CN114126230B - Compatible wiring method and related device of PCB - Google Patents

Abstract

The application discloses a compatible wiring method of a PCB board, comprising the following steps: setting four bonding pads; connecting an input end and an output end of the functional module with a bonding pad respectively; connecting an interface of the target controller with the connector with a bonding pad respectively; when the functional module is used, M resistance-capacitance devices are connected with the bonding pads, so that the interface, the M resistance-capacitance devices, the functional module and the connector form a signal transmission channel; when the functional module is not used, the N resistance-capacitance devices are connected with the bonding pads, so that the interface, the N resistance-capacitance devices and the connector form a signal transmission channel; wherein each anti-capacitor piece is connected with two adjacent bonding pads, M and N are positive integers, M is less than or equal to 2, N is less than or equal to 2, and N is unequal to M. The method can save the space of the board card and reduce the impedance discontinuity effect brought by the impedance container. The application also discloses a compatible wiring device, equipment and computer readable storage medium of the PCB, which have the technical effects.

Description

Compatible wiring method and related device for PCB board

Technical field

The present application relates to the technical field of PCB (Printed Circuit Board, printed circuit board) boards, and in particular to a compatible wiring method of the PCB board; and also relates to a compatible wiring device, equipment and computer-readable storage medium of the PCB board.

Background technique

As system configurations become increasingly diversified, a variety of functional modules are often reserved on the motherboard to meet the various needs of the system. For example, for SATA links, some customers need to encrypt the signal, while others do not have encryption requirements. For this purpose, both encrypted and non-encrypted functional modules are reserved on the motherboard. As shown in Figure 1, configuration A is an unencrypted module, and configuration B is an encryption module (the signal will pass through the encryption chip). However, the above design will increase the design cost of the motherboard and require more board space and chip resources. This restricts the motherboard design.

In order to reduce the cost of motherboard design and save board space and chip resources, there is currently a colay (Compatible-Layout, compatible wiring) solution as shown in Figure 2. When the customer needs to configure A, place the resistive components R0 and R1 as shown on the left in Figure 2; when the customer needs to configure B, place the resistive components R1 and R1 as shown on the right in Figure 2. The signal flow under different configurations is shown as the dotted line in Figure 2. Although the solution shown in Figure 2 can reduce the occupation of the interface and use only one connector, which saves board space and chip resources to a certain extent, it requires a large number of resistive components and pads, which will still occupy a larger board. card space. At the same time, for some high-speed signals, adding resistive components will introduce additional impedance discontinuities, which will affect the signal quality.

Therefore, how to save board space and reduce the impedance discontinuity effect caused by resistive components has become an urgent technical problem to be solved by those skilled in the art.

Contents of the invention

The purpose of this application is to provide a compatible wiring method for PCB boards that can save board space and reduce the impedance discontinuity effect caused by resistive components. Another object of the present application is to provide a PCB board-compatible wiring device, equipment and computer-readable storage medium, all of which have the above technical effects.

In order to solve the above technical problems, this application provides a compatible wiring method for PCB boards, including:

Set four pads;

Connect the input end and the output end of the functional module to one of the pads respectively; the input end and the output end of the functional module are connected to different pads;

Connect an interface and a connector of the target controller to one of the pads respectively; the interface is different from the pad to which the connector is connected;

When using the functional module, connect M resistive components to the pads, so that the interface, the M resistive components, the functional module and the connector form a signal transmission channel;

When the functional module is not used, connect the N resistive components to the pads so that the interface, the N resistive components and the connector form a signal transmission channel;

Wherein, each resistive component connects two adjacent pads, M and N are positive integers, M≤2, N≤2, and N and M are not equal.

Optionally, connecting the M resistive components to the pads includes:

Connect the two resistive components to the pads;

Correspondingly, connecting the N resistive components to the pads includes:

Connect one of the resistive components to the pad.

Optionally, connecting the M resistive components to the pads includes:

Connect one of the resistive components to the pad;

Correspondingly, connecting the N resistive components to the pads includes:

Connect the two resistive components to the pads.

Optionally, the resistive component is a resistor.

Optionally, the functional module includes a single functional chip.

In order to solve the above technical problems, this application also provides a PCB board compatible wiring device, including:

Setting unit, used to set four pads;

The first connection unit is used to connect the input end and the output end of the functional module to one of the pads respectively; the input end and the output end of the functional module are connected to different pads;

a second connection unit, configured to connect an interface and a connector of the target controller to one of the pads respectively; the interface is different from the pad to which the connector is connected;

A third connection unit is used to connect M resistive components to the pads when using the functional module, so that the interface, the M resistive components, the functional module and the connector Form a signal transmission channel;

The fourth connection unit is used to connect the N resistive components to the pads when the functional module is not used, so that the interface, the N resistive components and the connector form a signal. transmission channel;

Wherein, each resistive component connects two adjacent pads, M and N are positive integers, M≤2, N≤2, and N and M are not equal.

Optionally, the third connection unit is specifically used to: connect the two resistive components to the pad;

Correspondingly, the fourth connection unit is specifically used to connect one of the resistor components to the pad.

Optionally, the third connection unit is specifically used to: connect one of the resistor components to the pad;

Correspondingly, the fourth connection unit is specifically used to connect the two resistive components to the pad.

In order to solve the above technical problems, this application also provides a PCB board-compatible wiring device, including:

Memory, used to store computer programs;

A processor, configured to implement the steps of the compatible wiring method of a PCB board as described in any one of the above when executing the computer program.

In order to solve the above technical problems, the present application also provides a computer-readable storage medium. A computer program is stored on the computer-readable storage medium. When the computer program is executed by a processor, the PCB as described in any of the above items is implemented. Steps for board-compatible wiring methods.

The compatible wiring method of the PCB board provided by this application includes: setting four pads; connecting the input end and the output end of the functional module to one of the pads respectively; the input end and the output end of the functional module are connected to The pads are different; connect an interface and the connector of the target controller to one of the pads respectively; the interface and the pad connected to the connector are different; when using the functional module, connect M resistive components are connected to the pads, so that the interface, the M resistive components, the functional module and the connector form a signal transmission channel; when the functional module is not used, N The resistive components are connected to the pads, so that the interface, N resistive components and the connector form a signal transmission channel; wherein each resistive component connects two adjacent resistive components. In the pad, M and N are positive integers, M≤2, N≤2, and N and M are not equal.

It can be seen that the compatible wiring method of the PCB board provided by this application is provided with four pads. Compared with the six pads in the existing technical solution, this application reduces the number of pads and saves board space. In addition, under different functional requirements, the number of required resistive components is at most two and at least one. Compared with the existing technical solution that requires at least two resistive components, this application reduces the number of resistive components. , the signal can pass through at least one resistive component, which can reduce the impedance discontinuity effect caused by the resistive component and improve system reliability.

The PCB board-compatible wiring devices, equipment and computer-readable storage media provided by this application all have the above technical effects.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the prior art and the drawings required to be used in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some of the drawings of the present application. Embodiments, for those of ordinary skill in the art, other drawings can also be obtained based on these drawings without exerting creative efforts.

Figure 1 is a schematic diagram of the existing motherboard design;

Figure 2 is a schematic diagram of compatible wiring of an existing PCB board;

Figure 3 is a schematic flow chart of a PCB board compatible wiring method provided by an embodiment of the present application;

Figure 4 is a schematic diagram of a high-order colay provided by an embodiment of the present application;

Figure 5 is a schematic diagram of compatible wiring of the first PCB board provided by the embodiment of the present application;

Figure 6 is a schematic diagram of compatible wiring of the second PCB board provided by the embodiment of the present application;

Figure 7 is a schematic diagram of compatible wiring of the third type of PCB provided by the embodiment of the present application;

Figure 8 is a schematic diagram of a compatible wiring device for a PCB board provided by an embodiment of the present application;

FIG. 9 is a schematic diagram of a compatible wiring device of a PCB board provided by an embodiment of the present application.

Detailed ways

The core of this application is to provide a compatible wiring method for PCB boards, which can save board space and reduce the impedance discontinuity effect caused by resistive components. Another core of this application is to provide a PCB board-compatible wiring device, equipment and computer-readable storage medium, all of which have the above technical effects.

In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments These are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.

Please refer to Figure 3. Figure 3 is a schematic flow chart of a compatible wiring method for a PCB board provided by an embodiment of the present application. Referring to Figure 1, the method mainly includes:

S101: Set four pads;

S102: Connect the input terminal and the output terminal of the functional module to a pad respectively; the input terminal and the output terminal of the functional module are connected to different pads;

S103: Connect an interface and a connector of the target controller to a pad respectively; the pads connected to the interface and the connector are different;

S104: When using the functional module, connect the M resistive components to the pads so that the interface, M resistive components, functional modules and connectors form a signal transmission channel;

S105: When the functional module is not used, connect the N resistive components to the pads so that the interface, the N resistive components and the connector form a signal transmission channel;

Among them, each resistive component connects two adjacent pads, M and N are positive integers, M≤2, N≤2, and N and M are not equal.

Specifically, as shown in Figure 4, the compatible wiring method provided by this application adopts a high-level compatible wiring solution and sets four pads (PAD in Figure 4 represents pads). Any two adjacent pads can be connected together. Resistive components. Four pads can realize the colay design of three resistive components. You can choose the upper two pads to connect to a resistor device R0, the lower two pads to connect to a resistor device R2, or the middle two pads to connect a resistor device R1.

Based on the above-mentioned high-order compatible wiring scheme, on the basis of setting four pads, the input end and output end of the functional module are connected to one pad respectively. Among them, when the four pads are arranged in sequence from top to bottom, the input end of the functional module can be connected to the top pad, and the output end of the functional module can be connected to the bottom pad. Connect an interface and connector of the target controller to a pad respectively; where the interface and connector are connected to different pads. According to the different functional requirements of the pads connected to the interface and connector, the number of resistive components must be appropriately determined and must be able to meet:

When a functional module needs to be used, M resistive components are connected to the pads, and each resistive component is connected to two adjacent pads, so that the interface, M resistive components, functional modules and connectors form a signal transmission channel , at this time the signal flowing into the interface will pass through the functional module.

When there is no need to use functional modules, connect N resistive components to the pads, and each resistive component connects two adjacent pads, so that the interface, N resistive components and the connector form a signal transmission channel. The signals flowing into the interface will not pass through the function module.

M and N are positive integers, M≤2, N≤2, and N and M are not equal. Therefore, no matter when the functional module needs to be used or when the functional module does not need to be used, the number of resistive components is at most two and at least one.

The resistive component may be a resistor, and the functional module may include a single functional chip, for example, a single encryption chip.

On the basis of the above embodiments, as a specific implementation manner, connecting M resistive components to the soldering pads includes: connecting two resistive components to the soldering pads; correspondingly, connecting N resistive components to the soldering pads. Pad connection consists of connecting a resistive component to the pad.

Specifically, referring to FIG. 5 , the four bonding pads are marked as the first bonding pad, the second bonding pad, the third bonding pad and the fourth bonding pad from top to bottom. For example, if the target controller is a SATA controller and the functional module is an encryption chip, port1 of the SATA controller is connected to the second pad, and the connector is connected to the third pad. The input end of the encryption chip is connected to the first soldering pad, and the output end of the encryption chip is connected to the fourth soldering pad.

When an encryption chip needs to be used, connect the resistive component R0 to the first and second pads, and connect the resistive component R1 to the third and fourth pads. At this time, the signal flow is as shown in Figure 5 As shown in the left figure, port1, resistive component R0, encryption chip, resistive component R1 and connector are in sequence, that is, port1, resistive component R0, encryption chip, resistive component R1 and connector form a signal transmission channel.

When there is no need to use an encryption chip, connect the resistive component R2 to the second and third pads. At this time, the signal flow is as shown in the right picture in Figure 5, which is port1, the resistive component R2 and the connector in order. That is, port1, resistor R2 and connector form a signal transmission channel.

It can be seen that in this embodiment, only one interface of the SATA controller is occupied and only one connector is used. When there is no need to use an encryption chip, only one resistor is needed. At this time, the signal only passes through one resistor. Therefore, It not only saves board space occupation, but also reduces the impedance discontinuity effect caused by resistive components.

On the basis of the above embodiments, as a specific implementation manner, on the basis of the above embodiments, in a specific implementation manner, connecting M resistive components to the pads includes: connecting one resistive component Connect to the pad; correspondingly, connecting N resistive components to the pad includes: connecting two resistive components to the pad.

Specifically, referring to FIG. 6 , the four bonding pads are marked as the first bonding pad, the second bonding pad, the third bonding pad and the fourth bonding pad from top to bottom. For example, if the target controller is a SATA controller and the functional module is an encryption chip, port1 of the SATA controller is connected to the second pad, and the connector is connected to the fourth pad. The input end of the encryption chip is connected to the first soldering pad, and the output end of the encryption chip is connected to the fourth soldering pad.

When the encryption chip needs to be used, connect the resistive component R0 to the first and second pads. At this time, the signal flow is as shown in the left picture in Figure 6, which is port1, the resistive component R0, the encryption chip, and The connector, namely port1, resistive component R0, encryption chip and connector form a signal transmission channel.

When there is no need to use an encryption chip, connect the resistive component R1 to the second and third pads, and connect the resistive component R2 to the third and fourth pads. At this time, the signal flow is as shown in Figure 6 As shown in the figure on the right, port1, resistive component R1, resistive component R2 and connector are in sequence, that is, port1, resistive component R1, resistive component R2 and connector form a signal transmission channel.

It can be seen that in this embodiment, only one interface of the SATA controller is occupied and only one connector is used. When an encryption chip needs to be used, only one resistor is needed. At this time, the signal only passes through one resistor. Therefore, not only It saves board space and reduces the impedance discontinuity effect caused by resistive components.

Or, as shown in FIG. 7 , the four bonding pads are denoted as the first bonding pad, the second bonding pad, the third bonding pad and the fourth bonding pad in sequence from top to bottom. For example, if the target controller is a SATA controller and the functional module is an encryption chip, port1 of the SATA controller is connected to the first pad, and the connector is connected to the third pad. The input end of the encryption chip is connected to the first soldering pad, and the output end of the encryption chip is connected to the fourth soldering pad.

When the encryption chip needs to be used, connect the resistive component R0 to the third and fourth pads. At this time, the signal flow is as shown in the left picture in Figure 7, which is port1, the resistive component R0, the encryption chip, and The connector, namely port1, resistive component R0, encryption chip and connector form a signal transmission channel.

When there is no need to use an encryption chip, connect the resistive component R1 to the first and second pads, and connect the resistive component R2 to the second and third pads. At this time, the signal flow is as shown in Figure 6 As shown in the figure on the right, port1, resistive component R1, resistive component R2 and connector are in sequence, that is, port1, resistive component R1, resistive component R2 and connector form a signal transmission channel.

Similarly, in the embodiment shown in FIG. 7 , only one interface of the SATA controller is occupied, only one connector is used, and when an encryption chip needs to be used, only one resistive component is needed.

To sum up, the compatible wiring method of the PCB board provided by this application is provided with four pads. Compared with the six pads in the existing technical solution, this application reduces the number of pads and saves board space. . In addition, under different functional requirements, the number of required resistive components is at most two and at least one. Compared with the existing technical solution that requires at least two resistive components, this application reduces the number of resistive components. , the signal can pass through at least one resistive component, which can reduce the impedance discontinuity effect caused by the resistive component and improve system reliability.

This application also provides a PCB board-compatible wiring device. The device described below can be mutually referenced with the method described above. Please refer to Figure 8. Figure 8 is a schematic diagram of a compatible wiring device for a PCB board provided by an embodiment of the present application. As shown in conjunction with Figure 8, the device includes:

Setting unit 10, used to set four pads;

The first connection unit 20 is used to connect the input end and the output end of the functional module to one of the pads respectively; the input end and the output end of the functional module are connected to different pads;

The second connection unit 30 is used to connect an interface and a connector of the target controller to one of the pads respectively; the interface is different from the pad to which the connector is connected;

The third connection unit 40 is used to connect the M resistive components to the pads when using the functional module, so that the interface, the M resistive components, the functional module and the connection The device forms a signal transmission channel;

The fourth connection unit 50 is used to connect the N resistive components to the pads when the functional module is not used, so that the interface, the N resistive components and the connector form a signal transmission channel;

Wherein, each resistive component connects two adjacent pads, M and N are positive integers, M≤2, N≤2, and N and M are not equal.

Based on the above embodiments, optionally, the third connection unit 40 is specifically used to: connect the two resistive components to the pads;

Correspondingly, the fourth connection unit 50 is specifically used to connect one of the resistor components to the pad.

Based on the above embodiments, optionally, the third connection unit 40 is specifically used to: connect one of the resistive components to the pad;

Correspondingly, the fourth connection unit 50 is specifically used to connect the two resistive components to the pads.

Based on the above embodiments, optionally, the resistive component is a resistor.

Based on the above embodiments, optionally, the functional module includes a single functional chip.

This application also provides a PCB board-compatible wiring device. As shown in FIG. 9 , the device includes a memory 1 and a processor 2 .

Memory 1, used to store computer programs;

Processor 2 is used to execute the computer program to implement the following steps:

Four pads are provided; the input end and the output end of the functional module are respectively connected to one of the pads; the input end and the output end of the functional module are connected to different pads; and an interface of the target controller is connected to The connectors are respectively connected to one of the soldering pads; the interface is different from the soldering pads connected to the connector; when using the functional module, M resistive components are connected to the soldering pads so that all The interface, M resistive components, functional modules and connectors form a signal transmission channel; when the functional module is not used, N resistive components are connected to the pads so that The interface, N resistive components and the connector form a signal transmission channel; wherein each resistive component connects two adjacent pads, M and N are positive integers, M≤ 2, N≤2, and N and M are not equal.

For an introduction to the equipment provided by this application, please refer to the above method embodiments, and this application will not describe them in detail here.

This application also provides a computer-readable storage medium. The computer-readable storage medium stores a computer program. When the computer program is executed by the processor, the following steps can be implemented:

Four pads are provided; the input end and the output end of the functional module are respectively connected to one of the pads; the input end and the output end of the functional module are connected to different pads; and an interface of the target controller is connected to The connectors are respectively connected to one of the soldering pads; the interface is different from the soldering pads connected to the connector; when using the functional module, M resistive components are connected to the soldering pads so that all The interface, M resistive components, functional modules and connectors form a signal transmission channel; when the functional module is not used, N resistive components are connected to the pads so that The interface, N resistive components and the connector form a signal transmission channel; wherein each resistive component connects two adjacent pads, M and N are positive integers, M≤ 2, N≤2, and N and M are not equal.

The computer-readable storage medium can include: U disk, mobile hard disk, read-only memory (Read-OnlyMemory, ROM), random access memory (Random Access Memory, RAM), magnetic disk or optical disk, etc. that can store program code. medium.

For an introduction to the computer-readable storage medium provided by this application, please refer to the above method embodiments, and this application will not elaborate further here.

Each embodiment in the specification is described in a progressive manner. Each embodiment focuses on its differences from other embodiments. The same and similar parts between the various embodiments can be referred to each other. As for the devices, equipment and computer-readable storage media disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple. For relevant details, please refer to the description in the method section.

Those skilled in the art may further realize that the units and algorithm steps of each example described in connection with the embodiments disclosed herein can be implemented by electronic hardware, computer software, or a combination of both. In order to clearly illustrate the possible functions of hardware and software, Interchangeability, in the above description, the composition and steps of each example have been generally described according to functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Skilled artisans may implement the described functionality using different methods for each specific application, but such implementations should not be considered beyond the scope of this application.

The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein may be implemented directly in hardware, in software modules executed by a processor, or in a combination of both. Software modules may be located in random access memory (RAM), memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disks, removable disks, CD-ROMs, or anywhere in the field of technology. any other known form of storage media.

The technical solution provided by this application has been introduced in detail above. This article uses specific examples to illustrate the principles and implementation methods of this application. The description of the above embodiments is only used to help understand the method and its core idea of this application. It should be noted that those of ordinary skill in the art can make several improvements and modifications to the present application without departing from the principles of the present application, and these improvements and modifications also fall within the scope of the claims of the present application.

Claims (10)

1. A compatible wiring method for PCB boards, which is characterized by including: Set four pads; Connect the input end and the output end of the functional module to one of the pads respectively; the input end and the output end of the functional module are connected to different pads; Connect an interface and a connector of the target controller to one of the pads respectively; the interface is different from the pad to which the connector is connected; The pad connected to the input end of the functional module, the pad connected to the output end of the functional module, the pad connected to the connector, and the pad connected to an interface of the target controller are different. ; Or, the pad connected to the input end of the functional module is the same as the pad connected to an interface of the target controller, and the pad connected to the output end of the functional module is the same as the pad connected to the connector. The pads connected to the input end of the functional module are different from the pads connected to an interface of the target controller, and the pads connected to the output end of the functional module are different from the pads connected to the output end of the functional module. The connectors are connected to the same pads; When using the functional module, connect M resistive components to the pads, so that the interface, the M resistive components, the functional module and the connector form a signal transmission channel; When the functional module is not used, connect the N resistive components to the pads so that the interface, the N resistive components and the connector form a signal transmission channel; Wherein, each resistive component connects two adjacent pads, M and N are positive integers, M≤2, N≤2, and N and M are not equal. 2. The compatible wiring method according to claim 1, wherein connecting the M resistive components to the pads includes: Connect the two resistive components to the pads; Correspondingly, connecting the N resistive components to the pads includes: Connect one of the resistive components to the pad. 3. The compatible wiring method according to claim 1, wherein connecting the M resistive components to the pads includes: Connect one of the resistive components to the pad; Correspondingly, connecting the N resistive components to the pads includes: Connect the two resistive components to the pads. 4. The compatible wiring method according to claim 1, wherein the resistive component is a resistor. 5. The compatible wiring method according to claim 1, characterized in that the functional module includes a single functional chip. 6. A PCB board-compatible wiring device, characterized in that it includes: Setting unit, used to set four pads; The first connection unit is used to connect the input end and the output end of the functional module to one of the pads respectively; the input end and the output end of the functional module are connected to different pads; a second connection unit, configured to connect an interface and a connector of the target controller to one of the pads respectively; the interface is different from the pad to which the connector is connected; The pad connected to the input end of the functional module, the pad connected to the output end of the functional module, the pad connected to the connector, and the pad connected to an interface of the target controller are different. ; Or, the pad connected to the input end of the functional module is the same as the pad connected to an interface of the target controller, and the pad connected to the output end of the functional module is the same as the pad connected to the connector. The pads connected to the input end of the functional module are different from the pads connected to an interface of the target controller, and the pads connected to the output end of the functional module are different from the pads connected to the output end of the functional module. The connectors are connected to the same pads; A third connection unit is used to connect M resistive components to the pads when using the functional module, so that the interface, the M resistive components, the functional module and the connector Form a signal transmission channel; The fourth connection unit is used to connect the N resistive components to the pads when the functional module is not used, so that the interface, the N resistive components and the connector form a signal. transmission channel; Wherein, each resistive component connects two adjacent pads, M and N are positive integers, M≤2, N≤2, and N and M are not equal. 7. The compatible wiring device according to claim 6, wherein the third connection unit is specifically used to: connect two of the resistive components to the pad; Correspondingly, the fourth connection unit is specifically used to connect one of the resistor components to the pad. 8. The compatible wiring device according to claim 6, wherein the third connection unit is specifically used to: connect one of the resistive components to the pad; Correspondingly, the fourth connection unit is specifically used to connect the two resistive components to the pad. 9. A PCB board-compatible wiring device, characterized by including: Memory, used to store computer programs; A processor, configured to implement the steps of the compatible wiring method of a PCB board according to any one of claims 1 to 5 when executing the computer program. 10. A computer-readable storage medium, characterized in that a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, the PCB according to any one of claims 1 to 5 is implemented. Steps for board-compatible wiring methods.