[go: up one dir, main page]

CN113930738B - Metal vapor modulation device for vacuum coating and modulation method thereof - Google Patents

Metal vapor modulation device for vacuum coating and modulation method thereof Download PDF

Info

Publication number
CN113930738B
CN113930738B CN202010602512.0A CN202010602512A CN113930738B CN 113930738 B CN113930738 B CN 113930738B CN 202010602512 A CN202010602512 A CN 202010602512A CN 113930738 B CN113930738 B CN 113930738B
Authority
CN
China
Prior art keywords
metal
metal vapor
crucible
control valve
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202010602512.0A
Other languages
Chinese (zh)
Other versions
CN113930738A (en
Inventor
金小礼
周月明
李山青
张春伟
熊斐
汪义如
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Baoshan Iron and Steel Co Ltd
Original Assignee
Baoshan Iron and Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Baoshan Iron and Steel Co Ltd filed Critical Baoshan Iron and Steel Co Ltd
Priority to CN202010602512.0A priority Critical patent/CN113930738B/en
Publication of CN113930738A publication Critical patent/CN113930738A/en
Application granted granted Critical
Publication of CN113930738B publication Critical patent/CN113930738B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/542Controlling the film thickness or evaporation rate
    • C23C14/543Controlling the film thickness or evaporation rate using measurement on the vapor source
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/16Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/542Controlling the film thickness or evaporation rate
    • C23C14/544Controlling the film thickness or evaporation rate using measurement in the gas phase
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/22Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
    • G01F23/24Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of resistance of resistors due to contact with conductor fluid
    • G01F23/241Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of resistance of resistors due to contact with conductor fluid for discrete levels
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L11/00Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by means not provided for in group G01L7/00 or G01L9/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Fluid Mechanics (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention discloses a metal vapor modulation device for vacuum coating and a control method thereof, comprising a vacuum cavity, a metal vapor modulator, a metal vapor injector and an intelligent processor; the metal vapor modulator and the metal vapor injector are both arranged in the vacuum cavity; the metal vapor modulator comprises a crucible for placing metal liquid, a crucible heater is arranged on the crucible, and a metal vapor pressure detection device and a metal liquid level detection device are arranged in the crucible; the crucible is connected with the metal steam injector through a metal steam outlet pipeline, and a metal steam outlet control valve is arranged on the metal steam outlet pipeline; the crucible is connected with a molten metal conveying pipeline, and a molten metal inlet control valve is arranged on the molten metal conveying pipeline; the intelligent processor is used for receiving the detection data and calculating and judging through the intelligent processor. The invention realizes the control of the evaporation temperature, evaporation rate and injection rate of the metal vapor, thereby stabilizing the basic coating thickness and process and improving the quality of the coated product.

Description

Metal vapor modulation device for vacuum coating and modulation method thereof
Technical Field
The invention relates to a vacuum coating technology, in particular to a metal vapor modulation device for vacuum coating and a modulation method thereof.
Background
Physical vapor deposition techniques are widely used material surface treatment techniques that evaporate metals, alloys or compounds in a vacuum environment, and the resulting metal vapors solidify and deposit on a substrate. The technology is adopted to coat the surface of the material, and the coating has better wear resistance, corrosion resistance, hardness and dryness, and can obviously improve the material performance and prolong the service life. The technology is adopted for coating, so that no three wastes are generated, and no pollution is caused to the environment. The technology is widely applied to the fields of materials such as machinery, electronics, hardware, aerospace, chemical industry and the like, and becomes an important application technology for green manufacturing.
In the application of physical vapor deposition technology, various coating materials such as zinc, aluminum, magnesium, chromium and the like are used, the coating speed is generally high and can reach 1-3 m/s, and the metal vapor flow and pressure in the spraying process are required to be kept relatively constant for obtaining better coating surface quality and spraying effect. In addition, the requirements on the thickness of the coating are different for different materials, and in order to obtain reasonable thickness of the coating, the process matching of the thickness of the coating and the evaporation capacity is realized by setting the running speed of the material to be coated. Therefore, in the vacuum coating process, the modulation generator of the metal vapor is core equipment of the coating process and has a critical influence on the coating quality.
In the prior art, as in patent application No. 200820115896.0, an industrial steam generator is proposed, in which a crucible for evaporating metal steam is placed outside a vacuum chamber, the metal steam is conveyed into the vacuum chamber through a pipe, and the metal steam is sprayed from an injector onto a metal steel plate for deposition. In this technique, the crucible is placed outside the vacuum chamber, which is advantageous for operations such as maintenance, but increases the distance from the crucible to the injector, with some adverse effects. The extension of the metal vapor pipe increases the length of the heater on the one hand, so that the energy consumption increases. Further, the extension of the vapor delivery pipe causes an increase in metal vapor pressure loss, and if the vapor pressure at the pipe inlet is to be increased to achieve the same vapor pressure condition at the injector outlet in the vacuum chamber, it is required to increase the metal vapor pressure in the crucible. Since the crucible is disposed outside the vacuum chamber, once leakage occurs, oxidation of metal vapor is easily caused.
In addition, in the evaporation process of the molten metal, the evaporation rate of the metal vapor may change and needs to be quickly and stably adjusted; when zinc vapor is sprayed to a substrate for coating, the thickness of the coating has different requirements due to different process requirements, and the flow of the metal vapor at the spraying outlet needs to be accurately controlled, so that the stability of the flow of the vapor is ensured. These process demands put high demands on the evaporation device and the regulation technology of the metal vapor, and the conventional metal vapor generator usually adopts a separate control function at present, and the modulation device and the corresponding control technology of the metal vapor are not known.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a metal vapor modulation device for vacuum coating and a modulation method thereof, which realize the control of the evaporation temperature, the evaporation rate and the injection rate of metal vapor, thereby stabilizing the basic coating thickness and process and improving the quality of a coated product.
In order to achieve the above purpose, the invention adopts the following technical scheme:
in one aspect, a metal vapor modulating device for vacuum coating comprises a vacuum cavity, a metal vapor modulator, a metal vapor injector and an intelligent processor;
the metal vapor modulator and the metal vapor injector are both arranged in the vacuum cavity;
the metal vapor modulator comprises a crucible for placing molten metal, a crucible heater is arranged on the crucible, and a metal vapor pressure detection device and a metal liquid level detection device are arranged in the crucible;
the crucible is connected with the metal steam injector through a metal steam outlet pipeline, and a metal steam outlet control valve is arranged on the metal steam outlet pipeline;
the crucible is connected with a molten metal conveying pipeline, and a molten metal inlet control valve is arranged on the molten metal conveying pipeline;
the intelligent processor is used for receiving detection data of the metal vapor pressure detection device and the metal liquid level detection device, controlling the opening and closing of the crucible heater and controlling the opening of the metal vapor outlet control valve and the opening of the metal liquid inlet control valve through calculation and judgment of the intelligent processor.
Preferably, one or two vacuum cavities are arranged.
Preferably, when two vacuum cavities are provided, the metal vapor modulator and the metal vapor injector are respectively arranged in the corresponding vacuum cavities.
Preferably, a pressure release valve is arranged on the crucible.
Preferably, the crucible heater is a sectional control type crucible heater.
Preferably, the metal liquid level detection device adopts a high-sensitivity resistor array type metal liquid level detection device.
On the other hand, the metal vapor modulation method for the metal vapor modulation device for vacuum coating is characterized in that the metal liquid level data in the crucible is measured by using the metal liquid level detection device, and the intelligent processor controls the heating power of each section of the crucible heater to realize that the metal liquid in the crucible is at a set temperature to form metal vapor;
and the intelligent processor is used for controlling the opening of the metal vapor outlet control valve and the opening of the metal liquid inlet control valve to realize accurate modulation control between the metal vapor pressure and the metal vapor flow in the crucible.
Preferably, the method further comprises the steps of:
1) Starting the crucible heater, and preheating to a set temperature T a Opening the molten metal inlet control valveInputting molten metal into the crucible, and closing the metal vapor outlet control valve;
2) When the molten metal in the crucible reaches the set liquid level position, the crucible heater corresponding to the molten metal region adopts full-power heating to heat the molten metal to the target temperature T m Then forming metal vapor, wherein the crucible heater reduces heating power and keeps the crucible position of the molten metal region continuously;
3) When the pressure of the metal vapor in the crucible reaches a target pressure range, opening the metal vapor outlet control valve, conveying the metal vapor to the metal vapor ejector along the metal vapor outlet pipeline, and spraying the metal vapor to the surface of the running strip steel by the metal vapor ejector to form a metal coating film;
4) And when the metal coating production is just finished, after the position of the metal liquid level in the crucible is regulated, closing the metal liquid inlet control valve, and after the metal liquid in the crucible is completely evaporated, closing the metal vapor outlet control valve.
Preferably, in the step 3), the metal vapor injector injects metal vapor, and the intelligent processor controls the opening degree K of the valve according to the metal vapor outlet out And maximum metal vapor flow rate Q out Calculating the liquid supplementing quantity K required by maintaining balance of the molten metal in the crucible in real time out ×Q out Then according to the maximum flow Q of the molten metal in the molten metal conveying pipeline in Controlling the opening K of the molten metal inlet control valve in real time in So that K is in ×Q in =K out ×Q out
Preferably, in the step 3), when the metal vapor pressure detection device detects that the metal vapor pressure variation range in the crucible exceeds the set value, the intelligent processor calculates and makes the following judgment:
if the metal vapor pressure is reduced and the amplitude is more than a set value, increasing the power of the crucible heater corresponding to the molten metal area until the metal vapor pressure in the crucible is recovered to the set value;
if the metal vapor pressure is reduced and the amplitude is beyond a set value, the power of the crucible heater corresponding to the metal liquid area is increased, the metal vapor pressure in the crucible still cannot be recovered to the set value, the intelligent processor sends out a pressure lower alarm to a film plating unit, if the metal vapor pressure cannot meet the film plating process requirement, the metal vapor outlet control valve is closed, and when the metal vapor pressure is recovered to meet the film plating process requirement, the metal vapor outlet control valve is opened;
if the metal vapor pressure is increased and the increase exceeds a set value, reducing the power of the crucible heater corresponding to the molten metal region until the metal vapor pressure in the crucible is restored to the set value;
if the metal vapor pressure exceeds the highest critical value of the safety pressure range, reducing the power of the crucible heater corresponding to the metal liquid region, closing the metal liquid inlet control valve until the metal vapor pressure in the crucible is restored to a set value, opening the metal liquid inlet control valve, and increasing the power of the crucible heater; if the power of the crucible heater is reduced to the minimum and the metal vapor pressure cannot be reduced, the intelligent processor sends a pressure relief signal to the coating unit, the pressure relief valve is opened, and when the metal vapor pressure in the crucible is relieved to a set value, the pressure relief valve is closed.
The metal vapor modulation device and the modulation method for the vacuum coating provided by the invention have the following beneficial effects:
1) Independent modulation control of the evaporation rate of the metal vapor and the outlet jet flow can be realized, the stability of a film plating product and a process is facilitated, and dynamic optimization, adjustment and control of the process are facilitated;
2) The metal vapor modulator is arranged in the vacuum cavity, so that the metal liquid and the metal vapor are not easy to oxidize, and the quality of a coated product is improved;
3) The device has a relatively simple structure and a control method, and is easy to realize automatic control.
Drawings
FIG. 1 is a schematic view of a metal vapor modulator and a metal vapor injector in the apparatus of the present invention disposed in the same vacuum chamber;
FIG. 2 is a schematic view of the arrangement of the metal vapor modulator and metal vapor injector of the apparatus of the present invention disposed within corresponding separate vacuum chambers;
FIG. 3 is an electrical schematic of a metal level detection device in the apparatus of the present invention.
Detailed Description
The technical scheme of the invention is further described below with reference to the accompanying drawings and examples.
Referring to fig. 1 to 2, the metal vapor modulating device for vacuum coating provided by the invention comprises a vacuum cavity 1, a metal vapor modulator 2, a metal vapor injector 3 and an intelligent processor. Wherein the vacuum cavity 1 is provided with one or two.
In the case where the vacuum chamber 1 is provided with one, the metal vapor modulator 2 and the metal vapor injector 3 are both disposed in the vacuum chamber 1 (as shown in fig. 1).
When two vacuum cavities 1 and 4 are provided, the metal vapor modulator 2 and the metal vapor injector 3 are respectively arranged in the corresponding independent vacuum cavities 1 and 4 (as shown in fig. 2), so that the metal vapor modulator 2 is ensured to be in the environment of the vacuum cavity 1, the separation of key equipment and key technology is realized, and the operation and the maintenance are convenient.
The metal vapor modulator 2 comprises a crucible 6 for placing the metal liquid 5, a crucible heater 7 is arranged on the outer side of the crucible 6, and a metal vapor pressure detection device 8 and a metal liquid level detection device 9 are arranged in the crucible 6.
The top of the crucible 6 is connected to the metal vapor injector 3 through a metal vapor outlet pipe 10, and a metal vapor outlet control valve 11 is provided on the metal vapor outlet pipe 10.
The bottom of the crucible 6 is connected with a molten metal conveying pipeline 12, and a molten metal inlet control valve 13 is arranged on the molten metal conveying pipeline 12.
The crucible 6 is also provided with a pressure relief valve 14.
The crucible heater 7 adopts a sectional control type crucible heater, and the temperature of each section can be independently regulated.
Separate heaters are provided on the molten metal delivery pipe 12, the molten metal inlet control valve 13, the molten metal outlet pipe 10, the molten metal outlet control valve 11, and the molten metal injector 3.
The intelligent processor is used for receiving the numerical value of the metal vapor pressure in the crucible 6 measured by the metal vapor pressure detection device 8 and the numerical value of the metal liquid 5 level in the crucible 6 measured by the metal liquid level detection device 9, and controlling the sectional adjustment of the power of the crucible heater 7 and the opening of the metal vapor outlet control valve 11 and the metal liquid inlet control valve 13 through the calculation and judgment of the intelligent processor, so that the feeding of the metal liquid 5 and the injection flow control of the metal vapor in the vacuum coating process are realized, and the accurate modulation control of the metal vapor in the vacuum coating process is completed.
Referring to fig. 3, the metal level detection device 9 is a high-sensitivity resistor array type metal level detection device. In the metal coating process, the high-sensitivity resistor array is used for detecting the metal liquid level in the crucible 6, a plurality of identical small resistors are arranged in the height direction of the crucible 6, the resistors are in a disconnected state, a parallel circuit is packaged on the other side of each resistor, a current detection meter is arranged on the total loop, one end of each independent small resistor is connected with a power supply, and a small gap which is equivalent to a switch is arranged on the independent loop at the other end. When no molten metal 5 fills the gap, the circuit loop where the small resistor is located is in an open state, which is equal to the state that the resistor is not connected into the circuit; when the molten metal 5 rises, the gap on the circuit where the resistor is located is filled with the molten metal 5, the circuit of the resistor is conducted, a current I is formed on the circuit, and the height of the crucible 6 where the resistor is located is h. When the liquid level of the molten metal 5 continuously rises, the conducted parallel resistors are more and more, if n resistors are conducted and connected, the total current signal after parallel connection is n multiplied by I, the total current value is related to the liquid level height of the molten metal 5, and the corresponding liquid level height in the crucible 6 is n multiplied by h. The intelligent processor determines the position of the metal liquid level according to the measured current signals of the parallel circuit, a gas phase region is arranged above the liquid level, and a metal liquid region is arranged below the liquid level, so that the crucible heater 7 in the liquid phase region and the crucible heater 7 in the gas phase region can be independently controlled in power regulation. When the liquid level position of the molten metal 5 in the crucible 6 changes, the intelligent processor timely judges the gas-liquid interface position and determines the heating power required by each section of heater on the crucible heater 7.
The invention also provides a metal vapor modulation method for vacuum coating, which utilizes a metal liquid level detection device 9 in the device to measure the liquid level data of the metal liquid 5 in the crucible 6, and an intelligent processor controls the heating power of each section corresponding to the liquid phase and the position gas phase on the crucible heater 7 to realize that the metal liquid 6 in the crucible 6 is at a set temperature to form metal vapor.
The metal vapor pressure data formed in the crucible 6 is measured by utilizing the metal vapor pressure detection device 8, and the opening degrees of the metal vapor outlet control valve 11 and the metal liquid inlet control valve 13 are controlled by the intelligent processor, so that the accurate modulation control among the metal liquid 5 quantity, the metal vapor pressure and the metal vapor injection flow in the crucible 6 is realized.
The metal vapor modulation method of the invention further comprises the following steps:
1) The heater on each component and the crucible heater 7 are started to preheat to the set temperature T a Opening a metal liquid inlet control valve 13, inputting the metal liquid 5 melted into a liquid state in the premelting crucible into the crucible 6, and closing a metal vapor outlet control valve 11;
2) When the molten metal 5 in the crucible 6 reaches the set liquid level position, the crucible heater 7 corresponding to the region of the molten metal 5 adopts full-power heating to heat the molten metal 5 to the target temperature T m Then forming metal vapor, reducing heating power by a crucible heater 7, and continuously preserving heat of the position of a crucible 6 in the area of molten metal 5;
3) When the pressure of the metal vapor in the crucible 6 reaches a target pressure range, a metal vapor outlet control valve 11 is opened, the metal vapor is conveyed to a metal vapor injector 3 along a metal vapor outlet pipeline 10, and the metal vapor injector 3 sprays the metal vapor onto the surface of the running strip steel 15 to form a metal coating film;
in the metal coating process, if the metal vapor pressure is kept relatively constant, the maximum metal vapor flow is Q out The sprayed metal flow and the opening K of the metal vapor outlet control valve 11 out Related to the opening degree K out The value range is 0-100%. By setting the opening degree K of the metal vapor outlet control valve 11 out And obtaining real-time metal steam flow and realizing metal steam flow modulation control.
4) And immediately before the metal coating production is completed, after the metal liquid level position in the crucible 6 is regulated, the metal liquid inlet control valve 13 is closed, and after the metal liquid in the crucible 6 is completely evaporated, the metal vapor outlet control valve 11 is closed.
In step 3), during the metal plating process, in order to maintain the liquid level in the crucible 6 relatively constant, the intelligent processor controls the opening degree K of the valve 11 according to the metal vapor outlet out And maximum metal vapor flow rate Q out The liquid supplementing quantity K required by maintaining balance of the molten metal 5 in the crucible 6 is calculated in real time out ×Q out And at the same time, according to the maximum flow rate Q of the molten metal in the molten metal conveying pipeline 12 in And the opening degree K of the molten metal inlet control valve 13 in Calculating the flow of the inlet molten metal 5 in real time, wherein the flow of the evaporated metal steam is equal to the liquid supplementing amount of the molten metal 5, namely K in ×Q in =K out ×Q out Thereby controlling the molten metal 5 in the crucible 6 to maintain dynamic balance. In the process, if the metal evaporation amount needs to be regulated, the opening degree K of the metal liquid inlet control valve 13 can be adjusted in And adjusting to realize the adjustment of the molten metal 5 in the crucible 6. Meanwhile, the intelligent processor adjusts the heating power of each section of crucible heater 7 according to the judged liquid level position of the molten metal 5. Through the adjustment, the modulation control of the metal vapor evaporation amount can be realized.
In step 3), when the metal vapor pressure detection device 8 detects that the metal vapor pressure variation range in the crucible 6 exceeds the set value, the intelligent processor calculates and makes the following judgment:
if the metal vapor pressure is reduced and the amplitude exceeds a set value, the power of the crucible heater 7 corresponding to the area of the molten metal 5 is increased until the metal vapor pressure in the crucible 6 is restored to the set value;
if the metal vapor pressure is reduced and the amplitude exceeds a set value, the power of a crucible heater 7 corresponding to the area of the metal liquid 5 is increased, the metal vapor pressure in the crucible 6 still cannot be recovered to the set value, the intelligent processor gives out a pressure lower alarm to a coating machine set, if the coating process requirement cannot be met, the metal vapor outlet control valve 11 is closed, and when the metal vapor pressure is recovered to meet the coating process requirement, the metal vapor outlet control valve 11 is opened;
if the metal vapor pressure is increased and the increase exceeds a set value, reducing the power of the crucible heater 7 corresponding to the area of the molten metal 5 until the metal vapor pressure in the crucible 6 is restored to the set value;
if the metal vapor pressure exceeds the highest critical value of the safety pressure range, reducing the power of the crucible heater 7 corresponding to the metal liquid 5 area, closing the metal liquid inlet control valve 13 until the metal vapor pressure in the crucible 6 is restored to the set value, opening the metal liquid inlet control valve 13, and increasing the power of the crucible heater 7; if the power of the crucible heater 7 is reduced to the minimum and the metal vapor pressure cannot be reduced, the intelligent processor sends a pressure relief signal to the coating unit, the pressure relief valve 14 is opened, and the pressure relief valve 14 is closed when the metal vapor pressure in the crucible 6 is relieved to a set value.
Through the regulation and control, the modulation and control of the metal steam flow in the crucible 6 are realized, the stable control of the metal steam pressure in the film plating process is ensured, and the stability and the improvement of the film plating quality are facilitated.
The metal vapor modulation method of the invention is specifically controlled as follows:
first, the heater and the crucible heater 7 on each component preheat the molten metal delivery pipe 12, the molten metal inlet control valve 13, the molten metal outlet pipe 10, the molten metal outlet control valve 11, the molten metal injector 3, and the crucible 6 to the target temperature T a ,T a The temperature range of (2) is 600-800 ℃.
Next, the metal vapor outlet control valve 11 is closed, the metal liquid inlet control valve 13 is opened, and the metal liquid 5 enters the crucible 6 from the metal liquid conveying pipe 12. The metal liquid level detection device 9 measures the liquid level position of the metal liquid 5 in real time, and when the liquid level reaches a set value, the metal liquid inlet control valve 13 is closed.
Again, according to the metal level detection deviceThe intelligent processor adjusts the heating power of each section of the segmented crucible heater 7 according to the liquid level position detected by the device 9. For the crucible heater 7 above the liquid level, a low-power constant temperature maintenance is adopted, so that the temperature of the crucible 6 is kept at the target temperature T a . For the crucible heater 7 below the liquid level, high power rapid heating is used to heat the crucible 6 to the target temperature T m . When the crucible 6 is heated to the target temperature T m The crucible heating power 7 in the molten metal area is reduced, and the constant temperature maintenance is carried out by adopting low power. When the metal pressure value detected by the metal vapor pressure detecting device 8 meets the coating process requirement, the coating conditions are provided. Wherein T is m The temperature range of (2) is 700-1000 ℃.
Then, the metal vapor outlet control valve 11 is opened, and the metal vapor is delivered to the metal vapor injector 3 through the metal vapor outlet pipe 10 and is sprayed onto the surface of the strip steel 15 to form a coating layer. At the same time, according to the opening degree K of the metal vapor outlet control valve 11 out And maximum molten metal vapor flow rate Q out The liquid supplementing quantity K required by maintaining balance of the molten metal 5 in the crucible 6 is calculated in real time out ×Q out . The maximum flow rate of molten metal in the molten metal delivery pipe 12 is Q in The opening K of the molten metal inlet control valve 13 is adjusted in real time in So that K is in ×Q in =K out ×Q out Thereby keeping the metal liquid 5 stably evaporated and realizing the stable control of the steam pressure and flow.
In the metal vapor modulation method, if the metal vapor pressure needs to be increased, the target pressure value range of the metal vapor pressure detection device 8 can be adjusted, the intelligent processor can improve the heating power of the crucible heater 7 in the metal liquid 5 area, and when the metal vapor pressure value reaches the target pressure range, the constant power maintains the metal vapor pressure; if the metal vapor pressure needs to be reduced, the intelligent processor reduces the heating power of the crucible heater 7 in the area of the molten metal 5, and when the metal vapor pressure reaches the target pressure range, the constant power maintains the metal vapor pressure; when the metal vapor pressure fluctuates, stable modulation of the metal vapor pressure can be realized by adjusting the heating power of the crucible heater 7 in the area of the molten metal 5.
In the metal vapor modulation method, if the metal vapor pressure needs to be increased, and the heating power of the crucible heater 7 cannot reach the target pressure even if the heating power is regulated to the maximum, the metal vapor pressure does not meet the coating process requirement, and the intelligent processor temporarily closes the metal vapor outlet control valve 11 and simultaneously sends a metal vapor suspension signal to the coating unit. And when the metal vapor pressure meets the film plating process, sending a metal vapor recovery conveying signal to a film plating unit, and opening a metal vapor outlet control valve 11.
In the metal vapor modulation method, if the metal vapor pressure needs to be reduced in the metal vapor modulation control process, and the heating power of the crucible heater 7 is reduced to the minimum, and the metal vapor pressure still exceeds the safety critical value, the intelligent processor sends a signal for suspending metal vapor transmission to the film plating unit, closes the metal vapor outlet control valve 11, simultaneously closes the metal liquid inlet control valve 13, and opens the pressure relief valve 14. After the pressure of the metal vapor in the crucible 6 is restored to the normal setting range, the pressure release valve 14 is closed, the metal vapor outlet control valve 11 and the metal liquid inlet control valve 13 are opened, and the metal vapor delivery and injection are restored.
In the metal vapor regulating and controlling process, if the evaporation amount of the metal vapor in unit time is required to be increased, the opening degree K of the metal liquid inlet flow control valve 13 can be increased in The metal liquid level detection device 9 detects the liquid level change of the crucible 6 in real time, the intelligent processor adjusts the heating power of each section of the crucible heater 7, when the crucible heater 7 is originally in a gas phase region, the section of the crucible heater 7 is covered after the metal liquid level rises, and then the intelligent processor increases the heating power of the section of the crucible heater 7. Through the adjustment, the metal vapor evaporation amount modulation control can be realized.
It will be appreciated by persons skilled in the art that the above embodiments are provided for illustration only and not for limitation of the invention, and that variations and modifications of the above described embodiments are intended to fall within the scope of the claims of the invention as long as they fall within the true spirit of the invention.

Claims (8)

1. A metal vapor modulation method for a metal vapor modulation device for vacuum coating is characterized in that: the metal vapor modulation device for vacuum coating comprises a vacuum cavity, a metal vapor modulator, a metal vapor injector and an intelligent processor;
the metal vapor modulator and the metal vapor injector are both arranged in the vacuum cavity;
the metal vapor modulator comprises a crucible for placing molten metal, a crucible heater is arranged on the crucible, and a metal vapor pressure detection device and a metal liquid level detection device are arranged in the crucible;
the crucible is connected with the metal steam injector through a metal steam outlet pipeline, and a metal steam outlet control valve is arranged on the metal steam outlet pipeline;
the crucible is connected with a molten metal conveying pipeline, and a molten metal inlet control valve is arranged on the molten metal conveying pipeline;
the intelligent processor is used for receiving the detection data of the metal vapor pressure detection device and the metal liquid level detection device, controlling the opening and closing of the crucible heater and the opening of the metal vapor outlet control valve and the metal liquid inlet control valve through the calculation and the judgment of the intelligent processor,
the metal vapor modulation method utilizes the metal liquid level detection device to detect metal liquid level data in the crucible, and the intelligent processor controls the heating power of each section of the crucible heater to realize that the metal liquid in the crucible is at a set temperature to form metal vapor;
the metal vapor pressure detection device is utilized to measure the metal vapor pressure data in the crucible, the intelligent processor is used for controlling the opening degrees of the metal vapor outlet control valve and the metal liquid inlet control valve, so as to realize the accurate modulation control between the metal vapor pressure and the metal vapor flow in the crucible,
the metal vapor modulation method comprises the following steps:
1) Starting the crucible heatingThe heater is preheated to a set temperature T a Opening the metal liquid inlet control valve, inputting metal liquid into the crucible, and closing the metal vapor outlet control valve;
2) When the molten metal in the crucible reaches the set liquid level position, the crucible heater corresponding to the molten metal region adopts full-power heating to heat the molten metal to the target temperature T m Then forming metal vapor, wherein the crucible heater reduces heating power and keeps the crucible position of the molten metal region continuously;
3) When the pressure of the metal vapor in the crucible reaches a target pressure range, opening the metal vapor outlet control valve, conveying the metal vapor to the metal vapor ejector along the metal vapor outlet pipeline, and spraying the metal vapor to the surface of the running strip steel by the metal vapor ejector to form a metal coating film;
4) And when the metal coating production is just finished, after the position of the metal liquid level in the crucible is regulated, closing the metal liquid inlet control valve, and after the metal liquid in the crucible is completely evaporated, closing the metal vapor outlet control valve.
2. The metal vapor modulation method according to claim 1, characterized in that: one or two vacuum cavities are arranged.
3. The metal vapor modulation method according to claim 2, characterized in that: when two vacuum cavities are arranged, the metal vapor modulator and the metal vapor ejector are respectively arranged in the corresponding vacuum cavities.
4. The metal vapor modulation method according to claim 1, characterized in that: and a pressure release valve is arranged on the crucible.
5. The metal vapor modulation method according to claim 1, characterized in that: the crucible heater adopts a sectional control type crucible heater.
6. The metal vapor modulation method according to claim 1, characterized in that: the metal liquid level detection device adopts a high-sensitivity resistor array type metal liquid level detection device.
7. The metal vapor modulation method according to claim 1, characterized in that: in the step 3), the metal vapor injector sprays metal vapor, and the intelligent processor controls the opening K of the valve according to the metal vapor outlet at the same time out And maximum metal vapor flow rate Q out Calculating the liquid supplementing quantity K required by maintaining balance of the molten metal in the crucible in real time out ×Q out Then according to the maximum flow Q of the molten metal in the molten metal conveying pipeline in Controlling the opening K of the molten metal inlet control valve in real time in So that K is in ×Q in =K out ×Q out
8. The metal vapor modulation method as set forth in claim 4, wherein: in the step 3), when the metal vapor pressure detection device detects that the metal vapor pressure variation range in the crucible exceeds a set value, the intelligent processor calculates and judges as follows:
if the metal vapor pressure is reduced and the amplitude is more than a set value, increasing the power of the crucible heater corresponding to the molten metal area until the metal vapor pressure in the crucible is recovered to the set value;
if the metal vapor pressure is reduced and the amplitude is beyond a set value, the power of the crucible heater corresponding to the metal liquid area is increased, the metal vapor pressure in the crucible still cannot be recovered to the set value, the intelligent processor sends out a pressure lower alarm to a film plating unit, if the metal vapor pressure cannot meet the film plating process requirement, the metal vapor outlet control valve is closed, and when the metal vapor pressure is recovered to meet the film plating process requirement, the metal vapor outlet control valve is opened;
if the metal vapor pressure is increased and the increase exceeds a set value, reducing the power of the crucible heater corresponding to the molten metal region until the metal vapor pressure in the crucible is restored to the set value;
if the metal vapor pressure exceeds the highest critical value of the safety pressure range, reducing the power of the crucible heater corresponding to the metal liquid region, closing the metal liquid inlet control valve until the metal vapor pressure in the crucible is restored to a set value, opening the metal liquid inlet control valve, and increasing the power of the crucible heater; if the power of the crucible heater is reduced to the minimum and the metal vapor pressure cannot be reduced, the intelligent processor sends a pressure relief signal to the coating unit, the pressure relief valve is opened, and when the metal vapor pressure in the crucible is relieved to a set value, the pressure relief valve is closed.
CN202010602512.0A 2020-06-29 2020-06-29 Metal vapor modulation device for vacuum coating and modulation method thereof Active CN113930738B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010602512.0A CN113930738B (en) 2020-06-29 2020-06-29 Metal vapor modulation device for vacuum coating and modulation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010602512.0A CN113930738B (en) 2020-06-29 2020-06-29 Metal vapor modulation device for vacuum coating and modulation method thereof

Publications (2)

Publication Number Publication Date
CN113930738A CN113930738A (en) 2022-01-14
CN113930738B true CN113930738B (en) 2023-09-12

Family

ID=79272617

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010602512.0A Active CN113930738B (en) 2020-06-29 2020-06-29 Metal vapor modulation device for vacuum coating and modulation method thereof

Country Status (1)

Country Link
CN (1) CN113930738B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114875364A (en) * 2022-05-13 2022-08-09 武汉华星光电半导体显示技术有限公司 Evaporation source device

Citations (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2119970A (en) * 1982-03-26 1983-11-23 Clarion Co Ltd Film deposition equipment
US4436674A (en) * 1981-07-30 1984-03-13 J.C. Schumacher Co. Vapor mass flow control system
JPS62267468A (en) * 1986-05-16 1987-11-20 Mitsubishi Heavy Ind Ltd Device for controlling molten metal level in vacuum evaporator
JPS62267470A (en) * 1986-05-16 1987-11-20 Mitsubishi Heavy Ind Ltd Method for detecting and controlling level of molten metal in continuous vacuum deposition chamber
US5234527A (en) * 1990-07-20 1993-08-10 Tokyo Electron Limited Liquid level detecting device and a processing apparatus
JPH07278798A (en) * 1994-04-14 1995-10-24 Mitsubishi Heavy Ind Ltd Vacuum vapor deposition device and vacuum vapor deposition method
JPH0953173A (en) * 1995-08-18 1997-02-25 Nisshin Steel Co Ltd Method for stably feeding evaporating material
WO1999055478A1 (en) * 1998-04-27 1999-11-04 Otto Junker Gmbh Method for processing a molten metal mass, especially a molten light metal mass, and a dosing furnace which is encapsulated and which can be pressurized by protective gas
JPH11323535A (en) * 1998-05-08 1999-11-26 Toray Ind Inc Production of metallic vapor-deposited products and device therefor
EP1006219A1 (en) * 1998-11-30 2000-06-07 Air Products And Chemicals, Inc. Ultrasonic level sensing in a chemical refill system
JP2005054212A (en) * 2003-08-07 2005-03-03 Toray Ind Inc Method and apparatus for manufacturing base material with thin film deposited thereon
WO2005116290A1 (en) * 2004-05-27 2005-12-08 Sidrabe, Inc. Method and apparatus for vacuum deposition by vaporizing metals and metal alloys
CN101333642A (en) * 2007-06-29 2008-12-31 宝山钢铁股份有限公司 Band steel filming method and system thereof
JP2010084194A (en) * 2008-09-30 2010-04-15 Hoya Corp Vapor deposition apparatus and vapor deposition method
CN101855380A (en) * 2007-10-12 2010-10-06 安赛乐米塔尔法国公司 Industrial vapour generator for the deposition of an alloy coating onto a metal strip
KR20110034420A (en) * 2009-09-28 2011-04-05 주식회사 포스코 Molten Metal Feeder
CN102485952A (en) * 2010-12-06 2012-06-06 理想能源设备有限公司 Vaporizing device and vaporization method
CN103328680A (en) * 2011-01-14 2013-09-25 安赛乐米塔尔研究与发展有限责任公司 Automatic feeding device for an industrial metal-vapor generator
WO2013143692A1 (en) * 2012-03-30 2013-10-03 Tata Steel Nederland Technology B.V. Method and apparatus for feeding liquid metal to an evaporator device
JP2013204101A (en) * 2012-03-29 2013-10-07 Hitachi Zosen Corp Vapor deposition apparatus
EP2746423A1 (en) * 2012-12-20 2014-06-25 Applied Materials, Inc. Evaporator, deposition arrangement, deposition apparatus and methods of operation thereof
JP2014150019A (en) * 2013-02-04 2014-08-21 Hitachi High-Technologies Corp Device and method for manufacturing organic el device
CN104032264A (en) * 2013-06-13 2014-09-10 奥昱公司 Film Coating System Capable Of Performing Thin Film Deposition In Rigorous Evaporation Environment
JP2015069859A (en) * 2013-09-30 2015-04-13 株式会社日立ハイテクファインシステムズ Organic el manufacturing device and organic el manufacturing method
WO2018114376A1 (en) * 2016-12-22 2018-06-28 Flisom Ag Linear evaporation source
JP2019001671A (en) * 2017-06-12 2019-01-10 株式会社豊田中央研究所 Metal vapor supply apparatus, metal / metal compound production apparatus, metal nitride single crystal production method, and nanoparticle production method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4922286B2 (en) * 2005-03-16 2012-04-25 アドバンスド テクノロジー マテリアルズ,インコーポレイテッド Ion implantation system, fluorine chemical supply source, and xenon difluoride supply method
KR102360308B1 (en) * 2016-05-03 2022-02-08 타타 스틸 네덜란드 테크날러지 베.뷔. How the device works for supplying liquid metal to the evaporation device

Patent Citations (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4436674A (en) * 1981-07-30 1984-03-13 J.C. Schumacher Co. Vapor mass flow control system
GB2119970A (en) * 1982-03-26 1983-11-23 Clarion Co Ltd Film deposition equipment
JPS62267468A (en) * 1986-05-16 1987-11-20 Mitsubishi Heavy Ind Ltd Device for controlling molten metal level in vacuum evaporator
JPS62267470A (en) * 1986-05-16 1987-11-20 Mitsubishi Heavy Ind Ltd Method for detecting and controlling level of molten metal in continuous vacuum deposition chamber
US5234527A (en) * 1990-07-20 1993-08-10 Tokyo Electron Limited Liquid level detecting device and a processing apparatus
JPH07278798A (en) * 1994-04-14 1995-10-24 Mitsubishi Heavy Ind Ltd Vacuum vapor deposition device and vacuum vapor deposition method
JPH0953173A (en) * 1995-08-18 1997-02-25 Nisshin Steel Co Ltd Method for stably feeding evaporating material
WO1999055478A1 (en) * 1998-04-27 1999-11-04 Otto Junker Gmbh Method for processing a molten metal mass, especially a molten light metal mass, and a dosing furnace which is encapsulated and which can be pressurized by protective gas
JPH11323535A (en) * 1998-05-08 1999-11-26 Toray Ind Inc Production of metallic vapor-deposited products and device therefor
EP1006219A1 (en) * 1998-11-30 2000-06-07 Air Products And Chemicals, Inc. Ultrasonic level sensing in a chemical refill system
JP2005054212A (en) * 2003-08-07 2005-03-03 Toray Ind Inc Method and apparatus for manufacturing base material with thin film deposited thereon
WO2005116290A1 (en) * 2004-05-27 2005-12-08 Sidrabe, Inc. Method and apparatus for vacuum deposition by vaporizing metals and metal alloys
CN101333642A (en) * 2007-06-29 2008-12-31 宝山钢铁股份有限公司 Band steel filming method and system thereof
CN101855380A (en) * 2007-10-12 2010-10-06 安赛乐米塔尔法国公司 Industrial vapour generator for the deposition of an alloy coating onto a metal strip
JP2010084194A (en) * 2008-09-30 2010-04-15 Hoya Corp Vapor deposition apparatus and vapor deposition method
KR20110034420A (en) * 2009-09-28 2011-04-05 주식회사 포스코 Molten Metal Feeder
CN102485952A (en) * 2010-12-06 2012-06-06 理想能源设备有限公司 Vaporizing device and vaporization method
CN103328680A (en) * 2011-01-14 2013-09-25 安赛乐米塔尔研究与发展有限责任公司 Automatic feeding device for an industrial metal-vapor generator
JP2013204101A (en) * 2012-03-29 2013-10-07 Hitachi Zosen Corp Vapor deposition apparatus
WO2013143692A1 (en) * 2012-03-30 2013-10-03 Tata Steel Nederland Technology B.V. Method and apparatus for feeding liquid metal to an evaporator device
EP2746423A1 (en) * 2012-12-20 2014-06-25 Applied Materials, Inc. Evaporator, deposition arrangement, deposition apparatus and methods of operation thereof
JP2014150019A (en) * 2013-02-04 2014-08-21 Hitachi High-Technologies Corp Device and method for manufacturing organic el device
CN104032264A (en) * 2013-06-13 2014-09-10 奥昱公司 Film Coating System Capable Of Performing Thin Film Deposition In Rigorous Evaporation Environment
JP2015069859A (en) * 2013-09-30 2015-04-13 株式会社日立ハイテクファインシステムズ Organic el manufacturing device and organic el manufacturing method
WO2018114376A1 (en) * 2016-12-22 2018-06-28 Flisom Ag Linear evaporation source
JP2019001671A (en) * 2017-06-12 2019-01-10 株式会社豊田中央研究所 Metal vapor supply apparatus, metal / metal compound production apparatus, metal nitride single crystal production method, and nanoparticle production method

Also Published As

Publication number Publication date
CN113930738A (en) 2022-01-14

Similar Documents

Publication Publication Date Title
CN101680080B (en) Method for coating a substrate and metal alloy vacuum deposition facility
US4495889A (en) Polymeric film coating apparatus
US4518623A (en) Polymeric film coating method with continuous deposition pressure control
CN112538604B (en) Device and method for supplementing liquid and stabilizing metal steam supply amount in vacuum coating
CN113930738B (en) Metal vapor modulation device for vacuum coating and modulation method thereof
US10875067B2 (en) Pre-heating and thermal control of work rolls in metal rolling processes and control systems thereof
KR890002655B1 (en) Method of controlling deposition amount distribution in a vacuum deposition plating
US5518772A (en) Method for adjusting coating weight by gas wiping
CN112538603A (en) Vacuum coating device capable of continuously filling and continuous filling method thereof
JPS60251273A (en) Method for controlling extent of evaporation in vacuum depositing apparatus
CN113892731B (en) Three-dimensional curved surface quantitative gluing system and three-dimensional curved surface quantitative gluing method
CN115233162A (en) Chemical vapor deposition equipment with automatic regulating device for metal melt evaporation capacity
KR101778441B1 (en) Dry coating apparatus
CN217869086U (en) Chemical vapor deposition equipment capable of automatically adjusting evaporation capacity of metal melt
JPH0953173A (en) Method for stably feeding evaporating material
CN116445864A (en) System and method for monitoring and regulating uniformity of coating
JP2939033B2 (en) Manufacturing method of galvannealed steel sheet
CN113930737B (en) Metal steam flow control device under vacuum and control method thereof
JP2003129206A (en) Production method for hot-dip zinc-plated steel sheet
CN113684479A (en) Coating method using electromagnetic stirrer for stirring and alloy vacuum deposition device
JPS63199868A (en) Device for controlling molten metal level in vacuum evaporator
KR102746102B1 (en) Intelligent coating system
US20220074042A1 (en) Apparatus and method for controlling coating layer in pvd plating process
JPS63153268A (en) Method for controlling partial pressure of gas in continuous dry coating tank
JPH0533110A (en) Method for manufacturing steel sheet with alloyed molten zinc plating

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant