CN114122153B - Integrated packaging structure based on photoconductive switch and laser device - Google Patents

Abstract

The present invention relates to an integrated packaging structure based on a photoconductive switch and a laser device, comprising an upper and lower shell body that fit each other, two conductive columns are arranged at the bottom of the lower shell body, the upper ends of the conductive columns penetrate into the interior of the lower shell body, and the lower ends extend to the outside of the lower shell body, respectively connected to the two electrodes of the photoconductive switch, a closed space that can accommodate a laser diode is arranged in the upper shell body, and a through hole is opened at the top of the upper shell body for leading out the electrode. The beneficial effect of the present invention is that the packaging structure is formed by the matching of the photoconductive switch packaging structure and the laser diode packaging structure, and can accurately locate the irradiation position of the laser diode, and facilitate the replacement of the laser diode. At the same time, the photoconductive switch can be kept away from the inner wall of the package, and the surface is in full contact with the insulating coolant, which can be fully cooled, thereby avoiding the photoconductive switch from being damaged by discharge and sparking, and improving the pressure resistance of the photoconductive switch.

Description

Integrated packaging structure based on photoconductive switch and laser device

Technical Field

The invention relates to an integrated packaging structure based on a photoconductive switch and a laser device, belonging to the technical field of semiconductor devices.

Background Art

Photoconductive switches are new fast optoelectronic devices that integrate laser technology and semiconductor technology. Based on the photoelectric effect of semiconductor materials, the number of photogenerated carriers is changed by light triggering, causing the conductivity of semiconductor materials to change, so that the switch can be turned on and off within nanoseconds (ns) or even picoseconds (ps). Photoconductive switches have the advantages of simple structure, small jitter time, extremely fast response speed, high repetition frequency, etc., and can work under high voltage and high power.

The packaging structure is crucial for photoconductive switching devices. Currently, device modularization is still the focus. The incident position of the laser device is difficult to accurately fix, and the operating voltage of high-power photoconductive switches is very high, which makes surface breakdown discharge prone to occur, leading to device damage, which is also a problem.

Summary of the invention

In order to solve the above technical deficiencies, the present invention provides an integrated packaging structure based on a photoconductive switch and a laser device. The packaging structure is formed by combining a photoconductive switch packaging structure and a laser diode packaging structure, which can accurately locate the irradiation position of the laser diode and facilitate the replacement of the photoconductive switch and the laser device. At the same time, the photoconductive switch can be kept away from the inner wall of the package, and the surface is in full contact with the insulating coolant, which can be fully cooled, avoiding the photoconductive switch from being damaged by discharge and sparking, and improving the pressure resistance of the photoconductive switch.

The present invention is achieved by the following measures:

An integrated packaging structure based on a photoconductive switch and a laser device comprises an insulating lower shell, an insulating upper shell is detachably connected to the top of the lower shell, an upper opening is arranged on the top of the lower shell, a lower opening is arranged on the bottom of the upper shell, a light-transmitting glass is blocked between the lower opening and the upper opening, a closed space for accommodating the photoconductive switch is arranged in the lower shell, and the closed space is filled with insulating coolant, two conductive columns are arranged at the bottom of the lower shell, the upper ends of the conductive columns penetrate into the interior of the lower shell, and the lower ends of the conductive columns extend to the outside and below the bottom of the lower shell, the two conductive columns are respectively connected to the two electrodes of the photoconductive switch, a closed space for accommodating a laser diode is arranged in the upper shell, and a through hole for leading out the electrode is opened at the top of the upper shell.

The inner edge surface of the upper end surface of the lower shell is provided with a slot surrounding the lower opening, the edge of the light-transmitting glass is embedded in the slot, and the upper surface of the light-transmitting glass is flush with the outer edge surface of the upper end surface of the lower shell.

The lower end surface of the upper shell is provided with a plurality of positioning holes extending vertically upward, and the upper end surface of the lower shell is provided with a plurality of positioning cylinders extending vertically upward, and the positioning cylinders are plug-fitted with the positioning holes.

An injection hole is provided on the side wall of the lower shell, and a plugging screw is detachably inserted into the injection hole.

The upper shell and the lower shell are both made of insulating materials, and the insulating coolant is insulating oil or fluorinated liquid.

Preferably, both the upper shell and the lower shell are made of ceramic material.

The beneficial effects of the present invention are as follows: the packaging structure of the present invention is formed by combining the packaging structure of the photoconductive switch and the packaging structure of the laser diode, which can accurately locate the irradiation position of the laser diode and facilitate the replacement of the photoconductive switch and the laser device. It can also avoid surface breakdown; the sealed space is filled with insulating coolant, and the insulating coolant can completely wrap the photoconductive switch, so that the surface of the photoconductive switch is in full contact with the insulating coolant, which can fully cool the photoconductive switch, avoid the photoconductive switch from being damaged by discharge and sparking, and improve the pressure resistance of the photoconductive switch.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic diagram of the main structure of the present invention.

FIG. 2 is a schematic diagram of the side structure of the present invention.

In the figure: 1. positioning cylinder; 2. light-transmitting glass; 3. lower shell; 5. conductive column; 6. injection hole; 7. positioning hole; 8. upper shell; 9. through hole.

DETAILED DESCRIPTION

The present invention is further described in detail below in conjunction with the accompanying drawings:

As shown in Fig. 1 and Fig. 2, an integrated packaging structure based on a photoconductive switch and a laser device includes an insulating lower shell 3, and an insulating upper shell 8 is detachably connected to the upper part of the lower shell 3. In order to facilitate accurate positioning, a plurality of positioning holes 7 extending vertically upward are provided on the lower end surface of the upper shell 8, and a plurality of positioning cylinders 1 extending vertically upward are provided on the upper end surface of the lower shell 3, and the positioning cylinders 1 are plugged into the positioning holes 7. When the upper shell 8 is placed on the lower shell 3, the positioning cylinders 1 are inserted into the positioning holes 7. An upper opening is provided at the top of the lower shell 3, and a lower opening is provided at the bottom of the upper shell 8. A light-transmitting glass 2 is sealed between the lower opening and the upper opening. A closed space for accommodating a photoconductive switch is provided in the lower shell 3, and the closed space is filled with insulating coolant. Two conductive columns 5 are provided at the bottom of the lower shell 3. The upper ends of the conductive columns 5 penetrate into the lower shell 3, and the lower ends of the conductive columns 5 extend to the lower outside of the bottom of the lower shell 3. The two conductive columns 5 are respectively connected to the two electrodes of the photoconductive switch. A closed space for accommodating a laser diode is provided in the upper shell 8. A through hole 9 is provided at the top of the upper shell 8 for leading out the electrode. The photoconductive switch packaging structure and the laser diode packaging structure are independent of each other, and are matched into an integral packaging structure through the positioning cylinder 1 on the outer shell of the photoconductive switch packaging structure and the positioning hole 7 on the outer shell of the laser diode packaging structure. The irradiation position of the laser diode can be accurately positioned, and the photoconductive switch and the laser device can be easily replaced. An injection hole 6 is provided on the side wall of the lower shell 3, and a plugging screw can be removably inserted into the injection hole 6. When the injection hole 6 is opened, the insulating coolant is poured in, and then the plugging screw is inserted to block the injection hole 6.

The inner edge surface of the upper end face of the lower shell 3 is provided with a slot surrounding the lower opening, and the edge of the light-transmitting glass 2 is embedded in the slot, and the upper surface of the light-transmitting glass 2 is flush with the outer edge surface of the upper end face of the lower shell 3. A light-transmitting window is formed, and the optical glass plate is sealed to achieve a sealed state. The upper shell 8 and the lower shell 3 are both made of ceramic material, and the insulating coolant is insulating oil or fluorinated liquid.

The packaging structure provided by the present invention is formed by combining the photoconductive switch packaging structure and the laser diode packaging structure, which can accurately locate the irradiation position of the laser diode and facilitate the replacement of the photoconductive switch and the laser device. At the same time, the photoconductive switch can be kept away from the inner wall of the packaging, and the surface is fully in contact with the insulating coolant, which can be fully cooled, avoiding the photoconductive switch from being damaged by discharge and sparking, and improving the pressure resistance of the photoconductive switch.

The above is only a preferred implementation of this patent. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of this patent. These improvements and substitutions should also be regarded as the scope of protection of this patent.

Claims (5)

1. An integrated packaging structure based on photoconductive switch and laser device, its characterized in that: including insulating inferior valve, inferior valve top can be dismantled and be connected with insulating last casing, inferior valve top is provided with the upper shed, and it is provided with the lower shed to go up the casing bottom, the shutoff has light-transmitting glass between lower shed and the upper shed, is provided with the airtight space that can hold photoconductive switch in the inferior valve, and this airtight space intussuseption is filled with insulating coolant liquid, inferior valve bottom is provided with two conductive posts, the conductive post upper end penetrates inside inferior valve, and conductive post lower extreme extends to inferior valve bottom outside below, and two conductive posts are connected with photoconductive switch's two electrodes respectively, are provided with the airtight space that can hold laser diode in the superior valve, and the last casing top is opened there is the through-hole that is used for drawing forth the electrode.

2. The integrated packaging structure based on photoconductive switch and laser device according to claim 1, wherein: the inner side edge surface of the upper end face of the lower shell is provided with a clamping groove surrounding the periphery of the lower opening, the edge of the light-transmitting glass is embedded in the clamping groove, and the upper surface of the light-transmitting glass is flush with the outer side edge surface of the upper end face of the lower shell.

3. The integrated packaging structure based on photoconductive switch and laser device according to claim 1, wherein: the lower end face of the upper shell is provided with a plurality of positioning holes extending vertically upwards, the upper end face of the lower shell is provided with a plurality of positioning cylinders extending vertically upwards, and the positioning cylinders are in plug-in fit with the positioning holes.

4. The integrated packaging structure based on photoconductive switch and laser device according to claim 1, wherein: an injection hole is formed in the side wall of the lower shell, and a plugging screw is detachably plugged into the injection hole.

5. The integrated packaging structure based on photoconductive switch and laser device according to claim 1, wherein: the upper shell and the lower shell are made of insulating materials, and the insulating cooling liquid is insulating oil or fluoridized liquid.