[ Detailed description ] of the invention
The following embodiments of the invention are described in terms of the extended electronic device and electronic system, and those skilled in the art will appreciate the advantages and effects of the invention from the disclosure herein. The invention is capable of other and different embodiments and its several details are capable of modification and variation in various respects, all from the point of view and application, all without departing from the spirit of the present invention. The drawings of the present invention are merely schematic illustrations, and are not intended to be drawn to actual dimensions. The following embodiments will further illustrate the related art content of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.
It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used primarily to distinguish one element from another element. In addition, the term "or" as used herein shall include any one or combination of more of the associated listed items as the case may be.
Fig. 1 to fig. 4 are schematic perspective views of an electronic system, an exploded schematic view of the electronic system, a schematic perspective view of an extended electronic device, and an exploded schematic view of the extended electronic device according to a first embodiment of the present invention. As shown in the figure, the first embodiment of the present invention provides an expansion electronic device D, which can be adapted to be integrated with a main electronic device E and cooperate with the main electronic device E, and the expansion electronic device D can include a housing 1 and a plurality of functional modules 2, 2a. The top side of the housing 1 may have a mounting surface 10, and the bottom side may have a plurality of independent accommodating cavities 11, 11a, wherein the mounting surface 10 is used for combining the main electronic device E, and a first waterproof space S1 is formed between the mounting surface 10 and the main electronic device E through structural interference. The plurality of functional modules 2, 2a are respectively disposed in the plurality of accommodating chambers 11 for being individually installed or removed, and a second waterproof space S2 is formed between one of the accommodating chambers 11a and a corresponding one of the functional modules 2a through structural interference.
Specifically, the extended electronic device D of the present invention is detachably combined with the main electronic device E and electrically connected with the main electronic device E, so as to form an electronic system with perfect functionality and waterproof property, wherein the main electronic device E can be a notebook computer. The housing 1 has an assembly face 10 for coupling with the main electronics E, and a plurality of receiving cavities 11, 11a for receiving a plurality of functional modules 2, 2a. Further, as shown in fig. 4, each of the accommodating cavities 11, 11a of the housing 1 can be used for accommodating one of the functional modules 2, 2a, wherein in the present embodiment, the plurality of functional modules 2, 2a can be a display card module, an optical disk drive module, and at least one battery module, but not limited thereto. Each functional module 2, 2a can be independently mounted in the corresponding housing cavity 11, 11a, and can be independently detached from the housing cavity 11, 11a (or detached from the housing cavity 11, 11 a), respectively. Therefore, when a user needs to replace a new functional module or repair a certain functional module, the whole housing 1 is not required to be detached and separated from the main electronic device E, and the effects of quick repair and quick replacement can be achieved only by detaching and installing specific functional modules.
As shown in fig. 2 and 3, the assembly surface 10 of the housing 1 is detachably engaged with the bottom of the main electronic device E, and the assembly surface 10 and the bottom of the main electronic device E interfere with each other by a structure, so that a space between the assembly surface 10 and the bottom of the main electronic device E forms a first waterproof space S1. Therefore, after the electronic expansion device D is connected to the main electronic device E, foreign objects (such as dust particles, beverages, etc.) cannot enter the first waterproof space S1 through the seam between the electronic expansion device D and the main electronic device E.
Next, referring to fig. 4, the extended electronic device D of the present invention may further have a second waterproof space S2, where the second waterproof space S2 is formed by structural interference between one of the functional modules 2a and the corresponding accommodating cavity 11 a. That is, after the functional module 2a is mounted in the corresponding accommodating cavity 11a, the functional module 2a is isolated from the outside through the structural interference with the corresponding accommodating cavity 11a, so as to prevent foreign matters (such as dust particles, beverage, etc.) from entering the second waterproof space S2 through the joint between the functional module 2a and the corresponding accommodating cavity 11a when other functional modules 2 are dismounted.
However, the above examples are only one possible embodiment and are not intended to limit the present invention.
Fig. 5 and fig. 6 are schematic perspective views of an extended electronic device and a main electronic device according to a second embodiment of the invention, and fig. 1 to fig. 4 are also referred to. As shown in the drawings, the expansion electronic device D of the present embodiment is substantially similar to the expansion electronic device D of the first embodiment, and will not be described herein. The difference between the present embodiment and the first embodiment is that, in the present embodiment, the assembly surface 10 has a central area 100 corresponding to the first waterproof space S1 and a peripheral area 101 surrounding the central area 100, and the peripheral area 101 is provided with a first interference structure 1010, and the bottom of the main electronic device E is provided with a second interference structure E1 for generating sealing interference with the first interference structure 1010. The first interference structure 1010 and the second interference structure E1 are a limiting channel and an elastic sealing element, respectively.
For example, as shown in fig. 5 and 6, the housing 1 of the present invention is sealed and interfered with the second interference structure E1 at the bottom of the main electronic device E by the first interference structure 1010 on the peripheral area 101 to close the space between the assembly surface 10 and the bottom of the main electronic device E, thereby forming a first waterproof space S1, and meanwhile, the first waterproof space S1 also corresponds to the central area 100 of the assembly surface 10. In the present embodiment, the first interference structure 1010 is taken as a limiting channel and the second interference structure E1 is taken as an elastic sealing element as examples, but not limited thereto.
However, the above examples are only one possible embodiment and are not intended to limit the present invention.
Fig. 7 is an exploded view of an extended electronic device according to a third embodiment of the present invention, and fig. 1 to 6 are also referred to. As shown in the drawings, the expansion electronic device D of the present embodiment is substantially similar to the expansion electronic device D of the previous embodiments, and will not be described herein. The difference between the present embodiment and the foregoing embodiments is that, in the present embodiment, a surrounding retaining wall 110 is disposed in one of the accommodating chambers 11a to define a second waterproof space S2, and the surrounding retaining wall 110 has a third interference structure 1100, and one of the functional modules 2a may include a base 20, and a fourth interference structure 200 is disposed at the bottom of the base 20 to generate sealing interference with the third interference structure 1100. The third interference structure 1100 and the fourth interference structure 200 are a limiting channel and an elastic sealing element, respectively.
For example, as shown in fig. 7, the housing 1 may have a surrounding retaining wall 110 on the other surface opposite to the assembly surface 10, and the surrounding retaining wall 110 defines a receiving cavity 11a, and the surrounding retaining wall 110 may further divide a portion of the receiving cavity 11a into a second waterproof space S2. Therefore, the expansion electronic device D of the present invention sealingly interferes with the fourth interference structure 200 of the base 20 through the third interference structure 1100 of the surrounding retaining wall 110 to enclose the space of the surrounding retaining wall 110 passing through a portion of the accommodating cavity 11a, thereby forming the second waterproof space S2. In the present embodiment, the third interference structure 1100 is taken as a limiting channel and the fourth interference structure 200 is taken as an elastic sealing element as an example, but not limited thereto.
Further, the surrounding wall 110 further defines a heat dissipation space 1101 in one of the accommodating cavities 11a, and one of the functional modules 2a further includes a heat dissipation fan 21, and the heat dissipation fan 21 is disposed in the heat dissipation space 1101. Furthermore, the surrounding retaining wall 110 has a heat dissipation channel 1102 between the heat dissipation space 1101 and the second waterproof space S2, wherein one of the functional modules 2a may further include a heat conducting member 22, and the heat conducting member 22 extends from the heat dissipation space 1101 to the second waterproof space S2 through the heat dissipation channel 1102.
For example, as shown in fig. 7, the surrounding retaining wall 110 on the housing 1 may further divide the accommodating cavity 11a of another portion into the heat dissipation space 1101, and a portion of the surrounding retaining wall 110 for separating the second waterproof space S2 from the heat dissipation space 1101 may be recessed toward the assembling surface 10 to form the heat dissipation channel 1102. Therefore, the heat dissipation portion 220 of the heat conduction member 22 can be connected to the heat dissipation fan 21 and located in the heat dissipation space 1101 together with the heat dissipation fan 21, and the heat absorption portion 221 of the heat conduction member 22 can be located in the second waterproof space S2, and the heat absorption portion 221 and the heat dissipation portion 220 of the heat conduction member 22 are connected through the heat dissipation passage 1102.
However, the above examples are only one possible embodiment and are not intended to limit the present invention.
Fig. 8 to 11 are schematic perspective views of a first view, a second view, an enlarged view of the IX portion of fig. 8, and a usage status of a connection port of a functional module of an electronic device according to a fourth embodiment of the present invention, and fig. 1 to 10 are also referred to. As shown in the drawings, the expansion electronic device D of the present embodiment is substantially similar to the expansion electronic device D of the previous embodiments, and will not be described herein. The difference between the present embodiment and the foregoing embodiments is that, in the present embodiment, the extended electronic device D may further include a circuit board 3, where the circuit board 3 is disposed in the second waterproof space S2 and electrically connected to the plurality of functional modules 2. The expansion electronic device D may further include an FPC connector 4 and a cable connector 5 for electrically connecting with the main electronic device E.
For example, as shown in fig. 8, the circuit board 3 of the present invention may be disposed in the second waterproof space S2, and the circuit board 3 may be electrically connected to the main electronic device E through the FPC connector 4 and the cable connector 5, that is, one end of the FPC connector 4 and one end of the cable connector 5 may be electrically connected to the circuit board 3, and the other end of the FPC connector 4 and the other end of the cable connector 5 may be electrically connected to the main electronic device E.
Further, the surrounding retaining wall 110 may have a sidewall 1103, and the sidewall 1103 may have a through hole 11030 communicating with the second waterproof space S2, the other functional module 2 is disposed in the other accommodating cavity 11 partitioned by the sidewall 1103, the other functional module 2 may have a connection port 23, the connection port 23 is disposed in the through hole 11030 to be electrically connected with the circuit board 3, and the connection port 23 and the through hole 11030 generate sealing interference. Wherein, a waterproof gasket W may be provided between the connection port 23 and the through hole 11030.
For example, as shown in fig. 8 to 11, a portion of the surrounding retaining wall 110 of the present invention may be a side wall 1103, the side wall 1103 may be used to block two adjacent cavities 11, 11a, and the side wall 1103 has a through hole 11030 communicating the two adjacent cavities 11, 11a, that is, the through hole 11030 can communicate the cavity 11 with the second waterproof space S2. In addition, the functional module 2 located in the accommodating cavity 11 is disposed through the through hole 11030 through the connection port 23 and is electrically connected to the circuit board 3, so as to be electrically connected to the circuit board 3. Moreover, in order to prevent foreign matters from entering the second waterproof space S2 through the through hole 11030 when the functional module 2 is replaced, the expansion electronic device D of the present invention is provided with a waterproof gasket W in the through hole 11030, and the connection port 23 and the inner wall of the sidewall 1103 corresponding to the through hole 11030 are pressed or contacted by the waterproof gasket W to block the space communication between the accommodating cavity 11 and the second waterproof space S2.
However, the above examples are only one possible embodiment and are not intended to limit the present invention.
It should be noted that, according to the above description, the present invention further provides an electronic system S, which includes a main electronic device E and the expansion electronic device D according to any of the above embodiments, and the expansion electronic device D is integrated with the main electronic device E and cooperates with the main electronic device E.
The invention has the beneficial effects that the electronic expansion device D and the electronic system S provided by the invention can comprise a shell 1 and a plurality of functional modules 2 and 2a through the electronic expansion device D. The top side of the housing 1 may have a mounting surface 10, and the bottom side may have a plurality of independent accommodating cavities 11, 11a, wherein the mounting surface 10 is used for combining the main electronic device E, and a first waterproof space S1 is formed between the mounting surface 10 and the main electronic device E through structural interference. The plurality of functional modules 2, 2a are respectively disposed in the plurality of accommodating chambers 11 for being individually installed or detached, and a second waterproof space S2″ is formed between one of the accommodating chambers 11a and a corresponding one of the functional modules 2a through structural interference, so as to improve the functionality of the notebook computer and increase the waterproof performance.
Furthermore, the extended electronic device D and the electronic system S according to the present invention provide the plurality of functional modules 2, 2a by forming the plurality of independent accommodating chambers 11, 11a on the housing 1, and enable each of the functional modules 2, 2a to be independently mounted on the housing 1 or be independently and directly dismounted from the housing 1, so that the entire housing 1 does not need to be dismounted from or separated from the main electronic device E when the specific functional module is dismounted, thereby improving the functionality of the main electronic device E. In addition, the extended electronic device D and the electronic system S of the present invention can further prevent external foreign matters (such as dust particles, beverages, etc.) from entering the extended electronic device D and the accommodating cavity 11a by the first waterproof space S1 formed by the interference of the assembly surface 10 of the housing 1 and the bottom structure of the main electronic device E and the second waterproof space S2 formed by the interference of one of the functional modules 2a and the corresponding accommodating cavity 11a, thereby increasing the waterproof and dustproof properties of the main electronic device E.
The above disclosure is only a preferred embodiment of the present invention and is not intended to limit the scope of the present invention, so that all equivalent technical changes made by the specification and drawings of the present invention are included in the scope of the present invention.