CN114122029A - Display panel, method for making the same, and display device - Google Patents
Display panel, method for making the same, and display device Download PDFInfo
- Publication number
- CN114122029A CN114122029A CN202111447222.4A CN202111447222A CN114122029A CN 114122029 A CN114122029 A CN 114122029A CN 202111447222 A CN202111447222 A CN 202111447222A CN 114122029 A CN114122029 A CN 114122029A
- Authority
- CN
- China
- Prior art keywords
- layer
- display panel
- base substrate
- inorganic insulating
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/451—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by the compositions or shapes of the interlayer dielectrics
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
本发明提供了一种显示面板，包括：显示区、开孔区和位于所述显示区和所述开孔区之间的隔离区，其特征在于，所述隔离区设置有：衬底基板；位于所述衬底基板上的无机绝缘层，所述无机绝缘层具有至少一个凹陷部；位于所述无机绝缘层远离所述衬底基板一侧的发光层和阴极，其中，所述发光层和所述阴极从所述显示区延伸至所述隔离区时在所述无机绝缘层的所述至少一个凹陷部断开。本发明实施例提供的显示面板通过在隔离区的无机绝缘层设置凹陷部，既能够隔断发光层又能隔断阴极，不仅防止发光层和阴极在水氧的作用下被进一步腐蚀，也能隔断阴极信号，防止黑斑现象加剧。
The present invention provides a display panel, comprising: a display area, an opening area, and an isolation area located between the display area and the opening area, wherein the isolation area is provided with: a base substrate; an inorganic insulating layer located on the base substrate, the inorganic insulating layer having at least one recess; a light-emitting layer and a cathode located on the side of the inorganic insulating layer away from the base substrate, wherein the light-emitting layer and the cathode are The cathode is disconnected at the at least one recessed portion of the inorganic insulating layer when extending from the display region to the isolation region. In the display panel provided by the embodiment of the present invention, the recesses are provided in the inorganic insulating layer of the isolation region, which can cut off both the light-emitting layer and the cathode, which not only prevents the light-emitting layer and the cathode from being further corroded under the action of water and oxygen, but also cuts off the cathode. signal to prevent dark spots from aggravating.
Description
Technical Field
The invention relates to the technical field of display, in particular to a mask plate, a color film substrate, a manufacturing method of the color film substrate, a display panel and a display device.
Background
An Organic Light-Emitting Diode (OLED) display device has been classified as a next-generation display technology with great development prospect because of its advantages of thinness, lightness, wide viewing angle, active Light emission, continuously adjustable Light emission color, low cost, fast response speed, low energy consumption, low driving voltage, wide working temperature range, simple production process, high Light-Emitting efficiency, flexible display, etc.
In the prior art, a hole is formed in a screen to accommodate devices such as a camera and a sensor, and the hole is formed in the screen to easily expose a film layer of an OLED, so that an Electro-Luminescence (EL) layer forms a water-oxygen intrusion channel. The EL layer is corroded by water oxygen, causing organic light emitters of the EL layer to be oxidized and to fail, thereby causing growth black spots (GDS) of the screen.
At present, the EL layer is blocked mainly through an isolation column, and then a water oxygen invasion channel is cut off.
However, the isolation column in the prior art is realized by a metal pattern of a source drain metal layer, and adopts a film structure of Ti-Al-Ti. The left side and the right side of the Al film layer are subjected to side etching, the EL layer can be isolated at the moment, but the cathode is made of metal materials, the cathode and the film layer structure of Ti-Al-Ti can be electrically connected, cathode signals cannot be isolated, and the black spot phenomenon is more obvious after the cathode signals are connected into a whole.
Disclosure of Invention
The invention provides a display panel, a manufacturing method thereof and a display device, which can solve the problem that a cathode is not separated so as to aggravate a black spot phenomenon.
In a first aspect of the present invention, there is provided a display panel comprising: display area, trompil district and be located the display area with the isolation region between the trompil district, wherein, the isolation region is provided with:
a substrate base plate;
an inorganic insulating layer on the base substrate, the inorganic insulating layer having at least one recess;
a light emitting layer and a cathode on a side of the inorganic insulating layer away from the substrate, wherein the light emitting layer and the cathode are disconnected in the at least one recess of the inorganic insulating layer when extending from the display region to the separation region.
Optionally, the recessed portion includes two side surfaces and a bottom surface, the two side surfaces and the substrate base plate form a certain angle, the bottom surface is parallel to the substrate base plate, at least one side surface of the recessed portion is provided with at least one groove, a projection portion of the at least one groove on the at least one side surface on the substrate base plate is overlapped, the at least one groove on the at least one side surface is sequentially arranged along a first direction, and the first direction is perpendicular to a direction away from the substrate base plate.
Optionally, the height of the at least one groove in a direction away from the substrate base plate is
The at least one groove has a length in the first direction of 0.1 to 2.0 microns.
Optionally, a groove is disposed at a bottom surface of the recess.
Optionally, the height of the groove at the bottom surface of the recess in the direction away from the substrate base plate is
Optionally, the display panel is an LTPS display panel, an LTPO display panel, or an OXIDE display panel.
In a second aspect of the invention, a display device is provided, which includes the display panel.
In a third aspect of the present invention, a method for manufacturing a display panel is provided, where the display panel includes: the manufacturing method comprises the following steps of forming a display area, an opening area and an isolation area between the display area and the opening area, wherein the manufacturing method comprises the following steps:
providing a substrate base plate;
forming an inorganic insulating layer on the base substrate, the inorganic insulating layer having at least one recess;
and forming a light emitting layer and a cathode on the side of the inorganic insulating layer far away from the substrate, wherein the light emitting layer and the cathode are disconnected in the at least one recess of the inorganic insulating layer when extending from the display region to the isolation region.
Optionally, the forming of the inorganic insulating layer on the substrate base plate specifically includes:
forming at least one layer of inorganic insulator film layer and at least one layer of metal sub-pattern which are alternately arranged in a direction far away from the substrate base plate, wherein the projection parts of the metal sub-patterns of each layer on the substrate base plate are overlapped, the metal sub-patterns of each layer are sequentially arranged along a first direction, and the first direction is vertical to the direction far away from the substrate base plate;
punching the at least one inorganic insulator film layer to form at least one etching hole, wherein the etching hole is provided with two side walls and a bottom wall, the two side walls and the substrate base plate form a certain angle, the bottom wall is parallel to the substrate base plate, and at least one side wall of the etching hole exposes the metal sub-patterns of each layer;
and removing the metal sub-patterns of the exposed layers on at least one side wall, wherein the positions where the metal sub-patterns are removed form grooves.
Optionally, the removing the metal sub-pattern of each layer exposed on the at least one sidewall specifically includes:
and removing the metal sub-patterns of the exposed layers on the at least one side wall by using a phosphoric acid solution and a nitric acid solution.
Optionally, the method for manufacturing a display panel further includes:
and when the metal sub-pattern is formed on the bottom wall of the etching hole, removing the metal sub-pattern on the bottom wall of the etching hole by using a phosphoric acid solution and a nitric acid solution and forming a groove.
The embodiment of the invention has the following beneficial effects:
according to the display panel provided by the embodiment of the invention, the concave part is arranged on the inorganic insulating layer of the isolation region, so that the luminescent layer and the cathode can be separated, further corrosion of the luminescent layer and the cathode under the action of water and oxygen can be prevented, a cathode signal can be separated, and the phenomenon of black spots is prevented from being aggravated.
Drawings
Fig. 1 is a top view of a display panel provided in the related art;
FIG. 2 is a schematic sectional view taken along line A-A' of FIG. 1;
FIG. 3 is a schematic cross-sectional view illustrating an isolation region of a display panel according to an embodiment of the present invention;
fig. 3A to fig. 3C are schematic views illustrating a manufacturing process of a first display panel according to an embodiment of the invention;
fig. 4A to fig. 4E are schematic views illustrating a manufacturing process of a second display panel according to an embodiment of the invention;
fig. 5A to 5C are schematic views illustrating a manufacturing process of a third display panel according to an embodiment of the invention;
fig. 6A to 6C are schematic views illustrating a manufacturing process of a fourth display panel according to an embodiment of the invention;
fig. 7A to 7B are schematic views illustrating a manufacturing process of a fifth display panel according to an embodiment of the invention.
Reference numerals
1 display area
2 isolation region
3 area of opening
10 substrate base plate
20 buffer layer
30 gate insulating layer
40 gate metal layer
41 first gate metal layer
42 second gate metal layer
43 third gate metal layer
44 fourth gate metal layer
50 interlayer dielectric layer
60 source drain metal layer
61 first protective layer
62 Metal wire layer
63 second protective layer
70 luminescent layer
80 cathode
90 inorganic insulating layer
Detailed Description
In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following detailed description will be given with reference to the accompanying drawings and specific embodiments.
Referring to fig. 1, fig. 1 is a top view of a display panel provided in the related art, wherein the display panel includes: a display region 1, an opening region 3, and an isolation region 2 between the display region 1 and the opening region 3.
Referring to fig. 2, fig. 2 is a schematic cross-sectional view taken along a direction a-a' in fig. 1, and as shown in fig. 2, the isolation region 2 is provided with:
a base substrate 10;
a buffer layer 20 on the base substrate 10;
at least one gate metal layer 40 and at least one gate insulating layer 30 on a side of the buffer layer 20 away from the substrate 10, wherein the gate metal layer 40 includes at least one gate, the at least one gate metal layer 40 and the at least one gate insulating layer 30 are alternately arranged, and the gate insulating layer 30 covers the gate metal layer 40;
and the interlayer dielectric layer 50 is positioned on one side of the at least one gate metal layer 40 and the at least one gate insulating layer 30, which is far away from the substrate base plate 10.
The buffer layer 20, the gate insulating layer 30, and the interlayer dielectric layer 50 are made of inorganic materials, and may be collectively referred to as an inorganic insulating layer 90.
Wherein, a source-drain metal layer 60 is arranged on one side of the interlayer dielectric layer 50 far away from the substrate base plate 10.
The source-drain metal layer may be Cu, Al, Ag, Mo, Cr, Nd, Ni, Mn, Ti, Ta, W, etc., and alloys of these metals. The source and drain metal layers can be of a single-layer structure or a multi-layer structure, such as Cu \ Mo, Ti \ Cu \ Ti, Mo \ Al \ Mo and the like.
In the related art, in order to prevent the water and oxygen from invading into the display area from the opening area, the invasion path of the water and oxygen is blocked by arranging an isolation column in the isolation area. And the isolation column is realized by the metal pattern of the source drain metal layer. The source-drain metal layer 60 shown in fig. 2 includes a third metal layer 63, a second metal layer 62, and a first metal layer 61, which are stacked in this order. The third metal layer 63 and the first metal layer 61 are Ti, and the second metal layer 62 is Al. The left side and the right side of the Al layer are etched laterally, specifically, the metal layer of the middle layer is partially etched by an etching process, for example, a mixed liquor of nitric acid, acetic acid and phosphoric acid is used for etching treatment, and the liquor only has an etching effect on aluminum Al and does not have an etching effect on titanium Ti. The light emitting layers 70 located on the side of the source-drain metal layer 60 away from the substrate base plate 10 are blocked on the left and right sides of the Al layer.
The cathode 80 is disposed on the side of the light-emitting layer 70 away from the base substrate 10. Commonly used cathode materials include Al, Mg-Ag (magnesium silver alloy), Ag, Ca, and the like.
Because the cathode 80 and the source-drain metal layer 60 are both made of metal or alloy materials, the cathode 80 and the source-drain metal layer 60 can be electrically connected and can not cut off cathode signals, and the black spot phenomenon is more obvious after the cathode signals are connected into a piece.
In order to solve the problem that the black spot phenomenon is more obvious because the cathode is not separated, the embodiment of the invention provides a display panel, a manufacturing method thereof and a display device.
The display panel provided by the embodiment of the invention comprises: display area, trompil district and be located the display area with the isolation region between the trompil district, its characterized in that, the isolation region is provided with:
a substrate base plate;
an inorganic insulating layer on the base substrate, the inorganic insulating layer having at least one recess;
a light emitting layer and a cathode on a side of the inorganic insulating layer away from the substrate, wherein the light emitting layer and the cathode are disconnected in the at least one recess of the inorganic insulating layer when extending from the display region to the separation region.
Fig. 3 is a schematic cross-sectional view of an isolation region of a display panel according to an embodiment of the present invention, and as shown in fig. 3, the display panel according to the embodiment of the present invention includes: display area 1, trompil region 3 and lie in display area 1 with the isolation region 2 between the trompil region 3, wherein, isolation region 2 is provided with:
a base substrate 10;
an inorganic insulating layer 90 on the base substrate 10, the inorganic insulating layer 90 having at least one recess; wherein the inorganic insulating layer 90 may include a buffer layer 20, a gate insulating layer 30, and an interlayer dielectric layer 50;
a light emitting layer 70 and a cathode 80 located on a side of the inorganic insulating layer 90 away from the substrate 10, wherein the light emitting layer 70 and the cathode 80 are disconnected in the at least one recess of the inorganic insulating layer 90 when extending from the display region 1 to the isolation region 2.
Optionally, the recessed portion includes two side surfaces and a bottom surface, the two side surfaces and the substrate base plate form a certain angle, the bottom surface is parallel to the substrate base plate, at least one side surface of the recessed portion is provided with at least one groove, a projection portion of the at least one groove on the at least one side surface on the substrate base plate is overlapped, the at least one groove on the at least one side surface is sequentially arranged along a first direction, and the first direction is perpendicular to a direction away from the substrate base plate.
The at least one groove is formed in at least one side face of the concave portion, and the advantage that the periphery of the groove is made of inorganic insulating materials is utilized, so that the problems that in the prior art, a cathode is electrically connected with a Ti-Al-Ti film layer structure, cathode signals cannot be separated, and the black spot phenomenon is more obvious after the cathode signals are connected into a whole can be solved.
According to the display panel provided by the embodiment of the invention, the concave part is arranged on the inorganic insulating layer of the isolation region, so that the luminescent layer and the cathode can be separated, further corrosion of the luminescent layer and the cathode under the action of water and oxygen can be prevented, a cathode signal can be separated, and the phenomenon of black spots is prevented from being aggravated.
As shown in fig. 3, in which only one groove is provided on one side of the recess. Of course, grooves may be disposed on both side surfaces of the recess, and the number of the grooves may be determined according to actual application scenarios.
As shown in fig. 4E, 2 grooves are provided on one side surface of the recess. As shown in fig. 5B, 3 grooves are provided on one side surface of the recess. As shown in fig. 6B, 3 grooves are provided on both side surfaces of the recess.
Optionally, the height of the at least one groove in a direction away from the substrate base plate is
The at least one groove has a length in the first direction of 0.1 to 2.0 microns. Optionally, a groove is disposed at a bottom surface of the recess.
Optionally, the height of the groove at the bottom surface of the recess in the direction away from the substrate base plate is
The bottom surface of the depressed part is provided with at least one groove, so that the luminescent layer and the cathode can be separated, the luminescent layer and the cathode are prevented from being further corroded under the action of water and oxygen, the cathode signal can be separated, and the black spot phenomenon is prevented from being aggravated.
As shown in fig. 7B, 3 grooves are provided on both side surfaces of the recess, and 1 groove is provided on the bottom surface of the recess. In addition, the display panel provided by the embodiment of the invention also provides the thickness of the inorganic insulating layer between the grooves, and the thickness of the inorganic insulating layer is larger than that of the grooveThe thickness a of the inorganic insulating layer on the side of the third gate metal layer 43 away from the substrate is
The thickness b of the inorganic insulating layer between the third gate metal layer 43 and the second gate metal layer 42 is
The thickness c of the inorganic insulating layer between the second gate metal layer 42 and the first gate metal layer 41 is
The thickness d of the inorganic insulating layer between the first gate metal layer 41 and the fourth gate metal layer 44 is
Optionally, the display panel is an LTPS display panel, an LTPO display panel, or an OXIDE display panel.
The problem that cathode signals cannot be isolated is solved by arranging the concave part on the inorganic insulating layer of the isolation region, and the display panel is not only suitable for an LTPS (Low Temperature polysilicon) display panel, but also suitable for an LTPO (Low Temperature polysilicon Oxide) display panel or an Oxide display panel, so that the display panel provided by the embodiment of the invention can be suitable for various scenes.
The embodiment of the invention also provides a display device which comprises the display panel.
The display device includes but is not limited to: radio frequency unit, network module, audio output unit, input unit, sensor, display unit, user input unit, interface unit, memory, processor, and power supply. It will be appreciated by those skilled in the art that the above described configuration of the display device does not constitute a limitation of the display device, and that the display device may comprise more or less of the components described above, or some components may be combined, or a different arrangement of components. In the embodiment of the present invention, the display device includes, but is not limited to, a display, a mobile phone, a tablet computer, a television, a wearable electronic device, a navigation display device, and the like.
The display device may be: the display device comprises a display, a digital photo frame, a mobile phone, a tablet personal computer and any other product or component with a display function, wherein the display device further comprises a flexible circuit board, a printed circuit board and a back plate.
The embodiment of the invention also provides a manufacturing method of the display panel, and the display panel comprises the following steps: the manufacturing method comprises the following steps of forming a display area, an opening area and an isolation area between the display area and the opening area, wherein the manufacturing method comprises the following steps:
providing a substrate base plate; the substrate base plate can be a flexible base plate or a glass base plate made of polyimide and the like;
forming an inorganic insulating layer on the base substrate, the inorganic insulating layer having at least one recess;
and forming a light emitting layer and a cathode on the side of the inorganic insulating layer far away from the substrate, wherein the light emitting layer and the cathode are disconnected in the at least one recess of the inorganic insulating layer when extending from the display region to the isolation region.
The forming of the inorganic insulating layer on the substrate specifically includes:
forming at least one layer of inorganic insulator film layer and at least one layer of metal sub-pattern which are alternately arranged in a direction far away from the substrate base plate, wherein the projection parts of the metal sub-patterns of each layer on the substrate base plate are overlapped, the metal sub-patterns of each layer are sequentially arranged along a first direction, and the first direction is vertical to the direction far away from the substrate base plate;
punching the at least one inorganic insulator film layer to form at least one etching hole, wherein the etching hole is provided with two side walls and a bottom wall, the two side walls and the substrate base plate form a certain angle, the bottom wall is parallel to the substrate base plate, and at least one side wall of the etching hole exposes the metal sub-patterns of each layer;
and removing the metal sub-patterns of the exposed layers on at least one side wall, wherein the positions where the metal sub-patterns are removed form grooves.
Through utilizing at least one deck inorganic insulator rete and at least one deck metal sub-figure to punch to at least one deck inorganic insulator rete, and get rid of the metal sub-figure of each layer and form the recess, thereby make luminescent layer and negative pole can break off at the recess department, not only prevent that luminescent layer and negative pole from being further corroded under the effect of water oxygen, also can cut off the cathode signal, prevent that black spot phenomenon from aggravating.
Fig. 3 is a schematic cross-sectional view of an isolation region of a display panel according to an embodiment of the present invention, and fig. 3A to 3C are schematic views of a manufacturing process of a first display panel according to an embodiment of the present invention, and a detailed description is given to a process of forming an inorganic insulating layer with reference to fig. 3 and fig. 3A to 3C. In fig. 3A, there are 3 inorganic insulator film layers, namely, a buffer layer 20, a gate insulating layer 30, and an interlayer dielectric layer 50. Wherein the metal sub-pattern is a gate or a gate line of the gate metal layer 40.
Step 1: forming a buffer layer 20 on the base substrate 10; wherein, the buffer layer 20 is made of inorganic material and is formed on the substrate base plate 10 by deposition;
step 2: forming a grid electrode and a grid line pattern on the substrate after the step 1 is finished;
specifically, sputtering or thermal evaporation can be used to deposit a layer with a thickness of about 1 on the substrate
The gate metal layer may be Cu, Al, Ag, Mo, Cr, Nd, Ni, Mn, Ti, Ta, W, and other metals and alloys thereof, and the gate metal layer may be a single-layer structure or a multi-layer structure, such as Cu \ Mo, Ti \ Cu \ Ti, Mo \ Al \ Mo, and the like. Coating a layer of photoresist on the grid metal layer, and exposing the photoresist by using a mask plate to form a photoresist unreserved region and a photoresist reserved region, wherein the photoresist reserved region corresponds to the region where the graphs of the grid line and the grid electrode are located, and the photoresist unreserved region corresponds to the region except the graphsThe area of (a); developing, completely removing the photoresist in the photoresist unreserved region, and keeping the thickness of the photoresist in the photoresist reserved region unchanged; and completely etching the gate metal film in the region where the photoresist is not reserved by an etching process, and stripping the residual photoresist to form the patterns of the gate line and the gate electrode.
And step 3: forming a gate insulating layer 30 on the base substrate 10 where the step 2 is completed;
specifically, a Plasma Enhanced Chemical Vapor Deposition (PECVD) method may be employed to deposit a thickness of
The gate insulating layer may be an oxide, a nitride or an oxynitride, and the corresponding reaction gas is SiH4、NH3、N2Or SiH2Cl2、NH3、N2。
And 4, step 4: forming an interlayer dielectric layer 50 on the substrate 10 after the step 3;
specifically, the interlayer dielectric layer is generally an insulating material having a low dielectric constant (dielectric constant less than 3), such as boron-doped silicon glass (BSG), phosphorus-doped silicon glass (PSG), or boron-phosphorus-doped silicon glass (BPSG), and the lower the dielectric constant, the better the insulating property. The interlayer dielectric layer is usually manufactured by a high depth-to-depth ratio deposition process and is used for improving the adhesive force between the interlayer dielectric layer and surrounding devices.
After step 4, the cross-sectional structure shown in fig. 3A is formed.
And 5: punching the interlayer dielectric layer 50, the gate insulating layer 30 and the buffer layer 20 by dry etching to form etching holes; the etching hole is provided with two side walls and a bottom wall, the two side walls and the substrate base plate form a certain angle, the bottom wall is parallel to the substrate base plate, and at least one side wall of the etching hole exposes the grid or the grid line of each layer;
the dry etching cannot etch the protective layer metal (such as Mo) penetrating through the gate metal layer, and the etching hole continues to be etched downward along the edge of the protective layer metal. Because of the barrier of the protective layer metal, the slope angle of the inorganic layer below the edge of the protective layer metal is steeper along with the continuous deepening of the etching depth.
After step 5, the cross-sectional structure shown in fig. 3B is formed.
Step 6: and removing the grid electrode or the grid line of each exposed layer on at least one side wall, wherein a groove is formed at the position of removing the grid electrode or the grid line.
Specifically, the gate electrode or the gate line of each layer exposed on the at least one side wall is removed by using a phosphoric acid solution and a nitric acid solution.
The phosphoric acid solution and the nitric acid solution can react the grid electrode or the grid line, so that a groove is formed at the corresponding position.
Because the grooves and the inorganic layer have steeper slopes, the luminescent layer and the cathode can be completely separated.
In fig. 3A, since the metal sub-pattern has only one layer, the projection rule of the metal sub-pattern of each layer on the base substrate 10 is not obvious. Referring to fig. 4A, 5A, 6A and 7A, projected portions of the metal sub-patterns of the respective layers on the substrate overlap, and the metal sub-patterns of the respective layers are sequentially arranged along a first direction perpendicular to a direction away from the substrate.
The metal sub-patterns of the respective layers are formed stepwise in a direction from near the base substrate 10 to far from the base substrate 10. And if the direction from the substrate 10 to the substrate 10 is taken as the second direction and the first direction is the direction perpendicular to the second direction, the metal sub-patterns of each layer are sequentially arranged along the first direction and gradually get away from the center of the concave part.
Fig. 4A to fig. 4E are schematic views illustrating a manufacturing process of a second display panel according to an embodiment of the invention; fig. 4A differs from fig. 3A in that the display panel includes two gate metal layers, i.e., a first gate metal layer 41 and a second gate metal layer 42. Accordingly, the dry etching of the inorganic insulator film layer needs to be repeated twice. As shown in fig. 4B, after the first dry etching, the second gate metal layer is exposed. As shown in fig. 4C, after the second dry etching, the first gate metal layer is exposed. As shown in fig. 4D, the exposed gate electrode or gate line of each layer is removed using a phosphoric acid solution and a nitric acid solution. Finally, the light emitting layer 70 and the cathode 80 are formed on the formed inorganic insulating layer 90.
Fig. 5A to 5C are schematic views illustrating a manufacturing process of a third display panel according to an embodiment of the invention; as shown in fig. 5A, the difference from fig. 4A is that the display panel includes three gate metal layers, i.e., a first gate metal layer 41, a second gate metal layer 42, and a third gate metal layer 43. Accordingly, the dry etching of the inorganic insulator film layer needs to be repeated three times. Exposing the third grid metal layer after the first dry etching; exposing the second grid metal layer after the second dry etching; and exposing the first grid metal layer after the third dry etching. The exposed gate or gate line of each layer is removed using a phosphoric acid solution and a nitric acid solution to form the structure shown in fig. 5B. Finally, the light emitting layer 70 and the cathode 80 are formed on the formed inorganic insulating layer 90.
In the embodiment of the present disclosure, in the process of removing the exposed gate electrode or gate line of each layer by using the phosphoric acid solution and the nitric acid solution, the ratio of the removed gate electrode or gate line can be controlled by controlling the reaction time of the phosphoric acid solution and the nitric acid solution with the gate electrode or gate line, so as to control the situation that the gate electrode or gate line remains in the groove, and further achieve the purpose of controlling the depth of the groove, referring to fig. 5C.
In addition, by controlling the concentration of the phosphoric acid solution and the nitric acid solution, the proportion of the grid electrode or the grid line to be removed can be controlled.
In the disclosed embodiment, the length of the groove in the first direction is 0.1 to 2.0 micrometers;
for example, the length of the groove in the first direction can be designed to be 0.1 micrometer, 0.2 micrometer, 0.5 micrometer, 1.0 micrometer, 1.5 micrometer and the like by controlling the metal etching of the film layer where the gate or the gate line is located, so that the cathode and the light-emitting material are better separated.
Fig. 6A to 6C are schematic views illustrating a manufacturing process of a fourth display panel according to an embodiment of the invention, and fig. 6A is different from fig. 5A in that, during dry etching, gate metal layers on two sides of a recess are exposed, and not only the gate metal layer on one side is exposed. In fig. 6B, the gate electrode or the gate line of each exposed layer is removed by wet etching using a phosphoric acid solution and a nitric acid solution, and a groove is formed at a position where the gate electrode or the gate line is removed.
In the embodiment of the present disclosure, in the process of removing the exposed gate electrode or gate line of each layer by using the phosphoric acid solution and the nitric acid solution, the ratio of the removed gate electrode or gate line can be controlled by controlling the reaction time of the phosphoric acid solution and the nitric acid solution with the gate electrode or gate line, so as to control the situation that the gate electrode or gate line remains in the groove, and further achieve the purpose of controlling the depth of the groove, referring to fig. 6C.
In addition, by controlling the concentration of the phosphoric acid solution and the nitric acid solution, the proportion of the grid electrode or the grid line to be removed can be controlled.
Finally, the light emitting layer 70 and the cathode 80 are formed on the formed inorganic insulating layer 90.
Optionally, the manufacturing method of the display panel further includes:
and when the metal sub-pattern is formed on the bottom wall of the etching hole, removing the metal sub-pattern on the bottom wall of the etching hole by using a phosphoric acid solution and a nitric acid solution and forming a groove.
Fig. 7A to 7B are schematic views illustrating a manufacturing process of a fifth display panel according to an embodiment of the invention.
FIG. 7A differs from FIG. 6A in that a metal sub-pattern is formed on the bottom wall of the etching hole. The metal sub-pattern is a bottom shielding metal for blocking electromagnetic waves.
In fig. 7B, the exposed gate electrode or gate line and the bottom shielding metal of each layer are removed by using a phosphoric acid solution and a nitric acid solution, and a groove is formed at the position where the gate electrode or gate line and the bottom shielding metal are removed.
Finally, the light emitting layer 70 and the cathode 80 are formed on the formed inorganic insulating layer 90.
In the embodiments of the methods of the present invention, the sequence numbers of the steps are not used to limit the sequence of the steps, and for those skilled in the art, the sequence of the steps is not changed without creative efforts.
It should be noted that, in the present specification, all the embodiments are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the embodiments, since they are substantially similar to the product embodiments, the description is simple, and the relevant points can be referred to the partial description of the product embodiments.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present disclosure, and all the changes or substitutions should be covered within the scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.
Claims (11)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111447222.4A CN114122029A (en) | 2021-11-30 | 2021-11-30 | Display panel, method for making the same, and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111447222.4A CN114122029A (en) | 2021-11-30 | 2021-11-30 | Display panel, method for making the same, and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114122029A true CN114122029A (en) | 2022-03-01 |
Family
ID=80369105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111447222.4A Pending CN114122029A (en) | 2021-11-30 | 2021-11-30 | Display panel, method for making the same, and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114122029A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114613831A (en) * | 2022-03-30 | 2022-06-10 | 合肥鑫晟光电科技有限公司 | Display panel, preparation method thereof and display device |
| CN114678407A (en) * | 2022-03-24 | 2022-06-28 | 京东方科技集团股份有限公司 | Display substrate and display device |
| CN114824128A (en) * | 2022-04-07 | 2022-07-29 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110224006A (en) * | 2019-05-13 | 2019-09-10 | 武汉华星光电半导体显示技术有限公司 | OLED display panel and preparation method thereof |
| WO2020253320A1 (en) * | 2019-06-21 | 2020-12-24 | 京东方科技集团股份有限公司 | Display panel, display device, and method for fabricating display panel |
| US20210028249A1 (en) * | 2019-07-26 | 2021-01-28 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display panel and method of manufacturing the same, display device |
| US20210151707A1 (en) * | 2019-03-26 | 2021-05-20 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display substrate, preparation method thereof and display device |
| CN113497200A (en) * | 2020-04-02 | 2021-10-12 | 上海和辉光电有限公司 | Display panel, preparation method thereof and display device |
-
2021
- 2021-11-30 CN CN202111447222.4A patent/CN114122029A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210151707A1 (en) * | 2019-03-26 | 2021-05-20 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display substrate, preparation method thereof and display device |
| CN110224006A (en) * | 2019-05-13 | 2019-09-10 | 武汉华星光电半导体显示技术有限公司 | OLED display panel and preparation method thereof |
| WO2020253320A1 (en) * | 2019-06-21 | 2020-12-24 | 京东方科技集团股份有限公司 | Display panel, display device, and method for fabricating display panel |
| US20210028249A1 (en) * | 2019-07-26 | 2021-01-28 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display panel and method of manufacturing the same, display device |
| CN113497200A (en) * | 2020-04-02 | 2021-10-12 | 上海和辉光电有限公司 | Display panel, preparation method thereof and display device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114678407A (en) * | 2022-03-24 | 2022-06-28 | 京东方科技集团股份有限公司 | Display substrate and display device |
| CN114613831A (en) * | 2022-03-30 | 2022-06-10 | 合肥鑫晟光电科技有限公司 | Display panel, preparation method thereof and display device |
| CN114824128A (en) * | 2022-04-07 | 2022-07-29 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US12225759B2 (en) | Display substrate and method for manufacturing the same, display device | |
| CN110416434B (en) | Display substrate, preparation method thereof and display device | |
| EP3993080B1 (en) | Display panel and manufacturing method therefor, and display device | |
| CN114122029A (en) | Display panel, method for making the same, and display device | |
| CN110112317B (en) | Display device, flexible display panel and manufacturing method thereof | |
| CN110164916A (en) | Display panel, display equipment and the method for manufacturing display panel | |
| CN110444690B (en) | Display substrate, manufacturing method thereof, and display device | |
| CN109950296A (en) | Flexible display panel and manufacturing method thereof | |
| CN111933822A (en) | Display panel manufacturing method, display panel and display device | |
| CN110867475B (en) | Electroluminescent display substrate, preparation method thereof and electroluminescent display device | |
| US11398523B2 (en) | Array substrate and manufacturing method thereof, display panel and display device | |
| CN112103399A (en) | Display panel, manufacturing method thereof and display device | |
| CN111092098A (en) | Display substrate, preparation method thereof, display panel and display device | |
| US11637159B2 (en) | Display panel and display device with completed covered hollowed regions in frame region | |
| CN113972252A (en) | Display panel and electronic device | |
| CN115411080B (en) | Organic light-emitting display substrate and manufacturing method thereof, and organic light-emitting display device | |
| CN111244168A (en) | Display substrate, preparation method thereof and display device | |
| CN111524957A (en) | Display substrate, manufacturing method thereof and display device | |
| CN111564572A (en) | Display panel and manufacturing method thereof | |
| WO2022134092A1 (en) | Display device, and display panel and manufacturing method therefor | |
| CN113889489B (en) | Array substrate and preparation method thereof, and display device | |
| CN113540201A (en) | Display substrate and display device | |
| WO2022104937A1 (en) | Manufacturing method for oled panel, and oled panel | |
| CN112599697A (en) | Display panel, manufacturing method thereof and electronic equipment | |
| KR20060048438A (en) | Masks, mask manufacturing methods, film formation methods, electronic devices and electronic devices |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |