Disclosure of Invention
The embodiment of the application provides the preparation mold and the preparation method of the polymer microneedle, so that the yield of the microneedle is improved, the process is simplified, and industrial mass production is realized.
The embodiment of the application provides a preparation mould of polymer micropin, preparation mould of polymer micropin includes:
the injection mould comprises an injection mould body and a plurality of injection holes regularly distributed on the injection mould body, and the axial direction of each injection hole is consistent with the mould closing direction of the high-molecular microneedle preparation mould;
the microneedle forming die is at least partially overlapped with the projection of the injection die along the die closing direction of the die and comprises a forming die body and a plurality of microneedle forming holes regularly distributed on the forming die body, the microneedle forming holes correspond to the injection holes one by one, and the corresponding microneedle forming holes are coaxial with the injection holes; and the number of the first and second groups,
the exhaust mould and the microneedle forming mould are at least partially overlapped along the projection of the mould closing direction, the exhaust mould comprises an exhaust mould body and a plurality of exhaust holes regularly distributed on the exhaust mould body, the exhaust holes correspond to the microneedle forming holes one by one, and the corresponding exhaust holes are coaxial with the microneedle forming holes.
Further, the injection hole and the exhaust hole are both cylinders, the microneedle forming hole is an inverted truncated cone, the bottom surface of the injection hole is the same as the top surface of the microneedle forming hole in shape, and the top surface of the exhaust hole is the same as the bottom surface of the microneedle forming hole in shape.
Further, the shape of the bottom surface of the injection hole and the shape of the top surface of the exhaust hole are both circular, and the diameter b of the injection hole and the diameter a of the exhaust hole have the following relationship:
a=0.03~0.06b;
the diameter b of the injection hole and the height h of the inverted truncated cone have the following relationship:
b=0.63~0.83h。
further, the injection mold, the microneedle forming mold and the exhaust mold are made of metal materials, and the injection hole, the microneedle forming hole and the exhaust hole are processed by picosecond laser, femtosecond laser and cutting.
The embodiment of the application provides a preparation method of a high-molecular microneedle, which comprises the following steps:
step S1: preheating the injection mold, the microneedle forming mold and the exhaust mold;
step S2: the microneedle forming die and the exhaust die are matched;
step S3: placing a substrate between the injection mold and the microneedle forming mold, and closing the injection mold and the microneedle forming mold;
step S4: and injecting the molten high polymer material into the microneedle forming hole and the exhaust hole of the microneedle forming die through the injection hole of the injection die, and stopping injecting the molten high polymer material after the microneedle forming hole is filled with the molten high polymer material.
Further, the thickness of the substrate is 1um-2000 um.
Further, the substrate is one or a combination of more of general-purpose plastics, engineering plastic films and fiber cloth.
Further, a plurality of through holes are arranged on the substrate and correspond to the microneedle forming holes, and the diameter c of each through hole is 0.75-0.85 b.
Further, the polymer material comprises one or more of polymer materials such as PLA, PC, PA, PMMA, PP, LCP, POM, PEEK, PPS, PHA, PCL, PEAT, PBS, ABS, PVC, PCTA, PCTG, PEI, PES, PPA, PPE, PPO, PPS, hyaluronic acid and the like.
Further, the following relationship exists between the height h of the inverted frustum and the minimum spacing d between the injection holes: d is 1.35-1.45 h.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
1. in the microneedle forming process, the molten high polymer material is pressed into the microneedle forming hole through the injection hole, and air is discharged through the exhaust hole communicated with the microneedle forming hole along with the injection of the molten material, so that the high-quality microneedle without bubbles is obtained. Because the mould does not need to be vacuumized in advance, the process is simple, and the method is suitable for industrial mass production.
2. The substrate is arranged between the material injection mold and the microneedle forming mold in advance, and in the process that the melted microneedle material is pressed into the microneedle forming hole through the substrate, partial area of the substrate can be softened by using the temperature of the melted material, so that the microneedle material and the substrate material are fused, and the microneedle is firmly formed on the substrate.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Fig. 1 is a structure view of a microneedle in which a microneedle and a substrate are integrally formed in the related art, and as shown in fig. 1, the microneedle includes a microneedle portion 200 and a substrate portion 100 which are made of the same material, and ends of the microneedle portion 200 are connected to the substrate portion 100 to facilitate mold release. However, this method is only suitable for the case where the microneedle material and the substrate material are the same, and the choice of the substrate material is greatly limited. If the microneedle material and the base material are different, the materials need to be replaced at the time of injection, and the microneedle molding efficiency and molding quality are affected. If the microneedle portion 200 is formed separately and then the adhesive base material is covered at the end of the microneedle portion 200, the base material and the microneedle portion 200 are not tightly connected because they are independent from each other, so that the microneedle portion 200 is easily detached during use.
Fig. 2 is a structural diagram of a polymer microneedle preparation mold according to an embodiment of the present invention. As shown in fig. 2, the high molecular microneedle preparation mold includes an injection mold 1, a microneedle forming mold 2, and an exhaust mold 3.
The injection mould 1 comprises an injection mould 1 body and a plurality of injection holes 10 regularly distributed on the injection mould 1 body, and the axial direction of the injection holes 10 is consistent with the mould closing direction of the high-molecular microneedle preparation mould; the projection of the microneedle forming die 2 and the injection die 1 along the die closing direction of the die is at least partially overlapped, the microneedle forming die 2 comprises a forming die body and a plurality of microneedle forming holes 20 regularly distributed on the forming die body, the microneedle forming holes 20 correspond to the injection holes 10 one by one, and the corresponding microneedle forming holes 20 are coaxial with the injection holes 10; the projection of the exhaust mould 3 and the microneedle forming mould 2 along the mould closing direction is at least partially overlapped, the exhaust mould 3 comprises an exhaust mould 3 body and a plurality of exhaust holes 30 regularly distributed on the exhaust mould 3 body, the exhaust holes 30 correspond to the microneedle forming holes 20 one by one, and the corresponding exhaust holes 30 are coaxial with the microneedle forming holes 20.
In the microneedle forming process, the melted high molecular material is pressed into the microneedle forming hole 20 through the injection hole 10, and air is discharged through the exhaust hole 30 communicated with the microneedle forming hole 20 along with the injection of the melted material, so that the high-quality microneedle without bubbles is obtained. Because the mould does not need to be vacuumized in advance, the process is simple, and the method is suitable for industrial mass production.
Alternatively, the injection mold 1, the microneedle forming mold 2, and the exhaust mold 3 may be made of metal, and the injection hole 10, the microneedle forming hole 20, and the exhaust hole 30 may be processed by picosecond laser, femtosecond laser, and cutting.
Fig. 3 is a schematic diagram of a high molecular microneedle preparation mold provided in an embodiment of the present invention after mold assembly. As shown in fig. 3, in some embodiments, the injection hole 10 and the exhaust hole 30 are both cylinders, the microneedle molding hole 20 is an inverted truncated cone, the bottom surface of the injection hole 10 has the same shape as the top surface of the microneedle molding hole 20, and the top surface of the exhaust hole 30 has the same shape as the bottom surface of the microneedle molding hole 20.
Optionally, the bottom surface of the injection hole 10 and the top surface of the exhaust hole 30 are both circular, so that the microneedle defect caused by accumulation of air at corners and difficulty in exhausting can be avoided.
Specifically, the following relationship exists between the diameter b of the injection hole 10 and the diameter a of the exhaust hole 30: a is 0.03-0.06 b; the diameter b of the injection orifice 10 and the height h of the inverted truncated cone have the following relationship: b is 0.63-0.83 h.
Satisfying the above conditions, the microneedle molding hole 20 can have a proper taper, so that the melted material can fill the cavity of the microneedle molding hole 20 at a proper speed, thereby facilitating the air discharge.
The application also discloses a preparation method of the high-molecular microneedle, which is suitable for the high-molecular microneedle preparation mould. The method comprises the following steps:
step S1: preheating the material injection mold 1, the microneedle forming mold 2 and the exhaust mold 3;
step S2: the microneedle forming die 2 and the exhaust die 3 are matched;
step S3: and placing the substrate 4 between the injection mold 1 and the microneedle forming mold 2, and closing the injection mold 1 and the microneedle forming mold 2.
Step S4: injecting the melted high molecular material into the microneedle forming hole 20 and the exhaust hole 30 of the microneedle forming die 2 through the injection hole 10 of the injection die 1, and stopping injecting the melted high molecular material after the microneedle forming hole 20 is filled with the melted high molecular material.
By placing the substrate 4 between the injection mold 1 and the microneedle forming mold 2 in advance, in the process that the melted microneedle material is pressed into the microneedle forming hole 20 through the substrate 4, the temperature of the melted material can be utilized to soften a partial region of the substrate 4, so that the microneedle material and the substrate material are fused, and the microneedle main body is firmly formed on the substrate 4.
Fig. 4 is a structural diagram of a polymer microneedle molded in an embodiment of the present invention, and as shown in fig. 4, the melt and the substrate material are fused, and the microneedle body 5 molded in the present invention is tightly combined with the substrate 4, so that the array is beautiful, and is suitable for the injection molding preparation of the microneedle in an industrial scale.
Optionally, the substrate has a thickness of 1um to 2000 um. The substrate can be one or a combination of more of general plastic, engineering plastic film and fiber cloth, and the selection range of the substrate material is wider due to no limitation of microneedle materials, so that flexible substrate microneedle arrays and hard substrate microneedle arrays can be manufactured.
Alternatively, as shown in fig. 3, in some embodiments, for a substrate material with a lower melting point or a thinner melting point, the substrate 4 may be melted directly by the temperature of the melt, and the melt is pressed into the microneedle forming hole 20 through the substrate 4 for forming, so that the melt and the substrate material are better fused.
In other embodiments, openings may be made in substrate 4 for substrate materials having higher or thicker melting points, as shown in FIG. 4. Specifically, a plurality of through holes are arranged on the substrate 4, the through holes are arranged corresponding to the microneedle forming holes 20, and the diameter c of each through hole is 0.75-0.85 b, so that the edge of each through hole on the substrate 4 is wrapped and softened by the molten material, and the firmness of the microneedles on the substrate is further improved.
Optionally, the microneedle material is a polymer material, and the polymer material includes one or more of PLA, PC, PA, PMMA, PP, LCP, POM, PEEK, PPs, PHA, PCL, PEAT, PBS, ABS, PVC, PCTA, PCTG, PEI, PES, PPA, PPE, PPO, PPs, hyaluronic acid, and the like.
Optionally, the following relationship exists between the height h of the inverted frustum and the minimum spacing d between the injection holes 10: d is 1.35-1.45 h, so that the substrate warping caused by the concentrated melting of all substrates by the temperature of the molten material can be avoided on the premise of ensuring the efficiency.
The following embodiments are specifically described below.
Example 1
And sequentially closing the material injection mold, the silk fiber cloth, the microneedle forming mold and the air hole mold. And (3) baking the POM-K in a beaker at 100 ℃ for 3h in a material baking machine, and vacuumizing to remove air in the molten material. And then melting the POM-K, uniformly injecting the POM-K from the injection mold, stopping injecting the molten POM-K after the microneedle molding holes are filled with the molten POM-K, removing the injection mold and the pore mold, cooling and demolding to obtain the POM-K microneedle array with the flexible substrate.
Example 2
And sequentially closing the injection mold, the PET porous film with the thickness of 0.1mm, the microneedle forming mold and the air hole mold. Putting commercially available PC into a drying machine, drying the material for 4h at 120 ℃, vacuumizing to remove air in the molten material, melting the PC at 320 ℃, then uniformly injecting the molten material into an injection mold, stopping injecting the molten PC after the microneedle molding holes are filled with the molten PC, removing the injection mold and the air hole mold after removing the injected material and cooling, and then demolding to obtain the P0M-K microneedle array with the flexible substrate.
Example 3
And sequentially closing the material injection mold, the nylon cloth with the thickness of 0.01mm, the microneedle forming mold and the air hole mold. Putting commercially available PLA into a material drying machine, drying the material for 2h at the temperature of 100 ℃, then melting the material at the temperature of 160 ℃, uniformly injecting molten material from a material injection mold, stopping injecting the material when the material is injected from air holes, then removing the material injection mold, removing the air hole mold after cooling, and then demolding to obtain the PLA microneedle array with the flexible substrate.
Example 4
And sequentially closing the material injection mold, the 0.05 mm-thick non-porous PC mold, the microneedle forming mold and the air hole mold. Placing the modified PCL in a material baking machine, baking the material for 30min at 100 ℃, then melting, vacuumizing and removing the melt. And then uniformly injecting the molten PCL from the injection mold, stopping injecting the molten PCL after the microneedle molding holes are filled with the molten PCL, then removing the injection mold and the gas hole mold, and cooling and demolding to obtain the PCL microneedle array with the flexible substrate.
And sequentially closing the material injection mold, the nylon cloth with the thickness of 0.01mm, the microneedle forming mold and the air hole mold. Placing the PCL and the mold in a material baking machine for 30min at 50 ℃, placing the PCL and the mold in a vacuum oven for heating for 8min at 100 ℃, pouring the molten PCL into a preheated mold forming part (a mold blocking part is arranged below the mold forming part), then placing the material without the mold in the vacuum oven, vacuumizing and heating for 10min at 100 ℃, replacing the mold blocking part into a mold gas layer part after cooling, then injecting high-pressure air from the mold gas layer part, and demolding to obtain the PCL microneedle array.
Comparison of results
The local parts of the facial mask in the four groups of examples were randomly selected and subjected to rat in-vitro skin puncture experiments (after the rat in-vitro skin puncture, methyl blue was used for penetration, and whether residual methyl blue remained in the punctured micropores was observed), and the experimental results are shown in the following fig. 2-4 and the following table.
Rat in vitro skin puncture experiment
The test results showed that each microneedle array in the four examples had a very good skin-breaking effect, and no broken microneedle residue remained in the rat skin. Meanwhile, in the embodiment, the microneedle array is good, and the microneedle is sharp.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.