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CN114058154A - A kind of copper clad laminate glue suitable for PCB lead-free process and its application - Google Patents

A kind of copper clad laminate glue suitable for PCB lead-free process and its application Download PDF

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Publication number
CN114058154A
CN114058154A CN202111337043.5A CN202111337043A CN114058154A CN 114058154 A CN114058154 A CN 114058154A CN 202111337043 A CN202111337043 A CN 202111337043A CN 114058154 A CN114058154 A CN 114058154A
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parts
copper
epoxy resin
clad plate
lead
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Inventor
陈伟福
林英荣
闻建明
李亚涛
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Guangde Longtai Electronic Sci Tech Co ltd
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Guangde Longtai Electronic Sci Tech Co ltd
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Publication of CN114058154A publication Critical patent/CN114058154A/en
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses a copper-clad plate glue solution suitable for a PCB lead-free process and application thereof, wherein the glue solution comprises the following raw materials in parts by weight: 66-81 parts of composite epoxy resin, 0.1-0.3 part of curing agent, 0.01-0.02 part of catalyst, 0.05-0.08 part of boric acid, 16-19 parts of silica powder, 7-9 parts of aluminum hydroxide and 0.1 part of coupling agent KH 5600.08; the composite epoxy resin comprises the following components in parts by weight: 10-14 parts of BPA novolac epoxy resin, 8-10 parts of isocyanate modified epoxy resin, 25-28 parts of low-bromine epoxy resin, 1-3 parts of four-functional-group epoxy resin, 5-6 parts of high-bromine epoxy resin and 17-20 parts of novolac epoxy resin. The copper-clad plate glue solution can obviously improve the heat resistance and chemical resistance of the copper-clad plate and meet the processing requirements of a PCB lead-free process.

Description

Copper-clad plate glue solution suitable for PCB lead-free process and application
Technical Field
The invention relates to the field of glue solution, in particular to copper-clad plate glue solution suitable for a PCB lead-free process and application thereof.
Background
Lead and its compounds are one of 17 chemical substances seriously harming human life and natural environment, lead in industrial wastes enters the food chain of animals or human beings by permeating into a ground water system, excessive lead in the human body causes disorder of nerve and regeneration system, development retardation, hemoglobin reduction and causes anemia and hypertension, the lead content in blood of adults is less than 50mg/dl, and the lead content in blood of children is less than 30 mg/dl. In order to meet the requirement of environmental protection, the welding of PCB components and parts gradually eliminates lead soldering tin and uses lead-free soldering tin.
The leaded solder is an alloy consisting of tin (melting point 232 ℃) and lead (melting point 327 ℃). Among them, a solder composed of 63% tin and 37% lead is called eutectic solder, and the melting point of this solder is 183 degrees. The components and characteristics of the lead-free solder are that Sn tin-Ag silver-Cu copper has a high melting point (217 ℃) and a high melting point (260 +/-3 ℃). The melting point of the lead-free soldering tin is 77 ℃ higher than that of the lead soldering tin, and the heat resistance of the common FR-4 board is not suitable for the lead-free process of the PCB, so that the development of a novel heat-resistant board is urgently needed.
Disclosure of Invention
In order to solve the defects mentioned in the background technology, the invention aims to provide the copper-clad plate glue solution suitable for the PCB lead-free process and the application thereof.
The purpose of the invention can be realized by the following technical scheme:
the copper-clad plate glue solution suitable for the lead-free manufacture procedure of the PCB comprises the following raw materials in parts by weight:
Figure BDA0003350929940000011
Figure BDA0003350929940000021
further preferably, the composite epoxy resin comprises the following components in parts by weight:
Figure BDA0003350929940000022
further preferably, the curing agent is a dicyandiamide curing agent.
Further preferably, the catalyst is 2-ethyl 4-methylimidazole.
Further preferably, the coupling agent is the coupling agent KH 560.
Further preferably, the particle size of the fine silica powder is less than 3 μm, and the particle size of the aluminum hydroxide is less than 1.5 μm.
The application of copper-clad plate glue solution suitable for a PCB lead-free process in preparing a copper-clad plate comprises uniformly stirring composite epoxy resin, a curing agent, a catalyst, boric acid, silicon micropowder, aluminum hydroxide, a coupling agent KH560 and propylene glycol methyl ether at a high speed to prepare the glue solution, dipping glass fiber cloth in the glue solution, baking to prepare a prepreg, overlapping the prepreg according to requirements, covering two sides with electrolytic copper foils, and hot-pressing in a vacuum press to prepare the copper-clad plate.
The invention has the beneficial effects that:
according to the invention, propylene glycol methyl ether is used as a solvent to dilute BPA novolac epoxy resin, isocyanate modified epoxy resin and four-functional group epoxy resin, so that the heat resistance and chemical resistance of the copper-clad plate are improved, brominated resin is used to enable the copper-clad plate to have 94V0 flame retardance, dicyandiamide and novolac epoxy resin are used as curing agents, 2 ethyl 4 methylimidazole is used as a catalyst, composite silicon micropowder and aluminum hydroxide are used as fillers, and a coupling agent KH560 is used to enable the prepared glue solution to be fully immersed in a glass fiber cloth yarn bundle. The copper-clad plate prepared by the glue solution according to the proportion has the glass transition temperature of 155+/-5 ℃, the soldering tin heat resistance (288 ℃ tin immersion), and no delamination within more than 5 minutes, and can meet the processing requirements of a PCB lead-free process.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
The copper-clad plate glue solution suitable for the lead-free manufacture procedure of the PCB comprises the following raw materials in parts by weight: 10 parts of BPA novolac epoxy resin, 8 parts of isocyanate modified epoxy resin, 25 parts of low-bromine epoxy resin, 1 part of four-functional group epoxy resin, 5 parts of high-bromine epoxy resin, 17 parts of novolac epoxy resin, 0.1 part of dicyandiamide curing agent, 0.01 part of 2-ethyl 4-methylimidazole, 0.05 part of boric acid, 16 parts of silica micropowder, 7 parts of aluminum hydroxide and 5600.08 parts of coupling agent KH.
According to the formula, the composite epoxy resin, the dicyandiamide curing agent, the 2-ethyl 4-methylimidazole, the boric acid, the silicon micropowder, the aluminum hydroxide and the coupling agent KH560 are uniformly stirred at a high speed to prepare a glue solution, the glass fiber cloth is dipped in the glue and baked to prepare a prepreg, the prepreg is overlapped according to the requirement, the two sides of the prepreg are covered with electrolytic copper foils, and the copper clad laminate is formed by hot pressing in a vacuum press.
Example 2
The copper-clad plate glue solution suitable for the lead-free manufacture procedure of the PCB comprises the following raw materials in parts by weight: 10.5 parts of BPA novolac epoxy resin, 9.05 parts of isocyanate modified epoxy resin, 25.4 parts of low-bromine epoxy resin, 1.55 parts of four-functional-group epoxy resin, 5.2 parts of high-bromine epoxy resin, 17.6 parts of novolac epoxy resin, 0.15 part of dicyandiamide curing agent, 0.01 part of 2-ethyl 4-methylimidazole, 0.055 part of boric acid, 16.8 parts of silicon micropowder, 7.8 parts of aluminum hydroxide and 5600.088 parts of coupling agent KH.
The preparation method of the copper-clad plate is the same as that of the embodiment 1.
Example 3
The copper-clad plate glue solution suitable for the lead-free manufacture procedure of the PCB comprises the following raw materials in parts by weight: 11.8 parts of BPA novolac epoxy resin, 9.84 parts of isocyanate modified epoxy resin, 26.3 parts of low-bromine epoxy resin, 1.81 parts of four-functional-group epoxy resin, 5.5 parts of high-bromine epoxy resin, 18.3 parts of novolac epoxy resin, 0.185 part of dicyandiamide curing agent, 0.0121 part of 2-ethyl 4-methylimidazole, 0.068 part of boric acid, 17.6 parts of silicon micropowder, 8.5 parts of aluminum hydroxide and 5600.093 parts of coupling agent KH.
The preparation method of the copper-clad plate is the same as that of the embodiment 1.
Example 4
The copper-clad plate glue solution suitable for the lead-free manufacture procedure of the PCB comprises the following raw materials in parts by weight: 12.4 parts of BPA novolac epoxy resin, 9.95 parts of isocyanate modified epoxy resin, 27.5 parts of low-bromine epoxy resin, 2.4 parts of four-functional-group epoxy resin, 5.8 parts of high-bromine epoxy resin, 19.6 parts of novolac epoxy resin, 0.225 part of dicyandiamide curing agent, 0.015 part of 2-ethyl 4-methylimidazole, 0.075 part of boric acid, 18.4 parts of silicon micropowder, 8.8 parts of aluminum hydroxide and KH5600.097 parts of coupling agent.
The preparation method of the copper-clad plate is the same as that of the embodiment 1.
Example 5
The copper-clad plate glue solution suitable for the lead-free manufacture procedure of the PCB comprises the following raw materials in parts by weight: 14 parts of BPA novolac epoxy resin, 10 parts of isocyanate modified epoxy resin, 28 parts of low-bromine epoxy resin, 3 parts of four-functional group epoxy resin, 6 parts of high-bromine epoxy resin, 20 parts of novolac epoxy resin, 0.3 part of dicyandiamide curing agent, 0.02 part of 2-ethyl 4-methylimidazole, 0.08 part of boric acid, 19 parts of silicon micropowder, 9 parts of aluminum hydroxide and 5600.1 parts of coupling agent KH.
The preparation method of the copper-clad plate is the same as that of the embodiment 1.
Performance detection
The copper-clad plates prepared in examples 1 to 5 were subjected to peel strength test, interlayer adhesion test and combustion test, and the obtained data are shown in table 1 below:
TABLE 1 copper clad laminate Properties
Figure BDA0003350929940000051
As can be seen from Table 1, the copper-clad plate prepared from the copper-clad plate glue solution for the lead-free PCB process has excellent comprehensive performance, large adhesive force of the glue solution and good heat resistance, and can meet the use requirements of high-end PCBs.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.

Claims (7)

1. The copper-clad plate glue solution suitable for the lead-free manufacture procedure of the PCB is characterized by comprising the following raw materials in parts by weight:
Figure FDA0003350929930000011
2. the copper-clad plate glue solution suitable for the lead-free process of the PCB according to claim 1, wherein the composite epoxy resin comprises the following components in parts by weight:
Figure FDA0003350929930000012
3. the copper-clad plate glue solution suitable for the lead-free process of the PCB according to claim 1, wherein the curing agent is dicyandiamide curing agent.
4. The copper-clad plate glue solution suitable for the lead-free process of the PCB according to claim 1, wherein the catalyst is 2-ethyl-4-methylimidazole.
5. The copper-clad plate glue solution suitable for the lead-free process of the PCB according to claim 1, wherein the coupling agent is KH 560.
6. The copper-clad plate glue solution suitable for the lead-free process of the PCB according to claim 1, wherein the grain size of the silica micro powder is less than 3 μm, and the grain size of the aluminum hydroxide is less than 1.5 μm.
7. The application of the copper-clad plate glue solution suitable for the lead-free PCB process in the preparation of the copper-clad plate according to any one of claims 1 to 6 is characterized in that the composite epoxy resin, the curing agent, the catalyst, the boric acid, the silica powder, the aluminum hydroxide and the coupling agent KH560 are uniformly stirred at a high speed to prepare the glue solution, the glass fiber cloth is dipped with the glue and baked to prepare a prepreg, the prepreg is overlapped according to the requirement, the two sides of the prepreg are coated with the electrolytic copper foil, and the prepreg is hot-pressed into the copper-clad plate in a vacuum press.
CN202111337043.5A 2021-11-12 2021-11-12 A kind of copper clad laminate glue suitable for PCB lead-free process and its application Pending CN114058154A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114589988A (en) * 2022-03-11 2022-06-07 建滔(佛冈)积层板有限公司 CEM-1 copper-clad plate based on multiple curing system and preparation method thereof

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WO2006057498A1 (en) * 2004-11-26 2006-06-01 Lg Chem, Ltd. Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same
CN109677058A (en) * 2018-12-24 2019-04-26 龙宇电子(梅州)有限公司 A kind of production method of unleaded TG140 copper-clad plate
CN110117407A (en) * 2019-04-17 2019-08-13 江苏诺德新材料股份有限公司 A kind of special curing materials of middle Tg and its application method for leadless process field
CN112250997A (en) * 2020-10-21 2021-01-22 广德龙泰电子科技有限公司 Heat-resistant epoxy resin composition, lead-free middle-Tg copper-clad plate and preparation method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006057498A1 (en) * 2004-11-26 2006-06-01 Lg Chem, Ltd. Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same
CN109677058A (en) * 2018-12-24 2019-04-26 龙宇电子(梅州)有限公司 A kind of production method of unleaded TG140 copper-clad plate
CN110117407A (en) * 2019-04-17 2019-08-13 江苏诺德新材料股份有限公司 A kind of special curing materials of middle Tg and its application method for leadless process field
CN112250997A (en) * 2020-10-21 2021-01-22 广德龙泰电子科技有限公司 Heat-resistant epoxy resin composition, lead-free middle-Tg copper-clad plate and preparation method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114589988A (en) * 2022-03-11 2022-06-07 建滔(佛冈)积层板有限公司 CEM-1 copper-clad plate based on multiple curing system and preparation method thereof

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