CN114122869A

CN114122869A - laser

Info

Publication number: CN114122869A
Application number: CN202010880212.9A
Authority: CN
Inventors: 李建军; 周伯禹; 黄永达
Original assignee: Qingdao Hisense Laser Display Co Ltd
Current assignee: Qingdao Hisense Laser Display Co Ltd
Priority date: 2020-08-27
Filing date: 2020-08-27
Publication date: 2022-03-01

Abstract

The application discloses a laser, which belongs to the field of optoelectronic technology. The laser includes: a tube shell, which includes a bottom plate and a tubular side wall; a plurality of light-emitting components, the plurality of light-emitting components are located in a cavity enclosed by the bottom plate and the side wall; a sealing cover plate, the sealing cover plate is annular, And the outer edge of the sealing cover plate is fixed on the surface of the side wall away from the bottom plate; the light-transmitting sealing layer is fixed with the inner edge of the sealing cover plate; the collimating lens group is located on the side of the sealing cover plate away from the bottom plate; Wherein, the inner wall or the outer wall of the end of the side wall away from the bottom plate has a groove extending along the circumferential direction of the side wall. The present application solves the problem of low production yield of lasers. This application is for luminescence.

Description

Laser device

Technical Field

The application relates to the field of photoelectric technology, in particular to a laser.

Background

With the development of the optoelectronic technology, the laser is widely used.

As shown in fig. 1, the laser 00 includes a package 001, a plurality of light emitting elements 002, a sealing cover 003, a light-transmissive sealing layer 004, and a collimator set 005. The package 001 includes a bottom plate 0011 and a ring-shaped sidewall 0012, the sidewall 0012 and the light emitting elements 002 are fixed on the bottom plate 0011, and the sidewall 0012 surrounds the light emitting elements 002. Sealed apron 003 is the sunken cyclic annular panel beating part of inward flange, and the outward flange of sealed apron 003 welds in the surface that bottom plate 0011 was kept away from to lateral wall 0012 through parallel seal welding technique, and the marginal and the inward flange of sealed apron 003 of printing opacity sealing layer 004 are fixed. The collimating lens group 005 is located on one side of the sealing cover plate 004 away from the bottom plate 0011.

When the side wall to sealed apron and tube carries out parallel seal welding, the junction of sealed apron and this lateral wall can send more heat, and then sealed apron and this lateral wall thermal expansion produce great stress, and this stress can be transmitted to the printing opacity sealing layer through sealed apron, leads to the printing opacity sealing layer to be more breakable. Therefore, the production yield of the laser is low.

Disclosure of Invention

The application provides a laser, can solve the lower problem of preparation yield of laser. The technical scheme is as follows: the laser includes:

a cartridge comprising a floor and a tubular sidewall;

the light emitting assemblies are positioned in a cavity formed by the bottom plate and the side wall;

the sealing cover plate is annular, and the outer edge of the sealing cover plate is fixed on the surface, away from the bottom plate, of the side wall;

the light-transmitting sealing layer is fixed with the inner edge of the sealing cover plate;

the collimating lens group is positioned on one side of the sealing cover plate far away from the bottom plate;

wherein the inner wall or the outer wall of one end of the side wall far away from the bottom plate is provided with a groove extending along the circumferential direction of the side wall.

The beneficial effect that technical scheme that this application provided brought includes at least:

in the laser provided by the application, the inner wall or the outer wall of one end, away from the bottom plate, of the side wall of the tube shell is provided with the groove extending along the circumferential direction of the side wall, so that the wall thickness of the position, where the groove is located, in the side wall is thinner. When the side wall and the sealing cover plate are heated, the stress generated by the side wall and the sealing cover plate can easily deform the side wall where the groove is located so as to absorb more stress. And further, the stress transmitted to the light-transmitting sealing layer can be reduced, the risk of breakage of the light-transmitting sealing layer is reduced, and the preparation yield of the laser is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a laser provided in the related art;

fig. 2 is a schematic structural diagram of a laser provided in an embodiment of the present application;

fig. 3 is an exploded schematic view of a laser according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of another laser provided in an embodiment of the present application;

fig. 5 is a schematic structural diagram of a tube shell provided in an embodiment of the present application;

fig. 6 is an exploded view of a package according to an embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of another cartridge provided in an embodiment of the present application.

Detailed Description

To make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

With the development of the optoelectronic technology, the application of the laser is more and more extensive, for example, the laser can be applied to the aspects of welding process and cutting process, and the laser can be used as a light source in laser projection or laser television. The following embodiments of the present application provide a laser, can reduce the risk that the printing opacity sealing layer breaks in the laser, improve the preparation yield of laser.

Fig. 2 is a schematic structural diagram of a laser provided in an embodiment of the present application, fig. 3 is an exploded structural diagram of a laser provided in an embodiment of the present application, fig. 4 is a schematic structural diagram of another laser provided in an embodiment of the present application, fig. 2 may be a schematic diagram of a section a-a' of the laser shown in fig. 3, and fig. 4 may be a top view of fig. 2 and 3. As shown in fig. 2, the laser 10 may include: the light-emitting diode comprises a tube shell 101, a plurality of light-emitting components 102, a sealing cover plate 103, a light-transmitting sealing layer 104 and a collimating lens group 105. It should be noted that fig. 3 does not illustrate the light emitting element in the laser.

The package 101 may include a bottom plate 1011 and a tubular sidewall 1012, and the plurality of light emitting components 102 are located in a cavity defined by the bottom plate 1011 and the sidewall 1012. Alternatively, bottom 1011 and side walls 1012 in case 101 may be of unitary construction, or may be of separate construction, welded together to form case 101. In this embodiment of the present application, the side wall 1012 is taken as an example of a square tubular structure, and optionally, the side wall 1012 may also be a circular tubular structure, a pentagonal tubular structure, or a tubular structure with another shape, which is not limited in this embodiment of the present application. The inner and/or outer wall of the side wall 1012 at the end remote from the base plate 1011 has a groove K extending in the circumferential direction of the side wall 1012. Fig. 2 illustrates that only the outer wall of the side wall 1012 has the groove K, alternatively, only the inner wall of the side wall 1012 may have the groove, or both the outer wall and the inner wall may have the groove, which is not limited in the embodiment of the present application. The sealing cover plate 103 is annular, and the outer edge of the sealing cover plate 103 is fixed to the surface of the side wall 1012 away from the bottom plate 1011. The light transmissive sealing layer 104 is fixed to the inner edge of the sealing cover plate 103, for example, the edge of the light transmissive sealing layer 104 is fixed to the inner edge of the sealing cover plate 103. The collimating lens assembly 105 is located on the side of the sealing cover plate 103 away from the base plate 1011.

The thickness of the outer edge of the sealing cover plate 103, which is thinner in the embodiments of the present application and may be fixed to the surface of the side wall 1012 away from the bottom plate by a parallel sealing technique, may be less than a predetermined thickness threshold. The inner edge of the sealing cover plate 103 may be recessed toward the bottom plate 1011 relative to the outer edge. Alternatively, the sealing cover plate 103 may be a sheet metal part, and the thickness of each position of the sealing cover plate 103 is the same or approximately the same. The sealing cover plate 103 may be manufactured by a sheet metal process, for example, an annular plate-shaped structure may be stamped, so that a proper position in the plate-shaped structure is bent, recessed or raised, so as to obtain the sealing cover plate provided in the embodiment of the present application.

When the outer edge of the sealing cover 103 is fixed to the side wall 1012 of the package 101 by the parallel sealing technique, the sealing cover 103 is first placed on the side of the side wall 1012 of the package 101 away from the bottom plate 1011, and the outer edge of the sealing cover 103 overlaps the surface of the side wall 1012 of the package 101 away from the bottom plate 1011. The outer edge is then heated by a sealing device to melt the connection of the outer edge to side wall 1012 and to weld the outer edge to side wall 1012 of package 101. Alternatively, the light-transmissive sealing layer 104 may be fixed to the sealing cover plate 103 before the sealing cover plate 103 is fixed to the package 101, for example, an edge of the light-transmissive sealing layer 104 may be fixed to an inner edge of the sealing cover plate 103 by a sealant. The sealant may include glass frit, low temperature glass solder, epoxy sealant or other sealant glues. The sealing glue can coat the side surface of the light-transmitting sealing layer so as to ensure the pasting reliability of the light-transmitting sealing layer.

When parallel sealing is performed, the package 101 and the sealing cap 103 thermally expand, and thus generate large stress. Since the sidewall portion of sidewall 1012 of package 101 where recess K is located is thinner, the sidewall portion where the recess is located is easier to deform under the stress, such as become uneven, and the deformation amount can be smaller than the set deformation amount threshold, i.e. the deformation amount is smaller. This is equivalent to converting the stress into mechanical force, thereby achieving the effect of absorbing the stress, so that the stress transmitted to the light-transmitting sealing layer 104 is smaller.

In the embodiment of the present application, the collimating lens group 105 is used for collimating and emitting the light emitted by the light emitting element. It should be noted that, collimating the light, that is, converging the light, makes the divergence angle of the light smaller, and is closer to the parallel light. The collimating lens group 105 may include a plurality of collimating lenses, the plurality of collimating lenses may correspond to the plurality of light emitting assemblies 102 in the laser one-to-one, and light emitted by each light emitting assembly may be emitted to the corresponding collimating lens, and then emitted after being collimated by the collimating lens.

In the embodiment of the present application, after the sealing cover plate 103 is fixed to the case 101, the collimating lens group 105 can be suspended at one side of the sealing cover plate 103 away from the bottom plate to perform the debugging of the light collimating effect. After the position of the collimating lens group 105 is determined by debugging, for example, after the position of the collimating lens group is determined to ensure that the light emitted by each light emitting component 102 can pass through the corresponding collimating lens, the outer edge of the sealing cover plate 103 is coated with an adhesive, and then the collimating lens group 105 and the sealing cover plate 103 are fixed by the adhesive. Since the position of the collimating lens group 105 can be adjusted, even if the side wall 1012 is slightly deformed due to heat generated when the sealing cover plate 103 is fixed, the influence of the deformation of the side wall 1012 on the light emission of the light emitting element 102 can be compensated by adjusting the position of the collimating lens group 105, thereby ensuring the normal light emission of the laser 10.

In summary, in the laser provided in the embodiments of the present application, the inner wall or the outer wall of the side wall of the package at the end away from the bottom plate has a groove extending along the circumferential direction of the side wall, so that the wall thickness of the side wall where the groove is located is thinner. When the side wall and the sealing cover plate are heated, the stress generated by the side wall and the sealing cover plate can easily deform the side wall where the groove is located so as to absorb more stress. And further, the stress transmitted to the light-transmitting sealing layer can be reduced, the risk of breakage of the light-transmitting sealing layer is reduced, and the preparation yield of the laser is improved.

As shown in fig. 2, the plurality of collimating lenses in the collimating lens group 105 can be integrally formed, one side of the collimating lens group 105 far from the bottom plate 1011 of the tube shell 101 can have a plurality of convex arc surfaces bending towards one side far from the bottom plate 1011, and the portion where each convex arc surface is located can be used as a collimating lens, so that the collimating lens group can be regarded as including a plurality of collimating lenses. This collimating lens can be the convex lens of plano-convex form, and this collimating lens can have a convex arc face and a plane, and this convex arc face and plane can be two relative faces, and this plane can be on a parallel with the face of bottom plate 1011, and is close to bottom plate 1011 and sets up. Each of the convex curved surfaces of the collimator lens group 105 may be a convex curved surface in one collimator lens. Optionally, in the embodiment of the present application, a radius of curvature of the collimating lens in the collimating lens group (that is, a radius of curvature of the convex arc surface in the collimating lens) may range from 1 mm to 4.5 mm.

Alternatively, on the base plate 1011, the orthographic projection of the outer edge of the sealing cover plate 103 lies within the orthographic projection of the surface of the side wall 1012 remote from the base plate 1011, i.e. the outer edge of the sealing cover plate 103 may be retracted relative to the outer wall of the side wall 1012 without protruding beyond the side wall 1012. The maximum distance d1 between the outer edge of the sealing flap 103 and the outer edge of the side wall 1012 may be less than 0.1 mm. The maximum distance d1 may be 0.05 mm, for example. Alternatively, the outer edge of the sealing cover plate 103 and the outer edge of the sidewall 1012 may be in a similar concentric pattern (e.g., both rectangular shapes), and the distances between the outer edge of the sealing cover plate 103 and the outer edges of the sidewalls 1012 at various positions are equal, and may be smaller than 0.1 mm, for example, may be both 0.05 mm. Because the surface that is used for in the sealing equipment and is contacted with the object that is welded is the inclined plane, and the outer border of outward flange part is along retracting relatively the outer border of this lateral wall, can guarantee that this inclined plane of sealing equipment can contact the outward flange of sealed apron and the surface that the bottom plate was kept away from to the lateral wall simultaneously, and then can make this outward flange all take place the melting with the lateral wall, and parallel sealing's effect is better. Optionally, the outer edge of the sidewall of the tube shell may also coincide with the outer edge of the sealing cover plate, which is not limited in this embodiment of the application.

In the present embodiment, the inner edge of the sealing cover plate 103 is recessed toward the bottom plate with respect to the outer edge. The outer edge of the sealing cover plate is of annular plate-like configuration, the width of the outer edge may be wider than the width of the surface of the side wall 1012 remote from the base plate 1011, and the difference between the width of the outer edge portion W2 and the width of the surface of the side wall 1012 remote from the base plate 1011 may be less than a set threshold, i.e. the width of the outer edge may be slightly wider than the width of the surface of the side wall 1012 remote from the base plate 1011. It should be noted that any ring structure described in the embodiments of the present application refers to the ring width of the ring.

This recess K can be U type groove or rectangular channel (or can also be called square groove) in this application embodiment. The U-shaped groove is also a groove with a U-shaped section, and the rectangular groove is also a groove with a rectangular section, and the section is vertical to the extending direction of the groove. Alternatively, the groove may include two side surfaces and a bottom surface connecting the two side surfaces, the bottom surface of the U-shaped groove may not be a flat surface, and the bottom surface of the rectangular groove may be a flat surface. In the embodiment of the present application, fig. 2 and 3 exemplify that the groove is a rectangular groove. Optionally, the groove may also be a groove with other shapes, for example, the groove may also be a trapezoidal groove, a V-shaped groove, or a semicircular groove, and at this time, the groove may also only include one groove surface or two side surfaces, which is not limited in the embodiment of the present application.

In the present embodiment, the wall thickness d2 of the sidewall 1012 at the location of the groove K may be less than or equal to 0.6 mm, for example, the wall thickness may be 0.25 mm. It should be noted that the wall thickness of the side wall at the location of the groove may include the wall thickness of the side wall at any position at the location of the groove. Optionally, if the groove includes a groove surface parallel to the inner wall of the side wall, if the groove is a rectangular groove, and the bottom surface of the groove is parallel to the inner wall, the wall thickness of each position of the groove in the side wall is the same, for example, 0.25 mm; if the bottom surface of the groove is not parallel to the inner wall of the side wall (if the groove is a U-shaped groove), the wall thickness of each position of the groove in the side wall is different. In the embodiment of the application, the wall thickness of each position of the groove in the side wall can be less than or equal to 0.6 mm, no matter whether the wall thickness of each position is the same or not. Therefore, the wall thickness of the position of the groove in the side wall is ensured to be thin, and the side wall of the position of the groove is easy to deform under the action of stress generated by thermal expansion of the pipe shell so as to absorb the stress easily.

In the embodiment of the present application, the groove K at the end of the sidewall 1012 away from the bottom plate 1011 may surround the entire inner circumferential surface of the sidewall 1012. The extension locus of the groove K may be the same as the shape of the sidewall 1012. For example, the sidewall 1012 has a square tubular structure, and the extending track of the groove K may have a rectangular shape. Alternatively, if the sidewall has a circular tubular structure, the extending track of the groove may be circular.

It should be noted that, in the embodiment of the present application, only the outer wall of the sidewall has one groove, and the groove surrounds the entire inner annular surface of the sidewall. Alternatively, the side wall may also have a plurality of recesses. For example, the extending locus of each of the plurality of grooves may be rectangular, and each groove surrounds the inner annular surface of the side wall, for example, the plurality of grooves may be sequentially arranged on the side wall along a direction away from the bottom plate. As another example, the extending locus of the plurality of grooves may not be rectangular, and may not surround the entire inner annular surface of the side wall. For example, each of the plurality of grooves is a strip-shaped groove extending only in one direction, and the plurality of grooves may be respectively arranged on different sides of the sidewall; if the sidewall is a square tubular structure, the sidewall may have four grooves respectively located on four sides of the sidewall, and the length of each groove may be less than or equal to the length of one side of the sidewall where the groove is located, or the sidewall may also have only grooves located on three sides or two sides of the sidewall, which is not limited in the embodiment of the present application. Optionally, some of the grooves may be located on the outer wall of the side wall, and some of the grooves may be located on the inner wall of the side wall, or may be located on both the inner wall and the outer wall of the side wall, which is not limited in this embodiment of the application.

Alternatively, in the embodiment of the present application, the distance d3 between the surface of the side wall 1012 of the tube housing 101 parallel to and away from the bottom plate 1011 and the groove K may be less than or equal to 0.6 mm, for example, the distance may be 0.25 mm, and the surface of the side wall 1012 parallel to and away from the bottom plate 1011, that is, the surface fixed to the outer edge of the sealing cover plate 103. It is noted that the distance between the surface and the recess may comprise a minimum distance between the recess and a respective location in the surface in a direction perpendicular to the base plate. Alternatively, the groove surface of the groove close to the surface may be parallel to the surface, and the minimum distances between each position in the surface and the groove may be equal, and are distances between the groove surface and the surface, such as 0.25 mm. If the minimum distances between the different locations in the surface and the grooves are different, the minimum distances between the different locations and the grooves may also each be less than or equal to 0.6 mm. For example, as shown in fig. 2, the groove K is a rectangular groove, the surface of the sealing cover plate 103 parallel to the bottom plate 1011 and the groove surface of the groove K close to the surface are parallel, and the distance d3 between the surface and the groove K may be equal to the wall thickness d2 where the groove is located in the side wall. When the outer edge of the sealing cover plate is fixed to the side wall of the tube case by using a sealing device, it is necessary to melt the connecting position of the outer edge of the sealing cover plate and the side wall. In the related technology, the side wall of the pipe shell is of a tubular structure with flat inner wall and outer wall, and the height of the side wall is larger, so that the melting rate of the side wall under the action of sealing equipment is slower and the difficulty is larger; and distance d3 between the parallel surface of just keeping away from the bottom plate and the recess is less in this application embodiment in the lateral wall, so lie in the thickness of the part between this surface and the recess in the lateral wall on the direction of perpendicular bottom plate thinner, this part melts under the effect of sealing equipment more easily, and then can improve the efficiency of sealing the sealed apron, and the welding firmness of sealed apron and this lateral wall can be higher.

The side wall of the embodiment of the present application has a plurality of realizable manners in preparation, and two realizable manners are described below:

in a first alternative implementation, the inner or outer wall of a tubular structure, in which both the inner and outer walls are flat, may be machined to form grooves to obtain the shell shown in fig. 2. Such as by grinding or milling a particular location in the tubular structure with a tool (e.g., a milling cutter) to form a recess in that location, or by etching the particular location in the tubular structure through an etching process to form a recess.

In a second alternative implementation, please refer to fig. 5 and fig. 6, fig. 5 is a schematic structural diagram of a tube shell provided in an embodiment of the present application, fig. 6 is an exploded structural diagram of a tube shell provided in an embodiment of the present application, and fig. 5 may be a schematic diagram of a section b-b' of the tube shell shown in fig. 6. The sidewall 1012 may include a first tubular structure 1012a and a second tubular structure 1012 b. The first tubular structure 1012a is fixed on the base plate 1011, the second tubular structure 1012b is fixed on the surface of the first tubular structure 1012a far from the base plate 1012a, the first tubular structure 1012a can be a tubular structure with flat inner wall and outer wall, and the second tubular structure 1012b has a groove K. That is, the second tubular structure 1012b is the end of the sidewall 1012 away from the base 1011, and the sidewall 1012 has a recess K that is the recess of the second tubular structure 1012 b. The materials of the first tubular structure 1012a and the second tubular structure 1012b may be the same or different, and the embodiment of the present invention is not limited thereto.

The second tubular structure 1012b may be, for example, a sheet metal part, and may be obtained by stamping an annular plate-shaped structure through a sheet metal process to recess or protrude a specific region. Such as by bending the ends of an annular plate-like structure outward or by recessing the region of the annular plate-like structure between the ends inward to provide the second tubular structure 1012b of figures 5 and 6. Alternatively, the second tubular structure 1012b may be secured to the surface of the first tubular structure 1012a remote from the base plate 1011 by brazing. Alternatively, the surface of the first tubular structure 1012a remote from the base plate 1011 and the surface of the second tubular structure 1012b proximate to the base plate 1011 may be congruent in shape, and the orthographic projections of the first tubular structure 1012a and the second tubular structure 1012b on the base plate may completely coincide.

In the embodiment of the present application, a cross section of one end of the side wall away from the bottom plate may be a square wave extending in a direction perpendicular to the bottom plate, the cross section is perpendicular to the bottom plate, and the square wave may have one, two, three or more wave periods. For example, for the second alternative implementation of the sidewall described above, the cross-section of the second tubular structure 1012b may have a square wave shape extending along the length of the second tubular structure 1012 b. Fig. 7 is a schematic structural diagram of another tube shell provided by an embodiment of the present application, and as shown in fig. 7, the cross section of the second tubular structure 1012b has a square waveform with two wave periods, that is, each of the inner wall and the outer wall of the second tubular structure 1012b has a groove K.

The section of one end of the side wall far away from the bottom plate is in a square wave shape extending along the direction vertical to the bottom plate, namely the groove on the side wall is a rectangular groove. If the square wave has a plurality of wave periods, that is, one end of the side wall far away from the bottom plate is provided with a plurality of grooves, and the grooves are alternately arranged on the inner wall and the outer wall of the side wall in the direction vertical to the bottom plate. Optionally, the sizes of the plurality of grooves may be the same or may also be different, and the embodiment of the present application is not limited. The dimensions of the groove may include the depth and the width of the groove, referring to fig. 5, the depth d4 of the groove is the distance between the opening of the groove and the bottom surface of the groove, the depth d4 of a certain groove is the difference between the maximum thickness d7 of the side wall and the wall thickness d2 (referring to fig. 2 for the distance indicated by d 2) of the side wall where the groove is located, and the width d5 of the groove is the dimension of the opening of the groove in the direction perpendicular to the extending direction of the groove.

For example, the maximum thickness of the sidewall in the embodiment of the present application may be in a range of 1.2 mm to 2.5 mm, and the depth of the groove in the embodiment of the present application may be in a range of 0.6 mm to 1.9 mm because the wall thickness d2 where the groove is located in the sidewall is less than 0.6 mm. The length d8 (refer to fig. 7 for the distance indicated by d 8) of the sidewall portion where the groove is located in the direction perpendicular to the bottom plate in the embodiment of the present application may range from 0.6 mm to 4 mm, and the number of the grooves on the sidewall may be one, or two, three or more. The maximum width of the grooves in the embodiments of the present application may range less than 4 mm. It should be noted that the length d8 of the side wall portion (i.e. the portion of the side wall with a thinner wall thickness) where the groove is located in the embodiment of the present application is smaller in the direction perpendicular to the bottom plate, so that the side wall can still have higher strength, and the side wall can effectively protect the components inside the case. Alternatively, the distance between adjacent grooves of the plurality of grooves (e.g., the distance d6 between two adjacent grooves in fig. 7) may be less than or equal to 0.6 mm, e.g., the distance d6 may be equal to the wall thickness d2 of the sidewall where the grooves are located, e.g., 0.25 mm. When the side wall has a plurality of grooves, the width of each groove may be designed according to the number of the plurality of grooves. Optionally, when the side wall has a plurality of grooves, the widths d5 of the grooves may be all equal, the distances d6 between adjacent grooves may also be all equal, and the distance d6 may be equal to the distance d3 between the surface parallel to the side wall and away from the bottom plate and the groove, where the width d5 of each groove is d8-n d6, and n is the number of the grooves.

In the embodiment of the present application, a cross section of one end of the side wall away from the bottom plate is in a square waveform extending in a direction perpendicular to the bottom plate, and the square waveform has one, two or three wave periods, and the cross section of the end of the side wall away from the bottom plate can also be called as Contraband-shaped, Chinese character 'ji' shaped or Chinese character 'bow' shaped. Wherein, if only the inner wall or the outer wall of the side wall is provided with a groove, the section can be Contraband; if the inner wall and the outer wall of the side wall are respectively provided with a groove, the section can be in a shape of a Chinese character 'ji' or an S shape; if one of the inner and outer walls of the side wall has one groove and the other has two grooves, the cross-section may be in the shape of a Chinese character bow.

In the embodiment of the present application, the end of the side wall away from the bottom plate has a plurality of grooves arranged in a direction perpendicular to the bottom plate, so that the end of the side wall away from the bottom plate has a plurality of bending structures (for example, the bending structure W in fig. 7). Therefore, when the side wall is heated to generate stress, each bending structure can correspondingly deform towards the bending direction to further enhance the stress absorption effect. In the embodiment of the present application, the bending portions of the bending structure are all square corners, and optionally, the bending portions of the bending structure may have a chamfer or a fillet, so as to avoid too concentrated stress at the bending portions.

In the embodiment, with continued reference to fig. 2 and fig. 3, the light emitting assembly 102 may include a light emitting chip 1021, a heat sink 1022, and a reflective prism 1023. A heat sink 1022 may be disposed on the bottom plate 1011 of the package 101, the light emitting chip 1021 may be disposed on the heat sink 1022, the heat sink 1022 serves to assist the light emitting chip 1021 in heat dissipation, and the reflective prism 1023 may be located at a light emitting side of the light emitting chip 1021. Light emitted from the light emitting chip 1021 can be directed to the reflective prism 1023, and then reflected on the reflective prism 1023 to be emitted through the light-transmissive sealing layer 104. For example, the plurality of light emitting chips may all emit light of the same color, or different light emitting chips in the plurality of light emitting chips may emit light of different colors, which is not limited in this embodiment of the application. The light emitted by the light emitting chip can be laser. The light emitting chip 1021 can generate a large amount of heat during operation, and then the heat is transferred to the bottom plate 1011 through the heat sink 1022, and then is conducted to the sidewall 1012 through the bottom plate 1011, at this time, the effect of the heat on the sidewall 1012 is the same as the effect of the heat generated by parallel sealing on the sidewall 1012, and the groove in the sidewall can also deform to absorb stress under the effect of the heat. Optionally, after the light emitting chip stops working and is cooled, the side wall can be restored to the original shape to release the stress.

Alternatively, the plurality of light emitting elements in the Laser may include a plurality of rows and columns of light emitting chips arrayed on the bottom plate of the package, and the Laser may be a multi-chip Laser Diode (MCL) type Laser. The distance between the adjacent light emitting chips in the first direction may be 2-4 mm, for example, 3 mm, and the first direction may be a light emitting direction of the light emitting chips. In a second direction perpendicular to the first direction, the distance between adjacent light emitting chips may be in a range of 3 to 6 mm, for example, may be 4 mm.

In the embodiment of the present application, the light transmissive sealing layer 104 may be a plate-shaped structure. The plate-like structure may comprise two parallel larger surfaces and a plurality of smaller sides connecting the two surfaces, and the sides of the light-transmissive sealing layer 104 may be fixed to the inner edge of the sealing cover plate 103 by a sealing glue (not shown in fig. 2). In this application embodiment, the printing opacity sealing layer can be directly fixed with sealed apron, and perhaps the laser instrument can also include the carriage, and the printing opacity sealing layer can be fixed with the carriage earlier, and then the carriage is fixed with sealed apron again. For example, the supporting frame may be a frame shaped like a Chinese character 'mu', so that the middle region of the light-transmitting sealing layer may be supported by the supporting frame, and the setting firmness of the light-transmitting sealing layer may be improved. Optionally, a brightness enhancement film may be attached to at least one of the surface close to the substrate and the surface far from the substrate of the light-transmitting sealing layer to improve the light-emitting brightness of the laser.

In the embodiment of the present application, the package 101, the sealing cover plate 103, and the light-transmitting sealing layer 104 may form a closed space, so that the light emitting element 102 may be located in the closed space, and the light emitting element 102 is prevented from being corroded by water and oxygen. Since the risk of cracking of the light-transmitting sealing layer 104 is reduced, the sealing effect of the sealed space can be ensured, and the life of the light-emitting component can be further prolonged.

The material of this tube shell in this application embodiment can be copper, for example oxygen-free copper, and the material of this printing opacity sealing layer can be glass, and the material of this sealed apron can be stainless steel. Because the thermal expansion coefficient of the stainless steel is larger than that of the glass and smaller than that of the oxygen-free copper, the difference of the thermal expansion coefficients of all connected parts is small, the stress transmitted to the sealing cover plate and the sealing glass by the oxygen-free copper pipe shell due to thermal expansion can be properly relieved, and the preparation yield of the laser is further improved.

It should be noted that, the coefficient of heat conductivity of copper is great, and the material of tube in this application embodiment is copper, so can guarantee that the light emitting component who sets up on the bottom plate of tube can conduct through the tube fast at the heat that the during operation produced, and then very fast giveaway, avoids heat to gather the damage to light emitting component. Optionally, the material of the package may be one or more of aluminum, aluminum nitride and silicon carbide. The material of the sealing cover plate in the embodiment of the present application may also be other kovar materials, such as iron-nickel-cobalt alloy or other alloys. The material of the light-transmitting sealing layer may also be other materials with light-transmitting and high reliability, such as resin materials.

With continued reference to fig. 3, 4 and 6, the side wall 1012 of package 101 may have a plurality of openings on opposite sides thereof, and laser 10 may further include: conductive pins 106, and conductive pins 106 may extend into package 101 through openings in sidewalls 1012, respectively, to be fixed to package 101. The conductive pins 106 may be electrically connected to electrodes of the light emitting chips in the light emitting assembly 102 to transmit an external power to the light emitting chips, so as to excite the light emitting chips to emit light. Alternatively, the aperture of the opening may be 1.2 mm, and the diameter of the conductive pin 106 may be 0.55 mm.

Optionally, in the embodiment of the present application, when assembling the laser, a groove may be formed on the tubular structure first, or a second tubular structure may be formed by a sheet metal technique, and the second tubular structure is brazed with the first tubular structure to obtain the side wall of the tube shell. The side wall of the package may have a plurality of openings, and a ring-shaped solder structure (e.g., a ring-shaped glass bead) may be disposed in the openings on the side wall of the package, and the conductive leads may be inserted through the solder structure and the openings where the solder structure is located. Then, the side wall is placed on the periphery of the bottom plate, annular silver-copper solder is placed between the bottom plate and the side wall, then the structure of the bottom plate, the side wall and the conductive pins is placed in a high-temperature furnace for sealed sintering, the bottom plate, the side wall, the conductive pins and the solder can be integrated after sealed sintering and solidification, and then air tightness of the opening of the side wall is achieved. The light-transmitting sealing layer may be fixed to the sealing cover plate, for example, an edge of the light-transmitting sealing layer is adhered to an inner edge of the sealing cover plate, so as to obtain the upper cover assembly. Then can weld light emitting component on the bottom plate in the accommodation space of tube, adopt parallel seal welding technique to weld the upper cover subassembly on the lateral wall of tube keeps away from the surface of bottom plate, aim at the position of the straight mirror group at last and aim at the back, with the straight mirror group through epoxy glue fixed in the one side that the bottom plate was kept away from to the upper cover subassembly, so far accomplish the equipment of laser instrument. It should be noted that the above-mentioned assembling process is only an exemplary process provided in the embodiment of the present application, the welding process adopted in each step may also be replaced by another process, and the sequence of each step may also be adapted to be adjusted, which is not limited in the embodiment of the present application.

In the above embodiments of the present invention, the bottom plate and the side wall of the case are taken as two separate structures to be assembled. Alternatively, the bottom plate and the side wall may be integrally formed. So can avoid bottom plate and lateral wall to produce the fold because the bottom plate that the thermal expansion coefficient of bottom plate and lateral wall is different to lead to when high temperature welded, and then can guarantee the flatness of bottom plate, guarantee light-emitting component and set up the reliability on the bottom plate, and guarantee that the light that luminous chip sent is according to predetermined luminous angle outgoing, improve the luminous effect of laser instrument.

It should be noted that, in the embodiments of the present application, the term "and/or" in the present application is only one kind of association relationship describing an associated object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship. The terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The term "plurality" means two or more unless expressly limited otherwise. "substantially" means within an acceptable error range, within which a person skilled in the art can solve the technical problem to substantially achieve the technical result. In the drawings, the size of layers and regions may be exaggerated for clarity of illustration. Also, it will be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element or layer or intervening layers may also be present. Like reference numerals refer to like elements throughout.

The above description is only exemplary of the present application and should not be taken as limiting, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A laser, characterized in that the laser comprises:

a cartridge comprising a floor and a tubular sidewall;

wherein the inner wall and/or the outer wall of the side wall at the end far away from the bottom plate is provided with a groove extending along the circumferential direction of the side wall.

2. The laser of claim 1, wherein the wall thickness of the sidewall at the location of the groove is less than or equal to 0.6 mm.

3. The laser of claim 1, wherein a distance between a surface of the sidewall parallel to and distal from the base plate and the groove is less than or equal to 0.6 mm.

4. The laser of claim 1, wherein the groove is a U-shaped groove or a rectangular groove.

5. The laser of claim 1, wherein the sidewall is a square tubular structure, and the extending track of the groove is rectangular.

6. The laser of any of claims 1 to 5, wherein the sidewall comprises a first tubular structure and a second tubular structure;

the first tubular structure is fixed on the bottom plate, the second tubular structure is fixed on the surface of the first tubular structure far away from the bottom plate, and the second tubular structure is provided with the groove.

7. The laser of claim 6, wherein the second tubular structure is a sheet metal part.

8. The laser of claim 7, wherein a cross-section of the second tubular structure has a square wave shape extending along a length of the second tubular structure, the cross-section being perpendicular to the base plate.

9. A laser according to any one of claims 1 to 5, wherein, on the base plate, an orthographic projection of the outer edge of the sealing cover plate is located within an orthographic projection of the surface of the side wall remote from the base plate, and the maximum distance between the outer edge of the sealing cover plate and the outer edge of the side wall is less than 0.1 mm.

10. A laser according to any one of claims 1 to 5, wherein the outer edge of the sealing cover plate is secured to the surface of the side wall remote from the base plate by a parallel seal technique.