CN114062382A

CN114062382A - Detection system and detection method

Info

Publication number: CN114062382A
Application number: CN202010772540.7A
Authority: CN
Inventors: 陈鲁; 李海卫; 张鹏斌
Original assignee: Shenzhen Zhongke Feice Technology Co Ltd
Current assignee: Shenzhen Zhongke Feice Technology Co Ltd
Priority date: 2020-08-04
Filing date: 2020-08-04
Publication date: 2022-02-18

Abstract

The invention discloses a detection system and a detection method, wherein the detection system comprises a detection device, a bearing device and a transfer device, wherein the detection device is used for detecting a first surface or a second surface of an object to be detected, and an optical axis of the detection device is vertical to the first surface or the second surface of the object to be detected; the bearing device is arranged in the detection cavity and is used for bearing the first surface of the object to be detected or the edge area of the object to be detected; the transfer device is used for moving the object to be tested to or from the carrying device and is configured to enable the first surface or the second surface of the object to be tested to be in a state to be tested. Through the detection system with the optimized functional structure, the detection of two surfaces of the device to be detected can be completed in one detection cavity, and the detection time can be greatly reduced on the basis of effectively reducing the detection cost.

Description

Detection system and detection method

Technical Field

The invention relates to the technical field of semiconductor test equipment, in particular to a detection system and a detection method.

Background

In a typical process, the front and back sides of the wafer are inspected for defects. Generally, two detection cavities are adopted, wherein one detection cavity is used for front detection of a wafer, and the other detection cavity is used for back detection of the wafer; specifically, different bearing devices are respectively arranged in the front side detection cavity and the back side detection cavity and used for bearing the back side and the front side of the wafer, and the wafer is conveyed and turned over by utilizing a manipulator. The defects of high detection cost and long detection period exist due to the limitation of the self structure principle.

In view of the above, it is desirable to perform structure optimization on the existing detection system to effectively reduce the detection cost and the detection time.

Disclosure of Invention

In order to solve the technical problems, the invention provides a detection system and a detection method, which can complete the detection of two surfaces of an object to be detected in one detection cavity through a detection system with an optimized functional structure, and can greatly reduce the detection time on the basis of effectively reducing the detection cost.

The detection system provided by the invention comprises a detection device, a bearing device and a transfer device, wherein the detection device is used for detecting the first surface or the second surface of an object to be detected, and the optical axis of the detection device is vertical to the first surface or the second surface of the object to be detected; the bearing device is arranged in the detection cavity and is used for bearing the first surface of the object to be detected or the edge area of the object to be detected; the transfer device is used for moving the object to be tested to or from the carrying device and is configured to enable the first surface or the second surface of the object to be tested to be in a state to be tested.

Preferably, the bearing device includes a vacuum adsorption surface and a support surface, the vacuum adsorption surface is used for adsorbing the first surface of the object to be tested, and the support surface is used for bearing the edge area of the object to be tested; the plurality of supporting components are used for driving the object to be detected to the plane where the vacuum adsorption surface is located or to the plane where the supporting surface is located.

Preferably, the transfer device comprises a manipulator and a turnover mechanism, the manipulator is used for grabbing or releasing the object to be tested, and the turnover mechanism is used for turning over the object to be tested.

Preferably, the turnover mechanism is configured to: is positioned beside the detection cavity or is integrated with the manipulator.

Preferably, a moving table is arranged in the detection cavity, the bearing device is arranged on the moving table to drive the bearing device to displace, and a displacement track of the bearing device is formed by compounding transverse displacement, longitudinal displacement and/or rotation around a rotation center in a horizontal plane.

Preferably, the detection device comprises a defect detection module and an automatic focusing module; the defect detection module comprises a light source, a lens and a camera, the optical axis of the defect detection module is perpendicular to the surface of the object to be detected, and the automatic focusing module is used for acquiring the distance between the defect detection module and the surface of the object to be detected and enabling the focus of the defect detection module to be located on the surface of the object to be detected.

Preferably, the plurality of support assemblies comprises: the positioning block is configured to move in a direction perpendicular to the vacuum adsorption surface, the positioning block comprises a first bearing surface and a positioning part located above the first bearing surface, and the positioning part can limit the position of the device to be tested in a horizontal plane; the bearing block is configured to move along a direction vertical to the vacuum adsorption surface, and the bearing block comprises a second bearing surface.

Preferably, the clamping assembly further comprises a clamping drive part: the clamping driving part is used for driving the clamping part to move along the radial direction of the vacuum adsorption surface, providing clamping driving force of the clamping part and is configured to: and under the action of the clamping driving force, the clamping force formed by the clamping part and the positioning part is transmitted to an object to be measured.

Preferably, the clamping driving part is a clamping cylinder, and the output end of the clamping cylinder is in transmission connection with the body of the clamping assembly; the clamping parts are arranged into two parts, and are arranged in a mirror image manner and respectively pivoted on the body of the clamping assembly relative to a symmetrical center line which is vertical to a connecting line of the pivoting centers of the two parts, and can be switched between a clamping working position and a loosening working position around the pivoting center and configured as follows: the clamping part is positioned at the clamping working position, and the clamping force formed by the clamping part and the positioning part is transmitted to an object to be measured; the clamping part positioned at the loosening working position is separated from the object to be detected; each clamping part is provided with a clamping end which is formed by bending outwards from the body, and the end part which is matched with the periphery of the device to be laterally is an outward convex cambered surface; an elastic member is provided between the two clamping portions, and is configured to: and in the process that the two clamping parts are switched to the clamping working positions, the elastic piece deforms and stores elastic deformation energy.

Preferably, the vacuum adsorption device further comprises a lifting component, wherein the lifting component comprises a lifting table, and the plurality of support assemblies are arranged on the lifting table and move along the direction vertical to the vacuum adsorption surface by the lifting table; the lifting driving part can provide lifting driving force for the lifting platform.

Preferably, the object to be measured includes a graphic wafer, the first surface of the object to be measured is a non-processed surface of the object to be measured, and the second surface of the object to be measured is a processed surface to be measured.

The invention also provides a detection method, which is realized based on the detection system, and the detection method comprises the following steps: enabling the bearing device to bear the first surface of the object to be detected, and enabling the detection device to carry out first detection processing on the second surface of the object to be detected; after the first detection treatment is finished, enabling the transfer device to switch the first surface of the object to be detected to a state to be detected; and enabling the bearing device to bear the edge area of the object to be detected, and enabling the detection device to carry out second detection processing on the first surface of the object to be detected.

Preferably, the method comprises the following steps: before the first detection processing, the method comprises the steps of lifting the plurality of supporting assemblies to a working position, and arranging an object to be detected on the plurality of supporting assemblies; the supporting assemblies descend to the position where the vacuum adsorption surface is flush with or lower than the vacuum adsorption surface, the object to be detected is placed on the vacuum adsorption surface, and the vacuum adsorption surface adsorbs a first surface of the object to be detected; after the first detection processing is finished, the plurality of supporting assemblies drive the object to be detected to ascend to the plane where the bearing surface is located.

Preferably, the step of causing the transfer device to switch the first surface of the object to be measured to the state to be measured includes: and the transfer device is enabled to move the object to be detected away from the bearing surface, the transfer device is enabled to turn over the object to be detected, the object to be detected after turning over is placed in the bearing surface, and the first surface of the object to be detected is enabled to be in a state to be detected.

Aiming at the prior art, the invention develops a new method for carrying out optimization design aiming at the detection system of the object to be detected, the bearing device of the invention has a fixed realization mode of two detection states of the object to be detected, and simultaneously, the invention is assisted with the matching linkage of the transfer device and the detection device, so that the whole process of front detection and back detection of the complete object to be detected can be realized. Taking an object to be detected as a wafer as an example, the detection device can detect the first surface or the second surface of the object to be detected, and the bearing device is arranged in the detection cavity and is used for bearing the first surface of the object to be detected or bearing the edge area of the object to be detected; the transfer device is used for moving the object to be measured to or from the carrying device and is configured to enable the first surface or the second surface of the object to be measured to be in a state to be measured. That is, a first detection state for detecting the second surface of the wafer and a second detection state for detecting the first surface of the wafer are respectively formed, that is, the second surface of the wafer faces the detection device, the detection device performs the first detection on the second surface of the wafer, or the first surface of the wafer faces the detection device, and the detection device performs the second detection on the first surface of the wafer. Compared with the prior art, the scheme has the following beneficial technical effects:

first, the scheme can selectively realize the function requirements of the wafer in two detection states, and the transfer device is utilized to enable the front side or the back side of the wafer to be detected to be in the state to be detected respectively, so that the detection of the two surfaces of the wafer to be detected can be completed in one detection cavity. Therefore, the defect that the detection cost is too high by utilizing the corresponding bearing devices in the two detection cavities can be avoided; simultaneously, use this scheme can also reduce and detect the used supplementary man-hour of transferring the object to be measured between the chamber, can significantly reduce check-out time, can further reduce and detect the cost.

Secondly, in the preferred scheme of the invention, the back surface of the wafer to be detected is adsorbed by the vacuum adsorption surface, and the first state detection is carried out; meanwhile, the edge of the wafer to be tested is borne by the supporting surface, and the wafer to be tested is driven to the plane of the vacuum adsorption surface or the plane of the supporting surface through a plurality of supporting components; therefore, the detection functions of the two surfaces of the wafer to be detected are met, and the front form of the wafer to be detected is not influenced.

In another preferred embodiment of the present invention, the plurality of support assemblies include a positioning block and/or a bearing block, the positioning block includes a first bearing surface and a positioning portion located above the first bearing surface, and the positioning portion can limit the position of the device to be tested in the horizontal plane, so as to form reliable clamping and positioning for the back detection state; simultaneously, the first bearing surface configuration of location portion below can switch to the work position with the back of the common bearing wafer of the second bearing surface of bearing portion, has the effect of bearing wafer concurrently, can promote the wafer displacement to this detection state more steadily, ensures to detect the precision.

Finally, in another preferred embodiment of the present invention, the two clamping portions are provided in a mirror image manner, and can be switched between a clamping working position and a releasing working position respectively around the pivot center, the clamping portions are provided with clamping ends formed by bending the body outwards, and the end portions adapted to the periphery of the device to be laterally positioned are convex cambered surfaces; therefore, in the process that the clamping parts press and clamp the edge of the wafer, the clamping parts rotate around the pivoting centers of the clamping parts respectively and are tangent to the wafer through the arcs of the two clamping end parts, and the flexible clamping acting force on the wafer is kept through energy absorption of the elastic parts in the process.

Drawings

FIG. 1 is a schematic view of the detection system in an embodiment;

FIG. 2 is a schematic view of the carrier in a first inspection state;

FIG. 3 is a diagram illustrating the carrier device in a second testing state according to an exemplary embodiment;

FIG. 4 is a top view of an embodiment of the carrier;

FIG. 5 is a top view of a carrier device according to an embodiment without a vacuum chuck;

FIG. 6 is an enlarged view of the relationship between the carrier block and the wafer shown in the portion B of FIG. 4;

FIG. 7 is an enlarged view of the positioning relationship between the positioning block and the wafer shown in the portion C of FIG. 4;

FIG. 8 is a schematic view of the clamping assembly in a release operating position;

FIG. 9 is a schematic view of the clamping assembly in the clamping station;

FIG. 10 is a schematic diagram of a defect detection module of the detection apparatus.

In the figure:

the device comprises a bearing device 10, a manipulator 20, a detection cavity 30, a detection device 40, a motion table 50, a turnover mechanism 60 and a calibration table 70;

the vacuum chuck 1, the clamping assembly 2, the clamping portion 21, the clamping end 211, the clamping cylinder 22, the elastic member 23, the bearing block 3, the second bearing surface 31, the positioning block 4, the positioning portion 41, the first bearing surface 42, the lifting member 5, the lifting table 51, the lifting cylinder 52, the limiting block 6, the rotation driving mechanism 7, the light source 401, the lens 402, the camera 403, and the light splitting assembly 404.

Detailed Description

In order to make the technical solutions of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings and specific embodiments.

Without loss of generality, the present embodiment takes the detection system shown in fig. 1 as a main description body, and the detection device 40, the carrying device 10 and the moving table 50 thereof are placed in one detection chamber 30, and the manipulator 20 is placed outside the detection chamber 30. It should be understood that the specific structural form of the detection chamber 30, the specific functional components of the detection device 40 and the motion stage 50 are not essential limitations to the claimed technical solution.

Please refer to fig. 1, which is a top view of the detection system according to the present embodiment. In order to clearly describe the working principle of the carrying device, the present solution uses the wafer a as the object to be measured for detailed description. And the wafer a is a patterned wafer, i.e. the first surface of the wafer includes a plurality of chip patterns. It is understood that the object to be inspected may be in the form of different products having two surfaces to be inspected, such as but not limited to wafers.

The detection system comprises a detection device 40 for detecting a first surface or a second surface of the object to be detected, respectively, an optical axis of the detection device 40 being perpendicular to the first surface or the second surface of the object to be detected. Preferably, an optical detection method is adopted to detect whether the second surface (front surface) of the wafer a to be detected has defects in the graphic circuit and to detect whether the first surface (back surface) of the wafer a has defects such as scratches and pits.

The carrier 10 for carrying and fixing the wafer a to be tested may be disposed on the moving stage 50 in the inspection chamber 30, for carrying the first surface of the object to be tested or for carrying the edge region of the object to be tested. And the transfer device is used for moving the object to be tested to or from the carrying device and is configured to enable the first surface or the second surface of the object to be tested to be in a state to be tested. In the actual detection process, the moving stage 50 may drive the carrying device 10 to move based on the detection principle, and then complete the optical detection of the second surface (front surface) or the first surface (back surface) by cooperating with the detection device 40 through the high-speed movement. It can be understood that, for different wafers a to be measured, the displacement trajectories are also different; such as, but not limited to, the arrows in fig. 1, the displacement trajectory is formed by a combination of lateral displacement in the horizontal plane, longitudinal displacement, and/or rotational motion about the center of rotation.

Of course, the lens of the detecting device 40 can be matched to perform displacement along the direction perpendicular to the absorption surface of the object to be detected based on different objects to be detected.

The carrying device 10 in this embodiment may provide two detection states, and the transferring device is used to move the object to be tested to the carrying device 10 or move the object to be tested from the carrying device 10, and the transferring device is configured to enable the first surface or the second surface of the object to be tested to be in a state to be tested. Please refer to fig. 2 and fig. 3 together, wherein fig. 2 is a schematic view of the carrying device in a first detection state, and fig. 3 is a schematic view of the carrying device in a second detection state.

Further, the carrying device 10 may include a vacuum suction surface formed on the vacuum chuck 1 for sucking the first surface of the object to be measured, and a supporting surface for carrying an edge region of the object to be measured; the supporting components are used for driving the object to be detected to the plane where the vacuum adsorption surface is located or the plane where the supporting surface is located, and position guarantee of the two surfaces of the wafer A to be detected is provided.

In order to more reliably fix the wafer a to be tested at the working position to be tested, the carrier device 10 may further include a clamping assembly 2, where the clamping assembly 2 includes a clamping portion 21 radially abutting against the edge of the object to be tested; the clamping portion 21 is located above and outside the vacuum suction surface, and is disposed at a predetermined distance from the upper surface of the vacuum suction surface in the vertical direction. It should be noted that, in order to fully utilize the vertical space in the detection cavity, the clamping portion 21 of the clamping assembly 2 may be located above the outer side of the vacuum chuck 1, and is configured with a predetermined distance in the vertical direction from the upper surface of the vacuum chuck 1, so as to ensure that the clamping portion is completely staggered from the vacuum chuck 1 in the first detection state, thereby facilitating the picking and placing operation of the wafer to be detected.

Specifically, the plurality of support assemblies include a positioning block 4 and/or a bearing block 3, wherein the positioning block 4 may be configured to move in a direction perpendicular to the vacuum absorption surface, the positioning block 4 includes a first bearing surface 42 and a positioning portion 41 located above the first bearing surface 42, and the positioning portion 41 may form a limit on the position of the device under test in the horizontal plane; wherein the carrier block 3, which comprises the second bearing surface 31, is configured to move in a direction perpendicular to the vacuum suction surface.

The vacuum chuck 1 is used to fix the wafer a in the first detection state shown in fig. 2. Specifically, a first surface (back surface) of the wafer a is placed on the vacuum chuck 1, and in the vacuumized state, the first surface (back surface) of the wafer a can be adsorbed by using a vacuum portion on the upper surface of the vacuum chuck 1, that is, the wafer a is fixed in the first detection state by the vacuum chuck 1, and the vacuum portion may be a vacuum groove or a vacuum portion, for example, but not limited to, in a form of a sealed air channel or a microporous ceramic. At this time, the front surface (second surface) of the wafer a may be inspected. In the first detection state, the clamping assembly 2 and the bearing block 3 are both in a non-working state.

In particular, the clamping assembly 2 is fixedly arranged relative to the vacuum chuck 1, while the carrier block 3 can be switched in the vertical direction between an operative position and an inoperative position. Here, the "working position" and the "non-working position" are defined based on whether the carrier block 3 participates in fixing the object to be measured, the carrier block 3 in the "working position" participates in fixing the object to be measured, and the carrier block 3 in the "non-working position" does not participate in fixing the object to be measured. And is configured to: when the vacuum chuck is located at the non-working position, the second supporting surface 31 of the supporting block 3 is not higher than the upper surface of the vacuum chuck 1, as shown in fig. 2, in this state, the vacuum chuck 1 can provide the adsorption fixing function in the first detection state; when the second supporting surface 31 supports the front surface (second surface) of the wafer a and is switched to the working position, as shown in fig. 3, the clamping portion 21 of the side clamping assembly 2 applies a clamping force to the wafer to fix the object to be detected in the second detection state, and at this time, the back surface (first surface) of the wafer a can be detected. In the second detection state, the vacuum chuck 1 and the construction of the vacuum are both in a non-working state.

This scheme is through setting up vacuum chuck 1 and clamping part 21, and the alternative realization is fixed or is fixed to the centre gripping at wafer edge to the absorption at the wafer back, and wafer A is located two fixed wait to examine positions of the not co-altitude of a detection intracavity, utilizes one to bear the weight of the device and can satisfy the function needs that detect the wafer front and the back respectively, and then accomplishes the detection on two surfaces of the object of awaiting measuring and provides good technical guarantee.

As shown in fig. 1, the wafer a to be tested is handled by the transferring device in a testing state, that is, the wafer a to be tested is placed on the carrying device 10 according to two testing states, so as to meet the functional requirements of front and back testing.

The transfer device further comprises a manipulator 20 and a turnover mechanism 60, wherein the manipulator 20 is used for grabbing or releasing the wafer a to be tested, and correspondingly, the turnover mechanism 60 is used for turning over the wafer a to be tested. As shown in the figure, the turnover mechanism 60 is located beside the robot 20, and in the working process, after the second surface (front surface) of the wafer a is detected, the robot 20 picks the wafer a on the carrying device 10 and places the wafer a on the turnover mechanism 60, and after the turnover mechanism 60 finishes the turnover of the wafer a to be detected, the robot 20 picks the wafer a on the turnover mechanism 60 and places the wafer a on the carrying device 10 to perform the reverse surface detection of the wafer a.

Here, the robot 20 may adopt a self-friction circumscribed circle bump structure, and thus securely fix the wafer a. In addition, canting mechanism 60 may not be limited to the preferred embodiment shown in the figures.

For example, the turning mechanism may be integrated with the robot 20 (not shown), and this method is characterized in that no additional independent turning mechanism is needed, after the second surface (front surface) of the wafer a is detected, the robot 20 picks up the wafer a on the carrier 10, the wafer a is always held by the robot 20 during the turning mechanism, and after the wafer a to be detected is turned over, the robot 20 is placed on the carrier 10 to perform the back surface detection of the wafer a.

Further, when the clamping assembly 2 clamps the wafer a, in order to avoid affecting the integrity and cleanliness of the front surface thereof, a positioning block 4 adapted to the clamping portion 21 may be added. Please refer to fig. 2 and fig. 3 together. The positioning block 4 with the positioning portion 41 is also switchable in the vertical direction between an operating position and a non-operating position, and is configured to: when the positioning block is positioned at the non-working position, the positioning part 41 of the positioning block 4 is not higher than the upper surface of the vacuum chuck 1; when the positioning block 4 is located at the working position, the positioning portion 41 of the positioning block may limit the position of the wafer a in the horizontal plane, so as to form reliable clamping and positioning for the wafer a switched to the second detection state. Due to the design of the positioning part 41, a good technical guarantee is provided for simplifying the force application structure of the clamping assembly 2.

In addition, the positioning block 4 body below the positioning portion 41 has a first supporting surface 42, and the first supporting surface 42 is configured to support the front surface (second surface) of the wafer a together with the second supporting surface 31 and to be switched to the working position shown in fig. 3. That is to say, in the direction of height, the first bearing surface 42 of locating piece 4 is flush with the second bearing surface 31 of bearing piece 30, and like this, locating piece 4 has the effect of bearing wafer a concurrently, can promote the wafer displacement to the second more steadily and detect the state, ensures to detect the precision.

Of course, in the second inspection state, in order to minimize the influence of the support on the surface of the wafer a, the carrier block 3 may be preferably disposed below the edge of the wafer a, please refer to fig. 4 and 5 together, which are top views of the carrier device, wherein the top view shown in fig. 5 is formed after the vacuum chuck is removed.

As shown, the bearing block 3 and the positioning block 4 are both located radially outside the vacuum chuck 1. A portion of the radially inner surface of the first support surface 42 is used to support the edge of the wafer a without directly contacting the central region of the front surface of the wafer a, see also fig. 5, which is an enlarged view of the position relationship between the carrier block and the wafer shown in part B of fig. 4. It is understood that, based on the actual size of the wafer to be tested and the matching of the sizes of the support blocks 30, the entire first support surface 42 may also be used to support the edge of the wafer a, rather than being limited to the portion of the support surface shown in the figures, and it is within the scope of the present application to support the edge of the wafer a without directly contacting the central region of the front surface.

Similarly, the positioning block 4 with supporting function may be disposed below the edge of the wafer a, please refer to fig. 7, and fig. 7 is an enlarged view of the position relationship between the positioning block and the wafer shown in the part C of fig. 4. The positioning portion 41 of the wafer a is radially abutted against the edge of the wafer a for positioning, and a part of the surface of the first supporting surface 42 on the radially inner side of the positioning portion 41 is used for synchronously supporting the edge of the wafer a and is not directly contacted with the middle area of the front surface of the wafer a.

As shown, the clamping assembly 2 is located at one side of the vacuum chuck 1, and the positioning portion 41 adapted to clamp and position the clamping assembly 2 is located at the opposite side of the clamping assembly 2 in the radial direction, so that when the clamping portion 21 applies a clamping force to the wafer in the substantially radial direction, the positioning portion 41 of the positioning block 4 abuts against the edge of the wafer a to establish the above-mentioned positioning. In the present embodiment, the specific number and corresponding position of the positioning blocks 4 may be set as required, for example, but not limited to, two of the preferred examples of the present embodiment. As shown in fig. 4, the two positioning blocks 4 are symmetrically disposed on both sides with respect to the radial force application direction of the clamping portion 21, so as to form a stable clamping and positioning relationship, and the structure is simple and reliable. In this embodiment, two bearing blocks 3 are also provided, as shown in fig. 4, the bearing block 3 is located on one side of the clamping assembly 2 relative to the positioning block 4, and the bearing portions are substantially uniformly arranged along the circumferential direction of the wafer a, so as to ensure that the wafer to be measured maintains a horizontal posture. Of course, the bearing blocks 3 may be arranged in other plural numbers and arranged evenly in the circumferential direction.

Theoretically, the clamping force provided by the clamping assembly 2 can be applied in a radial direction as well as in a vertical direction. Such as but not limited to, applying a clamping force to the wafer in a generally radial direction as shown in the preferred example.

The clamping assembly 2 can further comprise a clamping driving part (22) which can provide a clamping driving force for the clamping part 21, and is specifically configured to: under the action of the clamping driving force, the clamping portion 21 and the positioning portion 41 form a clamping force to the wafer a. Here, the clamping driving part for providing the clamping driving force preferably adopts a clamping cylinder 22, and the output end of the clamping cylinder is in transmission connection with the body of the clamping assembly 21 so as to drive the clamping cylinder to linearly displace; the clamp driving unit may be configured as a hydraulic cylinder or a linear motor, if necessary.

In order to obtain a flexible clamping mode, the requirements of different objects to be tested such as a common wafer, a thin wafer, a TAIKO wafer and the like on the clamping force are met, and the clamping assembly 2 can be further optimized. Reference is also made to fig. 8 and 9, wherein fig. 8 is a schematic view of the clamping assembly in the unclamped operating position, and fig. 9 is a schematic view of the clamping assembly in the clamped operating position.

Preferably, the gripping portion 21 is pivoted to the body of the gripping assembly 2 and is switchable between a clamping operating position and a release operating position around a pivoting center, and is configured to: the clamping portion 21 located at the clamping position shown in fig. 9 forms a clamping force with the positioning portion 41 of the positioning block 4 to the wafer a to be tested; the clamping portion 21 at the unclamping station shown in fig. 8 is disengaged from the wafer a to be tested. Therefore, through the switching stroke, technical support is provided for adapting to different objects to be measured.

As shown in the figure, the two clamping portions 21 are arranged in a mirror image manner, i.e. symmetrically arranged with respect to the radial clamping force application direction, with respect to a symmetrical center line perpendicular to the connecting line of the two pivot centers. Each clamping part 21 is provided with a clamping end 211 formed by bending outwards from the body, the end part matched with the periphery of the wafer A to be side is an outward convex cambered surface, and the clamping parts 21 respectively rotate around respective pivot centers in the process of pressing and clamping the edge of the wafer and are tangent to the wafer through arcs of the two clamping end parts; meanwhile, an elastic member 23 is provided between the two clamping portions 21, and is configured to: in the process of switching the two clamping parts 21 from the unclamping working position to the clamping working position, the elastic piece generates deformation and stores elastic deformation energy, and the elastic piece 23 absorbs energy to keep flexible clamping acting force on the wafer A in the process, so that safe and stable bearing and fixing of various types of wafers can be realized.

In addition, the elastic element 23 is preferably in the form of a tension spring, and can also adjust the clamping force of the clamping part 21 on the outer edge of the wafer a on the premise that the force of the clamping cylinder 22 is not changed by replacing springs with different wire diameters.

In this scheme, a plurality of supporting components such as carrier block 3 and locating piece 4 all can follow vertical direction and switch between work position and non-work position, especially locating piece 4 has the function of bearing the wafer that awaits measuring concurrently, can further optimize to the synchronism of both displacements. Referring to fig. 2 and 3, the bearing block 3 and the positioning block 4 are both disposed on a lifting platform 51 of the lifting member 5, and are moved by the lifting platform 51 in a direction perpendicular to the vacuum suction surface, and are driven to synchronously switch between a working position and a non-working position, wherein a lifting driving force of the lifting platform 51 is provided by a lifting driving part (52), and similarly, the lifting driving part may be a lifting cylinder 52, and may also be driven by a hydraulic cylinder or a motor.

Further, the lifting platform 51 is provided with a limiting block 6, please refer to fig. 2 and fig. 3, and is configured as follows: when the lifting table 51 drives the bearing block 3 and the positioning block 4 to switch to the working positions shown in fig. 3, at least two of the limiting blocks 6 are pressed against and limited by the lower surface of the vacuum chuck 1. The lifting table 51 in the second detection state is in a horizontal posture based on the uniformly distributed limiting blocks 6, so that the supported wafer to be detected is ensured to be kept in an ideal state to be detected, and a good technical guarantee is provided for obtaining good detection precision. Referring to fig. 5, four limiting blocks 6 are circumferentially and uniformly distributed on the lifting platform 51, it can be understood that the number of the limiting blocks 6 is at least two, which can achieve the requirement of the balanced and uniform loading function, and is not limited to the preferred exemplary illustration shown in the figure.

In this embodiment, the detecting system is further provided with a calibration platform 70 for pre-inspecting the position of the wafer a to be detected, which mainly includes calibration of relative position and angle precision, so as to ensure that the manipulator 20 accurately captures the wafer to be detected. That is, the wafer to be tested is first placed on the calibration stage 70 for position calibration, and then enters the inspection process.

In addition, the inspection apparatus 40 includes a defect detection module and an auto focus module; the defect detection module comprises a light source 401, a lens 402 and a camera 403, wherein light path guiding is constructed through a light splitting component 404, the optical axis of the defect detection module is perpendicular to the surface of an object to be detected, so as to scan and acquire the surface states of two sides of the object to be detected respectively, because the first surface is a non-processing surface of the object to be detected, and the second surface is a processing surface of the object to be detected, namely the first surface is different from the second surface, the second surface comprises a plurality of chip patterns, and when the optical axis of the defect detection module is perpendicular to the surface of the object to be detected, the defect detection module can detect the first surface and the second surface respectively, and has universality. The automatic focusing module is used for obtaining the distance between the defect detection module and the surface of the object to be detected, adjusting the focal length of the lens and enabling the focal point of the defect detection module to be located on the surface of the object to be detected to adapt to different devices to be detected. Referring to fig. 10, a schematic diagram of a defect detection module of the inspection apparatus is shown. It should be noted that the specific functional structure of the detecting device 40 is not the core point of the present application, and those skilled in the art can implement the function based on the prior art, so that the detailed description is omitted here.

In addition to the detection system, the present embodiment also provides a detection method based on the detection system.

The detection method specifically comprises the following steps: enabling the bearing device to bear the first surface of the object to be detected, and enabling the detection device to carry out first detection processing on the second surface of the object to be detected; after the first detection treatment is finished, enabling the transfer device to switch the first surface of the object to be detected to a state to be detected; and enabling the bearing device to bear the edge area of the object to be detected, and enabling the detection device to carry out second detection processing on the first surface of the object to be detected.

Further, before the first detection processing, the method includes raising the plurality of support assemblies to a working position, and disposing the object to be detected on the plurality of support assemblies; the supporting assemblies descend to the position where the vacuum adsorption surface is flush with or lower than the vacuum adsorption surface, the object to be detected is placed on the vacuum adsorption surface, and the vacuum adsorption surface adsorbs a first surface of the object to be detected;

after the first detection processing is finished, the plurality of supporting assemblies drive the object to be detected to ascend to the plane where the bearing surface is located.

Further, after the first detection process is completed, the step of switching the transfer device to the state to be detected via the first surface of the object to be detected includes: and the transfer device is used for moving the object to be detected away from the bearing surface, turning the object to be detected by the transfer device, and placing the object to be detected after turning in the bearing surface to enable the first surface of the object to be detected to be in a state to be detected.

Specifically, in the first detection state, the bearing block 3 is lifted to the working position, and the object to be detected is arranged on the second bearing surface 31 of the bearing block 3; the bearing block 3 is lowered to a non-working position, an object to be measured is placed on the vacuum chuck 1, the first surface (back surface) of the object to be measured is fixed through establishing vacuum adsorption, and measurement processing is carried out on the second surface (front surface) of the device to be measured; in a second detection state, the bearing block 3 is lifted to a working position, and the object to be detected is arranged on a second bearing surface 31 of the bearing block 3; the clamping part 21 of the clamping assembly 2 clamps and fixes the object to be measured, and the measurement processing is performed on the first surface (back surface) of the device to be measured.

Further, in the first detection state, the clamping portion 21 is located at the unclamping working position; in the second detection state, the clamping portion 21 is switched to the clamping position.

Before the optical detection starts, the high-speed motion platform rotates through the rotary driving mechanism, a first surface (back surface) of a wafer A to be detected is placed on the bearing device downwards, and the wafer A is adsorbed and fixed by the vacuum chuck 1 in a first detection state and can be detected aiming at a second surface (front surface) of the wafer A; next, the vacuum pump is turned off, the wafer a to be detected is turned over by 180 degrees by the manipulator 60, the second surface (front) of the wafer a to be detected is placed on the bearing device in a downward direction, in a second detection state, the edge of the second surface (front) of the wafer a is supported by the bearing block 3 and the positioning block 4 together, the wafer a is moved up to the working position, the clamping component 20 and the positioning block 4 are used for clamping the outer edge of the wafer a together in a positioning manner, and the reverse side of the wafer a can be detected.

After the optical detection is finished, the manipulator lifts up and takes away the wafer, and the rotary driving mechanism rotates the corresponding associated component to return to the zero position, so that the high-speed and full-automatic optical detection is finished in one detection cavity.

The following table is a table of the matching relationship between each detection flow and the state of the main functional part in the detection method:

mechanical arm

Lifting part

Clamping part

Vacuum chuck

Detection device

1

Preparing a wafer

Descend

Open and open

Close off

2

Enter the detection cavity

Is raised

Open and open

Close off

3

Release wafer

Is raised

Open and open

Close off

4

Exit detection cavity

Descend

Open and open

Is opened

Front side detection

5

Enter the detection cavity

Is raised

Open and open

Close off

6

Turnover wafer

Is raised

Open and open

Close off

7

Release wafer

Is raised

Open and open

Close off

8

Exit detection cavity

Is raised

Clamping of

Close off

Backside detection

9

Taking away the wafer

Descend

Open and open

Close off

In the description of the present invention, it is to be understood that the terms "central," "radial," "vertical," "horizontal," "inner," "outer," and the like refer to orientations or positional relationships based on those shown in the drawings, which are used for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the scope of the present invention.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that it is obvious to those skilled in the art that various modifications and improvements can be made without departing from the principle of the present invention, and these modifications and improvements should also be considered as the protection scope of the present invention.

Claims

1. A detection system, comprising:

the device comprises a detection device, a first detection unit and a second detection unit, wherein the detection device is used for detecting a first surface or a second surface of an object to be detected, and an optical axis of the detection device is vertical to the first surface or the second surface of the object to be detected;

the bearing device is arranged in the detection cavity and is used for bearing the first surface of the object to be detected or bearing the edge area of the object to be detected;

and the transfer device is used for moving the object to be tested to or from the carrying device and is configured to enable the first surface or the second surface of the object to be tested to be in a state to be tested.

2. The detection system of claim 1, wherein the carrier device comprises:

the vacuum adsorption surface is used for adsorbing the first surface of the object to be detected, and the support surface is used for bearing the edge area of the object to be detected;

the supporting components are used for driving the object to be detected to the plane where the vacuum adsorption surface is located or to the plane where the supporting surface is located.

3. The inspection system of claim 1, wherein the transfer device comprises a robot for gripping or releasing the object to be inspected and a turnover mechanism for turning over the object to be inspected.

4. The detection system of claim 3, wherein the flipping mechanism is configured to: is positioned beside the detection cavity or is integrated with the manipulator.

5. The detection system according to any one of claims 1 to 4, wherein a motion stage is disposed in the detection chamber, the carrying device is disposed on the motion stage to drive the carrying device to displace, and a displacement track of the carrying device is formed by combining lateral displacement, longitudinal displacement and/or rotation around a rotation center in a horizontal plane.

6. The inspection system of claim 1, wherein the inspection device comprises a defect detection module and an autofocus module; the defect detection module comprises a light source, a lens and a camera, the optical axis of the defect detection module is perpendicular to the surface of the object to be detected, and the automatic focusing module is used for acquiring the distance between the defect detection module and the surface of the object to be detected and enabling the focus of the defect detection module to be located on the surface of the object to be detected.

7. The detection system of claim 2, wherein the plurality of support assemblies comprises: the positioning block is configured to move in a direction perpendicular to the vacuum adsorption surface, the positioning block comprises a first bearing surface and a positioning part located above the first bearing surface, and the positioning part can limit the position of the device to be tested in a horizontal plane; the bearing block is configured to move along a direction vertical to the vacuum adsorption surface, and the bearing block comprises a second bearing surface.

8. The detection system of claim 1, wherein the carrier further comprises a clamping assembly comprising a clamping portion and a clamping drive portion: the clamping part is configured to be radially abutted against the edge of the object to be measured;

the clamping driving part is used for driving the clamping part to move along the radial direction of the vacuum adsorption surface, providing clamping driving force of the clamping part and is configured to: and under the action of the clamping driving force, the clamping force formed by the clamping part and the positioning part is transmitted to an object to be measured.

9. The detection system according to claim 8, wherein the clamping driving part is a clamping cylinder, and an output end of the clamping cylinder is in transmission connection with the body of the clamping assembly; the clamping parts are arranged into two parts, and are arranged in a mirror image manner and respectively pivoted on the body of the clamping assembly relative to a symmetrical center line which is vertical to a connecting line of the pivoting centers of the two parts, and can be switched between a clamping working position and a loosening working position around the pivoting center and configured as follows: the clamping part is positioned at the clamping working position, and the clamping force formed by the clamping part and the positioning part is transmitted to an object to be measured; the clamping part positioned at the loosening working position is separated from the object to be detected;

each clamping part is provided with a clamping end which is formed by bending outwards from the body, and the end part which is matched with the periphery of the device to be laterally is an outward convex cambered surface; an elastic member is provided between the two clamping portions, and is configured to: and in the process that the two clamping parts are switched to the clamping working positions, the elastic piece deforms and stores elastic deformation energy.

10. The detection system of claim 2, further comprising a lifting member, the lifting member comprising:

the plurality of supporting assemblies are arranged on the lifting platform and move along the direction vertical to the vacuum adsorption surface by the lifting platform;

and a lifting driving part which can provide lifting driving force for the lifting platform.

11. The inspection system of claim 1, wherein the object to be inspected comprises a patterned wafer, the first surface of the object to be inspected is a non-machined surface of the object to be inspected, and the second surface of the object to be inspected is a machined surface of the object to be inspected.

12. A detection method implemented by the detection system according to any one of claims 1 to 11, the detection method comprising: enabling the bearing device to bear the first surface of the object to be detected, and enabling the detection device to carry out first detection processing on the second surface of the object to be detected;

after the first detection treatment is finished, enabling the transfer device to switch the first surface of the object to be detected to a state to be detected;

and enabling the bearing device to bear the edge area of the object to be detected, and enabling the detection device to carry out second detection processing on the first surface of the object to be detected.

13. The detection method according to claim 12, comprising:

before the first detection processing, the method comprises the steps of lifting the plurality of supporting assemblies to a working position, and arranging an object to be detected on the plurality of supporting assemblies; the supporting assemblies descend to the position where the vacuum adsorption surface is flush with or lower than the vacuum adsorption surface, the object to be detected is placed on the vacuum adsorption surface, and the vacuum adsorption surface adsorbs a first surface of the object to be detected;

14. The inspection method according to claim 13, wherein the step of causing the transfer device to switch the first surface of the object to be inspected to the state to be inspected includes:

and the transfer device is enabled to move the object to be detected away from the bearing surface, the transfer device is enabled to turn over the object to be detected, the object to be detected after turning over is placed in the bearing surface, and the first surface of the object to be detected is enabled to be in a state to be detected.