CN114107911B - Metal foil production system - Google Patents
Metal foil production system Download PDFInfo
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- CN114107911B CN114107911B CN202111335012.6A CN202111335012A CN114107911B CN 114107911 B CN114107911 B CN 114107911B CN 202111335012 A CN202111335012 A CN 202111335012A CN 114107911 B CN114107911 B CN 114107911B
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- metal
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 60
- 239000002184 metal Substances 0.000 title claims abstract description 60
- 239000011888 foil Substances 0.000 title claims abstract description 39
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 230000007704 transition Effects 0.000 claims abstract description 55
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 24
- 238000002360 preparation method Methods 0.000 claims abstract description 18
- 238000007740 vapor deposition Methods 0.000 claims abstract description 17
- 238000000151 deposition Methods 0.000 claims abstract description 16
- 230000008021 deposition Effects 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims description 36
- 238000005507 spraying Methods 0.000 claims description 20
- 238000011068 loading method Methods 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000011084 recovery Methods 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 7
- 238000007738 vacuum evaporation Methods 0.000 claims description 7
- 230000001680 brushing effect Effects 0.000 claims description 6
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims description 4
- 239000011630 iodine Substances 0.000 claims description 4
- 229910052740 iodine Inorganic materials 0.000 claims description 4
- 239000000969 carrier Substances 0.000 claims description 3
- 238000001914 filtration Methods 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 238000004064 recycling Methods 0.000 claims description 2
- 238000000926 separation method Methods 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 54
- 239000011889 copper foil Substances 0.000 description 45
- 238000000034 method Methods 0.000 description 11
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 9
- 239000004926 polymethyl methacrylate Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 6
- 238000005240 physical vapour deposition Methods 0.000 description 6
- 229920002472 Starch Polymers 0.000 description 4
- 239000012047 saturated solution Substances 0.000 description 4
- 239000008107 starch Substances 0.000 description 4
- 235000019698 starch Nutrition 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000012805 post-processing Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004801 process automation Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
本发明属于生产设备领域，尤其涉及一种金属箔生产系统。其包括：用于预处理的上游区；用于沉积制备的负载区；和用于分离的下游区；所述上游区、负载区和下游区设有传送装置；所述载体包括负载面；所述上游区内设有在载体的负载区表面制备过渡层的预处理装置；所述负载区设有气相沉积装置，所述气相沉积装置包括用于产生预沉积态金属的发生结构和用于引导预沉积态金属的引导结构，所述发生结构产生的预沉积态金属通过引导结构引导至载体表面的过渡层上，所述预沉积态金属为气态金属和/或等离子态金属；所述下游区内设有用于去除过渡层的后处理装置。本发明能够实现高效、高品质地制备电子级超薄金属箔；制备过程简单高效，能够实现全程自动化。
The present invention belongs to the field of production equipment, and in particular, relates to a metal foil production system. It comprises: an upstream area for pretreatment; a load area for deposition preparation; and a downstream area for separation; the upstream area, the load area and the downstream area are provided with a conveying device; the carrier comprises a load surface; the upstream area is provided with a pretreatment device for preparing a transition layer on the surface of the load area of the carrier; the load area is provided with a vapor deposition device, the vapor deposition device comprises a generating structure for generating pre-deposited metal and a guiding structure for guiding the pre-deposited metal, the pre-deposited metal generated by the generating structure is guided to the transition layer on the surface of the carrier through the guiding structure, the pre-deposited metal is a gaseous metal and/or a plasma metal; the downstream area is provided with a post-treatment device for removing the transition layer. The present invention can realize the efficient and high-quality preparation of electronic-grade ultra-thin metal foil; the preparation process is simple and efficient, and can realize full automation.
Description
Technical Field
The invention belongs to the field of production equipment, and particularly relates to a metal foil production system.
Background
A metal foil is a sheet-like metal article, such as a copper foil, which is typically made of copper plus a proportion of other metals. The copper content of a typical commercial copper foil is 80 wt% or 90 wt%, respectively, corresponding to 80 and 90 foils, respectively. The most widely used decorative materials in the prior market environment can be adhered to various base materials such as metal, insulating materials and the like due to the low surface oxygen characteristic, and have a wide temperature application range.
However, with the development of metal foils, the market has created a wide variety of demands. For example, in the copper foil field, the developed high-purity electronic grade copper foil with copper content more than or equal to 99.7 wt% is also commonly used in electronic equipment due to its excellent conductivity and electromagnetic shielding effect. The electronic grade copper foil is one of basic materials of the electronic industry, the electronic information industry is rapidly developed, the use amount of the electronic grade copper foil is larger and larger, and the product is widely applied to industrial calculators, communication equipment, QA equipment, lithium ion copper foil, copper foil storage batteries, civil televisions, video recorders, CD players, copiers, telephones, cold and warm air conditioners, electronic components for automobiles, game machines and the like. There is an increasing demand for electronic grade copper foil, especially high performance electronic grade copper foil, in markets at home and abroad.
Similarly, copper foil is an indispensable part of the 5G communication and chip industry which are greatly developed in China. The copper foil used for chips has higher quality requirements than conventional electronic grade copper foil, and it is generally required to achieve ultra-thin and extremely low surface roughness state of about 5-8 μm, even 1-3 μm. In addition to the typical copper foil, various ultra-thin metal foils are increasingly demanded, and for example, they are used in the fields of catalysts and the like, and there is a great play for the ultra-thin metal foils. The conventional calendaring and electrolytic processes for the preparation of ultra-thin metal foils have failed to meet the high performance requirements of the above-mentioned fields.
However, at present, there is no special apparatus or system for preparing ultrathin metal foil by vapor deposition, and most of the existing apparatus and system need customization and combination use, resulting in low production efficiency, high cost and easy occurrence of unnecessary problems, especially in terms of stripping of metal foil, no special apparatus has yet been capable of efficiently and effectively stripping ultrathin metal foil. Therefore, it is urgent to develop a special apparatus capable of being dedicated to the production of ultra-thin metal foils.
Disclosure of Invention
The invention provides a metal foil production system, which aims to solve the problems that the existing method for producing metal foil is low in efficiency, low in yield and the like because complete and complete equipment for preparing ultrathin electronic-grade metal foil by a vapor deposition method and a special production system are not available in the market.
The invention aims at:
1. The method can be effectively applied to the existing vapor deposition method for preparing the metal foil;
2. the whole production system has high preparation flexibility, and can perform different preparations according to requirements;
3. The material utilization rate is high, and the efficient cyclic utilization of the material can be effectively realized.
In order to achieve the above purpose, the present invention adopts the following technical scheme.
A system for producing a metal foil, which comprises a first metal foil and a second metal foil,
The system comprises:
An upstream zone for carrying out a pretreatment of the support;
a loading zone for preparing a metal foil by deposition on a support;
and a downstream zone for separating the carrier and the metal foil;
The upstream zone, the loading zone and the downstream zone are integrally or separately arranged, and a conveying device capable of conveying the carriers from the upstream zone to the loading zone and the downstream zone in sequence is arranged;
the carrier comprises at least one loading surface for depositing a preparation metal foil;
the upstream area is internally provided with a pretreatment device for preparing a transition layer on the surface of a loading area of the carrier by taking a transition material as a raw material;
The load area is provided with a vapor deposition device, the vapor deposition device comprises a generation structure for generating pre-deposition state metal and a guide structure for guiding the pre-deposition state metal, the pre-deposition state metal generated by the generation structure is guided onto a transition layer on the surface of a carrier through the guide structure, and the pre-deposition state metal is gaseous state metal and/or plasma state metal;
and a post-treatment device for removing the transition layer is arranged in the downstream area.
As a preferred alternative to this,
The conveying device is of a roll shaft structure or a structure of a roll shaft matched with the conveying belt.
As a preferred alternative to this,
When the conveying device is of a roll shaft structure, the conveying device of the roll shaft structure is matched with the strip-shaped carrier, the roll shaft structure rolls to drive the strip-shaped carrier to move, and the loading surface of the carrier is outwards arranged away from the roll shaft structure;
When the conveying device is in a structure that the roller shaft is matched with the conveying belt, the carrier is fixedly arranged on the outer surface of the conveying belt, the conveying belt drives the carrier to move, and the loading surface of the carrier is outwards arranged away from the conveying belt.
As a preferred alternative to this,
The pretreatment device is a brushing structure and/or a spraying structure and/or a heating device and at least comprises at least one of the brushing structure and the spraying structure.
As a preferred alternative to this,
The post-treatment device is a spraying device and/or a heating device.
As a preferred alternative to this,
The generating structure is a vacuum evaporation coating machine or a vacuum sputtering coating machine or a vacuum ion coating machine.
As a preferred alternative to this,
The guide structure is provided with an inlet end and an outlet end, and the generating structure is provided with an outlet end;
the inlet end of the guide structure is connected with the outlet end of the generating structure;
The outlet end of the guiding structure faces the transition layer of the carrier surface.
As a preferred alternative to this,
The outlet end of the guide structure is provided with a leveling structure;
the leveling structure is used for leveling the transition layer.
As a preferred alternative to this,
The downstream zone is provided with a recovery device for collecting the transition layer material removed by the aftertreatment device.
As a preferred alternative to this,
The system further comprises a secondary processing device;
the secondary treatment device is used for concentrating and/or filtering and recycling the obtained transition layer material to form a transition material for preparing the transition layer;
And the inlet end of the secondary treatment device is connected with the recovery device, and the outlet end of the secondary treatment device is connected with the pretreatment device.
The beneficial effects of the invention are as follows:
1) Can realize the preparation of electronic grade ultrathin metal foil with high efficiency and high quality;
2) The preparation process is simple and efficient, and the whole process automation can be realized;
3) Is suitable for the preparation of a novel vapor deposition method;
4) The material utilization rate is high, and the material can be flexibly adjusted and used according to the preparation requirement.
Drawings
FIG. 1 is a schematic diagram of a metal foil production system according to the present invention;
fig. 2 is a schematic structural view of the guide structure.
In the figure, an upstream area A, a load area B, a downstream area C, a100 roller shaft, a 200 vapor deposition device, a 201 generating structure, a 202 guiding structure, a 2021 guiding structure main body, a 2022 slope structure, a 2023 leveling structure, a 300 pretreatment device, a 400 post-treatment device, a 500 carrier, a 501 initial end, a 502 tail end, a 600 transition layer, a 601 transition material, a 700 copper foil and a 800 recovery device.
Detailed Description
The invention is described in further detail below with reference to specific examples and figures of the specification. Those of ordinary skill in the art will be able to implement the invention based on these descriptions. In addition, the embodiments of the present invention referred to in the following description are typically only some, but not all, embodiments of the present invention. Therefore, all other embodiments, which can be made by one of ordinary skill in the art without undue burden, are intended to be within the scope of the present invention, based on the embodiments of the present invention.
In the description of the present invention, it should be understood that the terms "thickness," "upper," "lower," "horizontal," "top," "bottom," "inner," "outer," "circumferential," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the present invention. In the description of the present invention, the meaning of "a plurality" means at least two, for example, two, three, etc., unless explicitly defined otherwise, the meaning of "a number" means one or more.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, or communicable with each other, directly connected, indirectly connected through an intervening medium, or in communication between two elements or in an interactive relationship between two elements, unless otherwise explicitly specified. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
The raw materials used in the examples of the present invention are all commercially available or available to those skilled in the art unless otherwise specified, and the methods used in the examples of the present invention are all known to those skilled in the art.
The embodiment of the invention takes the copper foil production as a representative to carry out the description of the metal foil production, and the copper foil production system is the metal foil production system claimed by the invention, and the description of the production of the attached copper foil is expressed as the copper foil production system.
Examples
A copper foil 700 production system as shown in fig. 1, which specifically comprises:
A conveyor, an upstream zone a, a load zone B and a downstream zone C;
the upstream area A, the load area B and the downstream area C form an integrated structure or are arranged in a split mode;
the conveyor is capable of transporting the carriers 500 sequentially from an upstream zone a to a loading zone B, a downstream zone C;
The specific use of the copper foil 700 production system aims at improving the defect that the existing equipment cannot be effectively applied to the preparation of the copper foil 700 by a vapor deposition method, and aims at realizing the main purpose of preparing the ultrathin electronic-grade copper foil 700 by the high-efficiency vapor deposition method;
The vapor deposition (PVD) method requires a carrier 500 for deposition, the carrier 500 is usually metal aluminum or anodized aluminum plate/strip, etc., and at least one surface is a loading surface for loading the grown copper foil 700, and the produced copper foil 700 has a form of sheet or strip, etc., and is suitable for the carrier 500 with different materials and forms, and is suitable for the preparation of copper foil 700 with different forms, the conveying device adopts a roll shaft 100 as a main body, and can selectively use a conveyor belt structure in a matching way;
If the strip-shaped copper foil 700 is required to be prepared, the roller shaft 100 is matched with the strip-shaped aluminum alloy carrier 500, as shown in fig. 1, the strip-shaped carrier 500 can be continuously connected in a ring shape or in an intermittent traction mode to form a structure similar to a structure taking the carrier 500 as a conveyor belt, and continuous work is carried out to realize vapor deposition preparation of the strip-shaped ultrathin electronic-grade copper foil 700;
If a regular sheet-like or characteristic-shaped thin copper foil 700 is required to be prepared, a structure in which the roller shaft 100 is matched with the conveyor belt can be provided, the carrier 500 conforming to the expected shape of the copper foil 700 is fixedly arranged on the outer surface of the conveyor belt, moves along with the conveyor belt, and the preparation of the copper foil 700 is carried out on the carrier 500;
In this embodiment, the roller 100 is configured to cooperate with an aluminum alloy belt in a ring shape as the carrier 500, and for convenience of description, the carrier 500 on the upstream area a side is the start 501, and the carrier 500 on the downstream area C side is the end 502.
While the upstream area A is improved on the basis of the traditional PVD method for preparing the copper foil 700, the traditional PVD method for preparing the copper foil 700 directly deposits and grows the copper foil 700 on the surface of the carrier 500, after the upstream area A is arranged, a transition layer 600 is firstly prepared on the surface of the copper foil 700 in the upstream area A, so that the copper foil 700 is conveniently obtained through subsequent demolding and separation, and the specific transition layer 600 is prepared by adopting transition materials 601 such as PMMA, starch, elemental iodine and the like;
and a pretreatment structure for preparing the transition layer 600 is provided in the upstream region a;
The pretreatment structure is in detail a single or a plurality of spray coating structure, brush coating structure and heating device, and can be practically adjusted according to the requirement;
Specifically, the invention adopts a spraying structure, the spraying structure can be used for spraying PMMA saturated solution, starch saturated solution, iodine vapor and the like, the spraying structure is suitable for spraying liquid or gaseous transition materials 601, the brushing structure is used for brushing liquid transition materials 601, such as PMMA saturated solution, starch saturated solution and the like, a heating device can be selectively added, a heating resistance wire can be directly and adaptively arranged at a nozzle of the spraying structure, the spray materials are heated, firstly, the dissolution stability or the gaseous stability of the spray materials can be maintained, secondly, the drying rate of the subsequent liquid spray materials on the surface of a carrier 500 can be improved, the transition layer 600 is formed by high-efficiency drying and solidification, the liquid transition materials 601 sprayed at room temperature above 25 ℃ can be basically and naturally dried through the operation of thin-layer spraying (the spraying thickness is less than or equal to 0.3 mm), and the heating device is required to be matched when the transition materials 601 are thicker, so as to improve the use effect;
in this embodiment, only the spraying structure is disposed in the upstream area a for spraying the liquid transition material 601;
the surface of the carrier 500 passing through the upstream region a can form a stable transition layer 600, which is beneficial to realizing orderly demolding and separation to obtain the copper foil 700.
In the load zone B, the carrier 500 running to the load zone B has a complete transition layer 600 formed on the load surface, so that the copper foil 700 can be deposited and grown in the load zone B in a conventional PVD manner;
specifically, the load area B is provided with a vapor deposition device 200, and the vapor deposition device 200 at least comprises two parts, namely a generating structure 201 and a guiding structure 202;
The generating structure 201 adopts conventional PVD equipment, such as a vacuum evaporation coating machine or a vacuum sputtering coating machine or a vacuum ion coating machine;
In the embodiment, a vacuum evaporation coating machine is adopted, copper vapor is formed by the vacuum evaporation coating machine, the outlet end of the vacuum evaporation coating machine is connected with the inlet end of the guide structure 202, the formed copper vapor enters the guide structure 202 through the outlet end of the vacuum evaporation coating machine and the inlet end of the guide structure 202, finally, the guide mechanism guides the copper vapor to the surface of the carrier 500, the copper vapor is released through the outlet end of the guide structure 202, and the copper foil 700 is deposited and grown on the surface of the transition layer 600 on the carrier 500;
Although the conventional PVD apparatus alone can achieve a similar deposition growth effect, it is not suitable for the other structures of the present invention, the continuity of the production process cannot be maintained, and due to the arrangement of the transition layer 600, the conventional in-line arrangement easily breaks the transition layer 600 with poor thermal stability in the rest, while the arrangement of the guide structure 202 can form an effective buffer, in addition, the outlet end of the guide structure 202, that is, the opening at the upper end of the guide structure body 2021 in fig. 2, is arranged as a slope structure 2022, the high side of the slope structure 2022 faces the beginning 501 of the carrier 500, that is, the upstream area a, and the low side faces the end 502 of the carrier 500, that is, the downstream area C, because the thickness change is caused by the growth of the copper foil 700, the adoption of the structure can more effectively ensure the uniformity of the deposition growth of the copper foil 700, the flatness of the outer side, and can effectively avoid the problems of damage of the copper foil 700 caused by short-distance scratch or the reduction of the copper vapor utilization rate caused by long distance;
Furthermore, a leveling structure 2023 is further disposed on the high side of the slope structure 2022, in this embodiment, the leveling structure 2023 is specifically a pressing roller, and the pressing roller directly presses the surface of the transition layer 600, which can further improve the flatness of the transition layer 600 before the copper vapor is deposited and grown.
Specifically, the downstream area C is used for removing the post-processing device 400 of the transition layer 600, the post-processing device 400 is specifically a spraying device and/or a heating device, according to the transition material 601 used by the pre-processing device 300, for example, PMMA and starch can be simply sprayed and dissolved by a solvent, and finally the copper foil 700 can be naturally demolded and separated under the action of gravity, the transition layer 600 of elemental iodine can be sublimated by the heating device, the copper foil 700 can be naturally separated after the transition layer 600 is removed, products can be recovered, and the carrier 500 after the transition layer 600 and the copper foil 700 are removed can be recovered, and the carrier 500 can be re-entered into the upstream area a to perform the covering preparation of the transition layer 600 as shown by the arrow of the end 502 pointing to the initial end 501 in fig. 1, so that the efficient cyclic preparation is realized.
Further, in order to improve the utilization rate of the whole device to materials, the invention is also provided with a recovery device 800 and a secondary treatment device;
The recovery device 800 is disposed in the downstream area C, a basin-shaped structure or a vacuum-pumping structure may be adopted, the liquid transition layer 600 material and the gas transition layer 600 material formed after removal are respectively collected correspondingly, the recovered transition layer 600 material is conveyed to the secondary processing device through a pipeline, the secondary processing device may be a conventional filtering tank and/or a concentrating tank, in this embodiment, PMMA is selected as the transition material 601, so that the post processing device 400 adopts a spraying device, the PMMA is removed by spraying toluene dissolution, the basin-shaped recovery device 800 is used for receiving and recovering the toluene solution dissolved with PMMA, and the toluene solution is conveyed to the secondary processing device through a pipeline, the secondary processing device in this embodiment adopts a common industrial concentrating tank, the saturated PMMA solution is reformed after concentration and is conveyed to the pretreatment device 300 through a pipeline as the transition material 601, and the pipelines connected to the two ends of the secondary processing device are all provided with one-way valves, so as to ensure that the flow direction of the transition material can be set as expected, avoid the occurrence of the reflux problem, so that the nearly hundred percent of PMMA material cycle utilization rate in theory can be realized, and the cycle utilization rate of PMMA can reach more than 98% after four months of operation test.
Claims (7)
1. A metal foil production system is characterized in that,
The system comprises:
An upstream zone for carrying out a pretreatment of the support;
a loading zone for preparing a metal foil by deposition on a support;
and a downstream zone for separating the carrier and the metal foil;
The upstream zone, the loading zone and the downstream zone are integrally or separately arranged, and a conveying device capable of conveying the carriers from the upstream zone to the loading zone and the downstream zone in sequence is arranged;
the carrier comprises at least one loading surface for depositing a preparation metal foil;
the upstream area is internally provided with a pretreatment device for preparing a transition layer on the surface of a loading area of the carrier by taking a transition material as a raw material;
The transition material is iodine;
The pretreatment device is a brushing structure and/or a spraying structure and/or a heating device and at least comprises at least one of the brushing structure and the spraying structure;
The load area is provided with a vapor deposition device, the vapor deposition device comprises a generation structure for generating pre-deposition state metal and a guide structure for guiding the pre-deposition state metal, the pre-deposition state metal generated by the generation structure is guided onto a transition layer on the surface of a carrier through the guide structure, and the pre-deposition state metal is gaseous state metal and/or plasma state metal;
A post-treatment device for removing the transition layer is arranged in the downstream area;
the post-treatment device is a spraying device and/or a heating device;
the system further comprises a secondary processing device;
the secondary treatment device is used for concentrating and/or filtering and recycling the obtained transition layer material to form a transition material for preparing the transition layer;
And the inlet end of the secondary treatment device is connected with the recovery device, and the outlet end of the secondary treatment device is connected with the pretreatment device.
2. A metal foil production system as claimed in claim 1, wherein,
The conveying device is of a roll shaft structure or a structure of a roll shaft matched with the conveying belt.
3. A metal foil production system as claimed in claim 2, wherein,
When the conveying device is of a roll shaft structure, the conveying device of the roll shaft structure is matched with the strip-shaped carrier, the roll shaft structure rolls to drive the strip-shaped carrier to move, and the loading surface of the carrier is outwards arranged away from the roll shaft structure;
When the conveying device is in a structure that the roller shaft is matched with the conveying belt, the carrier is fixedly arranged on the outer surface of the conveying belt, the conveying belt drives the carrier to move, and the loading surface of the carrier is outwards arranged away from the conveying belt.
4. A metal foil production system as claimed in claim 1, wherein,
The generating structure is a vacuum evaporation coating machine or a vacuum sputtering coating machine or a vacuum ion coating machine.
5. A metal foil production system according to claim 1 or 4, wherein,
The guide structure is provided with an inlet end and an outlet end, and the generating structure is provided with an outlet end;
the inlet end of the guide structure is connected with the outlet end of the generating structure;
The outlet end of the guiding structure faces the transition layer of the carrier surface.
6. A metal foil production system as claimed in claim 5, wherein,
The outlet end of the guide structure is provided with a leveling structure;
the leveling structure is used for leveling the transition layer.
7. A metal foil production system as claimed in claim 1, wherein,
The downstream zone is provided with a recovery device for collecting the transition layer material removed by the aftertreatment device.
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| CN114086120A (en) * | 2021-11-11 | 2022-02-25 | 杭州四马化工科技有限公司 | A kind of preparation method of ultra-thin metal foil |
| CN114107889A (en) * | 2021-11-11 | 2022-03-01 | 杭州四马化工科技有限公司 | Metal foil demoulding method |
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| WO2000018978A1 (en) * | 1998-09-28 | 2000-04-06 | Weinert Vakuum Verfahrenstechnik Gmbh | Apparatus and method for producing plane-parallel flakes |
| US6770976B2 (en) * | 2002-02-13 | 2004-08-03 | Nikko Materials Usa, Inc. | Process for manufacturing copper foil on a metal carrier substrate |
| WO2011021007A1 (en) * | 2009-08-21 | 2011-02-24 | Qinetiq Limited | Production of flake particles |
| JP5165773B2 (en) * | 2011-02-10 | 2013-03-21 | フリージア・マクロス株式会社 | Metal foil with carrier and method for producing laminated substrate using the same |
| KR101343951B1 (en) * | 2011-06-23 | 2013-12-24 | 코닉이앤씨 주식회사 | Manufacturing method and manufacturing apparatus of metal foil |
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| CN114086120A (en) * | 2021-11-11 | 2022-02-25 | 杭州四马化工科技有限公司 | A kind of preparation method of ultra-thin metal foil |
| CN114107889A (en) * | 2021-11-11 | 2022-03-01 | 杭州四马化工科技有限公司 | Metal foil demoulding method |
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