CN113985657A - Backlight module, preparation method thereof and display device - Google Patents
Backlight module, preparation method thereof and display device Download PDFInfo
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- CN113985657A CN113985657A CN202111264890.3A CN202111264890A CN113985657A CN 113985657 A CN113985657 A CN 113985657A CN 202111264890 A CN202111264890 A CN 202111264890A CN 113985657 A CN113985657 A CN 113985657A
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- 238000002360 preparation method Methods 0.000 title abstract description 6
- 238000009792 diffusion process Methods 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims description 21
- 238000005520 cutting process Methods 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 7
- 239000012528 membrane Substances 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 41
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000012788 optical film Substances 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000010023 transfer printing Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133605—Direct backlight including specially adapted reflectors
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133608—Direct backlight including particular frames or supporting means
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Planar Illumination Modules (AREA)
Abstract
The application provides a backlight module, a preparation method thereof and a display device, wherein the backlight module comprises a circuit board; a plurality of light emitting elements disposed on the circuit board; the circuit board is provided with a plurality of convex supporting parts, the supporting parts are positioned between the adjacent light-emitting elements, and the surfaces of the supporting parts are covered with reflecting films. According to the light-emitting device, the supporting parts are integrally formed on the circuit board, the supporting parts are positioned between the adjacent light-emitting elements, and the surfaces of the supporting parts are covered with the reflecting films, so that when the light-emitting elements emit light, the adjacent light-emitting elements cannot generate a light crosstalk phenomenon due to the shielding of the supporting parts and the reflection effect of the reflecting films on the light; meanwhile, the raised supporting part can support other components of the backlight module, such as optical membranes such as a diffusion plate and the like, and the structural stability of the whole backlight module is ensured.
Description
Technical Field
The application relates to the technical field of display, in particular to a backlight module, a preparation method thereof and a display device.
Background
At present, with the development of display industry, direct type backlight and side type backlight gradually occupy the whole display backlight market, and because the direct type backlight has the advantages of good display effect, divisionally controllable and the like, and along with the introduction of miniLED, the direct type backlight gradually occupies most market share in the high-end market.
However, because the lamp pearl on the miniLED lamp plate is arranged very densely, produce the optical crosstalk problem between the lamp pearl easily, for example the light that the lamp pearl sent propagates to adjacent lamp pearl, leads to this non-luminous lamp pearl to correspond the pixel and give out light, and for example again, adjacent and the mutual light that emits of lamp pearl of common luminescence lead to corresponding the pixel brighter. Therefore, solving the problem of light crosstalk of the existing lamp bead becomes the direction of efforts of technicians in the field.
Disclosure of Invention
The application provides a backlight module, a preparation method thereof and a display device, and aims to solve the technical problem that light crosstalk is easily generated on a lamp bead of the conventional backlight module.
In a first aspect, the present application provides a backlight module, comprising:
a circuit board;
a plurality of light emitting elements disposed on the circuit board;
the circuit board is provided with a plurality of convex supporting parts, the supporting parts are positioned between the adjacent light-emitting elements, and the surfaces of the supporting parts are covered with reflecting films.
In some embodiments, the support portions enclose a rectangle; or
The supporting parts are encircled to form a circle.
In some embodiments, the support portion comprises a first support portion and a second support portion;
the first supporting parts are linearly arranged on the left side and the right side of the light-emitting element, the second supporting parts are linearly arranged on the front side and the rear side of the light-emitting element, and the first supporting parts and the second supporting parts corresponding to the same light-emitting element are enclosed to form a rectangle; or
The first supporting part is arc-shaped and is arranged on the left side and the right side of the light-emitting element, the second supporting part is arc-shaped and is arranged on the front side and the rear side of the light-emitting element, the central angle of the first supporting part corresponding to the second supporting part is smaller than or equal to 90 degrees, and the first supporting part and the second supporting part corresponding to the same light-emitting element are enclosed to form a circle.
In some embodiments, the support portion has a gradually decreasing area parallel to a cross-section of the circuit board in a direction away from the circuit board; and/or
Along the direction far away from the circuit board, the distance between any point on the surface of the supporting part and the center line of the nearest light-emitting element is gradually increased.
In some embodiments, the sub-reflective film further covers a surface of the circuit board on which the light emitting device is mounted, and the reflective film is provided with a through hole corresponding to the surface on which the light emitting device is mounted.
In some embodiments, the support member further comprises a diffusion plate disposed on the support member, and the support member is in point contact or line contact with the diffusion plate.
In some embodiments, the support is shaped as a semi-ellipsoid, the apex of the semi-ellipsoid being in contact with the diffuser plate; or
The supporting part is in the shape of a pyramid, and the vertex of the pyramid is in contact with the diffusion plate.
In a second aspect, the present application provides a method for manufacturing a backlight module, including:
providing a circuit board;
forming a plurality of raised supporting parts on the circuit board;
covering a reflecting film on the supporting part;
the light emitting element is fixed between the adjacent support portions.
In some embodiments, the reflective film further covers a side of the circuit board where the light emitting element is fixed, and before the step of fixing the light emitting element between the adjacent supporting portions, the method further includes:
a through hole is formed by laser cutting the reflective film to expose a pad for fixing the light emitting element on the circuit board.
In a third aspect, the present application provides a display device comprising the backlight module as described in the first aspect.
The circuit board is provided with the supporting parts, the supporting parts are positioned between the adjacent light-emitting elements, and the surfaces of the supporting parts are covered with the reflecting films, so that when the light-emitting elements emit light, the adjacent light-emitting elements cannot generate optical crosstalk due to the shielding of the supporting parts and the reflection effect of the reflecting films on the light; meanwhile, the raised supporting part can support other components of the backlight module, such as optical membranes such as a diffusion plate and the like, and the structural stability of the whole backlight module is ensured.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a backlight module provided in an embodiment of the present application;
FIG. 2 is a schematic view of an arrangement of support portions provided in an embodiment of the present application;
fig. 3 is a schematic view of another arrangement of the support part provided in the embodiment of the present application;
fig. 4 is a schematic view of another arrangement of the support part provided in the embodiment of the present application;
fig. 5 is a schematic flow chart of a backlight module manufacturing method provided in the embodiment of the present application.
The light emitting device comprises a circuit board 10, a support part 11, a first support part 111, a second support part 112, a light emitting element 20, a reflection film 30, a through hole 31 and a diffusion plate 40.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In this application, the word "exemplary" is used to mean "serving as an example, instance, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is presented to enable any person skilled in the art to make and use the invention. In the following description, details are set forth for the purpose of explanation. It will be apparent to one of ordinary skill in the art that the present invention may be practiced without these specific details. In other instances, well-known structures and processes are not shown in detail to avoid obscuring the description of the invention with unnecessary detail. Thus, the present invention is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles and features disclosed herein.
The embodiment of the application provides a backlight module, a preparation method thereof and a display device, which are respectively described in detail below.
First, referring to fig. 1, fig. 1 shows a schematic structural diagram of a backlight module in an embodiment of the present application, where the backlight module includes:
a circuit board 10;
a plurality of light emitting elements 20, the light emitting elements 20 being disposed on the circuit board 10;
the circuit board 10 has a plurality of convex supporting portions 11, the supporting portions 11 are located between adjacent light emitting elements 20, and the surface of the supporting portions 11 is covered with a reflective film 30.
Specifically, the circuit board 10 is used to carry a plurality of light emitting elements 20, and is integrated with a circuit for supplying power to the plurality of light emitting elements 20. In some embodiments, the circuit board 10 may have flexibility, for example, a flexible printed circuit board 10 made of polyimide or polyester film as a base material is used. For example, the circuit board 10 may be a single panel, and since the backlight module only needs to emit light on one side, the light emitting elements 20 are mainly concentrated on one side of the circuit board 10, and the circuits of the single panel are mainly concentrated on one side of the circuit board 10, so that the structure of the circuit board 10 can be simplified and the manufacturing cost of the backlight module can be reduced. It is understood that a double-sided board or a multi-layer board may be used for the circuit board 10 according to actual needs.
For example, for a display module including a liquid crystal layer, a polarizer, and a color filter, the liquid crystal layer and the polarizer control whether the light emitted by the light emitting element 20 passes through the color filter to display a color, and finally the color of a plurality of pixels forms an image. It is understood that the light emitting element 20 of the present application can also provide light emitting sources for other types of display modules, such as those that display images using quantum dot films. Specifically, the light emitting element 20 may be a light emitting diode.
In the present application, the circuit board 10 has a plurality of protruding supporting portions 11, the supporting portions 11 are located between adjacent light emitting elements 20, and the surface of the supporting portions 11 is covered with the reflective film 30, when the light emitting elements 20 emit light, due to the shielding of the supporting portions 11 and the reflection effect of the reflective film 30 on the light, the light emitted to the corresponding area of the adjacent light emitting elements 20 on the side surface is reflected by the reflective film 30, and further the adjacent light emitting elements 20 do not generate optical crosstalk; meanwhile, the raised support portion 11 can also be used for supporting other components of the backlight module, such as optical films such as the diffusion plate 40, etc., thereby ensuring the structural stability of the whole backlight module.
In some embodiments of the present disclosure, the supporting portions 11 are enclosed to form a rectangle, so as to avoid the crosstalk phenomenon between the light emitting elements 20 adjacent to the periphery; in other embodiments of the present application, the supporting portion 11 may further enclose to form a circle, and the arc surface of the supporting portion 11 reflects the light to the center of the light emitting element 20 when reflecting the light, so as to improve the light concentration of the light emitting element 20 while avoiding the optical crosstalk phenomenon of the adjacent light emitting elements 20.
Referring to fig. 2 and fig. 2, an arrangement diagram of the supporting portion 11 in the embodiment of the present disclosure is shown, wherein the supporting portion 11 includes a first supporting portion 111 surrounding left and right sides of the light emitting device 20, and a second supporting portion 112 surrounding front and rear sides of the light emitting device 20, and since the first supporting portion 111 and the second supporting portion 112 surround the periphery of the light emitting device 20, light emitted from the light emitting device 20 to the periphery is reflected by the first supporting portion 111 and the second supporting portion 112, so that a light crosstalk phenomenon generated by the light emitting device 20 adjacent to the periphery is avoided at the same time.
Specifically, as an example, referring to fig. 2, the first supporting portions 111 are linearly disposed on both left and right sides of the light emitting element 20, the second supporting portions 112 are linearly disposed on both front and rear sides of the light emitting element 20, and the first supporting portions 111 and the second supporting portions 112 corresponding to the same light emitting element 20 are enclosed to form a rectangle. In the case of the rectangular light emitting element 20, the first supporting portion 111 and the second supporting portion 112 arranged linearly form a rectangle to better surround the light emitting element 20, which is beneficial to further prevent the light emitted from the light emitting element 20 from being input to the corresponding region of the adjacent light emitting element 20.
As still another example, referring to fig. 3, fig. 3 shows another arrangement diagram of the support 11 in the embodiment of the present application, wherein the first support 111 is disposed in an arc shape at the left and right sides of the light emitting element 20, the second support 112 is disposed in an arc shape at the front and rear sides of the light emitting element 20, the central angle of the first support 111 and the second support 112 is smaller than or equal to 90 °, and the first support 111 and the second support 112 enclose to form a circle. Because first supporting part 111 and second supporting part 112 are the arc setting, consequently first supporting part 111 and second supporting part 112 have the arcwall face towards light-emitting component 20, and this arcwall face is with light reflection to light-emitting component 20's center department when the reflection light, has improved the concentration nature of light-emitting component 20 light-emitting when avoiding adjacent light-emitting component 20 light crosstalk phenomenon.
It is understood that the shape of the light emitting element 20 and the arrangement of the supporting portion 11 can be modified equally by those skilled in the art at the guidance of the present application, for example, referring to fig. 4, fig. 4 shows another structural schematic diagram of the supporting portion 11 in the embodiment of the present application, wherein the light emitting element 20 is circular, and the supporting portion 11 is arranged in a ring shape on the outer periphery of the circular light emitting element 20.
Further, in order to avoid that the light cannot be emitted directly above the supporting portion 11, and the area above the supporting portion 11 between the adjacent light emitting elements 20 generates a blind seam phenomenon, in some embodiments of the present application, along the direction away from the circuit board 10, the area of the supporting portion 11 parallel to the cross section of the circuit board 10 is gradually reduced, that is, the cross-sectional area of the supporting portion 11 from bottom to top is gradually reduced, so that the area shielded by the upper portion of the supporting portion 11 is reduced, the light emitted from the light emitting elements 20 can enter the area above the supporting portion 11, and further, the dark area above the supporting portion 11 is reduced, and the blind seam phenomenon generated directly above the supporting portion 11 is avoided, and meanwhile, the cross-sectional area of the lower portion of the supporting portion 11 is large, and it can be ensured that the supporting portion has sufficient strength to support components such as the diffuser plate 40.
In some embodiments of the present application, for example, for the embodiment that the area of the cross section of the supporting portion 11 parallel to the circuit board 10 is gradually decreased, along the direction away from the circuit board 10, the distance between any point on the surface of the supporting portion 11 and the center line of the nearest light emitting element 20 is gradually increased, that is, the side of the supporting portion 11 facing the nearest light emitting element 20 is a curved surface, the curved surface is curved from bottom to top towards the side away from the light emitting element 20, when the light irradiates on the curved surface, the light reflected by the reflective film 30 at the curved surface is emitted towards the position directly above the light emitting element 20, so that the curved surface not only can reduce the area blocked by the upper portion of the supporting portion 11, but also is beneficial to enable the reflected light to be emitted towards the position directly above the light emitting element 20, thereby improving the light emitting rate, and avoiding the phenomenon that the supporting portion 11 reflects the light to the lower portion of the light emitting element 20 to reduce the light emitting rate.
In some embodiments of the present application, the supporting portion 11 and the circuit board 10 are integrally formed, so that the supporting portion 11 and the circuit board 10 are integrally formed to avoid the phenomenon that the supporting portion slides relative to the circuit board 10, which is beneficial to improving the structural stability of the whole backlight module. For example, in the hot stamping process, after the circuit board 10 is heated to a certain temperature, the circuit board 10 is stamped by a stamping machine in a corresponding die to obtain the required support 11 on the circuit board 10. It is understood that other processes may be used to integrally form the supporting portion 11 on the circuit board 10, for example, stamping the copper plate as the raw material of the circuit board 10, preparing the supporting portion 11 in advance, and completing other processes of manufacturing the circuit board 10, such as circuit transfer printing, circuit etching, etc.
Further, in order to reflect the light emitted from the light emitting element 20 to the circuit board 10, referring to fig. 1, the reflective film 30 further covers a surface of the circuit board 10 where the light emitting element 20 is installed, and the reflective film 30 is provided with a through hole 31 for installing the light emitting element 20 correspondingly, when the light emitted from the light emitting element 20 is emitted to the circuit board 10 at the bottom thereof, the reflective film 30 covering the circuit board 10 reflects the light, so that the light is emitted right above the light emitting element 20 after being reflected, thereby improving the light emitting rate. While the through-holes 31 on the reflective film 30 may facilitate the mounting of the light emitting elements 20, for example, for the embodiment where the light emitting elements 20 are light emitting diodes, the through-holes 31 of the reflective film 30 may correspond to pads of the circuit board 10 on which the light emitting diodes are mounted, so as to solder the light emitting elements 20 to the circuit board 10.
It is understood that for the embodiment where the light emitting element 20 is other light emitting members, the arrangement of the through holes 31 of the reflective film 30 can be modified according to actual requirements.
In some embodiments of the present disclosure, the backlight module may further include a diffusion plate 40, the diffusion plate 40 is disposed on the supporting portion 11, and the supporting portion 11 is in point contact or line contact with the diffusion plate 40. After the light rays enter the diffusion plate 40, the light rays are subjected to physical phenomena of refraction, reflection and scattering, so that the traveling route of the light rays is changed, the incident light rays are fully scattered to generate an optical diffusion effect, and the light emitting uniformity of the backlight module is further ensured; the point contact or line contact is set between the support part 11 and the diffusion plate 40, which is beneficial to reducing the contact area between the diffusion plate 40 and the support part 11, thereby avoiding the phenomenon that the diffusion plate 40 has a region where more light rays cannot be emitted, and further influencing the light diffusion effect of the diffusion plate 40.
Specifically, as an example, the shape of the support 11 is a semi-ellipsoid, the vertex of which is in contact with the diffuser plate 40; as still another example, the support part 11 has a pyramid shape, and the apex of the pyramid contacts the diffusion plate 40, thereby forming point contact between the support part 11 and the diffusion plate 40. It will be appreciated that the support 11 may also have other shapes, such as a triangular prism, wherein one side of the prism contacts the diffuser plate 40 to achieve line contact.
It should be noted that the above description of the backlight module is intended to clearly illustrate the verification process of the embodiments of the present application, and those skilled in the art can make equivalent modifications under the guidance of the present application, for example, changing the rectangular array arrangement of the light emitting elements 20 on the circuit board 10 into a triangular or hexagonal array arrangement of the light emitting elements 20.
Further, in order to better implement the backlight module in the present application, an embodiment of the present application further provides a method for manufacturing the backlight module on the backlight module, referring to fig. 5, fig. 5 shows a schematic flow chart of the method for manufacturing the backlight module in the embodiment of the present application, wherein the method for manufacturing the backlight module includes:
step S501, providing a circuit board 10;
the circuit board 10 is used to carry a plurality of light emitting elements 20, and integrates a circuit for supplying a power supply to the plurality of light emitting elements 20. In some embodiments, the circuit board 10 may have flexibility, for example, a flexible printed circuit board 10 made of polyimide or polyester film as a base material is used. For example, the circuit board 10 may be a single panel, and since the backlight module only needs to emit light on one side, the light emitting elements 20 are mainly concentrated on one side of the circuit board 10, and the circuits of the single panel are mainly concentrated on one side of the circuit board 10, so that the structure of the circuit board 10 can be simplified and the manufacturing cost of the backlight module can be reduced. It is understood that a double-sided board or a multi-layer board may be used for the circuit board 10 according to actual needs.
Step S502, forming a plurality of convex supporting parts 11 on the circuit board 10;
the support portion 11 is used to separate adjacent light emitting elements 20 to block light emitted to the corresponding area of the laterally adjacent light emitting elements 20. In some embodiments of the present application, the first supporting portions 111 are linearly disposed at left and right sides of the light emitting device 20, the second supporting portions 112 are linearly disposed at front and rear sides of the light emitting device 20, and the first supporting portions 111 and the second supporting portions 112 corresponding to the same light emitting device 20 are enclosed to form a rectangle. In other embodiments of the present application, the first supporting portion 111 is disposed in an arc shape at left and right sides of the light emitting device 20, the second supporting portion 112 is disposed in an arc shape at front and rear sides of the light emitting device 20, a central angle of the first supporting portion 111 and the second supporting portion 112 is smaller than or equal to 90 °, and the first supporting portion 111 and the second supporting portion 112 enclose to form a circle.
Specifically, the integrated supporting portion 11 on the circuit board 10 may be formed by a press forming process, for example, a hot stamping process, after the circuit board 10 is heated to a certain temperature, a punch presses the circuit board 10 in a corresponding mold to obtain the required supporting portion 11 on the circuit board 10. It is understood that other processes may be used to integrally form the supporting portion 11 on the circuit board 10, for example, stamping the copper plate as the raw material of the circuit board 10, preparing the supporting portion 11 in advance, and completing other processes of manufacturing the circuit board 10, such as circuit transfer printing, circuit etching, etc.
Step S503, covering the support 11 with the reflective film 30;
the reflective film 30 is used to reflect light emitted to the corresponding area of the adjacent light emitting elements 20 on the side surface, so as to avoid the optical crosstalk phenomenon between the adjacent light emitting elements 20. Illustratively, the reflective film 30 may be a metallic reflective film 30, an all dielectric reflective film 30, or the like. As an example, a plastic suction process may be used to cover the reflective film 30 on the supporting portion 11, the reflective film 30 is heated to be softened and then vacuum-sucked on the surface of the supporting portion 11, and the reflective film 30 is covered on the supporting portion 11 after cooling and forming. As still another example, it is also possible to coat the surface of the supporting part 11 with a solution having a reflective function, and complete the process of covering the supporting part 11 with the reflective film 30 after the solution is condensed to form a film having a reflective function.
In step S504, the light emitting element 20 is fixed between the adjacent support portions 11.
Specifically, taking the light emitting element 20 as an led as an example, the light emitting element 20 may be fixed and electrically connected by soldering the light emitting element 20 to a pad of the fixed circuit board 10. It will be appreciated that other means of fixing the light emitting element 20 may be used, such as laser welding.
According to the invention, the supporting part 11 is integrally molded on the circuit board 10, the supporting part 11 is positioned between the adjacent light-emitting elements 20, and the surface of the supporting part 11 is covered with the reflecting film 30, so that when the light-emitting elements 20 emit light, the adjacent light-emitting elements 20 cannot generate optical crosstalk phenomenon due to the shielding of the supporting part 11 and the reflection effect of the reflecting film 30 on the light; meanwhile, the raised support portion 11 can support other components of the backlight module, such as optical films, for example, the diffusion plate 40, etc., thereby ensuring the structural stability of the whole backlight module.
It should be noted that the steps S504 and S503 can be performed in an alternative order, for example, the light emitting element 20 is fixed on the circuit board 10, and then the reflective film 30 is covered by a plastic-absorbing process, and if the light emitting element 20 is flipped over by the reflective film 30, the reflective film 30 can be cut by a laser to expose the light emitting element 20.
In some embodiments of the present application, for example, for the embodiment of covering the reflective film 30 first and then fixing the light emitting elements 20, the reflective film 30 may further cover a side of the circuit board 10 where the light emitting elements 20 are fixed, and before the step of fixing the light emitting elements 20 between the adjacent supporting portions 11, the backlight module manufacturing method further includes forming through holes 31 by cutting the reflective film 30 with a laser to expose pads for fixing the light emitting elements 20 on the circuit board 10. Since the reflective film 30 is cut by laser to form the through hole 31, the position of the through hole 31 corresponds to the position of the bonding pad, and the light emitted from the light emitting element 20 to the bottom thereof is also reflected by the reflective film 30, thereby further improving the light extraction rate of the light emitting element 20.
Further, in order to better implement the backlight module in the present application, an embodiment of the present application further provides a display device on the backlight module, where the display device includes the backlight module according to any of the above embodiments. The display device in the embodiment of the present application has all the advantages of the backlight module due to the backlight module in the embodiment, and details are not repeated herein.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and parts that are not described in detail in a certain embodiment may refer to the above detailed descriptions of other embodiments, and are not described herein again. Also, two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, some features, structures, or characteristics of one or more embodiments of the present application may be combined as appropriate.
The backlight module, the manufacturing method thereof, and the display device provided in the embodiments of the present application are described in detail above, and the principles and embodiments of the present invention are explained in this document by applying specific examples, and the description of the embodiments above is only used to help understanding the method and the core idea of the present invention; meanwhile, for those skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. A backlight module, comprising:
a circuit board;
a plurality of light emitting elements disposed on the circuit board;
the circuit board is provided with a plurality of convex supporting parts, the supporting parts are positioned between the adjacent light-emitting elements, and the surfaces of the supporting parts are covered with reflecting films.
2. The backlight module of claim 1, wherein the support portions enclose to form a rectangle; or
The supporting parts are encircled to form a circle.
3. The backlight module of claim 1, wherein the support comprises a first support and a second support;
the first supporting parts are linearly arranged on the left side and the right side of the light-emitting element, the second supporting parts are linearly arranged on the front side and the rear side of the light-emitting element, and the first supporting parts and the second supporting parts corresponding to the same light-emitting element are enclosed to form a rectangle; or
First supporting part is the arc setting in the light emitting component left and right sides, the second supporting part is the arc setting both sides around light emitting component, first supporting part with the central angle that the second supporting part corresponds is less than or equal to 90, and is same light emitting component corresponds first supporting part with the second supporting part encloses to close and forms circularly.
4. The backlight module of claim 1, wherein an area of a cross section of the support portion parallel to the circuit board is gradually reduced in a direction away from the circuit board; and/or
Along the direction far away from the circuit board, the distance between any point on the surface of the supporting part and the center line of the nearest light-emitting element is gradually increased.
5. The backlight module of claim 1, wherein the support part is integrally molded with the circuit board;
the reflecting film also covers one surface of the circuit board, on which the light-emitting element is mounted, and the reflecting film is provided with a through hole, on which the light-emitting element is correspondingly mounted.
6. The backlight module of claim 1, further comprising a diffuser plate disposed on the support portion, the support portion being in point contact or line contact with the diffuser plate.
7. The backlight module of claim 6, wherein the support is shaped as a semi-ellipsoid, the apex of the semi-ellipsoid being in contact with the diffuser plate; or
The support part is in the shape of a pyramid, and the vertex of the pyramid is in contact with the diffusion plate.
8. A method for preparing a backlight module is characterized by comprising the following steps:
providing a circuit board;
forming a plurality of raised supporting parts on the circuit board;
covering a reflective film on the supporting part;
and a light emitting element is fixed between the adjacent support parts.
9. The method of claim 8, wherein the reflective film further covers a surface of the circuit board on which the light emitting elements are fixed, and before the step of fixing the light emitting elements between the adjacent supporting portions, the method further comprises:
and forming a through hole by cutting the reflecting film by using laser so as to expose a pad for fixing the light-emitting element on the circuit board.
10. A display device comprising the backlight module according to any one of claims 1 to 7.
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| CN202111264890.3A CN113985657A (en) | 2021-10-28 | 2021-10-28 | Backlight module, preparation method thereof and display device |
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| CN202111264890.3A CN113985657A (en) | 2021-10-28 | 2021-10-28 | Backlight module, preparation method thereof and display device |
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| WO2025051763A1 (en) * | 2023-09-04 | 2025-03-13 | Valeo Vision | Lighting device for a motor vehicle |
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