CN113990809B - Packaging structure, circuit board assembly and electronic equipment - Google Patents

Abstract

The invention provides a packaging structure, a circuit board assembly and electronic equipment, wherein the packaging structure comprises a substrate, an electronic component and a packaging cover body, the substrate is provided with a first surface and a second surface which are oppositely arranged, the electronic component is connected with the first surface of the substrate, the packaging cover body comprises a top cover, a first supporting part and a second supporting part, the top cover is connected to the first surface of the substrate through the first supporting part and the second supporting part, the covering area of the top cover on the substrate can be maximized, and therefore the warping of the substrate is controlled. A first cavity is defined between the first supporting part and the second supporting part, so that other devices such as capacitors can be conveniently attached to the substrate, and the weight of the package can be reduced; the top cover is provided with openings corresponding to the positions of the electronic components, at least part of the electronic components are exposed out of the openings, and the electronic components can be in direct contact with air or a radiator, so that the heat dissipation effect of the packaging structure is guaranteed.

Description

Package Structures, Circuit Board Assemblies and Electronic Devices

technical field

The present invention relates to the technical field of semiconductor packaging, in particular to a packaging structure, a circuit board assembly and an electronic device.

Background technique

With the rapid development of science and technology, the requirements for chips are getting higher and higher, and the package size and chip power consumption are increasing rapidly. As the package size increases, the package warpage increases. The package warpage will not only increase the internal stress of the package, but also lead to poor soldering between the chip and the circuit board, resulting in problems such as tin connection and virtual soldering. The increase in chip power consumption causes the chip to generate and dissipate more heat, which puts forward higher requirements for the heat dissipation of the chip package.

SUMMARY OF THE INVENTION

Embodiments of the present invention provide a package structure, a circuit board assembly and an electronic device, which are used to effectively control the warpage of the package structure without affecting the heat dissipation of the electronic components and ensure the heat dissipation efficiency of the package structure.

In a first aspect, an embodiment of the present invention provides a packaging structure, including:

a substrate, the substrate has a first surface and a second surface disposed oppositely;

an electronic component connected to the first surface of the substrate;

a package cover, the package cover includes a top cover, a first support part and a second support part, the top cover is connected to the first surface of the substrate through the first support part and the second support part On the top, a first cavity is defined between the first support part and the second support part, and the top cover is provided with an opening at a position corresponding to the electronic component, and the electronic component is at least partially exposed in the opening.

In a second aspect, an embodiment of the present invention provides a circuit board assembly, which includes a circuit board and the package structure according to the first aspect above, where the package structure is connected to the circuit board.

In a third aspect, an embodiment of the present invention provides an electronic device, where the electronic device includes the circuit board assembly described in the second aspect above.

In the solution of the embodiment of the present invention, the package structure includes a substrate, an electronic component, and a package cover, wherein the substrate has a first surface and a second surface disposed opposite to each other, and the electronic component and the first surface of the substrate connection, the package cover body includes a top cover, a first support portion and a second support portion, the top cover is connected to the first surface of the substrate through the first support portion and the second support portion, The coverage area of the top cover on the substrate can be maximized, and the second supporting part can provide torque to the first supporting part, so as to control the warpage of the substrate, so as to reduce the warpage deformation of the package structure and prevent the problems caused by warpage. and damage, while improving the productivity and stability of the package structure. A first cavity is defined between the first support part and the second support part, and the first cavity provides a accommodating space for components on the substrate other than the above-mentioned electronic components, which is convenient for capacitors, etc. Other components are mounted on the substrate, which has strong applicability to the System In a Package (SiP) with many components on the substrate, and can reduce the weight of the package; the top cover is corresponding to the electronic The positions of the components are provided with openings, the electronic components are exposed from the openings, and the electronic components can be in direct contact with the air or the heat sink, thereby ensuring the heat dissipation effect of the package structure.

Description of drawings

1a and 1b are schematic structural diagrams of a packaging structure in the related art;

2a and 2b are schematic structural diagrams of another packaging structure in the related art;

3a-3c are schematic structural diagrams of a packaging structure provided by an embodiment of the present invention;

4a-4c are schematic structural diagrams of a package structure provided by another embodiment of the present invention;

5 is a schematic structural diagram of a packaging structure provided by another embodiment of the present invention;

6a and 6b are schematic structural diagrams of a package structure provided by another embodiment of the present invention;

Figure 7 is a comparative analysis table of substrate warpage and thermal resistance of electronic components under different types of cover plates.

Reference number:

1-Package structure; 10-Substrate; 20-Electronic components; 30-Reinforcing ring; 40-Cover plate; 41-Conductive adhesive;

50-package cover; 510-top cover; 511-hole; 521-first support part; 522-second support part; 5221-support foot; 523-third support part; 524-notch; 530-first cavity; 531-second cavity;

61-underfill; 62-raised contacts; 63-connection.

Detailed ways

The technical solutions in the embodiments of the present invention will be described below with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

It should be understood that in the description of the embodiments of the present invention, if there is a description of "first", "second", etc., it is only for the purpose of distinguishing technical features, and should not be understood as indicating or implying relative importance or implicitly indicating that The number of indicated technical features or implicitly indicates the order of the indicated technical features. "At least one" means one or more, and "plurality" means two or more. "And/or", which describes the association relationship of the associated objects, means that there can be three kinds of relationships, for example, A and/or B, which can indicate the existence of A alone, the existence of A and B at the same time, and the existence of B alone. where A and B can be singular or plural. The character "/" generally indicates that the associated objects are an "or" relationship. "At least one of the following" and similar expressions, refers to any group of such items, including any group of single or plural items. For example, at least one of a, b, and c may represent: a, b, c, a and b, a and c, b and c, or, a and b and c, where a, b, and c may be a single , or more than one.

In the description of the present invention, the orientation or positional relationship indicated by the terms "inner", "outer", "longitudinal", "lateral", "upper", "lower", "top", "bottom", etc. are based on the drawings The orientation or positional relationship shown is only for the convenience of describing the present invention rather than requiring the present invention to be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

In addition, those of ordinary skill in the art should appreciate that the connections described in the embodiments of the present invention include direct connections and indirect connections through intermediate components.

With the rapid development of science and technology, the requirements for chips are getting higher and higher, and the package size and chip power consumption are increasing rapidly. As the package size increases, the probability of package warpage increases. Package warpage will not only increase the internal stress of the package, but also lead to poor soldering between the chip and the circuit board, resulting in problems such as tin connection and virtual soldering. The increase in chip power consumption causes the chip to generate and dissipate more heat, which puts forward higher requirements for the heat dissipation of the chip package.

Please refer to FIG. 1a and FIG. 1b, which respectively show a top view and a cross-sectional view of a package structure in the related art. The package structure includes: a substrate 10 , electronic components 20 and a stiffener ring 30 , wherein the electronic components 20 and the stiffener ring 30 are both arranged on the upper surface of the substrate 10 , the stiffener ring 30 is a ring structure, and the electronic components The device 20 is exposed from the hollow portion of the reinforcement ring 30 . The package structure shown in FIG. 1a and FIG. 1b controls the package warpage through the reinforcement ring 30 disposed on the substrate 10. In this package structure, the electronic components 20 can be in direct contact with the air or the heat sink, the heat dissipation is good, and the reinforcement Ring 30 has less control over package warpage.

Please refer to FIG. 2a and FIG. 2b. FIG. 2a and FIG. 2b respectively show a top view and a cross-sectional view of another package structure in the related art. The package structure includes: a substrate 10 , an electronic component 20 and a cover plate 40 (Lid), wherein the electronic component 20 and the cover plate 40 are both arranged on the upper surface of the substrate 10 , and there is a gap between the cover plate 40 and the electronic component 20 . A thermally conductive glue 41 (Tim glue) is provided, the lower surface of the cover plate 40 has an annular support portion, and the cover plate 40 is connected to the substrate 10 through the annular support portion. The package structure shown in FIG. 2a and FIG. 2b controls package warpage through the cover plate 40 disposed on the substrate 10. This package structure has relatively good control of package warpage, but the electronic components 20 and the air/heat sink A barrier (the thermally conductive adhesive 41 and the cover plate 40 ) is added between them, which leads to an increase in the thermal resistance of heat transfer, which makes the heat dissipation capability of the package structure poor.

In order to overcome the shortcomings of the packaging structure of the related art, the embodiments of the present invention provide a packaging structure, a circuit board assembly and an electronic device, which are used to effectively control the warpage of the packaging structure without affecting the heat dissipation of the electronic components and ensure the packaging structure. heat dissipation efficiency of the structure.

Example 1

Please refer to FIG. 3a, FIG. 3b, and FIG. 3c. FIG. 3a, FIG. 3b, and FIG. 3c are schematic structural diagrams of a package structure 1 provided by an embodiment of the present invention. 3a is a schematic top view of the package structure 1, FIG. 3b is a schematic cross-sectional structure at I in FIG. 3a, and FIG. 3c is a cross-sectional structure at II in FIG. 3b. In the embodiments shown in FIGS. 3 a , 3 b and 3 c , the package structure 1 includes: a substrate 10 , an electronic component 20 and a package cover 50 . The substrate 10 has a first surface and a second surface disposed opposite to each other, the electronic component 20 is connected to the first surface of the substrate 10 , and the package cover 50 includes a top cover 510 and a first support portion. 521 and a second support portion 522, the top cover 510 is connected to the first surface of the substrate 10 through the first support portion 521 and the second support portion 522, the first support portion 521 and the A first cavity 530 is defined between the second support parts 522 , the top cover 510 is provided with an opening 511 at a position corresponding to the electronic component 20 , and the electronic component 20 is at least partially opened from the opening exposed in 511.

It can be understood that the substrate 10 is a carrier for encapsulating the electronic components 20 , and plays the role of providing electrical connection, protection, support, heat dissipation, and assembly for the encapsulated electronic components 20 .

Exemplarily, the package structure 1 of the embodiment of the present invention can be applied to a circuit board assembly (Printed Circuit Board Assembly, PCBA). The first surface of the substrate 10 of the package structure 1 is used for mounting the electronic components 20 and the package cover 50 , The second surface of the substrate 10 of the package structure 1 is used for connecting with a printed circuit board (Printed Circuit Board, PCB), and the package structure 1 and the circuit board constitute the above circuit board assembly.

The circuit board assembly specifically includes a package structure 1 and a circuit board, and the package structure 1 is connected to the circuit board through the second surface of the substrate 10 .

In specific implementation, a plurality of connection parts 63 may be provided on the second surface of the substrate 10 , and the plurality of connection parts 63 are used for electrical connection with the circuit board. Exemplarily, the connection portion 63 may be a solder ball, and the solder ball may be made of a metal material such as tin, copper, or the like. The connection portion 63 may also be configured as a metal connection post (eg, a copper post). The embodiment of the present invention does not limit the specific form of the connecting portion 63 too much. The package structure 1 provided in the embodiment of the present invention is electrically connected to the circuit board through a plurality of connecting portions 63, so as to realize the electrical interconnection between the package structure 1 and the circuit board, and further realize the assembly of the circuit board assembly.

It can be understood that, those skilled in the art can select the type of the electronic component 20 according to actual needs. Exemplarily, the electronic component 20 may be an active device. Here, the active device includes a die (Die) or other devices/components that require an external power supply to work. It should be understood that in the field of semiconductor packaging, "die", "die", "Chip" or "bare chip" can be seen as synonyms. The electronic component 20 may also be a passive device. Here, the passive device includes capacitors, inductors, mixers, filters, and other devices/elements that do not require an external power supply. In the embodiment of the present invention, the electronic component 20 is used as an example for illustration.

In a specific embodiment, as shown in FIG. 3 b , the electronic component 20 is soldered on the first surface of the substrate 10 in a flip-chip manner through a plurality of bump contacts 62 (Bump). The circuit of the electronic component 20 can be drawn out through the raised contact 62 to realize the electrical connection between the electronic component 20 and other active/passive devices on the substrate 10 .

Optionally, an underfill 61 (Underfill) is disposed between the plurality of the raised contacts 62 . In specific implementation, underfill 61 may be added to the surface where the electronic component 20 is connected to the substrate 10 , and when the electronic component 20 is flip-chip welded to the substrate 10 , the melted underfill 61 flows into the raised contacts due to the siphon effect. The bottom of the point 62 is completely wrapped around the raised contact 62 to protect the raised contact 62 .

It can be understood that, as shown in FIG. 3 a , the package cover 50 described in the embodiment of the present invention is provided with an opening 511 at a position corresponding to the electronic component 20 . On the surface, the electronic component 20 may be exposed from the opening 511 of the package cover 50 . Through the opening 511, the electronic component 20 can be in direct contact with the air or the heat sink, so that the heat generated by the electronic component 20 can be easily transferred and diffused, thereby enhancing the heat dissipation of the package structure.

It can be understood that the openings 511 of the package cover 50 may adopt different shapes, for example, may be circular openings, square openings or oval openings, and the size of the openings 511 may be adapted based on the electronic components 20 . match. The specific shape and size of the opening 511 are not specifically limited in this embodiment of the present invention.

It can be understood that the package cover 50 described in the embodiment of the present invention is provided with a hollow portion on the surface used for connecting with the substrate 10 . During the specific implementation, the shape of the hollow region can be designed in advance, and then the hollow region can be designed according to the shape of the hollow region. The encapsulation lid body 50 is hollowed out to obtain the above hollowed-out portion. In addition, after hollowing out the surface of the package cover 50, a first support portion 521 and a second support portion 522 may be formed on the surface of the package cover 50. As shown in FIGS. 3b and 3c, the first support portion 521 There is a space between it and the second support part 522, the top cover 510 is connected above the first support part 521 and the second support part 522, and an annular first support part 521 and the second support part 522 Cavity 530.

Exemplarily, the first support portion 521 is disposed at the outer edge region of the top cover 510 , and the second support portion 522 is disposed at the edge region of the opening 511 .

It can be understood that, in the structure of the package cover 50 , the top cover 510 is erected above the substrate 10 through the first support portion 521 and the second support portion 522 , and the first support portion 521 and the second support portion 522 define a gap between the first support portion 521 and the second support portion 522 . A first cavity 530 is provided, and the first cavity 530 provides a accommodating space for components other than the above-mentioned electronic components 20 on the first surface of the substrate 10 . The package (system in package, SiP) has strong applicability and is beneficial to reduce the package weight of the package structure 1 .

In specific implementation, the shape of the hollow area can be pre-designed to be an annular shape surrounding the opening 511, and then the package cover 50 is hollowed out according to the pre-designed annular shape. After the package cover 50 is hollowed out, the surface is formed with two There are support parts of an annular structure, and the part between the two support parts is the top cover 510 . Here, the two support parts are the first support part 521 and the second support part 522 , the first support part 521 is located at the outer edge area of the top cover 510 , and the second support part 522 is located at the edge area of the opening 511 .

Exemplarily, the first support portion 521 may be a ring structure such as a square ring, a circular ring, an oval ring, etc. Generally speaking, the first support portion 521 only needs to be adapted to the substrate 10. There is no specific limitation in the embodiments of the present invention.

Exemplarily, the second support portion 522 may be a ring structure such as a square ring, a circular ring, an oval ring, etc. Generally speaking, the second support portion 522 only needs to be adapted to the opening 511. There is no specific limitation in this embodiment of the present invention.

It can be understood that the first support portion 521 and the second support portion 522 may adopt different annular structures, for example, the first support portion 521 is a square ring shape, and the second support portion 522 is a circular ring shape. Of course, the first support portion 521 and the second support portion 522 may also adopt the same annular structure. For example, the first support portion 521 and the second support portion 522 are both square and annular.

It can be understood that, the first support portion 521 and the second support portion 522 are respectively adhered to the first surface of the substrate 10 . Specifically, the first support portion 521 and the second support portion 522 can be respectively bonded and fixed to the first surface of the substrate 10 through adhesive. In this way, between the first support portion 521 and the first surface of the substrate 10 , Adhesive layers are respectively formed between the second support portion 522 and the first surface of the substrate 10 .

Example 2

Please refer to FIG. 4a, FIG. 4b and FIG. 4c. FIG. 4a, FIG. 4b and FIG. 4c are schematic structural diagrams of the package structure 1 provided by an embodiment of the present invention. 4a is a schematic top view of the package structure 1, FIG. 4b is a schematic cross-sectional structure at III in FIG. 4a, and FIG. 4c is a cross-sectional structure at IV in FIG. 4b. In the embodiment shown in FIGS. 4 a to 4 c , the package structure 1 includes: a substrate 10 , an electronic component 20 and a package cover 50 . The substrate 10 has a first surface and a second surface disposed opposite to each other, the electronic component 20 is connected to the first surface of the substrate 10 , and the package cover 50 includes a top cover 510 and a first support portion. 521 , a second support portion 522 and a third support portion 523 , the top cover 510 is connected to the first surface of the substrate 10 through the first support portion 521 , the second support portion 522 and the third support portion 523 , so The top cover 510 is provided with an opening 511 at a position corresponding to the electronic component 20 , and the electronic component 20 is at least partially exposed from the opening 511 .

Compared with the embodiment shown in FIGS. 3 a to 3 c , in the embodiment shown in FIGS. 4 a to 4 c , the package cover 50 is further provided with a third support between the first support part 521 and the second support part 522 The first support portion 521, the second support portion 522 and the third support portion 523 are spaced apart, and a first cavity 530 is defined between the first support portion 521 and the second support portion 522. The three support parts 523 define at least two second cavities 531 in the first cavity 530 . For example, in the embodiment shown in FIGS. 4a-4c, the first support portion 521, the second support portion 522 and the third support portion 523 are all annular structures, and the first support portion 521, the second support portion 522 and the The third support portion 523 divides the surface of the package cover 50 for connecting with the substrate 10 into two annular second cavities 531 .

The specific principle of controlling the warpage of the package cover 50 is to provide torque to the first support portion 521 through the second support portion 522 through the third support portion 523, which is beneficial to disperse the stress of the package structure, thereby effectively reducing the warpage of the package structure. Prevents problems and damages caused by warpage while improving the yield and stability of the package structure.

It can be understood that, in the specific implementation process, on the premise of ensuring that other components except the electronic component 20 have sufficient assembly space, the number of the supporting parts of the package cover 50 can be appropriately increased, for example, the third supporting part The number of 523 can be set to multiple, and the position distance between the support parts can be adjusted according to actual needs.

It should be noted that, in the embodiments shown in FIGS. 4 a to 4 c , the specific connection method between the electronic component 20 and the substrate 10 , the specific connection method between the package cover 50 and the substrate 10 , and the connection between the package structure 1 and the circuit board The method and the manufacturing method of the packaging cover 50 can be referred to the related descriptions of the embodiments shown in FIGS. 3 a to 3 c , which will not be repeated here.

Example 3

Please refer to FIG. 5 , which is a schematic cross-sectional structure diagram of a package structure 1 provided by another embodiment of the present invention. It should be noted that the top-view structure and longitudinal cross-sectional structure of the package structure 1 of the embodiment shown in FIG. 5 may correspond to the structures of the embodiments shown in FIGS. 3 a and 3 b , so they are omitted here. The package structure 1 of the embodiment shown in FIG. 5 includes: a substrate 10 , an electronic component 20 and a package cover 50 . The substrate 10 has a first surface and a second surface disposed opposite to each other, the electronic component 20 is connected to the first surface of the substrate 10 , and the package cover 50 includes a top cover 510 and a first support portion. 521 and a second support portion 522, the top cover 510 is connected to the first surface of the substrate 10 through the first support portion 521 and the second support portion 522, the first support portion 521 and the A first cavity 530 is defined between the second support parts 522 , the top cover 510 is provided with an opening 511 at a position corresponding to the electronic component 20 , and the electronic component 20 is at least partially opened from the opening exposed in 511. In the embodiment shown in FIG. 5 , the first support portion 521 and the second support portion 522 are both annular structures, and the first support portion 521 is provided with a notch 524 that cuts off the annular first support portion 521 . The two supporting portions 522 are also provided with a notch 524 for separating the annular second supporting portion 522. In the embodiment of the present invention, the notch 524 serves to provide a wiring space for component wiring. For example, for electronic components 20 with optoelectronic modules, cables are often required to be drawn out. For this purpose, gaps 524 are provided in the first support portion 521 and the second support portion 522 to provide a space for the cables to be drawn.

It can be understood that the number of the notches 524 corresponding to the first support portion 521 and the second support portion 522 is at least one. It should be noted that, in the embodiment shown in FIG. 5 , the number of the notches 524 on the first support part 521 and the second support part 522 and the position of the notches 524 are exemplary, and the number of the notches 524 may be based on actual needs during specific implementation. Adaptive adjustment is made to the position of the notch 524 . Of course, the notch 524 can also exist only in the first support portion 521 or the second support portion 522. For example, only the components located in the first cavity 530 need to lead out cables. In this case, only the first support portion 521 The opening 524 is sufficient; for another example, only the electronic component 20 needs to lead out the cable, and the cable does not need to be lead out of the substrate 10 . The embodiment of the present invention does not limit the specific arrangement of the notch 524 too much.

It should be noted that, in the embodiment shown in FIG. 5 , the specific connection method between the electronic component 20 and the substrate 10 , the specific connection method between the package cover 50 and the substrate 10 , the connection method between the package structure 1 and the circuit board, the package For the manufacturing method of the cover body 50, reference can be made to the related descriptions of the embodiments shown in FIGS. 3a-3c, and details are not repeated here.

Example 4

Referring to FIG. 6a, FIG. 6a shows a schematic cross-sectional structure diagram of a package structure 1 provided by another embodiment of the present invention. It should be noted that the top view structure and the longitudinal cross-sectional structure of the package structure 1 of the embodiment shown in FIG. 6a may correspond to the structures of the embodiments shown in FIGS. 3a and 3b, and are therefore omitted here. The package structure 1 of the embodiment shown in FIG. 6 a includes: a substrate 10 , an electronic component 20 and a package cover 50 . The substrate 10 has a first surface and a second surface disposed opposite to each other, the electronic component 20 is connected to the first surface of the substrate 10 , and the package cover 50 includes a top cover 510 and a first support portion. 521 and a second support portion 522, the top cover 510 is connected to the first surface of the substrate 10 through the first support portion 521 and the second support portion 522, the first support portion 521 and the A first cavity 530 is defined between the second support parts 522 , the top cover 510 is provided with an opening 511 at a position corresponding to the electronic component 20 , and the electronic component 20 is at least partially opened from the opening exposed in 511.

Compared with the embodiment shown in FIGS. 3 a to 3 c , the second support portion 522 adopts an annular structure. In the embodiment shown in FIG. 6 a , the second support portion 522 includes a plurality of support feet 5221 . Distributed at intervals around the edge of the opening 511 . It can be understood that the openings 511 are not actually shown in the cross-sectional view of FIG. 6 a , and the projected positions of the openings 511 on the substrate 10 are indicated by dotted lines in FIG. 6 a .

Specifically, as shown in FIG. 6 a , the second supporting portion 522 includes four square supporting feet 5221 , and the four supporting feet 5221 are distributed at four corners of the square opening 511 . Of course, in the embodiment shown in FIG. 6a , the shape, number and distribution of the support feet 5221 are all exemplary, and in actual implementation, the shape, number and distribution of the support feet 5221 can be adapted according to actual conditions.

For example, as shown in FIG. 6 b , the cross-sectional shape of the support legs 5221 is a right-angle shape, and the four right-angle-shaped support legs 5221 are distributed at four corners of the square opening 511 . The embodiment of the present invention does not limit the specific arrangement form of the support feet 5221 too much.

It can be understood that the openings 511 are not actually shown in the cross-sectional view of FIG. 6 b , and the projected positions of the openings 511 on the substrate 10 are indicated by dotted lines in FIG. 6 b .

It should be noted that, in the embodiment shown in FIG. 6a/FIG. 6b, the specific connection method between the electronic component 20 and the substrate 10, the specific connection method between the package cover 50 and the substrate 10, and the connection between the package structure 1 and the circuit board The method and the manufacturing method of the packaging cover 50 can be referred to the related descriptions of the embodiments shown in FIGS. 3 a to 3 c , which will not be repeated here.

It can be understood that, in the solution of the embodiment of the present invention, the structure of the package structure 1 is strengthened by the package cover body 50 to reduce warpage. Compared with the solutions shown in FIG. 1a and FIG. 1b, in the solution of the embodiment of the present invention, since the package cover 50 has a first cavity 530 that can provide a accommodating space for components other than the above-mentioned electronic components 20, Therefore, it is beneficial to maximize the coverage area of the package cover 50 on the substrate 10 (thus obtaining a larger coverage area than the reinforcing ring shown in FIG. 1a and FIG. 1b ), so that the package cover 50 has a better warpage control effect. The specific principle of the package cover 50 for controlling warpage is to provide torque to the first support portion 521 through the second support portion 522 to reduce the stress of the package structure, thereby reducing the warpage of the package structure and preventing problems caused by warpage. and damage, while improving the productivity and stability of the package structure. Compared with the solutions shown in FIGS. 2 a and 2 b , in the solution of the embodiment of the present invention, the package cover 50 has a hollow opening 511 , and through the opening 511 , the electronic component 20 can be in direct contact with the air or the heat sink, The heat generated by the electronic components 20 is facilitated to be transferred and diffused. Compared with the solution shown in FIG. 2a and FIG. 2b in which the cover plate seals the electronic components 20 on the substrate 10, the package structure 1 of the embodiment of the present invention has better heat dissipation sex. To sum up, the package structure 1 of the embodiment of the present invention can effectively reduce the warpage deformation of the package on the premise of ensuring the heat dissipation of the package structure 1 .

In order to facilitate the understanding of the technical effects brought about by the packaging cover 50 adopted in the embodiment of the present invention, the following uses the cover plate type as no cover plate, the stiffener ring 30 (Stiffener ring) shown in FIGS. The conventional cover plate (Lid) + thermally conductive adhesive (Tim glue) shown in 2b has a modulus of 0.04Mpa, the conventional cover plate (Lid) + thermally conductive adhesive (Tim glue) shown in Figures 2a-2b has a modulus of 0.04Mpa, the present invention In the package cover 50 provided by the embodiment shown in FIGS. 3a-3c as a comparison, when different cover types are used, the warpage of the substrate 10 at room temperature (25° C.) and at the peak reflow soldering (260° C.) is measured. , and the thermal resistance between the electronic component 20 (taking the die as an example) to the air or the heat sink, the results are shown in the table shown in FIG. 7 .

It can be seen from the table shown in Figure 7 that both the reinforcement ring or the conventional cover plate can restrain the warpage to a certain extent. The warpage control effect of the board is better than that of the reinforcement ring, but it is greatly affected by the modulus of the thermally conductive adhesive, and it will increase the thermal resistance of the thermally conductive adhesive and the cover itself, and the heat dissipation effect is poor; the package cover provided by the embodiment of the present invention inhibits warping The effect is good and stable, it will not be affected by changes in the properties of the thermally conductive adhesive material, nor will it increase additional thermal resistance, and the heat dissipation effect is good.

Exemplarily, taking the electronic component 20 as a die as an example, the packaging process flow of the packaging structure 1 according to the embodiment of the present invention is as follows:

S1, the die is flip-chip welded to the first surface of the substrate 10 through the bump contact 62 (Bump);

S2, add underfill glue 61 (Underfill) around the die. Due to the siphon effect, the melted glue will flow into the bottom of the raised contacts 62 to completely wrap the raised contacts 62 to protect the raised contacts 62 the role of;

S3, adding Tim glue (if any) on the die, and adding adhesive glue to the positions of the substrate 10 corresponding to the first support portion 521 and the second support portion 522;

S4, pressing the first support portion 521 and the second support portion 522 of the package cover 50 on the adhesive;

S5, curing the adhesive at a certain temperature, so that the cover plate and the substrate 10 are bonded together;

S6 , implanting solder balls or pads on the second surface of the substrate 10 through a reflow oven.

Embodiments of the present invention further provide a circuit board assembly, which includes a circuit board and the package structure 1 described in any of the above embodiments, where the package structure 1 is connected to the circuit board.

In specific implementation, a plurality of connection parts 63 may be provided on the second surface of the substrate 10 , and the plurality of connection parts 63 are used for electrical connection with the circuit board. Exemplarily, the connection portion 63 may be a solder ball, and the solder ball may be made of a metal material such as tin, copper, or the like. The package structure 1 provided in the embodiment of the present invention is electrically connected to the circuit board through a plurality of connecting portions 63, so as to realize the electrical interconnection between the package structure 1 and the circuit board, and further realize the assembly of the circuit board assembly.

An embodiment of the present invention further provides an electronic device, where the electronic device includes the circuit board assembly described in any of the above embodiments. The electronic devices here can be mobile phones, tablet computers, laptops, in-vehicle devices, wearable devices, drones, routers and other products. The electronic device can also be a power supply module or a network switching device.

It should be understood that the description of each embodiment of the present invention has its own emphasis. For parts that are not described or described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments. In addition, the technical features involved in the various embodiments described in the present invention can be combined with each other as long as they do not conflict with each other.

The above is a specific description of the preferred implementation of the present invention, but the present invention is not limited to the above-mentioned embodiments, and those skilled in the art can make various equivalent deformations or replacements under the sharing conditions that do not violate the spirit of the present invention. , these equivalent modifications or replacements are included within the scope defined by the claims of the present invention.

Claims (6)

1. A package structure, comprising:

a substrate having a first surface and a second surface disposed opposite to each other;

an electronic component connected to the first surface of the substrate;

the packaging cover body comprises a top cover, a first supporting part and a second supporting part, the top cover is connected to the first surface of the substrate through the first supporting part and the second supporting part, a first cavity is defined between the first supporting part and the second supporting part, the top cover is provided with an opening at a position corresponding to the electronic component, and at least part of the electronic component is exposed from the opening; the package cover body further comprises at least one third supporting part, the third supporting part is arranged between the first supporting part and the second supporting part, and the third supporting part is connected with the top cover and the first surface of the substrate; the third support portion defines at least two second cavities within the first cavity;

the first supporting part is arranged in the outer edge area of the top cover, the first supporting part is of an annular structure, and the first supporting part is provided with at least one notch for partitioning the annular first supporting part;

the second supporting part is arranged in the edge area of the opening and is of an annular structure, and the second supporting part is provided with at least one notch for cutting off the annular second supporting part;

or,

the second supporting portion is arranged in the edge area of the opening and comprises a plurality of supporting legs which are distributed around the edge of the opening at intervals.

2. The package structure of claim 1, wherein the electronic component is connected to the first surface of the substrate via a plurality of bump contacts, and wherein an underfill is disposed between the plurality of bump contacts.

3. The package structure of claim 1, wherein the second surface of the substrate is provided with a plurality of connecting portions, and the connecting portions are used for connecting a circuit board.

4. The package structure of claim 1, wherein the first supporting portion and the second supporting portion are respectively adhered to the first surface of the substrate.

5. A circuit board assembly comprising a circuit board and the package of any one of claims 1 to 4, the package being connected to the circuit board.

6. An electronic device comprising the circuit board assembly of claim 5.

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