CN113937144A - Display panel, method for making the same, and display device - Google Patents
Display panel, method for making the same, and display device Download PDFInfo
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- CN113937144A CN113937144A CN202111209635.9A CN202111209635A CN113937144A CN 113937144 A CN113937144 A CN 113937144A CN 202111209635 A CN202111209635 A CN 202111209635A CN 113937144 A CN113937144 A CN 113937144A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
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Abstract
The embodiment of the application provides a display panel, a manufacturing method thereof and a display device. The display panel comprises a substrate, a first pixel defining layer arranged on the substrate and dividing the substrate into a plurality of pixel areas; and second and third pixel banks partitioning each pixel region into a plurality of sub-pixel regions; on the substrate in each pixel area, a groove is formed in each N sub-pixel areas, the second pixel bank is arranged in the groove, a third pixel bank is arranged between every two adjacent sub-pixel areas in each N sub-pixel area, and the third relative height of the third pixel bank is smaller than the second relative height of the second pixel bank and smaller than the first relative height of the first pixel defining layer. During ink-jet printing, ink can deposit in the recess to reduce the climbing height of ink on the second pixel bank, improve the uniformity of film forming appearance between the sub-pixel region, improve the film forming uniformity of ink-jet printing in the sub-pixel region, improve the luminous mura problem of organic light emitting device.
Description
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a display panel, a manufacturing method thereof, and a display device.
Background
This section provides background information related to the present disclosure only and is not necessarily prior art.
Organic Light Emitting Diode (OLED) has many advantages of self-luminescence, high brightness, high contrast, fast response speed, wide viewing angle, simple structure, flexible display, etc., and attracts the favor of colleges and universities and enterprises due to its excellent performance, so that it is developed rapidly and widely applied to display products. Compared with the conventional evaporation method for manufacturing the OLED, the method has the problems of low material utilization rate and the like, and the ink jet printing technology (IJP) is gradually and widely applied to the field of flat panel display by virtue of the advantages of high material utilization rate, low cost and the like, wherein the printing methods of the ink jet printing technology comprise Side By Side (SBS), Line bank and the like, and the Line bank printing method is widely applied to the OLED production due to the advantages of high printing uniformity, high speed and the like.
In the related art, when the OLED device is manufactured by using the inkjet printing technique, the difference in the thickness of the film formed between pixels is caused by the error in the amount of ink ejected between the plurality of nozzles, and the luminance is not uniform when the difference is reflected on the light emitting device. In order to solve the problem, a low bank is arranged between each row of same-color sub-pixel areas printed by adopting a Line bank printing technology, and high banks are respectively arranged at two ends of each row of same-color sub-pixel areas, so that the ink among the same-color sub-pixel areas of each row is communicated with each other, the ink volume difference among the sub-pixel areas is homogenized, and a uniform film is obtained. However, since the ink climbs on the bank and the climbing height of the ink on the high bank is larger than that on the low bank, the film formation state of the ink at the high bank position is inconsistent with the film formation morphology at the middle low bank position (as shown in fig. 1), and the light emission mura problem is caused by reflection on the light emitting device.
Disclosure of Invention
The embodiment of the application provides a display panel, a manufacturing method thereof and a display device, which are used for improving the film forming uniformity of ink-jet printing in a sub-pixel area and improving the problem of light-emitting mura of an organic light-emitting device. The specific technical content is as follows:
in a first aspect, an embodiment of the present application provides a display panel, including:
a substrate;
a first pixel defining layer disposed on the substrate and dividing the substrate into a plurality of pixel regions; and
a second pixel bank and a third pixel bank that partition each pixel region into a plurality of sub-pixel regions;
a groove is formed in every N sub-pixel regions on the substrate located in each pixel region, N is a positive integer, the second pixel bank is arranged in the groove, a third pixel bank is arranged between every two adjacent sub-pixel regions in every N sub-pixel regions, a third relative height of the third pixel bank is smaller than a second relative height of the second pixel bank and smaller than a first relative height of the first pixel defining layer, and the first relative height, the second relative height and the third relative height respectively refer to a distance from a surface, far away from the substrate, of the first pixel defining layer to the substrate, a distance from a surface, far away from the substrate, of the second pixel bank to the substrate, and a distance from a surface, far away from the substrate, of the third pixel bank to the substrate.
In some embodiments of the present application, the second pixel bank has two first sidewalls oppositely disposed, the first sidewalls facing the sub-pixel region, and a gap exists between the first sidewalls and second sidewalls of the groove corresponding thereto.
In some embodiments of the present application, the first sidewall and/or the second sidewall are sloped sidewalls, and a gap between the second sidewall and the first sidewall is gradually reduced in a depth direction of the groove.
In some embodiments of the present application, the substrate includes a substrate base plate, a planarization layer disposed on the substrate base plate, and a first electrode layer disposed on the planarization layer, the first electrode layer includes a plurality of first electrodes, each of the first electrodes is correspondingly disposed in the sub-pixel region, and the groove is opened on the planarization layer.
In some embodiments of the present application, the first electrode extends into the groove, an insulating layer is disposed in the groove, the insulating layer covers the first electrode extending into the groove, and the second pixel bank is disposed on the insulating layer.
In some embodiments of the present application, a recessed groove is formed on the first sidewall, and the first electrode extends into the recessed groove and extends into the recessed groove.
In some embodiments of the present application, the angle between the sloped side wall and the bottom wall of the groove is between 30 ° and 60 °.
In some embodiments of the present application, the thickness of the first electrode is 0.05um to 0.2um, and the thickness of the insulating layer is 0.3 um to 0.4 um.
In some embodiments of the present application, the depth of the groove is 0.2um to 1 um.
In some embodiments of the present application, the base further includes a driving circuit layer disposed between the substrate base plate and the planarization layer.
In some embodiments of the present application, the display device further includes a light emitting layer disposed on a side of the first electrode in each of the sub-pixel regions, the side being far away from the substrate;
in each pixel area, at least every N light-emitting layers in the sub-pixel areas are light-emitting layers of the same color.
In some embodiments of the present application, the light emitting device further includes a second electrode layer, where the second electrode layer includes a plurality of second electrodes, and the second electrodes are correspondingly disposed on a side of the light emitting layer away from the substrate.
In a second aspect, an embodiment of the present application provides a method for manufacturing a display panel, including the following steps:
providing a substrate;
forming a first pixel defining layer on a substrate, the first pixel defining layer dividing the substrate into a plurality of pixel regions;
forming a plurality of grooves on the substrate in each pixel region;
forming a second pixel bank and a third pixel bank on the substrate within each pixel region, the second pixel bank and the third pixel bank partitioning each pixel region into a plurality of sub-pixel regions, a groove appears every N sub-pixel regions in each pixel region, N is a positive integer, a second pixel bank is formed in the groove, a third pixel bank is formed between every two adjacent sub-pixel regions in every N sub-pixel regions, wherein a third relative height of the third pixel bank is less than a second relative height of the second pixel bank, and is smaller than the first relative height of the first pixel defining layer, and the first relative height, the second relative height and the third relative height respectively refer to the distance from the surface of the first pixel defining layer far from the substrate to the substrate, the distance from the surface of the second pixel bank far from the substrate to the substrate, and the distance from the surface of the third pixel bank far from the substrate to the substrate.
In a third aspect, an embodiment of the present application provides a display device, including the display panel according to any one of the first aspect.
The embodiment of the application has the following beneficial effects:
in the display panel provided in the embodiment of the application, the first pixel defining layer divides the substrate into a plurality of pixel regions, the second pixel bank and the third pixel bank divide each pixel region into a plurality of sub-pixel regions, a groove is formed in each N sub-pixel regions on the substrate located in each pixel region, the second pixel bank is arranged in the groove, the third pixel bank is arranged between two adjacent sub-pixel regions in each N sub-pixel region, and the third relative height of the third pixel bank is smaller than the second relative height of the second pixel bank and smaller than the first relative height of the first pixel defining layer. Therefore, in the process of preparing the luminescent material layer by the ink-jet printing process, the ink can cross the third pixel bank between every N sub-pixel areas, so that the volume of the ink between every N sub-pixel areas is homogenized, meanwhile, the ink can be deposited in the grooves in the sub-pixel areas at two ends in every N sub-pixel areas, the climbing height of the ink on the second pixel banks in the grooves is reduced, the consistency of the film forming morphology between every N sub-pixel areas is improved, the film forming uniformity of the ink-jet printing in the sub-pixel areas is improved, and the luminescent mura problem of the organic light-emitting device is improved. In addition, the display panel of the embodiment of the application can be applied to a display device, so that the display quality of the display device can be improved.
Of course, not all advantages described above need to be achieved at the same time in the practice of any one product or method of the present application.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the drawings used in the description of the embodiments of the present application or the related art are briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
FIG. 1 is a schematic diagram of a film formation profile in a sub-pixel region of a display panel when ink-jet printing is used to print an organic light emitting device in the prior art;
fig. 2 is a schematic top view of a display panel according to an embodiment of the present disclosure;
FIG. 3 is a cross-sectional view taken along line A-A of FIG. 2;
FIG. 4 is a cross-sectional view taken along line B-B of FIG. 2;
FIG. 5 is a cross-sectional view taken along line C-C of FIG. 2;
FIG. 6 is a cross-sectional view taken along line D-D of FIG. 2;
fig. 7 is a schematic diagram of a film formation morphology in a sub-pixel region when an inkjet printing organic light emitting device is adopted in a display panel provided in an embodiment of the present application;
fig. 8 is a schematic structural diagram of an insulating layer disposed in a groove on a substrate according to an embodiment of the present disclosure;
fig. 9 is a schematic structural view illustrating a caulking groove formed in a first sidewall of a second pixel bank according to an embodiment of the present disclosure;
FIG. 10 is a graph of the number of subpixel areas in communication with film formation uniformity;
fig. 11 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present disclosure.
As shown in fig. 2 to 7, an embodiment of the first aspect of the present application provides a display panel 100, which includes a substrate 110, a first pixel defining layer 120, a second pixel bank 130, and a third pixel bank 140, where the first pixel defining layer 120 is disposed on the substrate 110 and divides the substrate 110 into a plurality of pixel regions 150, the second pixel bank 130 and the third pixel bank 140 divide each pixel region 150 into a plurality of sub-pixel regions 160, where a groove 170 is formed in each N sub-pixel regions 160 on the substrate 110 in each pixel region 150, N is a positive integer, the second pixel bank 130 is disposed in the groove 170, the third pixel bank 140 is disposed between two adjacent sub-pixel regions 160 in each N sub-pixel regions 160, and a third relative height H of the third pixel bank 140 is provided3Is smaller than second relative height H of second pixel bank 1302And is smaller than the first relative height H of the first pixel defining layer 1201First relative height H1Second relative height H2And a third relative height H3Respectively, refer to a distance from a surface of first pixel defining layer 120 away from the substrate 110 to substrate 110, a distance from a surface of second pixel bank 130 away from substrate 110 to substrate 110, and a distance from a surface of third pixel bank 140 away from substrate 110 to substrate 110.
It should be understood that, the plurality of sub-pixel regions 160 in each pixel region 150 have the same color of light-emitting layer therein, or every N sub-pixel regions 160 in each pixel region 150 have the same color of light-emitting layer therein, where a specific value of N may be determined according to the size of the display panel 100, a third pixel bank 140 is disposed between two adjacent sub-pixel regions 160 in every N sub-pixel regions 160, and a third relative height H of the third pixel bank 140 is equal to the third relative height H of the third pixel bank 1403Is smaller than second relative height H of second pixel bank 1302And is smaller than the first pixel defining layer 120A relative height H1In the process of manufacturing an Organic Light Emitting Device (OLED) by an inkjet printing process, the N sub-pixel regions 160 are communicated with each other between every N sub-pixel regions 160, the ink can cross the third pixel bank 140, so that the volume of the ink communicated between the N sub-pixel regions 160 is uniform, and the film formation in each N sub-pixel region 160 is uniform, as can be seen from fig. 10, when the value of N is a certain value, the film formation uniformity in the sub-pixel region 160 is almost unchanged, and as can be seen from fig. 10, N is preferably equal to or greater than 15.
In the display panel 100 of the embodiment of the application, the first pixel defining layer 120 divides the substrate 110 into a plurality of pixel regions 150, the second pixel bank 130 and the third pixel bank 140 divide each pixel region 150 into a plurality of sub-pixel regions 160, a groove 170 is formed in each N sub-pixel regions 160 on the substrate 110 in each pixel region 150, the second pixel bank 130 is disposed in the groove 170, the third pixel bank 140 is disposed between two adjacent sub-pixel regions 160 in each N sub-pixel region 160, and a third relative height H of the third pixel bank 140 is equal to the third relative height H of the third pixel bank 1403Is smaller than second relative height H of second pixel bank 1302And is smaller than the first relative height H of the first pixel defining layer 1201. In this way, in the process of manufacturing an Organic light emitting device (OLED for short) by an inkjet printing process, as shown in fig. 7, between every N sub-pixel regions 160, ink can cross over the third pixel bank 140, so that the volume of the ink between every N sub-pixel regions 160 is equalized, and meanwhile, in the sub-pixel regions 160 at two ends of each N sub-pixel region 160, the ink can be deposited in the groove 170, thereby reducing the climbing height of the ink on the second pixel bank 130 located in the groove 170, improving the consistency of the film forming morphology between every N sub-pixel regions 160, further improving the film forming uniformity of inkjet printing in the sub-pixel regions 160, and improving the light emitting mura problem of the Organic light emitting device.
In some embodiments of the present application, the base 110 may include a substrate base and a planarization layer (not shown), on which the recess 170 opens. The substrate may be a rigid substrate, such as a glass substrate or a PMMA (Polymethyl methacrylate) substrate, or a flexible substrate, such as a PET (Polyethylene terephthalate) substrate or a PI (Polyimide) substrate. The base 110 further includes a driving circuit layer (not shown) disposed between the substrate base and the planarization layer. The driving circuit layer includes a plurality of driving transistors, and the driving transistors may be thin film transistors, but the embodiments of the present disclosure are not limited thereto, and the thin film transistors may be top gate thin film transistors, and of course, may also be bottom gate thin film transistors. Taking a thin film transistor as an example of a top gate type thin film transistor, the driving circuit layer includes an active layer, a gate insulating layer, a gate electrode, an interlayer insulating layer, a source electrode and a drain electrode, the active layer is disposed on the substrate, the gate insulating layer is disposed on the substrate and covers the active layer, the gate electrode is disposed on one side of the gate insulating layer away from the substrate, the interlayer insulating layer is disposed on the gate insulating layer and covers the gate electrode, and the source electrode and the drain electrode are disposed on the interlayer insulating layer and connected to the active layer through via holes passing through the interlayer insulating layer and the gate insulating layer. As shown in fig. 8 and 9, the substrate 110 further includes a first electrode layer disposed on the planarization layer, the first electrode layer includes a plurality of first electrodes 180, each first electrode 180 is correspondingly disposed in the sub-pixel region 160, and the recess 170 is opened on the planarization layer. The first electrode 180, i.e., the anode, is typically a transparent or semitransparent material with high work function, such as Indium Tin Oxide (ITO), Ag, Nio, Al, graphene, etc., but is not limited thereto.
In some embodiments of the present application, as shown in fig. 6, second pixel bank 130 has two first sidewalls 131 oppositely disposed, first sidewall 131 faces sub-pixel region 160, and a gap exists between first sidewall 131 and second sidewall 171 of recess 170 corresponding thereto, so that ink around second pixel bank 130 may be deposited in the recess, thereby reducing a climbing height of ink on first sidewall 131 of second pixel bank 130, so as to improve consistency between a film formation topography of sub-pixel region 160 at second pixel bank 130 and a film formation topography of sub-pixel region 160 at third pixel bank 140, and alleviate a mura problem of light emission of organic light-emitting device at sub-pixel region 160 at second pixel bank 130.
In some embodiments of the present application, first sidewall 131 and/or second sidewall 171 are sloped sidewalls, and a gap between first sidewall 131 and second sidewall 171 gradually decreases in a depth direction of groove 170, so that more ink around second pixel bank 130 may be deposited in the groove, which may further reduce a climbing height of the ink on first sidewall 131 of second pixel bank 130, and further improve a uniformity of a film formation profile of sub-pixel region 160 at second pixel bank 130 and a film formation profile of sub-pixel region 160 at third pixel bank 140, which may effectively alleviate a mura problem of light emission of organic light emitting device at sub-pixel region 160 at second pixel bank 130.
In some embodiments of the present application, as shown in fig. 8, the first electrode 180 extends into the groove 170, the insulating layer 190 is disposed in the groove 170, the insulating layer 190 covers the first electrode 180 extending into the groove 170, and the second pixel bank 130 is disposed on the insulating layer 190, so that the edge portion of the first electrode 180 is prevented from being exposed, the problems of leakage of the light emitting device and the like are avoided, and the lifetime of the organic light emitting device in the display panel 100 is prolonged.
In some embodiments of the present application, as shown in fig. 9, a recessed groove (not shown) is formed on the first sidewall 131, and the first electrode 180 extends into the recessed groove 170 and extends into the recessed groove, so that the edge portion of the first electrode 180 is prevented from being exposed, the problems of electric leakage of the light emitting device and the like are avoided, and the lifetime of the organic light emitting device in the display panel 100 is prolonged.
In some embodiments of the present application, an included angle between the inclined sidewall and the bottom wall of the groove 170 may be 30 ° to 60 °, and the larger the included angle between the inclined sidewall and the bottom wall of the groove 170 is, the larger the minimum gap between the first sidewall 131 and the second sidewall 171 is, so that a climbing height of ink on the first sidewall 131 of the second pixel bank 130 may be further reduced, and the problem of light emission mura of the light emitting device at the second pixel bank 130 of the sub-pixel region 160 may be effectively alleviated.
In some embodiments of the present application, the thickness of the first electrode 180 is 0.05um to 0.2um, and the thickness of the insulating layer 190 is 0.3 um to 0.4um, so that the insulating layer 190 can completely cover the portion of the first electrode extending into the groove, thereby preventing the first electrode 180 from having an exposed portion, and preventing the light emitting device from generating the problems of electric leakage, etc.
In some embodiments, the thickness of the first electrode 180 may be 0.12um, and the thickness of the insulating layer 190 is 0.3-0.4um, so that the insulating layer 190 may completely cover the portion of the first electrode extending into the groove, thereby preventing the first electrode 180 from being exposed, preventing the light emitting device from leaking electricity and the like, and prolonging the lifetime of the organic light emitting device in the display panel 100.
In some embodiments of the present application, the depth of the groove 170 is 0.2um to 1um, and further, the depth of the groove is 0.2um to 0.6 um.
In some embodiments of the present disclosure, the display panel 100 further includes a light emitting layer (not shown) disposed on a side of the first electrode 180 in each sub-pixel region 160 away from the substrate; in each pixel region 150, at least every N sub-pixel regions 160 have the same color of light-emitting layer. It should be noted that, in the following description,
in some embodiments of the present application, the display panel 100 further includes a second electrode layer (not shown in the figure), and the second electrode layer includes a plurality of second electrodes, and the second electrodes are correspondingly disposed on a side of the light emitting layer away from the substrate. The second electrode is the cathode.
As shown in fig. 11, an embodiment of a second aspect of the present invention provides a method for manufacturing a display panel, including the following steps:
s1, providing a substrate 110;
s2, forming a first pixel defining layer 120 on the substrate 110, the first pixel defining layer 120 dividing the substrate 110 into a plurality of pixel regions 150;
s3, forming a plurality of grooves 170 on the substrate in each pixel region 150;
s4, forming second and third pixel banks 130 and 140 on substrate 110 positioned within each pixel region 150, second and third pixel banks 130 and 140 separating each pixel region 150A groove 170 appears every N sub-pixel regions 160 within each pixel region 150 for a plurality of sub-pixel regions 160, N being a positive integer, a second pixel bank 130 is formed within groove 170, and a third pixel bank 140 is formed between two adjacent sub-pixel regions 160 within every N sub-pixel regions 160, wherein a third relative height H of third pixel bank 1403Is smaller than second relative height H of second pixel bank 1302And is smaller than the first relative height H of the first pixel defining layer 1201First relative height H1Second relative height H2And a third relative height H3Respectively, refer to a distance from a surface of first pixel defining layer 120 distant from substrate 110 to substrate 110, a distance from a surface of second pixel bank 130 distant from substrate 110 to substrate 110, and a distance from a surface of third pixel bank 140 distant from substrate 110 to substrate 110.
An embodiment of a third aspect of the present invention provides a display device, which is characterized by comprising the display panel in any of the above embodiments.
The specific type of the display device is not particularly limited, and any display device commonly used in the art may be used, specifically, for example, a mobile device such as a mobile phone, a VR device, and the like.
It should be noted that, the display device includes other necessary components and components besides the display panel, and for the display, specifically, for example, a housing, a circuit board, a power line, etc., those skilled in the art can supplement the display device accordingly according to the specific use requirement of the display device, and details are not described herein.
Compared with the prior art, the beneficial effects of the display panel device provided by the embodiment of the application are the same as the beneficial effects of the display panel provided by the embodiment, and are not repeated herein.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
All the embodiments in the present specification are described in a related manner, and the same and similar parts among the embodiments may be referred to each other, and each embodiment focuses on the differences from the other embodiments.
The above description is only for the preferred embodiment of the present application, and is not intended to limit the scope of the present application. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application are included in the protection scope of the present application.
Claims (14)
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