CN114001794A - Storage container stock measuring device, control and measuring method, device and medium - Google Patents
Storage container stock measuring device, control and measuring method, device and medium Download PDFInfo
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- CN114001794A CN114001794A CN202011596448.6A CN202011596448A CN114001794A CN 114001794 A CN114001794 A CN 114001794A CN 202011596448 A CN202011596448 A CN 202011596448A CN 114001794 A CN114001794 A CN 114001794A
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- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
- G01F23/14—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measurement of pressure
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Abstract
The invention discloses a storage container stock measuring device and a control method and device thereof as well as a storage medium, wherein the measuring device comprises a semiconductor strain gauge, a resistance measuring module, a sampling module and a processing module, the semiconductor strain gauge has resistance strain characteristics, the resistance measuring module measures the resistance of the semiconductor strain gauge, the sampling module samples the measuring result of the resistance measuring module, and the processing module is used for processing the sampling result of the sampling module to obtain the measuring result of the storage container stock. The semiconductor strain gauge is used independently of articles stored in the storage container, so that the semiconductor strain gauge is suitable for articles made of various materials, the contact area between the semiconductor strain gauge and the stressed deformation part of the storage container is small, temperature change interference between the semiconductor strain gauge and the stressed deformation part of the storage container due to the fact that the thermal expansion coefficient, the elastic modulus and the thermal conductivity coefficient are inconsistent is small, and the measurement accuracy can be improved. The invention is widely applied to the technical field of measuring devices.
Description
Technical Field
The invention relates to the technical field of measuring devices, in particular to a storage container stock measuring device, a control method, a measuring device and a storage medium.
Background
In the fields of industry, agriculture, and the like, storage containers such as large silos are often used to store materials, crops, and the like, and in order to measure the stock of the materials stored in the storage containers without taking out the materials, methods such as a radar reflection method, a microwave reflection method, a weight ranging method, and a pull rope ranging method have been used in the related art. The radar reflection method and the microwave reflection method estimate the storage amount of the objects by judging the height of the objects through the reflection distance of the interface of the objects, but when the objects stored in the storage container are powdery materials, the objects are always in a suspension state in the feeding process, the interface is fuzzy, and powder is slowly accumulated on equipment, which seriously affects the measurement accuracy of the radar reflection method and the microwave reflection method. The heavy hammer distance measurement method and the pull rope distance measurement method both rely on a heavy object to be hung on the surface of the powdery material for distance measurement to estimate the stock of the material, but when the material stored in a storage container is not the powdery material or the powdery material is sometimes tight and sometimes loose, phenomena such as hammer burying or rope burying are easy to occur, and accurate measurement results are difficult to obtain.
Disclosure of Invention
In view of at least one of the above-described problems, it is an object of the present invention to provide a storage container stock quantity measuring device, a control method and device thereof, and a storage medium.
In one aspect, embodiments of the invention include a storage vessel inventory measuring device, comprising:
a semiconductor strain gauge; the semiconductor strain gauge has resistance strain characteristics and is used for being stuck to a stressed deformation part of the storage container;
a resistance measurement module; the input end of the resistance measuring module is connected with the output end of the semiconductor strain gauge, and the resistance measuring module is provided with an excitation end; the resistance measuring module is used for measuring the resistance of the semiconductor strain gauge;
a sampling module; the input end of the sampling module is connected with the output end of the resistance measuring module; the sampling module is used for sampling the measurement result of the resistance measurement module;
a processing module; the input end of the processing module is connected with the output end of the sampling module; the processing module is used for processing the sampling result of the sampling module to obtain the measuring result of the storage container stock.
Further, the semiconductor strain gauge includes:
a substrate;
a first semiconductor silicon strip; the first semiconductor silicon strip is arranged on one surface of the substrate or in the substrate;
a second semiconductor silicon strip; the second semiconductor silicon strip is arranged on one surface of the substrate or in the substrate;
the first semiconductor silicon strip is connected in series with the second semiconductor silicon strip.
Further, the first semiconductor silicon strip and the second semiconductor silicon strip have the same size and electrical parameters.
Further, the projections of the first semiconductor and the second semiconductor on the substrate are perpendicular to each other.
Further, the resistance measurement module comprises a first resistance and a second resistance; the first resistor, the second resistor, the first semiconductor silicon strip and the second semiconductor silicon strip are connected to form a Wheatstone bridge; and a first end and a second end in the wheatstone bridge are used as output ends of the resistance measurement module, and a third end and a fourth end in the wheatstone bridge are used as excitation ends of the resistance measurement module, wherein the first end is a connection point of the first semiconductor silicon strip and the second semiconductor silicon strip, the second end is a connection point of the first resistor and the second resistor, and the third end and the fourth end are two ports except the first end and the second end of four ports formed by the wheatstone bridge.
On the other hand, the embodiment of the invention also comprises a control method of the storage container inventory measuring device, which comprises the following steps:
the resistance measurement module acquires an excitation voltage V from a voltage source;
the sampling module acquires the output voltage U of the resistance measuring module;
the sampling module sends the excitation voltage V and the output voltage U to the processing module;
the processing module searches the pre-stored output voltage U when empty0And a weight mapping coefficient X;
the processing module uses the formula M ═ X · (U-U)0) A stock measurement M of the storage vessel is calculated.
In another aspect, an embodiment of the present invention further includes a method for measuring storage container inventory, including:
acquiring a storage container stock measuring device;
polishing the stressed deformation part of the storage container;
using quick-drying weather-resistant glue to adhere the semiconductor strain gauge to the stressed deformation part of the storage container;
covering and protecting the surfaces of the semiconductor strain gauge and the resistance measurement module by using silicon rubber;
the resistance measuring module, the sampling module and the processing module are started, the resistance measuring module is used for measuring the resistance of the semiconductor strain gauge, the sampling module is used for sampling the measuring result of the resistance measuring module, and the processing module is used for processing the sampling result of the sampling module to obtain the measuring result of the storage container storage amount.
In another aspect, an embodiment of the present invention further includes a computer apparatus, including a memory and a processor, where the memory is used to store at least one program, and the processor is used to load the at least one program to execute the control method in the embodiment.
In another aspect, the present invention further includes a storage medium in which a program executable by a processor is stored, the program executable by the processor being configured to perform the control method in the embodiments when executed by the processor.
The invention has the beneficial effects that: the storage container stock quantity measuring device in the embodiment measures the stock quantity of the stored articles in the storage container by the deformation of the deformed portion of the storage container, and is used independently of the stored articles in the storage container, and therefore is suitable for articles of various materials. Because the area of each semiconductor strain gauge can be made to be small, the contact area between the semiconductor strain gauge and the stress deformation part of the storage container is small, temperature change interference between the semiconductor strain gauge and the stress deformation part of the storage container due to the fact that the thermal expansion coefficient, the elastic modulus and the thermal conductivity coefficient are inconsistent is small, and the measurement accuracy can be improved.
Drawings
FIG. 1 is a schematic view showing the construction of a storage vessel inventory measuring device in an embodiment;
FIG. 2 is a schematic structural diagram of a semiconductor strain gage and a resistance measurement module in an embodiment.
Detailed Description
In the present embodiment, referring to fig. 1, the measuring device for measuring the stock of the storage container includes a semiconductor strain gauge, a resistance measuring module, a sampling module, and a processing module.
In this embodiment, the semiconductor strain gauge has a resistance strain characteristic, and is attached to a portion of the storage container that is deformed by a force when the measuring device is used. Wherein, if the storage container has supporting legs, the supporting legs are the stressed deformation parts of the storage container, and if the storage container has no supporting legs, the bottommost surrounding edge of the storage container is the stressed deformation parts of the storage container.
In this embodiment, referring to fig. 1, an input end of the resistance measurement module is connected to an output end of the semiconductor strain gauge. The resistance measuring module is used for measuring the resistance of the semiconductor strain gauge.
In this embodiment, referring to fig. 1, an input end of a sampling module is connected to an output end of a resistance measurement module; the sampling module is used for sampling the measurement result of the resistance measurement module.
In this embodiment, referring to fig. 1, an input end of the processing module is connected to an output end of the sampling module. The processing module is used for processing the sampling result of the sampling module and obtaining the measuring result of the storage container stock. In this embodiment, a single chip microcomputer or a dedicated embedded processor may be used as the processing module.
In this embodiment, referring to fig. 2, the semiconductor strain gauge includes a substrate, and a first semiconductor silicon strip and a second semiconductor silicon strip, where the first semiconductor silicon strip and the second semiconductor silicon strip are mounted on one surface of the substrate or inside the substrate, specifically, the first semiconductor silicon strip and the second semiconductor silicon strip may be mounted on the same surface of the substrate, or the first semiconductor silicon strip and the second semiconductor silicon strip may be embedded inside the substrate.
In this embodiment, the substrate is rectangular in shape, with a length of 5mm to 20mm and a width of 5mm to 20 mm. The first semiconductor silicon strip and the second semiconductor silicon strip are the same in size and are both between 1mm and 10 mm. In the embodiment, the resistance strain characteristics of the first semiconductor silicon strip and the second semiconductor silicon strip are mainly applied, that is, the substrate of the semiconductor strain gauge drives the second semiconductor silicon strip and/or the second semiconductor silicon strip to deform along with the deformation of the stressed deformation part of the storage container, and the resistances of the second semiconductor silicon strip and the second semiconductor silicon strip are respectively changed by the deformation of the second semiconductor silicon strip and the second semiconductor silicon strip. The resistance changes of the first semiconductor silicon strip and the second semiconductor silicon strip are equal due to the temperature change and can compensate each other. In the embodiment, the resistance of the first semiconductor silicon strip and the second semiconductor silicon strip ranges from 5 Ω to 2k Ω.
In this embodiment, and referring to fig. 2, the projections of the first semiconductor and the second semiconductor on the substrate are perpendicular to each other, wherein the first semiconductor silicon strip is sensitive to deformation in the horizontal direction, the second semiconductor silicon strip is sensitive to deformation in the vertical direction, therefore, the first semiconductor silicon strip can convert the deformation in the horizontal direction into the resistance change which is easy to detect, the second semiconductor silicon strip can convert the deformation in the vertical direction into the resistance change which is easy to detect, the first semiconductor silicon strip is used for detecting the deformation of the stressed deformation part of the storage container in the horizontal direction, the second semiconductor silicon strip is used for detecting the deformation of the stressed deformation part of the storage container in the vertical direction, and the deformation of the stressed deformation part of the storage container in other directions can be decomposed into the deformation in the horizontal direction and the deformation in the vertical direction, and can be detected by the first semiconductor silicon strip and the second semiconductor silicon strip respectively. Namely, the first semiconductor silicon strip and the second semiconductor silicon strip which are perpendicular to each other are arranged, so that the deformation of the stressed deformation part of the storage container in any direction on the plane can be detected.
In this embodiment, referring to fig. 2, the resistance measurement module includes a first resistor and a second resistor, where the first resistor and the second resistor are connected in series, and the first semiconductor silicon strip is connected in series with the second semiconductor silicon strip, and the first resistor, the second resistor, the first semiconductor silicon strip, and the second semiconductor silicon strip are connected to form a wheatstone bridge. The four terminals in the wheatstone bridge are indicated by dots in fig. 2, and specifically include a first terminal, a second terminal, a third terminal, and a fourth terminal. In this embodiment, the first end is a connection point of the first semiconductor silicon strip and the second semiconductor silicon strip, the second end is a connection point of the first resistor and the second resistor, and the third end and the fourth end are two ports, except the first end and the second end, of four ports formed by the wheatstone bridge. Referring to fig. 2, among four terminals of the wheatstone bridge represented by dots, the uppermost terminal is a first terminal, the lowermost terminal is a second terminal, the leftmost terminal is a third terminal, and the rightmost terminal is a fourth terminal. In this embodiment, the first terminal and the second terminal in the wheatstone bridge are connected to the sampling module as the output terminal of the resistance measurement module, and the third terminal and the fourth terminal in the wheatstone bridge are connected to the sampling module as the excitation terminal of the resistance measurement module.
In this embodiment, the first resistor and the second resistor are both high-precision low-temperature drift fixed resistors, and the resistances of the first resistor and the second resistor are the same. Specifically, the resistance precision of the first resistor and the second resistor is below 1%, and the temperature drift is below 50 ppm.
In this embodiment, the sampling module used is a wide-range analog quantity sampling module, the lowest value of the sampling capability of the sampling module is not more than minus 1.5 times of the actual full-range analog signal quantity, and the highest value of the sampling capability of the sampling module is not less than plus 1.5 times of the actual full-range analog signal quantity.
When the storage container stock measuring device of this embodiment is used, the deformed portion of the storage container is first ground to expose the metal material having a diameter of 2cm to 5 cm. And adhering the semiconductor strain gauge to the stressed deformation part of the storage container by using quick-drying weather-resistant glue, and covering and protecting the surfaces of the semiconductor strain gauge and the resistance measurement module by using silicon rubber. And then starting the resistance measuring module, the sampling module and the processing module to enable the resistance measuring module to measure the resistance of the semiconductor strain gauge, wherein the sampling module samples the measuring result of the resistance measuring module, and the processing module is used for processing the sampling result of the sampling module to obtain the measuring result of the storage container storage.
After the resistance measurement module, the sampling module and the processing module are started, the sampling module outputs excitation voltage V to an excitation end of the resistance measurement module under the control of a control algorithm. According to the electrical knowledge, if the resistance values and the two fixed resistance values of the first semiconductor silicon strip and the second semiconductor silicon strip are both R when the first semiconductor silicon strip and the second semiconductor silicon strip are not strained, the second semiconductor silicon strip and the first semiconductor silicon strip are subjected to strain when the storage container is emptied, and the resistance values of the second semiconductor silicon strip and the first semiconductor silicon strip are respectively changed into delta R due to the strain2And Δ R1The output voltage U during emptying measured by the resistance measuring module with the Wheatstone bridge as the main structure0Satisfy the requirement of
Then
When the actual weight is MSThe material rear resistance measuring module measures the output voltage U after feedingSObtaining a weight mapping coefficient
Output voltage U when processing module prestores clearance0And a weight mapping coefficient X, which can be represented by the formula M ═ X · (U-U)0) And calculating the corresponding measured inventory value M of the storage container with the output voltage of U at different inventories. The processing module can store the calculated stock measurement value M in a cloud server, print the stock measurement value M out or send the stock measurement value M to a mobile phone terminal for displayingShown in the figure.
In this embodiment, a computer program may be written, the computer is written in a storage medium or a computer device, and when the computer program is read out and executed, the sampling module and the processing module may be controlled to execute the following steps:
s1, a sampling module acquires an output voltage U of a resistance measurement module;
s2, the sampling module sends the excitation voltage V and the output voltage U to the processing module;
s3, the processing module searches for the pre-stored empty output voltage U0And a weight mapping coefficient X;
s4, the processing module uses a formula M ═ X · (U-U)0) A stock measurement M of the storage vessel is calculated.
Steps S1 to S4 are main steps of the control method for the measuring device in the present embodiment, and the technical effects as explained in the present embodiment can be achieved by controlling the measuring device in the present embodiment to perform steps S1 to S4.
In the embodiment, experiments of different silos prove that the full-scale time of a plurality of silos
Upper limit (delta)
Then the full range output signal
Sampling module sampling capacity minimum value WD<-1.5U-1.5 0.0125V-0.019V, i.e. WD<-0.019V. Maximum value WU of sampling capability of sampling module>U1.5U 0.0125V 0.019V, WU>0.019V. For example: WD is measured when the first and second strips of semiconductor silicon are energized at a voltage V of 3.3V<＝-0.019V＝-0.063，WU>＝0.019V＝0.063。
In this embodiment, the wheatstone half-bridge sensing circuit composed of two semiconductor silicon strips of the same type and the fixed resistor of the same resistance has a temperature compensation effect, and can greatly reduce a large error caused by a large temperature coefficient of the semiconductor silicon strips. Because the silicon strip is directly adhered to the stressed part of a storage container such as a silo and the like, and the sensitivity K value of the silicon strip is very large, a sufficiently large output signal can be obtained at a relatively tiny deformation part, and an indirect elastic body is not required to be fixed at the silo deformation part to amplify the deformation amount as in the prior art, so that the great measurement error caused by the inconsistency of the thermal expansion coefficient, the elastic modulus and the thermal conductivity coefficient of the intermediate elastic body and the silo deformation part in the prior art can be avoided.
In the embodiment, the sampling module has wide range, can bear the sampling capacity of not less than plus or minus 1.5 times of actual full-range signal quantity, and can be used for reducing the installation difficulty and simultaneously omitting the debugging work of the semiconductor strain gauge during installation as long as the output value of the analog signal can be within plus or minus 0.5 times of the actual full-range analog signal quantity during installation, and can be used for carrying out zero adjustment and calibration at any time within the full-range so as to ensure that the signal cannot exceed the range, thereby greatly improving the installation and debugging efficiency.
In this embodiment, there may be a plurality of semiconductor strain gauges, each semiconductor strain gauge has the same parameters, and each semiconductor strain gauge is attached to different stressed deformation portions of the same storage container. Accordingly, there may be a plurality of resistance measurement modules. And each semiconductor strain gauge is connected with a corresponding resistance measurement module, and the output end of each resistance measurement module is respectively connected with the input end of the sampling module. When the number of the input ends of the sampling modules is small, the output ends of the plurality of resistance measuring modules can be connected with the same input end of the sampling module, the sampling module respectively samples the output voltages of different resistance measuring modules at different time periods to be processed by the processing module, and the processing module respectively processes the measuring results of each group of semiconductor strain gauges and each group of resistance measuring modules to obtain one measuring result. For a plurality of measurement results obtained by processing the measurement results of a plurality of groups of semiconductor strain gauges and resistance measurement modules, the final measurement result can be obtained by a statistical method such as averaging, so that the measurement error is reduced.
The storage container storage quantity measuring device in the present embodiment measures the storage quantity of the stored article in the storage container by the deformation of the deformed portion of the storage container, and is used independently of the stored article in the storage container, and is therefore suitable for articles of various materials. Because the area of each semiconductor strain gauge can be made to be small, the contact area between the semiconductor strain gauge and the stress deformation part of the storage container is small, temperature change interference between the semiconductor strain gauge and the stress deformation part of the storage container due to the fact that the thermal expansion coefficient, the elastic modulus and the thermal conductivity coefficient are inconsistent is small, and the measurement accuracy can be improved.
In this example, data relating to an experiment using the storage container inventory measuring device is shown in table 1. The data in table 1 indicates that the storage container inventory measuring device in this embodiment can achieve higher measurement accuracy.
TABLE 1
It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly fixed or connected to the other feature or indirectly fixed or connected to the other feature. Furthermore, the descriptions of upper, lower, left, right, etc. used in the present disclosure are only relative to the mutual positional relationship of the constituent parts of the present disclosure in the drawings. As used in this disclosure, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. In addition, unless defined otherwise, all technical and scientific terms used in this example have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in the description of the embodiments herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this embodiment, the term "and/or" includes any combination of one or more of the associated listed items.
It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element of the same type from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure. The use of any and all examples, or exemplary language ("e.g.," such as "or the like") provided with this embodiment is intended merely to better illuminate embodiments of the invention and does not pose a limitation on the scope of the invention unless otherwise claimed.
It should be recognized that embodiments of the present invention can be realized and implemented by computer hardware, a combination of hardware and software, or by computer instructions stored in a non-transitory computer readable memory. The methods may be implemented in a computer program using standard programming techniques, including a non-transitory computer-readable storage medium configured with the computer program, where the storage medium so configured causes a computer to operate in a specific and predefined manner, according to the methods and figures described in the detailed description. Each program may be implemented in a high level procedural or object oriented programming language to communicate with a computer system. However, the program(s) can be implemented in assembly or machine language, if desired. In any case, the language may be a compiled or interpreted language. Furthermore, the program can be run on a programmed application specific integrated circuit for this purpose.
Further, operations of processes described in this embodiment can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context. The processes described in this embodiment (or variations and/or combinations thereof) may be performed under the control of one or more computer systems configured with executable instructions, and may be implemented as code (e.g., executable instructions, one or more computer programs, or one or more applications) collectively executed on one or more processors, by hardware, or combinations thereof. The computer program includes a plurality of instructions executable by one or more processors.
Further, the method may be implemented in any type of computing platform operatively connected to a suitable interface, including but not limited to a personal computer, mini computer, mainframe, workstation, networked or distributed computing environment, separate or integrated computer platform, or in communication with a charged particle tool or other imaging device, and the like. Aspects of the invention may be embodied in machine-readable code stored on a non-transitory storage medium or device, whether removable or integrated into a computing platform, such as a hard disk, optically read and/or write storage medium, RAM, ROM, or the like, such that it may be read by a programmable computer, which when read by the storage medium or device, is operative to configure and operate the computer to perform the procedures described herein. Further, the machine-readable code, or portions thereof, may be transmitted over a wired or wireless network. The invention described in this embodiment includes these and other different types of non-transitory computer-readable storage media when such media include instructions or programs that implement the steps described above in conjunction with a microprocessor or other data processor. The invention also includes the computer itself when programmed according to the methods and techniques described herein.
A computer program can be applied to input data to perform the functions described in the present embodiment to convert the input data to generate output data that is stored to a non-volatile memory. The output information may also be applied to one or more output devices, such as a display. In a preferred embodiment of the invention, the transformed data represents physical and tangible objects, including particular visual depictions of physical and tangible objects produced on a display.
The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above embodiment, and any modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present invention should be included in the protection scope of the present invention as long as the technical effects of the present invention are achieved by the same means. The invention is capable of other modifications and variations in its technical solution and/or its implementation, within the scope of protection of the invention.
Claims (10)
1. A storage vessel inventory measuring device, comprising:
a semiconductor strain gauge; the semiconductor strain gauge has resistance strain characteristics and is used for being stuck to a stressed deformation part of the storage container;
a resistance measurement module; the input end of the resistance measuring module is connected with the output end of the semiconductor strain gauge, and the resistance measuring module is provided with an excitation end; the resistance measuring module is used for measuring the resistance of the semiconductor strain gauge;
a sampling module; the input end of the sampling module is connected with the output end of the resistance measuring module; the sampling module is used for sampling the measurement result of the resistance measurement module;
a processing module; the input end of the processing module is connected with the output end of the sampling module; the processing module is used for processing the sampling result of the sampling module to obtain the measuring result of the storage container stock.
2. The storage container inventory measuring device of claim 1, in which the semiconductor strain gage comprises:
a substrate;
a first semiconductor silicon strip; the first semiconductor silicon strip is arranged on one surface of the substrate or in the substrate;
a second semiconductor silicon strip; the second semiconductor silicon strip is arranged on one surface of the substrate or in the substrate;
the first semiconductor silicon strip is connected in series with the second semiconductor silicon strip.
3. The storage vessel inventory measuring device of claim 2, wherein the first and second strips of semiconductor silicon have the same dimensions and electrical parameters.
4. The storage vessel inventory measuring device of claim 2, wherein the projections of the first semiconductor and the second semiconductor on the substrate are perpendicular to each other.
5. The storage vessel inventory measuring device of claim 1, wherein the lower limit of the sample capability value of the sampling module is no greater than minus 0.01 times the excitation voltage and the upper limit is no less than plus 0.01 times the excitation voltage.
6. The storage vessel inventory measuring device of any of claims 2-5, wherein the resistance measuring module includes a first resistance and a second resistance; the first resistor, the second resistor, the first semiconductor silicon strip and the second semiconductor silicon strip are connected to form a Wheatstone bridge; and a first end and a second end in the wheatstone bridge are used as output ends of the resistance measurement module, and a third end and a fourth end in the wheatstone bridge are used as excitation ends of the resistance measurement module, wherein the first end is a connection point of the first semiconductor silicon strip and the second semiconductor silicon strip, the second end is a connection point of the first resistor and the second resistor, and the third end and the fourth end are two ports except the first end and the second end of four ports formed by the wheatstone bridge.
7. The method of controlling a storage vessel inventory measuring device of claim 6, comprising:
the sampling module acquires the output voltage U of the resistance measuring module;
the sampling module sends the excitation voltage V and the output voltage U to the processing module;
the processing module searches the pre-stored output voltage U when empty0And a weight mapping coefficient X;
the processing module uses the formula M ═ X · (U-U)0) A stock measurement M of the storage vessel is calculated.
8. A storage vessel inventory measuring method, comprising:
obtaining the storage vessel inventory measuring device of any of claims 1-6;
polishing the stressed deformation part of the storage container;
using quick-drying weather-resistant glue to adhere the semiconductor strain gauge to the stressed deformation part of the storage container;
covering and protecting the surfaces of the semiconductor strain gauge and the resistance measurement module by using silicon rubber;
the resistance measuring module, the sampling module and the processing module are started, the resistance measuring module is used for measuring the resistance of the semiconductor strain gauge, the sampling module is used for sampling the measuring result of the resistance measuring module, and the processing module is used for processing the sampling result of the sampling module to obtain the measuring result of the storage container storage amount.
9. A computer apparatus comprising a memory for storing at least one program and a processor for loading the at least one program to perform the control method of claim 7.
10. A storage medium in which a program executable by a processor is stored, wherein the program executable by the processor is used to perform the control method according to claim 7 when executed by the processor.
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| JPH08261853A (en) * | 1995-03-20 | 1996-10-11 | Matsushita Electric Ind Co Ltd | Mechanical-quantity sensor element |
| CN101210850A (en) * | 2006-12-29 | 2008-07-02 | 中国直升机设计研究所 | Multi-component force sensor |
| CN201716063U (en) * | 2010-07-13 | 2011-01-19 | 深圳市好时代专用挂车有限公司 | Tank container single-bin digital metering system |
| CN103017948A (en) * | 2012-11-28 | 2013-04-03 | 安徽埃克森科技集团有限公司 | Piezoresistive type pressure sensor |
| CN103216725A (en) * | 2013-04-12 | 2013-07-24 | 南京航空航天大学 | Design method of composite material pressure container |
| CN103335588A (en) * | 2013-06-19 | 2013-10-02 | 浙江维思无线网络技术有限公司 | Deformation measurement method for equipment housing of high-pressure closed vessel |
| CN103411711A (en) * | 2013-07-11 | 2013-11-27 | 南京航空航天大学 | Measuring device of tubular part inner wall processing stress and measuring method thereof |
| CN103926028A (en) * | 2014-03-25 | 2014-07-16 | 慧石（上海）测控科技有限公司 | Structural design and manufacturing technology of strain foil |
| CN106441646A (en) * | 2016-10-27 | 2017-02-22 | 江苏科技大学 | A kind of flexible pressure sensor and preparation method thereof |
| CN207090182U (en) * | 2017-08-30 | 2018-03-13 | 南通中集罐式储运设备制造有限公司 | Tank container and the monitoring system for managing tank container |
| CN111742189A (en) * | 2017-12-22 | 2020-10-02 | 美蓓亚三美株式会社 | Strain gauge and sensor module |
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