CN113973443B - Soft-hard combined circuit board and manufacturing method thereof - Google Patents
Soft-hard combined circuit board and manufacturing method thereof Download PDFInfo
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- CN113973443B CN113973443B CN202010719557.6A CN202010719557A CN113973443B CN 113973443 B CN113973443 B CN 113973443B CN 202010719557 A CN202010719557 A CN 202010719557A CN 113973443 B CN113973443 B CN 113973443B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 36
- 239000010410 layer Substances 0.000 claims abstract description 148
- 239000000758 substrate Substances 0.000 claims abstract description 137
- 239000012790 adhesive layer Substances 0.000 claims abstract description 61
- 238000000034 method Methods 0.000 claims abstract description 20
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 8
- 229920006259 thermoplastic polyimide Polymers 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 abstract 1
- -1 polyethylene terephthalate Polymers 0.000 description 11
- 229920000139 polyethylene terephthalate Polymers 0.000 description 8
- 239000005020 polyethylene terephthalate Substances 0.000 description 8
- 239000002355 dual-layer Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000003698 laser cutting Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
一种软硬结合电路板的制作方法，包括以下步骤：提供柔性内层线路基板；在柔性内层线路基板的相对两侧分别设置可剥离胶片，并开设至少一通孔贯穿柔性内层线路基板和两可剥离胶片；在通孔内填充导电膏，且导电膏从柔性内层线路基板的相对两侧伸出；剥离可剥离胶片制得中间结构；提供外层线路基板，包括绝缘层和布线层，且布线层设有至少一开口；提供粘接层且粘接层设有至少一第一通槽和至少一第二通槽；以及将中间结构通过两粘接层粘接于两个外层线路基板之间并压合，其中，导电膏与第一通槽对应设置以电连接布线层，两粘结层的第二通槽相互对应设置，且绝缘层朝第二通槽凹陷以与柔性内层线路基板粘结。本发明还涉及一种软硬结合电路板。
A method for manufacturing a rigid-flexible circuit board includes the following steps: providing a flexible inner circuit substrate; arranging peelable films on opposite sides of the flexible inner circuit substrate, and opening at least one through hole penetrating the flexible inner circuit substrate and the two peelable films; filling the through hole with conductive paste, and the conductive paste extends from opposite sides of the flexible inner circuit substrate; peeling off the peelable film to obtain an intermediate structure; providing an outer circuit substrate, including an insulating layer and a wiring layer, and the wiring layer is provided with at least one opening; providing an adhesive layer, and the adhesive layer is provided with at least one first through groove and at least one second through groove; and bonding the intermediate structure between two outer circuit substrates through two adhesive layers and pressing them together, wherein the conductive paste is arranged corresponding to the first through groove to electrically connect the wiring layer, the second through grooves of the two adhesive layers are arranged corresponding to each other, and the insulating layer is recessed toward the second through groove to bond with the flexible inner circuit substrate. The present invention also relates to a rigid-flexible circuit board.
Description
Technical Field
The present disclosure relates to circuit boards, and particularly to a circuit board with soft and hard combined and a method for manufacturing the same.
Background
The soft and hard combined Board (Rigid-Flexible Printed Circuit Board, R-F PCB) refers to a printed Circuit Board comprising one or more rigid areas and one or more flexible areas, and has the durability of a hard Board (RIGID PRINTED Circuit Board, RPCB) and the flexibility of a soft Board (Flexible Printed Circuit Board, FPCB, flexible Circuit Board), so that the soft and hard combined Board has the characteristics of light weight, compactness, severe application environment resistance and the like, and is particularly suitable for being applied to precision electronics such as portable electronic products, medical electronic products, military equipment and the like. Accordingly, many researchers have conducted extensive studies on the rigid-flex board in recent years, for example, ganasan, J.R. et al, published in month 1 of 2000 at IEEE Transactions on Electronics Packaging Manufacturing, volume:23, issue:1, page:28-31, chip On Chip (COC) and Chip On Board (COB) assembly on flex RIGID PRINTED circuit assemblies have studied the technique of assembling the rigid-flex board.
In general, the manufacturing process of the rigid-flex board comprises the following steps: firstly, manufacturing a flexible circuit substrate; then, pressing the hard circuit substrate on the soft circuit substrate to form a circuit on the hard circuit substrate; finally, a first opening is formed in a preset area of the hard circuit substrate, so that part of the soft circuit substrate can be exposed from the first opening on the hard circuit substrate to form a flexible region, and the rest part of the soft circuit substrate and the hard circuit substrate form a rigid region together to form a soft and hard combined board with the flexible region and the rigid region. The method is complex, and a manufacturing method of the rigid-flex board with a simpler process is needed.
Disclosure of Invention
In view of the foregoing, there is a need for a method for manufacturing a flexible-rigid printed circuit board that solves the above-mentioned problems.
It is also necessary to provide a rigid-flex circuit board.
A manufacturing method of a soft and hard combined circuit board comprises the following steps:
Providing a flexible inner layer circuit substrate;
the method comprises the steps that peelable films are respectively arranged on two opposite sides of a flexible inner-layer circuit substrate, and at least one through hole is formed to penetrate through the flexible inner-layer circuit substrate and the two peelable films;
Filling conductive paste in the through holes, wherein the conductive paste extends out of two opposite sides of the flexible inner-layer circuit substrate;
Peeling the peelable adhesive sheet to obtain an intermediate structure in which the conductive paste protrudes from opposite sides of the flexible inner-layer wiring substrate;
Providing an outer layer circuit substrate, wherein the outer layer circuit substrate comprises an insulating layer and a wiring layer arranged on one surface of the insulating layer, and the wiring layer is provided with at least one opening to expose part of the insulating layer;
Providing an adhesive layer, wherein the adhesive layer is provided with at least one first through groove and at least one second through groove; and
The middle structure is adhered between the two outer circuit substrates through the two adhesive layers and is pressed, wherein the conductive paste and the first through grooves are correspondingly arranged to be electrically connected with the wiring layers, the second through grooves of the two adhesive layers are correspondingly arranged, and the insulating layer is sunken towards the second through grooves to be adhered with the flexible inner circuit substrates.
The utility model provides a soft or hard combination circuit board, includes flexible inlayer circuit substrate, adhesive linkage, two inlayer circuit substrate, two outer circuit substrate range upon range of in flexible inlayer circuit substrate both sides, and through respectively through the adhesive linkage with flexible inlayer circuit substrate bonds, at least one opening runs through each outer circuit substrate with the adhesive linkage is in order to expose flexible inlayer circuit substrate, at least one connecting hole runs through flexible inlayer circuit substrate and adhesive linkage is in order to communicate two outer circuit substrate, soft or hard combination circuit board still includes insulating layer and conductive paste, the insulating layer bond in outer circuit substrate deviates from flexible inlayer circuit substrate's surface, open-ended lateral wall and flexible inlayer circuit substrate corresponds the open-ended surface, conductive paste fills up the connecting hole is in order to electrically connect flexible inlayer circuit substrate with outer circuit substrate.
The manufacturing method of the soft and hard combined circuit board does not need to carry out a cover opening step, and the manufacturing process is simplified. In addition, in the manufacturing method of the soft and hard combined circuit board, the conductive paste is used for realizing the electric connection of the inner circuit and the outer circuit, so that the influence on the flatness of the circuit board when copper plating is used for forming the conductive holes is reduced. In the soft and hard combined circuit board manufactured by the manufacturing method of the soft and hard combined circuit board, the insulating layer is positioned on the outermost layer, so that the insulating layer can be used as a solder mask layer of the soft and hard combined circuit board to protect the soft and hard combined circuit board at the same time, the solder mask layer is not required to be formed, and the flatness of the circuit board is improved while the process is simplified. In addition, the manufacturing process of the manufacturing method of the soft and hard combined circuit board can be used for manufacturing ultrathin soft and hard combined boards.
Drawings
Fig. 1 is a schematic cross-sectional view of a flexible inner circuit substrate according to an embodiment of the present invention.
Fig. 2 is a schematic cross-sectional view of the flexible inner circuit substrate shown in fig. 1 with a peelable film provided thereon and through holes.
Fig. 3 is a schematic cross-sectional view of the via hole of fig. 2 after filling with a conductive paste.
Fig. 4 is a schematic cross-sectional view of an intermediate structure formed after peeling the peelable film of fig. 3.
Fig. 5 is a schematic cross-sectional view of an outer layer wiring substrate according to an embodiment of the present invention.
Fig. 6 is a schematic cross-sectional view of an adhesive layer provided on the outer-layer wiring substrate shown in fig. 5.
Fig. 7 is a schematic cross-sectional view of the intermediate structure of fig. 4 and the outer layer wiring substrate with the adhesive layer shown in fig. 6 stacked.
Fig. 8 is a schematic cross-sectional view of the laminated intermediate structure of fig. 7 and an outer layer circuit substrate with an adhesive layer laminated to form a rigid-flex circuit board.
Fig. 9 is a schematic cross-sectional view of an adhesive layer provided on the outer layer wiring substrate shown in fig. 5.
Fig. 10 is a schematic cross-sectional view of a rigid-flex circuit board formed by applying the outer circuit substrate with the adhesive layer shown in fig. 9.
Fig. 11 is a schematic cross-sectional view of a glue line formed on the intermediate structure shown in fig. 4.
Fig. 12 is a schematic cross-sectional view of an adhesive layer formed on the intermediate structure shown in fig. 4.
Fig. 13 is a schematic cross-sectional view of an insulating layer providing opening in the soft and hard combined circuit board shown in fig. 8.
Fig. 14 is a schematic cross-sectional view of an insulating layer providing opening in the soft and hard combined circuit board shown in fig. 10.
Fig. 15 is a schematic cross-sectional view of a soft and hard combined circuit board according to an embodiment of the present invention.
Fig. 16 is a schematic cross-sectional view of a soft and hard combined circuit board according to another embodiment of the present invention.
Description of the main reference signs
| Flexible inner layer circuit substrate | 10 |
| Insulating substrate | 11 |
| First inner circuit layer | 13 |
| A second inner circuit layer | 15 |
| First direction | X |
| Peelable film | 20 |
| Through hole | 21 |
| Conductive paste | 30 |
| Intermediate structure | 10a |
| Outer layer circuit substrate | 50、55 |
| Insulating layer | 51 |
| Wiring layer | 53 |
| An opening | 530、510、550 |
| Adhesive layer | 60 |
| First through groove | 61 |
| Second through groove | 63 |
| Recess portion | 65 |
| Soft and hard combined circuit board | 100、100a |
| Adhesive layer | 70 |
| Connecting hole | 101 |
| First part | 102 |
| Second part | 103 |
| Third part | 104 |
The invention will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Some embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.
Referring to fig. 1 to 8 in combination, the present invention provides a method for manufacturing a soft and hard combined circuit board, which includes the following steps:
in step S1, referring to fig. 1, a flexible inner circuit board 10 is provided.
In this embodiment, the flexible inner circuit board 10 is a dual-layer circuit board, and includes an insulating base 11, a first inner circuit layer 13, and a second inner circuit layer 15. Wherein the first inner wiring layer 13 and the second inner wiring layer 15 are respectively stacked on opposite sides of the insulating substrate 11 along a first direction X. The insulating substrate 11 is a polyimide film layer.
In some embodiments, the flexible inner circuit substrate 10 may also be a single-layer circuit substrate or a multi-layer circuit substrate. When the flexible inner circuit board 10 is a multi-layer circuit board, the flexible inner circuit board 10 further includes at least one third inner circuit layer (not shown), which is embedded in the insulating base 11 and is spaced apart from and laminated with the first inner circuit layer 13 and the second inner circuit layer 15, respectively.
In some embodiments, the insulating substrate 11 may also be selected from, but not limited to, polyethylene terephthalate, polyethylene naphthalate, polyethylene, teflon, liquid crystal high molecular polymer, polyvinyl chloride, polythioamine, polymethyl methacrylate, polycarbonate, polyethylene terephthalate, or polyimide-polyethylene-terephthalate copolymer, or a combination thereof, and the like.
In step S2, referring to fig. 2, peelable sheets 20 are disposed on opposite sides of the flexible inner circuit board 10, and at least one through hole 21 is formed to penetrate the flexible inner circuit board 10 and the two peelable sheets 20.
In this embodiment, the peelable film 20 is polyethylene terephthalate (PET).
In some embodiments, the peelable film 20 may be made of other materials, which only needs to ensure that the peelable film 20 has a slight tackiness, so that the peelable film is easy to adhere to the flexible inner circuit board 10 and be easily peeled in a subsequent process, so that details are not described here.
The through holes 21 may be formed by, but not limited to, laser cutting, mechanical cutting, etching, and the like.
In step S3, referring to fig. 3, the through hole 21 is filled with the conductive paste 30, and the conductive paste 30 extends from two opposite sides of the flexible inner circuit board 10.
In this embodiment, the conductive paste 30 fills the through hole 21. In some embodiments, the conductive paste 30 may not fill the entire through hole 21, and it is only necessary to ensure that the conductive paste 30 protrudes from opposite sides of the flexible inner circuit board 10.
The conductive paste 30 may be filled in the through holes 21 by, but not limited to, printing, injection, or the like.
In this embodiment, after the conductive paste 30 is filled in the through hole 21, the conductive paste 30 may be baked so that the conductive paste 30 is pre-cured, thereby further ensuring that the conductive paste 30 maintains a certain shape.
In step S4, referring to fig. 4, the peelable film 20 is peeled to obtain the intermediate structure 10a. Wherein, in the intermediate structure 10a, the conductive paste 30 protrudes from opposite sides of the flexible inner circuit substrate 10.
In step S5, referring to fig. 5, an outer circuit substrate 50 is provided, the outer circuit substrate 50 includes an insulating layer 51 and a wiring layer 53 disposed on a surface of the insulating layer 51, and the wiring layer 53 is provided with at least one opening 530 to expose a portion of the insulating layer 51.
In the present embodiment, the outer circuit board 50 is a single-sided circuit board, that is, the wiring layer 53 is formed of a circuit layer.
In some embodiments, the wiring layer 53 may also be a dual-layer wiring structure or a multi-layer wiring structure. That is, the wiring layer 53 may include two or more laminated wiring layers.
Preferably, the insulating layer 51 is a polyimide film. More preferably, the insulating layer 51 is a thermoplastic polyimide film.
The openings 530 may be formed by, but are not limited to, laser cutting, mechanical cutting, etching, and the like.
In step S6, referring to fig. 6, an adhesive layer 60 is disposed on a side of the wiring layer 53 facing away from the insulating layer 51, and the adhesive layer 60 is provided with at least one first through slot 61 and at least one second through slot 63. Wherein the first through groove 61 is disposed corresponding to the wiring layer 53 to expose a part of the wiring layer 53, and the second through groove 63 communicates with the opening 530 to form a recess 65.
Preferably, the thickness of the adhesive layer 60 is less than or equal to the height of the conductive paste 30 protruding from one side of the flexible inner circuit substrate 10 along the first direction X.
More preferably, the thickness of the adhesive layer 60 is smaller than the height of the conductive paste 30 protruding from one side of the flexible inner circuit substrate 10 along the first direction X.
The first through groove 61 and the second through groove 63 may be formed by, but not limited to, laser cutting, mechanical cutting, etching, and the like.
The adhesive layer 60 may be, but is not limited to, prepreg (pp= Perperg), and other lamination adhesive materials commonly used in the art may be used, and will not be described herein.
In step S7, referring to fig. 7 and 8, the intermediate structure 10a is sandwiched between two outer circuit boards 50 with the adhesive layer and pressed to obtain the soft and hard combined circuit board 100. Wherein each of the outer circuit substrates 50 is bonded to the intermediate structure 10a through the adhesive layer 60, the conductive paste 30 is disposed corresponding to the first through groove 61 to electrically connect the wiring layer 53, the second through grooves 63 of the two adhesive layers 60 are disposed corresponding to each other, and the insulating layer 51 is recessed toward the recess 65 to be bonded to the flexible inner circuit substrate 10.
Specifically, the conductive paste 30 softens and deforms during hot pressing, so as to fill the first through groove 61 and electrically connect the flexible inner circuit substrate 10 and the outer circuit substrate 50, and after pressing, the width of the portion of the conductive paste 30 protruding from the flexible inner circuit substrate 10 is greater than the width of the portion of the conductive paste 30 embedded in the flexible inner circuit substrate 10, thereby improving the stability of the electrical connection between the flexible inner circuit substrate 10 and the outer circuit substrate 50. The adhesive layer 60 is softened and flows in hot pressing to be reinforced, so that the gap between the outer layer circuit substrate 50 and the gap between the flexible inner layer circuit substrate 10 and the gap between the outer layer circuit substrate 50 and the flexible inner layer circuit substrate 10 are gradually filled, and the outer layer circuit substrate 50 and the flexible inner layer circuit substrate 10 are bonded. The insulating layer 51 is forced and softened by heat at the time of hot pressing and is recessed toward the recessed portion 65 to be bonded with the flexible inner circuit board 10.
Wherein, when the thickness of the adhesive layer 60 is less than or equal to the height of the conductive paste 30 protruding from one side of the flexible inner circuit substrate 10 in the first direction X, it is convenient to achieve contact of the conductive paste 30 with the wiring layer 53 before lamination, thereby facilitating ensuring the effectiveness of the electrical connection between the flexible inner circuit substrate 10 and the outer circuit substrate 50, especially when the thickness of the adhesive layer 60 is less than the height of the conductive paste 30 protruding from one side of the flexible inner circuit substrate 10 in the first direction X.
The manufacturing method of the soft and hard combined circuit board does not need to carry out a cover opening step, and the manufacturing process is simplified. In addition, in the method for manufacturing the soft and hard combined circuit board, the conductive paste 30 is used for realizing the electric connection of the inner circuit and the outer circuit, so that the influence on the flatness of the circuit board when copper plating is used for forming the conductive holes is reduced. In the method for manufacturing the soft and hard combined circuit board, the insulating layer 51 is positioned on the outermost layer, so that the insulating layer can be used as the solder mask of the soft and hard combined circuit board to protect the soft and hard combined circuit board at the same time, and the solder mask is not required to be formed any more, so that the process is simplified, and the flatness of the circuit board is improved. In addition, the manufacturing process of the manufacturing method of the soft and hard combined circuit board can be used for manufacturing ultrathin soft and hard combined boards.
In some embodiments, referring to fig. 9, before step S7, the method for manufacturing the soft and hard combined circuit board may further include: a glue layer 70 is disposed in the opening 530, and the glue layer 70 is adhered to the insulating layer 51. Referring to fig. 10, in step S7, when the intermediate structure 10a is sandwiched between the two outer circuit boards 50 and pressed, the insulating layer 51 is recessed toward the recess 65 and the flexible inner circuit board 10 is bonded by the adhesive layer 70, so as to form a soft-hard combined circuit board 100a.
In some embodiments, referring to fig. 11, the adhesive layer 70 may also be disposed on the surface of the intermediate structure 10a before step S7, and when the intermediate structure 10a is sandwiched between the two outer circuit substrates 50 in step S7, the adhesive layer 70 is disposed corresponding to the recess 65, and after the intermediate structure 10a and the two outer circuit substrates 50 are pressed together, the insulating layer 51 is recessed towards the recess 65 and is bonded to the flexible inner circuit substrate 10 through the adhesive layer 70.
In some embodiments, referring to fig. 12, the adhesive layer 60 may be further disposed on the surface of the intermediate structure 10a before the step S7, where the first through groove 61 is configured to receive a portion of the conductive paste 30 protruding from one side of the flexible inner circuit board 10 along the first direction X. In step S7, when the intermediate structure 10a is sandwiched between the two outer circuit boards 50, the second through slot 63 communicates with the opening 530.
In some embodiments, after step S7, the method for manufacturing a soft and hard combined circuit board may further include: at least one opening 510 (see fig. 13 and 14) is provided in the insulating layer 51 to expose a portion of the wiring layer 53 as a connection pad for connecting other electronic components.
Referring to fig. 15, the present invention further provides a flexible-rigid combined circuit board 100, which includes a flexible inner circuit board 10, an adhesive layer 60, and two outer circuit boards 55. The two outer circuit substrates 55 are laminated on both sides of the flexible inner circuit substrate 10 and bonded to the flexible inner circuit substrate 10 by the adhesive layers 60, respectively. At least one opening 550 penetrates each of the outer circuit substrate 55 and the adhesive layer 60 to expose the flexible inner circuit substrate 10. At least one connecting hole 101 penetrates the flexible inner circuit board 10 and the adhesive layer 60 to connect the two outer circuit boards 55. The soft and hard combined circuit board 100 further includes an insulating layer 51 and a conductive paste 30. The insulating layer 51 is adhered to the surface of the outer circuit substrate 55 facing away from the flexible inner circuit substrate 10, the side wall of the opening 550, and the surface of the flexible inner circuit substrate 10 corresponding to the opening 550. The conductive paste 30 fills the connection holes 101 to electrically connect the flexible inner circuit substrate 10 and the outer circuit substrate 55.
In this embodiment, the connection hole 101 is a stepped hole, and includes a first portion 102, a second portion 103, and a third portion 104 that are sequentially connected. The second portion 103 penetrates through the flexible inner circuit board 10, and the first portion 102 and the third portion 104 respectively penetrate through the adhesive layers 60 at two sides of the flexible inner circuit board 10. The width of the first portion 102 and the third portion 104 is greater than the width of the second portion 103, respectively.
In this embodiment, the flexible inner circuit board 10 is a dual-layer circuit board, and includes an insulating base 11, a first inner circuit layer 13, and a second inner circuit layer 15. Wherein the first inner circuit layer 13 and the second inner circuit layer 15 are respectively stacked on opposite sides of the insulating substrate 11. The connection hole 101 penetrates the first inner circuit layer 13, the insulating substrate 11, and the second inner circuit layer 15 in sequence. The insulating substrate 11 is a polyimide film layer.
In some embodiments, the flexible inner circuit substrate 10 may also be a single-layer circuit substrate or a multi-layer circuit substrate. When the flexible inner circuit board 10 is a multi-layer circuit board, the flexible inner circuit board 10 further includes at least one third inner circuit layer (not shown), which is embedded in the insulating base 11 and is spaced apart from and laminated with the first inner circuit layer 13 and the second inner circuit layer 15, respectively.
In some embodiments, the insulating substrate 11 may also be selected from, but not limited to, polyethylene terephthalate, polyethylene naphthalate, polyethylene, teflon, liquid crystal high molecular polymer, polyvinyl chloride, polythioamine, polymethyl methacrylate, polycarbonate, polyethylene terephthalate, or polyimide-polyethylene-terephthalate copolymer, or a combination thereof, and the like.
In this embodiment, the outer circuit board 55 is a single circuit layer. In some embodiments, the outer circuit substrate 55 may also be a dual layer circuit substrate or a multi-layer circuit substrate.
Preferably, the insulating layer 51 is a polyimide film. More preferably, the insulating layer 51 is a thermoplastic polyimide film.
The adhesive layer 60 may be, but is not limited to, prepreg (pp= Perperg), and other lamination adhesive materials commonly used in the art may be used, and will not be described herein.
At least one opening 510 may be further formed on the insulating layer 51 to expose a portion of the outer circuit substrate 55 as a connection pad for connecting other electronic components.
In some embodiments, referring to fig. 16, the soft and hard combined circuit board 100 may further include a glue layer 70, the glue layer 70 is disposed in the opening 550, and at the opening 550, the insulating layer 51 is bonded to the flexible inner circuit board 10 through the glue layer 70.
While the invention has been described with reference to the preferred embodiments, it will be understood by those skilled in the art that the invention is not limited thereto, and that the invention is not limited thereto, but rather by the scope of the appended claims, while the above disclosure is directed to equivalent embodiments capable of being altered or modified in a manner similar to the above embodiments, any simple modification, equivalent variations and modification made in accordance with the technical principles of the present invention fall within the scope of the technical aspects of the present invention.
Claims (10)
1. A manufacturing method of a soft and hard combined circuit board comprises the following steps:
Providing a flexible inner layer circuit substrate;
the method comprises the steps that peelable films are respectively arranged on two opposite sides of a flexible inner-layer circuit substrate, and at least one through hole is formed to penetrate through the flexible inner-layer circuit substrate and the two peelable films;
Filling conductive paste in the through holes, wherein the conductive paste extends out of two opposite sides of the flexible inner-layer circuit substrate;
Peeling the peelable adhesive sheet to obtain an intermediate structure in which the conductive paste protrudes from opposite sides of the flexible inner-layer wiring substrate;
Providing an outer layer circuit substrate, wherein the outer layer circuit substrate comprises an insulating layer and a wiring layer arranged on one surface of the insulating layer, and the wiring layer is provided with at least one opening to expose part of the insulating layer;
Providing an adhesive layer, wherein the adhesive layer is provided with at least one first through groove and at least one second through groove; and
And bonding the intermediate structure between the two outer circuit substrates through two bonding layers and pressing, wherein the conductive paste and the first through grooves are correspondingly arranged to electrically connect the wiring layers, the second through grooves of the two bonding layers are correspondingly arranged, and the insulating layer is sunken towards the second through grooves to be bonded with the flexible inner circuit substrates.
2. The method of manufacturing a flexible-to-rigid circuit board according to claim 1, wherein the height of the conductive paste protruding from one side of the flexible inner circuit board is greater than or equal to the thickness of the adhesive layer on the same side of the flexible inner circuit board before the intermediate structure, the adhesive layer and the outer circuit board are laminated.
3. The method for manufacturing a soft and hard combined circuit board according to claim 1, wherein the step of bonding the intermediate structure between the two outer circuit substrates through the two adhesive layers and pressing, wherein the conductive paste is disposed corresponding to the first through grooves to electrically connect the wiring layers, the second through grooves of the two adhesive layers are disposed corresponding to each other, and the insulating layer is recessed toward the second through grooves to be bonded with the flexible inner circuit substrate is specifically as follows:
An adhesive layer is arranged on one side, away from the insulating layer, of the wiring layer, and the adhesive layer is provided with at least one first through groove and at least one second through groove, wherein the first through groove is arranged corresponding to the wiring layer so as to expose part of the wiring layer, and the second through groove is communicated with the opening to form a concave part; and
The middle structure is clamped between two outer circuit substrates with the adhesive layers and pressed, wherein each outer circuit substrate is bonded with the middle structure through the adhesive layers, the conductive paste is correspondingly arranged with the first through grooves to be electrically connected with the wiring layers, the second through grooves of the two adhesive layers are correspondingly arranged with each other, and the insulating layer is sunken towards the sunken parts to be bonded with the flexible inner circuit substrate.
4. The method for manufacturing a soft and hard combined circuit board according to claim 3, wherein,
Before the intermediate structure, the adhesive layer and the outer layer circuit substrate are pressed, the manufacturing method of the soft and hard combined circuit board further comprises the steps of arranging an adhesive layer in the opening, and adhering the adhesive layer to the insulating layer or arranging adhesive layers on two opposite sides of the intermediate structure along the protruding direction of the conductive paste so that the adhesive layer is adhered to the surface of the flexible inner layer circuit substrate;
When the intermediate structure, the adhesive layer and the outer layer circuit substrate are pressed, the insulating layer is sunken towards the sunken part and is adhered to the flexible inner layer circuit substrate through the adhesive layer.
5. The method of claim 1, further comprising providing at least one opening in the insulating layer to expose a portion of the wiring layer after laminating the intermediate structure, the adhesive layer, and the outer circuit substrate.
6. The method for manufacturing a soft and hard combined circuit board according to claim 1, characterized in that, before the peelable film is peeled, the manufacturing method of the soft and hard combined circuit board further comprises the step of baking the conductive paste filled in the through holes to enable the conductive paste to be pre-cured.
7. The method of manufacturing a rigid-flex circuit board according to claim 1, wherein said insulating layer is a thermoplastic polyimide film.
8. The flexible-rigid combined circuit board is characterized in that the flexible-rigid combined circuit board is manufactured by the manufacturing method according to any one of claims 1 to 7, the flexible-rigid combined circuit board comprises a flexible inner circuit substrate, an adhesive layer and two outer circuit substrates, the two outer circuit substrates are stacked on two sides of the flexible inner circuit substrate and are respectively adhered with the flexible inner circuit substrate through the adhesive layer, the flexible-rigid combined circuit board is characterized in that at least one opening penetrates through each outer circuit substrate and the adhesive layer to expose the flexible inner circuit substrate, at least one connecting hole penetrates through the flexible inner circuit substrate and the adhesive layer to be communicated with the two outer circuit substrates, the flexible-rigid combined circuit board further comprises an insulating layer and conductive paste, the insulating layer is adhered on the surface of the outer circuit substrate, which is away from the flexible inner circuit substrate, the side wall of the opening and the surface of the flexible inner circuit substrate, which corresponds to the opening, and the conductive paste fills the connecting hole to electrically connect the flexible inner circuit substrate and the outer circuit substrate.
9. The flexible and rigid circuit board of claim 8, further comprising a glue layer disposed in said opening, wherein said insulating layer bonds said flexible inner circuit substrate through said glue layer at said opening.
10. The rigid-flex circuit board of claim 8, wherein said insulating layer is a thermoplastic polyimide film.
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| CN202010719557.6A CN113973443B (en) | 2020-07-23 | 2020-07-23 | Soft-hard combined circuit board and manufacturing method thereof |
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| CN202010719557.6A CN113973443B (en) | 2020-07-23 | 2020-07-23 | Soft-hard combined circuit board and manufacturing method thereof |
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|---|---|---|---|---|
| JP2002043750A (en) * | 2000-07-27 | 2002-02-08 | Toppan Printing Co Ltd | Method for manufacturing multilayer flexible wiring board and multilayer flexible wiring board manufactured thereby |
| CA2802112A1 (en) * | 2009-07-10 | 2011-01-13 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Fluidized-bed reactor system |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5204871B2 (en) * | 2011-05-25 | 2013-06-05 | タツタ電線株式会社 | Partial multilayer flexible printed wiring board |
| JP2014204088A (en) * | 2013-04-09 | 2014-10-27 | 株式会社フジクラ | Multilayer wiring board and method of manufacturing the same |
| JP6337394B2 (en) * | 2013-07-05 | 2018-06-06 | パナソニックＩｐマネジメント株式会社 | Semiconductor device |
| KR101572916B1 (en) * | 2014-06-05 | 2015-11-30 | 대덕지디에스 주식회사 | Method of manufacturing rigid-flexible circuit board |
| KR101576840B1 (en) * | 2014-08-06 | 2015-12-11 | 대덕지디에스 주식회사 | A rigid-flexible circuit board and manufacturing method thereof |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002043750A (en) * | 2000-07-27 | 2002-02-08 | Toppan Printing Co Ltd | Method for manufacturing multilayer flexible wiring board and multilayer flexible wiring board manufactured thereby |
| CA2802112A1 (en) * | 2009-07-10 | 2011-01-13 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Fluidized-bed reactor system |
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