CN114002790A - Optical module - Google Patents
Optical module Download PDFInfo
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- CN114002790A CN114002790A CN202111436693.5A CN202111436693A CN114002790A CN 114002790 A CN114002790 A CN 114002790A CN 202111436693 A CN202111436693 A CN 202111436693A CN 114002790 A CN114002790 A CN 114002790A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 381
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 79
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 79
- 239000010703 silicon Substances 0.000 claims abstract description 79
- 239000000758 substrate Substances 0.000 claims abstract description 78
- 239000013307 optical fiber Substances 0.000 claims abstract description 43
- 238000005538 encapsulation Methods 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 4
- 238000013461 design Methods 0.000 abstract description 6
- 238000004891 communication Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 239000000306 component Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4215—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The application is suitable for the technical field of communication, and provides an optical module which comprises a PCB (printed circuit board), an optical transceiver chip, a first driving chip, a second driving chip and a control chip. The optical transceiver chip integrates the optical transmitter, the optical combiner, the optical fiber output device, the optical fiber input device, the optical splitter and the optical receiver on the silicon optical substrate, so that the miniaturization design of the optical transceiver chip is facilitated, the size of the optical module can be reduced, and the miniaturization design of the optical module is realized.
Description
Technical Field
The application belongs to the technical field of communication, and particularly relates to an optical module.
Background
The core component of an optical communication product is an optical module, which generally refers to an integrated module for photoelectric conversion, and can convert an optical signal into an electrical signal or convert an electrical signal into an optical signal, and plays an important role in the field of optical communication. The existing optical module has the defect of large volume.
Disclosure of Invention
The embodiment of the application provides an optical module, which can solve the problem of large size of the optical module.
An embodiment of the present application provides an optical module, including:
a PCB board;
the optical transceiver chip is mounted on the PCB and comprises a silicon optical substrate, an optical transmitter, an optical combiner, an optical fiber output device, an optical fiber input device, an optical splitter and an optical receiver are integrated on the silicon optical substrate, and the optical transmitter and the optical receiver are respectively and electrically connected with the silicon optical substrate; the optical transmitter is used for receiving a first electric signal through the silicon optical substrate and converting the first electric signal into a first optical signal; the optical combiner is used for receiving the first optical signal and carrying out light combination processing on the first optical signal; the optical fiber output device is used for outputting a first optical signal after light combination; the optical fiber input device is used for receiving a second optical signal; the optical splitter is used for splitting the second optical signal; the optical receiver is used for converting the second optical signal after light splitting into a second electric signal and outputting the second electric signal through the silicon optical substrate;
the first driving chip is installed on the PCB and electrically connected with the light emitter, and the driver chip is used for sending a first electric signal according to a first control instruction;
the second driving chip is installed on the PCB and electrically connected with the optical receiver, and is used for receiving the second electric signal, processing the second electric signal and then sending the second electric signal;
and the control chip is installed on the PCB and is respectively electrically connected with the first driving chip and the second driving chip, and the control chip is used for sending a first control instruction to the first driving chip and is also used for receiving a second electric signal processed by the second driving chip.
In one possible implementation, the optical transmitter is flip-chip mounted on the silicon optical substrate, and the optical receiver is flip-chip mounted on the silicon optical substrate.
In a possible implementation manner, a first electrode unit is disposed on a surface of the silicon optical substrate, a first optical waveguide is disposed inside the silicon optical substrate, a plurality of electrodes in the first electrode unit are electrically connected to a plurality of electrodes on the optical transmitter correspondingly, a first end of the first optical waveguide is directly opposite to a light outlet of the optical transmitter, and a second end of the first optical waveguide is directly opposite to a light inlet of the optical combiner, so that the first optical signal sent by the light outlet of the optical transmitter enters the optical combiner through the first optical waveguide.
In a possible implementation manner, a first pin unit for electrically connecting with the PCB is further disposed on the silicon optical substrate, a plurality of pins in the first pin unit are electrically connected with a plurality of electrodes in the first electrode unit correspondingly, and a plurality of pins in the first pin unit are electrically connected with a plurality of electrodes in the first electrode unit correspondingly.
In a possible implementation manner, a first groove is further disposed on the silicon optical substrate, and the light emitter is disposed in the first groove.
In a possible implementation manner, a second electrode unit, a second optical waveguide and a reflector are disposed on the silicon optical substrate, the second electrode unit is disposed on a surface of the silicon optical substrate, the second optical waveguide is disposed inside the silicon optical substrate, a plurality of electrodes in the second electrode unit are electrically connected to a plurality of electrodes on the optical receiver, a light inlet of the optical receiver and a first end of the second optical waveguide are respectively opposite to a reflection surface of the reflector, and a second end of the second optical waveguide is opposite to the optical splitter, so that the split second optical signal output by the optical splitter enters the optical receiver through the second optical waveguide and the reflector.
In a possible implementation manner, a second groove is further formed in the silicon optical substrate, the reflector is arranged in the second groove, the first end of the second optical waveguide is just opposite to the reflecting surface of the reflector, the optical receiver is arranged above the second groove, and the light inlet of the optical receiver is just opposite to the reflecting surface of the reflector.
In a possible implementation manner, a second pin unit for electrically connecting with the PCB is further disposed on the silicon optical substrate, a plurality of pins in the second pin unit are electrically connected with a plurality of electrodes in the second electrode unit correspondingly, and a plurality of pins in the second pin unit are electrically connected with a plurality of electrodes in the second electrode unit correspondingly.
In a possible implementation manner, a limiting structure is disposed on the silicon optical substrate, and the limiting structure is configured to perform position limitation on the light emitter, the optical combiner, the optical fiber output device, the optical fiber input device, the optical splitter, and the light receiver on the silicon optical substrate.
In one possible implementation, the optical transceiver further includes an encapsulation layer, and the encapsulation layer is used for encapsulating the optical transmitter, the optical combiner, the optical fiber output, the optical fiber input, the optical splitter, and the optical receiver on the silicon optical substrate.
Compared with the prior art, the embodiment of the application has the advantages that:
the optical module that this application embodiment provided includes PCB board, light transceiver chip, first driver chip, second driver chip and control chip. The optical transceiver chip integrates the optical transmitter, the optical combiner, the optical fiber output device, the optical fiber input device, the optical splitter and the optical receiver on the silicon optical substrate, so that the miniaturization design of the optical transceiver chip is facilitated, the size of the optical module can be reduced, and the miniaturization design of the optical module is realized.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of an optical module according to an embodiment of the present application;
fig. 2 is a schematic diagram of an optical transceiver chip according to an embodiment of the present application;
FIG. 3 is a schematic view of an installation of a light emitter provided by an embodiment of the present application;
fig. 4 is a schematic installation diagram of an optical receiver according to an embodiment of the present application.
In the figure: 100. an optical transceiver chip; 101. a silicon photobase; 102. a light emitter; 103. an optical combiner; 104. an optical fiber follower; 105. an optical fiber input device; 106. an optical splitter; 107. an optical receiver; 108. an electrode; 109. a first optical waveguide; 110. a first groove; 111. a second optical waveguide; 112. a mirror; 113. a second groove; 200. a PCB board; 300. a first driver chip; 400. a second driver chip; 500. and a control chip.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It should also be understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
As used in the specification of this application and the appended claims, the term "if" may be interpreted contextually as "when …" or "upon" or "in response to a determination" or "in response to a detection". Similarly, the phrase "if it is determined" or "if a [ described condition or event ] is detected" may be interpreted contextually to mean "upon determining" or "in response to determining" or "upon detecting [ described condition or event ]" or "in response to detecting [ described condition or event ]".
Furthermore, in the description of the present application and the appended claims, the terms "first," "second," "third," and the like are used for distinguishing between descriptions and not necessarily for describing or implying relative importance.
Reference throughout this specification to "one embodiment" or "some embodiments," or the like, means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather "one or more but not all embodiments" unless specifically stated otherwise. The terms "comprising," "including," "having," and variations thereof mean "including, but not limited to," unless expressly specified otherwise.
Fig. 1 shows a schematic structural diagram of an optical module according to an embodiment of the present application. Referring to fig. 1, the optical module includes an optical transceiver chip 100, a PCB board 200, a first driving chip 300, a second driving chip 400, and a control chip 500. The optical transceiver chip 100, the first driver chip 300, the second driver chip 400, and the control chip 500 are integrated on the PCB board 200.
The optical transceiver chip 100 includes a silicon optical substrate 101, an optical transmitter 102, an optical combiner 103, an optical fiber output 104, an optical fiber input 105, an optical splitter 106, and an optical receiver 107 are integrated on the silicon optical substrate 101, and the optical transmitter 102 and the optical receiver 107 are electrically connected to the silicon optical substrate 101, respectively. The first driving chip 300 is electrically connected to the light emitter 102, the second driving chip 400 is electrically connected to the light receiver 107, and the control chip 500 is electrically connected to the first driving chip 300 and the second driving chip 400, respectively.
The control chip 500 is electrically connected to the first driving chip 300 and the second driving chip 400, respectively, and the optical transceiver chip 100 is electrically connected to the first driving chip 300 and the second driving chip 400, respectively. The control chip 500 sends a first control instruction to the first driver, and the first driver sends a first electrical signal according to the first control instruction. The optical transmitter 102 receives the first electrical signal through the silicon optical substrate 101, converts the first electrical signal into a first optical signal, and transmits the first optical signal to the optical combiner 103. After receiving the first optical signal, the optical combiner 103 combines the first optical signal, and then transmits the combined first optical signal to the optical fiber outputter 104, where the optical fiber outputter 104 is configured to output the combined first optical signal to an external device. Thus, the optical module realizes the emission of optical signals.
The optical fiber input device 105 is configured to receive the second optical signal and transmit the second optical signal to the optical splitter 106. The optical splitter 106 performs a splitting process on the second optical signal, and transmits the split second optical signal to the optical receiver 107. The optical receiver 107 converts the split second optical signal into a second electrical signal, and transmits the second electrical signal to the second driving chip 400 through the silicon optical substrate 101. The second driving chip 400 processes the second signal and transmits the processed second electrical signal to the control chip 500. Thus, the optical module realizes the reception of the optical signal.
The optical transceiver chip 100 integrates the optical transmitter 102, the optical combiner 103, the optical fiber output 104, the optical fiber input 105, the optical splitter 106, and the optical receiver 107 on the silicon optical substrate 101, which is beneficial to realizing the miniaturization design of the optical transceiver chip 100, and further can reduce the volume of the optical module and realize the miniaturization design of the optical module.
Illustratively, the optical transmitter 102 is a direct modulation laser and the optical receiver 107 is a photodiode.
In one embodiment of the present application, the optical transmitter 102 is flip-chip mounted on the silicon optical substrate 101 and the optical receiver 107 is flip-chip mounted on the silicon optical substrate 101.
Specifically, the optical transmitter 102 and the optical receiver 107 are both mounted on the silicon optical substrate 101 by using a flip-chip process, and the optical transmitter 102 and the optical receiver 107 can be electrically connected to the silicon optical substrate 101 well, so that the optical transmitter 102 and the optical receiver 107 can be respectively connected to external devices connected to the silicon optical substrate 101 to transmit electrical signals.
Fig. 2 shows a schematic mounting diagram of the light emitter 102 provided in an embodiment of the present application. Referring to fig. 2, a first electrode unit is disposed on a surface of the silicon optical substrate 101, a first optical waveguide 109 is disposed inside the silicon optical substrate 101, a plurality of electrodes 108 in the first electrode unit are electrically connected to a plurality of electrodes 108 on the optical transmitter 102, a first end of the first optical waveguide 109 faces a light exit of the optical transmitter 102, and a second end of the first optical waveguide 109 faces a light entrance of the optical combiner 103, so that a first optical signal emitted from the light exit of the optical transmitter 102 enters the optical combiner 103 through the first optical waveguide 109.
Specifically, the plurality of electrodes 108 on the light emitter 102 are connected to the plurality of electrodes 108 in the first electrode unit on the silicon optical substrate 101 in a one-to-one correspondence manner, so as to realize the electrical connection between the light emitter 102 and the silicon optical substrate 101. After the silicon optical substrate 101 is electrically connected to an external device, a first electrical signal sent by the external device is transmitted to the light emitter 102 through the silicon optical substrate 101. The optical transmitter 102 generates a first optical signal according to the first electrical signal, and the first optical signal is emitted through the light outlet of the optical transmitter 102.
Since the first end of the first optical waveguide 109 faces the light outlet of the light emitter 102, the second end of the first optical waveguide 109 faces the light inlet of the optical combiner 103. The first optical signal emitted by the optical transmitter 102 can enter the optical combiner 103 through the first optical waveguide 109. Thus, the optical transmitter 102 can receive the first electrical signal through the silicon optical substrate 101 and output the first optical signal according to the first electrical signal.
In an embodiment of the present application, a first pin unit for electrically connecting with an external device is further disposed on the silicon optical substrate 101, a plurality of pins in the first pin unit are electrically connected with the plurality of electrodes 108 in the first electrode unit correspondingly, and a plurality of pins in the first pin unit are electrically connected with the plurality of electrodes 108 in the first electrode unit correspondingly.
Thus, the silicon optical substrate 101 corresponds to a conductive medium, the light emitter 102 is electrically connected to an external device through the silicon optical substrate 101, and the light emitter 102 can receive a first electrical signal transmitted from the external device through the silicon optical substrate 101.
In an embodiment of the present application, a first groove 110 is further disposed on the silicon optical substrate 101, and the light emitter 102 is disposed in the first groove 110.
Specifically, since the first optical waveguide 109 is disposed inside the silicon optical substrate 101, the first groove 110 is disposed on the silicon optical substrate 101, and the optical transmitter 102 is disposed in the first groove 110, so that the light outlet of the optical transmitter 102 is directly opposite to the first optical waveguide 109, and the first optical signal emitted by the optical transmitter 102 can completely enter the first optical waveguide 109 for transmission. Meanwhile, the light emitter 102 is installed inside the first groove 110, which is helpful for improving the stability of the installation of the light emitter 102, thereby improving the stability of the whole optical transceiver.
In one embodiment of the present application, the optical combiner 103 and the optical fiber follower 104 are connected by an optical waveguide to realize transmission of an optical signal.
Fig. 3 shows a schematic installation diagram of the optical receiver 107 provided in an embodiment of the present application. Referring to fig. 3, a second electrode unit, a second optical waveguide 111 and a reflector 112 are arranged on the silicon optical substrate 101, the second electrode unit is arranged on the surface of the silicon optical substrate 101, the second optical waveguide 111 is arranged inside the silicon optical substrate 101, a plurality of electrodes 108 in the second electrode unit are correspondingly and electrically connected with a plurality of electrodes 108 on the optical receiver 107, the light inlet of the optical receiver 107 and the first end of the second optical waveguide 111 are respectively opposite to the reflecting surface of the reflector 112, and the second end of the second optical waveguide 111 is opposite to the optical splitter 106, so that the split second optical signal output by the optical splitter 106 enters the optical receiver 107 through the second optical waveguide 111 and the reflector 112.
Specifically, the second optical signal output by the optical splitter 106 passes through the second optical waveguide 111 and reaches the reflecting surface of the reflecting mirror 112. The reflective surface of the mirror 112 reflects the second optical signal. Since the light inlet of the optical receiver 107 and the first end of the second optical waveguide 111 are respectively opposite to the reflecting surface of the reflector 112, the reflected second optical signal is received by the optical receiver 107 through the light inlet of the optical receiver 107. The optical receiver 107 generates a second electrical signal from the second optical signal, and the second electrical signal is transmitted to an external device through the silicon optical substrate 101, whereby the optical receiver 107 realizes reception of the optical signal.
In an embodiment of the present application, a second groove 113 is further disposed on the silicon optical substrate 101, the reflector 112 is disposed in the second groove 113, the first end of the second optical waveguide 111 faces the reflective surface of the reflector 112, the optical receiver 107 is disposed above the second groove 113, and the light inlet of the optical receiver 107 faces the reflective surface of the reflector 112.
Specifically, the reflector 112 is disposed in the second groove 113, so that the stability of the installation of the reflector 112 can be improved, and the reflector 112 can be protected. The light receiver 107 is disposed above the second groove 113, and the light inlet of the light receiver 107 is directly opposite to the reflecting surface of the reflector 112, so that the light reflected by the reflecting surface of the reflector 112 can enter the light receiver 107 through the light inlet, and the light receiver 107 receives the second optical signal.
In an embodiment of the present application, a second pin unit for electrically connecting with an external device is further disposed on the silicon optical substrate 101, a plurality of pins in the second pin unit are electrically connected with a plurality of electrodes 108 in the second electrode unit correspondingly, and a plurality of pins in the second pin unit are electrically connected with a plurality of electrodes 108 in the second electrode unit correspondingly.
Thus, the silicon optical substrate 101 corresponds to a conductive medium, and the optical receiver 107 is electrically connected to an external device through the silicon optical substrate 101. The optical receiver 107 can transmit the second electrical signal to an external device through the silicon optical substrate 101, so as to realize transmission of the second electrical signal.
In one embodiment of the present application, the optical fiber input device 105 and the optical splitter 106 are connected by an optical waveguide, so as to realize transmission of optical signals.
In an embodiment of the present application, the silicon optical substrate 101 is provided with a position limiting structure, and the position limiting structure is used for performing position limitation on the light emitter 102, the optical combiner 103, the optical fiber output 104, the optical fiber input 105, the optical splitter 106, and the optical receiver 107 on the silicon optical substrate 101.
Specifically, when the optical transceiver is installed, the position limiting structure can limit the positions of the optical transmitter 102, the optical combiner 103, the optical fiber follower 104, the optical fiber input device 105, the optical splitter 106 and the optical receiver 107, so that the optical transmitter 102, the optical combiner 103, the optical fiber follower 104, the optical fiber input device 105, the optical splitter 106 and the optical receiver 107 are prepared in positions and can respectively face the corresponding optical waveguides, and good optical communication is realized.
In one embodiment of the present application, the optical transceiver further includes an encapsulation layer for encapsulating the optical transmitter 102, the optical combiner 103, the optical fiber output 104, the optical fiber input 105, the optical splitter 106, and the optical receiver 107 on the silicon optical substrate 101.
Specifically, after the optical transmitter 102, the optical combiner 103, the optical fiber output device 104, the optical fiber input device 105, the optical splitter 106, and the optical receiver 107 are mounted on the silicon optical substrate 101, they are packaged by a packaging layer, so that the optical transceiver forms an integrated device. The encapsulation layer can protect the optical transmitter 102, the optical combiner 103, the optical fiber output device 104, the optical fiber input device 105, the optical splitter 106 and the optical receiver 107, and improve the overall stability of the optical transceiver.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.
Claims (10)
1. A light module, comprising:
a PCB board;
the optical transceiver chip is mounted on the PCB and comprises a silicon optical substrate, an optical transmitter, an optical combiner, an optical fiber output device, an optical fiber input device, an optical splitter and an optical receiver are integrated on the silicon optical substrate, and the optical transmitter and the optical receiver are respectively and electrically connected with the silicon optical substrate; the optical transmitter is used for receiving a first electric signal through the silicon optical substrate and converting the first electric signal into a first optical signal; the optical combiner is used for receiving the first optical signal and carrying out light combination processing on the first optical signal; the optical fiber output device is used for outputting a first optical signal after light combination; the optical fiber input device is used for receiving a second optical signal; the optical splitter is used for splitting the second optical signal; the optical receiver is used for converting the second optical signal after light splitting into a second electric signal and outputting the second electric signal through the silicon optical substrate;
the first driving chip is installed on the PCB and electrically connected with the light emitter, and the driver chip is used for sending a first electric signal according to a first control instruction;
the second driving chip is installed on the PCB and electrically connected with the optical receiver, and is used for receiving the second electric signal, processing the second electric signal and then sending the second electric signal;
and the control chip is installed on the PCB and is respectively electrically connected with the first driving chip and the second driving chip, and the control chip is used for sending a first control instruction to the first driving chip and is also used for receiving a second electric signal processed by the second driving chip.
2. The optical module of claim 1, wherein the optical transmitter is flip-chip mounted on the silicon optical substrate and the optical receiver is flip-chip mounted on the silicon optical substrate.
3. The optical module according to claim 1, wherein a first electrode unit is disposed on a surface of the silicon optical substrate, a first optical waveguide is disposed inside the silicon optical substrate, a plurality of electrodes in the first electrode unit are electrically connected to a plurality of electrodes on the optical transmitter, a first end of the first optical waveguide faces a light outlet of the optical transmitter, and a second end of the first optical waveguide faces a light inlet of the optical combiner, so that the first optical signal emitted from the light outlet of the optical transmitter enters the optical combiner through the first optical waveguide.
4. The optical module according to claim 3, wherein a first pin unit is further disposed on the silicon optical substrate for electrically connecting with the PCB, a plurality of pins in the first pin unit are electrically connected with a plurality of electrodes in the first electrode unit correspondingly, and a plurality of pins in the first pin unit are electrically connected with a plurality of electrodes in the first electrode unit correspondingly.
5. The optical module of claim 3, wherein the silicon optical substrate further comprises a first groove, and the light emitter is disposed in the first groove.
6. The optical module according to claim 1, wherein a second electrode unit, a second optical waveguide and a reflector are disposed on the silicon optical substrate, the second electrode unit is disposed on a surface of the silicon optical substrate, the second optical waveguide is disposed inside the silicon optical substrate, a plurality of electrodes in the second electrode unit are electrically connected to a plurality of electrodes on the optical receiver, the light inlet of the optical receiver and the first end of the second optical waveguide are respectively opposite to the reflective surface of the reflector, and the second end of the second optical waveguide is opposite to the optical splitter, so that the split second optical signal output by the optical splitter enters the optical receiver through the second optical waveguide and the reflector.
7. The optical module according to claim 6, wherein a second groove is further formed on the silicon optical substrate, the reflector is disposed in the second groove, the first end of the second optical waveguide faces the reflecting surface of the reflector, the optical receiver is disposed above the second groove, and the light inlet of the optical receiver faces the reflecting surface of the reflector.
8. The optical module according to claim 6, wherein a second pin unit is further disposed on the silicon optical substrate for electrically connecting with the PCB, and a plurality of pins in the second pin unit are electrically connected with a plurality of electrodes in the second electrode unit correspondingly.
9. The optical module according to any one of claims 1 to 8, wherein a position limiting structure is disposed on the silicon optical substrate, and the position limiting structure is used for position limitation of the optical transmitter, the optical combiner, the optical fiber output, the optical fiber input, the optical splitter and the optical receiver on the silicon optical substrate.
10. The optical transceiver of any one of claims 1 to 8, further comprising an encapsulation layer for encapsulating the optical transmitter, the optical combiner, the optical fiber output, the optical fiber input, the optical splitter, and the optical receiver on the silicon optical substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111436693.5A CN114002790A (en) | 2021-11-29 | 2021-11-29 | Optical module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111436693.5A CN114002790A (en) | 2021-11-29 | 2021-11-29 | Optical module |
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| CN114002790A true CN114002790A (en) | 2022-02-01 |
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| CN202111436693.5A Pending CN114002790A (en) | 2021-11-29 | 2021-11-29 | Optical module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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