CN114167640A - Manufacturing method of color film substrate - Google Patents
Manufacturing method of color film substrate Download PDFInfo
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- CN114167640A CN114167640A CN202111406973.1A CN202111406973A CN114167640A CN 114167640 A CN114167640 A CN 114167640A CN 202111406973 A CN202111406973 A CN 202111406973A CN 114167640 A CN114167640 A CN 114167640A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
- G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
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Abstract
The application discloses a manufacturing method of a color film substrate, which comprises the following steps: providing a substrate; forming a plurality of transparent structures on the substrate and forming a color resistance layer on one side of the transparent structures far away from the substrate; the transparent structures are arranged at intervals and carry first charges, and the color resistance layer carries second charges opposite to the first charges in electrical property. The color resistance layer with the smaller line width can be obtained, and the color film substrate with the ultrahigh resolution can be manufactured conveniently, so that the requirement of the ultrahigh resolution display screen is met.
Description
Technical Field
The application relates to the technical field of display, in particular to a manufacturing method of a color film substrate.
Background
Currently, with the continuous improvement of the consumption experience, the display screen gradually develops towards the direction of high resolution, and various large manufacturers also strive to develop a display technology with higher resolution. Display resolution is required to be higher due to the increasing demand for 4K/8K video and VR/AR applications. Especially for VR (Virtual Reality)/AR (Augmented Reality) displays, ultra high resolution (2000 and even above 2000 PPI) displays are required.
At present, the OLED (Organic Light-Emitting Diode)/Mini LED Display technology is gradually developing a Display screen with more than 10000PPI, and LCD (Liquid Crystal Display) panels are also gradually laying high-resolution LCD displays in various large panel factories. In the LCD with ultra-high resolution, for AR/VR products with a size below 4 inches and a resolution requirement greater than 2000PPI, smaller line width, smaller pixel size and smaller RGB color resistance size (line width size) are required. However, since the photoresist material used for fabricating the color filter substrate is usually a negative photoresist system, the resolution is low, and it is difficult to make the RGB color resistance size meet the requirement of ultra-high resolution.
Disclosure of Invention
The application provides a manufacturing method of a color film substrate, which can obtain a color resistance layer with a smaller line width, and is beneficial to manufacturing the color film substrate with ultrahigh resolution, so as to meet the requirement of an ultrahigh resolution display screen.
The application provides a manufacturing method of a color film substrate, which comprises the following steps:
providing a substrate;
forming a plurality of transparent structures on the substrate and forming a color resistance layer on one side of the transparent structures far away from the substrate; the transparent structures are arranged at intervals and carry first charges, and the color resistance layer carries second charges opposite to the first charges in electrical property.
Optionally, the forming a plurality of transparent structures on the substrate includes:
forming a plurality of transparent structures which are arranged at intervals and are free of electric charge on the substrate; and
and carrying out chemical bonding treatment on the plurality of uncharged transparent structures so as to enable the plurality of transparent structures to be charged with a first charge.
Optionally, the forming a plurality of transparent structures on the substrate, the transparent structures being disposed at intervals and having no electric charge, includes:
depositing a layer of transparent material on the substrate;
and patterning the transparent material layer by adopting an exposure etching process to form a plurality of transparent structures which are arranged at intervals and are not charged.
Optionally, the material of the transparent material layer includes silicon dioxide.
Optionally, the first charge is a positive charge; the chemical bonding treatment of the plurality of transparent structures without electric charge comprises the following steps:
acidifying the plurality of uncharged transparent structures; and
introducing amino-containing silane groups into the plurality of uncharged transparent structures after the acidification treatment.
Optionally, the forming a color-resist layer on the side of the plurality of transparent structures far away from the substrate includes:
providing a color-resisting material; the color resistance material comprises pigment, photoinitiator, dispersed particles, solvent and photoresist polymer;
introducing a functional group having a second charge to at least a terminal of one of the pigment and the photoresist polymer to charge the color resist material with the second charge;
coating the color-resisting material with the second electric charge on the substrate formed with the plurality of transparent structures, so that the color-resisting material is remained on the side, away from the substrate, of the plurality of transparent structures; and
and curing the color resistance material on one side of the transparent structures far away from the substrate to form a color resistance layer.
Optionally, the material of the color resist layer includes any one of a positive photoresist material and a negative photoresist material.
Optionally, the forming a plurality of transparent structures on the substrate and forming a color-resist layer on a side of the plurality of transparent structures away from the substrate includes:
forming a plurality of transparent structures which are arranged at intervals and carry first charges on the substrate, wherein the plurality of transparent structures comprise a plurality of first transparent structures, a plurality of second transparent structures and a plurality of third transparent structures; and
a plurality of first color resistance units, a plurality of second color resistance units and a plurality of third color resistance units with second charges are correspondingly formed on the sides, far away from the substrate, of the plurality of first transparent structures, the plurality of second transparent structures and the plurality of third transparent structures in sequence; the plurality of first color resistance units, the plurality of second color resistance units and the plurality of third color resistance units form a color resistance layer.
Optionally, the forming a plurality of transparent structures on the substrate and forming a color-resist layer on a side of the plurality of transparent structures away from the substrate includes:
forming a plurality of first transparent structures which are arranged at intervals and carry first charges on the substrate;
forming a plurality of first color resistance units with second charges on one sides of the first transparent structures far away from the substrate;
forming a plurality of second transparent structures which are arranged at intervals, arranged at intervals with the plurality of first transparent structures and provided with the first charges on the substrate;
forming a plurality of second color resistance units with the second charges on the side, away from the substrate, of the plurality of second transparent structures;
forming a plurality of third transparent structures which are arranged at intervals, are arranged at intervals with the plurality of first transparent structures and the plurality of second transparent structures and are provided with the first charges on the substrate; and
forming a plurality of third color-resisting units with the second charges on the side, away from the substrate, of the plurality of third transparent structures; wherein the plurality of first transparent structures, the plurality of second transparent structures, and the plurality of third transparent structures constitute a plurality of transparent structures; the plurality of first color resistance units, the plurality of second color resistance units and the plurality of third color resistance units form a color resistance layer.
Optionally, the manufacturing method further includes the following steps:
and forming a shading layer on the substrate, wherein the shading layer is positioned between any two adjacent transparent structures.
The method for manufacturing the color film substrate comprises the steps of manufacturing a plurality of transparent structures with positive charges on a substrate, forming color resistance layers with negative charges on the transparent structures through a coating and curing process, avoiding the direct manufacturing of the color resistance layers by adopting an exposure etching process, enabling the line width of the color resistance layers to depend on the line width of the transparent structures, and enabling patterns of the transparent structures to be manufactured by an exposure machine in an Array process, so that positive photoresist materials with higher resolution can be used for manufacturing the transparent structures with smaller line widths, the color resistance layers with smaller line widths can be manufactured, the requirements of the color film substrate with high resolution and ultrahigh resolution are met, and the requirements of the display screen with ultrahigh resolution are met.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a schematic flow chart of a manufacturing method of a color film substrate according to an embodiment of the present disclosure.
Fig. 2 is a schematic structural diagram of a manufacturing method of a color film substrate according to an embodiment of the present disclosure.
Fig. 3 is a schematic flow chart of another manufacturing method of a color film substrate according to an embodiment of the present disclosure.
Fig. 4 is a schematic structural diagram of another manufacturing method of a color film substrate according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
Currently, in an exemplary process of fabricating an LCD panel, a photoresist material for fabricating a color filter substrate is usually a negative photoresist material, and a photoresist material for fabricating an Array substrate is usually a positive photoresist material. Because the negative photoresist material has low resolution and the positive photoresist material has high resolution, and the manufactured ultrahigh-resolution display screen needs the photoresist material with higher resolution, the manufactured color film substrate cannot meet the requirement of the ultrahigh-resolution display screen.
The existing exposure machines for fabricating Array substrates can meet the product requirement of resolution greater than 2000PPI (Pixels Per Inch Per pixel). Therefore, the present application provides a method for manufacturing a color film substrate, which can manufacture a color film substrate with a resolution greater than 2000PPI, and the line width of the color resistor unit of the color film substrate in the embodiment of the present application can be determined by the capability of an exposure machine in the Array process, i.e., the resolution of the positive photoresist, and is not affected by the inconsistency of the resolutions of the positive photoresist and the negative photoresist in the existing LCD screen manufacturing.
It can be understood that, in the LCD display, the color resist layer on the color film substrate is arranged corresponding to the pixel layer on the Array substrate, so that the resolution of the color film substrate is the same as that of the LCD display. In addition, the line width of the color resistor of the color film substrate in the present application refers to the size of the RGB color resistor unit in the color resistor layer.
As shown in fig. 1, an embodiment of the present application provides a manufacturing method of a color filter substrate, where the manufacturing method includes steps S101 and S102.
S101: a substrate is provided.
Specifically, as shown in fig. 2 (a), the substrate 1 may be a glass substrate, but is not limited thereto.
S102: forming a plurality of transparent structures on the substrate and forming a color resistance layer on one side of the plurality of transparent structures far away from the substrate; the transparent structures are arranged at intervals and carry first charges, and the color resistance layer carries second charges with the electrical property opposite to that of the first charges.
Specifically, as shown in fig. 2 (j), the color resistance layer 3 includes a plurality of first color resistance units 31, a plurality of second color resistance units 32, and a plurality of third color resistance units 33; the first color resistance unit 31 includes any one of a red color resistance unit (R), a green color resistance unit (G), and a blue color resistance unit (B), the second color resistance unit 32 includes one of the red color resistance unit (R), the green color resistance unit (G), and the blue color resistance unit (B) that is different from the first color resistance unit 31, and the third color resistance unit 33 includes one of the red color resistance unit (R), the green color resistance unit (G), and the blue color resistance unit (B) that is different from the first color resistance unit 31 and the second color resistance unit 32. In one embodiment, the first color resistance unit 31 is a red color resistance unit (R), the second color resistance unit 32 is a green color resistance unit (G), and the third color resistance unit 33 is a blue color resistance unit (B).
It will be appreciated that each transparent structure is formed with a colour-resist element on the side remote from the substrate. For convenience of description, as shown in fig. 2 (j), the plurality of transparent structures 2 'are divided into a plurality of first transparent structures 21', a plurality of second transparent structures 22 ', and a plurality of third transparent structures 23' disposed corresponding to the plurality of first color resistance units 31, the plurality of second color resistance units 32, and the plurality of third color resistance units 33.
Specifically, as shown in fig. 1, step S102 includes steps S1021 to S1023.
S1021: forming a plurality of transparent structures which are arranged at intervals and are free of electric charge on a substrate; wherein the plurality of transparent structures include a plurality of first transparent structures, a plurality of second transparent structures, and a plurality of third transparent structures.
As shown in diagram (b) of fig. 2, the plurality of transparent structures 2 without electric charges includes a plurality of first transparent structures 21, a plurality of second transparent structures 22, and a plurality of third transparent structures 23.
Specifically, step S1021 includes the steps of:
depositing a layer of transparent material on a substrate;
the transparent material layer is patterned by an exposure etching process to form a plurality of transparent structures 2 which are arranged at intervals and have no electric charge.
Specifically, the transparent material layer may be formed by a CVD (Chemical Vapor Deposition) process, and the material of the transparent material layer includes, but is not limited to, silicon dioxide (SiO)2)。
Specifically, in the process of patterning the transparent material layer by using an exposure etching process, the used photoresist material is a positive photoresist material with high resolution, and correspondingly, an exposure machine in an Array process can be used for exposing the positive photoresist material, so that the line widths of the prepared transparent structures 2 are smaller.
S1022: and carrying out chemical bonding treatment on the plurality of uncharged transparent structures so as to enable the plurality of transparent structures to carry the first charge.
Specifically, as shown in fig. 2 (c), the plurality of transparent structures 2' subjected to the chemical bonding process have a first charge. Specifically, in the embodiment of the present application, the first charge is a positive charge; the second charge is a negative charge.
Specifically, step S1022 includes the following steps:
acidifying a plurality of uncharged transparent structures; and
introducing amino (NH) into a plurality of uncharged transparent structures after acidification treatment2) A silane group of (2).
Specifically, the amino group-containing silane group includes any one of APS (ammonium persulfate) and APTES (3-aminopropyltriethoxysilane), but is not limited thereto.
Specifically, an amino group (NH) is introduced into each transparent structure2) The silane group of (A) is p-SiO2Process of hydroxylation。
S1023: a plurality of first color resistance units, a plurality of second color resistance units and a plurality of third color resistance units with second charges are correspondingly formed on one sides, far away from the substrate, of the plurality of first transparent structures, the plurality of second transparent structures and the plurality of third transparent structures with the first charges in sequence; the color resistance layer is formed by the first color resistance units, the second color resistance units and the third color resistance units.
Specifically, step S1023 includes the following steps:
providing a color-resisting material; the color resistance material comprises pigment, photoinitiator, dispersed particles, solvent and photoresist polymer;
introducing a functional group having a second charge to at least a terminal of one of the pigment and the photoresist polymer to charge the color resist material with the second charge;
coating a color resistance material with second charges on a substrate formed with a plurality of transparent structures with first charges so that the color resistance material is remained on one side of the plurality of transparent structures far away from the substrate; and
and curing the color resistance materials on the side of the plurality of transparent structures far away from the substrate to form a color resistance layer.
Specifically, the color-resisting material comprises a first color-resisting material, a second color-resisting material and a third color-resisting material. Each of the color-resist materials requires introduction of a functional group having a second charge, such as a phosphate group, at least at a terminal end of one of the pigment and the photoresist polymer thereof, so that the pigment and/or the photoresist polymer have the second charge, thereby allowing the corresponding color-resist material to have the second charge.
Specifically, the color resist material includes any one of a positive resist material and a negative resist material. That is, the photoresist polymer used to make the photoresist layer in this application can be either a positive or negative photoresist.
It can be understood that the first color-resisting material, the second color-resisting material and the third color-resisting material need to be coated and cured 3 times to form the color-resisting layer, which comprises the following steps:
coating a first color resistance material with a second charge on one side of the first transparent structures 21' far away from the substrate 1, and curing after UV (ultraviolet) exposure and baking (Oven) to form a plurality of first color resistance units 31, as shown in fig. 2 (e);
coating a second color resistance material with a second charge on one side of the second transparent structures 22' far away from the substrate 1, and curing after UV exposure and baking to form a plurality of second color resistance units 32, as shown in a diagram (g) in FIG. 2; and
a third color-resisting material with a second charge is coated on a side of the third transparent structures 23' far from the substrate 1, and is cured after UV exposure and baking to form a plurality of third color-resisting units 33, as shown in fig. 2 (i).
Specifically, the color resist layer 3 is formed by a plurality of first color resist units 31, a plurality of second color resist units 32, and a plurality of third color resist units 33.
Specifically, as shown in fig. 2 (d), the second transparent structure 22 'and the third transparent structure 23' may be covered with the protective layer 4 or the inert photoresist layer when the first color resist material is coated; as shown in fig. 2 (f), after the first color resist unit 31 is formed, the protective layer 4 is patterned to form a protective layer 4 ', and the second transparent structure 22' is exposed to form a second color resist unit 32; as shown in fig. 2 (h), after the second color-resisting unit 32 is formed, the protection layer 4 'is removed to expose the third transparent structure 23' to form a third color-resisting unit 33.
Specifically, each transparent structure 2 'with the first electric charge and the corresponding color resistance material with the second electric charge are mutually adsorbed through van der waals force, so that when the color resistance material is coated, only the color resistance material can be remained on the exposed transparent structure 2', and the color resistance material cannot be remained elsewhere. Therefore, the color resist layer 3 in the embodiment of the present application does not need to be manufactured by an exposure etching process, and the line width of the color resist unit in the color resist layer 3 is consistent with the line width of the transparent structure 2 (2'). Since the transparent structure 2(2 ') can be manufactured by an exposure machine in the Array process, the color resistance unit with a smaller line width can be manufactured by manufacturing the transparent structure 2 (2') with a smaller line width.
Specifically, as shown in fig. 2 (j), the manufacturing method further includes the following steps:
a light-shielding layer 5 is formed on the substrate 1, the light-shielding layer 5 being located between any adjacent two of the transparent structures 2.
Specifically, the light-shielding layer 5 may be a Black Matrix (BM). The light-shielding layer 5 may be formed before the formation of the transparent structure 2, may be formed after the formation of the transparent structure 2, or may be formed after the formation of the color-resist layer 3, and the present application is not limited thereto.
Specifically, the manufacturing process of the light-shielding layer 5 is not limited.
In this embodiment, a plurality of transparent structures 2 ' with positive charges are firstly fabricated on a substrate 1, and then a color resistance layer 3 with negative charges is formed on the plurality of transparent structures 2 ' through a coating and curing process, so that the color resistance layer 3 fabricated by an exposure etching process is avoided, the line width of the color resistance layer 3 depends on the line width of the transparent structure 2(2 '), and the pattern of the transparent structure 2(2 ') can be fabricated by an exposure machine in an Array process, so that a positive photoresist material with higher resolution can be used for fabricating the transparent structure 2(2 ') with smaller line width, thereby fabricating the color resistance layer 3 with smaller line width, so as to meet the requirements of a high-resolution and ultrahigh-resolution color film substrate 10, and thus meet the requirements of an ultrahigh-resolution display screen.
The embodiment of the present application further provides a manufacturing method of a color filter substrate, which is different from the foregoing embodiment in that, in step S102, the plurality of first transparent structures 21, the plurality of second transparent structures 22, and the plurality of third transparent structures 23 are not formed in the same process.
Specifically, as shown in fig. 3 and 4, the method for manufacturing the color filter substrate 10 provided in the embodiment of the present application includes the following steps:
s301: a substrate is provided.
S302: forming a plurality of transparent structures on the substrate and forming a color resistance layer on one side of the plurality of transparent structures far away from the substrate; the transparent structures are arranged at intervals and carry first charges, and the color resistance layer carries second charges with the electrical property opposite to that of the first charges.
Step S302 includes steps S3021 to S3026.
S3021: a plurality of first transparent structures which are arranged at intervals and carry first charges are formed on the substrate.
As shown in fig. 4 (a) to (c), a plurality of first transparent structures 21 that are spaced apart from each other and have no electric charge are formed on the substrate 1, and then the plurality of first transparent structures 21 having no electric charge are converted into a plurality of first transparent structures 21' having a first electric charge, where the first electric charge is a positive electric charge.
S3022: and forming a plurality of first color resistance units with second charges on the sides of the first transparent structures far away from the substrate.
As shown in fig. 4 (d), a plurality of first color resist units 31 are correspondingly disposed on a plurality of first transparent structures 21'.
S3023: a plurality of second transparent structures which are arranged at intervals, arranged at intervals with the first transparent structures and provided with first charges are formed on the substrate.
As shown in fig. 4 (e) and (f), a plurality of second transparent structures 22, which are spaced apart from each other, spaced apart from the plurality of first transparent structures 21 'and without electric charges, are formed on the substrate 1, and then the plurality of second transparent structures 22 without electric charges are converted into a plurality of second transparent structures 22' with first electric charges.
S3024: and forming a plurality of second color resistance units with second charges on the side, far away from the substrate, of the plurality of second transparent structures.
As shown in fig. 4 (g), a plurality of second color-resist units 32 are correspondingly disposed on the plurality of second transparent structures 22'.
S3025: and forming a plurality of third transparent structures which are arranged at intervals, are arranged at intervals with the plurality of first transparent structures and the plurality of second transparent structures and are provided with first charges on the substrate.
As shown in fig. 4 (h) and (i), a plurality of third transparent structures 23, which are spaced apart from each other, spaced apart from the plurality of first transparent structures 21 ' and the plurality of second transparent structures 22 ', and not charged, are first formed on the substrate 1, and then the plurality of third transparent structures 23, which are not charged, are converted into a plurality of third transparent structures 23 ' charged with the first charge.
S3026: forming a plurality of third color-resisting units with second charges on one sides of the plurality of third transparent structures far away from the substrate; the first transparent structures, the second transparent structures and the third transparent structures form a plurality of transparent structures; the multiple first color resistance units, the multiple second color resistance units and the multiple third color resistance units form a color resistance layer.
As shown in fig. 4 (j), the plurality of third color-resisting units 33 are correspondingly disposed on the plurality of third transparent structures 23 ', and the plurality of first transparent structures 21 ', the plurality of second transparent structures 22 ' and the plurality of third transparent structures 23 ' form a plurality of transparent structures 2 '; the plurality of first color resist units 31, the plurality of second color resist units 32, and the plurality of third color resist units 33 constitute the color resist layer 3.
As in the previous embodiment, the manufacturing method further includes forming the light-shielding layer 5, as shown in fig. 4 (k).
Specifically, the manufacturing processes of the plurality of first transparent structures 21(21 '), the plurality of second transparent structures 22(22 '), and the plurality of third transparent structures 23(23 ') in the embodiment of the present application are the same as the manufacturing processes of the transparent structures in the foregoing embodiment, and are not described herein again. Moreover, the manufacturing processes of the first color resistance units 31, the second color resistance units 32 and the third color resistance units 33 are the same as those of the color resistance units in the foregoing embodiments, and are not described herein again.
It is understood that the plurality of first transparent structures 21 ', the plurality of second transparent structures 22', and the plurality of third transparent structures 23 'are formed in three steps, and the corresponding color-resisting units are formed after the transparent structures are formed each time, for example, the plurality of first transparent structures 21' are formed and then the plurality of first color-resisting units 31 are formed, the plurality of second transparent structures 22 'are formed and then the plurality of second color-resisting units 32 are formed, and the plurality of third transparent structures 23' are formed and then the plurality of third color-resisting units 33 are formed.
In this embodiment, as in the previous embodiment, the line width of the color resistance unit in the color resistance layer 3 depends on the line width of the transparent structure 2(2 '), and the pattern of the transparent structure 2(2 ') can be made by using an exposure machine in the Array process, so that the positive photoresist material with higher resolution can be used to make the transparent structure 2(2 ') with smaller line width, thereby making the color resistance unit with smaller line width to meet the requirements of the color film substrate 10 with high resolution and ultrahigh resolution, and thus meeting the requirements of the ultrahigh resolution display screen.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The method for manufacturing the color film substrate provided by the embodiment of the present application is described in detail above, and the principle and the implementation manner of the present application are explained in this document by applying specific examples, and the description of the above embodiment is only used to help understanding the technical scheme and the core idea of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (10)
1. The manufacturing method of the color film substrate is characterized by comprising the following steps of:
providing a substrate;
forming a plurality of transparent structures on the substrate and forming a color resistance layer on one side of the transparent structures far away from the substrate; the transparent structures are arranged at intervals and carry first charges, and the color resistance layer carries second charges opposite to the first charges in electrical property.
2. The method for manufacturing a color filter substrate according to claim 1, wherein the step of forming a plurality of transparent structures on the substrate comprises:
forming a plurality of transparent structures which are arranged at intervals and are free of electric charge on the substrate; and
and carrying out chemical bonding treatment on the plurality of uncharged transparent structures so as to enable the plurality of transparent structures to be charged with a first charge.
3. The method for manufacturing the color film substrate according to claim 2, wherein the step of forming a plurality of transparent structures which are arranged at intervals and have no electric charge on the substrate comprises the following steps:
depositing a layer of transparent material on the substrate;
and patterning the transparent material layer by adopting an exposure etching process to form a plurality of transparent structures which are arranged at intervals and are not charged.
4. The manufacturing method of the color film substrate according to claim 3, wherein the material of the transparent material layer comprises silicon dioxide.
5. The method for manufacturing a color filter substrate according to claim 2, wherein the first charge is a positive charge; the chemical bonding treatment of the plurality of transparent structures without electric charge comprises the following steps:
acidifying the plurality of uncharged transparent structures; and
introducing amino-containing silane groups into the plurality of uncharged transparent structures after the acidification treatment.
6. The method for manufacturing a color filter substrate according to claim 1, wherein forming a color resist layer on one side of the plurality of transparent structures away from the substrate comprises:
providing a color-resisting material; the color resistance material comprises pigment, photoinitiator, dispersed particles, solvent and photoresist polymer;
introducing a functional group having a second charge to at least a terminal of one of the pigment and the photoresist polymer to charge the color resist material with the second charge;
coating the color-resisting material with the second electric charge on the substrate formed with the plurality of transparent structures, so that the color-resisting material is remained on the side, away from the substrate, of the plurality of transparent structures; and
and curing the color resistance material on one side of the transparent structures far away from the substrate to form a color resistance layer.
7. The method for manufacturing a color filter substrate according to any one of claims 1 to 6, wherein the material of the color resist layer comprises any one of a positive photoresist material and a negative photoresist material.
8. The method for manufacturing a color filter substrate according to claim 1, wherein the forming of the plurality of transparent structures on the substrate and the forming of the color resist layer on the side of the plurality of transparent structures away from the substrate comprises the following steps:
forming a plurality of transparent structures which are arranged at intervals and carry first charges on the substrate, wherein the plurality of transparent structures comprise a plurality of first transparent structures, a plurality of second transparent structures and a plurality of third transparent structures; and
a plurality of first color resistance units, a plurality of second color resistance units and a plurality of third color resistance units with second charges are correspondingly formed on the sides, far away from the substrate, of the plurality of first transparent structures, the plurality of second transparent structures and the plurality of third transparent structures in sequence; the plurality of first color resistance units, the plurality of second color resistance units and the plurality of third color resistance units form a color resistance layer.
9. The method for manufacturing a color filter substrate according to claim 1, wherein the forming of the plurality of transparent structures on the substrate and the forming of the color resist layer on the side of the plurality of transparent structures away from the substrate comprises the following steps:
forming a plurality of first transparent structures which are arranged at intervals and carry first charges on the substrate;
forming a plurality of first color resistance units with second charges on one sides of the first transparent structures far away from the substrate;
forming a plurality of second transparent structures which are arranged at intervals, arranged at intervals with the plurality of first transparent structures and provided with the first charges on the substrate;
forming a plurality of second color resistance units with the second charges on the side, away from the substrate, of the plurality of second transparent structures;
forming a plurality of third transparent structures which are arranged at intervals, are arranged at intervals with the plurality of first transparent structures and the plurality of second transparent structures and are provided with the first charges on the substrate; and
forming a plurality of third color-resisting units with the second charges on the side, away from the substrate, of the plurality of third transparent structures; wherein the plurality of first transparent structures, the plurality of second transparent structures, and the plurality of third transparent structures constitute a plurality of transparent structures; the plurality of first color resistance units, the plurality of second color resistance units and the plurality of third color resistance units form a color resistance layer.
10. The manufacturing method of the color film substrate according to claim 1, further comprising the following steps:
and forming a shading layer on the substrate, wherein the shading layer is positioned between any two adjacent transparent structures.
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| CN115220253A (en) * | 2022-07-29 | 2022-10-21 | 京东方科技集团股份有限公司 | Display panel, manufacturing method thereof and display device |
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