CN114188442B - A preparation method of antimony-doped electrochemical deposition copper-zinc-tin-sulfur solar cell absorber layer - Google Patents
A preparation method of antimony-doped electrochemical deposition copper-zinc-tin-sulfur solar cell absorber layer Download PDFInfo
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- WILFBXOGIULNAF-UHFFFAOYSA-N copper sulfanylidenetin zinc Chemical compound [Sn]=S.[Zn].[Cu] WILFBXOGIULNAF-UHFFFAOYSA-N 0.000 title claims abstract description 78
- 238000004070 electrodeposition Methods 0.000 title claims abstract description 17
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 239000006096 absorbing agent Substances 0.000 title claims description 8
- 239000010408 film Substances 0.000 claims abstract description 32
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 28
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000010409 thin film Substances 0.000 claims abstract description 25
- 238000000137 annealing Methods 0.000 claims abstract description 15
- 239000000843 powder Substances 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 11
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 10
- 239000011733 molybdenum Substances 0.000 claims abstract description 10
- 238000004073 vulcanization Methods 0.000 claims abstract description 8
- 238000010521 absorption reaction Methods 0.000 claims abstract description 7
- 239000008367 deionised water Substances 0.000 claims abstract description 7
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910000365 copper sulfate Inorganic materials 0.000 claims abstract description 6
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims abstract description 6
- AVTYONGGKAJVTE-OLXYHTOASA-L potassium L-tartrate Chemical compound [K+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O AVTYONGGKAJVTE-OLXYHTOASA-L 0.000 claims abstract description 6
- 229940111695 potassium tartrate Drugs 0.000 claims abstract description 6
- 239000001509 sodium citrate Substances 0.000 claims abstract description 6
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims abstract description 6
- 235000011083 sodium citrates Nutrition 0.000 claims abstract description 6
- 235000011006 sodium potassium tartrate Nutrition 0.000 claims abstract description 6
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 claims abstract description 6
- 235000019345 sodium thiosulphate Nutrition 0.000 claims abstract description 6
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 claims abstract description 6
- 229910000368 zinc sulfate Inorganic materials 0.000 claims abstract description 6
- 229960001763 zinc sulfate Drugs 0.000 claims abstract description 6
- 239000001476 sodium potassium tartrate Substances 0.000 claims abstract description 5
- RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 claims abstract description 3
- 238000005987 sulfurization reaction Methods 0.000 claims abstract description 3
- 229910000375 tin(II) sulfate Inorganic materials 0.000 claims abstract description 3
- 230000001105 regulatory effect Effects 0.000 claims abstract 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 238000000151 deposition Methods 0.000 claims description 10
- 229910002804 graphite Inorganic materials 0.000 claims description 10
- 239000010439 graphite Substances 0.000 claims description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- 230000008021 deposition Effects 0.000 claims description 6
- YPMOSINXXHVZIL-UHFFFAOYSA-N sulfanylideneantimony Chemical compound [Sb]=S YPMOSINXXHVZIL-UHFFFAOYSA-N 0.000 claims description 6
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 4
- GTKRFUAGOKINCA-UHFFFAOYSA-M chlorosilver;silver Chemical compound [Ag].[Ag]Cl GTKRFUAGOKINCA-UHFFFAOYSA-M 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 229910052717 sulfur Inorganic materials 0.000 claims description 4
- 239000011593 sulfur Substances 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 3
- 239000000243 solution Substances 0.000 claims description 3
- 229910052786 argon Inorganic materials 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- OQRNKLRIQBVZHK-UHFFFAOYSA-N selanylideneantimony Chemical compound [Sb]=[Se] OQRNKLRIQBVZHK-UHFFFAOYSA-N 0.000 claims 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims 1
- 230000002745 absorbent Effects 0.000 claims 1
- 239000002250 absorbent Substances 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 claims 1
- 239000011259 mixed solution Substances 0.000 claims 1
- 238000004321 preservation Methods 0.000 claims 1
- 238000005086 pumping Methods 0.000 claims 1
- 230000000630 rising effect Effects 0.000 claims 1
- 238000011160 research Methods 0.000 abstract description 3
- FAWGZAFXDJGWBB-UHFFFAOYSA-N antimony(3+) Chemical compound [Sb+3] FAWGZAFXDJGWBB-UHFFFAOYSA-N 0.000 abstract description 2
- 239000003153 chemical reaction reagent Substances 0.000 abstract description 2
- 230000001276 controlling effect Effects 0.000 abstract 1
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000001069 Raman spectroscopy Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000004626 scanning electron microscopy Methods 0.000 description 4
- 239000012670 alkaline solution Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- FAKFSJNVVCGEEI-UHFFFAOYSA-J tin(4+);disulfate Chemical compound [Sn+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O FAKFSJNVVCGEEI-UHFFFAOYSA-J 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000001237 Raman spectrum Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000005516 deep trap Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000005486 sulfidation Methods 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 238000001291 vacuum drying Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 241000282414 Homo sapiens Species 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910021607 Silver chloride Inorganic materials 0.000 description 1
- SEUJAMVVGAETFN-UHFFFAOYSA-N [Cu].[Zn].S=[Sn]=[Se] Chemical compound [Cu].[Zn].S=[Sn]=[Se] SEUJAMVVGAETFN-UHFFFAOYSA-N 0.000 description 1
- PDYXSJSAMVACOH-UHFFFAOYSA-N [Cu].[Zn].[Sn] Chemical compound [Cu].[Zn].[Sn] PDYXSJSAMVACOH-UHFFFAOYSA-N 0.000 description 1
- ZQRRBZZVXPVWRB-UHFFFAOYSA-N [S].[Se] Chemical compound [S].[Se] ZQRRBZZVXPVWRB-UHFFFAOYSA-N 0.000 description 1
- LAJDTOIDXQYPCZ-UHFFFAOYSA-N [Se]=S.[Sn].[Zn].[Cu] Chemical compound [Se]=S.[Sn].[Zn].[Cu] LAJDTOIDXQYPCZ-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- PCRGAMCZHDYVOL-UHFFFAOYSA-N copper selanylidenetin zinc Chemical compound [Cu].[Zn].[Sn]=[Se] PCRGAMCZHDYVOL-UHFFFAOYSA-N 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000001472 potassium tartrate Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000011573 trace mineral Substances 0.000 description 1
- 235000013619 trace mineral Nutrition 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
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- H—ELECTRICITY
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- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D9/00—Electrolytic coating other than with metals
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- H—ELECTRICITY
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- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
- H10F77/169—Thin semiconductor films on metallic or insulating substrates
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- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
Description
技术领域technical field
本发明涉及半导体材料与太阳能技术领域,尤其是一种锑掺杂电化学沉积铜锌锡硫太阳能电池吸收层制备方法。The invention relates to the technical field of semiconductor materials and solar energy, in particular to a method for preparing an absorbing layer of an antimony-doped electrochemically deposited copper-zinc-tin-sulfur solar cell.
背景技术Background technique
全球经济发展和人口增长共同驱动着巨大的能源需求。石油、天然气和煤炭等传统资源日趋枯竭,同时化石能源燃烧后所排放的气体导致环境污染和气候复杂变化,使人类正面临着能源紧缺和全球气候变暖的双重挑战。作为可再生能源利用的重要形式之一,太阳能光伏发电具有非常显著的优点,其发电资源丰富,取之不尽、用之不竭、清洁环保、发电过程无燃料、无噪声、无排放、性能稳定、寿命长、运维简单、使用可靠再生能源是社会发展的重要物质基础。Global economic development and population growth are jointly driving huge energy demands. Traditional resources such as oil, natural gas, and coal are becoming increasingly depleted. At the same time, the gas emitted from the combustion of fossil energy causes environmental pollution and complex climate changes. Human beings are facing the dual challenges of energy shortage and global warming. As one of the important forms of renewable energy utilization, solar photovoltaic power generation has very significant advantages. Its power generation resources are abundant, inexhaustible, clean and environmentally friendly, no fuel, no noise, no emissions, stable performance, long life, simple operation and maintenance, and the use of reliable renewable energy is an important material basis for social development.
出于寻找廉价、绿色环保、稳定的半导体吸收材料,其中铜锌锡硫四元半导体材料吸引全球科学家了越来越多的关注。由于该材料包含丰富、成本低、无毒的元素,且其带隙十分接近单结太阳能电池吸收层的最优带隙等诸多优点,使之成为最具发展前景的光伏吸收层材料之一。经过近几年不断的努力,纯硫化铜锌锡硫、纯硒化铜锌锡硒和硫硒混合铜锌锡硫硒薄膜太阳能电池最高光电转换效率分别达到11%、11.6%和12.6%,这说明铜锌锡硫类薄膜太阳能电池在光伏领域具有很大应用前景。In search of cheap, green, and stable semiconductor absorber materials, copper-zinc-tin-sulfur quaternary semiconductor materials have attracted more and more attention from scientists around the world. Because the material contains abundant, low-cost, non-toxic elements, and its band gap is very close to the optimal band gap of the single-junction solar cell absorber layer, it has become one of the most promising photovoltaic absorber materials. After continuous efforts in recent years, the highest photoelectric conversion efficiencies of pure copper zinc tin sulfur, pure copper zinc tin selenide and sulfur selenium mixed copper zinc tin sulfur selenium thin film solar cells have reached 11%, 11.6% and 12.6%, respectively, which shows that copper zinc tin sulfur thin film solar cells have great application prospects in the photovoltaic field.
目前,铜锌锡硫体系主要的问题是开路电压很低,这与结构紊乱密切有关,而结构紊乱表现为带尾和深陷阱态。其中铜锌反位受主缺陷是导致带尾缺陷的主要因素,而锡元素无序在带隙产生深能级缺陷。这些缺陷制约铜锌锡硫太阳能电池器件的性能,但是它们对开路电压的影响程度知之甚少。在预制层薄膜中引入钠、钾、银、锑、镉、锗等掺杂剂,后硫化或硒化退火有助于铜锌锡硫薄膜结晶,降低金属元素无序化,有利于进一步提升电池转换效率。At present, the main problem of the CuZnSnS system is the very low open circuit voltage, which is closely related to the structural disorder, which manifests as band tails and deep trap states. Among them, the copper-zinc antisite acceptor defect is the main factor leading to the band-tail defect, and the disorder of the tin element produces deep-level defects in the band gap. These defects constrain the performance of CuZnSnS solar cell devices, but the extent to which they affect the open circuit voltage is poorly understood. Dopants such as sodium, potassium, silver, antimony, cadmium, and germanium are introduced into the prefabricated film, and post-sulfurization or selenization annealing helps the crystallization of the copper-zinc-tin-sulfur film, reduces the disorder of metal elements, and is conducive to further improving the battery conversion efficiency.
与其他制备方法相比,电化学沉积技术理论完善,技术较为成熟,是一种适宜于金属薄膜材料制备的工业化大规模生产技术。实现电共沉积多元素薄膜,其元素之间标准电位差需要在0.2 V以内。然而,铜、锌、锡和硫四种元素的标准电位差较大,尤其是锌和铜的标准电位,分别为-0.76 V和+0.342 V,所以共沉积铜锌锡硫薄膜存在技术难题。因此,相对其他工艺而言,电化学沉积掺杂铜锌锡硫薄膜存在技术难题。为了提升铜锌锡硫太阳能电池的转换效率,如何对电化学沉积铜锌锡硫薄膜太阳能电池吸收层进行微量元素掺杂。到目前为止,尚未有关于电化学沉积铜锌锡硫薄膜掺杂相关文献报道。Compared with other preparation methods, the theory of electrochemical deposition technology is perfect, the technology is more mature, and it is an industrialized large-scale production technology suitable for the preparation of metal thin film materials. To achieve electrodeposited multi-element thin films, the standard potential difference between the elements needs to be within 0.2 V. However, the standard potential differences of the four elements of copper, zinc, tin, and sulfur are relatively large, especially the standard potentials of zinc and copper are -0.76 V and +0.342 V, respectively, so there are technical difficulties in co-depositing copper-zinc-tin-sulfur thin films. Therefore, compared with other processes, there are technical difficulties in the electrochemical deposition of copper-zinc-tin-sulfur thin films. In order to improve the conversion efficiency of copper-zinc-tin-sulfur solar cells, how to do trace element doping on the absorber layer of electrochemically deposited copper-zinc-tin-sulfur thin film solar cells. So far, there is no relevant literature report on the electrochemical deposition of CuZnSnS thin film doping.
发明内容Contents of the invention
本发明的目的是针对现有技术的不足而提供的一种锑掺杂电化学沉积铜锌锡硫太阳能电池吸收层制备方法,采用金属钼背电极上电化学沉积四元铜锌锡硫预制层的方法,将预制层与锑源粉末进行硫化退火,通过调控硫化退火过程中锑源的量,即可对铜锌锡硫薄膜中锑元素进行精准控制,获得锑掺杂电化学沉积铜锌锡硫薄膜太阳能电池吸收层材料,其光电性能得到了大幅度的提高,有效解决了电化学沉积铜锌锡硫薄膜太阳能吸收层掺杂的技术难题,制备工艺简单,重复性好,成本低廉,具有较好的研究与推广利用价值。The object of the present invention is to provide a method for preparing an antimony-doped electrochemical deposition copper-zinc-tin-sulfur solar cell absorbing layer for the deficiencies of the prior art. The method of electrochemically depositing a quaternary copper-zinc-tin-sulfur prefabricated layer on the metal molybdenum back electrode is used, and the prefabricated layer and the antimony source powder are subjected to sulfidation annealing. The technical problem of depositing copper-zinc-tin-sulfur thin film solar energy absorbing layer is difficult, the preparation process is simple, the repeatability is good, the cost is low, and it has good research and popularization and utilization value.
本发明的目的是这样实现的:一种锑掺杂电化学沉积铜锌锡硫太阳能电池吸收层制备方法,其特点是锑掺杂电化学沉积铜锌锡硫薄膜太阳能电池吸收层的制备具体包括以下步骤:The object of the present invention is achieved like this: a kind of antimony-doped electrochemical deposition copper-zinc-tin-sulfur solar cell absorption layer preparation method is characterized in that the preparation of antimony-doped electrochemical deposition copper-zinc-tin-sulfur thin-film solar cell absorption layer specifically comprises the following steps:
(一)铜锌锡硫预制层的制备(1) Preparation of copper-zinc-tin-sulfur prefabricated layer
将硫酸铜、硫酸锌、硫酸亚锡、硫代硫酸钠、柠檬酸钠和酒石酸钾等化学试剂按一定摩尔比混合后,溶解于去离子水溶液中,得到电化学沉积电镀溶液;以金属钼背电极为工作电极,银-氯化银为参比电极,铂片为对电极,采用三电极恒电位法共沉积四元铜锌锡硫预制层。Chemical reagents such as copper sulfate, zinc sulfate, stannous sulfate, sodium thiosulfate, sodium citrate and potassium tartrate are mixed in a certain molar ratio, and then dissolved in a deionized aqueous solution to obtain an electrochemical deposition plating solution; the metal molybdenum back electrode is used as the working electrode, the silver-silver chloride is used as the reference electrode, and the platinum sheet is used as the counter electrode.
(二)吸收层的制备(2) Preparation of the absorbing layer
将步骤(一)所得铜锌锡硫预制层置于含有锑源粉末的真空条件下进行硫化退火,得到锑掺杂铜锌锡硫薄膜太阳能电池材料,即锑掺杂铜锌锡硫吸收层薄膜。Putting the copper-zinc-tin-sulfur prefabricated layer obtained in step (1) under vacuum conditions containing antimony source powder for sulfidation annealing to obtain an antimony-doped copper-zinc-tin-sulfur thin film solar cell material, that is, an antimony-doped copper-zinc-tin-sulfur absorbing layer film.
所述金属钼背电极依次使用碱性溶液、丙酮、乙醇及去离子水超声清洗5~30分钟,然后用氮气吹干,放入真空干燥箱中备用。The metal molybdenum back electrode is ultrasonically cleaned with alkaline solution, acetone, ethanol and deionized water for 5 to 30 minutes in sequence, then blown dry with nitrogen, and placed in a vacuum oven for standby.
所述硫酸铜、硫酸锌、硫酸锡、硫代硫酸钠、柠檬酸钠和酒石酸钾的摩尔浓度比为1~5:2~50:1~3:1~20:10~100:5~40。The molar concentration ratio of the copper sulfate, zinc sulfate, tin sulfate, sodium thiosulfate, sodium citrate and potassium tartrate is 1-5:2-50:1-3:1-20:10-100:5-40.
所述沉积温度为25℃,沉积电位为-0.5~-1.5 V(vs. Ag/AgCl),沉积时间为5~60分钟。The deposition temperature is 25°C, the deposition potential is -0.5--1.5 V (vs. Ag/AgCl), and the deposition time is 5-60 minutes.
所述硫化退化具体为:先将电化学沉积铜锌锡硫预制层和一定量的锑源粉末放在石墨舟中,然后将石墨舟置于退火炉中,抽真空后通入惰性气体,设定硫化初始温度为20~25℃,以5~80℃/S升温速率加热退火炉,终止温度为450~650℃,保温10~60分钟,然后自然冷却至室温。The vulcanization degradation is specifically as follows: first place the electrochemically deposited copper-zinc-tin-sulfur prefabricated layer and a certain amount of antimony source powder in a graphite boat, then place the graphite boat in an annealing furnace, and then pass in an inert gas after vacuuming, set the initial temperature of vulcanization to 20-25°C, heat the annealing furnace at a heating rate of 5-80°C/S, end the temperature at 450-650°C, keep it warm for 10-60 minutes, and then naturally cool to room temperature.
所述锑掺杂铜锌锡硫吸收层薄膜厚度为0.5~3 μm。The film thickness of the antimony-doped copper-zinc-tin-sulfur absorbing layer is 0.5-3 μm.
本发明与现有技术相比具有对铜锌锡硫薄膜进行了有效掺杂,制备工艺简单,组分可控,薄膜结晶性好,大大提升了铜锌锡硫薄膜太阳能电池的光电性能,有效解决了电化学沉积铜锌锡硫薄膜太阳能吸收层掺杂的技术难题,重复性好,成本低廉,具有较好的研究与推广利用价值。Compared with the prior art, the present invention has the advantages of effective doping of copper-zinc-tin-sulfur thin film, simple preparation process, controllable components, and good film crystallinity, which greatly improves the photoelectric performance of copper-zinc-tin-sulfur thin film solar cells, effectively solves the technical problem of doping the solar absorbing layer of electrochemically deposited copper-zinc-tin-sulfur thin film, has good repeatability, low cost, and has good research, popularization and utilization value.
附图说明Description of drawings
图1为实施例1制备的电化学沉积铜锌锡硫预制层的SEM图;)Fig. 1 is the SEM figure of the electrochemically deposited copper-zinc-tin-sulfur prefabricated layer prepared in embodiment 1;)
图2为实施例1制备的锑掺杂电化学沉积铜锌锡硫薄膜的XRD图;Fig. 2 is the XRD pattern of the antimony-doped electrochemically deposited copper-zinc-tin-sulfur film prepared in embodiment 1;
图3为实施例1制备的锑掺杂电化学沉积铜锌锡硫薄膜的Raman图;Fig. 3 is the Raman diagram of the antimony-doped electrochemically deposited copper-zinc-tin-sulfur film prepared in embodiment 1;
图4为实施例1制备的锑掺杂电化学沉积铜锌锡硫薄膜的SEM图;Fig. 4 is the SEM figure of the antimony-doped electrochemically deposited copper-zinc-tin-sulfur film prepared in embodiment 1;
图5为实施例2制备的电化学沉积铜锌锡硫预制层的SEM图;Fig. 5 is the SEM picture of the electrochemically deposited copper-zinc-tin-sulfur prefabricated layer prepared by embodiment 2;
图6为实施例2制备的锑掺杂电化学沉积铜锌锡硫薄膜的XRD图;Fig. 6 is the XRD pattern of the antimony-doped electrochemically deposited copper-zinc-tin-sulfur film prepared in embodiment 2;
图7为实施例2制备的锑掺杂电化学沉积铜锌锡硫薄膜的Raman图;Fig. 7 is the Raman diagram of the antimony-doped electrochemically deposited copper-zinc-tin-sulfur film prepared in embodiment 2;
图8为实施例2制备的锑掺杂电化学沉积铜锌锡硫薄膜的SEM图;Fig. 8 is the SEM figure of the antimony-doped electrochemically deposited copper-zinc-tin-sulfur film prepared in embodiment 2;
图9为实施例2制备的锑掺杂电化学沉积铜锌锡太阳能电池的J-V图。FIG. 9 is a J-V diagram of the antimony-doped electrochemically deposited copper-zinc-tin solar cell prepared in Example 2. FIG.
具体实施方式Detailed ways
本发明实施例提供了一种锑掺杂电化学沉积铜锌锡硫薄膜太阳能电池吸收层的制备方法,用于解决现有的电化学沉积铜锌锡硫薄膜的掺杂难的技术难问题。为了更好的理解本发明,对本发明作进一步的详细说明,本发明的保护内容不仅仅局限于以下实施例。The embodiment of the present invention provides a method for preparing an antimony-doped electrochemically deposited copper-zinc-tin-sulfur thin film solar cell absorber layer, which is used to solve the existing technical problem of difficult doping of the electrochemically deposited copper-zinc-tin-sulfur thin film. In order to better understand the present invention, the present invention will be further described in detail, and the protection content of the present invention is not limited only to the following examples.
实施例1Example 1
1)将金属钼背电极依次使用碱性溶液、丙酮、乙醇及去离子水超声清洗10分钟后,然后用氮气吹干,在放入真空干燥箱中干燥备用。1) Clean the metal molybdenum back electrode sequentially with alkaline solution, acetone, ethanol and deionized water for 10 minutes, then blow dry with nitrogen, and put it in a vacuum drying oven for later use.
2)按摩尔比2:10:1:4:50:10称取硫酸铜、硫酸锌、硫酸锡、硫代硫酸钠、柠檬酸钠和酒石酸钾,依次溶解于200 ml去离子水溶剂中得到待镀电解液待用;以步骤1)中清洗过的金属钼背电极为工作电极,铂片为对电极,银-氯化银为参比电极,以-1.0 V恒电势沉积20分钟,电沉积溶液(电解液)的温度为25℃,得到铜锌锡硫预制层薄膜。2) Weigh copper sulfate, zinc sulfate, tin sulfate, sodium thiosulfate, sodium citrate, and potassium tartrate in a molar ratio of 2:10:1:4:50:10, and dissolve them in 200 ml of deionized water solvent in turn to obtain the electrolyte to be plated; use the metal molybdenum back electrode cleaned in step 1) as the working electrode, the platinum sheet as the counter electrode, and the silver-silver chloride as the reference electrode. At 25°C, a copper-zinc-tin-sulfur prefabricated film was obtained.
参阅附图1,采用扫描电子显微镜对上述制备的铜锌锡硫预制层薄膜进行表征,表明预制层表面光滑、表面致密、均匀纳米尺寸。Referring to accompanying drawing 1, scanning electron microscopy is used to characterize the copper-zinc-tin-sulfur prefabricated layer film prepared above, which shows that the surface of the prefabricated layer is smooth, dense and uniform in nanometer size.
3)将步骤2)电化学沉积铜锌锡硫预制层和0.2g硫化锑粉末放在石墨舟中,然后将石墨舟置于退火炉中,抽真空后通入高纯氮气,设定硫化初始温度为25℃,以50℃/S升温速率加热退火炉,终止温度为550℃,保温15分钟后系统自然冷却至室温,获得锑掺杂电化学沉积铜锌锡硫吸收层薄膜。3) Put step 2) the electrochemically deposited copper-zinc-tin-sulfur prefabricated layer and 0.2 g of antimony sulfide powder in a graphite boat, then place the graphite boat in an annealing furnace, pump high-purity nitrogen gas after vacuuming, set the initial temperature of vulcanization to 25°C, heat the annealing furnace at a heating rate of 50°C/S, and end the temperature at 550°C.
参阅附图2~图3,上述制备的铜锌锡硫吸收层薄采用XRD和拉曼光谱表征,可以看出在2q=18.21、28.53、32.98、47.33和56.18°处的峰分别对应于锌黄锡矿结构的铜锌锡硫[JCPDS 26-0575]的(101)、(112)、(200)、(220)和(312)晶面的衍射峰,未出现锑与锑相关化合物的XRD衍射峰和Raman光谱特征峰,表明所制备的薄膜为纯相铜锌锡硫,且锑元素已掺杂到电化学沉积铜锌锡硫薄膜中。Referring to Figures 2 to 3, the copper-zinc-tin-sulfur absorbing layer prepared above is characterized by XRD and Raman spectroscopy. It can be seen that the peaks at 2q=18.21, 28.53, 32.98, 47.33 and 56.18° correspond to (101), (112), (200), (220) and (312) of kesterite-structured copper-zinc-tin-sulfur [JCPDS 26-0575], respectively. The diffraction peaks of the crystal plane do not appear the XRD diffraction peaks and Raman spectrum characteristic peaks of antimony and antimony-related compounds, indicating that the prepared film is a pure-phase copper-zinc-tin-sulfur film, and the antimony element has been doped into the electrochemically deposited copper-zinc-tin-sulfur film.
参阅附图4,采用扫描电子显微镜对上述制备的铜锌锡硫吸收层薄膜进行表征,表明制备得到的锑掺杂铜锌锡硫吸收层薄膜表面光滑、表面致密、晶界较少和结晶性好。Referring to accompanying drawing 4, scanning electron microscopy was used to characterize the above-prepared copper-zinc-tin-sulfur absorbing layer film, which showed that the prepared antimony-doped copper-zinc-tin-sulfur absorbing layer film had a smooth surface, compact surface, fewer grain boundaries and good crystallinity.
实施例2Example 2
1)将金属钼背电极依次使用碱性溶液、丙酮、乙醇及去离子水超声清洗10分钟后,然后用氮气吹干,在放入真空干燥箱中干燥备用。1) Clean the metal molybdenum back electrode sequentially with alkaline solution, acetone, ethanol and deionized water for 10 minutes, then blow dry with nitrogen, and put it in a vacuum drying oven for later use.
2)按摩尔比1:20:1:4:50:10称取硫酸铜、硫酸锌、硫酸锡、柠檬酸钠、硫代硫酸钠和酒石酸钾,依次溶解于200 ml去离子水溶剂中得到待镀电解液;以步骤1)中清洗过的金属钼背电极为工作电极,铂片为对电极,银-氯化银为参比电极,以-1.15 V恒电势沉积20分钟,电沉积溶液(电解液)的温度为25℃,得到铜锌锡硫预制层薄膜。2) Weigh copper sulfate, zinc sulfate, tin sulfate, sodium citrate, sodium thiosulfate and potassium tartrate in a molar ratio of 1:20:1:4:50:10, and dissolve them in 200 ml deionized water solvent in turn to obtain the electrolyte to be plated; the metal molybdenum back electrode cleaned in step 1) is used as the working electrode, the platinum sheet is used as the counter electrode, and the silver-silver chloride is used as the reference electrode. At 25°C, a copper-zinc-tin-sulfur prefabricated film was obtained.
参阅附图5,采用扫描电子显微镜对上述制备的铜锌锡硫预制层薄膜进行表征,表明预制层表面光滑、表面致密、均匀纳米尺寸。Referring to Figure 5, scanning electron microscopy was used to characterize the copper-zinc-tin-sulfur prefabricated layer film prepared above, showing that the surface of the prefabricated layer is smooth, dense and uniform in nanometer size.
3)将步骤2)中制备的电化学沉积铜锌锡硫预制层和0.5 g硫化锑粉末放在石墨舟中,然后将石墨舟置于退火炉中,抽真空后通入高纯氩气,设定硫化温度初温为25℃,以50℃/S升温速率加热退火炉,终止温度为550℃,保温15分钟后系统自然冷却至室温,制得锑掺杂电化学沉积铜锌锡硫薄膜。3) Put the electrochemically deposited copper-zinc-tin-sulfur prefabricated layer prepared in step 2) and 0.5 g of antimony sulfide powder in a graphite boat, then place the graphite boat in an annealing furnace, pump it into a high-purity argon gas, set the initial temperature of the vulcanization temperature to 25°C, heat the annealing furnace at a heating rate of 50°C/S, and set the termination temperature to 550°C.
参阅附图6~图7,上述制备的铜锌锡硫吸收层薄采用XRD和拉曼光谱表征,可以看出在2q=18.21、28.53、32.98、47.33和56.18°处的峰分别对应于锌黄锡矿结构的铜锌锡硫[JCPDS 26-0575]的(101)、(112)、(200)、(220)和(312)晶面的衍射峰,未出现锑与锑相关化合物的XRD衍射峰和拉曼光谱特征峰,表明所制备的薄膜为纯相铜锌锡硫,且锑元素已掺杂到电化学沉积铜锌锡硫薄膜中。Referring to accompanying drawings 6 to 7, the copper-zinc-tin-sulfur absorbing layer prepared above is characterized by XRD and Raman spectroscopy. It can be seen that the peaks at 2q=18.21, 28.53, 32.98, 47.33 and 56.18° correspond to (101), (112), (200), (220) and (312) of kesterite-structured copper-zinc-tin-sulfur [JCPDS 26-0575], respectively. The diffraction peaks of the crystal plane did not appear the XRD diffraction peaks and Raman spectrum characteristic peaks of antimony and antimony-related compounds, indicating that the prepared film was a pure-phase copper-zinc-tin-sulfur film, and antimony elements had been doped into the electrochemically deposited copper-zinc-tin-sulfur film.
参阅附图8,采用扫描电子显微镜对上述制备的铜锌锡硫吸收层薄膜进行表征,表明制备得到的锑掺杂铜锌锡硫吸收层薄膜表面光滑、表面致密、晶界较少和结晶性好。Referring to accompanying drawing 8, scanning electron microscopy was used to characterize the copper-zinc-tin-sulfur absorbing layer film prepared above, which showed that the prepared antimony-doped copper-zinc-tin-sulfur absorbing layer film had smooth surface, compact surface, few grain boundaries and good crystallinity.
本发明在其他实施例中,分别按1.0g、1.5g、2.0g或2.5g硫化锑粉末放在石墨舟中,其他操作与本实施例2相同,得到的样品锑掺杂铜锌锡硫吸收层薄膜与本实施例2的产物相同。In other embodiments of the present invention, 1.0g, 1.5g, 2.0g or 2.5g of antimony sulfide powder is placed in the graphite boat respectively, and other operations are the same as in Example 2, and the obtained sample antimony-doped copper-zinc-tin-sulfur absorbing layer film is identical to the product of Example 2.
从上述实施例1~2可见,0.5g硫化锑粉末放在石墨舟中生长的铜锌锡硫薄膜的XRD半高宽小,其结晶度较高,该铜锌锡硫薄膜的SEM形貌非常致密,进一步制得的铜锌锡硫薄膜太阳能电池具更高效率。0.2g硫化锑粉末放在石墨舟中生长的铜锌锡硫薄膜的XRD半高宽较大,铜锌锡硫薄膜的晶粒尺寸相对较小。It can be seen from the above-mentioned Examples 1-2 that the XRD FWHM of the copper-zinc-tin-sulfur thin film grown in a graphite boat with 0.5 g of antimony sulfide powder is small, and its crystallinity is relatively high. The XRD half-maximum width of copper-zinc-tin-sulfur thin films grown with 0.2g antimony sulfide powder in graphite boats is relatively large, and the grain size of copper-zinc-tin-sulfur thin films is relatively small.
参阅附图9,实施例2制备的锑掺杂铜锌锡硫薄膜太阳能电池和未掺杂铜锌锡硫薄膜太阳能电池的J-V曲线对比图表明:锑掺入电化学沉积铜锌锡硫吸收层中显著地提高了铜锌锡硫薄膜太阳能电池的电学性能,电流密度从19.65mA/cm2增加到21.34mA/cm2,开路电压从0.6723 V增加到0.710 V,填充因子从61.7%增加到64.3%,转换效率从8.15%增加到9.76%。Referring to accompanying drawing 9, the comparison chart of the JV curves of the antimony-doped copper-zinc-tin-sulfur thin-film solar cell and the undoped copper-zinc-tin-sulfur thin-film solar cell prepared in Example 2 shows that the incorporation of antimony into the electrochemically deposited copper-zinc-tin-sulfur absorber layer significantly improves the electrical properties of the copper-zinc-tin-sulfur thin-film solar cell, the current density increases from 19.65mA/ cm2 to 21.34mA/ cm2 , the open circuit voltage increases from 0.6723 V to 0.710 V, and the fill factor increases from 61.7% increased to 64.3%, and the conversion efficiency increased from 8.15% to 9.76%.
本发明通过调节锑源粉末的含量,可以对锑掺杂电化学沉积铜锌锡硫的成分进行精确控制,进而得到了结晶质量高,形貌好,锑掺杂电化学沉积铜锌锡硫硒薄膜和转换效率接近10%的太阳能电池器件。以上所述仅是本发明的优选实施方式,应当指出:对任何熟悉本领域的技术人员来说,在不脱离本发明技术方案范围情况下,还可以本发明技术做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。By adjusting the content of the antimony source powder, the present invention can precisely control the composition of antimony-doped electrochemically deposited copper-zinc-tin-sulfur, thereby obtaining a solar cell device with high crystal quality and good morphology, antimony-doped electrochemically deposited copper-zinc-tin-sulfur-selenide thin film and a conversion efficiency close to 10%. The above is only a preferred embodiment of the present invention, and it should be pointed out that for anyone skilled in the art, without departing from the scope of the technical solution of the present invention, some improvements and modifications can also be made by the technology of the present invention, and these improvements and modifications should also be considered as protection scope of the present invention.
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CN108257852A (en) * | 2018-01-16 | 2018-07-06 | 北京工业大学 | A kind of preparation method of Ag doping absorbing layer of copper-zinc-tin-sulfur film solar cell |
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---|
电沉积制备太阳能电池吸收层铜锌锡硫薄膜;杨雪莹;李丽波;徐妍;高冠雄;裴蕾;;电镀与环保(第04期);全文 * |
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