CN114025579A - Compressing heat dissipation device - Google Patents
Compressing heat dissipation device Download PDFInfo
- Publication number
- CN114025579A CN114025579A CN202111351623.XA CN202111351623A CN114025579A CN 114025579 A CN114025579 A CN 114025579A CN 202111351623 A CN202111351623 A CN 202111351623A CN 114025579 A CN114025579 A CN 114025579A
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- CN
- China
- Prior art keywords
- heat
- heat sink
- blotter
- printed board
- buffering pad
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a compressing and heat-dissipating device which comprises a printed board, a compressing assembly, a buffering pad and a heat dissipating fin, wherein the buffering pad comprises a first buffering pad and a second buffering pad, the heat dissipating fin is arranged on the printed board, the first buffering pad is arranged on the heat dissipating copper sheet, the compressing assembly and the printed board are detachably connected to the upper part of the buffering pad, and the second buffering pad is connected with the compressing assembly. The compressing and heat-dissipating device can be widely applied to heat-dissipating installation and uniform-distribution pressing force installation of most aerospace electronic products, and can also adopt a distributed installation mode according to the heat consumption and the actual requirements of the devices, so that the high-power heating device not only meets the installation requirement of the uniform-distribution pressing force, but also can withstand the harsh thermal impact test environment, and the service life of the high-power device is prolonged.
Description
Technical Field
The invention belongs to the field of structural parts of electrical equipment, and particularly relates to a compressing heat dissipation device.
Background
In recent years, aerospace power supply products are rapidly and deeply developed towards high power and intelligentization of components, the size of the power supply products is smaller and smaller, the assembly density of the products is higher and higher, the power consumption of components is higher and higher, and large-scale integrated circuits are more and more widely applied, so that the heat density of components, printed circuit boards and the whole power supply products is continuously improved, and the heat problems of ultra-high-power components and large-scale integrated circuits are increasingly the key problems of the reliability design of the power supply products. Thermal design has been a major concern as an important item in product reliability design, particularly for spacecraft power supply products. With the increase of temperature, the failure rate of a spacecraft power supply product tends to increase exponentially, and excessively high temperature can endanger the nodes of large-scale integrated power devices, damage the connection interface of a circuit, increase the resistance value of a conductor and form mechanical stress damage, thereby affecting the reliability of the product. Meanwhile, the special use environment also requires that the installation mode of the ultra-high power component can deal with larger impact stress so as to prevent the high power component from falling off or being damaged due to impact.
Disclosure of Invention
The invention aims to solve the problems and provides a compression heat dissipation device which comprises a printed board, a compression assembly, a buffering pad and a heat dissipation plate, wherein the buffering pad comprises a first buffering pad and a second buffering pad, the heat dissipation plate is arranged on the printed board, the first buffering pad is arranged on the heat dissipation copper plate, the compression assembly and the printed board are detachably connected to the upper part of the buffering pad, and the second buffering pad is connected with the compression assembly.
According to one aspect of the invention, the heat dissipation link is pre-arranged on the printed board by means of printed board processing.
According to one aspect of the invention, the pressing assembly comprises a supporting column and a Z-shaped pressing plate, wherein the supporting column is respectively connected to two ends of the Z-shaped pressing plate.
According to one aspect of the invention, the material of the hold-down assembly is an aluminum alloy.
According to one aspect of the invention, the cushioning pad is a resilient thermally conductive insulating pad.
According to one aspect of the invention, the heat sink is a copper plate with a 10-20 μm lead-tin alloy plated surface.
According to one aspect of the present invention, a first thermally conductive filling medium is disposed on the first cushion pad.
According to one aspect of the invention, the first thermally conductive filler medium is thermally conductive silicone grease.
According to one aspect of the invention, a second thermally conductive filler medium is disposed on a side of the second cushion pad adjacent to the hold-down assembly.
According to one aspect of the invention, the second heat-conducting filling medium is vulcanized silicone rubber.
According to one technical scheme of the invention, the pressing and heat-radiating device ensures that the mounting surface and the top surface of the device are uniformly stressed and do not have local warping by a pressing and mounting mode of bidirectionally clamping the normal abdomen and the top of the high-power heating device 6, and the temperature gradient of the mounting surface is reduced to be within 1.3 ℃.
According to one technical scheme of the invention, the compression heat dissipation device adopts the red copper plate with high thermal conductivity and the surface plated with 10-20 mu m of lead-tin alloy, so that the thermal conduction resistance is reduced, the temperature rise of a device can be effectively inhibited by combining bidirectional clamping and compression installation of the belly and the top, and the average temperature rise reduction amplitude reaches 49 percent through test tests.
According to one technical scheme of the invention, the compressing and heat-dissipating device adopts uniformly distributed pressure plate materials with high hardness, so that the distribution uniformity of the mounting compression force is improved, and the maximum value of the equivalent stress of each pin of the device is reduced by 26%.
According to one technical scheme of the invention, the compressing and radiating device can reduce the temperature rise of a large-scale integrated power device in rated operation, effectively meets the I-level derating temperature requirement, and has larger safe operating temperature margin compared with the traditional installation mode.
According to a technical scheme of the invention, the compressing and heat-radiating device can be widely applied to heat-radiating installation and uniform-distribution pressing force installation of most aerospace electronic products, and can also adopt a distributed installation mode according to heat consumption and actual requirements of devices, so that the high-power heating device 6 not only meets the installation requirement of the uniform-distribution pressing force, but also can withstand the harsh thermal impact test environment, and the service life of the high-power device is prolonged.
Drawings
FIG. 1 is a schematic representation of a construction of a compression heat sink;
fig. 2 is a perspective view schematically showing a compression heat sink.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
In describing embodiments of the present invention, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship that is based on the orientation or positional relationship shown in the associated drawings, which is for convenience and simplicity of description only, and does not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, the above-described terms should not be construed as limiting the present invention.
The present invention is described in detail below with reference to the drawings and the specific embodiments, which are not repeated herein, but the embodiments of the present invention are not limited to the following embodiments.
As shown in fig. 1 and 2, according to an embodiment of the present invention, the pressing heat sink includes a printed board 1, a heat sink 2, a cushion pad 3, a pressing assembly 4, and a heat dissipating link 5, wherein the cushion pad 3 further includes a first cushion pad 31 and a second cushion pad 32. In this embodiment, the heat sink 2 is directly soldered to the printed board 1 by using a preset solder, and other connection methods may be adopted to connect the heat sink 2 and the printed board 1, which are not described herein again. A first cushion 31 is bonded to the heat sink 2 and a second cushion 32 is bonded to the back of the hold-down assembly 4. In the embodiment, the pressing component 4 is detachably connected to the printed board 1 through a fastening screw, a spring washer and a flat washer, wherein the number of the fastening screw is A2-70 stainless steel, and the tensile strength is greater than 800 MPa. According to the inventive concept, this arrangement enables a secure mounting of the hold-down assembly 4. In the present embodiment, the heat dissipation link 5 is mainly an exposed copper-clad layer on the printed board, and has a thickness of 0.254mm, and mainly functions to quickly conduct heat on the abdomen of the power device and the printed board through the copper layer to the edge of the printed board or the metal heat dissipation enclosure frame arranged on the printed board, and directly contacts the heat dissipation fin 2. According to the concept of the present invention, the high power heat generating device 6 is disposed on the first buffer pad 31 and directly soldered on the printed board 1 by a preset solder to ensure the stability of the connection of the high power heat generating device 6 and the printed board 1. In addition, the high-power heating device 6 is further pressed and fixed by the pressing component 4 which is bonded with the second cushion pad 32, and the device is mainly applied to the field of aerospace, so that large impact can be frequently encountered in a special working environment of the device, and the device mounting surface and the top surface are uniformly stressed and do not have local warping so as to improve the stability of operation of the high-power heating device 6 under the environment that the high-power heating device 6 can bear large impact by a pressing mounting mode of bidirectional clamping of the normal belly and the top of the high-power heating device 6 through the pressing heat dissipation device.
Because the on-orbit operation of the spacecraft is in a vacuum environment, convection heat dissipation cannot be carried out. Therefore, according to the concept of the present invention, a portion of the heat generated by the high power heat generating device 6 is transferred to the heat sink 2 through the first buffer 31, and then transferred from the heat sink 2 to the heat dissipating link 5, and finally transferred out through the heat dissipating link 5. Another part transfers heat to the compression assembly 4 through the second cushion 32. According to the concept of the invention, the compressing and heat-radiating device can be widely applied to heat-radiating installation and uniform-distribution pressing force installation of most aerospace electronic products, and can also adopt a distributed installation mode according to the heat consumption and the actual requirements of the devices, so that the high-power heating device 6 not only meets the installation requirement of the uniform-distribution pressing force, but also can be subjected to a severe thermal impact test environment, and the service life of the high-power device is prolonged.
Referring to fig. 1 and 2, according to a preferred embodiment of the present invention, the lap heat dissipation link 5 is pre-mounted on the printed board 1 by means of printed circuit board processing. According to the concept of the invention, the heat dissipation circuit can be designed in advance to ensure that the pressing heat dissipation device has stronger adaptability on one hand and can also prevent short circuit in a preset mode on the other hand by being arranged on the printed board 1 in a preset mode, so that the safety performance is improved.
Referring to fig. 1 and 2, in accordance with a preferred embodiment of the present invention, the pressing assembly 4 includes a supporting column 41 and a Z-shaped pressing plate 42, wherein the supporting column 41 is fixedly connected to both side ends of the Z-shaped pressing plate 42. According to the concept of the invention, the supporting column 41 and the Z-shaped pressing plate 42 are processed by aluminum alloy, the alloy material has the characteristics of light weight, easiness in processing and the like, the surface of the material is processed to have excellent roughness which is better than 3.2 microns, the top of the power device can be ensured to be uniformly contacted with a metal pressing block, the uniform pressing force on the body of the power device can be ensured, and the heat conductivity coefficient of the raw material is 117 ℃/W, so that the heat of the top of the power device can be smoothly conducted to the printed board.
Referring to fig. 1 and 2, according to a preferred embodiment of the present invention, the material of the pressing member 4 is aluminum alloy. According to the concept of the invention, the aluminum alloy has the characteristics of light weight, high ultimate strength, easy processing and the like, and the yield strength is higher than 260Mpa, and the heat conductivity coefficient is 117 ℃/W, so that the compression assembly 4 has better heat transfer performance and higher strength.
Referring to fig. 1 and 2, according to a preferred embodiment of the present invention, the cushion pad 3 is an elastic heat-conductive insulating pad. According to the concept of the invention, the elastic heat-conducting insulating pad is made of an elastic heat-conducting insulating material with the thickness of 0.25mm or 0.38mm, the heat conductivity of 3.5W/(m.K) and the normal maximum volume compression ratio of 36%, has good heat transfer property and high normal compressibility ratio, is favorable for rapidly transferring heat and simultaneously buffering stress on the high-power heating device 6, and prolongs the service life of the high-power heating device 6.
Referring to fig. 1 and 2, in accordance with a preferred embodiment of the present invention, the heat sink 2 is a copper plate coated with 10-20 μm of lead-tin alloy. According to the concept of the invention, the direct contact between the belly of the high-power heating device 6 and the lap joint heat dissipation link 5 is realized through the arrangement of the material, and the heat of the high-power heating device 6 can be stably transferred to the heat dissipation link 5 due to the high heat conductivity coefficient, the good weldability and the good elongation percentage.
Referring to fig. 1 and 2, according to an embodiment of the present invention, a first heat conductive filling medium 33 is disposed on the first cushion pad 31. In the present embodiment, the first heat conductive filling medium 33 is heat conductive silicone grease. According to the concept of the invention, the first cushion pad 31 often cannot be tightly attached to the high-power heating device 6, so that the heat dissipation and buffering effects of the compression heat dissipation device can be seriously affected, the heat-conducting silicone grease has certain fluidity, can keep stable properties at the working temperature of more than or equal to 85 ℃, and has good heat-conducting performance, the compression heat dissipation device can be tightly attached to the shape of the high-power heating device 6 through the first heat-conducting filling medium 33, and the adaptability of the compression heat dissipation device is further improved.
Referring to fig. 1 and 2, according to an embodiment of the present invention, a second heat-conducting filling medium 34 is disposed on the contact surface of the second cushion pad 32 and the high work Z-shaped pressing plate 42. In this embodiment, the second heat-conducting filling medium 34 is a single-component room temperature vulcanized silicone rubber. According to the concept of the invention, the vulcanized silicone rubber has good heat transfer characteristic and high contact surface filling rate, and can realize heat dissipation protection of the high-power heating device 6.
The above description is only one embodiment of the present invention, and is not intended to limit the present invention, and it is apparent to those skilled in the art that various modifications and variations can be made in the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a compress tightly heat abstractor, is including printing board (1), fin (2), blotter (3) and compress tightly subassembly (4), blotter (3) include first blotter (31) and second blotter (32), fin (2) set up on printing board (1), first blotter (31) set up on fin (2), compress tightly subassembly (4) with printing board (1) detachable connects the upper portion in blotter (3), second blotter (32) with compress tightly subassembly (4) and be connected, its characterized in that still includes heat dissipation link (5), heat dissipation link (5) with printing board (1) are connected and set up fin (2) with between printing board (1).
2. The pressing heat sink according to claim 1, wherein the heat sink link (5) is pre-mounted on the printed board (1) by means of printed board machining.
3. The hold-down heat sink according to claim 1, wherein the hold-down assembly (4) comprises a support column (41) and a Z-shaped hold-down plate (42), the support column (41) being connected to both ends of the Z-shaped hold-down plate (42), respectively.
4. The pressing heat sink according to claim 1 or 3, characterized in that the material of the pressing assembly (4) is an aluminum alloy.
5. The compression heat sink as claimed in claim 1, characterised in that the buffer pad (3) is an elastic, thermally conductive and insulating pad.
6. The compression heat sink as claimed in claim 1, characterised in that the heat sink (2) is a copper plate coated with a 10-20 μm lead-tin alloy.
7. The compression heat sink according to claim 1, wherein a first heat conducting filling medium (33) is arranged on the first cushion pad (31).
8. The compression heat sink as claimed in claim 7, wherein the first thermally conductive filling medium (33) is thermally conductive silicone grease.
9. The hold-down heat sink according to claim 1 or 8, characterized in that a second heat-conducting filling medium (34) is arranged on the second cushion (32) on the side thereof adjacent to the hold-down assembly (4).
10. The compression heat sink of claim 9, wherein the second thermally conductive filler medium (34) is a silicone sulfide rubber.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111351623.XA CN114025579A (en) | 2021-11-16 | 2021-11-16 | Compressing heat dissipation device |
| PCT/CN2022/115607 WO2023087837A1 (en) | 2021-11-16 | 2022-08-29 | Compression heat dissipation apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111351623.XA CN114025579A (en) | 2021-11-16 | 2021-11-16 | Compressing heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114025579A true CN114025579A (en) | 2022-02-08 |
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ID=80064289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111351623.XA Pending CN114025579A (en) | 2021-11-16 | 2021-11-16 | Compressing heat dissipation device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114025579A (en) |
| WO (1) | WO2023087837A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023087837A1 (en) * | 2021-11-16 | 2023-05-25 | 北京卫星制造厂有限公司 | Compression heat dissipation apparatus |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI255684B (en) * | 2004-08-26 | 2006-05-21 | Asustek Comp Inc | Auxiliary supporting structure of circuit board and assembling method for the same |
| JP6366562B2 (en) * | 2015-11-10 | 2018-08-01 | 日本特殊陶業株式会社 | Manufacturing method of multilayer wiring board |
| CN107567266A (en) * | 2017-10-25 | 2018-01-09 | 北京无线电测量研究所 | The cooling system and antenna of a kind of antenna |
| CN211831630U (en) * | 2020-03-21 | 2020-10-30 | 宁波吉品科技有限公司 | Heat dissipation type radio frequency test platform |
| CN111867324B (en) * | 2020-06-30 | 2023-04-14 | 北京卫星制造厂有限公司 | Heat radiation structure suitable for spacecraft high-power device |
| CN114025579A (en) * | 2021-11-16 | 2022-02-08 | 北京卫星制造厂有限公司 | Compressing heat dissipation device |
-
2021
- 2021-11-16 CN CN202111351623.XA patent/CN114025579A/en active Pending
-
2022
- 2022-08-29 WO PCT/CN2022/115607 patent/WO2023087837A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023087837A1 (en) * | 2021-11-16 | 2023-05-25 | 北京卫星制造厂有限公司 | Compression heat dissipation apparatus |
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| Publication number | Publication date |
|---|---|
| WO2023087837A1 (en) | 2023-05-25 |
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