CN113935273A - Control signal connection method of low-power-consumption module - Google Patents
Control signal connection method of low-power-consumption module Download PDFInfo
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/394—Routing
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
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- H—ELECTRICITY
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- H04W52/02—Power saving arrangements
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
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Abstract
The invention relates to a control signal connection method of a low-power-consumption module, which comprises the following steps: determining a control signal input end and a control signal output end of a low-power-consumption module; inputting a control signal output from a Power Management Unit (PMU) from a control signal input end to a control signal input end of a low-power consumption module; generating a control signal propagation chain main path in a snake-shaped arrangement according to the distribution positions of the switch units in the low-power-consumption module; the starting point of the main path of the control signal propagation chain is the input end of the control signal, and the ending point of the main path of the control signal propagation chain is the output end of the control signal; and serially transmitting the control signals to each switch unit according to the main path of the control signal propagation chain in the serpentine arrangement, so that the switch units control the on or off of the power loads in the low-power-consumption module according to the control signals.
Description
Technical Field
The invention relates to the technical field of integrated circuit design, in particular to a control signal connection method of a low-power-consumption module.
Background
In the field of low power consumption design, the most effective means for reducing power consumption is to turn off the power supply. The reason for this is that no matter how low the voltage, how small the current, how slow the speed or how small the leakage current is, is not as thorough as completely turning off the power supply.
However, it is clearly impractical to power down the entire chip for an active chip. Then a truly low power consumption can be achieved if the inactive modules in the chip can be shut down while the modules that remain active continue to operate.
In the existing chip, a power supply network is realized by one layer of metal, the top layer of metal is always maintained in a power-on state, and the bottom layer of metal is connected with the top layer of metal through holes layer by layer for power supply transmission.
The inventor proposes a module structure in which a switch unit is added to maintain the operation of a module operating in a chip and the non-operating module is turned off to achieve the effect of low power consumption in other patents, but how to control the switch units and how to input control signals to the switch units is a problem to be discussed in the present invention.
Disclosure of Invention
The embodiment of the invention provides a control signal connection method of a low-power-consumption module, which is characterized in that a control signal is serially input to a main path radial switch unit through a control signal propagation chain which is arranged in a snake shape and is used for the work or the turn-off of electric loads such as a standard unit, a hard macro and the like, so that for an integral chip, when some chip modules in the chip do not need to participate in the work, the turn-off of the part of chip modules can be controlled by controlling the logic of the part of switch units, thereby reducing the electric loads of the chip, achieving the purpose of reducing the power consumption of the chip and optimizing the input path of the control signal.
Therefore, an embodiment of the present invention provides a method for connecting control signals of a low power module, where the method for connecting control signals of a low power module includes:
determining a control signal input end and a control signal output end of a low-power-consumption module;
inputting a control signal output from a Power Management Unit (PMU) from a control signal input end to a control signal input end of a low-power consumption module;
generating a control signal propagation chain main path in a snake-shaped arrangement according to the distribution positions of the switch units in the low-power-consumption module; the starting point of the main path of the control signal propagation chain is the input end of the control signal, and the ending point of the main path of the control signal propagation chain is the output end of the control signal;
and serially transmitting the control signals to each switch unit according to the main path of the control signal propagation chain in the serpentine arrangement, so that the switch units control the on or off of the power loads in the low-power-consumption module according to the control signals.
Preferably, after the generating the main path of the control signal propagation chain in the serpentine arrangement, the method further comprises:
determining whether there is a switching unit not connected to the main path of the control signal propagation chain;
when there is a switching unit not connected to the control signal propagation chain main path, generating one or more control signal propagation chain sub-paths according to the distribution positions of the switching units not connected to the control signal propagation chain main path;
searching a shortest path between each control signal propagation chain sub-path and the control signal propagation chain main path to generate an access path;
the control signal propagation chain sub-path is switched into the control signal propagation chain main path through an access path, and the control signal is delivered to each switching unit not connected to the control signal propagation chain main path through the access path and the control signal propagation chain sub-path.
Preferably, the low power consumption module includes: the power supply system comprises a high-level power supply network, a bottom-level power supply network, a transition-level power supply network, a first hole, a second hole and a switch unit;
the high-level power network is a power network with one or two layers at the top for connecting a power supply;
the bottom layer power supply network is specifically a power supply network for connecting a standard unit and a Hard Macro Hard Macro in the chip module, wherein the bottom layer power supply network is one layer or two layers of the bottom layer;
the transition layer power supply network is specifically a power supply network of each layer between the high-layer power supply network and the bottom layer power supply network except the high-layer power supply network and the bottom layer power supply network; the bottom layer power supply network is connected with the transition layer power supply network;
the switch unit is arranged below the bottom layer power supply network and is horizontally arranged with the standard unit and the hard macro;
the first hole is connected with the high-level power supply network and the switch unit, and the second hole is connected with the switch unit and the transition-level power supply network;
and the standard unit and the Hard Macro Hard Macro are connected to the transition layer power supply network through the bottom layer power supply network, and are connected or disconnected with the power supply through the switch unit.
Preferably, the switching units in the chip module are connected in parallel.
Preferably, the sum of the IR Drop of each switch unit in the chip module and the chip module itself is less than 10% of the power supply operating voltage.
Further preferably, the IR-drop of one of said switching units is equal to the operating current and the on-resistance R of the switching unitONThe product of (a).
Further preferably, the working current is obtained by calculating a ratio of power consumption to working voltage when the chip module is working.
According to the control signal connection method of the low-power-consumption module, the control signals are serially input to the main path radial switch unit through the control signal propagation chain in the serpentine arrangement and are used for the work or the turn-off of the electric loads such as the standard unit and the hard macro, so that for the whole chip, when some chip modules in the chip do not need to participate in the work, the turn-off of the part of the chip modules can be controlled through controlling the logic of the part of the switch units, the electric loads of the chip are reduced, the purpose of reducing the power consumption of the chip is achieved, and meanwhile, the input path of the control signals is optimized.
Drawings
The technical solutions of the embodiments of the present invention are further described in detail with reference to the accompanying drawings and embodiments.
Fig. 1 is a flowchart of a method for connecting control signals of a low power module according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a main path of a control signal propagation chain and a sub-path of the control signal propagation chain according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a low power module according to an embodiment of the present invention.
Detailed Description
The invention is further illustrated by the following figures and specific examples, but it should be understood that these examples are for the purpose of illustration only and are not to be construed as in any way limiting the present invention, i.e., as in no way limiting its scope.
The embodiment of the invention provides a control signal connection method of a low-power-consumption module, which mainly comprises the following steps as shown in figure 1:
each module has a port opened for design, and a control signal input end and a control signal output end with low power consumption of the module can be determined according to design requirements. Typically, the control signal input and output terminals are disposed on either side of the module.
specifically, for each module, the control signal for turning on or off the module is derived from the power management unit, and different control signals are output to each module according to the actual working condition of the chip.
specifically, the starting point of the main path of the control signal propagation chain is the control signal input end, and the ending point of the main path of the control signal propagation chain is the control signal output end;
since each standard cell, hard macro, etc. in a module are usually arranged in blocks, the serpentine arrangement can be covered with the maximum probability to the switching cells inserted between the standard cells and the hard macros, etc. for supplying power to the standard cells and the hard macros, etc.
And 140, serially transmitting the control signals to each switch unit according to the main path of the control signal propagation chain in the serpentine arrangement, so that the switch units control to turn on or turn off the power loads in the low-power-consumption modules according to the control signals.
After performing step 130, it should also be confirmed to determine whether there is a switching unit not connected to the main path of the control signal propagation chain;
when there is a switching unit not connected to the main path of the control signal propagation chain, the following steps should also be performed:
step 150, generating one or more control signal propagation chain sub-paths according to the distribution positions of the switch units which are not connected to the control signal propagation chain main path;
step 160, finding the shortest path between each control signal propagation chain sub-path and the control signal propagation chain main path to generate an access path;
step 170, the control signal propagation chain sub-path is accessed to the control signal propagation chain main path through the access path, and the control signal is transmitted to each switching unit not connected to the control signal propagation chain main path through the access path and the control signal propagation chain sub-path.
A schematic diagram of a main path of a control signal propagation chain and a sub-path of the control signal propagation chain formed by the above method is shown in fig. 2. This figure is only a schematic diagram for explaining the structure of the control signal propagation chain main path and the control signal propagation chain sub path.
The control signal input end and the control signal output end of the module 100 are respectively at two positions a and b shown in the figure, and the main path 101 of the control signal propagation chain is arranged in a snake shape from a to b as shown in the figure.
In the lower right of the figure, the main path 101 of the serpentine control signal propagation chain must be avoided in this region due to the hard macro occupying position, and there is a local control signal propagation chain sub-path 102. This control signal propagation chain sub-path 102 is accessed into the control signal propagation chain main path 101 via the access path 103.
The control signal connection method of the low power consumption module is applied to the low power consumption module shown in fig. 3. As shown in fig. 3, the low power consumption module of the present invention includes: the power supply system comprises a high-level power supply network (M7), a bottom-level power supply network (M1-M2), a transition-level power supply network (M3-M6), a first hole, a second hole and a switch unit;
the high-level power network is a power network with one or two layers at the top for connecting a power supply; in this case top metal layer M7;
the bottom layer power supply network is specifically a power supply network of which one layer or two layers are used for connecting a standard cell (STDcell) and a Hard Macro (Hard Macro) in a chip Module (Module); in this example, bottom metal layers M1, M2; m2 and M1 directly power standard cells (only 4 shown) and 1 hard macro for the underlying power network.
The transition layer power supply network is specifically a power supply network of each layer between the high-layer power supply network and the bottom layer power supply network except the high-layer power supply network and the bottom layer power supply network; in this example, metal layers M3-M6; the bottom layer power supply network is connected with the transition layer power supply network;
the switch unit is arranged below the bottom layer power supply network and is horizontally arranged with the standard unit and the hard macro on the physical design;
the first hole is connected with the high-level power supply network and the switch unit, and the second hole is connected with the switch unit and the transition-level power supply network; the first and second holes are implemented in a particular implementation using stacked holes.
In the design of the invention, the high-level power network is not directly connected with the transition-level power network.
The standard unit and the hard macro are connected to a transition layer power supply network through a bottom layer power supply network, and are connected or disconnected with a power supply through a switch unit.
The power supply of the chip is connected to a high-level power supply network through a power source. The power supply of the higher power supply network is always on. The higher level power network in each chip module is powered on as long as the chip is not powered off.
A first hole is formed between the high-level power supply network and the switch unit, so that a power supply path which is directly communicated with the high-level power supply network is formed between the switch unit and the transition layer power supply network, and a second hole is formed between the switch unit and the transition layer power supply network, so that the switch unit, the standard unit and the hard macro which are powered by the transition layer power supply network and the bottom layer power supply network form another power supply path.
A switch unit controls a plurality of electric loads within a certain range around the switch unit through a transition layer power supply network. The method depends on the connection relationship between a transition layer power supply network and a bottom layer power supply network in the original design, and between the bottom layer power supply network and the electric loads such as standard units and hard macros.
The switch units in one chip module are connected in parallel.
The sum of the IR Drop (IR Drop) of each switch unit in one chip module and the chip module is less than 10% of the working voltage of the power supply. IR drop is a phenomenon that indicates a voltage drop or rise on the power and ground networks present in an integrated circuit. As the width of the metal interconnection line becomes narrower and narrower as the semiconductor process progresses, the resistance value of the metal interconnection line rises, so that a certain IR drop exists in the whole chip range.
Further, the IR voltage drop of a switch unit is equal to the working current and the on-resistance R of the switch unitONThe product of (a). The working current can be obtained by calculating the ratio of the power consumption and the working voltage when the chip module works.
Although it is considered theoretically that the sum of the IR Drop (IR Drop) of each switch unit and the chip module itself is less than 10% of the power supply operating voltage, and each switch unit is in a parallel relationship, it seems that the IR Drop is reduced when the number of the switch units is increased, and the requirement that the sum of the IR Drop (IR Drop) of the chip module itself is less than 10% of the power supply operating voltage can be satisfied, in actual operation, the loss caused by the leakage power consumption of the switch units needs to be considered, and those skilled in the art know how to handle the calculation of the leakage power consumption, and the detailed description is omitted here.
In a chip module, there are a plurality of structures like this, each switch unit is controlled by control signal, when this chip module does not need to work, can control each switch unit in this chip module and cut off the power supply of the high-level power network to the transition layer power network, thus close this part of power consumption load.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (7)
1. A control signal connection method of a low-power module is characterized by comprising the following steps:
determining a control signal input end and a control signal output end of a low-power-consumption module;
inputting a control signal output from a Power Management Unit (PMU) from a control signal input end to a control signal input end of a low-power consumption module;
generating a control signal propagation chain main path in a snake-shaped arrangement according to the distribution positions of the switch units in the low-power-consumption module; the starting point of the main path of the control signal propagation chain is the input end of the control signal, and the ending point of the main path of the control signal propagation chain is the output end of the control signal;
and serially transmitting the control signals to each switch unit according to the main path of the control signal propagation chain in the serpentine arrangement, so that the switch units control the on or off of the power loads in the low-power-consumption module according to the control signals.
2. The control signal connection method of claim 1, wherein after the generating the serpentine-arranged control signal propagation chain main path, the method further comprises:
determining whether there is a switching unit not connected to the main path of the control signal propagation chain;
when there is a switching unit not connected to the control signal propagation chain main path, generating one or more control signal propagation chain sub-paths according to the distribution positions of the switching units not connected to the control signal propagation chain main path;
searching a shortest path between each control signal propagation chain sub-path and the control signal propagation chain main path to generate an access path;
the control signal propagation chain sub-path is switched into the control signal propagation chain main path through an access path, and the control signal is delivered to each switching unit not connected to the control signal propagation chain main path through the access path and the control signal propagation chain sub-path.
3. The control signal connection method according to claim 1, wherein the low power module comprises: the power supply system comprises a high-level power supply network, a bottom-level power supply network, a transition-level power supply network, a first hole, a second hole and a switch unit;
the high-level power network is a power network with one or two layers at the top for connecting a power supply;
the bottom layer power supply network is specifically a power supply network for connecting a standard unit and a Hard Macro Hard Macro in the chip module, wherein the bottom layer power supply network is one layer or two layers of the bottom layer;
the transition layer power supply network is specifically a power supply network of each layer between the high-layer power supply network and the bottom layer power supply network except the high-layer power supply network and the bottom layer power supply network; the bottom layer power supply network is connected with the transition layer power supply network;
the switch unit is arranged below the bottom layer power supply network and is horizontally arranged with the standard unit and the hard macro;
the first hole is connected with the high-level power supply network and the switch unit, and the second hole is connected with the switch unit and the transition-level power supply network;
and the standard unit and the Hard Macro Hard Macro are connected to the transition layer power supply network through the bottom layer power supply network, and are connected or disconnected with the power supply through the switch unit.
4. The low power module of claim 1, wherein each switch unit in the one chip module is connected in parallel.
5. The low power consumption module of claim 1, wherein the sum of the IR Drop of each switch unit in the chip module and the chip module is less than 10% of the power supply operating voltage.
6. The low power module of claim 5, wherein the IR drop of one of the switch units is equal to the operating current and the on-resistance R of the switch unitONThe product of (a).
7. The low power module of claim 6, wherein the operating current is calculated from a ratio of power consumption to operating voltage of the chip module during operation.
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Application publication date: 20220114 |