CN114033780A - Full-automatic ceramic chip pasting machine and chip pasting method - Google Patents
Full-automatic ceramic chip pasting machine and chip pasting method Download PDFInfo
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- CN114033780A CN114033780A CN202111371116.2A CN202111371116A CN114033780A CN 114033780 A CN114033780 A CN 114033780A CN 202111371116 A CN202111371116 A CN 202111371116A CN 114033780 A CN114033780 A CN 114033780A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
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Abstract
The application provides a full-automatic ceramic chip mounter and a chip mounting method, which comprise the following steps: the device comprises a mobile platform, a processing platform and a control system, wherein at least two processing stations are arranged on the mobile platform; the conveying mechanism is used for respectively conveying the ceramic chips to at least two processing stations in a single-row arrangement manner; each processing station comprises: the rotary transplanting assembly, the sucker mechanism and the rotary carrier roller assembly; the rotary carrier roller assembly adsorbs the gummed paper, and when the sucker device descends to a set height, the multiple groups of single-row ceramic chip groups are sequentially arranged and adhered on the gummed paper; the ceramic tile adhesive paper is characterized by further comprising a pressure maintaining mechanism, wherein the pressure maintaining mechanism is used for abutting against the single-row ceramic tile groups arranged in multiple groups to be fixed and adhered to the adhesive paper. It can be seen from the above description that, after the rotary transplanting assembly conveys the single ceramic chips in groups, the sucking disc mechanism conveys the single ceramic chip group to the position right above the rotary carrier roller assembly to press down the chip, the rotary carrier roller assembly rotates or advances correspondingly, and after the arc-shaped surface is closely attached, the pressure maintaining mechanism is adopted to ensure that the ceramic chips are firmly bonded, the full-automatic operation is realized, the manual intervention is reduced, and the chip mounting effect is better.
Description
Technical Field
The application relates to the technical field of full-automatic tile pasting, in particular to a full-automatic tile pasting machine and a tile pasting method.
Background
With the continuous development of society, the powder is formed into ceramic chips with required shapes. The purpose of the forming is to produce a compact of a certain shape and size and to give it a certain density and strength. The molding method is basically divided into press molding and pressureless molding. Press molding is most widely used in press molding.
However, when the formed ceramic chips are arranged and bonded on the adhesive paper of the arc-shaped carrier roller, the adhesive paper is cut to a proper size, and the adhesive paper is bonded after the single chips are manually taken, so that the working efficiency is low, the automation degree is low, the labor loss is high, the bonding arrangement is uneven, and the bonding is not firm.
Disclosure of Invention
The application provides a full-automatic paster machine for the full-automatic paster that carries on guarantees higher paster efficiency, and the bonding effect is firm.
In a first aspect, a full-automatic tile pasting machine is provided, which comprises: the device comprises a mobile platform, a processing platform and a control system, wherein at least two processing stations are arranged on the mobile platform;
the conveying mechanism is used for respectively conveying the ceramic chips to the at least two processing stations in a single-row arrangement mode in a vibration separation mode; wherein,
each processing station comprises: the rotary transplanting assembly is used for conveying a plurality of ceramic chips to a set position in a single-row ceramic chip group mode, the sucking disc mechanism slides to the set position and is used for adsorbing the single-row ceramic chip group, and the rotary carrier roller assembly is assembled on the moving platform in a sliding mode and is in rotary progressive fit with the sucking disc mechanism;
the sliding direction of the sucker mechanism is mutually vertical to that of the rotary carrier roller assembly, the rotary carrier roller assembly adsorbs gummed paper, and when the sucker device descends to a set height, the single-row ceramic chip sets are sequentially arranged and bonded on the gummed paper;
each processing station further comprises a pressure maintaining mechanism, and the pressure maintaining mechanism is used for abutting against the single-row ceramic chip groups arranged in multiple groups to be fixedly adhered to the adhesive paper. It can be seen from the above description that, after the rotary transplanting assembly conveys the single ceramic chips in groups, the sucking disc mechanism conveys the single ceramic chip group to the position right above the rotary carrier roller assembly to press down the chip, the rotary carrier roller assembly rotates or advances correspondingly, and after the arc-shaped surface is closely attached, the pressure maintaining mechanism is adopted to ensure that the ceramic chips are firmly bonded, the full-automatic operation is realized, the manual intervention is reduced, and the chip mounting effect is better.
In a specific implementation scheme, four corners of the bottom of the mobile platform are provided with universal wheels, and each universal wheel is provided with a brake. The mobile platform can move to a designated position.
In a specific embodiment, a gantry is arranged on the moving platform, and two guide rails are arranged on the gantry in parallel; the sucking disc mechanism is assembled on one guide rail in a sliding mode, and the pressure maintaining mechanism is fixedly assembled on the other guide rail. The pressure maintaining mechanism is positioned in front of the sucker mechanism. The sucking disc mechanism is used for sliding and transmitting the single-row ceramic chip group, and the pressure maintaining mechanism is used for firmly bonding the ceramic chips.
In a specific embodiment, the delivery mechanism comprises: the vibration disc is connected with at least two channels;
and the at least two channels are arranged in a single row and used for conveying the ceramic chips and are correspondingly connected with the at least two processing stations one by one. And simultaneously transmitting the ceramic chips to at least two processing stations.
In one specific embodiment, each single row of tiles comprises at least four tiles. When the ceramic chip adhesive tape is matched with the top of the rotary carrier roller component, the number of the ceramic chips adhered at one time is increased.
In a specific embodiment, the suction cup mechanism is provided with the same number of suction cups as the number of the tiles in the single row of tile group. The sucking disc mechanism absorbs a plurality of ceramic chips in the single-row ceramic chip group at a time.
In a specific embodiment, the rotating idler assembly adsorbs the gummed paper by negative pressure gas. The adhesive paper is fixed in position during the paster operation.
In a specific possible embodiment, each group of the single-row ceramic sheet groups is bonded with the gummed paper along the highest point of the rotary carrier roller assembly. The rotary carrier roller assembly correspondingly rotates or advances according to the position of the patch.
In a second aspect, a method of patching includes the steps of:
firstly, conveying the ceramic chips to corresponding processing stations in a single-row conveying mode after vibration separation;
step two, the rotary transplanting assembly classifies the plurality of ceramic chips into a single-row ceramic chip group and conveys the ceramic chips to a set position;
thirdly, after the sucker mechanism slides to a set position to suck a plurality of ceramic chips in a single-row ceramic chip group, the sucker device is positioned right above the rotary carrier roller assembly;
fourthly, adhesive paper cut into standard sizes is adsorbed on the rotary carrier roller assembly;
step five, after the sucker device descends until a plurality of ceramic chips on the single-row ceramic chip group are bonded with the gummed paper, the sucker device ascends to return to continuously adsorb another single-row ceramic chip group;
step six, the rotary carrier roller assembly rotates for a set angle, and the other single-row ceramic chip group and the bonded single-row ceramic chip group are bonded on the adhesive paper side by side;
step seven, after the adhesive tape is fully adhered to the ceramic chips in a row, the rotary carrier roller assembly slides for a set distance, and the step five and the step six are repeated until the adhesive tape is fully adhered to the ceramic chips in a row;
step eight, the rotary carrier roller assembly drives the gummed paper fully adhered with the ceramic chip to slide to the position right below the pressure maintaining mechanism, and the pressure maintaining mechanism presses downwards to enable the ceramic chip and the gummed paper to be tightly adhered;
and step nine, the rotary carrier roller assembly retreats to the unloading station.
By the method, automatic material conveying, grouping transmission, surface mounting and pressure maintaining operations are realized, manual intervention is reduced, production efficiency is improved, and the surface mounting effect is ensured.
Drawings
Fig. 1 is a perspective view of a full-automatic ceramic wafer attaching machine provided in an embodiment of the present application;
FIG. 2 is an enlarged schematic view at A in FIG. 1;
fig. 3 is a plan view of a fully automatic ceramic wafer attaching machine provided in an embodiment of the present application;
FIG. 4 is an enlarged schematic view at B of FIG. 3;
FIG. 5 is a schematic structural diagram of a rotary transplanting assembly provided in an embodiment of the present application;
fig. 6 is a schematic structural diagram of a rotary idler assembly provided in an embodiment of the present application.
Reference numerals:
a mobile platform-100 and a universal wheel-110;
a gantry-200;
a shaking plate-300;
channel-400;
a guide rail-500;
the automatic transplanting machine comprises a rotary transplanting assembly-610, a machine base-611, a first linear guide rail-612, a moving base-613, a first lead screw-614, a first stepping motor-615, a feeding die-616, a receiving groove-617, a rotating mechanism-618, a feeding mechanism-619, a driving wheel-6191, a driven wheel-6192, a synchronous belt-6193, a suction cup device-6194 and a rotating arm-6195;
a suction cup mechanism-620;
a rotary carrier roller assembly-630, a second linear guide rail-631, a motor assembly box-632, a carrier roller-633, gummed paper-634, a vacuum movable joint-635, a second lead screw-636, a bearing assembly-637 and a second stepping motor-638;
pressure maintaining mechanism-640.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clear, the present application will be further described in detail with reference to the accompanying drawings.
In order to facilitate understanding of the fully automatic tile pasting machine provided in the embodiments of the present application, an application scenario of the fully automatic tile pasting machine will be described first, and the fully automatic tile pasting machine is mainly applied to an automatic tile pasting technology. When arranging and bonding molded ceramic chips on the adhesive paper of the arc-shaped carrier roller in the prior art, the adhesive paper is cut to a proper size, and the single chips are manually taken and then bonded, so that the working efficiency is low, the automation degree is low, the loss of labor force is high, the bonding arrangement is uneven, and the bonding is not firm. Therefore, the full-automatic chip mounter is adopted in the embodiment of the application, so that manual intervention is reduced, and the chip mounting effect is ensured.
Referring to fig. 1 to 2, fig. 1 and 2 are perspective views of a fully automatic ceramic wafer attaching machine in an embodiment of the present application. The full-automatic tile pasting machine provided by the embodiment of the application comprises a moving platform 100, wherein universal wheels 110 are arranged at four corners of the bottom of the moving platform 100, and each universal wheel 110 is provided with a brake. The mobile platform 100 may move to a specified location.
The moving platform 100 serves as a supporting moving assembly in the embodiment of the present application, and a conveying mechanism and at least two processing stations are disposed on the moving platform 100. The number of the processing stations can be two, three or four according to the processing requirement; it should be understood that there are not two processing stations shown in fig. 1 and 3.
The conveying mechanism respectively conveys the ceramic chips to at least two processing stations in a single-row arrangement mode in a vibration separation mode; specifically, the conveying mechanism includes: a vibration plate 300 and at least two channels 400 connecting the vibration plate 300; the at least two channels 400 are arranged in a single row for conveying the ceramic chips and are correspondingly connected with the at least two processing stations one by one. And simultaneously transmitting the ceramic chips to at least two processing stations. As can be seen from the above description, by pouring tiles into the vibration tray 300, the individual tiles are sequentially arranged and conveyed to the channel 400 by vibration separation, the tiles are arranged in a single row and conveyed on the channel 400, and the channel 400 adopts a conveyor belt device and has a width consistent with the width of the individual tiles, so that the tiles are conveyed to the corresponding processing station for processing and pasting.
As shown in connection with fig. 3 and 4, each processing station includes: a rotary transplanting assembly 610 for conveying a plurality of tiles to a set position in a single row of tile groups; the rotary transplanting assembly 610 sequentially arranges and combines the single tiles conveyed on the channel 400 into a single row of tile groups, so that the single tile is a plurality of tiles, not four as shown in fig. 1; of course, the number of the single patches can be correspondingly adjusted to three, five, six and the like according to the radian of the patches.
The base 611 is provided with a longitudinal moving mechanism, the longitudinal moving mechanism is provided with a feeding mold 616, and the feeding mold 616 is provided with a plurality of receiving slots 617 which are arranged longitudinally. The groove body of the receiving groove 617 is identical to the ceramic chip in shape, so that the ceramic chip is limited in the corresponding receiving groove 617. The receiving slots 617 of the feeding mold 616 are located on the same straight line, so that the sucking disc mechanism 620 can suck all the tiles on the receiving slots 617 in a single row. As shown in fig. 5, the number of the receiving slots 617 is four, but may also be three, five, six, or the like, and during the moving process of the vertical moving mechanism, the tiles are sequentially placed in the corresponding receiving slots 617, until all the tiles are fully received, the vertical moving mechanism moves to the position matched with the suction cup mechanism 620.
Continuing with fig. 5, in particular, the longitudinal moving device includes: a movable base 613; the base 611 has a first linear guide 612 along a longitudinal direction, and the movable base 613 is slidably mounted on the first linear guide 612. The movable base 613 moves longitudinally along the first linear guide 612.
When the driving movable base 613 moves along the guide rail 500, the driving apparatus includes: a first lead screw 614 rotatably connected above the first linear guide 612, and a first stepping motor 615 for driving the first lead screw 614 to rotate; the end of the first lead screw 614 far from the first stepping motor 615 is sleeved with a bearing assembly, and the bearing assembly is fixedly assembled on the base 611. Therefore, the first lead screw 614 rotates smoothly, and unstable torque transmission caused by the deflection of the first lead screw 614 is reduced.
The first lead screw 614 penetrates the moving base 613 and is threadedly connected to the moving base 613. The first lead screw 614 is screwed to the moving base 613 and penetrates the moving base 613, so that the first lead screw 614 is correspondingly rotated by the first stepping motor 615 during rotation, and the moving base 613 moves on the first linear guide 612 according to the rotation direction of the first lead screw 614. A feeding mold 616 is fixedly assembled above the movable seat 613, so that in the moving process of the movable seat 613, the plurality of receiving slots 617 sequentially coincide with the feeding position of the feeding mechanism 619, the feeding mechanism 619 feeds the ceramic chips into the receiving slots 617 for positioning, and after the ceramic chips are loaded in the plurality of receiving slots 617, the first stepping motor 615 drives the movable seat 613 to move to the position where the movable seat 613 is matched with the suction cup mechanism 620. Specifically, the first stepping motor 615 is a programmable motor, and controls a rotation stroke according to the placement position of the ceramic chip, so that the receiving groove 617 is sequentially located at the feeding position of the feeding mechanism 619, and controls a rotation stroke of the receiving groove to increase to move the feeding mold 616 to a position where the receiving mold is matched with the suction cup mechanism 620 after feeding is completed.
In the embodiment of the present application, the rotating mechanism 618 is used to position the feeding mechanism 619 at a first setting position and a second setting position when the feeding mechanism 619 is moved from the conveying mechanism to the receiving groove 617. The first set position is the position where the feeding mechanism 619 is matched with the conveying mechanism; the second setting position is a position where the feeding mechanism 619 engages with the plurality of receiving slots 617. Referring to fig. 5, the feeding mechanism 619 is shown in a first setting position, and the feeding mechanism 619 is shown in a second setting position in phantom in fig. 5.
As can be seen, the rotating mechanism 618 is a rotating cylinder or a rotating motor capable of rotating 180 °; the first setting position and the second setting position are located on the same horizontal straight line. So that the feeding mechanism 619 performs corresponding operations at two different positions. The rotation stroke of the rotation mechanism 618 is clockwise 180 degrees (the feeding mechanism 619 conveys the single ceramic chip of the conveying mechanism to the receiving groove 617 at the corresponding position) and then anticlockwise 180 degrees (the feeding mechanism 619 returns the ceramic chip to the conveying mechanism after placing the ceramic chip in the receiving groove 617), so that reciprocating operation is performed.
Specifically, the feeding mechanism 619 includes: a rotating arm 6195 connected with the rotating mechanism 618, wherein one end of the rotating arm 6195 far away from the rotating mechanism 618 is provided with a synchronously rotating sucker device 6194; when the feeding mechanism 619 rotates and is locked at the first setting position, the suction cup device 6194 is away from the feeding die 616. The feeding mechanism 619 cooperates with the conveying mechanism when in the first set position. After sucking disc device 6194 starts, adsorb single ceramic chip, sucking disc device 6194 in this application adopts gas to adsorb to it is more convenient to place in connecing silo 617 at the in-process exhaust of unloading.
Meanwhile, in order to realize synchronous rotation of the suction cup device 6194, one end of the rotating arm 6195 close to the rotating mechanism 618 is coaxially and rotatably connected with a driving wheel 6191, and one end of the rotating arm 6195 far from the rotating mechanism 618 is rotatably connected with a driven wheel 6192; wherein, the driving wheel 6191 is connected with the driven wheel 6192 through a synchronous belt 6193; the driven wheel 6192 is fixedly connected with the suction cup device 6194. During the rotation of the rotating mechanism 618, the suction cup device 6194 is moved from the conveying mechanism station to the unloading station of the feeding mold 616 for unloading operation.
As can be seen from the above description, when the rotating mechanism 618 drives the rotating arm 6195 to rotate, the driving wheel rotates and drives the driven wheel 6192 to rotate through the synchronous belt 6193, so that the suction cup device 6194 is always kept in a vertical state when the suction cup device 6194 moves between the first setting position and the second setting position, so as to suck the tiles, and the single tiles are sequentially placed in the receiving slots 617 and arranged in order in cooperation with the longitudinal moving device. Thus, the plurality of ceramic sheets are combined into a single row of ceramic sheet group and transmitted to the set position matched with the sucking disc mechanism 620 by the longitudinal moving mechanism.
Referring to fig. 1 and 2, two guide rails 500 are arranged on the gantry 200 in parallel; the suction cup mechanism 620 is slidably mounted on one of the guide rails 500; after the single-row tile group moves to a set position, the suction cup mechanism 620 longitudinally slides to the set position along one of the guide rails 500, the suction cup mechanism 620 is started by an air cylinder to descend, and the suction cups with the same number as the tiles in the single-row tile group are arranged on the suction cup mechanism 620. Thereby causing the chuck mechanism 620 to completely suck a single row of a plurality of tiles in a tile group at a single time. After sucking the ceramic chip, the air cylinder ascends, and the suction cup mechanism 620 continues to slide along the guide rail 500 to a position right above the rotary carrier roller assembly 630 for chip mounting.
Referring to fig. 6, the rotary carrier roller assembly 630 is used for being fixedly assembled on the full-automatic chip mounter and is correspondingly bonded with the single-row ceramic chip group conveyed by the sucker mechanism 620, so that the position of a chip is always located at the highest point, the ceramic chips are fully attached to the arc surface in the rotating and progressive sliding processes, the automatic operation is high, and the chip mounting effect is guaranteed.
The rotating idler assembly 630 includes: the sliding base comprises two second linear guide rails 631 arranged in parallel, and the carrier roller mechanism is slidably assembled on the two second linear guide rails 631. The carrier roller mechanism slides along the two second linear guide rails 631; specifically, the first linear guide 612 and the guide 500 on the gantry 200 are both disposed in the same longitudinal direction, and the second linear guide 631 is disposed perpendicular to the longitudinal direction, so that the roller mechanism and the suction cup mechanism 620 cooperate to adjust the single-row position of the patches. The two second linear guides 631 are configured to be fixedly mounted on the top of the moving platform 100 of the automatic chip mounter, and the carrier roller mechanism is configured to adjust the single-row position of the chip along the two second linear guides 631.
In adjusting the single-row patch position of the idler mechanism, the lead screw driver is used in the embodiment of the present application to drive the sliding position of the idler assemblies on the two second linear guide rails 631. Specifically, the screw drive includes: a second lead screw 636 rotatably connected between the two second linear guides 631, and a second stepping motor 638 for rotating the second lead screw 636; wherein, second lead screw 636 runs through the bearing roller mechanism and with bearing roller mechanism threaded connection. The second lead screw 636 enables the carrier roller mechanism to correspondingly slide along the two second linear guide rails 631 in the corresponding rotation process. In the rotating process, the second stepping motor 638 drives the second lead screw 636 to rotate in a belt or gear manner, so that the carrier roller mechanism connected with the second lead screw 636 by threads slides along the two second linear guide rails 631 correspondingly.
Meanwhile, in order to ensure smooth rotation of the second lead screw 636, a bearing assembly 637 is sleeved at one end of the second lead screw 636 far away from the second stepping motor 638. The second lead screw 636 rotates smoothly, and unstable torque transmission caused by the deflection of the second lead screw 636 is reduced.
With continued reference to fig. 6, the idler mechanism includes: the carrier roller 633 is provided with a hollow cavity, and a driving device is used for driving the carrier roller 633 to rotate circumferentially; the driving device comprises a motor assembly box 632; a motor output shaft of the motor assembly box 632 (a motor, not shown, is mounted in the motor assembly box 632) is coaxially connected to the carrier roller 633. The motor driving idler 633 in the motor assembly box 632 correspondingly rotates for a set angle.
When the carrier roller mechanism is driven by the second lead screw 636 to slide along the two second linear guide rails 631, the carrier roller mechanism further comprises a base plate for assembling the motor assembly box 632 and the carrier roller 633; the substrate is slidably engaged with the two second linear guides 631, and the second lead screw 636 is threadedly coupled to the bottom of the substrate. The substrate carries the motor mounting box 632 and the idler 633 for sliding. As can be seen from the above description, the substrate carries the motor assembly box 632, the motor output shaft of the motor assembly box 632 is coaxially connected with the carrier roller 633, and the second lead screw 636 is located at the bottom of the substrate and is in threaded connection with the substrate; during specific setting, the bottom of the substrate is provided with a nut in threaded fit with the second lead screw 636, so that when the second lead screw 636 rotates, the threads travel along the second lead screw 636, and the substrate is driven to slide on the two second linear guide rails 631.
Therefore, when the second lead screw 636 rotates, the carrier roller 633 is driven to slide along the two second linear guide rails 631, so that the single-row position of the patches on the carrier roller 633 is adjusted; when the motor output shaft at motor assembly box 632 drove bearing roller 633 circumferential direction to the adjustment paster is located bearing roller 633 angle, makes single row porcelain piece group be located the top of bearing roller 633 all the time and carries out the tray, operates in proper order, pastes completely on adhesive tape 634 until the ceramic chip.
In addition, in order to fix the gummed paper 634 on the arc-shaped surface of the carrier roller 633, the unloading is facilitated; a plurality of through-holes that communicate with the cavity are seted up at the top of bearing roller 633, and a plurality of through-holes coat has adhesive tape 634, and the cavity is connected with evacuation mechanism. The side wall of the carrier roller 633 is provided with a vacuum movable joint 635 communicated with the hollow cavity, and the vacuumizing mechanism is connected with the vacuum movable joint 635. The position of the gummed paper 634 is ensured to be stable by adopting a vacuum pumping mode. This evacuation mechanism adopts modes such as suction fan or aspirator pump to make adhesive tape 634 laminate on the arcwall face of bearing roller 633, when taking after the paster is accomplished simultaneously, stop evacuation mechanism can.
Through the mutual matching between the sucking disc mechanism 620 and the rotating carrier roller 633, after the single-row ceramic chip groups are adhered to the adhesive paper 634, the single-row ceramic chips are adhered after rotating for a set angle; and sliding the rotary carrier roller assembly 630 and then sequentially sticking the adhesive paper 634 on the ceramic tiles; meanwhile, in order to enhance the bonding effect, as shown in fig. 3 and 4, a pressure maintaining mechanism 640 is further included; the pressure holding mechanism 640 is fixedly fitted to the other guide rail 500. The pressure holding mechanism 640 is located in front of the suction cup mechanism 620. Pressurize mechanism 640 goes up and down through the cylinder drive to possess with bearing roller 633 assorted arcwall face, it is fixed to bond a plurality of ceramic chips, thereby make the ceramic chip bond firmly.
It can be seen from the above description that, after the rotary transplanting assembly 610 conveys the single ceramic chips in groups, the suction cup mechanism 620 conveys the single ceramic chip group to the position right above the rotary carrier roller assembly 630 to press down the ceramic chips, the rotary carrier roller assembly 630 rotates or advances correspondingly until the arc surface is closely attached, the pressure maintaining mechanism 640 is adopted to make the ceramic chips firmly bonded, the full-automatic operation is realized, the manual intervention is reduced, and the chip mounting effect is better.
In addition, the embodiment of the application also provides a patch method, which comprises the following steps:
firstly, conveying the ceramic chips to corresponding processing stations in a single-row conveying mode after vibration separation;
step two, classifying the plurality of ceramic chips into a single-row ceramic chip group by the rotary transplanting assembly and conveying the single-row ceramic chip group to a set position;
thirdly, after the sucker mechanism slides to a set position to suck a plurality of ceramic chips in the single-row ceramic chip group, the sucker device is positioned right above the rotary carrier roller assembly;
fourthly, adhesive paper cut into standard sizes is adsorbed on the rotary carrier roller assembly;
step five, after the sucking disc device descends until a plurality of ceramic chips on the single row of ceramic chip group are bonded with the gummed paper, the sucking disc device ascends to return to continuously adsorb another single row of ceramic chip group;
step six, rotating the carrier roller assembly for a set angle, and adhering the other single-row ceramic chip group and the adhered single-row ceramic chip group to the adhesive paper side by side;
step seven, after the adhesive tape is fully adhered to the ceramic chips in a row, the rotary carrier roller assembly slides for a set distance, and the step five and the step six are repeated until the adhesive tape is fully adhered to the ceramic chips in a row;
step eight, the rotating carrier roller assembly drives the gummed paper fully adhered with the ceramic chip to slide to the position right below the pressure maintaining mechanism, and the pressure maintaining mechanism presses downwards to enable the ceramic chip and the gummed paper to be tightly adhered;
and step nine, the rotary carrier roller assembly retreats to the unloading station.
By the method, automatic material conveying, grouping transmission, surface mounting and pressure maintaining operations are realized, manual intervention is reduced, production efficiency is improved, and the surface mounting effect is ensured.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a full-automatic paster machine, its characterized in that includes:
the device comprises a mobile platform, a processing platform and a control system, wherein at least two processing stations are arranged on the mobile platform;
the conveying mechanism is used for respectively conveying the ceramic chips to the at least two processing stations in a single-row arrangement mode in a vibration separation mode; wherein,
each processing station comprises: the rotary transplanting assembly is used for conveying a plurality of ceramic chips to a set position in a single-row ceramic chip group mode, the sucking disc mechanism slides to the set position and is used for adsorbing the single-row ceramic chip group, and the rotary carrier roller assembly is assembled on the moving platform in a sliding mode and is in rotary progressive fit with the sucking disc mechanism;
the sliding direction of the sucker mechanism is mutually vertical to that of the rotary carrier roller assembly, the rotary carrier roller assembly adsorbs gummed paper, and when the sucker device descends to a set height, the single-row ceramic chip sets are sequentially arranged and bonded on the gummed paper;
each processing station further comprises a pressure maintaining mechanism, and the pressure maintaining mechanism is used for abutting against the single-row ceramic chip groups arranged in multiple groups to be fixedly adhered to the adhesive paper.
2. The full-automatic porcelain piece pasting machine of claim 1, wherein four corners of the bottom of the moving platform are provided with universal wheels, and each universal wheel is provided with a tread brake.
3. The full-automatic ceramic wafer pasting machine according to claim 2, wherein a portal frame is arranged on the moving platform, and two guide rails are arranged on the portal frame in parallel;
the sucking disc mechanism is assembled on one guide rail in a sliding mode, and the pressure maintaining mechanism is fixedly assembled on the other guide rail.
4. The full-automatic ceramic tile pasting machine according to claim 3, wherein the pressure maintaining mechanism is located in front of the suction cup mechanism.
5. The full-automatic ceramic tile pasting machine of claim 1, wherein the conveying mechanism comprises: the vibration disc is connected with at least two channels;
and the at least two channels are arranged in a single row and used for conveying the ceramic chips and are correspondingly connected with the at least two processing stations one by one.
6. The fully automatic tile pasting machine of claim 1, wherein each set of single row tiles comprises at least four tiles.
7. The full-automatic tile pasting machine according to claim 6, wherein the sucking disc mechanism is provided with sucking discs with the same number of tiles as the single row of tile groups.
8. The full-automatic paster machine of claim 7, wherein the rotary carrier roller assembly adsorbs the gummed paper through negative pressure gas.
9. The full-automatic paster machine of claim 8, wherein each group of single-row ceramic pieces bonds the gummed paper along the highest point of the rotating carrier roller assembly.
10. A method of patching comprising the steps of:
firstly, conveying the ceramic chips to corresponding processing stations in a single-row conveying mode after vibration separation;
step two, the rotary transplanting assembly classifies the plurality of ceramic chips into a single-row ceramic chip group and conveys the ceramic chips to a set position;
thirdly, after the sucker mechanism slides to a set position to suck a plurality of ceramic chips in a single-row ceramic chip group, the sucker device is positioned right above the rotary carrier roller assembly;
fourthly, adhesive paper cut into standard sizes is adsorbed on the rotary carrier roller assembly;
step five, after the sucker device descends until a plurality of ceramic chips on the single-row ceramic chip group are bonded with the gummed paper, the sucker device ascends to return to continuously adsorb another single-row ceramic chip group;
step six, the rotary carrier roller assembly rotates for a set angle, and the other single-row ceramic chip group and the bonded single-row ceramic chip group are bonded on the adhesive paper side by side;
step seven, after the adhesive tape is fully adhered to the ceramic chips in a row, the rotary carrier roller assembly slides for a set distance, and the step five and the step six are repeated until the adhesive tape is fully adhered to the ceramic chips in a row;
step eight, the rotary carrier roller assembly drives the gummed paper fully adhered with the ceramic chip to slide to the position right below the pressure maintaining mechanism, and the pressure maintaining mechanism presses downwards to enable the ceramic chip and the gummed paper to be tightly adhered;
and step nine, the rotary carrier roller assembly retreats to the unloading station.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111371116.2A CN114033780A (en) | 2021-11-18 | 2021-11-18 | Full-automatic ceramic chip pasting machine and chip pasting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111371116.2A CN114033780A (en) | 2021-11-18 | 2021-11-18 | Full-automatic ceramic chip pasting machine and chip pasting method |
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| Publication Number | Publication Date |
|---|---|
| CN114033780A true CN114033780A (en) | 2022-02-11 |
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| CN202111371116.2A Pending CN114033780A (en) | 2021-11-18 | 2021-11-18 | Full-automatic ceramic chip pasting machine and chip pasting method |
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|---|---|
| CN (1) | CN114033780A (en) |
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