CN114111556A - Ultrathin probe for extreme gap detection environment and eddy current sensor - Google Patents
Ultrathin probe for extreme gap detection environment and eddy current sensor Download PDFInfo
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- CN114111556A CN114111556A CN202111447138.2A CN202111447138A CN114111556A CN 114111556 A CN114111556 A CN 114111556A CN 202111447138 A CN202111447138 A CN 202111447138A CN 114111556 A CN114111556 A CN 114111556A
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- 239000000523 sample Substances 0.000 title claims abstract description 46
- 238000001514 detection method Methods 0.000 title claims abstract description 23
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 230000003750 conditioning effect Effects 0.000 claims description 6
- 238000005259 measurement Methods 0.000 abstract description 22
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 4
- 239000010409 thin film Substances 0.000 abstract description 3
- 239000002184 metal Substances 0.000 description 20
- 239000010408 film Substances 0.000 description 7
- 230000006872 improvement Effects 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 238000006073 displacement reaction Methods 0.000 description 5
- 239000002131 composite material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000005307 ferromagnetism Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
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- 230000035945 sensitivity Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/14—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring distance or clearance between spaced objects or spaced apertures
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Abstract
The invention discloses an ultrathin probe for an extreme gap detection environment and an eddy current sensor, and belongs to the technical field of sensors. The probe comprises a substrate, wherein a patterned coil layer and a connecting wire are arranged on the substrate, a single-turn coil of the coil layer is annularly wound, the end part of the single-turn coil is connected with the connecting wire, the coil layer, the substrate and the connecting wire are integrated, a shielding layer is arranged on one side of the coil layer, the coil layers are arranged in multiple layers and are connected through via holes, and the shielding layer is made of ferrite thin films. The invention utilizes the flexible circuit board or other similar technologies to manufacture the coil, on one hand, the thickness of the coil can be greatly reduced, on the other hand, the probe array can be conveniently manufactured, and the invention can be suitable for realizing gap measurement in the harsh environment with small size, large depth, requirement of multi-point measurement and high bandwidth.
Description
Technical Field
The invention relates to the technical field of eddy current sensors, in particular to an ultrathin probe for an extreme gap detection environment and an eddy current sensor.
Background
In the equipment manufacturing and assembling link, a plurality of assembling gaps need to be measured accurately. Common methods for measuring the gap and the displacement include a contact type and a non-contact type, wherein the contact type includes a feeler gauge, a micrometer gauge, an LVDT (linear variable differential transformer) and the like, and the non-contact type includes an optical sensor, an eddy current sensor, a capacitance sensor, an acoustic sensor and the like.
The most difficult problem to solve in the assembly clearance detection is the clearance measurement that is narrow and small, the depth is big, does not have manual operation space, and the above-mentioned sensor form is no matter from size, installation space, measuring point quantity, measurement frequency can not satisfy the requirement. Four examples are shown below:
detecting a gap value between a wing and a fuselage in a splicing process of the wing and the fuselage on an aircraft production line, guiding the wing to be continuously adjusted to achieve an optimal posture, and manufacturing a gasket with a corresponding thickness according to the gap value to fill the gap; the gap is in millimeter level, the depth of the contact surface is large, some people can not enter the gap at some points, and the conventional measurement method can not be applied; secondly, the gap between the closed cabin door of the airplane and the door frame needs to be accurately measured to determine whether the quality of the cabin door reaches the standard, and the gap is difficult to measure by using a conventional method after the cabin door is closed; thirdly, judging whether the appearance of the composite material manufactured by using the die meets the design requirement, buckling the composite material on a reference plate and measuring the gap of the composite material; under the conditions that the thickness of the gap is generally less than 3mm, the gap surface has radian and large size, the conventional test method cannot be completed; and fourthly, whether the clearance between the blade and the casing of the aircraft engine reaches the standard is an important index for assembling the engine, and after the engine is started, the dynamic clearance between the blade and the casing is also a parameter to be detected, so that the conventional detection method is not suitable for use.
The eddy current sensor is a sensor based on the eddy current effect, and can perform non-contact measurement on the movement of a metal material entering a measurement range. The basic principle is as follows: a high frequency alternating current is applied to the detection coil, which generates an alternating magnetic field and excites an induced current, i.e. an eddy current, in the metal conductor near the coil. The alternating magnetic field of the current vortex and the alternating magnetic field of the coil are offset effects, so that the inductance and the resistance of the original coil are changed. If the metal is a magnetically permeable material, the effect of the metal being magnetized on the magnetic flux must be considered. When the distance between the coil and the metal changes, the strength of the eddy current changes along with the change, and the inductance and the resistance of the detection coil are further influenced. Therefore, the displacement information of the target conductor can be obtained by measuring the impedance (or the inductance and the resistance) of the coil.
The current vortex sensor has two common forms, namely an integrated type and a separated type. The integrated finger coil and the demodulation circuit are integrated in the probe shell, and the separated finger probe and the demodulation circuit are two parts and are connected through a cable. The common forms of the probe are a shielding type and a non-shielding type, as shown in (a) and (b) of fig. 1, a nonmetal 2 is arranged around a coil 1, and the main distinction is whether the probe coil 1 extends out of a metal shell 3 of the probe. In either of the above forms, there is a need to leave sufficient space behind the coil to avoid the metal casing from affecting the measurement, so that the probe has a certain length in the direction perpendicular to the coil (i.e. the measuring direction), typically at least 20 mm. This also results in that the length of the conventional eddy current displacement sensor in the measuring direction cannot be made very small, and therefore cannot be placed in the gap of typically several millimeters to a few tenths of a millimeter for measurement.
Disclosure of Invention
1. Solves the technical problem
The present invention is directed to overcoming the above-mentioned problems in the prior art, and providing an ultra-thin probe and an eddy current sensor for use in an extreme gap detection environment, which are suitable for gap measurement in a harsh environment with a narrow size, a large depth, a requirement for multi-point measurement, and a high bandwidth.
2. Technical scheme
In order to achieve the purpose, the technical scheme provided by the invention is as follows:
the invention discloses an ultrathin probe for an extreme gap detection environment, which comprises a substrate, wherein a patterned coil layer and a connecting wire are arranged on the substrate, a single-turn coil of the coil layer is annularly wound, the end part of the single-turn coil is connected with the connecting wire, the coil layer, the substrate and the connecting wire are integrated, and a shielding layer is arranged on one side of the coil layer, the substrate and the connecting wire.
As a further improvement of the invention, the coil layers are arranged in multiple layers, and the coil layers are connected through via holes.
As a further improvement of the invention, the shielding layer adopts a ferrite film.
As a further improvement of the invention, the thickness of the ferrite film is less than or equal to 0.05mm, and the total thickness of the substrate, the coil layer and the shielding layer is less than 0.3 mm.
As a further improvement of the invention, the probe also comprises an adapter plate, a coaxial line and a coaxial connector, wherein the coil layer is connected to the adapter plate through a connecting line, and the adapter plate is connected with the coaxial connector through the coaxial line.
As a further improvement of the present invention, the coil layers are arranged in an array on the substrate.
The invention relates to an ultrathin eddy current sensor for an extreme gap detection environment.
As a further improvement of the invention, the probe is connected with the eddy current detection circuit through a connecting wire.
As a further improvement of the invention, the eddy current detection circuit comprises a signal conditioning circuit, a switch control circuit and a multi-level multi-channel switch chip, one end of the coil layer is grounded, the other end of the coil layer is connected with the signal conditioning circuit through the multi-level multi-channel switch chip, and the switch control circuit controls the on-off of the switch.
3. Advantageous effects
Compared with the prior art, the technical scheme provided by the invention has the following beneficial effects:
(1) according to the ultrathin probe for the extreme gap detection environment, the coil is manufactured by using the flexible circuit board or other similar technologies, so that the thickness of the coil can be greatly reduced, the probe array can be conveniently manufactured, and the ultrathin probe can be suitable for realizing gap measurement in narrow, large-depth, high-bandwidth and severe environments requiring multi-point measurement.
(2) According to the ultrathin probe for the extreme gap detection environment, the ferrite layer is used for shielding metal on the back surface, so that a magnetic field cannot penetrate through the ferrite on one hand, and eddy current cannot occur in the metal on the back surface of the probe to influence measurement, and on the other hand, the ferrite does not have conductivity and cannot form eddy current in the ferrite, so that the ferrite cannot influence the detection function of a coil, and narrow and small gap measurement is possible.
Drawings
Fig. 1 (a) and (b) are schematic diagrams of two structural forms of a conventional eddy current displacement sensor probe respectively;
FIG. 2 is a schematic structural view of a planar coil according to the present invention;
FIG. 3 is a side view of a planar structured coil in accordance with the present invention;
FIG. 4 is a schematic view of a conventional search coil assembled during production;
FIG. 5 is a schematic view of the assembly of a search coil according to the present invention;
FIG. 6 is a schematic diagram of an embodiment of a coil array according to the present invention;
FIG. 7 is a schematic view of the assembly of the flat structure probe of the present invention;
fig. 8 is a schematic diagram of the multi-stage multi-channel switch chip to realize probe switching in the invention.
The reference numerals in the schematic drawings illustrate:
1. a coil; 11. a coil layer; 12. a substrate; 13. a via hole; 14. a connecting wire; 2. a non-metal; 3. a housing; 4. a metal plate; 5. magnetic field lines; 6. a shielding layer; 7. an adapter plate; 8. a coaxial line; 9. and a coaxial connector.
Detailed Description
For a further understanding of the invention, reference should be made to the following detailed description taken in conjunction with the accompanying drawings and examples.
Example 1
With reference to fig. 2-5, the probe for an ultra-thin and extreme gap detection environment of the present embodiment utilizes a flexible circuit board or other similar technologies to fabricate a multilayer composite structure of the coil layer 11 and the connecting wires 14 on the substrate 12, so as to form a planar structure probe satisfying the function of an eddy current sensor, the overall thickness can be as low as 0.3mm, and the measurement of a narrow gap can be realized.
The main part of the probe is an inductance coil layer, a single-turn coil of the coil layer 11 is wound annularly, the end part of the single-turn coil is connected with a connecting wire 14, and the inductance coil is required to have certain inductance, usually more than 20uH, for completing the measurement with high precision and high stability. Therefore, for a coil having a relatively small outer diameter, the number of coil layers is usually 2 or more, and the multilayer coils are connected by vias 13 (conductive metal is present in the vias). The thickness of the 2-layer coil manufactured by using the flexible circuit board technology is about 0.15mm, and the thickness of the 4-layer coil is about 0.2 mm. Fig. 3 is a schematic diagram of a 2-layer planar structure coil cross-section.
In the application of the eddy current sensor, the surrounding space of the probe coil is prevented from being approached by other conductors except the target conductor to avoid measurement errors. The metal shell of the traditional eddy current displacement sensor probe needs to keep a certain distance from the coil, and if the distance between the metal shell and the coil is very close, the influence caused by the metal shell is even larger than that of a target conductor. In many production and assembly links, the metal conductors are arranged around the assembly gap, as shown in fig. 4, the upper and lower surfaces of the detection coil are made of metal, and the metal of the upper and lower plates affects the inductance resistance of the coil. In order to eliminate the influence of one-side metal on the coil in the slit, referring to fig. 5, the coil layer 11, the substrate 12 and the connection line 14 are an integral body, and the shielding layer 6 is provided on one side of the integral body. The shielding layer 6 is made of ferrite film. This ferrite film has two functions:
(1) downward magnetic induction lines generated by the coil are concentrated inside the ferrite, and no magnetic induction line passes through the lower metal plate. Therefore, the material, thickness, position, etc. of the lower metal plate have no influence on the impedance characteristics of the coil.
(2) The measurement of the coil on the upper metal plate is not affected by the ferrite film. The ferrite thin film itself has no conductivity, and no eddy current is formed inside the ferrite thin film, so that the detection function of the coil is not affected. Ferrite itself has ferromagnetism, and can increase the inductance and resistance of the coil to some extent, and if viewed in absolute value of impedance change, ferrite can increase the sensitivity of the coil.
In the embodiment, the two functions can be realized by using the ferrite film with the thickness of less than or equal to 0.05mm, and the total thickness of the ferrite film and the planar structure coil can be less than 0.3 mm. The method can be suitable for realizing gap measurement in a strict environment with narrow and large depth.
Example 2
Referring to fig. 7, the probe of this embodiment further includes an interposer 7, a coaxial cable 8, and a coaxial connector 9, the coil layer 11 is connected to the interposer 7 through a connecting wire 14, and the interposer 7 is connected to the coaxial connector 9 through the coaxial cable 8. And inserting the coaxial connector 9 into the eddy current detection circuit to realize the connection between the circuit and the plane structure probe. When the device is used, the back surface of the probe is pasted on one surface of the gap to be measured, and the size of the gap between the two surfaces can be measured. Wherein the total thickness of the planar structure coil and the ferrite is 0.2mm to 0.3mm, and the planar structure coil and the ferrite have certain flexibility.
Example 3
Referring to fig. 6, the present embodiment arranges the coil layers 11 in an array on the substrate 12. Each coil layer 11 is connected to the eddy current detection circuit by a connection line 14 of a planar structure. When the device is used, the back surface of the probe is pasted on one surface of the gap to be measured, and the size of the gap between the two surfaces can be measured. Wherein the total thickness of the planar structure coil array and the ferrite is 0.2mm to 0.3mm, and the planar structure coil array has certain flexibility.
In many assembly sites, a plurality of measurement points need to be measured in real time, an array comprising a plurality of coils can be manufactured by using a planar process such as a flexible circuit board, and the gap measurement of a large-area assembly surface is realized. A single controller is required to be arranged on each probe of a common eddy current sensor, so that the problem of over-complicated hardware system in multi-point measurement can be caused, and a technical scheme that a single controller corresponds to multiple probes is required.
Fig. 8 shows a scheme for realizing probe switching by using a multi-stage multi-channel switch chip. The eddy current detection circuit comprises a signal conditioning circuit, a switch control circuit and a multi-level multi-channel switch chip, one end of the coil layer 11 is grounded, the other end of the coil layer is connected with the signal conditioning circuit through the multi-level multi-channel switch chip, and the switch control circuit controls the on-off of the switch. Taking 1 to 8 switch chips as an example, the first-stage switch can switch 8 probes, and the number of probes which can be supported by the 1-stage switch is increased by 8.
The present invention and its embodiments have been described above schematically, without limitation, and what is shown in the drawings is only one of the embodiments of the present invention, and the actual structure is not limited thereto. Therefore, if the person skilled in the art receives the teaching, without departing from the spirit of the invention, the person skilled in the art shall not inventively design the similar structural modes and embodiments to the technical solution, but shall fall within the scope of the invention.
Claims (9)
1. An ultra-thin probe for use in extreme gap sensing environments, comprising: the coil comprises a substrate (12), wherein a patterned coil layer (11) and a connecting wire (14) are arranged on the substrate (12), a single-turn coil of the coil layer (11) is wound in an annular shape, and the end part of the single-turn coil is connected with the connecting wire (14); the coil layer (11), the substrate (12) and the connecting wire (14) are integrated, and a shielding layer (6) is arranged on one side of the coil layer.
2. An ultra-thin probe for use in an extreme gap sensing environment as defined in claim 1 wherein: the coil layers (11) are arranged in multiple layers, and the coil layers (11) are connected through via holes (13).
3. An ultra-thin probe for use in an extreme gap sensing environment as defined in claim 2 wherein: the shielding layer (6) is made of ferrite film.
4. An ultra-thin probe for use in an extreme gap sensing environment as defined in claim 3 wherein: the thickness of the ferrite film is less than or equal to 0.05mm, and the total thickness of the substrate (12), the coil layer (11) and the shielding layer (6) is less than 0.3 mm.
5. An ultra-thin probe for use in an extreme gap sensing environment as claimed in any of claims 1-4, wherein: the coaxial connector is characterized by further comprising an adapter plate (7), a coaxial line (8) and a coaxial connector (9), wherein the coil layer (11) is connected to the adapter plate (7) through a connecting line (14), and the adapter plate (7) is connected with the coaxial connector (9) through the coaxial line (8).
6. An ultra-thin probe for use in an extreme gap sensing environment as claimed in any of claims 1-4, wherein: and the substrate (12) is provided with coil layers (11) which are arranged in an array.
7. An ultra-thin eddy current sensor for use in an extreme gap sensing environment, comprising an eddy current sensing circuit, characterized by: the probe of claim 5 connected to an eddy current testing circuit by a coaxial connector (9).
8. An ultra-thin eddy current sensor for use in an extreme gap sensing environment, comprising an eddy current sensing circuit, characterized by: the probe of claim 6 connected to an eddy current testing circuit by a connecting wire (14).
9. An ultra-thin eddy current sensor for use in an extreme gap sensing environment as claimed in claim 8, wherein: the eddy current detection circuit comprises a signal conditioning circuit, a switch control circuit and a multi-level multi-channel switch chip, one end of the coil layer (11) is grounded, the other end of the coil layer is connected with the signal conditioning circuit through the multi-level multi-channel switch chip, and the switch control circuit controls the on-off of the switch.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111447138.2A CN114111556A (en) | 2021-11-30 | 2021-11-30 | Ultrathin probe for extreme gap detection environment and eddy current sensor |
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| CN202111447138.2A CN114111556A (en) | 2021-11-30 | 2021-11-30 | Ultrathin probe for extreme gap detection environment and eddy current sensor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114659440A (en) * | 2022-04-08 | 2022-06-24 | 安徽见行科技有限公司 | An eddy current sensor |
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| CN218781752U (en) * | 2021-11-30 | 2023-03-31 | 安徽见行科技有限公司 | Ultrathin probe for extreme gap detection environment and eddy current sensor |
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2021
- 2021-11-30 CN CN202111447138.2A patent/CN114111556A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1272409A (en) * | 1969-07-26 | 1972-04-26 | Kuibyshevsky Awiazionny | Eddy-currents transducer for checking surfaces of metal articles |
| JPH10311857A (en) * | 1997-03-13 | 1998-11-24 | Ricoh Co Ltd | Near magnetic field probe, near magnetic field probe unit, near magnetic field probe array, and magnetic field measuring system |
| CN1988069A (en) * | 2006-11-24 | 2007-06-27 | 南京航空航天大学 | Process for producing inductive coil by printed circuit board |
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| CN101408404A (en) * | 2008-11-28 | 2009-04-15 | 清华大学 | Method for preparing complaisance type double-layer electric vortex flow sensor for testing curved surface clearance |
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