to convey the circuit board 8 to the corresponding position according to the corresponding detection result.
In the present embodiment, the first driving device 6 includes: a rotating motor 61; the movable part of the rotating motor 61 is connected with the detection plate 5 to drive the detection plate 5 to turn by a corresponding angle.
In summary, the invention can dispense glue at the joints of the front and back sides of the circuit board and the pins, and simultaneously, the first conveying device is matched with the detection board, so that the circuit board is clamped into the detection board to dry and accelerate the solidification process of the glue dispensing position, and each pin or the front and back sides of the circuit board are marked, thereby facilitating the screening of unqualified products and improving the conveying and screening efficiency.
The components selected for use in the present application (components not illustrated for specific structures) are all common standard components or components known to those skilled in the art, and the structure and principle thereof can be known to those skilled in the art through technical manuals or through routine experimentation.
In the description of the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one logical division, and there may be other divisions when actually implemented, and for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of devices or units through some communication interfaces, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (10)
1. The utility model provides a conveying system based on thing networking circuit board which characterized in that includes:
the device comprises a first conveying device, a second conveying device, a first dispensing device, a second dispensing device, a detection plate and a first driving device; wherein
The first dispensing device is arranged above the first conveying device, the second dispensing device is arranged above the second conveying device, the detection plate is positioned between the first conveying device and the second conveying device, and the movable part of the first driving device is connected with the detection plate;
a plurality of pin holes are arranged on the circuit board, and corresponding L-shaped pins penetrate into the pin holes;
the first conveying device conveys the circuit board to a first dispensing device, and the first dispensing device dispenses the joints of the pin holes and the corresponding L-shaped pins on the front surface of the circuit board;
the detection plate is provided with a cavity, two opposite side surfaces of the detection plate are respectively provided with a first exposure hole and a second exposure hole, the first exposure hole and the second exposure hole are communicated with the cavity to form a conveying channel, the upper edge of the first exposure hole is provided with an arc-shaped groove, and the lower edge of the first exposure hole is provided with a plurality of embedded grooves;
the first driving device drives the detection plate to overturn so that the first exposed hole is aligned to the output position of the first conveying device, so that the circuit board conveyed by the first conveying device is inserted into the conveying channel in the detection plate until the L-shaped pins on the circuit board are clamped into the arc-shaped grooves and the embedding grooves, the detection plate dries the dispensing positions on the circuit board through the arc-shaped grooves, and the detection plate marks the L-shaped pins on the circuit board through the embedding grooves;
the first driving device drives the detection plate to turn 90 degrees to enable the second exposure hole to face downwards, so that glue at the dispensing position on the circuit board drips along the cavity and the second exposure hole;
the first driving device drives the detection plate to turn 180 degrees so that the first exposed hole is aligned with the input position of the second conveying device, and the circuit board is separated from the detection plate and travels along the conveying direction under the driving of the second conveying device, namely
The second conveying device conveys the circuit board to a second glue dispensing device, the second glue dispensing device performs glue dispensing on the joints of the pin holes and the corresponding L-shaped pins on the back surface of the circuit board, and the glue dispensing positions on the circuit board are dried through waste heat; and
and a marking layer is arranged on the inner wall of the detection plate, and marking liquid is injected into the marking layer so as to mark the circuit board, which does not penetrate into the corresponding L-shaped pin in the pin hole, when the circuit board passes through the conveying channel.
2. The Internet of things circuit board-based delivery system of claim 1,
the circuit board conveyed by the first conveying device is inserted into a conveying channel in the detection plate, and the bent part of the upper half part of the L-shaped pin is abutted against the arc-shaped groove, namely
The arc-shaped groove is internally coated with a heat conducting agent, and the detection plate is internally provided with a heating plate to dry the dispensing position on the circuit board.
3. The Internet of things circuit board-based delivery system of claim 2,
the lower half part of the L-shaped pin is propped against the corresponding embedded groove from the position where the circuit board penetrates out, namely
A buffer layer is arranged in each embedded groove, and marking liquid is filled in the buffer layer to mark the L-shaped pins embedded into the corresponding embedded grooves.
4. The Internet of things circuit board-based delivery system of claim 1,
and a collecting box is arranged below the detection plate and used for collecting the glue dripped along the cavity and the second exposure hole.
5. The Internet of things circuit board-based delivery system of claim 4,
the collecting box is connected with the first glue dispensing device and the second glue dispensing device, and the glue collected in the collecting box is conveyed to the first glue dispensing device and the second glue dispensing device through the glue conveying pump.
6. The Internet of things circuit board-based delivery system of claim 1,
the first dispensing device and the second dispensing device have the same structure and both comprise:
the glue dispensing device comprises a glue storage tank, a glue conveying pump, a glue conveying pipeline, a glue dispensing nozzle, a movable plate and a longitudinal rail;
the dispensing nozzle is arranged on the moving plate and faces the first conveying device;
the movable plate is movably arranged on the longitudinal rail, and the glue storage tank is connected with a glue dispensing nozzle through a glue delivery pump and a glue delivery pipeline, namely
The movable plate moves on the longitudinal rail through the corresponding driving part, so that the glue storage tank conveys glue to the glue dispensing nozzle through the glue conveying pump and the glue conveying pipeline, and the circuit board is subjected to glue dispensing through the glue dispensing nozzle.
7. The Internet of things circuit board-based delivery system of claim 1,
the first conveying device includes: a first conveyor belt;
the first conveying belt is arranged in a slope mode, so that the circuit board is inserted into the detection board at the output position of the first conveying belt.
8. The Internet of things circuit board-based delivery system of claim 1,
the second conveying device includes: the detection module is arranged above the second conveying belt;
the detection module detects the marked position on the circuit board conveyed by the second conveying belt so as to convey the circuit board to the corresponding position according to the corresponding detection result.
9. The Internet of things circuit board-based delivery system of claim 1,
the first driving device includes: rotating the motor;
the movable part of the rotating motor is connected with the detection plate so as to drive the detection plate to turn over by a corresponding angle.
10. A manufacturing method based on an Internet of things circuit board is characterized by comprising the following steps:
the internet of things circuit board-based conveying system is suitable for detecting the circuit board by adopting the internet of things circuit board-based conveying system as claimed in any one of claims 1-9;
conveying the circuit board to a first dispensing device through a first conveying device, and dispensing the joints of the pin holes and the corresponding L-shaped pins on the front surface of the circuit board through the first dispensing device;
the detection plate is provided with a cavity, a first exposure hole and a second exposure hole are respectively arranged on two opposite side surfaces of the detection plate, the first exposure hole and the second exposure hole are communicated with the cavity to form a conveying channel, an arc-shaped groove is arranged on the upper edge of the first exposure hole, and a plurality of embedded grooves are arranged on the lower edge of the first exposure hole;
the first driving device drives the detection plate to overturn so that the first exposed hole is aligned to the output position of the first conveying device, so that the circuit board conveyed by the first conveying device is inserted into the conveying channel in the detection plate until the L-shaped pins on the circuit board are clamped into the arc-shaped grooves and the embedded grooves, and the detection plate dries the dispensing positions on the circuit board and marks the L-shaped pins through the arc-shaped grooves and the embedded grooves;
the first driving device drives the detection plate to turn 90 degrees to enable the second exposure hole to face downwards, so that glue at the dispensing position on the circuit board drips along the cavity and the second exposure hole;
the first driving device drives the detection plate to turn 180 degrees so that the first exposed hole is aligned with an input position of the second conveying device, and the circuit board is driven by the second conveying device to be separated from the detection plate and move along the conveying direction;
conveying the circuit board to a second glue dispensing device through a second conveying device, dispensing glue at the joint of each pin hole and the corresponding L-shaped pin at the back of the circuit board through the second glue dispensing device, and drying the glue dispensing position on the circuit board through waste heat;
a marking layer is arranged on the inner wall of the detection plate, and marking liquid is injected into the marking layer to mark the circuit board passing through the conveying channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210144077.0A CN114226185B (en) | 2022-02-17 | 2022-02-17 | Conveying system based on Internet of things circuit board and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210144077.0A CN114226185B (en) | 2022-02-17 | 2022-02-17 | Conveying system based on Internet of things circuit board and manufacturing method thereof |
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| CN114226185A CN114226185A (en) | 2022-03-25 |
| CN114226185B true CN114226185B (en) | 2022-04-29 |
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Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005175468A (en) * | 2002-09-30 | 2005-06-30 | Seiko Epson Corp | Wiring forming method, wiring manufacturing apparatus, conductive film wiring, thin film transistor, electro-optical device, electronic apparatus, and non-contact card medium |
| CN1755907A (en) * | 2004-09-30 | 2006-04-05 | 株式会社瑞萨科技 | Manufacturing method of semiconductor device |
| CN102138226A (en) * | 2008-08-28 | 2011-07-27 | 肖特太阳能股份公司 | Method and apparatus for fabricating functional layers on semiconductor devices |
| CN106112317A (en) * | 2016-07-01 | 2016-11-16 | 佛山电器照明股份有限公司 | A kind of LED lamp tube automatic production line |
| CN107282373A (en) * | 2017-07-31 | 2017-10-24 | 昆山希盟自动化科技有限公司 | A kind of automatic adhesive sealing machine |
| CN108514991A (en) * | 2018-06-07 | 2018-09-11 | 嘉兴爱劳科斯智能照明有限公司 | A kind of wiring board point glue equipment |
| CN109482424A (en) * | 2018-01-22 | 2019-03-19 | 精电(河源)显示技术有限公司 | A kind of COG display screen UV dispensing solidification equipment |
| CN110013945A (en) * | 2019-04-28 | 2019-07-16 | 深圳市万禾自动化设备有限公司 | Two-sided filament dispenser |
| CN110116081A (en) * | 2019-04-09 | 2019-08-13 | 广西科技大学鹿山学院 | Automatic glue application water dispenser for Brake for vehicle hub frame soldering member |
| CN111060984A (en) * | 2018-10-16 | 2020-04-24 | 江苏求实塑业有限公司 | Composite film foreign matter detection device |
| CN111617943A (en) * | 2020-06-02 | 2020-09-04 | 何金昌 | Working method of circuit board glue printing device capable of automatically overturning |
| CN111644346A (en) * | 2020-06-04 | 2020-09-11 | 赣州智晟知识产权咨询服务有限公司 | Liquid crystal display dispensing curing machine |
| CN112499166A (en) * | 2020-11-16 | 2021-03-16 | 遂宁市广天电子有限公司 | Device for automatically feeding and conveying electronic circuit board |
| CN214864929U (en) * | 2021-03-30 | 2021-11-26 | 南通东鼎彩印包装厂 | Turnover device for processing lining plate with gram weight |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8586129B2 (en) * | 2010-09-01 | 2013-11-19 | Solarworld Innovations Gmbh | Solar cell with structured gridline endpoints and vertices |
| JP6152248B2 (en) * | 2012-04-19 | 2017-06-21 | ファスフォードテクノロジ株式会社 | Paste coating apparatus, paste coating method, and die bonder |
-
2022
- 2022-02-17 CN CN202210144077.0A patent/CN114226185B/en active Active
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005175468A (en) * | 2002-09-30 | 2005-06-30 | Seiko Epson Corp | Wiring forming method, wiring manufacturing apparatus, conductive film wiring, thin film transistor, electro-optical device, electronic apparatus, and non-contact card medium |
| CN1755907A (en) * | 2004-09-30 | 2006-04-05 | 株式会社瑞萨科技 | Manufacturing method of semiconductor device |
| CN102138226A (en) * | 2008-08-28 | 2011-07-27 | 肖特太阳能股份公司 | Method and apparatus for fabricating functional layers on semiconductor devices |
| CN106112317A (en) * | 2016-07-01 | 2016-11-16 | 佛山电器照明股份有限公司 | A kind of LED lamp tube automatic production line |
| CN107282373A (en) * | 2017-07-31 | 2017-10-24 | 昆山希盟自动化科技有限公司 | A kind of automatic adhesive sealing machine |
| CN109482424A (en) * | 2018-01-22 | 2019-03-19 | 精电(河源)显示技术有限公司 | A kind of COG display screen UV dispensing solidification equipment |
| CN108514991A (en) * | 2018-06-07 | 2018-09-11 | 嘉兴爱劳科斯智能照明有限公司 | A kind of wiring board point glue equipment |
| CN111060984A (en) * | 2018-10-16 | 2020-04-24 | 江苏求实塑业有限公司 | Composite film foreign matter detection device |
| CN110116081A (en) * | 2019-04-09 | 2019-08-13 | 广西科技大学鹿山学院 | Automatic glue application water dispenser for Brake for vehicle hub frame soldering member |
| CN110013945A (en) * | 2019-04-28 | 2019-07-16 | 深圳市万禾自动化设备有限公司 | Two-sided filament dispenser |
| CN111617943A (en) * | 2020-06-02 | 2020-09-04 | 何金昌 | Working method of circuit board glue printing device capable of automatically overturning |
| CN111644346A (en) * | 2020-06-04 | 2020-09-11 | 赣州智晟知识产权咨询服务有限公司 | Liquid crystal display dispensing curing machine |
| CN112499166A (en) * | 2020-11-16 | 2021-03-16 | 遂宁市广天电子有限公司 | Device for automatically feeding and conveying electronic circuit board |
| CN214864929U (en) * | 2021-03-30 | 2021-11-26 | 南通东鼎彩印包装厂 | Turnover device for processing lining plate with gram weight |
Non-Patent Citations (1)
| Title |
|---|
| 印制板组件点胶加固的应用研究;陈威等;《电子工艺技术》;20190930;第40卷(第5期);第279-282页 * |
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| CN114226185A (en) | 2022-03-25 |
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