CN114037246B - Injection control method, device, electronic device and storage medium - Google Patents
Injection control method, device, electronic device and storage medium Download PDFInfo
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Abstract
本发明实施例公开了一种注料控制方法、装置、电子设备和存储介质，具体涉及智能制造技术领域，该方法包括：采用超宽带UWB定位技术定位目标模具，得到目标模具的当前位置；确定目标模具的当前位置是否属于注料设备的预设注料区域；在目标模具的当前位置属于预设注料区域时，获取注料设备的注料配置信息，并获取目标模具的模具配置信息；确定注料配置信息与模具配置信息是否匹配；若注料配置信息与模具配置信息匹配，则控制注料设备对目标模具注料，若注料配置信息与模具配置信息不匹配，则发出报警提示。本发明实施例可以降低注料出错率，提高生产效率和产品质量。
The embodiment of the present invention discloses a material injection control method, device, electronic device and storage medium, which specifically relates to the field of intelligent manufacturing technology. The method comprises: using ultra-wideband (UWB) positioning technology to locate a target mold and obtain the current position of the target mold; determining whether the current position of the target mold belongs to a preset material injection area of the material injection device; when the current position of the target mold belongs to the preset material injection area, obtaining the material injection configuration information of the material injection device and obtaining the mold configuration information of the target mold; determining whether the material injection configuration information matches the mold configuration information; if the material injection configuration information matches the mold configuration information, then controlling the material injection device to inject material into the target mold, and if the material injection configuration information does not match the mold configuration information, then issuing an alarm prompt. The embodiment of the present invention can reduce the error rate of material injection and improve production efficiency and product quality.
Description
Technical Field
The embodiment of the invention relates to a manufacturing technology, in particular to a material injection control method, a material injection control device, electronic equipment and a storage medium.
Background
In the manufacturing field, mold injection is one of the very important links in the factory production line. However, in the process of injecting materials from the material injecting device to the mould, the material injecting errors such as multiple material injecting, fewer material injecting, material injecting errors and the like easily occur, the production cost and the efficiency are seriously affected, and the step of transferring and upgrading from traditional manufacturing to intelligent manufacturing is dragged slowly by enterprises.
Disclosure of Invention
The embodiment of the invention provides a material injection control method, a device, electronic equipment and a storage medium, which can reduce the material injection error rate and improve the production efficiency and the product quality.
In a first aspect, an embodiment of the present invention provides a method for controlling injection, including:
positioning a target die by adopting an ultra wideband UWB positioning technology to obtain the current position of the target die;
determining whether the current position of the target die belongs to a preset material injection area of material injection equipment;
When the current position of the target die belongs to the preset material injection area, obtaining material injection configuration information of the material injection equipment, and obtaining die configuration information of the target die;
determining whether the injection configuration information is matched with the die configuration information;
If the injection configuration information is matched with the die configuration information, controlling the injection equipment to inject the target die, and if the material injection configuration information is not matched with the die configuration information, sending an alarm prompt.
In a second aspect, an embodiment of the present invention provides a material injection control device, including:
the positioning module is used for positioning the target mould by adopting an ultra wideband UWB positioning technology to obtain the current position of the target mould;
the determining module is used for determining whether the current position of the target die belongs to a preset material injection area of material injection equipment;
The acquisition module is used for acquiring the material injection configuration information of the material injection equipment and acquiring the die configuration information of the target die when the current position of the target die belongs to the preset material injection area;
the matching module is used for determining whether the injection configuration information is matched with the die configuration information;
And the control module is used for controlling the material injecting equipment to inject the material into the target die if the material injecting configuration information is matched with the die configuration information, and sending an alarm prompt if the material injecting configuration information is not matched with the die configuration information.
In a third aspect, an embodiment of the present invention further provides an electronic device, including a memory, a processor, and a computer program stored in the memory and capable of running on the processor, where the processor implements the method for controlling injection according to any one of the embodiments of the present invention when executing the program.
In a fourth aspect, embodiments of the present invention further provide a computer readable storage medium having stored thereon a computer program which, when executed by a processor, implements a shot control method according to any of the embodiments of the present invention.
In the embodiment of the invention, an ultra wideband UWB positioning technology can be adopted to position a target die to obtain the current position of the target die, whether the current position of the target die belongs to a preset material injection area of material injection equipment is determined, when the current position of the target die belongs to the preset material injection area, material injection configuration information of the material injection equipment is obtained, and the die configuration information of the target die is obtained, whether the material injection configuration information is matched with the die configuration information is determined, if the material injection configuration information is matched with the die configuration information, the material injection equipment is controlled to inject materials into the target die, and if the material injection configuration information is not matched with the die configuration information, an alarm prompt is sent. The embodiment of the invention can sense the position of the die in real time by means of UWB high-precision positioning technology, and when the die is sensed to enter the material injection area of the material injection equipment, an information checking mechanism is introduced, and whether the material injection equipment is controlled to inject materials into the die is determined through information matching judgment, so that the material injection error rate is reduced, and the production efficiency and the product quality are improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic flow chart of a method for controlling injection according to an embodiment of the present invention.
Fig. 2 is another flow chart of a method for controlling injection according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a material injection control device according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a material injection control system according to an embodiment of the present invention.
Fig. 5 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
Fig. 1 is a schematic flow chart of a method for controlling injection according to an embodiment of the present invention, where the method may be performed by an apparatus for controlling injection according to an embodiment of the present invention, and the apparatus may be implemented in a software and/or hardware manner. In a specific embodiment, the apparatus may be integrated in an electronic device, and the electronic device may be a server, and the server may be a background server corresponding to an Ultra Wide Band (UWB) positioning system. The following embodiments will be described taking the example of the integration of the apparatus in an electronic device, and referring to fig. 1, the method may specifically include the following steps:
and step 101, positioning a target die by adopting an ultra wideband UWB positioning technology to obtain the current position of the target die.
UWB technology is a wireless carrier communication technology, which does not use a sinusoidal carrier, but uses non-sinusoidal narrow pulses of nanosecond order to transmit data, so that the frequency spectrum occupied by the UWB technology is wide. The UWB technology has the advantages of low system complexity, low power spectrum density of the transmitted signal, insensitivity to channel fading, low interception capability, high positioning accuracy and the like, and is more suitable for high-speed wireless access in indoor and other dense multipath places. In particular, in the embodiment of the invention, UWB technology is applied to indoor production lines to locate relevant equipment on the production lines.
Specifically, the relevant equipment to be positioned on the production line can comprise one or more moulds and material injecting equipment, each mould and material injecting equipment can comprise one or more of a UWB micro-label (namely a mould label) which can be installed on each mould and bound with the corresponding mould (for example, the mould label and the mould can be bound through the identification information of the mould label and the identification information of the mould, the identification information can be a model number, a serial number and the like), the mould label is used for positioning the corresponding mould, one UWB micro-label (namely a device label) is installed on each material injecting equipment and bound with the corresponding material injecting equipment (for example, the device label and the material injecting equipment can be bound through the identification information of the device label and the identification information of the material injecting equipment, the identification information can be a model number and the like), the device label is used for positioning the corresponding material injecting equipment, and the UWB micro-label can be placed or adsorbed on the corresponding equipment. A UWB micro tag is a type of battery-powered positioning device that can be used to transmit UWB signals, and different UWB micro tags may have different identification information.
In addition, a plurality of UWB micro base stations can be deployed around the production line, the specific number of the UWB micro base stations can be determined according to actual needs, the more the number of the base stations is, the higher the accuracy of the positioning result is, but the higher the cost of the positioning hardware is, and the larger the positioning calculation data volume is. The die and the material injection equipment can be positioned by utilizing the UWB micro-tag to transmit UWB signals and utilizing the UWB micro-base station to receive UWB signals, and the positioning technology is UWB positioning technology. In practical application, on the material injection production line, the position of the material injection device is generally fixed, so that the position of the material injection device positioned by the device label is generally fixed, the mold moves along with the conveyor belt, so that the position of the mold positioned by the mold label is generally changed, the material injection device is positioned once, and the mold needs to be positioned continuously in real time. The target mold can be any mold needing to be positioned on the material injection production line, and the UWB positioning technology can be adopted to position the target mold in real time, so that the current position of the target mold is obtained.
Step 102, determining whether the current position of the target mold belongs to a preset material injection area of the material injection device, if so, executing step 103, and if not, returning to execute step 101.
Specifically, an electronic map of the material injection production line can be created in advance, the material injection equipment is positioned by utilizing a UWB positioning technology, so that the specific position of the material injection equipment is obtained, the specific position of the material injection equipment is marked on the electronic map, and an area is selected on the electronic map in a circling mode according to the specific position of the material injection equipment marked on the electronic map, so that the preset material injection area of the material injection equipment is obtained. The specific circle selection method can, for example, take the specific position of the material injection device as the center, and circle and select a circular area, a square area, a rectangular area and the like on the electronic map.
The current position of the target mold may be represented by coordinates, the preset injection region may be represented by a coordinate set, whether the coordinates of the current position of the target mold belong to the coordinate set of the preset injection region may be determined, if so, the current position of the target mold is determined to belong to the preset injection region, and if not, the current position of the target mold is determined not to belong to the preset injection region. And when the current position of the target die does not belong to the preset material injection area, the UWB positioning technology can be continuously adopted to position the target die.
In addition, after the current position of the target mold is obtained, the current position of the target mold can be marked on the electronic map in real time, and whether the target mold enters a preset material injection area of the material injection equipment or not is determined by detecting the electronic map.
And 103, acquiring injection configuration information of the injection equipment, and acquiring die configuration information of a target die.
For example, the injection configuration information may include basic information of a preset mold and basic information of a material to be injected by the preset mold, where the basic information of the mold may include a state (such as in use, idle, discard, fault, etc.), a model number, a name, etc., and the basic information of the material may include a model number, a name, an injection amount, etc. of the material. The preset molds may include one or more, and when the preset molds have a plurality of molds, the injection configuration information may include basic information of each preset mold and basic information of the material to be injected for each preset mold.
For example, the mold configuration information may include basic information of the target mold and basic information of the material that the target mold needs to inject, or the mold configuration information may include only basic information of the target mold. The basic information of the target mold can also comprise the state, the model, the number, the name and the like of the target mold, and the basic information of the material to be injected into the target mold can also comprise the model, the number, the name, the material injection quantity and the like of the material.
In a specific embodiment, for example, the injection configuration information of the injection device may be as shown in the following table 1:
TABLE 1
The material injecting device can inject materials into three preset moulds, wherein the numbers of the three moulds are sequentially 1,2 and 3, the model is sequentially A, B, C, the numbers of materials to be injected into the three moulds are sequentially 11, 22 and 33, and the material injecting quantity of the materials to be injected is sequentially X, Y, Z. Table 1 is merely an example, and does not limit the specific embodiments.
Step 104, determining whether the injection configuration information is matched with the die configuration information, if the injection configuration information is matched with the die configuration information, executing step 105, and if the injection configuration information is not matched with the die configuration information, executing step 106.
Specifically, when the die configuration information only includes the basic information of the target die, it can be judged whether the basic information of the target die exists in the basic information of the preset die included in the injection configuration information, if so, the injection configuration information is determined to be matched with the die configuration information, and if not, the injection configuration information is determined to be not matched with the die configuration information. When the basic information of the target die and the basic information of the material to be injected by the target die are included in the die configuration information, whether the basic information of the preset die included in the injection configuration information is the same as the basic information of the material to be injected by the target die or not (2) can be judged, and when the judging result of the step (1) is the same as the judging result of the step (2), the injection configuration information is determined to be matched with the die configuration information, otherwise, the injection configuration information is determined to be not matched with the die configuration information, and the method can avoid injection errors caused by die use errors and material information writing errors.
For example, as shown in table 1, if the die configuration information of the target die is die number 2 and die type B, it may be determined that the die configuration information of the target die matches the die configuration information of the target die, or if the die configuration information of the target die is die number 2, die type B, material number 22 and material injection amount Y, it may also be determined that the die configuration information of the target die matches the die configuration information of the target die, and if the die configuration information of the target die is die number 2, die type B, material number 33 and material injection amount Z, that is, the die basic information of the two matches, but the material basic information does not match, it is determined that the die configuration information of the target die does not match the die configuration information of the material equipment.
And 105, controlling the material injection equipment to inject the material into the target mould.
Specifically, the injection device can be controlled to inject the target mold according to the injection configuration information. For example, as shown in table 1, the injection configuration information is set to 2 and the mold type of the target mold is set to B, and the injection device can be controlled to inject the material with the number 22 and the injection amount Y into the target mold.
And 106, sending out an alarm prompt.
For example, the material injection device can be controlled to send out alarm signals such as sound and light to alarm and prompt related personnel for abnormal material injection, or alarm information can be generated and sent to the terminal to prompt related personnel for abnormal material injection through the terminal, the terminal can be a mobile phone, a computer and the like, and related personnel can be operators and/or management personnel of the production line.
In the embodiment of the invention, an ultra wideband UWB positioning technology can be adopted to position a target die to obtain the current position of the target die, whether the current position of the target die belongs to a preset material injection area of material injection equipment is determined, when the current position of the target die belongs to the preset material injection area, material injection configuration information of the material injection equipment is obtained, and the die configuration information of the target die is obtained, whether the material injection configuration information is matched with the die configuration information is determined, if the material injection configuration information is matched with the die configuration information, the material injection equipment is controlled to inject materials into the target die, and if the material injection configuration information is not matched with the die configuration information, an alarm prompt is sent. The embodiment of the invention can sense the position of the die in real time by means of UWB high-precision positioning technology, and when the die is sensed to enter the material injection area of the material injection equipment, an information checking mechanism is introduced, and whether the material injection equipment is controlled to inject materials into the die is determined through information matching judgment, so that the material injection error rate is reduced, and the production efficiency and the product quality are improved.
The following further describes a method for controlling injection according to an embodiment of the present invention, as shown in fig. 2, where the method for controlling injection according to the present embodiment may include the following steps:
step 201, acquiring injection configuration information of an injection device and mold configuration information of a target mold from a production management server.
Illustratively, the production management server may be a background server corresponding to a manufacturing execution system (Manufacturing Execution System, MES), which is a set of production informatization management systems facing the workshop execution layer of a manufacturing enterprise, and may provide manufacturing data management, planning scheduling management, production scheduling management, inventory management, and the like for the enterprise. In the embodiment of the invention, the material injection configuration information of the material injection equipment and the die configuration information of the target die can be obtained from the production management server.
Specifically, the injection configuration information may include basic information of a preset mold and basic information of a material to be injected into the preset mold, where the basic information of the mold may include a state (such as in use, idle, waste, failure, etc.), a model number, a name, etc., and the basic information of the material may include a model number, a name, a material injection amount, etc. of the material. The preset molds may include one or more, and when the preset molds have a plurality of molds, the injection configuration information may include basic information of each preset mold and basic information of the material to be injected for each preset mold.
Specifically, the mold configuration information may include basic information of the target mold and basic information of the material to be injected by the target mold, or the mold configuration information may include only basic information of the target mold. The basic information of the target mold can also comprise the state, the model, the number, the name and the like of the target mold, and the basic information of the material to be injected into the target mold can also comprise the model, the number, the name, the material injection quantity and the like of the material.
Step 202, writing the injection configuration information into the equipment label, and writing the mold configuration information into the mold label.
Specifically, a plurality of UWB micro base stations can be deployed around a production line, a UWB micro-tag (namely, an equipment tag) is installed on each material injection device, the equipment tag installed on each material injection device is bound with the corresponding material injection device, the equipment tag is used for positioning the corresponding material injection device, a UWB micro-tag (namely, a die tag) is installed on each die, the die tag installed on each die is bound with the corresponding die, and the die tag is used for positioning the corresponding die. After the injection configuration information of the injection device is acquired, the injection configuration information can be written into the device label installed on the corresponding injection device, and after the die configuration information of the die is acquired, the die configuration information can be written into the die label installed on the corresponding die.
Step 203, obtaining device positioning data obtained by positioning the material injecting device by each base station, wherein the material injecting device is provided with a device tag, and the device positioning data is obtained by measuring UWB signals transmitted by the device tag by each base station.
After positioning is started, the equipment tag installed on the material injecting equipment emits UWB signals, each base station receives the UWB signals emitted by the equipment tag, each base station measures the transmission time from the equipment tag to the corresponding base station, the distance between the equipment tag and the corresponding base station is calculated according to the transmission time and the signal transmission speed, the distance between the equipment tag and the base station calculated by each base station is equipment positioning data, each base station can report the equipment positioning data calculated by the base station to the electronic equipment, or a main base station can be determined from the base stations, the equipment positioning data calculated by each base station is reported to the electronic equipment by the main base station, and the electronic equipment acquires the equipment positioning data of each base station. For example, the plurality of base stations include a base station 1, a base station 2 and a base station 3, and the three base stations can directly transmit the device positioning data obtained by calculation to the electronic device, when the main base station is designated from the three base stations, the main base station can transmit the device positioning data of the three base stations to the electronic device, for example, the main base station is designated as a base station 1, and the base station 2 and the base station 3 can transmit the respective device positioning data to the base station 1, and the base station 1 transmits the device positioning data of the three base stations to the electronic device.
And 204, calculating the current position of the material injection device according to the device positioning data and the preset position information of each base station.
For example, the preset position information Of each base station is fixed known data, and the device positioning data and the preset position information Of each base station may be calculated by using a time-Of-Arrival (TOA) positioning method, a Time Difference Of Arrival (TDOA) positioning method, or the like, so as to obtain the current position Of the injection device. On the material injection production line, the position of the material injection equipment is generally fixed, so that the position of the material injection equipment positioned by the equipment label is generally fixed, and the material injection equipment is positioned once.
Step 205, setting a preset material injection area according to the current position of the material injection device.
Specifically, an electronic map of the material injection production line can be created in advance, the material injection equipment is positioned by utilizing a UWB positioning technology, so that the specific position of the material injection equipment is obtained, the specific position of the material injection equipment is marked on the electronic map, and an area is selected on the electronic map in a circling mode according to the specific position of the material injection equipment marked on the electronic map, so that the preset material injection area of the material injection equipment is obtained.
And 206, acquiring die positioning data obtained by positioning the target die by each base station, wherein the die label is mounted on the target die, and the die positioning data is obtained by measuring UWB signals emitted by the die label by each base station.
The target die can be any die which needs to be positioned. Similarly, after the positioning is started, the die label installed on the target die emits a UWB signal, each base station receives the UWB signal emitted by the die label, each base station measures the transmission time of the UWB signal from the die label to the corresponding base station, the distance between the die label and the corresponding base station is calculated according to the transmission time and the signal transmission speed, the distance between the die label and the base station calculated by each base station is the die positioning data, each base station can report the die positioning data calculated by the base station to the electronic equipment, or a main base station can be determined from the base stations, the die positioning data calculated by each base station is reported to the electronic equipment by the main base station, and the electronic equipment acquires the die positioning data of each base station.
Step 207, calculating the current position of the target mold according to the mold positioning data and the preset position information of each base station.
The method for calculating the current position of the target mold may be the same as the method for calculating the current position of the injection device, and will not be described here. In the injection line, the mold is moved along with the conveyor belt, so that the position of the mold positioned by the mold label is generally changed, and thus the mold needs to be positioned continuously in real time.
In addition, after the current position of the target mold is obtained, the current position of the target mold can be marked on the electronic map in real time, so that the target mold can be conveniently monitored, and whether the target mold enters a preset material injection area of the material injection equipment or not can be determined through detecting the electronic map.
Step 208, determining whether the current position of the target mold belongs to the preset material injection area of the material injection device, if so, executing step 209, and if not, returning to 206 to continue positioning.
Namely, determining whether the target mould enters a preset material injection area of the material injection equipment, judging through the attribution relation of coordinates, the determination may also be performed by detecting an electronic map, which is not particularly limited herein.
Step 209, determining whether the number of molds in the preset shot region is 1, if so, executing step 210, and if not, executing step 213.
Generally, in order to ensure production safety and avoid material injection errors, only one mold can be arranged in a preset material injection area of one material injection device, so that after a target mold enters the preset material injection area of the material injection device, whether the number of the molds in the preset material injection area is 1 can be determined through positioning, and if the number of the molds in the preset material injection area is not 1, it is indicated that other molds stay in the preset material injection area at the moment, and an alarm prompt can be sent.
In step 210, the material injection configuration information of the material injection device is obtained from the device tag through the plurality of base stations, and the mold configuration information of the target mold is obtained from the mold tag through the plurality of base stations.
In a specific implementation, the injection configuration information and the equipment positioning data can be acquired simultaneously or separately. The device tag can transmit UWB signals and simultaneously transmit the injection configuration information stored in the device tag, so that the electronic device can acquire the injection configuration information together when acquiring the device positioning data from the base station, or the device tag can only transmit UWB signals, and the device tag can transmit the injection configuration information stored in the device tag when needed later, so that the electronic device can acquire the device positioning data through the base station and acquire the injection configuration information through the base station.
Specifically, the mold configuration information and the mold positioning data may be acquired simultaneously or separately. Namely, when the die label can transmit the UWB signal, the die configuration information stored in the die label can be transmitted at the same time, and when the electronic equipment acquires the die positioning data from the base station, the die configuration information can be acquired together; or the die label can only transmit UWB signals, and when the die label is needed later, the die label transmits the die configuration information stored in the die label, so that the electronic equipment can acquire the die positioning data through the base station first, and then acquire the die configuration information through the base station.
Step 211, determining whether the injection configuration information and the mold configuration information are matched, if so, executing step 212, and if not, executing step 213.
Specifically, when the mold configuration information only includes the basic information of the target mold, it may be determined whether the basic information of the target mold exists in the basic information of the preset mold included in the shot configuration information, if so, it is determined that the shot configuration information is matched with the mold configuration information, and if not, it is determined that the shot configuration information is not matched with the mold configuration information. When the basic information of the preset mould included in the injection configuration information is provided with the basic information of the target mould, and the basic information of the material required to be injected by the preset mould included in the injection configuration information is the same as the basic information of the material required to be injected by the target mould, the injection configuration information is determined to be matched with the mould configuration information when the basic information of the target mould is included in the basic information of the preset mould included in the injection configuration information, and the basic information of the material required to be injected by the preset mould included in the injection configuration information is the same as the basic information of the material required to be injected by the target mould, otherwise, the injection configuration information is determined to be not matched with the mould configuration information.
And 212, controlling the material injecting equipment to inject the material into the target mould.
Specifically, the injection device can be controlled to inject the target mold according to the injection configuration information. In addition, before the material injection equipment is controlled to inject the material into the target mould, whether the material on the material injection equipment is sufficient or not can be judged (for example, whether the amount of the residual material on the material injection equipment exceeds a preset amount or not is sufficient if the amount exceeds the preset amount) can be judged, if the amount of the residual material on the material injection equipment is sufficient, the material injection equipment is controlled to inject the material into the target mould, and if the amount of the residual material on the material injection equipment is insufficient, an alarm prompt is sent to prompt related personnel to supplement the material to the material injection equipment.
And step 213, sending out an alarm prompt.
For example, the material injection device can be controlled to send out alarm signals such as sound and light to alarm and prompt related personnel for abnormal material injection, or alarm information can be generated and sent to the terminal to prompt related personnel for abnormal material injection through the terminal, the terminal can be a mobile phone, a computer and the like, and related personnel can be operators and/or management personnel of the production line.
In some embodiments, when determining that the current position of the target mold belongs to the preset injection region, the method may further include the following steps:
acquiring the residence time of a target die in a preset material injection area;
And when the residence time exceeds a preset time threshold, an alarm prompt is sent out.
The time from entering the preset material injection area to leaving the preset material injection area of the target mold can be monitored, if the time is larger than the preset time threshold, the abnormal material injection is possibly caused, an alarm prompt can be sent, and the preset time threshold can be set according to the conveying speed of the conveying belt.
Specifically, the method may further include monitoring in sections, that is, the residence time may include a first residence time and a second residence time, where the first residence time may be a time from entering a preset injection area to reaching a injection point of the target mold, and the second residence time may be a time from leaving the injection point to leaving the preset injection area of the target mold, determining whether the first residence time exceeds a first preset time threshold, if yes, sending an alarm prompt, if not, continuing to wait, determining whether the second residence time exceeds a second preset time threshold, if yes, sending an alarm prompt, if not, continuing to wait, and the first preset time threshold and the second preset time threshold may be the same or different, where no specific limitation is made.
Further, after the target mold leaves the preset material injection area, production process record information, alarm prompt record information and the like can be generated, and the generated information is stored in a database for inspection.
In the embodiment of the invention, an ultra wideband UWB positioning technology can be adopted to position a target die to obtain the current position of the target die, whether the current position of the target die belongs to a preset material injection area of material injection equipment is determined, when the current position of the target die belongs to the preset material injection area, material injection configuration information of the material injection equipment is obtained, and the die configuration information of the target die is obtained, whether the material injection configuration information is matched with the die configuration information is determined, if the material injection configuration information is matched with the die configuration information, the material injection equipment is controlled to inject materials into the target die, and if the material injection configuration information is not matched with the die configuration information, an alarm prompt is sent. The embodiment of the invention can sense the position of the die in real time by means of UWB high-precision positioning technology, and when the die is sensed to enter the material injection area of the material injection equipment, an information checking mechanism is introduced, and whether the material injection equipment is controlled to inject the material into the die is determined through information matching judgment, so that material injection errors caused by using errors of the die, writing errors of material information and the like are avoided, the material injection error rate is reduced, and the production efficiency and the product quality are improved.
Furthermore, UWB positioning and MES are combined, intelligent production management and visual management and control of the die are realized, and labor and time cost are saved.
In addition, for positioning precision and accuracy, the method provided by the embodiment of the invention mainly introduces the positioning of the die and the material injection device by using the UWB positioning technology, and in practical application, if the requirements on the positioning precision and accuracy are not high, other positioning technologies can be adopted to replace the positioning technologies, such as Wi-Fi, bluetooth and other technologies, and the method is not particularly limited.
Fig. 3 is a block diagram of a material injection control device according to an embodiment of the present invention, where the device is adapted to execute the material injection control method according to the embodiment of the present invention. As shown in fig. 3, the apparatus may specifically include:
the positioning module 301 is configured to position a target mold by using an ultra wideband UWB positioning technology, so as to obtain a current position of the target mold;
A determining module 302, configured to determine whether a current position of the target mold belongs to a preset injection area of an injection device;
an obtaining module 303, configured to obtain injection configuration information of the injection device and obtain mold configuration information of the target mold when the current position of the target mold belongs to the preset injection region;
a matching module 304, configured to determine whether the injection configuration information matches the mold configuration information;
And the control module 305 is configured to control the injection device to inject the target mold if the injection configuration information is matched with the mold configuration information, and send an alarm prompt if the injection configuration information is not matched with the mold configuration information.
In one embodiment, the positioning module 301 is specifically configured to:
The method comprises the steps that mould positioning data obtained by positioning a target mould by each base station in a plurality of base stations are obtained, a mould label is mounted on the target mould, the mould positioning data are obtained by measuring UWB signals emitted by the mould label by each base station, and the plurality of base stations are deployed around a material injection production line;
and calculating the current position of the target die according to the die positioning data and the preset position information of each base station.
In an embodiment, the positioning module 301 is further configured to position the material injecting device by using the UWB positioning technology, to obtain a current position of the material injecting device;
The apparatus further comprises:
And the setting module is used for setting the preset material injection area according to the current position of the material injection equipment.
In an embodiment, the positioning module 301 locates the material injecting device by using the UWB positioning technology to obtain a current position of the material injecting device, including:
Acquiring equipment positioning data obtained by positioning the material injection equipment by each base station, wherein equipment labels are arranged on the material injection equipment, and the equipment positioning data are obtained by measuring UWB signals transmitted by the equipment labels by each base station;
And calculating the current position of the material injection equipment according to the equipment positioning data and the preset position information of each base station.
In one embodiment, the apparatus further comprises:
the writing module is used for acquiring the injection configuration information and the die configuration information from a production management server, writing the injection configuration information into the equipment tag, and writing the die configuration information into the die tag;
the obtaining module 303 is specifically configured to:
and acquiring the material injection configuration information of the material injection equipment from the equipment tag through the plurality of base stations, and acquiring the die configuration information of the target die from the die tag through the plurality of base stations.
In an embodiment, the determining module 302 is further configured to determine the number of dies in the preset injection area, trigger the obtaining module 303 to perform the step of obtaining the injection configuration information of the injection device and obtain the die configuration information of the target die if the number of dies is 1, and trigger the control module 305 to send the alarm prompt if the number of dies is not 1.
In an embodiment, the obtaining module 303 is further configured to obtain a residence time of the target mold in the preset injection area, and trigger the control module 305 to send the alarm prompt when the residence time exceeds a preset time threshold.
In an embodiment, the injection configuration information includes basic information of a preset mold and basic information of a material to be injected by the preset mold, the mold configuration information includes basic information of the target mold and basic information of a material to be injected by the target mold, and the matching module 304 is specifically configured to:
Determining whether the basic information of the target die is matched with the basic information of the preset die, and determining whether the basic information of the material to be injected of the target die is matched with the basic information of the material to be injected of the preset die;
And if the basic information of the target die is matched with the basic information of the preset die, and the basic information of the material to be injected by the target die is matched with the basic information of the material to be injected by the preset die, determining that the material injection configuration information is matched with the die configuration information.
It will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-described division of the functional modules is illustrated, and in practical application, the above-described functional allocation may be performed by different functional modules according to needs, i.e. the internal structure of the apparatus is divided into different functional modules to perform all or part of the functions described above. The specific working process of the functional module described above may refer to the corresponding process in the foregoing method embodiment, and will not be described herein.
The device of the embodiment of the invention can adopt an ultra wideband UWB positioning technology to position the target die to obtain the current position of the target die, determine whether the current position of the target die belongs to a preset material injection area of the material injection equipment, acquire material injection configuration information of the material injection equipment when the current position of the target die belongs to the preset material injection area, acquire the die configuration information of the target die, determine whether the material injection configuration information is matched with the die configuration information, control the material injection equipment to inject materials into the target die if the material injection configuration information is matched with the die configuration information, and send an alarm prompt if the material injection configuration information is not matched with the die configuration information. The embodiment of the invention can sense the position of the die in real time by means of UWB high-precision positioning technology, and when the die is sensed to enter the material injection area of the material injection equipment, an information checking mechanism is introduced, and whether the material injection equipment is controlled to inject materials into the die is determined through information matching judgment, so that the material injection error rate is reduced, and the production efficiency and the product quality are improved.
The embodiment of the invention also provides electronic equipment, which comprises a memory, a processor and a computer program stored in the memory and capable of running on the processor, wherein the processor realizes the injection control method provided by any embodiment when executing the program.
The embodiment of the invention also provides a computer readable medium, on which a computer program is stored, which when executed by a processor, implements the method for controlling injection provided by any of the above embodiments.
The embodiment of the present invention further provides a material injection control system, as shown in fig. 4, including a material injection device 401, a target mold 402, a base station 403, a production management server 404, and an electronic device 405, where a device tag 4011 is installed on the material injection device 401, a mold tag 4022 is installed on the target mold 402, and there may be multiple base stations 403, and the electronic device 405 is used to execute the material injection control method provided by the embodiment of the present invention, and a specific process may refer to the description of the foregoing embodiment and will not be repeated herein.
Referring now to FIG. 5, there is illustrated a schematic diagram of a computer system 500 suitable for use in implementing an electronic device of an embodiment of the present invention. The electronic device shown in fig. 5 is only an example and should not be construed as limiting the functionality and scope of use of the embodiments of the present invention.
As shown in fig. 5, the computer system 500 includes a Central Processing Unit (CPU) 501, which can perform various appropriate actions and processes according to a program stored in a Read Only Memory (ROM) 502 or a program loaded from a storage section 508 into a Random Access Memory (RAM) 503. In the RAM 503, various programs and data required for the operation of the system 500 are also stored. The CPU 501, ROM 502, and RAM 503 are connected to each other through a bus 504. An input/output (I/O) interface 505 is also connected to bus 504.
Connected to the I/O interface 505 are an input section 506 including a keyboard, a mouse, and the like, an output section 507 including a Cathode Ray Tube (CRT), a Liquid Crystal Display (LCD), and the like, a speaker, and the like, a storage section 508 including a hard disk, and the like, and a communication section 509 including a network interface card such as a LAN card, a modem, and the like. The communication section 509 performs communication processing via a network such as the internet. The drive 510 is also connected to the I/O interface 505 as needed. A removable medium 511 such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, or the like is mounted on the drive 510 as needed so that a computer program read therefrom is mounted into the storage section 508 as needed.
In particular, according to embodiments of the present disclosure, the processes described above with reference to flowcharts may be implemented as computer software programs. For example, embodiments of the present disclosure include a computer program product comprising a computer program embodied on a computer readable medium, the computer program comprising program code for performing the method shown in the flow chart. In such an embodiment, the computer program may be downloaded and installed from a network via the communication portion 509, and/or installed from the removable media 511. The above-described functions defined in the system of the present invention are performed when the computer program is executed by a Central Processing Unit (CPU) 501.
The computer readable medium shown in the present invention may be a computer readable signal medium or a computer readable storage medium, or any combination of the two. The computer readable storage medium can be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or a combination of any of the foregoing. More specific examples of a computer-readable storage medium may include, but are not limited to, an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the context of this document, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device. In the present invention, however, the computer-readable signal medium may include a data signal propagated in baseband or as part of a carrier wave, with the computer-readable program code embodied therein. Such a propagated data signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination of the foregoing. A computer readable signal medium may also be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.
The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present invention. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams or flowchart illustration, and combinations of blocks in the block diagrams or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
The modules and/or units involved in the embodiments of the present invention may be implemented in software, or may be implemented in hardware. The described modules and/or units may also be provided in a processor, which may be described as, for example, a processor comprising a positioning module, a determining module, an obtaining module, a matching module and a control module. The names of these modules do not constitute a limitation on the module itself in some cases.
As a further aspect, the invention also provides a computer readable medium which may be comprised in the device described in the above embodiments or may be present alone without being fitted into the device. The computer readable medium carries one or more programs, when the one or more programs are executed by the equipment, the equipment comprises positioning a target die by adopting an ultra wideband UWB positioning technology to obtain the current position of the target die, determining whether the current position of the target die belongs to a preset material injection area of material injection equipment, acquiring material injection configuration information of the material injection equipment when the current position of the target die belongs to the preset material injection area, acquiring die configuration information of the target die, determining whether the material injection configuration information is matched with the die configuration information, controlling the material injection equipment to inject materials into the target die if the material injection configuration information is matched with the die configuration information, and sending an alarm prompt if the material injection configuration information is not matched with the die configuration information.
According to the technical scheme, the method and the device for detecting the injection of the target die can adopt an ultra wideband UWB positioning technology to position the target die to obtain the current position of the target die, determine whether the current position of the target die belongs to a preset injection area of injection equipment, acquire injection configuration information of the injection equipment when the current position of the target die belongs to the preset injection area, acquire die configuration information of the target die, determine whether the injection configuration information is matched with the die configuration information, control the injection equipment to inject the target die if the injection configuration information is matched with the die configuration information, and send an alarm prompt if the injection configuration information is not matched with the die configuration information. The embodiment of the invention can sense the position of the die in real time by means of UWB high-precision positioning technology, and when the die is sensed to enter the material injection area of the material injection equipment, an information checking mechanism is introduced, and whether the material injection equipment is controlled to inject materials into the die is determined through information matching judgment, so that the material injection error rate is reduced, and the production efficiency and the product quality are improved.
The above embodiments do not limit the scope of the present invention. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives can occur depending upon design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of the present invention.
Claims (7)
1. A method of controlling injection, comprising:
positioning a target die by adopting an ultra wideband UWB positioning technology to obtain the current position of the target die;
determining whether the current position of the target die belongs to a preset material injection area of material injection equipment;
When the current position of the target die belongs to the preset material injection area, obtaining material injection configuration information of the material injection equipment, and obtaining die configuration information of the target die;
determining whether the injection configuration information is matched with the die configuration information;
If the injection configuration information is matched with the die configuration information, controlling the injection equipment to inject the target die, and if the injection configuration information is not matched with the die configuration information, sending an alarm prompt;
Before determining whether the current position of the target die belongs to a preset material injection area of material injection equipment, acquiring equipment positioning data obtained by positioning the material injection equipment by each base station, wherein equipment labels are installed on the material injection equipment, and the equipment positioning data are obtained by measuring UWB signals transmitted by the equipment labels by each base station;
Before the ultra wideband UWB positioning technology is adopted to position the target mould to obtain the current position of the target mould, the method further comprises the steps of obtaining the injection configuration information and the mould configuration information from a production management server, writing the injection configuration information into the equipment label, and writing the mould configuration information into the mould label;
The method for acquiring the injection configuration information of the injection device and the die configuration information of the target die comprises the steps of acquiring the injection configuration information of the injection device from the device tag through a plurality of base stations and acquiring the die configuration information of the target die from the die tag through the plurality of base stations;
When the current position of the target die belongs to the preset material injection area, the method further comprises the steps of determining the number of dies in the preset material injection area, triggering and executing the steps of acquiring material injection configuration information of the material injection equipment and acquiring the die configuration information of the target die if the number of dies is 1, and sending out the alarm prompt if the number of dies is not 1.
2. The method of claim 1, wherein the positioning the target mold using the ultra wideband UWB positioning technique to obtain the current position of the target mold comprises:
The method comprises the steps that mould positioning data obtained by positioning a target mould by each base station in a plurality of base stations are obtained, a mould label is mounted on the target mould, the mould positioning data are obtained by measuring UWB signals emitted by the mould label by each base station, and the plurality of base stations are deployed around a material injection production line;
and calculating the current position of the target die according to the die positioning data and the preset position information of each base station.
3. The shot control method according to any one of claims 1 to 2, characterized by further comprising, when the current position of the target mold belongs to the preset shot region:
acquiring the residence time of the target die in the preset material injection area;
and when the residence time exceeds a preset time threshold, sending out the alarm prompt.
4. The shot control method according to any one of claims 1 to 2, wherein the shot configuration information includes basic information of a preset mold and basic information of a material to be injected by the preset mold, the mold configuration information includes basic information of the target mold and basic information of a material to be injected by the target mold, and the determining whether the shot configuration information matches the mold configuration information includes:
Determining whether the basic information of the target die is matched with the basic information of the preset die, and determining whether the basic information of the material to be injected of the target die is matched with the basic information of the material to be injected of the preset die;
And if the basic information of the target die is matched with the basic information of the preset die, and the basic information of the material to be injected by the target die is matched with the basic information of the material to be injected by the preset die, determining that the material injection configuration information is matched with the die configuration information.
5. A shot control device, comprising:
the positioning module is used for positioning the target mould by adopting an ultra wideband UWB positioning technology to obtain the current position of the target mould;
the determining module is used for determining whether the current position of the target die belongs to a preset material injection area of material injection equipment;
The acquisition module is used for acquiring the material injection configuration information of the material injection equipment and acquiring the die configuration information of the target die when the current position of the target die belongs to the preset material injection area;
the matching module is used for determining whether the injection configuration information is matched with the die configuration information;
The control module is used for controlling the material injecting equipment to inject the material into the target die if the material injecting configuration information is matched with the die configuration information, and sending an alarm prompt if the material injecting configuration information is not matched with the die configuration information;
The positioning module is also used for acquiring equipment positioning data obtained by positioning the material injection equipment by each base station, wherein equipment labels are arranged on the material injection equipment, and the equipment positioning data is obtained by measuring UWB signals transmitted by the equipment labels by each base station;
the setting module is used for setting the preset material injection area according to the current position of the material injection equipment;
the writing module is used for acquiring the injection configuration information and the die configuration information from a production management server, writing the injection configuration information into the equipment tag, and writing the die configuration information into the die tag;
the acquisition module is specifically configured to acquire injection configuration information of the injection device from the device tag through a plurality of base stations, and acquire die configuration information of the target die from the die tag through the plurality of base stations;
The determining module is further configured to determine the number of dies in the preset material injection area, if the number of dies is 1, trigger the obtaining module to execute the steps of obtaining the material injection configuration information of the material injection device and obtaining the die configuration information of the target die, and if the number of dies is not 1, trigger the control module to send out the alarm prompt.
6. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor implements the shot control method according to any one of claims 1 to 4 when executing the program.
7. A computer-readable storage medium, on which a computer program is stored, characterized in that the program, when executed by a processor, implements the shot control method according to any one of claims 1 to 4.
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| CN110012263A (en) * | 2018-07-17 | 2019-07-12 | 深圳市天工测控技术有限公司 | Indoor positioning monitoring method and device based on UWB |
| CN111126520B (en) * | 2019-11-28 | 2023-08-08 | 清研讯科（北京）科技有限公司 | Positioning method and device, storage medium and electronic device |
| CN110773730A (en) * | 2019-11-29 | 2020-02-11 | 宣城市安工大工业技术研究院有限公司 | Automatic pouring manipulator and pouring method |
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| CN102753327A (en) * | 2009-11-02 | 2012-10-24 | 马斯特模具（2007）有限公司 | A database for injection mold and integration with an injection molding machine and auxiliary components |
| CN103068551A (en) * | 2010-11-23 | 2013-04-24 | 圣万提注塑工业有限公司 | Injection molding flow control apparatus and method |
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