CN114203677A

CN114203677A - Miniaturized overcurrent protection components suitable for IC packaging requirements and manufacturing method thereof

Info

Publication number: CN114203677A
Application number: CN202111426356.8A
Authority: CN
Inventors: 陈俊敏
Original assignee: Dongguan Tlc Electronic Technology Co ltd
Current assignee: Dongguan Tlc Electronic Technology Co ltd
Priority date: 2021-11-27
Filing date: 2021-11-27
Publication date: 2022-03-18

Abstract

The utility model relates to the field of overcurrent protection components, in particular to an overcurrent protection component which is reliable in miniaturization and meets the IC packaging requirement and a manufacturing method thereof, and the overcurrent protection component which is reliable in miniaturization and meets the IC packaging requirement comprises a high polymer PPTC composite material core material, wherein the high polymer PPTC composite material core material is provided with an upper surface and a lower surface, and the upper surface of the high polymer PPTC composite material core material is sequentially pasted with a first PPTC composite material copper foil layer, a first insulation PP layer and a first electrode layer; the lower surface of the polymer PPTC composite core material is sequentially covered with a second PPTC composite copper foil layer, a second insulation PP layer and a second electrode layer. According to the technical scheme, the miniaturized high-polymer PPTC overcurrent protection element is realized, the structural design avoids the process limitations of drilling, copper deposition, electroplating and the like, the requirement of product structural miniaturization is met, the performance is reliable, and the element has double welding surfaces.

Description

Miniaturized over-current protection component suitable for IC packaging requirements and manufacturing method thereof

Technical Field

The utility model relates to the field of overcurrent protection components, in particular to an overcurrent protection component which is reliable and miniaturized and meets the IC packaging requirement and a manufacturing method thereof.

Background

With the popularization of portable devices such as smart phones, portable notebook computers, intelligent wearable devices, wireless Bluetooth headsets and the like and the rapid development of the 5G era, the charging and discharging currents of all portable devices are increasingly large, and the requirements on the actual bearing capacity of an overcurrent protection element are increasingly high to realize the diversification of the quick charging function and the charging power, so that the overcurrent protection element needs to have the overcurrent protection function and also needs to meet the requirements on large-current charging and discharging cycles and the requirements on over-temperature protection during charging and discharging or abnormal conditions; therefore, the newly designed charge-discharge management scheme can well realize the functions, but the overcurrent protection device needs to be miniaturized for convenient IC packaging, and the requirements of diversified overcurrent protection and overtemperature protection are met; the miniaturization of the overcurrent protection device requires that the packaging size is British 0201 (metric 0603) or less so as to be convenient for IC packaging.

Referring to fig. 1, the overcurrent protection device is formed by compounding one or more conductive fillers, one or more crystalline or semi-crystalline polymer materials and various additives. Because the existing patch structure is processed into the existing polymer PPTC patch structure product shown in fig. 1 by adopting the drilling process, the copper deposition electroplating process and other processes, and the via holes 101 are formed on the left and right sides of the PPTC chip 100, the minimum processing value of the aperture is 0.5mm due to the special property requirements of the material formulation and the product structure and the process limitations of the existing drilling, copper deposition and the like, the transverse cross-sectional view (shown in fig. 2) of the product can be obtained according to the existing processing method, and the following defects are found from the cross-sectional view: 1. after the through hole is processed according to the minimum processing value of the existing drilling hole, the diameter size L3 of the through hole is close to the width L2 of a product, so that 4 sharp corners appear on the product, and the sharp corners are easy to bend to cause functional failure; 2. the distance L1 between two via holes is about 0.1mm, and too small distance causes that the inner and outer layer circuits can not be processed, which is easy to cause short circuit, the bending strength of the product is insufficient, the welding resistance/thermal contact ability is insufficient, the outer layer welding electrode can not be processed, etc. Therefore, the prior art can not meet the requirement of 0201 paster structure; in addition, the smaller the package size is, the larger the resistance change rate is, and the material formula and the product structure design need to be re-developed.

The utility model aims to design a miniaturized polymer PPTC overcurrent protection element with reliable performance and a manufacturing method thereof, which takes a polymer PPTC composite material as a conductive substrate, is miniaturized, has reliable resistance and is suitable for an overcurrent protection device with overcurrent and overtemperature protection functions of IC combined package.

Disclosure of Invention

In order to solve the problems, the utility model provides an overcurrent protection component which is reliable and miniaturized and meets the IC packaging requirements and a manufacturing method thereof.

In order to achieve the purpose, the utility model adopts the following technical scheme that the overcurrent protection component which is reliable and miniaturized and meets the IC packaging requirement comprises a high polymer PPTC composite material core material, wherein the high polymer PPTC composite material core material is provided with an upper surface and a lower surface, and a first PPTC composite material copper foil layer, a first insulation PP layer and a first electrode layer are sequentially attached to the upper surface of the high polymer PPTC composite material core material; the lower surface of polymer PPTC composite core material covers in proper order and closes second PPTC composite copper foil layer, insulating PP layer of second and second electrode layer, first electrode layer includes electrode A1 and electrode B1, first printing ink layer has been printed respectively between electrode A1 and the electrode B1, the second electrode layer includes electrode A2 and electrode B2, second printing ink layer has been printed respectively between electrode A2 and the electrode B2, electrode A1 and electrode A2 switch on each other through conducting layer A, form the left electrode, electrode B1 and electrode B2 switch on each other through conducting layer B, form the right electrode.

Preferably, the polymer PPTC composite core material comprises a crystalline polyolefin polymer and a conductive filler, wherein the conductive filler adopts metal conductive powder and/or carbon black powder, and the crystalline polymer base material is one or a mixture of polyethylene, polyvinyl chloride, chlorinated polyethylene butadiene-acrylonitrile copolymer, polytetrafluoroethylene, polycarbonate, polyvinyl fluoride, maleic anhydride grafted polyethylene and polypropylene; the metal conductive powder is one or a mixture of titanium carbide, vanadium carbide, zirconium carbide, tungsten carbide, niobium carbide, molybdenum carbide, titanium boride, vanadium boride, zirconium boride, niobium boride and titanium nitride.

Preferably, the metal conductive powder particle size is between 0.01um to 30 um.

Preferably, the metal conductive powder particle size is between 0.1um to 12 um.

Preferably, the carbon black powder can be rubber carbon black, and the Oil adsorption (cc/100gram) range of the carbon black powder is 60-140.

A manufacturing method of an overcurrent protection component with reliable miniaturization and suitable for IC packaging requirements comprises the following steps:

granulating the PPTC composite material: crushing the crystalline polymer base material and the metal conductive powder or the carbon black powder into particles through open mixing processing or mixing the particles through an internal mixer to prepare the particles, or extruding and processing the particles through double screws to prepare the PPTC composite particles;

B. manufacturing a PPTC chip main body: gradually mixing and melting manufactured PPTC composite material particles through a single screw, extruding the mixture into a flaky polymeric PPTC composite material core material, automatically laminating an upper layer of copper foil and a lower layer of copper foil through an upper roller and a lower roller to prepare a PPTC chip main body with the thickness of 0.15-0.25 mm, the width of 100-300 mm and the length of 1f 00-400 mm;

and C, PPTC chip main body irradiation treatment: controlling the PPTC chip main body laminated layer to be 1-5 layers, selecting electron beam energy to be 2-15 Mev, selecting electron beam current to be 5-25 mA, controlling the trolley speed to be 5-20 m/min, and irradiating the PPTC chip main body to reach the requirement of irradiation dose of 60-180 kGy;

D. the circuit board is realized: performing circuit etching on the surface copper foil of the PPTC chip main body by using the existing PCB process, so that a part of the copper foil on the upper surface and the lower surface of the PPTC chip main body is etched, and a first PPTC composite material copper foil layer and a second PPTC composite material copper foil layer are respectively formed on the upper surface and the lower surface of the PPTC chip main body;

E. a first insulating PP layer and an outer copper foil A layer are sequentially arranged on the surface of the first PPTC composite copper foil layer; a second insulation PP layer and an outer copper foil layer B are sequentially arranged on the surface of the etched second PPTC composite copper foil layer; performing vacuum hot pressing to enable the outer layer copper foil A, the first insulating PP layer, the first PPTC composite material copper foil layer and the upper surface of the PPTC core material to be tightly fused together, and enable the outer layer copper foil B, the second insulating PP layer, the second PPTC composite material copper foil layer and the lower surface of the PPTC core material to be tightly fused together;

F. etching an outer layer circuit of the outer layer copper foil A and the outer layer copper foil B according to the design of the outer layer circuit of the product to remove the copper foil at the middle part and reserve an etching line as a subsequent processing cutting line, wherein the gap between the cutting line and the cutting line is 0.4-0.6 mm, so that the outer layer copper foil A forms a first electrode layer (an electrode A1 and an electrode B1); forming the outer layer copper foil B into a second electrode layer (electrode a2 and electrode B2);

G. forming a plurality of through grooves A and B on the composite material chip board by a linear cutting method, a groove engraving method or a punching method, and reserving etching lines as subsequent processing cutting lines, wherein the through grooves A and B are the same in size, the length is 3-30 mm, the width is 1-10 mm, and the gap between the through grooves A and B is 0.45-0.65 mm, so as to form a conducting layer A;

H. manufacturing a conducting layer B according to the step G;

I. connecting and conducting the electrode A1, the first PPTC composite material copper foil layer and the electrode A2 through the conducting layer A to form a same conducting path; the electrode B1, the second PPTC composite material copper foil layer and the electrode B2 are connected and conducted through the conducting layer B to form a same conducting path;

J. and cutting, UV (ultraviolet) removal and stripping of the reserved cutting line to complete the manufacture of the reliable miniaturized overcurrent protection component suitable for the IC packaging requirement, namely realizing the product structure design of the figure 2.

An overcurrent protection component with reliable miniaturization and suitable for IC packaging requirements comprises a first PPTC chip and a second PPTC chip, wherein the first PPTC chip and the second PPTC chip are in parallel connection, the first PPTC chip comprises a first polymer PPTC composite core material, the first polymer PPTC composite core material is provided with an upper surface and a lower surface, and a first PPTC composite copper foil layer, a first insulation PP layer and a first electrode layer are sequentially attached to the upper surface of the first polymer PPTC composite core material; the lower surface of the first polymer PPTC composite core material is sequentially covered with a second PPTC composite copper foil layer and a second insulation PP layer, the second PPTC chip comprises a second polymer PPTC composite core material, the second polymer PPTC composite core material is provided with an upper surface and a lower surface, and the upper surface of the second polymer PPTC composite core material is sequentially covered with a third PPTC composite copper foil layer; the lower surface of the second polymer PPTC composite core material is sequentially covered with a fourth PPTC composite copper foil layer, a third insulating PP layer and a second electrode layer.

The utility model has the beneficial effects that:

according to the technical scheme, the miniaturized high-polymer PPTC overcurrent protection element is realized, the structural design avoids the process limitations of drilling, copper deposition, electroplating and the like, the requirement of product structural miniaturization is met, the performance is reliable, the element has double welding surfaces, the front surface and the back surface are not required to be distinguished, the processing and the detection are convenient, the processing production efficiency is improved, and the situation that the left electrode and the right electrode are electrodes with different polarities is reduced; therefore, the upper welding surface and the lower welding surface of the overcurrent protection device can be welded and conducted, and the overcurrent protection device has the advantages that the front and the back of the overcurrent protection device are not required to be distinguished during processing and use, the processing and the detection are convenient, the processing production efficiency is improved, and the installation cost is reduced.

Drawings

Fig. 1 is a conventional configuration diagram of an overcurrent protection component.

Fig. 2 is a cross-sectional view of fig. 1.

FIG. 3 is a block diagram of an embodiment of the present invention.

FIG. 4 is a cross-sectional structural view of an embodiment of the present invention.

FIG. 5 is a diagram of a second embodiment of the present invention.

FIG. 6 is a cross-sectional structural view of the second embodiment of the present invention.

FIG. 7 is a table showing the dimensional measurements of samples according to example 1 and example 2 of the present invention.

FIG. 8 is a table of data for testing samples according to example 1 of the present invention.

FIG. 9 is a table of data for testing samples according to example 2 of the present invention.

Description of the labeling: 100, PPTC chip; 1. a polymer PPTC composite core material; 2. a first PPTC composite copper foil layer; 3. a second PPTC composite copper foil layer; 4. a first insulating PP layer; 5. a second insulating PP layer; 6. a left electrode; 61. electrode a 1; 62. electrode a 2; 63. a conductive layer A; 7. a right electrode; 71. electrode B1; 72. electrode B2; 73. a conductive layer B; 8. a third PPTC composite copper foil layer; 9 a fourth PPTC composite copper foil layer; 10 third insulating PP layer.

Detailed Description

The first embodiment is as follows: the present case is a patch structure product of a single-layer PPTC high polymer chip.

Referring to fig. 3-9, the utility model relates to an overcurrent protection device with reliable miniaturization and suitable for IC package requirements, which includes a polymer PPTC composite core material having an upper surface and a lower surface, wherein the upper surface of the polymer PPTC composite core material is sequentially coated with a first PPTC composite copper foil layer, a first insulating PP layer and a first electrode layer; the lower surface of polymer PPTC combined material core material covers second PPTC combined material copper foil layer in proper order, insulating PP layer of second and second electrode layer, first electrode layer includes electrode A1 and electrode B1, first printing ink layer has been printed respectively between electrode A1 and the electrode B1, the second electrode layer includes electrode A2 and electrode B2, second printing ink layer has been printed respectively between electrode A2 and the electrode B2, go up the printing ink layer and be convenient for protect outer copper foil with lower printing ink layer, be convenient for discern the product simultaneously, electrode A1 and electrode A2 switch on each other through conduction layer A, form the left electrode, electrode B1 and electrode B2 switch on each other through conduction layer B, form the right electrode.

The working principle is as follows: when the insulated PPTC composite material core material is used, firstly, the PPTC composite material copper foils covering the upper surface and the lower surface of the polymer PPTC composite material core material and playing a role in protecting the PPTC composite material copper foils, secondly, the first electrode layer and the second electrode on the outer side of the polymer PPTC composite material core material and the side surfaces of the polymer PPTC composite material core material are all wrapped and packaged, so that the conductive filler in the polymer PPTC composite material core material is not easily oxidized, and meanwhile, the polymer PPTC composite material core material is not easily corroded by moisture, so that a product has excellent weather resistance, good moisture resistance and obvious environmental stability, further, the weather resistance and reliability of the product are effectively improved, then, the insulating PP layer separates the polymer PPTC composite material core material from the second PPTC composite material copper foil layer, the first insulating PP layer separates the polymer PPTC composite material core material from the first PPTC composite material copper foil layer, and insulates the electrode A1 and the electrode B1 from the first polymer PPTC composite material copper foil, the short circuit risk is avoided; the second insulation PP layer mainly insulates and isolates the electrode A2 and the electrode B2 from the second polymer PPTC composite copper foil, so that the short circuit risk is avoided. The electrode A1 and the electrode A2 are mutually conducted through the conducting layer A to form a left electrode, the electrode B1 and the electrode B2 are mutually conducted through the conducting layer B to form a right electrode, so that an upper first electrode layer and a lower first electrode layer of a product can be welded and conducted, the upper ink layer and the lower ink layer respectively protect a first PPTC composite material copper foil layer and a second PPTC composite material copper foil layer, and the overcurrent protection paster element is completed.

Preferably, the PPTC composite chip comprises a crystalline polyolefin polymer and a conductive filler, wherein the conductive filler is metal conductive powder and/or carbon black powder, and the crystalline polymer substrate is one or a mixture of polyethylene, polyvinyl chloride, chlorinated polyethylene butadiene-acrylonitrile copolymer, polytetrafluoroethylene, polycarbonate, polyvinyl fluoride, maleic anhydride grafted polyethylene and polypropylene; the metal conductive powder is one or more of titanium carbide, vanadium carbide, zirconium carbide, tungsten carbide, niobium carbide, molybdenum carbide, titanium boride, vanadium boride, zirconium boride, niobium boride and titanium nitride, and the particle size of the metal conductive powder is between 0.01um and 30um, preferably between 0.1um and 12 um; the carbon black powder can be rubber carbon black, and the OilAbsorption (cc/100gram) range is between 60 and 140.

Specifically, the method for manufacturing the overcurrent protection component with reliable miniaturization and suitable IC packaging requirements comprises the following steps:

B. manufacturing a PPTC chip main body: gradually mixing and melting manufactured PPTC composite material particles through a single screw, extruding the mixture into a flaky polymeric PPTC composite material core material, automatically laminating upper and lower composite layers of copper foils through upper and lower rollers, and manufacturing a PPTC chip main body with the thickness of 0.15-0.25 mm, the width of 100-300 mm and the length of 100-400 mm;

G. forming a plurality of through grooves A and through grooves B on the composite material chip board by a linear cutting method, a groove engraving method or a punching method, wherein the through grooves A and the through grooves B are identical in size, the length of each through groove A is 3-30 mm, the width of each through groove A is 1-10 mm, and the gap between each through groove A and each through groove B is 0.45-0.65 mm, so as to form a conducting layer A;

H. manufacturing a conducting layer B according to the step G;

The second embodiment: the present case is a patch structure product of a double-layer PPTC polymer chip, and the perspective view thereof is shown in figure three; the PPTC composite material 1 and the PPTC composite material 2 are designed into a parallel structure so as to obtain lower resistance and larger rated working current characteristics, and the specific manufacturing method is as follows:

The first PPTC chip and the second PPTC chip are designed to be in a layer structure, and are organically combined together; from the structural point of view, the first PPTC chip and the second PPTC chip are in parallel connection, and when the first PPTC chip and the second PPTC chip are connected with the electronic component, the left electrode and the right electrode are respectively connected with power supply terminals of a circuit. Therefore, the space utilization rate is increased by adopting the layer structure, and the miniaturization design and the automatic mounting are facilitated.

The manufacturing process steps of the second embodiment are different from those of the first embodiment in that:

the second embodiment is a double-layer chip, two polymer PPTC composite core materials are selected, and inner layer circuit etching is performed according to the inner layer structure design of the product: etching the inner layer circuit of the first PPTC chip body to etch a part of the same copper foil layer of the PPTC chip body to form a first PPTC composite material copper foil layer and a second PPTC composite material copper foil layer on the upper surface and the lower surface of the first PPTC material, sequentially laying a first insulating PP layer and an outer copper foil A on the surface of the first PPTC composite material copper foil layer, laying a second insulating PP layer on the surface of the second PPTC composite material copper foil layer,

etching the inner layer circuit of the second PPTC chip to etch a part of the same copper foil layer of the main body of the second PPTC chip so as to form a third PPTC composite material copper foil layer and a fourth PPTC composite material copper foil layer on the upper surface and the lower surface of the second PPTC core material; a third insulating PP layer and an outer copper foil B are sequentially laid on the surface of the fourth PPTC composite copper foil layer, and the third PPTC composite copper foil layer is laid;

a third PPTC composite copper foil layer is superposed on the second insulation PP layer;

the outer layer copper foil A and the outer layer copper foil B are subjected to outer layer etching, copper deposition and electric tin treatment in the same treatment mode as the steps in the first embodiment, and finally a product is formed.

The test data of the embodiment 1 and the embodiment 2 are as follows:

in the first test, 10 samples of the embodiment 1 and the embodiment 2 are respectively taken and measured for the length, width and thickness dimensions, as shown in fig. 6, from the sample dimension, the minimum product in the existing PPTC industry can be realized, and the IC package dimension requirement can be realized.

And a second test step, namely respectively taking 10 samples of the first embodiment 1 and the second embodiment 2, testing the initial resistance R0 at room temperature, performing R welding after reflow soldering, packaging the product by LOCTITE ECCOCOND UF 3915 through a LOCTITE IC filling adhesive, curing for 140 ℃/20 minutes, testing after naturally cooling for 24H, taking the resistance R for curing, cooling for one hour to test R1 after the first embodiment is electrified by a constant current of 0.015A and the second embodiment is electrified by a constant current of 0.05A at room temperature to test R1, and finally electrifying for 0.08A for the first embodiment and the second embodiment to test R1trip of the product after cooling for one hour, wherein the resistance is normal. Specific test data refer to fig. 7 and 8.

From the data, the PPTC minimization can be realized, and the IC packaging process requirements and the electrical performance composite IC protection requirements can be met.

The above embodiments are merely illustrative of the preferred embodiments of the present invention, and not restrictive, and various changes and modifications to the technical solutions of the present invention may be made by those skilled in the art without departing from the spirit of the present invention, and the technical solutions of the present invention are intended to fall within the scope of the present invention defined by the appended claims.

Claims

1. An overcurrent protection component with reliable miniaturization suitable for IC packaging requirements, characterized in that: comprising a polymer PPTC composite material core material, the polymer PPTC composite material core material has an upper surface and a lower surface, and the polymer PPTC composite material core material has an upper surface and a lower surface. The upper surface of the composite core material is sequentially covered with the first PPTC composite material copper foil layer, the first insulating PP layer and the first electrode layer; the lower surface of the polymer PPTC composite material core material is sequentially covered with the second PPTC composite material copper foil Layer by layer, the second insulating PP layer and the second electrode layer, the first electrode layer includes electrode A1 and electrode B1, a first ink layer is printed between electrode A1 and electrode B1, and the second electrode layer includes electrode A2 and electrode B2 , A second ink layer is printed between the electrode A2 and the electrode B2, the electrode A1 and the electrode A2 are connected to each other through the conduction layer A to form the left electrode, and the electrode B1 and the electrode B2 are connected to each other through the conduction layer B to form the right electrode. electrode.

2 . An overcurrent protection component with reliable miniaturization and suitable for IC packaging requirements according to claim 1 , wherein the polymer PPTC composite core material comprises crystalline polyolefin polymer and conductive filler. 3 . , the conductive filler is metal conductive powder and/or carbon black powder, and the crystalline polymer base material is polyethylene, polyvinyl chloride, chlorinated polyethylene butadiene-acrylonitrile copolymer, polytetrafluoroethylene, poly One or more mixtures of carbonate, polyvinyl fluoride, maleic anhydride grafted polyethylene and polypropylene; the metal conductive powder is titanium carbide, vanadium carbide, zirconium carbide, tungsten carbide, niobium carbide, molybdenum carbide, boron One or more mixtures of titanium boride, vanadium boride, zirconium boride, niobium boride and titanium nitride.

3 . An overcurrent protection component with reliable miniaturization and suitable for IC packaging requirements according to claim 2 , wherein the particle size of the metal conductive powder is between 0.01um and 30um. 4 .

4 . The overcurrent protection component with reliable miniaturization and suitable for IC packaging requirements according to claim 2 , wherein the particle size of the metal conductive powder is between 0.1 um and 12 um. 5 .

5. An overcurrent protection component with reliable miniaturization suitable for IC packaging requirements according to claim 2, characterized in that: the carbon black powder can be selected from rubber carbon black, and its Oil Absorption (cc/100gram) The range is between 60 and 140.

6. A manufacturing method of an overcurrent protection component with reliable miniaturization suitable for IC packaging requirements according to claim 1, characterized in that: comprising the following steps:

A. PPTC composite material granulation: the crystalline polymer substrate and metal conductive powder or carbon black powder are crushed into particles by open-mixing processing, or mixed and made into particles by an internal mixer, or processed by twin-screw extrusion Granulation to form PPTC composite particles;

B. Making the main body of the PPTC chip: The PPTC composite material particles are gradually mixed and melted through a single screw, and extruded into a sheet-like polymer PPTC composite material core material. A PPTC chip body with a thickness of 0.15mm to 0.25mm, a width of 100 to 300mm and a length of 100 to 400mm;

C. Irradiation treatment of the main body of the PPTC chip: The main body of the PPTC chip is controlled at 1-5 layers, the electron beam energy is selected at 2-15Mev, the electron beam current is selected at 5-25mA, and the speed of the trolley is controlled at 5-20m/min. The main body of the PPTC chip is irradiated to achieve the irradiation dose of 60-180kGy;

D. Realize the circuit board: perform circuit etching on the surface copper foil of the PPTC chip body with the existing PCB process, so that part of the copper foil on the upper and lower surfaces of the PPTC chip body is etched away, and the first PPTC composite material is formed on the upper and lower surfaces of the PPTC chip body respectively. The copper foil layer and the second PPTC composite material copper foil layer;

E. A first insulating PP layer and a layer of outer copper foil A are arranged on the surface of the first PPTC composite material copper foil layer in turn; a second insulating PP layer is arranged on the surface of the etched second PPTC composite material copper foil layer layer in turn layer and a layer of outer copper foil B; then vacuum hot pressing is performed to make the outer copper foil A, the first insulating PP layer, the first PPTC composite copper foil layer and the upper surface of the PPTC core material tightly fused together, and the outer Layer copper foil B, the second insulating PP layer, the second PPTC composite material copper foil layer and the lower surface of the PPTC core material are tightly fused together;

F. The outer layer copper foil A and the outer layer copper foil B are etched out of the outer layer circuit according to the outer layer circuit design of the product, and the middle part of the copper foil and the reserved etching line are used as the subsequent processing cutting line, and the gap between the cutting line and the cutting line is 0.4 ~0.6mm, make the outer layer copper foil A form the first electrode layer; make the outer layer copper foil B form the second electrode layer;

G. The composite material chip sheet etched from the outer layer is subjected to wire cutting method or slotting method or stamping method to form a plurality of through grooves A and through grooves B on the composite material chip plate. The arrangement and combination and reserved etching lines are used for subsequent processing For the cutting line, the size of the through slot A and the through slot B is the same, the length is between 3~30mm, the width is between 1~10mm, and the gap between the through slot A and the through slot B is between 0.45~0.65mm, forming a conduction layer A;

H. According to the G step to make the conduction layer B;

1. make the conduction layer A connect the electrode A1, the first PPTC composite material copper foil layer and the electrode A2, and form the same conductive path; make the conduction layer B connect the electrode B1, the second PPTC composite material copper foil layer The layer and the electrode B2 are connected and conducted to form the same conductive path;

J. After cutting, de-UV, and stripping the reserved cutting line, the production of over-current protection components with reliable miniaturization and suitable for IC packaging requirements is completed.

7. An overcurrent protection component with reliable miniaturization suitable for IC packaging requirements, comprising a first PPTC chip and a second PPTC chip, the first PPTC chip and the second PPTC chip are in a parallel structure, and the first PPTC chip includes the first PPTC chip. A polymer PPTC composite material core material, the first polymer PPTC composite material core material has an upper surface and a lower surface, and the upper surface of the first polymer PPTC composite material core material is sequentially covered with the first PPTC composite material copper foil layer, the first polymer PPTC composite material core material an insulating PP layer and a first electrode layer; the lower surface of the first polymer PPTC composite material core material is sequentially covered with layers of copper foil and a second insulating PP layer of the second PPTC composite material, and the second PPTC chip includes a second polymer The PPTC composite material core material, the second polymer PPTC composite material core material has an upper surface and a lower surface, and the upper surface of the second polymer PPTC composite material core material is sequentially covered with the third PPTC composite material copper foil layer; The lower surface of the PPTC composite material core material is sequentially covered with the fourth PPTC composite material copper foil layer by layer, the third insulating PP layer and the second electrode layer.