CN114040637A - Heat radiation structure and servo driver - Google Patents
Heat radiation structure and servo driver Download PDFInfo
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- CN114040637A CN114040637A CN202111191532.4A CN202111191532A CN114040637A CN 114040637 A CN114040637 A CN 114040637A CN 202111191532 A CN202111191532 A CN 202111191532A CN 114040637 A CN114040637 A CN 114040637A
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- 230000005855 radiation Effects 0.000 title abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 144
- 230000017525 heat dissipation Effects 0.000 claims abstract description 116
- 230000005494 condensation Effects 0.000 claims abstract description 38
- 238000009833 condensation Methods 0.000 claims abstract description 38
- 238000001816 cooling Methods 0.000 claims abstract description 25
- 238000001514 detection method Methods 0.000 claims abstract description 19
- 238000005192 partition Methods 0.000 claims abstract description 18
- 238000001704 evaporation Methods 0.000 claims abstract description 16
- 230000008020 evaporation Effects 0.000 claims abstract description 15
- 239000004065 semiconductor Substances 0.000 claims description 20
- 230000003014 reinforcing effect Effects 0.000 claims description 7
- 238000005057 refrigeration Methods 0.000 claims description 4
- 230000002787 reinforcement Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 2
- 241000238631 Hexapoda Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20281—Thermal management, e.g. liquid flow control
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a heat radiation structure and a servo driver, wherein the heat radiation structure is used for the servo driver and comprises: the heat dissipation device comprises a shell, a heat dissipation cavity and a heat dissipation cavity, wherein a partition plate is arranged in the shell, and divides an inner cavity of the shell into an accommodating cavity and the heat dissipation cavity, and the accommodating cavity is used for accommodating a driving function component of a servo driver; the heat pipe penetrates through the partition plate, the evaporation end of the heat pipe is positioned in the accommodating cavity and is used for being in contact with the driving function component, and the condensation end of the heat pipe is positioned in the heat dissipation cavity; the water cooling device comprises a cold water pipe arranged in the heat dissipation cavity, a water pump with a water outlet end communicated with the cold water pipe, and a water tank communicated with a water inlet end of the water pump, wherein the cold water pipe is contacted with the condensation end of the heat pipe; the temperature detection device is arranged in the accommodating cavity and is used for contacting with the driving function component so as to detect the temperature of the driving function component; and the controller is electrically connected with the temperature detection device and the water pump. The technical scheme of the invention can improve the heat dissipation performance of the heat dissipation structure of the servo driver.
Description
Technical Field
The invention relates to the technical field of servo drivers, in particular to a heat dissipation structure and a servo driver.
Background
The alternating current servo system is a closed-loop control system for controlling the rotation of a motor, and comprises a servo driver, wherein the servo driver comprises a driving function component and a heat dissipation structure, the servo driving function component can continuously perform energy conversion in the working process, energy can be lost in the continuous conversion process, most of the lost energy is emitted in a heat form, the heat accumulation can lead to the temperature rise inside the servo driver, the running performance of each part is further influenced, and the service life of each part can be shortened. The heat radiation performance of the heat radiation structure of the existing servo driver is not excellent, and the operation performance and the service life of the servo driver are influenced.
Disclosure of Invention
The invention mainly aims to provide a heat dissipation structure, and aims to improve the heat dissipation performance of the heat dissipation structure of a servo driver.
In order to achieve the above object, the present invention provides a heat dissipation structure for a servo driver, including:
the servo driver comprises a shell, wherein a partition plate is arranged in the shell, the partition plate divides an inner cavity of the shell into an accommodating cavity and a heat dissipation cavity, and the accommodating cavity is used for accommodating a driving function component of the servo driver;
the heat pipe penetrates through the partition plate, the evaporation end of the heat pipe is positioned in the accommodating cavity and is used for being in contact with the driving function component, and the condensation end of the heat pipe is positioned in the heat dissipation cavity;
the water cooling device comprises a cold water pipe arranged in the heat dissipation cavity, a water pump with a water outlet end communicated with the cold water pipe, and a water tank communicated with a water inlet end of the water pump, wherein the cold water pipe is contacted with the condensation end of the heat pipe;
the temperature detection device is arranged in the accommodating cavity and is used for being in contact with the driving function component so as to detect the temperature of the driving function component; and
and the controller is electrically connected with the temperature detection device and the water pump.
Optionally, the housing is provided with an air inlet and an air outlet both communicated with the heat dissipation cavity, the heat dissipation structure further comprises a first heat dissipation fan arranged in the heat dissipation cavity, and the first heat dissipation fan is electrically connected with the controller and used for enabling air flow to flow out of the air outlet from the air inlet through the condensation end of the heat pipe.
Optionally, a plurality of heat pipes are distributed at intervals, and connecting lines of any three adjacent heat pipes form an equilateral triangle; and/or
Fins are arranged on the outer surfaces of the evaporation end and the condensation end of the heat pipe.
Optionally, the water cooling device further includes a flow meter disposed between the water pump and the cold water pipe, and the flow meter is electrically connected to the controller.
Optionally, the cold water pipe is wound around the condensation end of the heat pipe.
Optionally, the water tank is provided with a water outlet and a water return opening, the water inlet end of the water pump is communicated with the water outlet, and one end of the cold water pipe, which is far away from the water pump, is communicated with the water return opening.
Optionally, the heat dissipation structure further includes a semiconductor refrigeration sheet electrically connected to the controller, a cold end of the semiconductor refrigeration sheet is in contact with a condensation end of the heat pipe, and a hot end of the semiconductor refrigeration sheet is exposed outside the housing.
Optionally, the heat dissipation structure further includes a second heat dissipation fan disposed outside the housing, the second heat dissipation fan is disposed corresponding to the hot end of the semiconductor cooling fin, and the second heat dissipation fan is electrically connected to the controller.
Optionally, the partition plate is provided with a raised reinforcing portion protruding toward the accommodating cavity, and the heat pipe is arranged through the raised reinforcing portion.
The invention further provides a servo driver, which comprises the heat dissipation structure.
The heat radiation structure of the technical scheme of the invention is used for a servo driver and comprises: the servo driver comprises a shell, a partition board is arranged in the shell, the partition board divides an inner cavity of the shell into an accommodating cavity and a heat dissipation cavity, the accommodating cavity is used for accommodating a driving function assembly of the servo driver, and the shell can provide accommodating and protecting functions for the servo driving function assembly; the heat pipe penetrates through the partition plate, the evaporation end of the heat pipe is positioned in the accommodating cavity and is used for being in contact with the driving function component, a large amount of heat can be generated when the driving function component runs, the evaporation end of the heat pipe can quickly absorb the heat to reduce the temperature of the heat pipe, in addition, the condensation end of the heat pipe is positioned in the heat dissipation cavity, and the heat conducted from the evaporation end can be dissipated in the heat dissipation cavity by the condensation end; the water cooling device comprises a cold water pipe arranged in the heat dissipation cavity, a water pump with a water outlet end communicated with the cold water pipe, and a water tank communicated with a water inlet end of the water pump, wherein the cold water pipe is contacted with the condensation end of the heat pipe; the temperature detection device is arranged in the accommodating cavity and is used for being in contact with the driving function component so as to detect the temperature of the driving function component, and the temperature detection device can detect the temperature of the driving function component in time and enable an operator to know the temperature because the driving function component has different temperature values at different time stages; the water pump temperature detection device is electrically connected with the water pump, and the controller can receive, identify and process information from the temperature detection device and control the running state of the water pump. The heat pipe, the water cooling device, the temperature detection device and the controller are matched with each other, so that the heat dissipation performance of the heat dissipation structure of the servo driver can be improved to a great extent, and the effects of timely and rapid heat dissipation and energy saving are achieved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a heat dissipation structure according to an embodiment of the present invention;
fig. 2 is a cross-sectional view taken at a-a in fig. 1.
The reference numbers illustrate:
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, "and/or" in the whole text includes three schemes, taking a and/or B as an example, including a technical scheme, and a technical scheme that a and B meet simultaneously; in addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a heat dissipation structure.
Referring to fig. 1 and 2, in an embodiment of the present invention, the heat dissipation structure is used for a servo driver, and includes:
a partition plate 110 is arranged in the shell 100, the partition plate 110 divides an inner cavity of the shell 100 into an accommodating cavity 120 and a heat dissipation cavity 130, and the accommodating cavity 120 is used for accommodating a driving functional component 101 of the servo driver;
the heat pipe 200 penetrates through the partition 110, an evaporation end of the heat pipe 200 is positioned in the accommodating cavity 120 and is used for contacting with the driving functional component 101, and a condensation end of the heat pipe 200 is positioned in the heat dissipation cavity 130;
the water cooling device comprises a cold water pipe 301 arranged in the heat dissipation cavity 130, a water pump 302 with a water outlet end communicated with the cold water pipe 301, and a water tank 303 with a water inlet end communicated with the water pump 302, wherein the cold water pipe 301 is contacted with a condensation end of the heat pipe 200;
the temperature detection device 400 is arranged in the accommodating cavity 120 and is used for contacting with the driving functional component 101 so as to detect the temperature of the driving functional component 101; and
and the controller 500 is electrically connected with both the temperature detection device 400 and the water pump 302.
Referring to fig. 1 and 2, in the present embodiment, the heat dissipation structure includes: the servo driver comprises a shell 100, wherein a partition plate 110 is arranged in the shell 100, the partition plate 110 divides an inner cavity of the shell 100 into an accommodating cavity 120 and a heat dissipation cavity 130, the accommodating cavity 120 is used for accommodating a driving functional component 101 of the servo driver, and the shell 100 can provide accommodating and protecting functions for the servo driving functional component 101; the heat pipe 200 penetrates through the partition plate 110, an evaporation end of the heat pipe 200 is positioned in the accommodating cavity 120 and is used for contacting with the driving functional component 101, a large amount of heat is generated when the driving functional component 101 runs, the evaporation end of the heat pipe 200 can quickly absorb the heat to reduce the temperature of the heat pipe, additionally, a condensation end of the heat pipe 200 is positioned in the heat dissipation cavity 130, and the condensation end can dissipate the heat conducted from the evaporation end in the heat dissipation cavity 130; the water cooling device comprises a cold water pipe 301 arranged in the heat dissipation cavity 130, a water pump 302 with a water outlet end communicated with the cold water pipe 301, and a water tank 303 with a water inlet end communicated with the water pump 302, wherein the cold water pipe 301 is contacted with the condensation end of the heat pipe 200, so that the cold water pipe 301 is in close contact with the condensation end to quickly absorb heat on the condensation end, the cold water pipe 301, the water pump 302 and the water tank 303 form a circulating water system, heat in the servo driver can be quickly and effectively discharged to the external environment, and the water has the advantages of good heat conductivity and low price; the temperature detection device 400 is arranged in the accommodating cavity 120 and is used for contacting with the driving functional component 101 to detect the temperature of the driving functional component 101, and the temperature detection device 400 can detect the temperature of the driving functional component 101 in time and enable an operator to know the temperature because the driving functional component 101 has different temperature values at different time stages; the water pump temperature control system further comprises a controller 500, wherein the controller 500 is electrically connected with the temperature detection device 400 and the water pump 302, and the controller 500 can receive, identify and process information from the temperature detection device 400 and control the running state of the water pump 302. The controller 500 has a function of presetting a temperature threshold, and when the temperature of the driving functional component 101 is greater than or equal to a preset temperature, that is, when the temperature of the driving functional component 101 is too high, the controller 500 controls the water pump 302 to start or increases the rotation speed of the water pump 302 to increase the flow rate, so that the temperature of the condensation end of the heat pipe 200 is rapidly reduced through the cold water pipe 301 of the water cooling device, and the heat dissipation efficiency of the heat pipe 200 is improved. According to the technical scheme, the heat pipe 200, the water cooling device, the temperature detection device 400 and the controller 500 are matched with each other, so that the heat dissipation performance of the heat dissipation structure of the servo driver can be greatly improved, and the effects of timely and rapid heat dissipation and energy saving are achieved.
Further, in the present embodiment, the housing 100 is provided with an air inlet 601 and an air outlet 601 both communicated with the heat dissipation chamber 130, specifically, the air in the heat dissipation chamber 130 can be directly communicated with the air in the external environment through the air inlet 601 and the air outlet 601; the heat dissipation structure of the present invention further includes a first heat dissipation fan 600, the first heat dissipation fan 600 is disposed in the heat dissipation chamber 130 and electrically connected to the controller 500, so as to enable the air flow to flow out of the air outlet 601 from the air inlet through the condensation end of the heat pipe 200, the controller 500 can control the operation state of the first heat dissipation fan 600 according to the temperature detected by the temperature detection device 400, when the temperature of the driving functional component 101 is greater than or equal to a preset temperature, that is, when the temperature of the driving functional component 101 is too high, the controller 500 controls the start of the heat dissipation fan or increases the rotation speed of the fan blade, or when the power of the water cooling device reaches the maximum, the temperature of the driving functional component 101 still cannot be rapidly reduced, at this time, the controller 500 controls the start of the heat dissipation fan, and then increases the rotation speed of the fan blade according to the situation. In this embodiment, the air inlet and the air outlet 601 are respectively disposed at two opposite sides of the heat pipe 200, the first heat dissipation fan 600 is disposed at a position close to the air inlet or directly disposed at the air inlet, and a protective net is covered on the air outlet 601. However, the design is not limited thereto, and in other embodiments, the portion of the housing 100 including the heat dissipation chamber 130 may be configured as a mesh body, and the airflow can enter and exit the heat dissipation chamber 130 through the mesh.
Without loss of generality, in the present embodiment, the number of the heat pipes 200 included in the heat dissipation structure is multiple, the plurality of heat pipes 200 are distributed at intervals, and the connecting lines of any three adjacent heat pipes 200 form an equilateral triangle, according to the fluid mechanics principle, the heat pipes 200 are arranged in such a way that the fluid flowing through the heat pipes 200 generates the maximum turbulence, and in combination with the heat transfer principle, the fluid generates the turbulence to enable the heat exchange effect between the fluid and the heat pipes 200 to be better, that is, the heat dissipation airflow generated by the heat dissipation fan can better dissipate the heat at the condensation end of the heat pipes 200, so that the heat dissipation efficiency of the heat dissipation structure can be increased.
Optionally, in this embodiment, fins are disposed on the outer surfaces of the evaporation end and the condensation end of the heat pipe 200, specifically, the fins on the evaporation end can increase the contact area between the evaporation end and the driving function assembly 101 and the air in the accommodating cavity 120, so as to increase the heat absorption efficiency of the evaporation end; the fins on the condensation end can increase the contact area of the condensation end and the heat dissipation airflow generated by the heat dissipation fan and enable the heat dissipation airflow to generate more violent turbulence, so that the heat exchange efficiency of the heat dissipation airflow and the condensation end is increased, and the heat dissipation efficiency of the heat dissipation structure is further increased.
Further, in this embodiment, the water cooling apparatus further includes a flow meter 304 disposed between the water pump 302 and the cold water pipe 301, and the flow meter 304 is electrically connected to the controller 500, so as to feed back the water flow rate in the cold water pipe 301 to the controller 500 in time, so as to facilitate the controller 500 to perform more accurate heat dissipation control.
Without loss of generality, in the present embodiment, the cold water pipe 301 is tightly wound around the condensation end of the heat pipe 200, specifically, a surface of the cold water pipe 301 contacting the condensation end of the heat pipe 200 is flat, and the cold water pipe 301 is tightly wound around the outer surface of the heat pipe 200, so that the heat exchange efficiency between the cold water pipe 301 and the condensation end of the heat pipe 200 can be increased. Optionally, the condensation end of the heat pipe 200 is provided with a groove for winding the cold water pipe 301, and the groove can increase the contact area between the cold water pipe 301 and the condensation end, so as to increase the heat exchange amount between the cold water pipe 301 and the condensation end.
Optionally, in this embodiment, the water tank 303 of the water cooling device is provided with a water outlet and a water return port, a water inlet end of the water pump 302 is communicated with the water outlet, and when the water pump 302 needs to pump water, the water pump takes water from the water tank 303 through the water outlet of the water tank 303; the end of the cold water pipe 301 far away from the water pump 302 is communicated with the water return port, and water flows through the part of the cold water pipe 301 wound around the heat pipe 200 to absorb heat of the heat pipe 200 and flows back to the water tank 303 through the water return port. Alternatively, the water tank 303 is provided with an opening for heat dissipation, and when the water with the heat of the heat pipe 200 flows back to the water tank 303, the heat thereof is dissipated to the outside through the opening.
Further, in this embodiment, the heat dissipation structure further includes a semiconductor chilling plate 700 electrically connected to the controller 500, the cold end of the semiconductor chilling plate 700 contacts with the condensation end of the heat pipe 200, and the hot end of the semiconductor chilling plate is exposed outside the housing 100, the cold end of the semiconductor chilling plate 700 can rapidly absorb the heat at the condensation end of the heat pipe 200 to accelerate the heat dissipation, and the hot end of the semiconductor chilling plate 700 is used to dissipate the heat absorbed at the cold end to the external environment, so that it can be understood that the heat dissipation efficiency of the heat dissipation structure can be improved by the cooperation of the semiconductor chilling plate 700 and the heat pipe 200, specifically, when the operating power of the water cooling device and/or the first cooling fan 600 reaches the maximum value, if the temperature of the driving function component 101 is still too high, the controller 500 can further control the semiconductor chilling plate 700 to start up to increase the heat dissipation efficiency of the whole heat dissipation structure, and further, the controller 500 may also control the operation power of the semiconductor chilling plate 700, i.e., the chilling effect of the cold side thereof. However, the design is not limited thereto, and in other embodiments, the cold end of the semiconductor cooling plate 700 may also be disposed in direct contact with the driving functional device 101, which directly absorbs the heat of the driving functional device 101.
Optionally, in this embodiment, the heat dissipation structure further includes a second heat dissipation fan 701 disposed outside the housing 100, the second heat dissipation fan 701 is disposed corresponding to the hot end of the semiconductor cooling fin 700, and the second heat dissipation fan 701 is electrically connected to the controller 500, the controller 500 can control the operation state of the second heat dissipation fan 701 according to the overall heat dissipation effect of the heat dissipation structure, specifically, after the operation power of the water cooling device, the first heat dissipation fan 600, and/or the semiconductor cooling fin 700 reaches the maximum value, if the temperature of the driving functional component 101 is still too high, the controller 500 further controls the second heat dissipation fan 701 to start, so as to increase the heat dissipation efficiency of the entire heat dissipation structure.
Further, in the present embodiment, the partition 110 included in the housing 100 is provided with a protruding reinforcing portion 111 protruding toward the accommodating cavity 120, and the heat pipe 200 is disposed through the protruding reinforcing portion 111, specifically, the protruding reinforcing portion 111 is shaped as a protruding table-shaped body, and it can be understood that the protruding reinforcing portion 111 can enhance the structural strength of the heat pipe 200.
Without loss of generality, in the embodiment, the controller 500 may set a first preset temperature, a second preset temperature and a preset operation time, and when the temperature of the driving functional assembly 101 detected by the temperature detecting device 400 is greater than or equal to the first preset temperature, the controller 500 controls the water pump 302 to start; after the water pump 302 operates for a preset operation time, if the temperature of the driving function assembly 101 detected by the temperature detecting device 400 is still greater than or equal to a second preset temperature, the controller 500 controls the semiconductor chilling plate 700 to start, where the first preset temperature and the second preset temperature may be the same temperature value or different temperature values, and considering that the driving function assembly 101 is not suitable for enduring a higher temperature for a long time, the second preset temperature is usually less than the first preset temperature.
Optionally, in the present embodiment, the temperature detecting device 400 is a temperature sensor.
Optionally, the portion of the housing 100 including the accommodating chamber 120 is a sealed chamber, so that external dust, water, insects, and the like can be prevented from entering the accommodating chamber 120, thereby protecting the driving function assembly 101.
Optionally, the controller 500 is further provided with a wireless network connection device, which may specifically be but not limited to a WIFI connection device, and may send information such as the temperature of the driving function component 101 to a wireless network signal receiving end such as a mobile phone, so that an operator can know and operate related parts of the servo driver.
The present invention further provides a servo driver, which includes a heat dissipation structure, and the specific structure of the heat dissipation structure refers to the above embodiments, and since the servo driver adopts all technical solutions of all the above embodiments, the servo driver at least has all the beneficial effects brought by the technical solutions of the above embodiments, and details are not repeated herein.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111191532.4A CN114040637B (en) | 2021-10-13 | 2021-10-13 | Heat sink and servo drive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111191532.4A CN114040637B (en) | 2021-10-13 | 2021-10-13 | Heat sink and servo drive |
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| Publication Number | Publication Date |
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| CN114040637A true CN114040637A (en) | 2022-02-11 |
| CN114040637B CN114040637B (en) | 2025-02-14 |
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