CN114152783A - Micro-needle floating test tool and test module - Google Patents
Micro-needle floating test tool and test module Download PDFInfo
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- CN114152783A CN114152783A CN202111342103.2A CN202111342103A CN114152783A CN 114152783 A CN114152783 A CN 114152783A CN 202111342103 A CN202111342103 A CN 202111342103A CN 114152783 A CN114152783 A CN 114152783A
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- 238000012360 testing method Methods 0.000 title claims abstract description 170
- 239000000523 sample Substances 0.000 claims abstract description 73
- 238000003825 pressing Methods 0.000 claims description 35
- 238000005188 flotation Methods 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 4
- 230000008054 signal transmission Effects 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000013522 software testing Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
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Abstract
The invention provides a micro-needle floating test tool and a test module, wherein the test tool comprises: an upper cover assembly; the upper cover assembly is pressed on or separated from the carrier plate assembly; the carrier plate assembly sequentially comprises a fixing plate, a PCB adapter plate, a lower needle plate, a plurality of test probes, an upper needle plate and a chip carrier plate from bottom to top; the upper needle plate is arranged on the fixed plate, a plurality of reset springs are arranged between the upper needle plate and the fixed plate, a chip groove is arranged on the upper surface of the chip carrier plate and used for placing a test chip, a probe hole is formed in the chip carrier plate, a test probe is fixed on the lower needle plate, when the upper cover assembly and the carrier plate assembly are pressed, the upper needle plate is contacted with the fixed plate, the reset springs are compressed, and the test probe extends out of the chip carrier plate; when the upper cover component is separated from the support plate component, the upper needle plate is separated from the fixed plate, the reset spring resets, and the test probe is hidden in the probe hole. According to the scheme, the chip can be taken and placed more conveniently, the probe can be prevented from breaking holes, and the test result of the chip is prevented from being influenced.
Description
Technical Field
The invention relates to the technical field of chip testing, in particular to a micro-needle floating testing tool and a testing module.
Background
During the production of the chip, the performance of the chip needs to be tested, and the test method usually transmits a signal to a test fixture host through an external pin point to perform an analysis test, and determines whether the function is good or not by detecting the signal conduction state.
However, some test chips with small volume are not easy to take and place during testing, and probe holes are easy to break, so that the measurement result is influenced. Therefore, a testing tool which is convenient for taking and placing the chip and can avoid the broken holes of the probes is needed.
Disclosure of Invention
The invention aims to provide a micro-needle floating test tool and a test module, which are used for solving the problems that in the prior art, a chip is inconvenient to take and place, and a probe is easy to break a hole.
The technical scheme provided by the invention is as follows:
the invention provides a microneedle flotation test tool, comprising:
an upper cover assembly;
the upper cover assembly is pressed on or separated from the carrier plate assembly;
wherein, the support plate subassembly includes from supreme down in proper order:
a fixing plate;
the PCB adapter plate is provided with an installation groove on the upper surface;
the lower needle plate is placed in the mounting groove;
a plurality of test probes;
the upper needle plate is arranged on the fixing plate, a plurality of reset springs are arranged on the periphery between the upper needle plate and the fixing plate, and a first step hole and a second step hole are formed in the upper needle plate from top to bottom;
the lower half part of the chip carrier plate is embedded into the first stepped hole, a chip groove is formed in the upper surface of the chip carrier plate and used for placing a test chip, a probe hole extending from the bottom surface of the chip groove to the bottom surface of the chip carrier plate is formed in the chip carrier plate, the position of the probe hole is matched with the position of a test probe point of the test chip, and the test probe can be allowed to pass through;
the test probe is fixed on the lower needle plate, and the lower end of the test probe extends out of the bottom end of the lower needle plate and is in contact with the bottom surface of the mounting groove of the PCB adapter plate;
when the upper cover assembly and the carrier plate assembly are pressed, the bottom surface of the upper needle plate is contacted with the upper surface of the fixing plate, the return spring is compressed, and the test probe extends out of the chip carrier plate;
when the upper cover assembly is separated from the carrier plate assembly, the bottom surface of the upper needle plate is separated from the upper surface of the fixing plate, the reset spring resets, and the test probe is hidden in the probe hole.
The upper cover assembly and the carrier plate assembly are arranged and can be pressed or separated, the carrier plate assembly is used for placing a test chip and sequentially comprises a fixed plate, a PCB (printed circuit board) adapter plate, a lower needle plate, a test probe, an upper needle plate and a chip carrier plate from bottom to top, the upper needle plate and the fixed plate are connected through a reset spring, the chip carrier plate is embedded in a first stepped hole of the upper needle plate, so that the test chip is placed on a chip groove of the chip carrier plate when the chip is tested, the upper cover assembly and the carrier plate assembly are pressed, the bottom surface of the upper needle plate is in contact with the upper surface of the fixed plate, the reset spring can be compressed, the test probe can extend out of the chip carrier plate and is connected with the test chip, and the chip is connected; and when the test is finished, the upper cover component is separated from the carrier plate component, the bottom surface of the upper needle plate is separated from the upper surface of the fixing plate, the reset spring can reset, the test probe can be separated from the test chip, and the test chip can be taken out. This scheme can make getting of chip put more convenient, and reset spring can play the cushioning effect for the connection of test probe and chip, avoids the broken hole of test probe, influences the test result of chip.
Further, the upper cover assembly includes:
an upper cover plate;
and the pressing block is arranged below the upper cover plate and fixedly connected with the upper cover plate through a plurality of first screws, and the pressing block is used for pressing the test chip when the upper cover assembly and the carrier plate assembly are pressed.
Through setting up upper cover plate and briquetting at the upper cover subassembly, the briquetting is located the below of upper cover plate to through first screw and upper cover plate fixed connection, make when upper cover subassembly and support plate subassembly pressfitting, the test chip can be pressed to the briquetting, so that the probe is connected with the test chip.
Furthermore, both sides of the upper cover plate are provided with side grooves, buckles are arranged in the side grooves, both sides of the buckles are provided with rotating shafts, the end parts of the rotating shafts are connected with the side walls of the side grooves through screws,
the inner side surfaces of the buckles are connected with the inner side surfaces of the side grooves through buckle springs.
Further, the top of buckle all is provided with presses the splenium, just the bottom of buckle all is provided with the orientation the fixture block that the briquetting direction extends, the bottom both sides of fixed plate all be provided with the draw-in groove that the fixture block matches.
The side grooves are formed in the two sides of the upper cover plate, the buckles are arranged in the side grooves and movably connected with the side grooves, the pressing parts are arranged at the top ends of the buckles, the clamping blocks extending inwards are arranged at the bottom ends of the buckles, the clamping grooves matched with the clamping blocks are formed in the two sides of the bottom end of the fixing plate, so that when the upper cover assembly and the carrier plate assembly are pressed, the clamping blocks of the two buckles can rotate outwards by pressing the two pressing parts inwards, then the upper cover assembly and the carrier plate assembly are pressed, and the pressing parts are loosened, so that the clamping blocks can rotate inwards and are combined with the clamping grooves under the action of the buckle springs, and the upper cover assembly and the carrier plate assembly are fixed; when the upper cover assembly and the carrier plate assembly are required to be separated, the two pressing parts are also required to be pressed inwards, and when the clamping block is separated from the clamping groove, the upper cover assembly is lifted upwards, so that the upper cover assembly and the carrier plate assembly are pressed and separated more conveniently, and the pressing is more stable, and the test is facilitated.
Furthermore, both sides of the bottom end of the upper cover plate are provided with first positioning pins, the pressing block is positioned between the two first positioning pins,
the positioning blocks are arranged on two sides of the top end of the fixing plate, positioning holes matched with the first positioning pins are formed in the top ends of the positioning blocks, and the upper needle plate is located between the two positioning blocks.
Through setting up first locating pin in the bottom of upper cover plate, set up the locating hole that matches with first locating pin on the top of fixed plate for when with upper cover subassembly and support plate subassembly pressfitting, can lead to moving down of upper cover subassembly, avoid upper cover subassembly and support plate subassembly position deviation to appear, lead to probe and test chip's connection deviation to appear, influence the result of testing.
Furthermore, a plurality of carrier plate springs are arranged between the chip carrier plate and the lower needle plate, when the upper cover assembly and the carrier plate assembly are pressed, the carrier plate springs are compressed, and the test probes extend out of the chip carrier plate;
when the upper cover assembly is separated from the carrier plate assembly, the carrier plate spring is reset, and the test probes are hidden in the probe holes of the chip carrier plate.
Through set up a plurality of support plate springs between chip support plate and lower needle board, can cushion the protection to testing chip when upper cover subassembly and support plate subassembly pressfitting, avoid pressure too big, lead to the chip fracture.
Furthermore, the upper half part of the PCB adapter plate is embedded into a second stepped hole of the upper needle plate, the opening of the first stepped hole is larger than the opening of the second stepped hole, one opposite angle of the PCB adapter plate is connected with the fixing plate through a second screw, and the other opposite angle of the PCB adapter plate is connected with the fixing plate through a second positioning pin.
Furthermore, the chip carrier plate is limited on the top surface of the upper needle plate through a limiting screw, and the limiting screw is in threaded fit with the top surface of the upper needle plate;
the bottom surface of the fixed plate is provided with a plurality of step screws used for connecting the upper needle plate.
In addition, the invention also provides a test module which comprises a test mainboard, wherein a plurality of the micro-needle floating test tools are arranged on the test mainboard, a connector interface is arranged on the bottom surface of the PCB adapter plate,
the fixed plate is provided with a groove matched with the connector interface, the depth of the connector interface is slightly larger than that of the groove, a signal connecting line is buried in the bottom surface of the groove, and the connector interface transmits a signal to the test mainboard through the signal connecting line.
By arranging the test mainboard and arranging the micro-needle floating test tools on the test mainboard, batch test of test chips can be realized, and the test efficiency is improved.
Furthermore, one diagonal of the fixing plate is connected with the test main board through a third screw, and the other diagonal of the fixing plate is connected with the test main board through a third positioning pin.
According to the microneedle floating test tool and the test module provided by the invention, the microneedle floating test tool at least has the following beneficial effects:
(1) the scheme can enable the chip to be more conveniently taken and placed, and the reset spring can play a role in buffering the connection between the test probe and the chip, so that the test probe is prevented from being broken and the test result of the chip is prevented from being influenced;
(2) the scheme can ensure that the pressing and the separation of the upper cover assembly and the carrier plate assembly are more convenient, and the pressing is more stable, thereby being beneficial to the test;
(3) according to the scheme, when the upper cover assembly and the carrier plate assembly are pressed, the downward movement of the upper cover assembly can be guided, so that the situation that the positions of the upper cover assembly and the carrier plate assembly are deviated, the connection between a test probe and a test chip is deviated, and the test result is influenced is avoided;
(4) through set up a plurality of support plate springs between chip support plate and lower needle board, can cushion the protection to testing chip when upper cover subassembly and support plate subassembly pressfitting, avoid pressure too big, lead to the chip fracture.
Drawings
The foregoing features, technical features, advantages and embodiments of the present invention will be further explained in the following detailed description of the preferred embodiments, which is to be read in connection with the accompanying drawings.
FIG. 1 is a schematic diagram of the overall structure of an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a lid assembly according to an embodiment of the present invention;
FIG. 3 is a schematic perspective view of a lid assembly according to an embodiment of the present invention;
fig. 4 is a schematic diagram of an exploded structure of a carrier plate assembly according to an embodiment of the invention;
FIG. 5 is a schematic cross-sectional view illustrating a carrier assembly according to an embodiment of the invention;
FIG. 6 is a schematic structural diagram of a test module according to an embodiment of the invention.
Reference numbers in the figures: 1-an upper cover assembly; 11-an upper cover plate; 12-briquetting; 13-a first screw; 14-side groove; 15-buckling; 151-rotation axis; 152-basic meter screw; 153-snap spring; 154-a pressing part; 155-fixture block; 16-a first locator pin; 2-a carrier plate assembly; 21-fixing the plate; 211-card slot; 212-a positioning block; 213-positioning holes; 214-step screw; 215-third screw; 216-a third locating pin; 22-a needle board is arranged; 23-a chip carrier; 24-a return spring; 25-a limit screw; 26-a test probe; 27-a lower needle plate; 28-carrier plate spring; 29-PCB interposer; 291-second screw; 292-a second locating pin; 3-testing the chip; 4-testing the mainboard.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following description will be made with reference to the accompanying drawings. It is obvious that the drawings in the following description are only some examples of the invention, and that for a person skilled in the art, other drawings and embodiments can be derived from them without inventive effort.
For the sake of simplicity, the drawings only schematically show the parts relevant to the present invention, and they do not represent the actual structure as a product. In addition, in order to make the drawings concise and understandable, components having the same structure or function in some of the drawings are only schematically illustrated or only labeled. In this document, "one" means not only "only one" but also a case of "more than one".
Example 1
In an embodiment of the present invention, as shown in fig. 1, the present invention provides a microneedle floating test tool, which includes a cover assembly 1 and a carrier assembly 2, wherein the carrier assembly 2 is used for placing a test chip 3, and the cover assembly 1 and the carrier assembly 2 can be pressed or separated, so as to implement placing and removing the test chip 3.
As shown in fig. 4 and 5, the carrier board assembly 2 includes, from bottom to top, a fixing board 21, a PCB interposer 29, a lower pin board 27, a test probe 26, an upper pin board 22, and a chip carrier board 23.
The upper surface of the PCB adapter plate 29 is provided with a mounting groove, and the lower needle plate 27 is placed in the mounting groove.
The upper needle plate 22 is arranged on the fixed plate 21, and a plurality of return springs 24 are arranged around the space between the upper needle plate 22 and the fixed plate 21, so that the upper needle plate 22 can move up and down under the action of the return springs 24.
Go up faller 22 and down seted up first ladder hole and second ladder hole from last, and the opening in first ladder hole is greater than the opening in second ladder hole, the latter half embedding of chip support plate 23 is downthehole in the first ladder, and the upper surface of chip support plate 23 is provided with the chip groove for place test chip 3, set up the probe hole that extends from the chip tank bottom to the bottom surface of chip support plate 23 on the chip support plate 23, probe hole and test chip 3's test needle point position phase-match can allow test probe 26 to pass.
The test probes 26 are fixed on the lower needle plate 27, and the lower ends of the test probes 26 extend out from the bottom end of the lower needle plate 27 and contact with the bottom surface of the mounting groove of the PCB adapter plate 29, so that signal transmission is realized.
When the upper cover assembly 1 and the carrier plate assembly 2 are pressed, the return spring 24 is compressed, the test probe 26 extends out of the chip carrier plate 23, and the bottom surface of the upper probe plate 22 is contacted with the upper surface of the fixing plate 21; when the upper cover assembly 1 is separated from the carrier plate assembly 2, the return spring 24 is reset, the test probes 26 are hidden in the probe holes, and the bottom surface of the upper probe plate 22 is separated from the upper surface of the fixing plate 21.
By arranging the upper cover assembly 1 and the carrier plate assembly 2, the upper cover assembly 1 and the carrier plate assembly 2 can be pressed or separated, the carrier plate assembly 2 is used for placing the test chip 3, the carrier plate assembly 2 sequentially comprises a fixing plate 21, a PCB adapter plate 29, a lower needle plate 27, a test probe 26, an upper needle plate 22 and a chip carrier plate 23 from bottom to top, the upper needle plate 22 and the fixing plate 21 are connected through a reset spring 24, the chip carrier plate 23 is embedded in a first stepped hole of the upper needle plate 22, so that the test chip 3 is placed on a chip groove of the chip carrier plate 23 when a chip test is carried out, the upper cover assembly 1 and the carrier plate assembly 2 are pressed, the reset spring 24 can be compressed, the bottom surface of the upper needle plate 22 is in contact with the upper surface of the fixing plate 21, and the test probe 26 can extend out of the chip carrier plate 23 and is connected with the test chip 3, so as to realize the connection of the chip; and when the test is finished, the upper cover assembly 1 and the carrier plate assembly 2 are separated, the return spring 24 can be reset, the bottom surface of the upper needle plate 22 is separated from the upper surface of the fixing plate 21, the test probe 26 can be separated from the test chip 3, and the test chip 3 can be taken out, and meanwhile, the test probe 26 can be hidden in the probe hole, so that the purpose of protecting the test probe 26 is achieved. This scheme can make getting of chip put more convenient, and reset spring 24 can play the cushioning effect for the connection of test probe 26 and chip, avoids the broken hole of test probe 26, influences the test result of chip.
Example 2
In an embodiment of the present invention, as shown in fig. 2 and 3, the upper cover assembly 1 includes an upper cover plate 11 and a pressing block 12 on the basis of embodiment 1.
The pressing block 12 is arranged below the upper cover plate 11 and is fixedly connected with the upper cover plate 11 through a plurality of first screws 13, and the pressing block 12 is used for pressing the test chip 3 when the upper cover assembly 1 and the carrier plate assembly 2 are pressed.
By providing the upper cover plate 11 and the pressing block 12 on the upper cover assembly 1, the pressing block 12 is located below the upper cover plate 11 and is fixedly connected with the upper cover plate 11 through the first screw 13, so that when the upper cover assembly 1 and the carrier plate assembly 2 are pressed, the pressing block 12 can press the test chip 3, so that the probe 26 is connected with the test chip 3.
Preferably, both sides of the upper cover plate 11 are provided with side grooves 14, each side groove 14 is provided with a buckle 15, both sides of the buckle 15 are provided with a rotating shaft 151, the end of the rotating shaft 151 is connected with the side wall of the side groove 14 through a base rice screw 152, and the inner side of the buckle 15 is connected with the inner side of the side groove 14 through a buckle spring 153.
Further preferably, the top end of the buckle 15 is provided with a pressing portion 154, the bottom end of the buckle 15 is provided with a fixture block 155 extending towards the pressing block 12, and two sides of the bottom end of the fixing plate 21 are provided with clamping grooves 211 matched with the fixture block 155.
By arranging the side grooves 14 on two sides of the upper cover plate 11 and arranging the buckles 15 in the side grooves 14, the buckles 15 are movably connected with the side grooves 14, the top ends of the buckles 15 are provided with the pressing parts 154, the bottom ends of the buckles 15 are provided with the clamping blocks 155 extending inwards, and two sides of the bottom end of the fixing plate 21 are both provided with the clamping grooves 211 matched with the clamping blocks 155, so that when the upper cover assembly 1 and the carrier plate assembly 2 are pressed, the clamping blocks 155 of the two buckles 15 can rotate outwards by pressing the two pressing parts 154 inwards, then the upper cover assembly 1 and the carrier plate assembly 2 are pressed, and the pressing parts 154 are loosened, and under the action of the buckle springs 153, the clamping blocks 155 can rotate inwards and are combined with the clamping grooves 211, so that the upper cover assembly 1 and the carrier plate assembly 2 are fixed; when the upper cover assembly 1 and the carrier plate assembly 2 are required to be separated, only the two pressing portions 154 need to be pressed inwards, and when the clamping block 155 is separated from the clamping groove 211, the upper cover assembly 1 is lifted upwards, so that the upper cover assembly 1 and the carrier plate assembly 2 are pressed and separated more conveniently, and are more stable during pressing, and the test is facilitated.
Preferably, the two sides of the bottom end of the upper cover plate 11 are both provided with first positioning pins 16, the press block 12 is located between the two first positioning pins 16, the two sides of the top end of the fixing plate 21 are both provided with positioning blocks 212, the top ends of the positioning blocks 212 are both provided with positioning holes 213 matched with the first positioning pins 16, and the upper needle plate 22 is located between the two positioning blocks 212.
Through setting up first locating pin 16 in the bottom of upper cover plate 11, set up locating hole 213 with first locating pin 16 matches at the top of fixed plate 21 for when pressing upper cover subassembly 1 and support plate subassembly 2, can lead to moving down of upper cover subassembly 1, avoid upper cover subassembly 1 and support plate subassembly 2 position deviation to appear, lead to test probe 26 and test chip 3 to be connected the deviation, influence the result of testing.
Example 3
In an embodiment of the present invention, as shown in fig. 4, on the basis of embodiment 1 or 2, a plurality of carrier springs 28 are disposed between the chip carrier 23 and the lower pin 27, when the upper cover assembly 1 and the carrier assembly 2 are pressed, the carrier springs 28 compress, and the test probes 26 extend out of the chip carrier 23; when the lid assembly 1 and the carrier assembly 2 are separated, the carrier springs 28 are reset, and the test probes 26 are hidden in the probe holes of the chip carrier 23.
By arranging a plurality of carrier plate springs 28 between the chip carrier plate 23 and the lower pin plate 27, the test chip 3 can be protected in a buffering manner when the upper cover assembly 1 and the carrier plate assembly 2 are pressed, so that the chip fracture caused by overlarge pressure can be avoided.
Preferably, the upper half of the PCB adapter plate 29 is embedded in the second stepped hole of the upper pin plate 22, and the signal transmission can be realized through the test chip 3, the test probe 26, the lower pin plate 27 and the PCB adapter plate 29.
One opposite corner of the PCB interposer 29 is connected to the fixing plate 21 by the second screw 291, and the other opposite corner of the PCB interposer 29 is connected to the fixing plate 21 by the second positioning pin 292.
Specifically, at installation PCB keysets 29, can set up that a diagonal angle of PCB keysets 29 is connected with fixed plate 21 through second screw 291, and another diagonal angle passes through second locating pin 292 and is connected with fixed plate 21, has both guaranteed the firm connection of PCB keysets 29 and fixed plate 21, can guarantee again that PCB keysets 29's position is accurate. In other embodiments, other connection manners may be adopted, for example, four corners of the PCB interposer 29 are fixed by the second screws 291, and the second positioning pins 292 are additionally disposed, which is not limited herein.
Preferably, the chip carrier 23 is limited on the top surface of the upper needle plate 22 by a limiting screw 25, and the limiting screw 25 is in threaded fit with the top surface of the upper needle plate 22.
By arranging the limit screw 25 and limiting the nut of the limit screw 25 to the chip carrier 23, the test probe 26 of the chip carrier 23 is prevented from extending a long distance to damage the test chip 3.
The bottom surface of the fixing plate 21 is provided with a plurality of step screws 214 for connecting the upper needle plate 22, and the upper needle plate 22 and the fixing plate 21 can be connected on the basis of ensuring the movement of the upper needle plate 22 by arranging the step screws 214.
Example 4
An embodiment of the present invention, as shown in fig. 4 and 6, further provides a testing module, which includes a testing motherboard 4, the testing motherboard 4 is provided with a plurality of microneedle floating testing tools according to any one of embodiments 1 to 3, a bottom surface of the PCB adapter board 29 is provided with a connector interface, the fixing board 21 is provided with a groove matching with the connector interface, the depth of the connector interface is slightly greater than the depth of the groove, a signal connecting line is embedded in the bottom surface of the groove, and the connector interface transmits a signal to the testing motherboard 4 through the signal connecting line.
Through setting up test mainboard 4 to set up a plurality of foretell micropin testing tool that floats on test mainboard 4, can realize testing chip 3's batch test, be favorable to improving efficiency of software testing, if in this scheme, can place 25 micropin testing tool that floats simultaneously and test. Through set up the connector interface on the bottom surface at PCB keysets 29, set up the recess that matches with the connector interface on fixed plate 21, the signal connection line has been buried underground to the recess bottom surface for the connector interface can be through signal connection line with signal transmission to test on the mainboard 4, so that carry out the chip test.
Preferably, the microneedle floating test tools are uniformly distributed on the test main board 4.
Further preferably, in this embodiment, when the fixing plate 21 is installed, one diagonal of the fixing plate 21 is connected to the test motherboard 4 through the third screw 215, and the other diagonal of the fixing plate 21 is connected to the test motherboard 4 through the third positioning pin 216, which not only ensures the stable connection between the test motherboard 4 and the fixing plate 21, but also ensures the position accuracy of the fixing plate 21. In other embodiments, other connection manners may be adopted, for example, four corners of the fixing plate 21 are fixed by the third screws 215, and a third positioning pin 216 is further added, which is not limited herein.
It should be noted that the above embodiments can be freely combined as necessary. The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A microneedle flotation test tool, comprising:
an upper cover assembly;
the upper cover assembly is pressed on or separated from the carrier plate assembly;
wherein, the support plate subassembly includes from supreme down in proper order:
a fixing plate;
the PCB adapter plate is provided with an installation groove on the upper surface;
the lower needle plate is placed in the mounting groove;
a plurality of test probes;
the upper needle plate is arranged on the fixing plate, a plurality of reset springs are arranged on the periphery between the upper needle plate and the fixing plate, and a first step hole and a second step hole are formed in the upper needle plate from top to bottom;
the lower half part of the chip carrier plate is embedded into the first stepped hole, a chip groove is formed in the upper surface of the chip carrier plate and used for placing a test chip, a probe hole extending from the bottom surface of the chip groove to the bottom surface of the chip carrier plate is formed in the chip carrier plate, the position of the probe hole is matched with the position of a test probe point of the test chip, and the test probe can be allowed to pass through;
the test probe is fixed on the lower needle plate, and the lower end of the test probe extends out of the bottom end of the lower needle plate and is in contact with the bottom surface of the mounting groove of the PCB adapter plate;
when the upper cover assembly and the carrier plate assembly are pressed, the bottom surface of the upper needle plate is contacted with the upper surface of the fixing plate; the reset spring is compressed, and the test probe extends out of the chip carrier plate;
when the upper cover assembly is separated from the carrier plate assembly, the bottom surface of the upper needle plate is separated from the upper surface of the fixing plate, the reset spring resets, and the test probe is hidden in the probe hole.
2. A microneedle flotation test tool according to claim 1, wherein: the upper cover assembly includes:
an upper cover plate;
and the pressing block is arranged below the upper cover plate and fixedly connected with the upper cover plate through a plurality of first screws, and the pressing block is used for pressing the test chip when the upper cover assembly and the carrier plate assembly are pressed.
3. A microneedle flotation test tool according to claim 2, wherein: side grooves are arranged on both sides of the upper cover plate, buckles are arranged in the side grooves,
the two sides of the buckle are both provided with rotating shafts, the end parts of the rotating shafts are both connected with the side walls of the side grooves through screws of a base meter,
the inner side surfaces of the buckles are connected with the inner side surfaces of the side grooves through buckle springs.
4. A microneedle flotation test tool according to claim 3, wherein: the top ends of the buckles are provided with pressing parts, the bottom ends of the buckles are provided with clamping blocks extending towards the direction of the pressing block,
and clamping grooves matched with the clamping blocks are formed in the two sides of the bottom end of the fixing plate.
5. A microneedle flotation test tool according to any one of claims 2-4, wherein: the two sides of the bottom end of the upper cover plate are respectively provided with a first positioning pin, the pressing block is positioned between the two first positioning pins,
the positioning blocks are arranged on two sides of the top end of the fixing plate, positioning holes matched with the first positioning pins are formed in the top ends of the positioning blocks, and the upper needle plate is located between the two positioning blocks.
6. A microneedle flotation test tool according to claim 1, wherein: a plurality of carrier plate springs are arranged between the chip carrier plate and the lower needle plate,
when the upper cover assembly and the carrier plate assembly are pressed, the carrier plate spring is compressed, and the test probe extends out of the chip carrier plate;
when the upper cover assembly is separated from the carrier plate assembly, the carrier plate spring is reset, and the test probes are hidden in the probe holes of the chip carrier plate.
7. A microneedle flotation test tool according to claim 6, wherein: the upper half part of the PCB adapter plate is embedded into a second stepped hole of the upper needle plate, the opening of the first stepped hole is larger than the opening of the second stepped hole,
one opposite angle of the PCB adapter plate is connected with the fixing plate through a second screw, and the other opposite angle of the PCB adapter plate is connected with the fixing plate through a second positioning pin.
8. A microneedle flotation test tool according to claim 1, wherein: the chip carrier plate is limited on the top surface of the upper needle plate through a limiting screw, and the limiting screw is in threaded fit with the top surface of the upper needle plate;
the bottom surface of the fixed plate is provided with a plurality of step screws used for connecting the upper needle plate.
9. A test module is characterized in that: comprises a test main board, a plurality of microneedle floating test tools according to any one of claims 1-8 are arranged on the test main board, a connector interface is arranged on the bottom surface of the PCB adapter board,
the fixing plate is provided with a groove matched with the connector interface, the depth of the connector interface is slightly larger than that of the groove,
the bottom surface of the groove is embedded with a signal connecting wire, and the connector interface transmits a signal to the test mainboard through the signal connecting wire.
10. A test module according to claim 9, wherein: one opposite angle of the fixing plate is connected with the test main board through a third screw, and the other opposite angle of the fixing plate is connected with the test main board through a third positioning pin.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111342103.2A CN114152783B (en) | 2021-11-12 | 2021-11-12 | Microneedle floating test tool and test module |
| TW110149415A TWI800187B (en) | 2021-11-12 | 2021-12-29 | A microneedle floating test tool and test module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111342103.2A CN114152783B (en) | 2021-11-12 | 2021-11-12 | Microneedle floating test tool and test module |
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| CN114152783A true CN114152783A (en) | 2022-03-08 |
| CN114152783B CN114152783B (en) | 2023-06-16 |
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| CN202111342103.2A Active CN114152783B (en) | 2021-11-12 | 2021-11-12 | Microneedle floating test tool and test module |
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| TW (1) | TWI800187B (en) |
Cited By (1)
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| CN118226226A (en) * | 2024-03-27 | 2024-06-21 | 苏州韬盛电子科技有限公司 | Floating switching structure and chip testing device |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI800187B (en) | 2023-04-21 |
| CN114152783B (en) | 2023-06-16 |
| TW202319754A (en) | 2023-05-16 |
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