CN114126242B - 3D printing conformal circuit preparation method - Google Patents

Abstract

The application provides a 3D printing conformal circuit preparation method, which solves the technical problem that the service life of the conventional conformal circuit is short; the method comprises the following steps: (1) coating the surface of the substrate with an insulating material to form a first insulating layer; (2) printing ink on the conductive layer and adding the ink into the inner-layer nozzle; adding the bonding layer printing ink into the outer layer nozzle; setting a 3D printing program and printing parameters, and printing to form a conducting layer and a bonding layer outside the insulating material, wherein the bonding layer wraps the outer surface of the conducting layer; the inner layer nozzle and the outer layer nozzle are formed by separating an inner arc clapboard of the printer nozzle, and the cross sectional area of the inner layer nozzle is smaller than that of the outer layer nozzle; (3) and printing ink on the insulating layer into a printer nozzle, and printing a second insulating layer outside the bonding layer to obtain the 3D printed conformal circuit. The method is widely applied to the technical field of circuit manufacturing.

Description

A kind of 3D printing conformal circuit preparation method

technical field

The present application relates to a conformal circuit, and more particularly, to a method for preparing a 3D printed conformal circuit.

Background technique

The circuit board is an important electronic component, a support body for electronic components, and an important carrier for the electrical connection of electronic components. Almost all electronic devices are inseparable from circuit boards, from electronic watches, general-purpose computers, televisions, to supercomputers, communication equipment, military weapon systems, etc., only electronic components such as integrated circuits are used for electrical interconnection between them. circuit board.

The traditional integrated circuit chip processing or the common circuit board manufacturing technology in various electronic equipment is copper foil etching method. The pattern is obtained by chemical etching; if it is a double-layer or multi-layer circuit board, hole metallization and electroplating are required to realize interlayer circuit interconnection. Therefore, the traditional circuit board manufacturing process is complicated and has many processes, consumes a lot of water and electricity, and generates a lot of waste water and pollutants.

Due to its wide range of applications, conformal circuits are also required to be used in many extreme environments. Therefore, an important factor to realize its commercialization is its lifespan. The lifespan of conformal circuits depends not only on materials and processes, but also on packaging. Encapsulation not only protects the conformal circuit at the physical level, but more importantly, prevents the erosion of the conformal circuit by water, oxygen and corrosive liquids in the external environment.

3D printing is a contact-free, pressure-free and plate-less print reproduction technology that features plateless digital printing and simplifies the manufacturing process. 3D printing can also avoid the problem of wasting more than 95% of materials like lithography in the use of materials, and the area printed by printing is equivalent to the area used. From a long-term development perspective, printing methods will be more than traditional. The cost of photolithography is much lower. From the overall development direction, 3D printing technology will become a new force in PCB industrial production, which will have an important impact on the innovation of PCB production technology. 3D printed circuit boards can realize the rapid design and processing of complex three-dimensional microstructures, and can quickly change graphics through a software-based printing control system.

SUMMARY OF THE INVENTION

In order to solve the above problems, the technical solution adopted in this application is to provide a method for preparing a 3D printing conformal circuit, including:

(1) Coat the base surface with insulating material;

(2) Add the conductive layer printing ink to the inner nozzle, and add the adhesive layer printing ink to the outer nozzle; set the 3D printing program and printing parameters, and print the conductive layer and the adhesive layer outside the insulating material, and the adhesive layer is wrapped the outer surface of the conductive layer;

The inner layer nozzle and the outer layer nozzle are separated by the inner arc partition of the printer nozzle, and the cross-sectional area of the inner layer nozzle is smaller than that of the outer layer nozzle;

(3) The insulating layer printing ink is added to the printer nozzle, and the second insulating layer is printed outside the adhesive layer to obtain a 3D printed conformal circuit.

Preferably, in step (1), the insulating material to form the first insulating layer is mainly composed of the following components by weight: 3-8 parts of epoxy resin, 2-8 parts of phenolic resin, 3-8 parts of nitrile latex, 1-3 parts of vinylpyrrolidone and 3-8 parts of polyethylene glycol are dissolved in an acetone solution.

Preferably, in step (2), the conductive layer printing ink is mainly composed of the following components in parts by weight: 5-10 parts of graphene oxide, 10-20 parts of graphene, 5-10 parts of carbon nanotubes, and 10-10 parts of nano-silver 20 parts, 10-20 parts of nano-copper, 1-3 parts of polyvinylpyrrolidone, and 1-3 parts of polyacrylate are added to the aqueous solution to dissolve.

Preferably, in step (2), the adhesive layer printing ink is mainly composed of the following components in parts by weight: 5-10 parts of polybutylene succinate, 5-10 parts of polyethylene succinate, 10-20 parts of polycaprolactone and 1-5 parts of polyethylene glycol are added to dichloromethane and dissolved.

Preferably, in step (3), the insulating layer printing ink is mainly composed of the following components by weight: 5-10 parts of epoxy resin, 5-10 parts of phenolic resin, 5-10 parts of nitrile latex, 5-10 parts of polyvinylpyrrolidone -10 parts and 5-10 parts of polyethylene glycol are dissolved in acetone solution.

Preferably, the insulating material, the conductive layer printing ink, the adhesive layer printing ink and the insulating layer printing ink all have a viscosity of ≥1000 cps.

Preferably, in step (2), the width of the inner layer nozzle is 50-150 μm, and the width of the outer layer nozzle is 150-250 μm.

Preferably, in step (1), the 3D printing program and printing parameters are set as follows: first, a 3D model of the printing substrate is established by CT scanning, then a specific path of the printing circuit is established on the surface of the 3D model, a code file is formed according to the printing path, and finally Import the code file into the printer software.

The beneficial effect of the present invention is that the conformal circuit is prepared by 3D printing, which not only solves the difficult printing problem of the changing surface during the printing of the conformal circuit, but also solves the complex preparation process of the traditional processing method, which consumes a lot of water and electricity. , and produce a large amount of waste water and pollutants. A simple, fast, safe, effective, green and environmentally friendly conformal circuit forming and manufacturing is realized.

Faced with the safety and lifespan problems of the conformal circuit used in extreme environments, the present invention adopts a multi-layer cladding structure to completely cover the conformal circuit. First, a layer of insulating material with anti-corrosion, anti-conductivity, and strong isolation is spread on the surface of the substrate to form a first insulating layer to effectively protect the substrate material. Subsequently, circuit printing was carried out through 3D printing technology, and a semi-clad printing body was pioneered. The inner layer was printed with a conductive layer, and the outer layer was covered with an adhesive layer. This has two major advantages for the establishment and use of conformal circuits. Advantage. First, the control of the printing width of the inner conductive layer is realized. Under the action of the outer adhesive layer, the inner conductive layer cannot be spread freely, which shortens the width of the inner layer material and increases the thickness of the inner layer material accordingly. , which improves the transmission performance of the conformal circuit.

In order to further regulate the corrosion resistance and service life of the conformal circuit, the secondary covering of the insulating layer is carried out after the circuit printing is completed. , filling the micropores and partial defects of the bonding layer material, and realizing the successful fabrication of high-performance conformal circuits.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only for the present application. In some embodiments, for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without any creative effort.

1 is a schematic cross-sectional view of a nozzle of a printer of the present invention;

FIG. 2 is a schematic diagram of the structure of the 3D printing conformal circuit of the present invention.

Description of symbols in the figure:

1. Adhesive layer printing ink; 2. Conductive layer printing ink; 3. Substrate; 4. First insulating layer; 5. Conductive layer; 6. Adhesive layer; 7. Second insulating layer; 8. Arc partition ; 9. The width of the inner nozzle; 10. The width of the outer nozzle.

Detailed ways

In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application.

The method for preparing the 3D printing conformal circuit provided in the embodiment of the present application will now be described.

The 3D printing conformal circuit preparation method specifically includes the following steps:

(1) coating the surface of the substrate 3 with insulating material to form the first insulating layer 4;

Insulating material, the first insulating layer 4 is mainly composed of the following components by weight: 3-8 parts of epoxy resin, 2-8 parts of phenolic resin, 3-8 parts of nitrile latex, 1-3 parts of polyvinylpyrrolidone, and 3-8 parts of polyethylene glycol, dissolved in acetone solution;

(2) Add the conductive layer printing ink 2 to the inner layer nozzle for inner layer printing; add the adhesive layer printing ink 1 to the outer layer nozzle for outer layer printing; set the 3D printing program and printing parameters, in the insulating material A conductive layer 5 and an adhesive layer 6 are formed by external printing, and the adhesive layer 6 wraps the outer surface of the conductive layer 5;

Please refer to FIG. 1 , which is a schematic cross-sectional view of the nozzle of the printer of the present invention. The inner layer nozzle and the outer layer nozzle are separated by the inner arc partition 8 of the printer nozzle, and the cross-sectional area of the inner layer nozzle is smaller than that of the outer layer nozzle;

The conductive layer printing ink 2 is mainly composed of the following components by weight: 5-10 parts of graphene oxide, 10-20 parts of graphene, 5-10 parts of carbon nanotubes, 10-20 parts of nano-silver, 10-20 parts of nano-copper parts, 1-3 parts of polyvinylpyrrolidone, and 1-3 parts of polyacrylate, added to the aqueous solution to dissolve;

The adhesive layer printing ink 1 is mainly composed of the following components by weight: 5-10 parts of polybutylene succinate, 5-10 parts of polyethylene succinate, 10-20 parts of polycaprolactone , and 1-5 parts of polyethylene glycol, added to dichloromethane to dissolve and make;

The conductive layer 5 and the adhesive layer 6 are printed by a 3D printer, and then the insulating layer is printed on the surface of the printed circuit after forming, and the conductive layer 5 is double-coated to realize the conformal circuit with strong adhesion, excellent conductivity, The advantage of corrosion resistance.

(3) adding the insulating layer printing ink to the printer nozzle, and printing the second insulating layer 7 outside the adhesive layer 6 to obtain a 3D printed conformal circuit;

The insulating layer printing ink is mainly composed of the following components by weight: 5-10 parts of epoxy resin, 5-10 parts of phenolic resin, 5-10 parts of nitrile latex, 5-10 parts of polyvinylpyrrolidone, and polyethylene glycol 5-10 parts are made by dissolving into acetone solution.

Furthermore, in this embodiment, the viscosity of the insulating material, conductive layer printing ink 2, adhesive layer printing ink 1 and insulating layer printing ink is adjusted to achieve uniform flow out during extrusion.

Further, in this embodiment, in step (2), the width 9 of the inner layer nozzle is 50-150 μm, and the width 10 of the outer layer nozzle is 150-250 μm.

Further, in this embodiment, in step (1), a 3D printing program and printing parameters are set, specifically, firstly, a three-dimensional model of the printing substrate 3 is established by CT scanning, and then a specific path of the printing circuit is established on the surface of the three-dimensional model, A code file is formed according to the print path, and finally the code file is imported into the printer software.

The invention adopts the 3D printing method to prepare the conformal circuit, which not only solves the difficult printing problem of the changing surface during the conformal circuit printing process, but also solves the complicated preparation process of the traditional processing method, consumes a large amount of water and electricity, and generates a large amount of wastewater and pollutants. A simple, fast, safe, effective, green and environmentally friendly conformal circuit forming and manufacturing is realized.

Faced with the safety and lifespan problems of the conformal circuit used in extreme environments, the present invention adopts a multi-layer cladding structure to completely cover the conformal circuit. First, a layer of insulating material with anti-corrosion, anti-conductivity, and strong isolation is spread on the surface of the substrate 3 to form a first insulating layer 4 to effectively protect the material of the substrate 3 . Subsequently, circuit printing was carried out through 3D printing technology, and a semi-clad printing body was pioneered. The inner layer was printed with a conductive layer 5, and the outer layer was covered with an adhesive layer 6, which has great advantages for the establishment and use of conformal circuits. Two advantages. First, the control of the printing width of the inner conductive layer 5 is realized. Under the action of the outer adhesive layer 6, the inner conductive layer 5 cannot be spread freely, which shortens the width of the inner layer material and increases the inner layer accordingly. The thickness of the material improves the transmission performance of the conformal circuit.

In order to further regulate the corrosion resistance and service life of the conformal circuit, the secondary covering of the insulating layer is carried out after the circuit printing is completed. , filling the micropores and partial defects of the bonding layer 6 material, and realizing the successful preparation of high-performance conformal circuits.

Specific Example 1

A method for preparing a 3D printing conformal circuit, which specifically includes the following steps:

(1) coating the surface of the substrate 3 with insulating material to form the first insulating layer 4;

Insulating material, the first insulating layer 4 is mainly composed of the following components by weight: 3 parts of epoxy resin, 2 parts of phenolic resin, 3 parts of nitrile latex, 1 part of polyvinylpyrrolidone, and 3 parts of polyethylene glycol, dissolved into acetone solution;

(2) Add the conductive layer printing ink 2 to the inner layer nozzle for inner layer printing; add the adhesive layer printing ink 1 to the outer layer nozzle for outer layer printing; set the 3D printing program and printing parameters, in the insulating material A conductive layer 5 and an adhesive layer 6 are formed by external printing, and the adhesive layer 6 wraps the outer surface of the conductive layer 5; the inner layer nozzle and the outer layer nozzle are separated by the inner arc partition 8 of the printer nozzle, and the cross-section of the inner layer nozzle is formed. The area is smaller than the cross-sectional area of the outer nozzle;

The conductive layer printing ink 2 is mainly composed of the following components by weight: 5 parts of graphene oxide, 10 parts of graphene, 5 parts of carbon nanotubes, 10 parts of nano-silver, 10 parts of nano-copper, 1 part of polyvinylpyrrolidone, and 1 part of polyvinylpyrrolidone. 1 part of acrylate, added to the aqueous solution to dissolve;

The adhesive layer printing ink 1 is mainly composed of the following components by weight: 5 parts of polybutylene succinate, 5 parts of polyethylene succinate, 10 parts of polycaprolactone, and polyethylene glycol 1 part, added to dichloromethane to dissolve;

The conductive layer 5 and the adhesive layer 6 are printed by a 3D printer, and then the insulating layer is printed on the surface of the printed circuit after forming, and the conductive layer 5 is double-coated to realize the conformal circuit with strong adhesion, excellent conductivity, The advantage of corrosion resistance.

(3) adding the insulating layer printing ink to the printer nozzle, and printing the second insulating layer 7 outside the adhesive layer 6 to obtain a 3D printed conformal circuit;

The insulating layer printing ink is mainly composed of the following components by weight: 5 parts of epoxy resin, 5 parts of phenolic resin, 5 parts of nitrile latex, 5 parts of polyvinylpyrrolidone, and 5 parts of polyethylene glycol, dissolved in acetone solution to prepare to make.

The insulating material, the conductive layer printing ink 2, the adhesive layer printing ink 1 and the insulating layer printing ink, all have a viscosity of 1000cps.

In step (2), the width 9 of the inner layer nozzle is 50 μm, and the width 10 of the outer layer nozzle is 150 μm.

Adhesion Test:

The adhesion between the printed circuit and the substrate 3 was characterized by a universal material testing machine, and the adhesion between the printed circuit and the substrate 3 was measured by measuring the peel strength between the printed circuit and the substrate 3 . The process is as follows, fix the prepared circuit board on the glass slide, stick one end of the 3M tape on the circuit, and press the tape with your finger for 60s to ensure the full contact and bonding of the tape. 15mm/min, start the test at room temperature, record the stress-strain change relationship in real time, and divide the obtained stress by the width of the tape to obtain the peel strength. The calculation formula is as follows:

P=F/W, P is peel strength (N/m), F is peel force (N), W is test width (m).

Test results: peel strength 3.9N.

Resistivity test: Use a four-probe instrument to test the resistivity of the circuit. The four-probe tester used is a RET-9 double-electrical four-probe tester produced by Shenzhen Excellent Instrument Co., Ltd.

Test results: The resistivity is 8.98x10 ^-5 Ω·cm.

Specific embodiment 2

(1) coating the surface of substrate 3 with insulating material;

Insulating material, the first insulating layer 4 is mainly composed of the following components by weight: 8 parts of epoxy resin, 8 parts of phenolic resin, 8 parts of nitrile latex, 3 parts of polyvinylpyrrolidone, and 8 parts of polyethylene glycol, dissolved into acetone solution;

(2) Add the conductive layer printing ink 2 to the inner layer nozzle for inner layer printing; add the adhesive layer printing ink 1 to the outer layer nozzle for outer layer printing; set the 3D printing program and printing parameters, in the insulating material A conductive layer 5 and an adhesive layer 6 are formed by external printing, and the adhesive layer 6 wraps the outer surface of the conductive layer 5; the inner layer nozzle and the outer layer nozzle are separated by the inner arc partition 8 of the printer nozzle, and the cross-section of the inner layer nozzle is formed. The area is smaller than the cross-sectional area of the outer nozzle;

The conductive layer printing ink 2 is mainly composed of the following components by weight: 10 parts of graphene oxide, 20 parts of graphene, 10 parts of carbon nanotubes, 20 parts of nano-silver, 20 parts of nano-copper, 3 parts of polyvinylpyrrolidone, and 3 parts of polyvinylpyrrolidone. 3 parts of acrylate, added to the aqueous solution to dissolve;

The adhesive layer printing ink 1 is mainly composed of the following components by weight: 10 parts of polybutylene succinate, 10 parts of polyethylene succinate, 20 parts of polycaprolactone, and polyethylene glycol 5 parts, added to dichloromethane to dissolve;

The conductive layer 5 and the adhesive layer 6 are printed by a 3D printer, and then the insulating layer is printed on the surface of the printed circuit after forming, and the conductive layer 5 is double-coated to realize the conformal circuit with strong adhesion, excellent conductivity, The advantage of corrosion resistance.

(3) adding the insulating layer printing ink to the printer nozzle, and printing the second insulating layer 7 outside the adhesive layer 6 to obtain a 3D printed conformal circuit;

The insulating layer printing ink is mainly composed of the following components by weight: 10 parts of epoxy resin, 10 parts of phenolic resin, 10 parts of nitrile latex, 10 parts of polyvinylpyrrolidone, and 10 parts of polyethylene glycol, dissolved in acetone solution to prepare to make.

The insulating material, the conductive layer printing ink 2, the adhesive layer printing ink 1 and the insulating layer printing ink, all have a viscosity of 1100 cps.

In step (2), the width 9 of the inner layer nozzle is 100 μm, and the width 10 of the outer layer nozzle is 200 μm.

Adhesion test results: peel strength 10.9N.

Resistivity test results: the resistivity is 5.21x10 ^-5 Ω·cm.

Specific embodiment 3

(1) coating the surface of substrate 3 with insulating material;

Insulating material, the first insulating layer 4 is mainly composed of the following components by weight: 5 parts of epoxy resin, 4 parts of phenolic resin, 5 parts of nitrile latex, 2 parts of polyvinylpyrrolidone, and 6 parts of polyethylene glycol, dissolved into acetone solution;

(2) Add the conductive layer printing ink 2 to the inner layer nozzle for inner layer printing; add the adhesive layer printing ink 1 to the outer layer nozzle for outer layer printing; set the 3D printing program and printing parameters, in the insulating material A conductive layer 5 and an adhesive layer 6 are formed by external printing, and the adhesive layer 6 wraps the outer surface of the conductive layer 5; the inner layer nozzle and the outer layer nozzle are separated by the inner arc partition 8 of the printer nozzle, and the cross-section of the inner layer nozzle is formed. The area is smaller than the cross-sectional area of the outer nozzle;

The conductive layer printing ink 2 is mainly composed of the following components by weight: 7 parts of graphene oxide, 15 parts of graphene, 8 parts of carbon nanotubes, 12 parts of nano silver, 12 parts of nano copper, 2 parts of polyvinylpyrrolidone, and polyacrylic acid 2 parts of ester, added to the aqueous solution to dissolve;

The adhesive layer printing ink 1 is mainly composed of the following components by weight: 8 parts of polybutylene succinate, 7 parts of polyethylene succinate, 7 parts of polycaprolactone, and polyethylene glycol 4 parts, added to dichloromethane to dissolve;

The conductive layer 5 and the adhesive layer 6 are printed by a 3D printer, and then the insulating layer is printed on the surface of the printed circuit after forming, and the conductive layer 5 is double-coated to realize the conformal circuit with strong adhesion, excellent conductivity, The advantage of corrosion resistance.

(3) adding the insulating layer printing ink to the printer nozzle, and printing the second insulating layer 7 outside the adhesive layer 6 to obtain a 3D printed conformal circuit;

The insulating layer printing ink is mainly composed of the following components by weight: 8 parts of epoxy resin, 7 parts of phenolic resin, 8 parts of nitrile latex, 8 parts of polyvinylpyrrolidone, and 9 parts of polyethylene glycol, dissolved in acetone solution to prepare to make.

Insulating material, conductive layer printing ink 2, adhesive layer printing ink 1 and insulating layer printing ink, all have a viscosity of 1200cps.

In step (2), the width 9 of the inner layer nozzle is 150 μm, and the width 10 of the outer layer nozzle is 250 μm.

Adhesion test results: peel strength 5.4N.

Resistivity test results: the resistivity is 7.44x10 ^-5 Ω·cm.

Specific Example 4

The difference from the specific example 1 is that step (1) is not performed.

Adhesion test results: peel strength 1.5N.

Resistivity test results: the resistivity is 9.56x10 ^-5 Ω·cm.

Specific Example 5

The difference from the specific embodiment 1 is that step (3) is not performed.

Adhesion test results: peel strength 2.1N.

Resistivity test results: the resistivity is 9.48x10 ^-5 Ω·cm.

Analysis of the results: The 3D printed conformal circuit prepared by the method of the present invention has excellent adhesion performance, can resist large destructive force, and at the same time has low resistivity and excellent electrical conductivity. Among them, coating the bottommost and outermost insulating layers (the first insulating layer 4 and the second insulating layer 7) of the circuit can effectively improve the adhesion performance of the conformal circuit, improve the bonding strength of the circuit and the substrate 3, and ensure the integrity of the circuit. Normal use. By adjusting the content of printing ink, increasing the content of nano-silver and nano-copper can greatly reduce the resistivity of the conformal circuit and improve the conductivity and service life of the conformal circuit. 3D printed conformal circuits with excellent electrical conductivity were obtained.

The above-mentioned embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the above-mentioned embodiments, those of ordinary skill in the art should understand that: it can still be used for the above-mentioned implementations. The technical solutions described in the examples are modified, or some technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions in the embodiments of the application, and should be included in the within the scope of protection of this application.

Claims (8)

1. A method for preparing a 3D printing conformal circuit is characterized by comprising the following steps:

(1) coating the surface of the substrate with an insulating material to form a first insulating layer;

(2) adding the printing ink of the conductive layer into the inner-layer nozzle, and adding the printing ink of the bonding layer into the outer-layer nozzle; setting a 3D printing program and printing parameters, and printing outside the insulating material to form a conducting layer and a bonding layer, wherein the bonding layer wraps the outer surface of the conducting layer;

the inner layer nozzle and the outer layer nozzle are formed by separating an inner arc clapboard of the printer nozzle, and the cross sectional area of the inner layer nozzle is smaller than that of the outer layer nozzle;

(3) and adding printing ink of the insulating layer into a printer nozzle, and printing a second insulating layer outside the bonding layer to obtain the 3D printed conformal circuit.

2. The method of making a 3D printed conformal circuit of claim 1, wherein: in the step (1), the insulating material, which forms the first insulating layer, mainly comprises the following components in parts by weight: 3-8 parts of epoxy resin, 2-8 parts of phenolic resin, 3-8 parts of nitrile latex, 1-3 parts of polyvinylpyrrolidone and 3-8 parts of polyethylene glycol, and dissolving the components in an acetone solution.

3. The method of making a 3D printed conformal circuit of claim 2, wherein: in the step (2), the conductive layer printing ink mainly comprises the following components in parts by weight: 5-10 parts of graphene oxide, 10-20 parts of graphene, 5-10 parts of carbon nano tube, 10-20 parts of nano silver, 10-20 parts of nano copper, 1-3 parts of polyvinylpyrrolidone and 1-3 parts of polyacrylate, and adding the mixture into an aqueous solution to dissolve the mixture to prepare the nano-silver/nano-copper/polyvinyl pyrrolidone composite material.

4. The method of making a 3D printed conformal circuit of claim 3, wherein: in the step (2), the bonding layer printing ink mainly comprises the following components in parts by weight: 5-10 parts of poly (butylene succinate), 5-10 parts of poly (ethylene succinate), 10-20 parts of polycaprolactone and 1-5 parts of polyethylene glycol, and adding dichloromethane to dissolve the components to prepare the aqueous solution.

5. The method of making a 3D printed conformal circuit of claim 4, wherein: in the step (3), the insulating layer printing ink mainly comprises the following components in parts by weight: 5-10 parts of epoxy resin, 5-10 parts of phenolic resin, 5-10 parts of nitrile latex, 5-10 parts of polyvinylpyrrolidone and 5-10 parts of polyethylene glycol, and dissolving the epoxy resin, the phenolic resin, the nitrile latex and the polyethylene glycol into acetone solution.

6. The method of making a 3D printed conformal circuit of claim 5, wherein: the viscosity of the insulating material, the conductive layer printing ink, the bonding layer printing ink and the insulating layer printing ink is more than or equal to 1000 cps.

7. The method of making a 3D printed conformal circuit of claim 1, wherein: in the step (2), the width of the inner layer nozzle is 50-150 μm, and the width of the outer layer nozzle is 150-250 μm.

8. The method of making a 3D printed conformal circuit of claim 1, wherein: in the step (1), the 3D printing program and the printing parameters are set such that a three-dimensional model of a printing substrate is first established by CT scanning, then a specific path of a printing circuit is established on the surface of the three-dimensional model, a code file is formed according to the printing path, and finally the code file is imported into printer software.

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