CN114019334A

CN114019334A - Test equipment with horizontal adjustment module

Info

Publication number: CN114019334A
Application number: CN202010684861.1A
Authority: CN
Inventors: 吴国荣; 江登鑫; 林修颐
Original assignee: King Yuan Electronics Co Ltd
Current assignee: King Yuan Electronics Co Ltd
Priority date: 2020-07-16
Filing date: 2020-07-16
Publication date: 2022-02-08
Anticipated expiration: 2040-07-16
Also published as: CN114019334B

Abstract

A test equipment with a level adjustment module includes a test head, a test interface and a needle tester. The test interface includes an upper substrate, a lower substrate and a level adjustment module, and the upper substrate is connected to the test head by a plurality of tension springs. The leveling module includes a plurality of driving components, each of which is respectively connected to the upper substrate and the lower substrate, and includes a driving motor and a universal joint for adjusting the distance between the upper substrate and the lower substrate at different positions. The probe tester carries a test interface and has a probe card that can be overlapped with the lower substrate. In this way, the present invention can adjust the height of the probe in a specific area of the probe card, so that the overall level of the needle tip can reach the required test specification, and the test quality of the probe tester can be maintained.

Description

Test equipment with horizontal adjustment module

Technical Field

The present invention relates to a testing apparatus having a leveling module, and more particularly, to a testing apparatus having a leveling module, which provides accurate alignment.

Background

Please refer to fig. 13, which is a perspective view of a conventional testing apparatus with a horizontal adjustment module. There is shown a test apparatus 91 having a leveling module in which a contact substrate 92 having a plurality of contactors 93 is mounted on a probe card 96 through a support frame 95 and a conductive elastic body 94. A support frame 95 for supporting the contact substrate 92 is connected to a probe card 96 by screws 952 and nuts 951.

On the bottom surface of the contact substrate 92, an electrode 921 provided near the screw 952 is connected to the support frame 95, and the semiconductor wafer 900 to be tested is placed on a chuck 90. The gap sensor 901 on the semiconductor wafer 900 is connected to the input 981 of the gap measuring instrument 98. The gap sensor 901 is also an electrode and is disposed at a position opposite to the electrode 921 so as to obtain a capacitance value between the gap sensor 901 and the electrode 921.

The conventional leveling module is an automated system for adjusting the distance between the contact substrate 92 and the semiconductor wafer 900 or reference plate, and includes a motor 99 that rotates the nut 951 in response to a control signal from a controller 97. The controller 97 generates a control signal by calculating the measurement gap from the gap measuring instrument 98 so that the distance between the tips of the contactors 93 and the surface of the semiconductor wafer 900 being tested or the reference plate can be adjusted by the motor 99, i.e., the horizontal adjustment module can adjust the distance between the contact substrate 92 and the semiconductor wafer 900 so that all of the contactors 93 on the contact substrate 92 contact the surface of the semiconductor wafer 900 at substantially the same time with substantially the same pressure.

However, the conventional horizontal adjustment mechanism mainly includes only the combination of the motor 99, the screw 952 and the nut 951, so that the distance adjustment can be performed only in the height direction of each position of the horizontal adjustment mechanism, which is a change of a single degree of freedom, and if a horizontal displacement difference or an inclination angle change occurs between the contact substrate 92 and the semiconductor wafer 900, the horizontal adjustment mechanism of the single degree of freedom cannot meet the requirement, and there is still a great room for improvement.

The present invention is conceived based on the spirit of the active invention, and it is therefore an urgent need to provide a testing apparatus with a leveling module, which can solve the above problems.

Disclosure of Invention

The present invention provides a testing apparatus with a horizontal adjustment module, which changes the distance between an upper substrate and a lower substrate by the arrangement of the horizontal adjustment module, so as to further adjust the horizontal height of a probe card, maintain the level of each position in an optimal state, and avoid the worry that the probe card is damaged due to over-voltage caused by the inclination of the probe card.

To achieve the above object, the testing apparatus with a horizontal adjustment module of the present invention comprises a testing head, a testing interface and a prober. The test interface comprises an upper substrate, a lower substrate and a horizontal adjusting module, wherein the upper substrate is connected with the test head through a plurality of extension springs, so that the test interface is kept at a high position, and the test interface is prevented from colliding with a probe testing mechanism due to the fact that the test head is overturned and positioned. The horizontal adjusting module comprises a plurality of driving components, each driving component is respectively connected with the upper substrate and the lower substrate and comprises a driving motor and a universal joint for adjusting the space between the upper substrate and the lower substrate at different positions so as to change the horizontal height of the probe card relative to the test head. The prober bears a test interface, has a probe card capable of being connected with the lower substrate for detecting the quality of the wafer.

By means of the design, the lower substrate can be ejected out and driven to independently lift and fall each shaft by the combination mode of the driving motor and the universal joint, so that the probe height of a specific area of the probe card is adjusted, the integral probe point level reaches the required test specification, and the test quality of the probe tester is maintained.

The test equipment with the horizontal adjustment module can further comprise a buckling mechanism, wherein the buckling mechanism comprises a buckling motor, a sliding part with a guide groove element and a fixing part with a guide pillar element, the buckling motor is arranged on the upper substrate and can drive the sliding part to actuate, the fixing part is arranged on the needle test machine, the guide pillar element can slide in the guide groove element and drive the upper substrate, and the upper substrate can be in lap joint with the probe card. Therefore, the upper substrate can be adaptively floated to overlap the mechanism of the probe testing machine by matching with a pull-down stroke generated by the extension spring, and the probes of the probe card can be accurately aligned.

The lower substrate may be connected to a probe card by a carrier having a plurality of spring pin connectors. Therefore, the probe card can be electrically connected with the lower substrate through the plurality of spring pin connectors on the carrier plate to provide a transmission path of electric signals.

The driving assembly may further include a coupling block and a horizontal sliding member connecting the driving motor and the coupling block. Therefore, through the arrangement of the horizontal sliding piece, the degree of freedom of horizontal movement of the lower substrate can be effectively increased, and the lower substrate is prevented from generating structural damage in the fine adjustment process.

The connecting block may be provided with a stopping cylinder in which a stopping piston protruding to abut against the driving motor is accommodated. Therefore, after the driving motor finishes the horizontal adjustment of the probe card, the stop cylinder can convexly extend the stop piston to abut against the driving motor, so that the driving motor and the connecting block are positioned in an interlocking manner, and the phenomenon that the lower substrate deviates due to external force or vibration and further causes the needle point of the probe head to deviate is avoided.

The leveling module may include four driving components, including a first driving component, a second driving component, a third driving component and a fourth driving component. The first driving assembly, the second driving assembly and the fourth driving assembly may further include a connecting block and a horizontal sliding member connecting the driving motor and the connecting block, respectively. Therefore, only the third driving component is not provided with the connecting block and the horizontal sliding component, so that the third driving component can be used as a reference shaft to finely adjust other groups of driving components, and the horizontal adjustment of the probe card is achieved.

The prober may further include an image sensor. Therefore, the probe tester can measure the height value of the probe through the image sensor to serve as a basis for subsequently adjusting the level of the probe card, so that the probe tester can be conveniently finely adjusted to the required levelness and height position, and the test yield is further improved.

Both the foregoing general description and the following detailed description are exemplary and explanatory in nature to further illustrate the scope of the invention as claimed. Other objects and advantages of the present invention will become apparent from the following description and the accompanying drawings.

Drawings

FIG. 1 is a perspective view of a test apparatus with a leveling module according to a preferred embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a test apparatus with a leveling module according to a preferred embodiment of the present invention;

FIG. 3 is a schematic diagram of a test interface leveling process according to a preferred embodiment of the present invention;

FIG. 4 is a schematic view of a prior to being snapped by the snapping mechanism according to a preferred embodiment of the invention;

FIG. 5 is a schematic view of a fastening mechanism according to a preferred embodiment of the present invention;

FIG. 6 is a top view of a test apparatus with a leveling module in accordance with a preferred embodiment of the present invention;

FIG. 7 is a cross-sectional view of a third drive assembly in accordance with a preferred embodiment of the present invention;

FIG. 8 is a cross-sectional view of a first drive assembly in accordance with a preferred embodiment of the present invention;

FIG. 9 is a cross-sectional view of a second drive assembly in accordance with a preferred embodiment of the present invention;

FIG. 10 is a cross-sectional view of a fourth drive assembly in accordance with a preferred embodiment of the present invention;

FIGS. 11 and 12 are sectional views of a drive assembly having a stop cylinder in accordance with another preferred embodiment of the present invention;

fig. 13 is a perspective view of a conventional test apparatus having a leveling module.

[ description of reference ]

1 test device

2 test head

3 test interface

31 upper base plate

32 lower substrate

33 horizontal adjusting module

33a first drive assembly

33 a' first drive assembly

33b second drive assembly

33c third drive assembly

33d fourth drive assembly

331 driving motor

332 universal joint

333 connecting block

334 horizontal glide

334a slide rail

334b slide block

335 stop cylinder

336 stop piston

4-needle measuring machine

41 Probe card

5 extension spring

6 buckling mechanism

61 buckling motor

62 sliding part

621 guide groove element

63 fixing piece

631 guide post element

64 sliding rail assembly

7 support plate

71 spring pin connector

90 chuck

900 semiconductor wafer

901 gap sensor

91 test device

92 contact substrate

921 electrodes

93 contact device

94 conductive elastomer

95 support frame

951 screw cap

952 screw

96 probe card

97 controller

98 clearance measuring instrument

981 input terminal

99 motor

Detailed Description

Please refer to fig. 1 and fig. 2, which are a perspective view and a schematic structural diagram of a testing apparatus with a horizontal adjustment module according to a preferred embodiment of the present invention. The figure shows a testing device 1 with a horizontal adjustment module, which mainly comprises a testing head 2, a testing interface 3 and a probe testing machine 4, wherein after the testing head 2 is accurately lapped on the probe testing machine 4 through the testing interface 3, the testing device 1 can carry out subsequent testing operation on a wafer.

In the present embodiment, the test interface 3 is not only a simple interface board, but mainly includes an upper substrate 31, a lower substrate 32 and a leveling module 33. The upper substrate 31 is connected to the test head 2 by a plurality of extension springs 5, so that the test interface 3 is kept at a high position, and the test interface 3 is prevented from colliding with a probe testing mechanism due to the overturning and positioning of the test head 2. The leveling module 33 of the present invention includes four sets of driving components (a first driving component 33a, a second driving component 33b, a third driving component 33c and a fourth driving component 33 d). Each of the

driving elements

33a, 33b, 33c, 33d respectively connects the upper substrate 31 and the lower substrate 32, and includes a driving motor 331 and a universal joint 332 for adjusting the distance between the upper substrate 31 and the lower substrate 32 at different positions to achieve a substantially horizontal adjustment. In addition, the prober 4 carries the testing interface 3 and has a probe card 41 capable of being attached to the lower substrate 32. in this embodiment, the lower substrate 32 is connected to the probe card 41 by a carrier plate 7, and the carrier plate 7 has a plurality of spring pin connectors 71, so that the probe card 41 can be electrically connected to the lower substrate 32 through the spring pin connectors 71 on the carrier plate 7 to provide a transmission path for electrical signals.

Fig. 3 is a schematic diagram of a horizontal adjustment process of a test interface according to a preferred embodiment of the invention. As shown in the figure, in the process of adjusting the level of the test interface 3, the horizontal angle difference θ between the lower substrate 32 and the driving motor 331 is driven by the universal joint 332 to connect components with different angles at two ends, so that the level fine adjustment and the overall height position of the lower substrate 32 can be performed within a specific range, the test interface 3 and the probe card 41 can maintain the accurate needle point level and height position to press and contact the wafer, the height position and level can be accurately adjusted, and the test quality of the prober 4 can be maintained.

In addition, in order to ensure accurate alignment of the probes of the probe card 41, the present invention firstly uses a fastening mechanism 6 to firmly fix the test interface 3 on the probe machine 4, and then performs the subsequent horizontal adjustment procedure. The buckling mechanism 6 includes a buckling motor 61, a sliding member 62 and a fixing member 63, the buckling motor 61 is disposed on the upper substrate 31 and can drive the sliding member 62 to slide, the sliding member 62 has a guide slot element 621 and generates a transverse sliding displacement through a slide rail assembly 64, the fixing member 63 has a guide post element 631 disposed on the prober 4, wherein the guide post element 631 can slide in the guide slot element 621 and cooperate with a pull-down stroke generated by the tension spring 5 to make the upper substrate 31 adaptively float and lap on the prober 4, thereby ensuring accurate alignment of the probes of the probe card 41. Please refer to fig. 4 and fig. 5, which are a schematic diagram before and a schematic diagram after the card buckling of the card buckling mechanism according to a preferred embodiment of the present invention. As shown in fig. 4, before the chucking of the chucking mechanism 6, the upper substrate 31 is pulled only by the tension of the tension spring 5, and still assumes a floating state in the upper position. As shown in fig. 5, after the latch mechanism 6 is latched, the upper substrate 31 is pulled down by the latch mechanism 6, and the guide post 631 slides along the guide slot 621, so as to ensure that the test head 2 can be accurately mounted on the prober 4.

Fig. 6 to 10 are a top view, a cross-sectional view of a third driving assembly and a cross-sectional view of a first driving assembly, a second driving assembly and a fourth driving assembly, respectively, according to a preferred embodiment of the present invention. As shown in fig. 6, the horizontal adjustment module 33 of the present invention includes four sets of driving components (a first driving component 33a, a second driving component 33b, a third driving component 33c and a fourth driving component 33d), wherein, as shown in fig. 7, the third driving component 33c includes only a driving motor 331 and a universal joint 332, so that it has a degree of freedom for displacement in the height direction and can finely adjust other components by using the third driving component 33c as a reference axis; as shown in fig. 8 to 10, the first driving assembly 33a, the second driving assembly 33b and the fourth driving assembly 33d respectively have a driving motor 331 and a universal joint 332, and further include a connecting block 333 and a horizontal sliding member 334, wherein the connecting block 333 is provided with the horizontal sliding member 334, the horizontal sliding member 334 has a sliding block 334a and a sliding rail 334b, and the sliding block 334a and the sliding rail 334b of the horizontal sliding member 334 are respectively connected to the driving motor 331 and the connecting block 333. Therefore, the first driving assembly 33a, the second driving assembly 33b and the fourth driving assembly 33d of the present invention can have 5 degrees of Freedom (DOF) such as translational degrees of Freedom in the height direction, the horizontal direction and rotational degrees of Freedom in two-axis rotation by means of the driving motor 331, the horizontal slider 334 and the universal joint 332, so that the test interface 3 can be precisely aligned with the probe card 41, the test apparatus 1 can perform a test in an optimal horizontal state, and the probe card 41 is prevented from being damaged by an overpressure caused by a tilt of the probe card 41, wherein the adjustment process can utilize a program to limit the height difference within 2 mm, thereby ensuring a safe operation range of the mechanism.

Fig. 11 and 12 are sectional views of a driving assembly with a stop cylinder according to another preferred embodiment of the present invention. As shown in the figure, in the present embodiment, the first driving component 33 a' (the second driving component and the fourth driving component are the same) includes the aforementioned driving motor 331, the universal joint 332, the connecting block 333 and the horizontal sliding member 334, and a stopping cylinder 335 is further disposed in the connecting block 333, and a stopping piston 336 capable of protruding and abutting against the driving motor 331 is accommodated therein for locking the respective positioning of each driving component, so that the testing apparatus 1 maintains the adjusted horizontal state. As shown in fig. 11, before the test interface 3 is horizontally positioned, the stopping piston 336 does not protrude and abut against the driving motor 331, so that the driving motor 331 can still push the lower substrate 32 for adjustment, and the adjustability of the structure is maintained; as shown in fig. 12, when the test interface 3 is horizontally positioned, the stopping piston 336 protrudes and abuts against the driving motor 331, so that the driving motor 331 can not push the lower substrate 32 for adjustment, and the driving motor 331 and the connecting block 333 are interlocked for positioning, thereby preventing the lower substrate 32 from shifting due to external force or vibration, and further preventing the needle point of the probe head from shifting.

Finally, the present invention can add an image sensor in the prober 4. in this embodiment, a CCD image sensor (not shown) is installed to determine whether to adjust the level of the probe card 41 by the level adjusting module after the CCD image sensor passes through the height value of the image measuring probe, so as to prevent the probe from being deformed due to over-pressure of the probe and ensure good testing quality.

The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A test equipment with a level adjustment module, comprising:

a test head;

A test interface includes an upper substrate, a lower substrate and a leveling module, the upper substrate is connected to the test head by a plurality of tension springs, the leveling module includes a plurality of driving components, and each driving component is connected to the upper The base plate and the lower base plate include a drive motor and a universal joint for adjusting the distance between the upper base plate and the lower base plate at different positions; and

A needle testing machine, which carries the testing interface, has a probe card that can be overlapped with the lower substrate.

2 . The testing device with a leveling module as claimed in claim 1 , further comprising a buckle mechanism, the buckle mechanism comprising a buckle motor, a slider with a guide groove element, and a guide column with a guide post. 3 . The fixing piece of the component, the buckle motor is arranged on the upper base plate and can drive the sliding piece to act, the fixing piece is arranged on the needle measuring machine, the guide post element can slide in the guide groove element, and drives the the upper substrate, so that the upper substrate can indeed overlap and fix the probe card.

3 . The test equipment with a leveling module as claimed in claim 1 , wherein the lower substrate is connected to the probe card by a carrier board, and the carrier board has a plurality of pogo pin connectors. 4 .

4 . The testing device with a leveling module as claimed in claim 1 , wherein the driving assembly further comprises a connecting block and a horizontal sliding member connecting the driving motor and the connecting block. 5 .

5 . The testing apparatus with a leveling module as claimed in claim 4 , wherein the connecting block is provided with a stopper cylinder, and a stopper piston that can protrude and interfere with the drive motor is accommodated therein. 6 .

6. The test equipment with a level adjustment module as claimed in claim 1, wherein the level adjustment module comprises four drive assemblies, including a first drive assembly, a second drive assembly, a third drive assembly and a first drive assembly Four-drive assembly.

7 . The test equipment with a leveling module as claimed in claim 6 , wherein the first drive assembly, the second drive assembly and the fourth drive assembly further comprise a connection block and a connection between the drive motor and the fourth drive assembly. 8 . Horizontal skids for connecting blocks.

8 . The testing device with a leveling module as claimed in claim 7 , wherein the leveling member has a sliding block and a sliding rail, which are respectively connected to the driving motor and the connecting block. 9 .

9 . The testing device with a leveling module as claimed in claim 1 , wherein the needle testing machine further comprises an image sensor. 10 .