CN114131212A - Laser modification cutting and automatic separation method for transparent material closed solid structure - Google Patents
Laser modification cutting and automatic separation method for transparent material closed solid structure Download PDFInfo
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- CN114131212A CN114131212A CN202111326854.5A CN202111326854A CN114131212A CN 114131212 A CN114131212 A CN 114131212A CN 202111326854 A CN202111326854 A CN 202111326854A CN 114131212 A CN114131212 A CN 114131212A
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- 239000012780 transparent material Substances 0.000 title claims abstract description 40
- 238000005520 cutting process Methods 0.000 title claims abstract description 39
- 238000000926 separation method Methods 0.000 title claims abstract description 24
- 239000007787 solid Substances 0.000 title claims abstract description 17
- 238000012986 modification Methods 0.000 title abstract description 15
- 230000004048 modification Effects 0.000 title abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 44
- 239000000463 material Substances 0.000 abstract description 39
- 230000006378 damage Effects 0.000 abstract description 7
- 239000011521 glass Substances 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 8
- 238000012876 topography Methods 0.000 description 5
- 230000001788 irregular Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention provides a laser modification cutting and automatic separation method of a transparent material closed solid structure, which comprises the following steps: a plurality of guide lines are arranged outside the closed figure outline, one end of each guide line is positioned on the closed figure outline, and the other end of each guide line is positioned on a boundary line of the transparent material to be processed; processing a closed figure outline and a guide line on a transparent material to be processed through a Bessel beam; the closed figure profile and the guiding lines are irradiated by a gaussian beam. According to the invention, the appointed closed graph is scanned by focused ultrafast laser, and then the irradiation is carried out along the modification path by continuous laser or ultra-pulse laser, so that the automatic separation of the transparent brittle material can be realized, no additional mechanical stress is introduced, uncontrollable cracks and surface damage in the traditional cutting method are avoided, the cutting section is vertical to the upper surface and the lower surface, and beveling or step structure introduction is not required.
Description
Technical Field
The invention relates to the field of laser processing of transparent brittle materials, in particular to a method for laser modification cutting and automatic separation of a transparent material closed solid structure.
Background
The laser cutting technology is a precision processing technology which has no contact, small thermal damage and flexible processing, and is the best choice for processing transparent materials. The ultrafast laser has the characteristics of extremely short pulse and extremely high peak power, so that a heat affected zone can be reduced, and the cutting precision is improved.
When the ultra-fast laser is used for cutting glass, the extremely high peak power density of the ultra-fast laser can cause strong nonlinear absorption, the material near the focus is modified, and the modified region extends along the laser scanning direction, so that the glass can be broken along the modified section. The transparent brittle material with the ultrafast laser modification cutting thickness of 0.1-10mm can obtain better cutting quality, but the material can be separated along the laser modification section by applying external force. The method causes a complex processing process, is limited by a cutting processing pattern, is only suitable for processing an open pattern such as scribing, dividing and the like, and cannot realize cutting of a closed pattern.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a laser modification cutting and automatic separation method of a transparent material closed solid structure, wherein a plurality of guide lines are arranged outside the outline of a closed graph, a specified closed graph is scanned by focused ultrafast laser, and then continuous laser or pulse laser is irradiated along a modification path, so that the automatic separation of the transparent brittle material can be realized, no additional mechanical stress is introduced, uncontrollable cracks and surface damage in the traditional cutting method are avoided, the cutting section is vertical to the upper surface and the lower surface, and beveling or step structure introduction is not required.
The present invention achieves the above-described object by the following technical means.
A method for laser modification cutting and automatic separation of a transparent material closed solid structure comprises the following steps:
a plurality of guide lines are arranged outside the closed figure outline, one end of each guide line is positioned on the closed figure outline, and the other end of each guide line is positioned on a boundary line of the transparent material to be processed;
processing a closed figure outline and a guide line on a transparent material to be processed through a Bessel beam;
the closed figure profile and the guiding lines are irradiated by a gaussian beam.
Further, the guide line is a straight line or a curved line; the guide lines are parallel to each other or cross each other.
Further, one of the guide lines intersects at most 2 boundary lines of the transparent material to be processed.
Further, one of said guide lines is tangent to the closed figure contour and the other of said guide lines is tangent to the closed figure contour, the two guide lines intersecting at a tangent point.
Further, the Bessel beam focus is focused on the lower surface of the transparent material to be processed, and the transparent material is processed in a feeding mode from bottom to top.
The invention has the beneficial effects that:
1. the laser modification cutting and automatic separation method of the transparent material closed solid structure is characterized in that a plurality of guide lines are arranged outside the outline of the closed graph, the appointed closed graph is scanned by focused ultrafast laser, and then continuous laser or super pulse laser is irradiated along a modification path, so that the automatic separation of the transparent brittle material can be realized, no additional mechanical stress is introduced, uncontrollable cracks and surface damage in the traditional cutting method are avoided, the cutting section is vertical to the upper surface and the lower surface, and beveling or step structure introduction is not needed.
2. The method for laser modification cutting and automatic separation of the transparent material closed solid structure not only greatly simplifies the working procedures and improves the cutting processing efficiency of the transparent brittle material, but also is not limited by the position and the size of a cutting processing graph, can be used for obtaining target elements of a closed pattern solid structure, has no limitation on the size and the material thickness of the processing graph, can cut large-size graphs and realize automatic separation, and can also cut graphs with the diameter of 1mm and realize automatic separation; the cutting device can be used for cutting glass materials with the thickness of 10mm, and can also be used for cutting glass materials with the thickness of less than 1 mm. The method is suitable for automatically separating and cutting closed graphs of transparent brittle materials with different thermal expansion coefficients, such as quartz, glass, sapphire and the like, the cutting surface has higher flatness and smaller roughness, and the cutting section is vertical to the upper surface and the lower surface of the material. In the continuous laser or long pulse laser irradiation process, any auxiliary heating heat conducting element is not needed, the laser can irradiate along any shape, the flexibility is good, and the automation degree is high.
Drawings
Figure 1 is a plan view of a guide wire according to the present invention.
FIG. 2 is a microscopic topography of the upper surface of the material after being automatically separated by the processing method of the present invention.
FIG. 3 is a microscopic topography of the lower surface of the material after being automatically separated by the processing method of the present invention.
FIG. 4 is a micro-topography of the distribution of laser modified micropores on the surface of a material.
FIG. 5 is a view of the microscopic profile and edge profile of the longitudinal section of the laser modified material.
Fig. 6 is a flow chart of the laser modified cutting and automatic separation method for the transparent material closed solid structure according to the present invention.
Figure 7 is a schematic plan view of a guide wire according to embodiment 1 of the present invention.
Figure 8 is a schematic plan view of a guide wire according to embodiment 2 of the present invention.
Figure 9 is a schematic plan view of a guide wire according to embodiment 3 of the present invention.
Figure 10 is a schematic plan view of a guide wire according to embodiment 4 of the present invention.
Figure 11 is a schematic plan view of a guide wire according to embodiment 5 of the present invention.
Figure 12 is a schematic plan view of a guide wire according to embodiment 6 of the present invention.
Figure 13 is a schematic plan view of a guide wire according to embodiment 7 of the present invention.
Figure 14 is a schematic plan view of a guide wire according to embodiment 8 of the present invention.
Figure 15 is a schematic plan view of a guide wire according to example 9 of the present invention.
In the figure:
1-closed figure; 2-a guide wire; 3-closed figure outline.
Detailed Description
The invention will be further described with reference to the following figures and specific examples, but the scope of the invention is not limited thereto.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "axial," "radial," "vertical," "horizontal," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present invention and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
As shown in fig. 1 and fig. 6, the method for laser-modified cutting and automatic separation of a closed solid structure made of transparent material according to the present invention comprises the following steps:
a plurality of guide lines 2 are arranged outside the closed figure outline 3, one ends of the guide lines 2 are positioned on the closed figure outline 3, and the other ends of the guide lines 2 are positioned on a boundary line of the transparent material to be processed;
processing a closed figure profile 3 and a guide line 2 on a transparent material to be processed by a Bessel beam;
the closed figure profile 3 and the guideline 2 are irradiated by a gaussian beam.
In the case of the example 1, the following examples are given,
fig. 6 shows a method for laser modified cutting and automatic separation of a closed solid structure made of transparent material, which specifically includes the following steps:
the method comprises the following steps: as shown in fig. 7, the closed figure in example 1 is circular, 4 symmetrical tangent points are selected on the circular closed figure outline 3, each tangent point is provided with 2 guide lines 2, and the closed figure outline 3 is provided with 8 guide lines 2. One end of the guide line 2 is a tangent point of the closed figure outline 3, and the other end of the guide line 2 is positioned on a boundary line of the transparent material to be processed;
step two: the surface of the ultra-white glass is cleaned by using absolute ethyl alcohol, and the cleaned ultra-white glass is placed on a two-dimensional moving platform and is fixed in position.
Step three: and moving the two-dimensional platform, and accurately positioning the cutting graph boundary by combining the CCD image.
Step four: after the positioning is finished, setting processing parameters: the linear cutting speed and the curve cutting speed are respectively 80mm/s and 50mm/s, the laser power is 21W, the repetition frequency is 100kHz, the laser wavelength is 1064nm, the laser pulse width is 10ps, the number of processing layers is 6, and the distance between every two layers is 0.5 mm; the focus of the Bessel beam is ensured to be focused on the lower surface of the ultra-white glass, and a feeding mode from bottom to top is adopted. Wherein, a focusing objective lens of 10 times is used, the focal depth of the focused Bessel light beam can reach 3mm, the light spot can reach 3 mu m, and the light beam quality is good. The bessel beam is machined along a path.
Step five: removing the ultra-white glass, and placing it in CO2CO is arranged below the laser2Processing parameters of the laser: the scanning speed was 100mm/s, the power was 48W, the repetition frequency was 100kHz, and the pulse width was 10. mu.s. By CO2The closed figure outline 3 and the guide line 2 are irradiated by the Gaussian beam generated by the laser, and the sheet is split after irradiation by adopting single-side or front-back-side irradiation according to the thickness of the glass.
The present invention divides the ultra-white glass into a target element, i.e., a cut closed figure 1, and a surrounding element, i.e., other parts except the closed figure 1, by introducing a guide line 2. The target element and the surrounding elements are separated from each other by releasing the stress through the guide line 2, so that very high edge quality can be obtained, and the section of the disassembled target element has high verticality and small roughness. When Bessel beam machining is carried out, compressive stress is generated at the laser spot, tensile stress is generated around the laser spot, due to the irradiation of the laser, the compressive stress is generated on the surface of the material, the tensile stress is generated inside the material, so that the target element is separated from the surrounding elements along the contour line and the filamentous damage part arranged adjacent to the guide line 2, and finally, the whole material is separated into the target element and the surrounding elements by the contour line of the target element and the guide line 2. After the introduction of the filamentary damages arranged adjacently along the guideline 2 and the contour of the target element in the direction of the whole thickness of the material, continuous or long pulsed laser radiation with a significant heating effect is scanned along the contour of the target element and the guideline 2 at the surface of the material, so that local tensile stresses are generated along both sides of the contour of the target element and the guideline 2, in order to cause cracks between adjacent filamentary damages and to form cracks throughout the whole thickness.
Fig. 2 and 3 show the micro-topography of the edge of the material after automatic separation, and fig. 4 shows the micro-topography of the distribution of micropores formed after ultrafast laser modification on the surface of the material. It can be seen from fig. 2 and 3 that the cut quality of the edges of the upper and lower surfaces of the separated material is good, there is almost no edge breakage, and the verticality in the thickness direction is good. It can be seen from fig. 5 that the micropores are distributed relatively uniformly over the surface of the material.
The guide wire 2 introduced according to the invention is not limited by the thermal expansion coefficient of the material. The irradiation heating mode of the invention is different from the traditional heating mode, and does not need to use heating plate elements to heat the material in a large area, and the traditional heating mode not only needs higher heating temperature but also is easy to damage the surface of the material. The invention adopts a linear heating mode, only the closed figure outline and the guide line 2 need to be irradiated, and the surface quality of the separated target element is higher. In particular for materials with a low coefficient of thermal expansion, it is also possible to generate a tensile stress high enough to cause the materials to separate from each other along the guide wire 2. Before the separation, the guide line 2 is irradiated to generate a tensile stress, the peripheral elements having a common side are separated from each other, and then the common side between the peripheral elements and the target element is irradiated again to generate a tensile stress, and the peripheral elements and the target element are separated from each other.
When the transparent brittle material is modified by laser, the target element at the laser focus is modified to expand and become larger in volume, the surrounding material is not modified, and the volume is not changed, so that the target element is extruded by the target element, and conversely, the target element material is extruded by the surrounding material and is difficult to separate from the surrounding material. After the guide line extending to the edge of the material is arranged, the residual stress of the material can be gradually released from the inner part of the material to the end of the guide line until the residual stress is completely eliminated, and the squeezing effect around the target element is eliminated, so that sufficient space is left for the separation of the target element and the surrounding elements.
Example 2:
the method specifically comprises the following steps:
the method comprises the following steps: as shown in fig. 8, in embodiment 2, the closed figure is circular, 4 guide lines 2 are arranged on a circular closed figure outline 3, one end of one guide line 2 is on the closed figure outline 3, and the other end of the guide line 2 is located on a boundary line of the transparent material to be processed; adjacent guide wires 2 are perpendicular to each other.
The rest of the procedure was the same as in example 1.
Example 3:
the method specifically comprises the following steps:
the method comprises the following steps: as shown in fig. 9, the closed figure in embodiment 3 is a square, 2 guide lines 2 are provided at each end point on the closed figure outline 3 of the square, and 8 guide lines 2 are provided on the closed figure outline 3 in total. Taking an end point as an example, one end of one guide line 2 is on the end point of the closed figure outline 3, and the other end of the guide line 2 is positioned on the boundary line of the transparent material to be processed; one end of the other guide line 2 is an end point of the closed figure outline 3, and the other end of the guide line 2 is positioned on a boundary line of the transparent material to be processed; the two guide lines 2 are perpendicular to each other.
The rest of the procedure was the same as in example 1.
Example 4:
the method specifically comprises the following steps:
the method comprises the following steps: as shown in fig. 10, in the embodiment 4, the closed figure is a square, 1 guide line 2 is arranged at the midpoint of each side on the closed figure outline 3 of the square, and 4 guide lines 2 are arranged on the closed figure outline 3 in total. One end of the guide line 2 is the midpoint of one side of the closed figure outline 3, and the other end of the guide line 2 is positioned on the boundary line of the transparent material to be processed; the guideline 2 is perpendicular to the side of the midpoint.
The rest of the procedure was the same as in example 1.
Example 5:
the method specifically comprises the following steps:
the method comprises the following steps: as shown in fig. 11, in the embodiment 5, the closed figure is a square, 1 guide line 2 is arranged at each end point on the closed figure outline 3 of the square, and 4 guide lines 2 are arranged on the closed figure outline 3 in total. One end of the guide line 2 is an end point of the closed figure outline 3, and the other end of the guide line 2 is positioned on a boundary line of the transparent material to be processed; the guide line 2 is collinear with the diagonal of the end point.
The rest of the procedure was the same as in example 1.
Example 6:
the method specifically comprises the following steps:
the method comprises the following steps: as shown in fig. 12, the closed figure in example 6 is a triangle, 2 guide lines 2 are provided at each end point on the triangular closed figure outline 3, and 6 guide lines 2 are provided in total on the closed figure outline 3. Taking an end point as an example, one end of one guide line 2 is on the end point of the closed figure outline 3, and the other end of the guide line 2 is positioned on the boundary line of the transparent material to be processed; one of the guide lines 2 is collinear with one adjacent side corresponding to the end point, and the other guide line 2 is collinear with the other adjacent side corresponding to the end point.
The rest of the procedure was the same as in example 1.
Example 7:
the method specifically comprises the following steps:
the method comprises the following steps: as shown in fig. 13, the closed figure in example 7 is triangular, 1 guide line 2 is provided at each end point on the triangular closed figure outline 3, and 3 guide lines 2 are provided in total on the closed figure outline 3. Taking an end point as an example, one end of one guide line 2 is on the end point of the closed figure outline 3, and the other end of the guide line 2 is positioned on the boundary line of the transparent material to be processed and is perpendicular to the boundary line;
the rest of the procedure was the same as in example 1.
Example 8:
the method specifically comprises the following steps:
the method comprises the following steps: as shown in fig. 14, the closed figure in example 8 is an irregular closed figure, 4 tangent points are selected on an irregular closed figure contour 3, each tangent point is provided with 2 guide lines 2, and 8 guide lines 2 are provided on the closed figure contour 3 in total. One end of the guide line 2 is a tangent point of the closed figure outline 3, and the other end of the guide line 2 is positioned on a boundary line of the transparent material to be processed;
the rest of the procedure was the same as in example 1.
Example 9:
the method specifically comprises the following steps:
the method comprises the following steps: as shown in fig. 15, the closed figure in example 5 is an irregular closed figure, 4 points are selected on an irregular closed figure contour 3, each point is provided with 1 guide line 2, and 4 guide lines 2 are provided on the closed figure contour 3 in total. One end of the guide line 2 is positioned on the closed figure outline 3, and the other end of the guide line 2 is positioned on a boundary line of the transparent material to be processed; two adjacent guide lines 2 are perpendicular to each other.
The rest of the procedure was the same as in example 1.
It should be understood that although the present description has been described in terms of various embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and those skilled in the art will recognize that the embodiments described herein may be combined as suitable to form other embodiments, as will be appreciated by those skilled in the art.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.
Claims (5)
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| CN202111326854.5A CN114131212A (en) | 2021-11-10 | 2021-11-10 | Laser modification cutting and automatic separation method for transparent material closed solid structure |
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| CN202111326854.5A CN114131212A (en) | 2021-11-10 | 2021-11-10 | Laser modification cutting and automatic separation method for transparent material closed solid structure |
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