CN114209333A - Microneedle for nerve interface - Google Patents
Microneedle for nerve interface Download PDFInfo
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- CN114209333A CN114209333A CN202111683407.5A CN202111683407A CN114209333A CN 114209333 A CN114209333 A CN 114209333A CN 202111683407 A CN202111683407 A CN 202111683407A CN 114209333 A CN114209333 A CN 114209333A
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
- A61B5/25—Bioelectric electrodes therefor
- A61B5/279—Bioelectric electrodes therefor specially adapted for particular uses
- A61B5/291—Bioelectric electrodes therefor specially adapted for particular uses for electroencephalography [EEG]
- A61B5/293—Invasive
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
- A61B5/316—Modalities, i.e. specific diagnostic methods
- A61B5/369—Electroencephalography [EEG]
- A61B5/37—Intracranial electroencephalography [IC-EEG], e.g. electrocorticography [ECoG]
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
- A61B5/316—Modalities, i.e. specific diagnostic methods
- A61B5/369—Electroencephalography [EEG]
- A61B5/386—Accessories or supplementary instruments therefor
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Abstract
本发明提出了一种用于神经接口的微针，包括：至少两个体电极，其中，至少两个所述体电极的长度不相等。该微针具有长度不同的体电极，相较于目前的微针式神经接口器件，能够实现多电极触点记录和不同深度的神经元放电信息采集。
The present invention provides a microneedle for neural interface, comprising: at least two body electrodes, wherein the lengths of the at least two body electrodes are not equal. The microneedle has body electrodes with different lengths, and compared with the current microneedle-type neural interface device, it can realize multi-electrode contact recording and neuron discharge information collection at different depths.
Description
Technical Field
The invention relates to the field of medical instruments, in particular to a microneedle for a neural interface.
Background
The nerve interface provides a channel for connecting the nerve cell with an external device, and can stimulate the nerve cell to generate action potential through the external device and record the action potential generated by the nerve cell so as to realize the bidirectional communication between the nerve cell and the external device. Therefore, neural interfaces are widely used in research and treatment of various neurological diseases, such as parkinson's disease, epilepsy, depression, essential tremor, and the like.
The neural interface device is mainly divided into an implanted type and a non-implanted type, and compared with a non-implanted type neural electrode, the implanted type neural electrode is focused by scholars at home and abroad due to high resolution. The silicon-based tube micro-needle type neural interface device with the traditional structure can only realize extraction of electroencephalogram signals, has single function and fewer electrode recording points, and cannot meet the current clinical requirements. And the length of the existing micro-needle is designed mostly in the same scale, and only electroencephalogram signals with the same plane depth can be acquired, so that the neuron discharge information of different depths of the grey brain layers can not be acquired in a three-dimensional manner, and the current clinical requirements can not be met.
Thus, there is a need for a better solution to the problems of the prior art.
Disclosure of Invention
In view of this, the present invention provides a microneedle for neural interface, which is used to solve the problems in the prior art, and uses the staggered structure of the microneedle to three-dimensionally collect neuron discharge information of different depths of the gray brain layer.
To solve the foregoing problems, the present invention proposes the following specific embodiments: there is provided a microneedle for a neural interface, comprising: at least one bulk electrode, wherein the lengths of at least two of the bulk electrodes are not equal.
Preferably, the body electrode can be cut, and the body electrode is cut according to implantation data to obtain microneedles with different lengths.
Preferably, a protective film is disposed at a fracture of the cut body electrode.
Preferably, the lengths of the respective bulk electrodes are different, and the lengths of the respective bulk electrodes gradually increase or decrease in the arrangement direction from one end to the other end along the bulk electrodes.
Preferably, the length of the body electrode located at the middle region is smaller than the length of the body electrode located at both edge regions.
Preferably, a body electrode having the shortest length is used as a boundary line, and the length of the body electrode gradually increases in a direction from the boundary line to the end of the microneedle.
Preferably, the method comprises the following steps: at least one micropin subassembly, the micropin subassembly includes the micropin body and integrated circuit chip, integrated circuit chip set up in the afterbody of micropin body, the micropin body includes the body electrode.
Preferably, the microneedle comprises: a restraining device for unitizing at least two microneedle assemblies.
Preferably, the both ends of the afterbody of micropin body are provided with the through-hole, the constraint device includes the connecting rod, the connecting rod runs through homonymy through-hole on each micropin body afterbody.
Preferably, the tail part of the micro-needle body is provided with at least one first welding point, and each body electrode point is connected with the corresponding first welding point through a connecting wire.
Is different from the prior art: the invention provides a micro-needle for a neural interface, which respectively improves the structure and the preparation process of the traditional micro-needle neural interface device, and compared with the traditional micro-needle neural interface device, the micro-needle for the neural interface device can realize multi-electrode contact recording and neuron discharge information acquisition at different depths by processing the traditional single-row micro-needle into micro-needles with body electrodes with different lengths.
Furthermore, the micro-needle is combined with an integrated circuit chip (namely, a metal oxide semiconductor), so that the input and output functions of signals can be realized, and the problem that the existing invasive micro-needle can only realize a single brain wave signal acquisition function is effectively solved. In addition, at least one microneedle is integrated together to form the microneedle, so that more neuron discharge information can be acquired, and the spatial resolution and the signal accuracy are improved.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings required to be used in the embodiments will be briefly described below, and it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope of the present invention. Like components are numbered similarly in the various figures.
Fig. 1 illustrates a microneedle according to an embodiment of the present invention;
fig. 2 shows a schematic diagram of a microneedle for a neural interface according to an embodiment of the present invention;
FIG. 3 is a schematic diagram illustrating the connection of a bulk electrode pad and an indium column according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a circuit structure of an indium stud-connected integrated circuit chip according to an embodiment of the present invention.
Wherein: 1. a bulk electrode; 2. a body electrode point; 3. a through hole; 4. an integrated circuit chip; 5. a connecting rod; 6. a connecting wire; 7. a first indium column; 8. a contact electrode; 9. a poly-crystal gate; 10. a silicon substrate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
Hereinafter, the terms "including", "having", and their derivatives, which may be used in various embodiments of the present invention, are intended to indicate only specific features, numbers, steps, operations, elements, components, or combinations of the foregoing, and should not be construed as first excluding the presence of or adding to one or more other features, numbers, steps, operations, elements, components, or combinations of the foregoing.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which various embodiments of the present invention belong. The terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning that is consistent with their contextual meaning in the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein in various embodiments of the present invention.
Example 1
Referring to fig. 1, the present embodiment provides a microneedle for a neural interface, and at least two body electrodes 1, wherein the lengths of at least two body electrodes 1 are not equal, and the at least two body electrodes 1 are arranged along the extending direction of the tail of the microneedle body.
In an actual scene, the body electrodes of the micro-needles for the neural interfaces are designed to have different lengths according to an application scene when the micro-needles for the neural interfaces leave a factory, or the body electrodes of the micro-needles for the neural interfaces have the same length when the micro-needles for the neural interfaces leave the factory, and the body electrodes are cut according to implantation data in actual use to obtain the micro-needles with different lengths. The body electrode may be cut by laser cutting, or other methods, which are not limited in this respect. The implantation data may be data obtained according to a pre-established model, or may be real-time implantation data obtained when the microneedle is inserted into the target location.
In a preferred embodiment, a protective film is arranged at the fracture of the cut body electrode to eliminate burrs of the fracture, ensure the smoothness of the fracture, avoid puncturing nerve cells, play an insulating role and avoid electric leakage at the fracture. The protective film may be formed by surface treatment, such as coating resin at the fracture.
In actual use, before implantation, whether an electrode signal of the cut body electrode is abnormal or not is detected, if the electrode signal is abnormal, abnormal conditions are checked, and therefore the human body is prevented from being damaged.
In an alternative embodiment, the lengths of the body electrodes 1 are different, and the lengths of the body electrodes 1 gradually increase or decrease along the arrangement direction of the body electrodes 1 from one end to the other end, so as to form microneedles with staggered structures. In practical application, assuming that the operation position is in the left half or the right half of the brain sack, the microneedles in the aforementioned forms can be adopted, the shortest body electrode 1 is correspondingly arranged near the center of the brain sack, and the longest body electrode 1 is arranged near the center of the brain sack.
In another application scenario, assuming that the target position of the operation is a cerebral sack, and the area corresponding to the target position is relatively large, and covers the left half and the right half of the cerebral sack, the length of the body electrode can be set as follows, and the length of the body electrode 1 located in the middle area is smaller than the length of the body electrodes 1 located in the two edge areas. Specifically, the body electrode 1 having the shortest length is used as a boundary, and the length of the body electrode 1 gradually increases in the direction from the boundary to the end of the microneedle.
In an alternative embodiment, in order to ensure that each body electrode 1 can be inserted into a proper position, at least one body electrode 1 is symmetrically distributed relative to the center line of the microneedle, the length of the body electrode 1 closest to the center line is shortest, and the length of the body electrode 1 is gradually increased along the direction close to the end of the microneedle. During the operation, the body electrode 1 with the shortest length is closest to the central position of the brain sack.
Under a specific application scenario, a set of example data related to the bulk electrodes 1 is provided based on the foregoing embodiment, and the distance between adjacent bulk electrodes 1 is 545 μm to 555 μm; the line width of the connecting line 6 is 4.5-5.5 μm, and the distance between the adjacent body electrode points 2 is 19-21 μm; the width of the body electrode 1 is 135-145 mu m, the length of the body electrode 1 is 1.5-3 mm, and the needle point angle of the body electrode 1 is 17-30 degrees.
The invention provides a micro needle for a neural interface, which is processed into body electrodes with different lengths, and can realize multi-electrode contact recording and neuron discharge information acquisition with different depths.
Example 2:
in conjunction with fig. 1 and 2, the present embodiment provides a microneedle for a neural interface, including: at least one micropin subassembly, the micropin subassembly includes the micropin body and integrated circuit chip, integrated circuit chip set up in the afterbody of micropin body, the micropin body includes the body electrode. The microneedle comprises: a restraining device for unitizing at least two microneedle assemblies. The both ends of the afterbody of micropin body are provided with the through-hole, the constraint device includes the connecting rod, the connecting rod runs through homonymy through-hole on each micropin body afterbody.
Specifically, the microneedle assembly comprises a microneedle body and at least one integrated circuit chip 4; the micro needle body and the integrated circuit chip 4 are bonded to form a micro needle assembly (as shown in fig. 1), and a plurality of groups of micro needle assemblies are arranged in parallel to form micro needles; the micro-needle comprises at least two body electrodes 1, wherein the lengths of at least two body electrodes 1 are not equal. Compared with the existing micro-needle type neural interface device, the micro-needle type neural interface device can realize multi-electrode contact recording and neuron discharge information acquisition at different depths.
In an alternative embodiment, the lengths of the body electrodes 1 are different, and the lengths of the body electrodes 1 gradually increase or decrease along the arrangement direction of the body electrodes 1 from one end to the other end, so as to form microneedles with staggered structures. In practical application, assuming that the operation position is in the left half or the right half of the brain sack, the microneedles in the aforementioned forms can be adopted, the shortest body electrode 1 is correspondingly arranged near the center of the brain sack, and the longest body electrode 1 is arranged near the center of the brain sack.
In another application scenario, assuming that the region of the operation site is relatively large and covers the left half and the right half of the brain sack, the length of the body electrode can be set in such a way that the length of the body electrode 1 in the middle region is smaller than the length of the body electrodes 1 in the two edge regions. Specifically, the body electrode 1 having the shortest length is used as a boundary, and the length of the body electrode 1 gradually increases in the direction from the boundary to the end of the microneedle.
In an alternative embodiment, in order to ensure that each body electrode 1 can be inserted into a proper position, at least one body electrode 1 is symmetrically distributed relative to the center line of the microneedle, the length of the body electrode 1 closest to the center line is shortest, and the length of the body electrode 1 is gradually increased along the direction close to the end of the microneedle. During the operation, the body electrode 1 with the shortest length is closest to the central position of the brain sack.
Referring to fig. 2, a mode of assembling at least one microneedle assembly into microneedles is described, the binding device comprises two connecting rods 5, the tail of the microneedle assembly is provided with a through hole 3, and the connecting rods 5 penetrate through the through holes 3 on the same side of each microneedle assembly, so that each microneedle is assembled into microneedles. The axis of the through hole 3 is vertical to the length direction of the body electrode 1, and the through hole 3 is positioned at the outer side of the body electrode 1 at the most side of the corresponding side. The axis of the through hole 3 passes through the center of the through hole 3 and is perpendicular to the plane of the tail of the microneedle body.
Wherein, two through holes 3 can be respectively processed at two ends of the tail part of the micro needle body by adopting an MEMS process.
Under the practical application scene, the position of through-hole 3 on each micropin body afterbody is the same to guarantee that connecting rod 5 can pass through-hole 3 on at least one micropin in proper order. In addition, the size of through-hole 3 with the diameter phase-match of connecting rod 5 guarantees that connecting rod 5 can pass through-hole 3, and is difficult for producing relative movement.
In another alternative embodiment, the restraining device is made of an adhesive material, and at least one microneedle assembly can be assembled into a microneedle assembly as follows: bonding the adjacent microneedle assemblies together, and clamping a microneedle body of one microneedle assembly between the integrated circuit chips of the adjacent microneedle assemblies; the microneedle assembly comprises a microneedle component and an outer packaging body, wherein the microneedle component comprises a plurality of groups of integrated circuit chips, and the integrated circuit chips are bonded together to form the microneedle. The external packaging body is provided with synthetic rubber, and the synthetic rubber is n-butyl cyanoacrylate.
In the embodiment, the body electrode 1 is provided with at least one body electrode point 2, the body electrode point 2 is used for collecting brain wave signals, the tail of the micro-needle body is provided with at least one first welding point, and each body electrode point 2 is connected with the corresponding first welding point through a connecting wire 6; be provided with first indium post 7 on the first solder joint, integrated circuit chip 4 is last to have at least one second solder joint, every be provided with second indium post (not shown) on the second solder joint, first indium post 7 with correspond second indium post is connected, so that integrated circuit chip 4 and corresponding little needle body afterbody is through corresponding indium post bonding connection.
In this embodiment, indium columns are respectively implanted on the microneedles and the integrated circuit chip 4, and the microneedles and the integrated circuit chip 4 are bonded by the indium columns to form a microneedle assembly. Specifically, the micro-needle body tail has at least one first solder joint, be provided with the indium post on first solder joint and the integrated circuit chip 4 respectively, micro-needle and integrated circuit chip 4 form the micro-needle subassembly through the indium post bonding.
Specifically, as shown in fig. 3, at least one body electrode point 2 on the microneedle is connected to an indium column on the microneedle through a connecting line 6, wherein the connecting line is a metal line and is made of a metal material, for example, the connecting line is made of gold. In the practical application scene, the body electrode point 2 is connected with a first welding point on the micro needle through a connecting wire 6, and the indium column is arranged on the first welding point, so that the body electrode point 2 is connected with the integrated circuit chip 4.
It should be noted that the connection lines led out from each body electrode point 2 shown in fig. 3 are not connected together, and each body electrode point 2 is correspondingly connected to one of the first welding points, so as to ensure that the electrical signals collected by each body electrode point 2 are transmitted to the integrated circuit chip 4 independently.
The body electrode points 2 on the body electrode 1 may be distributed in the same row (as shown in fig. 1) or in different rows (as shown in fig. 3), and may be determined according to the width and actual condition of the body electrode 1. When the body electrode points 2 are distributed in different columns, the body electrode points 2 in adjacent columns may be distributed in a staggered manner (as shown in fig. 3).
In the present embodiment, the body electrode point 2 is used to collect brain wave signals and transmit the collected brain wave signals to the integrated circuit chip 4. The integrated circuit chip 4 is used for receiving brain wave signals acquired by part of the body electrode points 2 on one hand and sending electric signals to the part of the body electrode points 2 on the other hand so as to electrically stimulate brain tissues and recover the lost function of the brain, namely, the micro-needle is integrated with a reading circuit (integrated circuit chip), so that the input and output functions of signals can be realized, and the problem that the existing invasive micro-needle can only realize the single brain wave signal acquisition function is effectively solved.
In addition, as shown in fig. 4, the integrated circuit chip 4 is an integrated circuit chip silicon device, and includes a silicon substrate 10 on which a contact electrode 8 and a poly gate 9 are implanted. The silicon substrate is a P-type silicon substrate, and the indium column implanted on the integrated circuit chip 4 is electrically connected with the silicon substrate 7 through a connecting wire 6.
Under a specific application scenario, a set of example data related to the bulk electrodes 1 is provided based on the foregoing embodiment, and the distance between adjacent bulk electrodes 1 is 545 μm to 555 μm; the line width of the connecting line 6 is 4.5-5.5 μm, and the distance between the adjacent body electrode points 2 is 19-21 μm; the width of the body electrode 1 is 135-145 mu m, the length of the body electrode 1 is 1.5-3 mm, and the needle point angle of the body electrode 1 is 17-30 degrees.
Compared with the prior micro-needle type neural interface device, the micro-needle type neural interface device has the advantages that the structure and the preparation process of the traditional micro-needle type neural interface device are respectively improved, and the multi-electrode contact recording and the neuron discharge information acquisition at different depths can be realized by processing the traditional single-row micro-needle into the micro-needle with the body electrodes with different lengths; meanwhile, the micro-needle is combined with an integrated circuit chip (namely, a metal oxide semiconductor), so that the input and output functions of signals can be realized, and the problem that the existing invasive micro-needle can only realize a single brain wave signal acquisition function is effectively solved. In addition, at least one microneedle is integrated together to form the microneedle, so that more neuron discharge information can be acquired, and the spatial resolution and the signal accuracy are improved.
Example 3:
to further illustrate the present invention, embodiment 2 of the present invention also discloses a method for preparing a microneedle for a neural interface, comprising the steps of:
s1, manufacturing the micro needle body by adopting a standard MEMS processing technology;
s2, processing at least one body electrode point on the micro needle body;
s3, respectively implanting indium columns on the micro needle body and the integrated circuit chip;
s4, bonding the microneedle body implanted with the indium columns and the integrated circuit chip to form a microneedle assembly;
s5, respectively processing two through holes at two ends of at least one microneedle component for penetrating a connecting rod to assemble the microneedle for the neural interface in a matrix structure.
Specifically, the MEMS processing process in step S1 is to fabricate and process a microneedle structure using SOI.
Specifically, the body electrode point in step S2 is formed by evaporation deposition and lift-off process.
Specifically, the step S5 is to process two through holes at two ends of at least one microneedle assembly by using a MEMS process.
(1) The micro needle comprises a micro needle body, wherein the micro needle body is provided with at least one body electrode regardless of whether an integrated circuit chip is arranged or not;
(2) the micro needle comprises a micro needle body, wherein the micro needle body is provided with at least three body electrodes, and at least two body electrodes are distributed in one row or multiple rows regardless of whether an integrated circuit chip is arranged or not;
(3) the microneedle comprises a microneedle assembly, the microneedle assembly comprises the microneedle body and the integrated circuit chip, and the integrated circuit chip is bonded with the microneedle body to form the microneedle assembly;
(4) the microneedle comprises at least two microneedle assemblies, the at least two microneedle assemblies are assembled together, and the at least two microneedle assemblies are distributed in one or more rows.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention.
Claims (10)
1. A microneedle for a neural interface, comprising: at least two bulk electrodes, wherein the lengths of at least two of the bulk electrodes are not equal.
2. A microneedle according to claim 1, wherein the body electrode is tailorable, and the body electrode is tailorable according to implantation data to provide microneedles of varying lengths.
3. A microneedle according to claim 2, wherein a protective film is provided at a fracture of the body electrode which is cut out.
4. A microneedle according to any one of claims 1 to 3, wherein the length of each of the bulk electrodes is not equal, and the length of each of the bulk electrodes gradually increases or decreases in the direction of arrangement from one end to the other end along the bulk electrode.
5. A microneedle according to claims 1 to 3, wherein the length of the bulk electrode in the central region is less than the length of the bulk electrode in the edge regions.
6. A microneedle according to claim 5, wherein a body electrode having the shortest length is used as a boundary line, and the length of the body electrode gradually increases in a direction from the boundary line to an end of the microneedle.
7. A microneedle according to claims 1 to 3, comprising: at least one micropin subassembly, the micropin subassembly includes the micropin body and integrated circuit chip, integrated circuit chip set up in the afterbody of micropin body, the micropin body includes the body electrode.
8. A microneedle according to claim 7, comprising: a restraining device for unitizing at least two microneedle assemblies.
9. A microneedle according to claim 8, wherein through holes are provided at both ends of the tail portion of the microneedle body, and the binding means comprises a connecting rod passing through the through holes on the same side of the tail portion of each microneedle body.
10. A microneedle according to claim 9, wherein the end portion of the microneedle body has at least one first solder joint thereon, and each body electrode point is connected to the corresponding first solder joint by a connecting wire.
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| CN202111683407.5A CN114209333A (en) | 2021-12-31 | 2021-12-31 | Microneedle for nerve interface |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115153565A (en) * | 2022-06-15 | 2022-10-11 | 武汉衷华脑机融合科技发展有限公司 | Composite microneedle structure |
| CN115429282A (en) * | 2022-07-25 | 2022-12-06 | 武汉衷华脑机融合科技发展有限公司 | Composite microneedle structure and nerve microelectrode |
| CN115500831A (en) * | 2022-08-24 | 2022-12-23 | 武汉衷华脑机融合科技发展有限公司 | Composite microneedle structure based on integrated circuit chip |
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