CN114192985B - Magnetic field assisted laser polishing device and magnetic field assisted polishing method - Google Patents

Abstract

The application is applicable to the technical field of mechanical equipment, and provides a magnetic field auxiliary laser polishing device and a magnetic field auxiliary laser polishing method, wherein the magnetic field auxiliary laser polishing device comprises a cabinet; the workbench is arranged in the cabinet and is provided with a workpiece positioning area for placing a workpiece; a magnetic mechanism for causing the workpiece to be in a magnetic field; a laser system mounted within the cabinet, comprising: a first laser emitting mechanism for preheating the surface of the workpiece, a second laser emitting mechanism for polishing the surface of the workpiece, and a third laser emitting mechanism for annealing the surface of the workpiece. The magnetic field assisted laser polishing device provided by the invention can effectively reduce the surface roughness of a workpiece and improve the polishing effect by the magnetic field generated by the magnetic mechanism and the laser emitted by the laser system acting on the workpiece together.

Description

Magnetic field assisted laser polishing device and magnetic field assisted polishing method

technical field

The present application relates to the field of metal polishing, and more specifically, relates to a magnetic field-assisted laser polishing device and a magnetic field-assisted polishing method.

Background technique

Titanium alloy is suitable for the aerospace field due to its high strength, high heat resistance, and good corrosion resistance. Its high-quality corrosion resistance and excellent biocompatibility have also been highly recognized in the biomedical industry. 3D printing Expensive medical devices such as advanced titanium alloy artificial heart and blood stents have been successfully applied in clinical practice. Not only that, titanium alloys are also widely used in chemical, marine, automotive, energy and other industrial fields. The surface quality of titanium alloy is crucial to the performance and life of titanium alloy products.

Laser has potential advantages in the polishing application of titanium alloys. Not only can the polishing speed be adjusted during the polishing process, but also the polishing process is a non-contact polishing process that does not require cooling fluid, which can effectively reduce processing costs and protect the environment. However, the current laser polishing equipment can only emit one kind of laser beam, and the effect of one-time polishing of a single laser beam is often unsatisfactory.

Contents of the invention

The purpose of the embodiment of the present application is to provide a magnetic field assisted laser polishing device, aiming at solving the technical problem of relatively poor polishing effect on the titanium alloy surface in the prior art.

In order to achieve the above purpose, the technical solution adopted by this application is to provide a magnetic field assisted laser polishing device, including:

Cabinet;

A workbench is installed in the cabinet, and the workbench has a workpiece positioning area for placing workpieces;

a magnetic mechanism for subjecting the workpiece to a magnetic field;

The laser system, installed in the cabinet, includes: a first laser emitting mechanism for preheating the surface of the workpiece, a second laser emitting mechanism for polishing the surface of the workpiece, and a laser emitting mechanism for The third laser emitting mechanism for annealing the workpiece surface.

In a possible design, the magnetic mechanism includes a first electromagnetic structure and a second electromagnetic structure, and the first electromagnetic structure and the second electromagnetic structure are respectively arranged on two sides of the workpiece positioning area.

In a possible design, both the first laser emitting mechanism and the second laser emitting mechanism include a continuous laser, and the second laser emitting mechanism includes a pulsed laser.

In a possible design, the magnetic field-assisted laser polishing device further includes a sealed cabin and an air supply mechanism, the sealed cabin communicates with the gas supply mechanism through an air path, the workbench is located in the sealed cabin, The gas supply mechanism is used to supply inert gas to the sealed cabin through the gas path.

In a possible design, the magnetic field assisted laser polishing device further includes a controller, the controller is arranged on the cabinet, and the controller is electrically connected to the laser system and the magnetic mechanism respectively.

In a possible design, the magnetic field-assisted laser polishing device further includes a water cooler, and the water cooler is respectively connected to the first laser emitting mechanism, the second laser emitting mechanism and the third laser emitting mechanism through water pipes.

The present application also provides a magnetic field-assisted laser polishing method, which is suitable for the magnetic field-assisted laser polishing device described in the above technical solution, including:

mounting a workpiece to the workpiece positioning area of the workbench;

activating the magnetic mechanism such that the workpiece is in a magnetic field;

Start the laser system so that the first laser emitting mechanism emits a first beam to form a preheating spot on the surface of the workpiece, so that the second laser emitting mechanism emits a second beam to form a polishing spot on the surface of the workpiece, so that the third The laser emitting mechanism emits a third light beam to form an annealing spot on the surface of the workpiece. There are overlapping areas between the preheating spot and the polishing spot, and between the polishing spot and the annealing spot. According to the setting A path moves the preheating spot, the polishing spot and the annealing spot to perform polishing on the workpiece.

In a possible design, there are overlapping regions between the preheating spot and the polishing spot, and between the polishing spot and the annealing spot;

The overlapping ratio between the preheating spot and the polishing spot is 30%-50%, and/or, the overlapping ratio between the polishing spot and the annealing spot is 30%-50%.

In a possible design, the scanning speed of the first light beam, the scanning speed of the second light beam and the scanning speed of the third light beam are the same, all of which are 20mm/s-60mm/s; and/or

The power of the first light beam is 150W-250W, the power of the second light beam is 20W-50W, and the power of the third light beam is 100W-200W.

In a possible design, before the step of starting the laser system, it also includes:

Open the gas supply mechanism so that the inert gas in the gas supply mechanism enters the sealed compartment, and/or

Turn on the water cooler to cool down the first laser emitting mechanism, the second laser emitting mechanism and the third laser emitting mechanism.

The beneficial effect of the magnetic field-assisted laser polishing device provided by the application is that: compared with the prior art, the magnetic field-assisted laser polishing device of the present application can be used to polish the surface of a workpiece (such as the surface of a titanium alloy workpiece), and the polishing process is: The workpiece to be polished is placed in the workpiece positioning area of the workbench, and the area to be polished on the surface of the workpiece is heated by the first laser emitting mechanism. After heating, the surface temperature of the workpiece will increase to preheat the surface of the workpiece. When the surface temperature of the workpiece has not risen to the melting point, the preheated area is polished by the second laser emitting mechanism. At this time, only a small power is required to make the surface temperature of the workpiece reach above the melting point. In the polished area, the surface of the workpiece is annealed by the third laser emitting mechanism, so that defects such as cracks and voids caused by rapid surface cooling can be effectively placed. While using the laser system to polish the surface of the workpiece, start the magnetic mechanism so that the workpiece is in the magnetic field, the magnetic field acts on the surface of the workpiece, and the Lorentz force generated by the magnetic field will inhibit the flow of the molten pool on the surface of the workpiece and promote the flow of the molten pool on the surface of the workpiece. During the solidification process, the crystal nucleation makes the solidified grains more refined, thereby inhibiting the formation of the second roughness on the surface of the workpiece, further reducing the average roughness of the workpiece surface and increasing the mechanical properties, and can effectively inhibit the molten pool from forming Defects such as splashes during the flow process, ripples and cracks caused by molten pool oscillations.

In summary, the magnetic field-assisted laser polishing device provided by this application acts on the workpiece (including workpieces made of titanium alloy) through the magnetic field generated by the magnetic mechanism and the laser emitted by the laser system, which can effectively reduce the surface roughness of the workpiece and improve the polishing efficiency. Effect.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the accompanying drawings that need to be used in the descriptions of the embodiments or the prior art will be briefly introduced below. Obviously, the accompanying drawings in the following description are only for the present application For some embodiments, those of ordinary skill in the art can also obtain other drawings based on these drawings without any creative effort.

Fig. 1 is a schematic structural view of a magnetic field-assisted laser polishing device provided by an embodiment of the present application;

Fig. 2 is a structural schematic diagram of another viewing angle of a magnetic field-assisted laser polishing device provided by an embodiment of the present application;

Fig. 3 is a schematic diagram of the internal structure of a magnetic field-assisted laser polishing device provided by an embodiment of the present application;

Fig. 4 is a perspective view of a sealed cabin of a magnetic field-assisted laser polishing device provided by an embodiment of the present application;

Fig. 5 is a schematic diagram of the relative positional relationship between the magnetic mechanism and the workpiece of the magnetic field-assisted laser polishing device provided by an embodiment of the present application;

Fig. 6 is a schematic diagram of the connection of the water circuit and the air circuit of the magnetic field assisted laser polishing device provided by an embodiment of the present application.

The details of the labels involved in the above drawings are as follows:

10. Cabinet; 20. Sealed cabin; 31. Shell; 32. Power connector; 41. Laser; 42. Beam expander; 43. Scanning mirror; 51. Display; 52. Host; 61. Gas cylinder; 62. Air pipe; 71. Water cooler; 72. Water pipe; 81. Preheating spot; 82. Polishing spot; 83. Annealing spot; 90. Workpiece.

Detailed ways

In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the application and simplifying the description, rather than indicating or implying Magnetic field assisted laser polishing devices or elements must have a particular orientation, be constructed and operate in a particular orientation, and thus are not to be construed as limitations on the present application.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present application, "plurality" means two or more, unless otherwise specifically defined.

In order to illustrate the technical solutions described in this application, the following will be described in detail in conjunction with specific drawings and embodiments.

first embodiment

As shown in Figures 1 to 6, an embodiment of the present application provides a magnetic field-assisted laser polishing device, including: a cabinet 10, a workbench, a magnetic mechanism and a laser system, wherein: the workbench, the magnetic mechanism and the laser system are all installed on Inside the cabinet 10 , the workbench has a workpiece positioning area for placing the workpiece 90 . The magnetic mechanism is used to generate a magnetic field, so that the workpiece 90 located in the workpiece positioning area is in the magnetic field. The laser system includes three laser emitting mechanisms, respectively: a first laser emitting mechanism, a second laser emitting mechanism and a third laser emitting mechanism, the first laser emitting mechanism is used to preheat the surface of the workpiece 90 to be polished, and the second laser emitting mechanism The laser emitting mechanism is used for polishing the preheated area, and the third laser emitting mechanism is used for annealing the area of the surface of the workpiece 90 polished by the second laser emitting mechanism.

The bottom of the cabinet 10 can be provided with rollers, brake pads can be provided on the rollers, and the rollers are preferably universal wheels. The bottom of the cabinet 10 is also provided with auxiliary supporting feet.

The magnetic mechanism includes a first electromagnetic structure and a second electromagnetic structure, and the first electromagnetic structure and the second electromagnetic structure are respectively arranged on both sides of the workpiece positioning area. The first electromagnetic structure and the second electromagnetic structure can adopt the same structure. For example, as shown in FIG. An electric joint 32 is provided, and the coil is connected with the electric joint 32 , and the electric joint 32 can be connected with a cable, and the coil is energized by the cooperation of the cable and the electric joint 32 . For example, after electrification, the side of the first electromagnetic structure facing the second electromagnetic structure is an N pole, and the side of the second electromagnetic structure facing the first electromagnetic structure is an S pole.

In a possible design, the three laser emission mechanisms all include a laser 41, a beam expander 42 and a scanning galvanometer 43. The beam emitted by the laser 41 enters the scanning galvanometer 43 through the beam expander 42 and is focused by the galvanometer. The laser spot is focused on the surface of the workpiece 90 . Wherein, both the first laser emitting mechanism and the second laser emitting mechanism include a continuous laser, and the second laser emitting mechanism includes a pulsed laser.

Optionally, the magnetic field assisted laser polishing device also includes a control mechanism, the control mechanism is electrically connected to the magnetic mechanism and the laser system respectively, and the control mechanism can control whether the coil in the magnetic mechanism is energized or not, and can control the magnitude of the power fed into the coil. The continuous laser/pulse laser parameters emitted by the laser 41 in the laser system can be controlled, and the polishing range can be selected.

In an optional embodiment, the control mechanism includes a control board and a display screen connected to the control board, the display screen is fixed on the outer surface of the cabinet 10, the display screen is a touch screen, and the control operation is performed by selecting or inputting information on the touch screen .

Preferably, in another optional embodiment, the control mechanism may include a control computer, the control computer includes a display 51, a host 52 and an input terminal, the host 52 is installed on the inside of the cabinet 10, and a bracket is connected to the outer wall of the cabinet 10, The monitor 51 is installed on the bracket, and the input end may include a mouse and a keyboard connected to the host computer 52 . With such an arrangement, the host computer 52 of the control mechanism can be placed inside the cabinet 10, and the space inside the cabinet 10 can be reasonably utilized, while the display screen and the input terminal can be placed in an area that is convenient for the user to operate and does not affect the opening and closing of the cabinet door.

In order to further improve the sealing effect, in a possible design, the magnetic field-assisted laser polishing device also includes a sealed cabin 20 and an air supply mechanism. , the gas supply mechanism is used to supply the inert gas to the sealed cabin 20 through the gas path. For example, the inert gas may be argon. Before starting the laser system, lock the airtight cabin 20 so that the airtight cabin 20 remains in a sealed state, and then provide argon gas into the airtight cabin 20 through the gas supply mechanism to prevent the surface of the workpiece 90 from being oxidized during the polishing process.

The gas supply mechanism includes a gas cylinder 61 , which communicates with a gas pipe 62 . A valve is arranged on the gas outlet of the gas cylinder 61 or on the air pipe 62 , or an air pump is arranged on the air pipe 62 , so as to control whether the gas in the airtight cabin 20 enters or not. The gas supply mechanism is electrically connected with the control mechanism, and the working state of the gas supply mechanism is controlled by the control mechanism. As shown in FIG. 4 , the sealed chamber is connected with two air pipes 62 , wherein one air pipe 62 is an air intake pipe, one end of the air intake pipe is connected with the gas bottle 61 , and the other air pipe 62 is an air outlet pipe.

Specifically, the bottom plate of the airtight cabin 20 can be used as a workbench, or the workbench exists independently of the airtight cabin 20 and is fixed on the bottom plate of the airtight cabin 20 .

There is a workpiece positioning area on the worktable. The workpiece positioning area is the area between the first magnetic structure and the second magnetic structure on the worktable. This area can only be divided in position, and is structurally different from the top surface of the worktable The area is the same. Alternatively, a limit slot can be provided on the worktable, and the workbench can be positioned within the limit slot; or, a plurality of positioning holes can be provided on the workbench, and positioning pins can be inserted into the positioning holes, and the area surrounded by the positioning pins is Workpiece positioning area. Different positioning holes for inserting the positioning pins can make the area surrounded by the positioning pins of different sizes, thereby adapting to the positioning of workpieces 90 of various sizes.

In the magnetic mechanism, the distance between the first magnetic structure and the second magnetic structure can be changed, so that the distance between the coil and the workpiece 90 can be changed by adjusting the positions of the first magnetic structure and the second magnetic structure, thereby adjusting the effect on The magnitude of the magnetic field on the workpiece 90.

In an optional implementation, only the first magnetic structure and the second magnetic structure may be placed on the workbench, and there is no connection relationship between the first magnetic structure and the workbench, and between the second magnetic structure and the workbench. When it is necessary to change the positions of the first magnetic structure and the second magnetic structure, the operator manually changes the positions of the first magnetic structure and the second magnetic structure.

Or, in another alternative embodiment, a first guide is provided on the workbench, a second guide is provided on the first magnetic structure and the second magnetic structure, and the first guide and the second guide Fitted installation, so that the first magnetic structure can move away from or approach the second magnetic structure along the first guide, and the second magnetic structure can move away from or into the first magnetic structure along the first guide, The first guiding member plays a guiding role for the first magnetic structure and the second magnetic structure respectively to a certain extent.

Among the first guide piece and the second guide piece, one is a guide groove, and the other is a guide rail.

For example, the first magnetic structure and the second magnetic structure are placed at intervals along the first direction, and the workpiece 90 is placed between them. The first guide is a guide rail, and the second guide is a guide groove, so the number of the first guide is two, and the two guide rails are placed at intervals along the first direction, and the workpiece positioning area is located between the two guide rails. The bottom of the housing 31 of the first magnetic structure and the bottom of the housing 31 of the second magnetic structure are respectively provided with guide grooves, the first magnetic structure is slidably fitted on one of the guide rails, and the second magnetic structure is slidably fitted on the second guide rail. In this way, the first magnetic structure and the second magnetic structure can only move along the first direction under the action of the corresponding guide rail, so that when the distance between the coil and the workpiece 90 is changed, the first magnetic structure and the second magnetic structure The movement stability is stronger, and the path deviation is not easy to occur.

Or, in yet another optional embodiment, a driver is provided outside the sealed cabin 20, and the output end of the driver extends into the sealed cabin 20 and is connected with at least one of the first magnetic mechanism and the second magnetic mechanism to push The first magnetic structure and/or the second magnetic mechanism connected thereto moves in the first direction. The number of output ends of the driver can be two, one of which is connected to the first magnetic mechanism, and the other is connected to the second magnetic mechanism, and the two output ends are connected through a transmission mechanism so that when the driver starts, the two output ends Simultaneous operation, so as to simultaneously drive the first magnetic mechanism and the second magnetic mechanism to move in opposite directions to approach or move away from each other. It is worth noting that the seal between the output end of the driver and the side wall of the airtight chamber 20 is achieved by a combination of dynamic sealing and static sealing, so as to achieve a good sealing effect while ensuring the movement of the output end.

In a possible design, the magnetic field-assisted laser polishing device further includes a water cooler 71 , and the water cooler 71 is connected to the first laser emitting mechanism, the second laser emitting mechanism and the third laser emitting mechanism through water pipes 72 . Specifically, the water cooler 71 is provided with twelve water pipes 72, of which six water inlet pipes 72 and six water outlet pipes 72, one water inlet pipe 72 and one water outlet pipe 72 are a group of cooling water pipes, the first laser emitting mechanism, the second laser The emitting mechanism and the third laser emitting mechanism are respectively connected with two sets of cooling water pipes. Specifically, in the laser emitting mechanism, respective lasers 41 and scanning galvanometers 43 are respectively connected with a set of cooling water pipes, so one laser emitting mechanism is connected with two sets of cooling water pipes.

Before starting the laser system, turn on the water cooler 71 to cool the scanning galvanometer 43 and the laser 41 in advance, and provide suitable working temperatures for the scanning galvanometer 43 and the laser 41 . For example, the working temperature of the scanning galvanometer 43 and the laser 41 is maintained below 24° C. through a water cooler.

The water cooler 71 can be electrically connected with the control mechanism, so as to control the start and stop of the water cooler 71 through the control mechanism.

second embodiment

This embodiment provides a magnetic field-assisted laser polishing method, which is applicable to the magnetic field-assisted laser polishing device provided in the first embodiment above. The magnetic field-assisted laser polishing method includes:

Installing the workpiece 90 to the workpiece positioning area of the workbench;

activating the magnetic mechanism so that the workpiece 90 is in the magnetic field;

Start the laser system so that the first laser emitting mechanism emits the first beam so that the surface of the workpiece 90 forms a preheating spot 81, so that the second laser emitting mechanism emits the second beam so that the surface of the workpiece 90 forms a polishing spot 82, so that the third The laser emitting mechanism emits a third beam to form an annealing spot 83 on the surface of the workpiece 90 , and moves the preheating spot 81 , the polishing spot 82 and the annealing spot 83 according to a set path to polish the workpiece 90 .

The magnetic field assisted laser polishing method provided in this embodiment is suitable for polishing the surface of the workpiece 90 , especially for polishing the plane of the surface of the workpiece 90 .

In an optional embodiment, there are overlapping regions between the preheating spot 81 and the polishing spot 82 , and between the polishing spot 82 and the annealing spot 83 . Due to the existence of the overlapping area, the area to be polished on the surface of the workpiece 90 to be polished can be polished immediately after preheating, and there is no gap in the middle, so the polishing effect is better.

In an optional implementation, the overlapping ratio between the preheating light spot 81 and the polishing light spot 82 is 30%-50%.

In an optional embodiment, the overlap ratio between the polishing spot 82 and the annealing spot 83 is 30%-50%.

In an optional embodiment, the power of the first light beam is 150W-250W, the power of the second light beam is 20W-50W, and the power of the third light beam is 100W-200W.

In an optional implementation, the scanning speed of the first light beam, the scanning speed of the second light beam and the scanning speed of the third light beam are the same, all of which are 20mm/s-60mm/s. The power, spot size, and scanning speed of different laser emitting mechanisms in the laser system can be controlled by the control mechanism, so that arbitrarily selected regions on the workpiece 90 can be polished.

In a possible design, before the step of starting the laser system, it further includes: opening the gas supply mechanism, so that the inert gas in the gas supply mechanism enters the sealed compartment 20 .

In a possible design, before the step of starting the laser system, it also includes: turning on the water cooler 71 to cool down the first laser emitting mechanism, the second laser emitting mechanism and the third laser emitting mechanism.

To sum up, in a specific implementation, the polishing method provided in this embodiment is described by taking polishing the planar surface of the workpiece 90 made of titanium alloy material as an example.

Polishing methods include:

Fix the workpiece 90 on the table.

Start the water cooler 71 to pre-cool the lasers 41 and scanning galvanometers 43 to ensure that the working temperatures of the lasers 41 and scanning galvanometers 43 are kept below 24°C.

Start the gas supply device, rush argon gas into the airtight cabin 20 through the gas supply device, close the sealing cover plate of the sealing cabin 20, and lock the sealing cover plate, so that the sealing cabin 20 forms a closed chamber, and the workpiece 90 is located in the airtight chamber. inside the chamber.

Start the magnetic mechanism, energize the energizing joint 32, so that the coil is energized, and the magnitude of the magnetic field can be changed by changing the magnitude of the current or the distance between the coil and the workpiece 90, and the magnetic field generated by the coil acts on the workpiece 90.

Start the laser system, the laser light generated in the first laser emitting mechanism enters the scanning galvanometer 43 through the beam expander 42, and after being focused by the scanning galvanometer 43, it acts on the surface of the workpiece 90 to form a preheating spot 81 with a diameter of 0.6mm. While the first laser emitting mechanism is activated, the laser light generated in the second laser emitting mechanism enters the scanning galvanometer 43 through the beam expander 42, and after being focused by the scanning galvanometer 43, it acts on the surface of the workpiece 90 to form a polishing spot with a diameter of 0.3mm 82. While the second laser emitting mechanism is activated, the laser generated in the third laser emitting mechanism enters the scanning galvanometer 43 through the beam expander 42, and after being focused by the scanning galvanometer 43, it acts on the surface of the workpiece 90 to form an annealing spot with a diameter of 0.6mm 83. The melting point of titanium alloy material is 1900°C. In order to improve the polishing efficiency and polishing quality, the power of the first laser emitting mechanism is 150W-250W, the power of the second laser emitting mechanism is 20W-50W, and the power of the third laser emitting mechanism is 100W. -200W. The overlapping ratio between the preheating spot 81 and the polishing spot 82, and the overlapping ratio between the polishing spot 82 and the annealing spot 83 are both 30%-50%. In order to avoid heat accumulation, during one polishing process of the device, the total area of the polished area on the surface of the titanium alloy workpiece 90 should not be less than 100 mm ² as much as possible. The scanning speeds of the first laser emitting mechanism, the second laser emitting mechanism and the third laser emitting mechanism are all the same.

In the above polishing process, laser polishing is a new polishing technology that melts and then solidifies the material. From the microscopic level, the peak material on the surface of the titanium alloy workpiece 90 is heated and melted under the action of laser energy to form a molten pool, which will be subject to gravity and buoyancy. , Surface tension and other forces, if the molten pool has solidified and these forces have not been balanced, the surface of the regenerated titanium alloy will be uneven and the polishing effect will not be achieved. Multi-laser polishing is to use continuous laser 41 to heat the polishing area on the surface of titanium alloy workpiece 90. After heating, the surface temperature of titanium alloy workpiece 90 will rise sharply, and after reaching slightly lower than 1900°C, pulse laser is used to perform further polishing on the titanium alloy material. Polishing, so the pulse laser only needs a small power to raise the temperature of the sample surface above the melting point, and finally use the continuous laser 41 to anneal the titanium alloy sample, which can effectively prevent cracks, pores, etc. due to rapid surface cooling defect. Magnetic field assisted polishing is to apply the magnetic field generated by the energized coil on the titanium alloy plane during the laser polishing process. The Lorentz force generated by the magnetic field will inhibit the flow of the molten pool and promote the nucleation of titanium alloy crystals during the solidification process of the molten pool. Make the solidified titanium alloy crystals more refined. Therefore, the formation of the second roughness on the surface of the titanium alloy is suppressed, so that the average roughness of the surface of the titanium alloy is reduced and the mechanical properties are increased at the same time.

In the polishing method provided in this embodiment, the combination of multi-laser polishing method and magnetic field-assisted polishing is adopted, and by adding preheating spot 81 and annealing spot 83, the surface of titanium alloy workpiece 90 can be effectively reduced due to excessive cooling rate and excessive temperature gradient. Defects such as cracks and pores appear, thereby reducing the roughness of the polished titanium alloy surface. Using magnetic field-assisted polishing, the magnetic field generated by adding energized coils on both sides of the workpiece 90 can effectively suppress the splashing of the molten pool during the flow process, the ripples and cracks caused by the oscillation of the molten pool and other defects, and can further reduce the titanium alloy surface. roughness.

The above are only optional embodiments of the application, and are not intended to limit the application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the application shall be included in the protection scope of the application. Inside.

Claims (8)

1. A magnetic field assisted laser polishing apparatus comprising:

a cabinet;

the workbench is arranged in the cabinet and is provided with a workpiece positioning area for placing a workpiece;

a magnetic mechanism for causing the workpiece to be in a magnetic field;

a laser system mounted within the cabinet, comprising: a first laser emitting mechanism for preheating the surface of the workpiece, a second laser emitting mechanism for polishing the surface of the workpiece, and a third laser emitting mechanism for annealing the surface of the workpiece; the first laser emission mechanism is used for emitting a first light beam so as to enable the surface of the workpiece to form a preheating light spot, the second laser emission mechanism is used for emitting a second light beam so as to enable the surface of the workpiece to form a polishing light spot, and the third laser emission mechanism is used for emitting a third light beam so as to enable the surface of the workpiece to form an annealing light spot; overlapping areas are formed between the preheating light spot and the polishing light spot and between the polishing light spot and the annealing light spot; the power of the first light beam is 150W-250W, the power of the second light beam is 20W-50W, and the power of the third light beam is 100W-200W; the overlapping rate between the preheating light spot and the polishing light spot is 30% -50%, and the overlapping rate between the polishing light spot and the annealing light spot is 30% -50%; the magnetic mechanism comprises a first electromagnetic structure and a second electromagnetic structure, and the first electromagnetic structure and the second electromagnetic structure are respectively arranged at two sides of the workpiece positioning area;

the first electromagnetic structure and the second electromagnetic structure respectively comprise a shell, a coil is arranged in the shell, an energizing connector is arranged on the shell, the coil is connected with the energizing connector, the energizing connector is connected with a cable, and the coil is energized by matching the cable with the energizing connector; the magnitude of the magnetic field can be changed by changing the magnitude of the current or the distance between the coil and the workpiece, and the magnetic field generated by the coil acts on the workpiece;

the workbench is provided with a first guide piece, the first magnetic structure and the second magnetic structure are provided with a second guide piece, and the first guide piece and the second guide piece are matched and installed, so that the first magnetic structure can move along the first guide piece in a direction away from or close to the second magnetic structure, the second magnetic structure can move along the first guide piece in a direction away from or open into the first magnetic structure, and the first guide piece has a guiding function on the first magnetic structure and the second magnetic structure respectively;

the first magnetic structure and the second magnetic structure are arranged at intervals along the first direction, and a workpiece is arranged between the first magnetic structure and the second magnetic structure;

a driver is arranged outside the sealed cabin, the output end of the driver extends into the sealed cabin and is connected with at least one of the first magnetic mechanism and the second magnetic mechanism so as to push the first magnetic mechanism and/or the second magnetic mechanism connected with the driver to move along the first direction, the number of the output ends of the driver can be two, one of the two output ends is connected with the first magnetic mechanism, the other one of the two output ends is connected with the second magnetic mechanism in a transmission way through a transmission mechanism, so that when the driver is started, the two output ends simultaneously operate to drive the first magnetic mechanism and the second magnetic mechanism to move in opposite directions so as to be close to or far away from each other; the output end of the driver is sealed with the side wall of the sealed cabin (20) in a mode of combining dynamic sealing and static sealing.

2. The magnetic field assisted laser polishing apparatus of claim 1 wherein the first laser emitting mechanism and the second laser emitting mechanism each comprise a continuous laser and the second laser emitting mechanism comprises a pulsed laser.

3. The magnetic field assisted laser polishing apparatus of claim 1 further comprising a capsule and a gas supply mechanism, the capsule in communication with the gas supply mechanism via a gas path, the table positioned within the capsule, the gas supply mechanism configured to provide an inert gas to the capsule via the gas path.

4. The magnetic field assisted laser polishing apparatus of claim 1 further comprising a controller disposed on the cabinet, the controller electrically connected to the laser system and the magnetic mechanism, respectively.

5. The magnetic field assisted laser polishing apparatus of claim 1 further comprising a water cooler connected to the first, second and third laser emitting mechanisms, respectively, by a water line.

6. A magnetic field assisted laser polishing method suitable for use in a magnetic field assisted laser polishing apparatus according to any one of claims 1 to 5, comprising:

mounting the workpiece to a workpiece positioning area of the table;

starting a magnetic mechanism to enable the workpiece to be in a magnetic field;

starting a laser system, enabling a first laser emission mechanism to emit a first light beam so as to enable the surface of a workpiece to form a preheating light spot, enabling a second laser emission mechanism to emit a second light beam so as to enable the surface of the workpiece to form a polishing light spot, enabling a third laser emission mechanism to emit a third light beam so as to enable the surface of the workpiece to form an annealing light spot, and moving the preheating light spot, the polishing light spot and the annealing light spot according to a set path so as to polish the workpiece; overlapping areas are formed between the preheating light spot and the polishing light spot and between the polishing light spot and the annealing light spot; the power of the first light beam is 150W-250W, the power of the second light beam is 20W-50W, and the power of the third light beam is 100W-200W; the overlapping rate between the preheating light spot and the polishing light spot is 30% -50%, and the overlapping rate between the polishing light spot and the annealing light spot is 30% -50%.

7. The method of claim 6, wherein the scanning speed of the first beam and the scanning speed of the second beam are each 20mm/s to 60mm/s.

8. The magnetic field assisted laser polishing method of claim 6, further comprising, prior to the step of activating the laser system:

opening the gas supply mechanism to enable inert gas in the gas supply mechanism to enter the sealed cabin, and/or

And opening a water cooling machine to cool the first laser emission mechanism, the second laser emission mechanism and the third laser emission mechanism.

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