Detailed Description
For the purposes, technical solutions and advantages of the embodiments of the present application to be more apparent, the specific technical solutions of the present application will be described in further detail below with reference to the accompanying drawings in the embodiments of the present application. The following examples are illustrative of the present application, but are not intended to limit the scope of the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of the present application only and is not intended to be limiting of the present application.
In the following description, reference is made to "some embodiments" which describe a subset of all possible embodiments, but it is to be understood that "some embodiments" can be the same subset or different subsets of all possible embodiments and can be combined with one another without conflict.
It should be noted that the term "first\second\third" in relation to the embodiments of the present application is merely to distinguish similar or different objects and does not represent a specific ordering for the objects, it being understood that the "first\second\third" may be interchanged in a specific order or sequence, where allowed, to enable the embodiments of the present application described herein to be practiced in an order other than that illustrated or described herein.
An embodiment of the present application provides a radio frequency front end, fig. 1 is a schematic structural diagram of the radio frequency front end in the embodiment of the present application, and as shown in fig. 1, the radio frequency front end 1 at least includes: a first power amplifier module 10, the module 10 comprising: a first DCDC converter 101, a switch module 102 and at least two PA modules, PA module 103 and PA module 104 are shown in the figure; wherein,,
the switch module 102 is connected between the first DCDC converter 101 and the at least two PA modules, and is configured to turn on a power supply circuit between the first DCDC converter 101 and any PA module of the at least two PA modules according to a control signal;
a first DCDC converter 101, configured to supply power to the any PA module through the power supply circuit, so as to support the operation of the any PA module;
the at least two PA modules do not work under any EN-DC combination at the same time and are used for amplifying power of the corresponding input radio frequency signals during work.
In some embodiments, as shown in table 1 below, any of the EN-DC combinations include, but are not limited to: a first EN-DC combination of MB/HB supporting MB and NR of LTE, a second EN-DC combination of LB and NR of LTE, a third EN-DC combination of LB and NR of SUB 6G supporting LTE, a fourth EN-DC combination of MB/HB and NR of SUB 6G supporting LTE, and a fifth EN-DC combination of LB of MB/HB and NR of LTE.
TABLE 1
First EN-DC combination
|
MB+MB/HB
|
Second EN-DC combination
|
LB+LB
|
Third EN-DC combination
|
LB+SUB 6G
|
Fourth EN-DC combination
|
MB/HB+SUB 6G
|
Fifth EN-DC combination
|
MB/HB+LB |
In the embodiment of the application, the provided radio frequency front end at least comprises a first power amplification module, wherein at least two PA modules in the first power amplification module do not work under any EN-DC combination at the same time and share one DCDC converter; therefore, each PA module is not required to be correspondingly connected with one DCDC converter, but two PA modules and even more PA modules share one DCDC converter, so that the occupied area of the DCDC converter at the radio frequency front end is saved and the product cost of the radio frequency front end is reduced on the premise of not affecting the communication performance.
It should be noted that, in the present application, the first power amplifier module refers to a module in which at least two PA modules can share one DCDC converter, which is different from the second, third, and fourth power amplifier modules. In the present application, the first DCDC converter to the fourth DCDC converter may be the same type of converter, or may be different types of converters, which is not limited in this application.
In this embodiment of the present application, the radio frequency front end may be a radio frequency front end of a terminal device in a wireless communication system, or may be a radio frequency front end in a network device in a wireless communication system. The terminal device may be a handheld device, an in-vehicle device, a wearable device, a computing device, or other processing device connected to a wireless modem, as well as various forms of user terminal devices or mobile stations, among other things, having wireless communication capabilities. The user terminal device may be, for example, a mobile phone, a telephone watch, or a tablet computer.
The network device according to the embodiment of the present application is a device deployed in a radio access network to provide a wireless communication function for a terminal device. In the embodiment of the application, the network device may be a base station device, and the base station device may include various macro base stations, micro base stations, relay stations, access points, and the like.
In another embodiment, fig. 2 is a schematic structural diagram of the rf front end according to the embodiment of the present application, as shown in fig. 2, the rf front end 2 may include: a first power amplifier module 20, a controller 21 and an antenna 22; the radio frequency front end 2 further comprises a second power amplifier module 23 and/or a third power amplifier module 24; the first power amplifier module 20 includes a first DCDC converter 201, a switch module 202, and at least two PA modules;
the controller 21 is configured to generate a control signal according to a target EN-DC combination where the rf front end 2 is currently located, so as to trigger the switch module 202 to turn on a power supply circuit between the first DCDC converter 201 and the PA module operating under the target EN-DC combination according to the control signal.
In practical applications, the controller 21 may determine, according to the network configuration, the target EN-DC combination where the radio frequency front end 2 is currently located, that is, the LTE band and the NR band where the current communication is located.
The switch module 202 is connected between the first DCDC converter 201 and the at least two PA modules, and is configured to turn on a power supply circuit between the first DCDC converter 201 and any PA module of the at least two PA modules according to the control signal;
a first DCDC converter 201, configured to supply power to the any PA module through the power supply circuit, so as to support the operation of the any PA module;
the at least two PA modules at least comprise two of the following: a first PA module 203, a second PA module 204, a third PA module 205, which do not operate in any EN-DC combination at the same time; wherein,,
the first PA module 203, configured to perform power amplification on a radio frequency signal of an MB belonging to LTE or NR, where the first PA module is operated under the first EN-DC combination;
a second PA module 204, configured to perform power amplification on a radio frequency signal of the LB belonging to LTE or NR, where the second PA module operates under the second EN-DC combination;
the third PA module 205 operates under the third EN-DC combination or the fourth EN-DC combination to power amplify the rf signal belonging to NR SUB 6G.
As shown in fig. 2, the second power amplifier module 23 includes a second DCDC converter 231 and a fourth PA module 232, where the second DCDC converter 231 is connected to the fourth PA module 232 and is used to supply power to the fourth PA module 232, so that the fourth PA module 232 performs power amplification on the radio frequency signal of MB/HB belonging to LTE or NR when operating under the first EN-DC combination, the fourth EN-DC combination, or the fifth EN-DC combination;
the third power amplifier module 24 includes a third DCDC converter 241 and a fifth PA module 242; the third DCDC converter 241 is configured to supply power to the fifth PA module 242, so that the fifth PA module 242 performs power amplification on a radio frequency signal of the LB belonging to LTE or NR when the fifth PA module 242 operates under the second EN-DC combination, the third EN-DC combination, or the fifth EN-DC combination.
As shown in fig. 2, each PA module is connected to an antenna 22, and the antenna 22 is configured to transmit a radio frequency signal output by the corresponding PA module.
Because the current DCDC converter can not supply power to a plurality of PA modules at the same time, only one path of PA module can be supplied with power at the same time. As shown in table 2 below, which illustrates the power supply network under various EN-DC scenarios. The inventors found in the course of studying the power supply network that: the first PA module, the second PA module, and the third PA module, and any two of the three PA modules, do not operate simultaneously at any one of the following EN-DC combinations.
TABLE 2
Therefore, even if the three PA modules or any two modules share one DCDC converter, the communication performance in the EN-DC scene is not affected, and the occupied area and the hardware cost of the DCDC converter are reduced. In practical application, the controller can control the DCDC converter to supply power to one path of the PA module according to the current EN-DC scene requirement.
In analyzing the power network shown in table 2 above, the inventors also found that: the second PA module and the fourth PA module do not operate simultaneously at any of the aforementioned EN-DC combinations, nor do the first PA module and the fifth PA module operate simultaneously at any of the aforementioned EN-DC combinations. Based on the research result, the embodiment of the present application further provides a rf front end, and fig. 3 is a schematic structural diagram of the rf front end of the embodiment of the present application, as shown in fig. 3, where the rf front end 3 may include: the first power amplifier module 30, the first power amplifier module 31 and the controller 32; the first power amplifier module 30 includes: a first DCDC converter 301, a switch module 302, a second PA module 303, and a fourth PA module 304;
the controller 32 is configured to generate a first control signal according to a target EN-DC combination where the radio frequency front end 3 is currently located, so as to trigger the switch module 302 to conduct a power supply circuit between the first DC-DC converter 301 and the PA module working under the target EN-DC combination according to the first control signal;
the switch module 302 is connected between the first DCDC converter 301 and any one of the second PA module 303 and the fourth PA module 304, and is configured to conduct a power supply circuit between the first DCDC converter 301 and any one of the second PA module 303 and the fourth PA module 304 according to the first control signal;
the first DCDC converter 301 is configured to supply power to the any PA module through the power supply circuit, so as to support the operation of the any PA module;
a second PA module 303, configured to perform power amplification on a radio frequency signal of the LB belonging to LTE or NR, where the second PA module is operated under the second EN-DC combination;
the fourth PA module 304, working under the first EN-DC combination, the fourth EN-DC combination, or the fifth EN-DC combination, is configured to power amplify a radio frequency signal belonging to MB/HB of LTE or NR.
As shown in fig. 3, the first power amplifier module 31 includes: a first DCDC converter 311, a switch module 312, a first PA module 313 and a fifth PA module 314; wherein,,
the controller 32 is further configured to generate a second control signal according to a target EN-DC combination where the radio frequency front end 3 is currently located, so as to trigger the switch module 312 to conduct a power supply circuit between the first DC-DC converter 311 and the PA module operating under the target EN-DC combination according to the second control signal;
the switch module 312 is connected between the first DCDC converter 311 and the first PA module 313 and the fifth PA module 314, and is configured to turn on a power supply circuit between the first DCDC converter 311 and any one of the first PA module 313 and the fifth PA module 314 according to the second control signal;
the first DCDC converter 311 is configured to supply power to the any PA module through the power supply circuit, so as to support the operation of the any PA module;
the first PA module 313, configured to operate under the first EN-DC combination, and perform power amplification on a radio frequency signal of an MB belonging to LTE or NR;
a fifth PA module 314, operating under the second EN-DC combination, the third EN-DC combination, or the fifth EN-DC combination, is configured to power amplify a radio frequency signal of the LB belonging to LTE or NR.
In some embodiments, as shown in fig. 3, the rf front end 3 further includes a fourth power amplifier module 33, where the module 33 includes a third PA module 331 and a fourth DCDC converter 332, and the converter 332 is connected to the third PA module 331 and is configured to supply power to the third PA module, so that the third PA module performs power amplification on the rf signal belonging to the SUB 6G of the NR when the third PA module operates under the third EN-DC combination or the fourth EN-DC combination.
In some embodiments, as shown in fig. 3, the rf front end 3 further includes an antenna 34, where each PA module is connected to an antenna 34, and the antenna 34 is configured to transmit the rf signal output by the corresponding PA module.
In the application scenario of mobile bandwidth enhancement (Enhanced Mobile Broadband, eMBB) of the fifth Generation mobile communication technology (5 th-Generation, 5G), the geometrically increased mass data requirement places unprecedented demands on the data communication capability of the personal mobile terminal. The two deployment schemes of the 5G Non-independent Networking (NSA) and independent networking (SA) are both key schemes in terms of improving the communication rate, for example, 1T4R (1-way transmitting 4-way receiving) under NSA and 2T4R (2-way transmitting 4-way receiving) under SA are both used for improving the communication rate, especially the downlink communication rate. This is because personal big data applications (such as short video and video movies) require higher downstream rates.
Because the coverage area of the current 5G base station is small, the same area of LTE is covered, the number of the required 5G base stations is more than 3 times of that of the current 5G base station, and the networking cost is suddenly increased. However, because of uneven economic development in the global area and different 4G to 5G evolution strategies in various countries, the EN-DC scheme in the global area will become an important 5G coverage scheme for a quite long time, i.e. the EN-DC scheme is adopted to ensure the signal continuity in the case of unstable 5G signals or uncovered areas.
EN-DC is a 4G and 5G dual connection, and there are multiple frequency bands for LTE and multiple frequency bands for 5G in the global world at present, so any combination of the two can generate multiple EN-DC schemes. For example, LB and LB, LB and MB, LB and HB, MB and HB, LB and SUB-6G, MB and SUB-6G, HB and SUB-6G.
To support the above EN-DC scheme, the radio frequency front end of the mobile phone needs to include two Power Amplifiers (PA) for supporting LB, namely LB PA (i.e. the fifth PA module), one PA for supporting MHB, namely MHB PA (i.e. the fourth PA module), one PA for supporting HB, namely HB PA, and one PA for supporting SUB-6G, namely SUB-6G PA (i.e. the third PA module).
Considering the cost comprehensively, a PA supporting B1/B3 is generally designed in the mobile phone to be used as one path of MB PA, and a B20 PA (i.e. the second PA module) is used as another path of LB PA.
Because any two scenes of simultaneous working exist in the above PAs, the DCDC power supply of the related mobile phone scheme can only supply power to one path of the PAs, and therefore, each path of power supply needs to be independently used. For example, the rf front end 40 shown in fig. 4 includes: 5 DCDC converters (i.e., DCDC1 to DCDC 5), 5 antennas ANT (i.e., ANT1 to ANT 5), MHB PAMID connected to DCDC1 (i.e., the fourth PA module), LB PAMID connected to DCDC2 (i.e., the fifth PA module), B1/B3 PA connected to DCDC3 (i.e., the first PA module), and B20 PA connected to DCDC4 (i.e., the second PA module), SUB 6G PA connected to DCDC5 (i.e., the third PA module); the DCDC converter is used for supplying power to the corresponding PA module, and the ANT is used for sending radio frequency signals output by the corresponding PA module. As can be seen from fig. 4, in the rf front end 40, 5 PAs require 5 independent DCDCs.
However, 5 DCDCs result in significant increases in cost and footprint of the handset, each DCDC currently costs about $ 0.4 (USA dolar, USD), and 5 DCDCs are expected to be 2.0USD.
Based on this, an exemplary application of the embodiments of the present application in one practical application scenario will be described below.
For example, as shown in table 3 below, LB PA supports LB, DCDC2 powers LB PA; the SUB-6G PA supports SUB-6G, and the DCD 5 supplies power for the SUB-6G PA; the MHB PA supports MB/HB, and DCDC1 supplies power for the MHB PA; the B1/B3 PA supports MB, and the DCDC3 supplies power for the B1/B3 PA; b20 PA supports LB and DCDC4 supplies B20 PA.
It should be noted that the DCDC1 to DCDC5 converters described in the embodiments of the present application may be the same type of converter, or may be different types of converters, which is not limited.
TABLE 3 Table 3
As shown in the table above, under each set of EN-DC combinations, the two situations of DCDC3, DCDC4 and DCDC5 will not occur, so the radio frequency front end 50 shown in fig. 5 may be adopted, that is, one DCDC is used to connect the power supply ends of B1/B3 PA, B20 PA and SUG 6G PA simultaneously through the switch module, in practice, the switch module may be controlled to conduct DCDC2 and the power supply circuit of one PA according to the situation requirement, so as to supply power to the PA.
As shown in fig. 5, three DCDC power supplies are reasonably distributed, the same effect of the original 5 DCDC power supplies is achieved, the frequency band combination requirements of various EN-DC scenes are met, and the beneficial effects of 40% reduction in circuit cost and circuit area are achieved. For example, the cost of a single 5G terminal is reduced by 0.8USD.
In the research process, the inventor analyzes the power supply network under various EN-DC combined scenes, and discovers that two or more PA modules cannot work under any EN-DC combined scene at the same time. Based on this, in the embodiment of the present application, it is proposed to solve the support of more EN-DC combining capability with lower cost by means of external power integration, i.e. two or more PA modules share one DCDC.
It should be noted that, the combination of MB PA (B1/B3) and LB PA into a PA supporting both LB and MB can also reduce the number of DCDC in the RF front end, thereby reducing the hardware cost of the RF front end and saving the occupation area of DCDC.
Based on the foregoing embodiments, an embodiment of the present application provides a chip, where the chip includes the radio frequency front end described in any one of the foregoing embodiments.
Based on the foregoing embodiments, the embodiments of the present application further provide a wireless communication device, which may include the radio frequency front end described in any of the foregoing embodiments.
The description of the chip embodiment and the wireless communication device embodiment above is similar to the description of the radio frequency front end embodiment above, with similar benefits as the radio frequency front end embodiment. For technical details not disclosed in the chip embodiments and the wireless communication device embodiments of the present application, please refer to the description of the rf front-end embodiments of the present application for understanding.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" or "some embodiments" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" or "in some embodiments" in various places throughout this specification are not necessarily referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. It should be understood that, in various embodiments of the present application, the sequence numbers of the foregoing processes do not mean the order of execution, and the order of execution of the processes should be determined by the functions and internal logic thereof, and should not constitute any limitation on the implementation process of the embodiments of the present application. The foregoing embodiment numbers of the present application are merely for describing, and do not represent advantages or disadvantages of the embodiments.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a radio frequency front end, chip, or wireless communication device that comprises a list of elements includes not only those elements but also other elements not expressly listed or inherent to such radio frequency front end, chip, or wireless communication device. Without further limitation, the element defined by the phrase "comprising one … …" does not exclude that there are further elements in a radio frequency front end, a chip or a wireless communication device comprising the element.
In the several embodiments provided in the present application, it should be understood that the disclosed rf front end may be implemented in other manners. The radio frequency front end embodiments described above are merely illustrative and the various components shown or discussed as being coupled to each other, or directly coupled to each other, or communicatively coupled to each other may be indirectly coupled to each other via some interface, device or module, whether electrically, mechanically, or otherwise.
The methods disclosed in several embodiments of the rf front-end provided in the present application may be arbitrarily combined without collision to obtain a new embodiment of the rf front-end.
The features disclosed in the several product embodiments provided in the present application may be combined arbitrarily without conflict to obtain new product embodiments.
The features disclosed in several radio frequency front-end or device embodiments provided in the present application may be combined arbitrarily without conflict to obtain a new radio frequency front-end embodiment or device embodiment.
The foregoing is merely an embodiment of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are intended to be covered in the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.