CN114141685B - Automatic wafer carrier and use method thereof - Google Patents
Automatic wafer carrier and use method thereof Download PDFInfo
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- CN114141685B CN114141685B CN202111430315.6A CN202111430315A CN114141685B CN 114141685 B CN114141685 B CN 114141685B CN 202111430315 A CN202111430315 A CN 202111430315A CN 114141685 B CN114141685 B CN 114141685B
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- 238000000034 method Methods 0.000 title claims abstract description 13
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 82
- 239000010703 silicon Substances 0.000 claims abstract description 82
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 81
- 230000007246 mechanism Effects 0.000 claims abstract description 29
- 238000005507 spraying Methods 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 4
- 238000012840 feeding operation Methods 0.000 claims 1
- 230000001105 regulatory effect Effects 0.000 claims 1
- 239000000725 suspension Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 87
- 238000010586 diagram Methods 0.000 description 8
- 238000001179 sorption measurement Methods 0.000 description 8
- 230000006698 induction Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 1
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
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Abstract
本申请公开了一种自动化晶圆载台及其使用方法，其中自动化晶圆载台包括：吸盘，吸盘中部开设有顶升滑孔；基座，基座上部安装有所述吸盘，基座和所述吸盘接触面中部开设有凹槽形成安装位；顶升机构，顶升机构设置于所述安装位中，所述顶升机构被配置为对硅晶圆片进行顶升，所述顶升机构包括安装板、固定板以及顶升轴，其中，安装板用于将顶升机构安装于所述安装位，固定板通过气缸的伸缩杆连接于安装板上方，顶升轴设于所述固定板上端面，所述顶升轴滑动于所述顶升滑孔在所述吸盘的工作面升降设置。本申请解决硅晶圆片为翘曲较大的形态时，普通真空吸盘吸取不牢靠的技术问题。
The present application discloses an automated wafer stage and a method for using the same, wherein the automated wafer stage comprises: a suction cup, a lifting slide hole is provided in the middle of the suction cup; a base, the suction cup is installed on the upper part of the base, and a groove is provided in the middle of the contact surface between the base and the suction cup to form a mounting position; a lifting mechanism, the lifting mechanism is arranged in the mounting position, the lifting mechanism is configured to lift the silicon wafer, the lifting mechanism comprises a mounting plate, a fixing plate and a lifting shaft, wherein the mounting plate is used to install the lifting mechanism in the mounting position, the fixing plate is connected to the top of the mounting plate through the telescopic rod of the cylinder, the lifting shaft is provided on the upper end surface of the fixing plate, and the lifting shaft slides in the lifting slide hole to be lifted and lowered on the working surface of the suction cup. The present application solves the technical problem that when the silicon wafer is in a state of large warping, the ordinary vacuum suction cup cannot suck reliably.
Description
技术领域Technical Field
本申请涉及半导体设备技术领域，尤其涉及一种自动化晶圆载台。The present application relates to the field of semiconductor equipment technology, and in particular to an automated wafer carrier.
背景技术Background Art
硅晶圆片的夹持与输送是半导体生产工艺中的一个重要环节，较大程度地影响着硅晶圆片的质量和可靠性。The clamping and transportation of silicon wafers is an important link in the semiconductor production process, which greatly affects the quality and reliability of silicon wafers.
现有技术中，主要采用接触式真空吸盘技术进行硅晶圆片的夹持与输送。即通过真空吸附将硅晶圆片下表面紧贴，然而与吸盘的直接接触易导致硅片受力不均，容易造成硅片翘曲、变形等问题，另外，存在漏气吸不紧，载台高速运动时还有飞片(产品飞出载台)安全隐患。有些产品激光加工时容易产生高温或产品微量变形，在高温较高产品易变形的情况下，吸盘高温下使用容易老化，对具有纳米级精度的芯片制造过程而言，接触式真空吸附技术更容易导致废品率的进一步增加。In the prior art, the contact vacuum suction cup technology is mainly used to clamp and transport silicon wafers. That is, the lower surface of the silicon wafer is pressed tightly by vacuum adsorption. However, direct contact with the suction cup can easily lead to uneven force on the silicon wafer, which can easily cause problems such as warping and deformation of the silicon wafer. In addition, there are air leaks and poor suction, and there are also safety hazards such as flying wafers (products flying out of the carrier) when the carrier moves at high speed. Some products are prone to high temperatures or slight deformation of products during laser processing. When the product is easily deformed at high temperatures, the suction cup is prone to aging when used at high temperatures. For chip manufacturing processes with nanometer-level precision, contact vacuum adsorption technology is more likely to lead to a further increase in the scrap rate.
发明内容Summary of the invention
为了解决现有技术的不足，本申请的主要目的在于提供一种自动化晶圆载台及其使用方法，提供一种吸附效果稳定、适用范围广泛、具有散热功能以及产品升降功能的载台。In order to address the deficiencies in the prior art, the main purpose of the present application is to provide an automated wafer carrier and a method of using the same, providing a carrier with a stable adsorption effect, a wide range of applications, a heat dissipation function, and a product lifting function.
为了达到上述目的，本申请提供了一种自动化晶圆载台，包括：In order to achieve the above-mentioned object, the present application provides an automated wafer stage, comprising:
吸盘，吸盘中部开设有顶升滑孔；Suction cup, with a lifting sliding hole in the middle of the suction cup;
基座，基座上部安装有所述吸盘，基座和所述吸盘接触面中部开设有凹槽形成安装位；A base, the suction cup is installed on the upper part of the base, and a groove is opened in the middle of the contact surface between the base and the suction cup to form a mounting position;
顶升机构，顶升机构设置于所述安装位中，所述顶升机构被配置为对硅晶圆片进行顶升，所述顶升机构包括安装板、固定板以及顶升轴，其中，A lifting mechanism is arranged in the installation position, and the lifting mechanism is configured to lift the silicon wafer. The lifting mechanism includes a mounting plate, a fixing plate and a lifting shaft, wherein:
安装板用于将顶升机构安装于所述安装位，The mounting plate is used to mount the lifting mechanism at the mounting position.
固定板通过气缸的伸缩杆连接于安装板上方，The fixing plate is connected to the top of the mounting plate through the telescopic rod of the cylinder.
顶升轴设于所述固定板上端面，所述顶升轴升降于所述吸盘的工作面，所述顶升滑孔被配置为顶升轴进行升降时的通道。The lifting shaft is arranged on the upper end surface of the fixing plate, the lifting shaft is lifted and lowered on the working surface of the suction cup, and the lifting sliding hole is configured as a channel for the lifting shaft to be lifted and lowered.
优选地，所述顶升机构还包括：Preferably, the lifting mechanism further comprises:
导向孔，导向孔开设于所述固定板；A guide hole, the guide hole is opened on the fixing plate;
导向轴，所述导向轴设置于安装板，导向轴与导向孔同轴设置，导向孔被配置为导向轴的限位轨道。The guide shaft is arranged on the mounting plate, the guide shaft and the guide hole are arranged coaxially, and the guide hole is configured as a limiting track of the guide shaft.
优选地，所述安装位包括阶梯孔，所述顶升机构通过安装板连接于所述阶梯孔。Preferably, the mounting position comprises a stepped hole, and the lifting mechanism is connected to the stepped hole via a mounting plate.
优选地，所述吸盘包括：Preferably, the suction cup comprises:
喷气口，开设于所述吸盘的工作面；An air jet port is provided on the working surface of the suction cup;
气管，气管连接于外部气源。Air pipe, the air pipe is connected to the external air source.
优选地，所述喷气口设置为环形，用于在所述硅晶圆片底部均匀喷射高压空气。Preferably, the air jet is arranged in a ring shape, and is used to uniformly spray high-pressure air at the bottom of the silicon wafer.
优选地，所述硅晶圆片和所述吸盘之间通过高压空气产生气旋从而形成负压区域，硅晶圆片通过气面悬空吸附于所述吸盘。Preferably, a cyclone is generated between the silicon wafer and the suction cup by high-pressure air to form a negative pressure area, and the silicon wafer is suspended in the air and adsorbed on the suction cup.
优选地，载台还包括：Preferably, the carrier further comprises:
驱动机，所述驱动机通过连接部连接所述基座；A driving machine, the driving machine being connected to the base via a connecting portion;
连接部，用于连接驱动机和所述基座，连接部为环状结构，所述连接部被所述驱动机带动同轴转动。The connecting part is used to connect the driving machine and the base. The connecting part is an annular structure and is driven by the driving machine to rotate coaxially.
优选地，载台还包括：Preferably, the carrier further comprises:
传感组件，设置于所述自动化晶圆载台侧部，所述传感组件包括感应片、光电开关，感应片沿连接部径向方向固定于连接部外侧，The sensor component is arranged on the side of the automated wafer stage, and the sensor component includes a sensor sheet and a photoelectric switch. The sensor sheet is fixed to the outside of the connecting part along the radial direction of the connecting part.
所述光电开关与驱动机设置于同一工作台，所述驱动机转动时，所述感应片通过连接部带动同步转动，光电开关对转动的感应片进行探测；The photoelectric switch and the driving machine are arranged on the same workbench. When the driving machine rotates, the induction sheet is driven to rotate synchronously through the connecting part, and the photoelectric switch detects the rotating induction sheet.
所述感应部末端折弯预设角度形成接触部，接触部被配置为所述光电开关对感应片的探测目标；The end of the sensing portion is bent at a preset angle to form a contact portion, and the contact portion is configured as a detection target of the photoelectric switch for the sensing sheet;
所述光电开关设置有两个，两个光电开关间隔设置于所述感应片的旋转路径上，且感应片的接触部的运动轨迹位于光电开关的信号接收区域。There are two photoelectric switches, which are arranged at intervals on the rotation path of the sensor sheet, and the movement track of the contact part of the sensor sheet is located in the signal receiving area of the photoelectric switch.
优选地，载台还包括：Preferably, the carrier further comprises:
限位块，通过感应片设置于连接部一侧；A limit block is arranged on one side of the connecting part through a sensing sheet;
限位柱，限位柱数量为两个，分别设置于两个光电开关的外侧，限位柱被配置为载台转动时对通过限位块和限位柱对载台转动范围进行限定。There are two limit columns, which are respectively arranged on the outside of the two photoelectric switches. The limit columns are configured to limit the rotation range of the platform through the limit blocks and the limit columns when the platform rotates.
一种自动化晶圆载台的使用方法，包括以下步骤：A method for using an automated wafer stage comprises the following steps:
控制顶升轴伸出吸盘工作面，通过上料操作将硅晶圆片移载于顶升轴上，Control the lifting shaft to extend out of the suction cup working surface, and transfer the silicon wafer onto the lifting shaft through the loading operation.
喷气口喷射高压空气，高压空气在硅晶圆片底部形成低压区，在硅晶圆片顶部形成高压区，调节喷气口喷出的高压空气的流速，使得硅晶圆片被稳定吸附于吸盘，顶升轴下降于吸盘工作面，硅晶圆片被气流悬浮约束于低压区和高压区之间；The air jet nozzle sprays high-pressure air, which forms a low-pressure area at the bottom of the silicon wafer and a high-pressure area at the top of the silicon wafer. The flow rate of the high-pressure air sprayed from the air jet nozzle is adjusted so that the silicon wafer is stably adsorbed on the suction cup. The lifting shaft descends to the working surface of the suction cup, and the silicon wafer is suspended and constrained by the airflow between the low-pressure area and the high-pressure area.
驱动机带动硅晶圆片转动，进行加工；The driving machine drives the silicon wafer to rotate for processing;
加工完成后，硅晶圆片通过顶升轴顶升远离吸盘工作面，控制喷气口停止喷射高压空气，通过下料操作对硅晶圆片进行下料。After the processing is completed, the silicon wafer is lifted away from the suction cup working surface by the lifting shaft, the jet nozzle is controlled to stop spraying high-pressure air, and the silicon wafer is unloaded through the unloading operation.
本申请实现的有益效果为：The beneficial effects achieved by this application are:
本申请公开了一种自动化晶圆载台及其使用方法，硅晶圆片通过吸盘产生的负压吸附于吸盘，由于吸盘在吸附时，吸盘和硅晶圆片之间在形成有气面，硅晶圆片悬空地被约束到吸盘上，因此当硅晶圆片为翘曲较大的形态时，普通真空吸盘吸取不牢靠，本申请通过负压吸附，大大提高了稳定性。The present application discloses an automated wafer carrier and a method for using the same. A silicon wafer is adsorbed to a suction cup by the negative pressure generated by the suction cup. When the suction cup is adsorbed, an air surface is formed between the suction cup and the silicon wafer. The silicon wafer is constrained to the suction cup in mid-air. Therefore, when the silicon wafer is in a shape with a large warp, an ordinary vacuum suction cup cannot adsorb it securely. The present application greatly improves stability through negative pressure adsorption.
进一步地，由于吸盘是通过喷气口产生负压来实现吸附效果的，所以吸盘在对硅晶圆片吸附的同时，还起到一定的散热效果。Furthermore, since the suction cup achieves the adsorption effect by generating negative pressure through the air jet, the suction cup can achieve a certain heat dissipation effect while adsorbing the silicon wafer.
本申请公开了一种自动化晶圆载台及其使用方法，通过在吸盘工作面设置顶升机构，实现载台上在竖直方向对硅晶圆片的升降移载，对于设备而言，节省一个取料z轴模组的成本和空间。The present application discloses an automated wafer carrier and a method for using the same. By arranging a lifting mechanism on the working surface of the suction cup, the lifting and shifting of silicon wafers on the carrier in the vertical direction is achieved. For the equipment, the cost and space of a material taking z-axis module are saved.
本申请公开了一种自动化晶圆载台及其使用方法，在载台侧部设置传感组件，包括感应片和光电开关，通过光电开关检测感应片，从而通过接通或分断控制电路，通过控制所述电路从而实现对晶圆载台工作状态的控制。The present application discloses an automated wafer stage and a method for using the same. A sensor assembly is disposed on the side of the stage, including a sensing sheet and a photoelectric switch. The sensing sheet is detected by the photoelectric switch, thereby connecting or disconnecting a control circuit. The circuit is controlled to control the working state of the wafer stage.
同时，在载台一侧设置跟随载台同步转动的限位块，以及固定在限位块转动轨迹上的两个限位柱，对载台转动范围进行硬限位。At the same time, a limit block that rotates synchronously with the platform is set on one side of the platform, and two limit columns fixed on the rotation track of the limit block are used to hard limit the rotation range of the platform.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
图1是本申请一种自动化晶圆载台的示意图；FIG1 is a schematic diagram of an automated wafer stage of the present application;
图2是本申请一种自动化晶圆载台的示意图；FIG2 is a schematic diagram of an automated wafer stage of the present application;
图3是本申请一种自动化晶圆载台的示意图；FIG3 is a schematic diagram of an automated wafer stage of the present application;
图4是图3中A-A向的剖视图；Fig. 4 is a cross-sectional view taken along the line A-A in Fig. 3;
图5是本申请一种自动化晶圆载台的爆炸图；FIG5 is an exploded view of an automated wafer stage of the present application;
图6是本申请顶升机构的示意图；FIG6 is a schematic diagram of the jacking mechanism of the present application;
图7是本申请一种自动化晶圆载台顶料状态的示意图；FIG7 is a schematic diagram of an automated wafer stage loading state of the present application;
图8是本申请一种自动化晶圆载台加工状态的示意图；FIG8 is a schematic diagram of an automated wafer stage processing state of the present application;
图9是本申请传感组件和连接部的结构示意图；FIG9 is a schematic diagram of the structure of the sensor assembly and the connecting part of the present application;
图10是本申请一种自动化晶圆载台的示意图；FIG10 is a schematic diagram of an automated wafer stage of the present application;
图中：In the figure:
10-驱动机；10- driving machine;
20-基座；20- base;
201-安装位；201-installation position;
30-吸盘；30-suction cup;
301-顶升滑孔；302-喷气口；303-气管；301-lifting sliding hole; 302-jet port; 303-trachea;
40-传感组件；40-sensing component;
401-感应片；4012-接触部；402-光电开关；403-限位块；404-连接板；405-限位柱；401-sensing sheet; 4012-contact part; 402-photoelectric switch; 403-limiting block; 404-connecting plate; 405-limiting column;
50-顶升机构；50-lifting mechanism;
501-顶升轴；502-固定板；503-伸缩杆；504-安装板；505-气缸；506-导向孔；507-导向轴；501-lifting shaft; 502-fixing plate; 503-telescopic rod; 504-mounting plate; 505-cylinder; 506-guide hole; 507-guide shaft;
60-连接部；60-connecting part;
70-硅晶圆片。70-Silicon wafer.
具体实施方式DETAILED DESCRIPTION
为使本申请的目的、技术方案和优点更加清楚，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。In order to make the purpose, technical solutions and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
如背景技术中所述，现有大部分载台对翘曲(平面度较大)较大的产品，采用普通吸附平台配合真空发生器使用时存在漏气吸不紧，载台高速运动时还有飞片(产品飞出载台)的安全隐患；有些产品激光加工时容易产生高温或产品微量变形，在高温较高产品易变形的情况下，吸盘高温下使用容易老化，普通打孔平台容易出现漏气，使用的局限性较大。为解决上述问题，本申请提供一种自动化晶圆载台，提供一种吸附效果稳定、适用范围广泛、具有散热功能以及产品升降功能的载台。As described in the background technology, most of the existing carriers have air leakage and poor suction when using ordinary adsorption platforms with vacuum generators for products with large warping (large flatness), and there is a safety hazard of flying pieces (products flying out of the carrier) when the carrier moves at high speed; some products are prone to high temperatures or slight deformation of products during laser processing. In the case of high temperature and easy deformation of products, the suction cup is prone to aging when used at high temperatures, and ordinary punching platforms are prone to air leakage, which has great limitations in use. In order to solve the above problems, the present application provides an automated wafer carrier, a carrier with stable adsorption effect, wide application range, heat dissipation function and product lifting function.
为实现上述技术效果，需要在工作台上固定安装驱动机10，驱动机10转轴上通过连接部60安装有基座20，基座20上部安装有吸盘30，吸盘30包括喷气口302和气管303，通过喷气口302开设于所述吸盘30的工作面；气管303一端连接于外部气源，一端连接于吸盘30给喷气口302提供高压空气，进一步地，喷气口302设置为环形，用于对所述硅晶圆片70底部均匀喷射高压空气，避免硅晶圆片70底部受力不均匀。In order to achieve the above technical effect, it is necessary to fix the driving machine 10 on the workbench, and the base 20 is installed on the rotating shaft of the driving machine 10 through the connecting part 60, and the suction cup 30 is installed on the upper part of the base 20. The suction cup 30 includes a jet nozzle 302 and an air pipe 303, and the jet nozzle 302 is opened on the working surface of the suction cup 30; one end of the air pipe 303 is connected to an external air source, and the other end is connected to the suction cup 30 to provide high-pressure air to the jet nozzle 302. Furthermore, the jet nozzle 302 is set to a ring shape, which is used to evenly spray high-pressure air to the bottom of the silicon wafer 70 to avoid uneven force on the bottom of the silicon wafer 70.
吸盘30采用伯努利原理，当喷气口302中喷出的气体遇到硅晶圆片70后，使自硅晶圆片70中心沿硅晶圆片70径向方向向外迅速扩散从而使得硅晶圆片70上部的气流速度低于硅晶圆片70下部的气流速度，此时硅晶圆片70底部气压小于其上部的气压，因而硅晶圆片70通过所述吸盘30形成的负压吸附。进一步地，所述硅晶圆片70和吸盘30之间的高压空气在流动时会形成气面，从而使得硅晶圆片70被吸附时，硅晶圆片70悬浮于吸盘30，当硅晶圆片70为翘曲较大的形态时，硅晶圆片70通过不接触的方式被吸盘30吸附，这样设置比普通真空吸盘吸取更加牢靠。The suction cup 30 adopts the Bernoulli principle. When the gas ejected from the air jet 302 encounters the silicon wafer 70, it quickly diffuses outward from the center of the silicon wafer 70 along the radial direction of the silicon wafer 70, so that the air flow velocity of the upper part of the silicon wafer 70 is lower than the air flow velocity of the lower part of the silicon wafer 70. At this time, the air pressure at the bottom of the silicon wafer 70 is lower than the air pressure at the upper part, so the silicon wafer 70 is sucked by the negative pressure formed by the suction cup 30. Furthermore, the high-pressure air between the silicon wafer 70 and the suction cup 30 will form an air surface when flowing, so that when the silicon wafer 70 is sucked, the silicon wafer 70 is suspended on the suction cup 30. When the silicon wafer 70 is in a state of large warping, the silicon wafer 70 is sucked by the suction cup 30 in a non-contact manner. This setting is more reliable than the suction of an ordinary vacuum suction cup.
吸盘30吸附硅晶圆片70时，当需要取料时，在垂直方向上无法将硅晶圆片70进行托起，只能通过断开高压空气的输入或者从硅晶圆片70侧部提供较大的侧向力才能将产品移动，为了解决这一技术问题，本实施例中，给吸盘30设置顶升机构50，顶升机构50设置于吸盘30下方，顶升机构50被配置为对硅晶圆片70进行顶升。When the suction cup 30 adsorbs the silicon wafer 70, when it is necessary to take the material, the silicon wafer 70 cannot be lifted in the vertical direction, and the product can only be moved by cutting off the input of high-pressure air or providing a large lateral force from the side of the silicon wafer 70. In order to solve this technical problem, in this embodiment, a lifting mechanism 50 is provided for the suction cup 30, and the lifting mechanism 50 is arranged under the suction cup 30, and the lifting mechanism 50 is configured to lift the silicon wafer 70.
本实施例中，为了防止顶升机构50干扰吸盘30吸附硅晶圆片70，将顶升机构50设置于吸盘30工作面之下，且在吸盘30安装的基座20中开设有安装位201，安装位201包括设置在基座20内部的阶梯孔，所述顶升机构50安装于所述阶梯孔内，所述顶升机构50安装于所述安装位201，所述顶升机构50还包括顶升轴501、安装板504、气缸505、固定板502、导向孔506以及导向轴507，其中，安装板504用于将顶升机构50安装于阶梯孔内；气缸505设于安装板504中部；固定板502通过气缸505的伸缩杆503升降连接于安装板504上方，固定板502上设有所述顶升轴501，吸盘30的工作面开设有顶升滑孔301，所述顶升轴501在所述顶升滑孔301中升降移动，从而顶升轴501对硅晶圆片70进行顶升。具体来讲，通过设置升降的顶升轴501，在不需要对硅晶圆片70进行顶升时，顶升轴501下降至吸盘30的工作面之下，避免顶升轴的存在对吸盘30吸附性能的干扰；当需要取料时，气缸505驱动顶升轴在垂直方向上将硅晶圆片70进行托起。In this embodiment, in order to prevent the lifting mechanism 50 from interfering with the suction cup 30 adsorbing the silicon wafer 70, the lifting mechanism 50 is arranged below the working surface of the suction cup 30, and a mounting position 201 is opened in the base 20 on which the suction cup 30 is installed. The mounting position 201 includes a stepped hole arranged inside the base 20, and the lifting mechanism 50 is installed in the stepped hole. The lifting mechanism 50 is installed in the mounting position 201, and the lifting mechanism 50 also includes a lifting shaft 501, a mounting plate 504, a cylinder 505, and a fixing plate 502. , guide hole 506 and guide shaft 507, wherein the mounting plate 504 is used to install the lifting mechanism 50 in the stepped hole; the cylinder 505 is arranged in the middle of the mounting plate 504; the fixed plate 502 is connected to the top of the mounting plate 504 by the telescopic rod 503 of the cylinder 505, and the fixing plate 502 is provided with the lifting shaft 501, and the working surface of the suction cup 30 is provided with a lifting slide hole 301, and the lifting shaft 501 moves up and down in the lifting slide hole 301, so that the lifting shaft 501 lifts the silicon wafer 70. Specifically, by setting the lifting shaft 501, when it is not necessary to lift the silicon wafer 70, the lifting shaft 501 is lowered below the working surface of the suction cup 30, so as to avoid the interference of the lifting shaft on the adsorption performance of the suction cup 30; when it is necessary to take the material, the cylinder 505 drives the lifting shaft to lift the silicon wafer 70 in the vertical direction.
本实施例中，所述导向孔506开设于所述固定板502；导向轴507设置于安装板504，其中导向轴507与导向孔506同轴设置，导向孔506被配置为导向轴507的限位轨道。当顶升机构50运行时，导向轴507通过在导向孔506滑动，可以对固定板502进行约束，防止固定板502被气缸505推动时产生转动，避免顶升轴501与顶升滑孔301发生错位。In this embodiment, the guide hole 506 is provided in the fixing plate 502; the guide shaft 507 is provided on the mounting plate 504, wherein the guide shaft 507 is coaxially provided with the guide hole 506, and the guide hole 506 is configured as a limiting track of the guide shaft 507. When the lifting mechanism 50 is in operation, the guide shaft 507 can constrain the fixing plate 502 by sliding in the guide hole 506, thereby preventing the fixing plate 502 from rotating when being pushed by the cylinder 505, and avoiding misalignment between the lifting shaft 501 and the lifting sliding hole 301.
本实施例中，为了便于控制电路，需要对载台状态进行监测，本实施例通过设置传感组件40对载台的运动状态进行监控，其中传感组件40设置于载台侧部，所述传感组件40包括感应片401和光电开关402，感应片401沿连接部径向方向固定于连接部60外侧，所述光电开关402对所述感应片401进行探测，具体地，光电开关402与所述驱动机10设置于同一工作台，所述驱动机10转动时，所述感应片401同步转动，固定在机台的光电开关402上对转动的感应片401进行检测，当感应片401转动到光电开关402的感应区域时，将载台的位置信息反馈给软件来控制驱动机需要纠偏的角度。In this embodiment, in order to facilitate the control of the circuit, it is necessary to monitor the state of the carrier. In this embodiment, a sensor component 40 is set to monitor the movement state of the carrier, wherein the sensor component 40 is set on the side of the carrier, and the sensor component 40 includes a sensor sheet 401 and a photoelectric switch 402. The sensor sheet 401 is fixed to the outside of the connecting portion 60 along the radial direction of the connecting portion, and the photoelectric switch 402 detects the sensor sheet 401. Specifically, the photoelectric switch 402 and the driving machine 10 are set on the same workbench. When the driving machine 10 rotates, the sensor sheet 401 rotates synchronously. The photoelectric switch 402 fixed on the machine detects the rotating sensor sheet 401. When the sensor sheet 401 rotates to the sensing area of the photoelectric switch 402, the position information of the carrier is fed back to the software to control the angle that the driving machine needs to correct.
进一步地，连接部60为环状结构，所述连接部60与所述驱动机10的转动部同轴连接，在载台运行时，感应片401和限位块403跟随载台同轴转动，也就是说，载台运行时，感应片401和限位块403之间相对静止地跟随载台同步运转。Furthermore, the connecting part 60 is an annular structure, and the connecting part 60 is coaxially connected to the rotating part of the driving machine 10. When the platform is running, the sensing piece 401 and the limit block 403 rotate coaxially with the platform. That is to say, when the platform is running, the sensing piece 401 and the limit block 403 are relatively stationary and run synchronously with the platform.
本实施例中，载台还包括限位块403和限位柱405，限位块通过感应片设置于连接部60一侧，限位柱405数量为两个，分别设置于两个光电开关402的外侧，限位柱405被配置为载台转动时对通过限位块403和限位柱405对载台转动范围进行限定。具体来讲，限位块403通过连接部60被载台带动同步转动，限位柱405固定于限位块403的转动轨迹上使得载台只能在两个限位柱405之间的限制范围进行转动，优选地，限位柱405为优力胶材质的圆柱，所述限位块403撞击到两根限位柱405上时没有过大的异响并起到一定缓冲作用。感应片401还包括接触部4012，所述感应片401末端折弯预设角度形成接触部4012，本事实例中，优选折弯角度为90°，接触部4012被折弯至水平位置，且在跟随载台转动时，接触部4012的转动轨迹位于光电开关402的感应区域，接触部4012被配置为所述光电开关402对感应片401的探测目标，从而通过反馈数据实现对载台运动状态的检测，从而在对所述硅晶圆片70进行加工时，根据载台运动状态对加工设备进行控制。当载台转动到一定角度时限位柱405通过限位块403对载台进行限位，使载台停转，此时感应片401转动于光电开关402的感应区域，读取驱动机编码器程序反馈到软件上记录，通过编码记录的位置，来控制驱动机需要纠偏的角度。In this embodiment, the platform further includes a limit block 403 and a limit column 405. The limit block is arranged on one side of the connection part 60 through the induction sheet. There are two limit columns 405, which are arranged on the outside of the two photoelectric switches 402 respectively. The limit column 405 is configured to limit the rotation range of the platform through the limit block 403 and the limit column 405 when the platform rotates. Specifically, the limit block 403 is driven by the platform to rotate synchronously through the connection part 60, and the limit column 405 is fixed on the rotation trajectory of the limit block 403 so that the platform can only rotate within the limited range between the two limit columns 405. Preferably, the limit column 405 is a cylinder made of urethane foam. When the limit block 403 hits the two limit columns 405, there is no excessive abnormal sound and it plays a certain buffering role. The induction sheet 401 also includes a contact portion 4012. The end of the induction sheet 401 is bent at a preset angle to form the contact portion 4012. In this example, the preferred bending angle is 90°. The contact portion 4012 is bent to a horizontal position, and when following the rotation of the carrier, the rotation trajectory of the contact portion 4012 is located in the sensing area of the photoelectric switch 402. The contact portion 4012 is configured as the detection target of the photoelectric switch 402 for the induction sheet 401, so that the detection of the motion state of the carrier is realized through feedback data, so that when the silicon wafer 70 is processed, the processing equipment is controlled according to the motion state of the carrier. When the carrier rotates to a certain angle, the limit column 405 limits the carrier through the limit block 403 to stop the carrier. At this time, the induction sheet 401 rotates to the sensing area of the photoelectric switch 402, and the encoder program of the driver is read and fed back to the software for recording. The angle that the driver needs to correct is controlled by the position of the encoding record.
在一个实施方案中，进行激光剥离操作时，载台上方设置的加工设备为激光源，对硅晶圆片70照射激光剥离时，激光源需要根据工艺对照射硅晶圆片70的激光进行调节，也就是说，在载台带动硅晶圆片70旋转时，通过传感组件检测载台运动状态，如载台启停和载台转速，激光对硅晶圆片70进行照射剥离时，当载台被限位块和限位柱限位时，感应片401位于光电开关402的感应区域，读取驱动机编码器程序反馈到软件上记录，通过编码记录的位置，来控制驱动机需要纠偏的角度或者回零复位，相应地激光源的控制程序能根据预设加工工艺对激光源的输出功率进行控制，从而在载台的不同转速时通过激光源输出不同功率的激光而对硅晶圆片70进行加工。In one embodiment, when performing a laser stripping operation, the processing equipment arranged above the stage is a laser source. When the silicon wafer 70 is irradiated with laser stripping, the laser source needs to adjust the laser irradiating the silicon wafer 70 according to the process. That is to say, when the stage drives the silicon wafer 70 to rotate, the movement state of the stage is detected by the sensor component, such as the start and stop of the stage and the speed of the stage. When the laser irradiates and strips the silicon wafer 70, when the stage is limited by the limit block and the limit column, the sensor sheet 401 is located in the sensing area of the photoelectric switch 402, and the encoder program of the driver is read and fed back to the software for recording. The position of the encoded record is used to control the angle that the driver needs to correct or return to zero. Accordingly, the control program of the laser source can control the output power of the laser source according to the preset processing technology, so that the silicon wafer 70 is processed by the laser source outputting lasers of different powers at different speeds of the stage.
进一步地，为了控制电路接通或分断，所述光电开关402被配置为探测所述感应片401的运动，优选地，本事实例采用限位光电开关，所述接触部4012设于感应片401的末端，所述感应片401被基座20带动的旋转路径上设置限位光电开关，限位光电开关的感应区域为所述接触部4012的运动路径，也就是说，当感应片401转动时，接触部4012在限位光电开关的感应区域内运动。Furthermore, in order to control the connection or disconnection of the circuit, the photoelectric switch 402 is configured to detect the movement of the sensing sheet 401. Preferably, the present example adopts a limit photoelectric switch, and the contact portion 4012 is arranged at the end of the sensing sheet 401. The limit photoelectric switch is arranged on the rotation path of the sensing sheet 401 driven by the base 20. The sensing area of the limit photoelectric switch is the movement path of the contact portion 4012. That is to say, when the sensing sheet 401 rotates, the contact portion 4012 moves within the sensing area of the limit photoelectric switch.
本实施例中，所述限位光电开关通过连接板404安装于机台，且安装于连接板404远离所述载台的一侧面，便于在感应片401转动时，限位光电开关对所述感应片401的接触部4012进行探测。本实施例中，光电开关402设置有两个，两个光电开关402间隔设置于所述感应片401旋转路径上。通过限位光电开关对接触部4012检测，从而通过预设程序控制电路，最终实现生产制造中，其他工序和自动化晶圆载台的协同控制。In this embodiment, the limit photoelectric switch is installed on the machine platform through the connecting plate 404, and is installed on a side of the connecting plate 404 away from the carrier, so that when the sensor sheet 401 rotates, the limit photoelectric switch detects the contact portion 4012 of the sensor sheet 401. In this embodiment, two photoelectric switches 402 are provided, and the two photoelectric switches 402 are arranged at intervals on the rotation path of the sensor sheet 401. The contact portion 4012 is detected by the limit photoelectric switch, so that the circuit is controlled by the preset program, and finally the coordinated control of other processes and the automated wafer carrier in the production and manufacturing is realized.
本实施例在具体操作时，一种自动化晶圆载台的使用方法，包括以下步骤：In the specific operation of this embodiment, a method for using an automated wafer stage includes the following steps:
控制顶升轴501伸出吸盘30工作面，通过上料操作将硅晶圆片70移载于顶升轴501上；Control the lifting shaft 501 to extend out of the working surface of the suction cup 30, and transfer the silicon wafer 70 onto the lifting shaft 501 through the loading operation;
喷气口302喷射高压空气，高压空气自圆盘中心沿硅晶圆片70径向外迅速扩散从而使得硅晶圆片70上部的气流速度在低于其下部，根据伯努利原理可知，此时硅晶圆片70底部气压小于其上部的气压，从而硅晶圆片70底部形成低压区，在硅晶圆片70顶部形成高压区，调节喷气口302喷出的高压空气的流速，使得硅晶圆片70被稳定吸附于吸盘30，顶升轴501下降于吸盘30工作面，硅晶圆片70被气流悬浮约束于低压区和高压区之间；The air jet 302 sprays high-pressure air, which quickly diffuses outward from the center of the disk along the radial direction of the silicon wafer 70, so that the air flow velocity at the upper part of the silicon wafer 70 is lower than that at the lower part. According to the Bernoulli principle, at this time, the air pressure at the bottom of the silicon wafer 70 is lower than the air pressure at the upper part, so that a low-pressure area is formed at the bottom of the silicon wafer 70 and a high-pressure area is formed at the top of the silicon wafer 70. The flow rate of the high-pressure air sprayed from the air jet 302 is adjusted so that the silicon wafer 70 is stably adsorbed on the suction cup 30, and the lifting shaft 501 descends to the working surface of the suction cup 30, and the silicon wafer 70 is suspended and constrained by the air flow between the low-pressure area and the high-pressure area;
驱动机10带动硅晶圆片70转动，同时，加工设备对硅晶圆片70进行加工；The driving machine 10 drives the silicon wafer 70 to rotate, and at the same time, the processing equipment processes the silicon wafer 70;
加工完成后，硅晶圆片70通过顶升轴501顶升远离吸盘30工作面，同时控制喷气口302停止喷射高压空气，通过下料操作对硅晶圆片70进行下料，硅晶圆片70从顶升轴501上移载离开，并将下料的硅晶圆片70放置于指定位置。After the processing is completed, the silicon wafer 70 is lifted away from the working surface of the suction cup 30 by the lifting shaft 501, and the nozzle 302 is controlled to stop spraying high-pressure air. The silicon wafer 70 is unloaded through the unloading operation, and the silicon wafer 70 is moved away from the lifting shaft 501, and the unloaded silicon wafer 70 is placed at a designated position.
以上所述仅为本申请的较佳实施例，并不用以限制本申请，凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.
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| CN114619308B (en) * | 2022-03-29 | 2023-05-16 | 杭州众硅电子科技有限公司 | Wafer polishing system, loading method and using method thereof |
| CN114864470B (en) * | 2022-04-27 | 2024-11-15 | 苏州科韵激光科技有限公司 | A fixed carrier for wafer |
| CN115569949B (en) * | 2022-09-29 | 2025-03-18 | 深圳众深科技有限公司 | Automatic wiping method and automatic wiping system for lens workpiece |
| CN117226319B (en) * | 2023-11-16 | 2024-01-23 | 镭神泰克科技(苏州)有限公司 | Material carrying device, precise marking equipment and marking method |
| CN119517833A (en) * | 2025-01-21 | 2025-02-25 | 苏州芯慧联半导体科技有限公司 | Wafer adsorption device based on Bernoulli chuck |
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