CN113923966A - Circuit board assembly and electronic equipment - Google Patents
Circuit board assembly and electronic equipment Download PDFInfo
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- CN113923966A CN113923966A CN202111224988.6A CN202111224988A CN113923966A CN 113923966 A CN113923966 A CN 113923966A CN 202111224988 A CN202111224988 A CN 202111224988A CN 113923966 A CN113923966 A CN 113923966A
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- circuit board
- shielding
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- board assembly
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- 230000017525 heat dissipation Effects 0.000 description 9
- 238000004512 die casting Methods 0.000 description 7
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- 238000012546 transfer Methods 0.000 description 5
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- 230000001070 adhesive effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000002791 soaking Methods 0.000 description 3
- 239000002470 thermal conductor Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
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- 239000010949 copper Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
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- 229910000679 solder Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application provides a circuit board assembly and an electronic device, wherein the circuit board assembly comprises a circuit board, a shielding part, a heat conducting part and a heat conducting connecting part. The circuit board is provided with components. The shielding piece is provided with a shielding space, the shielding piece is arranged on the circuit board, at least part of components are arranged in the shielding space, and the shielding piece is also provided with a through hole communicated with the shielding space. The heat conducting piece is connected to one side of the shielding piece, which is far away from the shielding space, and the heat conducting piece covers the through hole. At least part of the heat conduction connecting piece is arranged in the through hole, and the opposite two ends of the heat conduction connecting piece are respectively connected with the component and the heat conduction piece. Through set up the through-hole that communicates shielding space on the shielding part, only need make the relative both ends of heat conduction connecting piece connect components and parts and heat conduction spare respectively afterwards, alright couple together components and parts and heat conduction spare. The heat that components and parts gived off can directly be transmitted for the heat conduction spare from the heat conduction connecting piece and dispel the heat this moment, has reduced heat transmission route, has improved heat conduction efficiency.
Description
Technical Field
The application belongs to the technical field of circuit boards, and particularly relates to a circuit board assembly and electronic equipment.
Background
In the field of circuit boards, various components are generally mounted on a circuit board to operate, thereby enabling electronic devices to realize various functions. However, with the continuous development of electronic devices, especially in response to the demands of high power consumption and strong shielding of electronic devices, it is necessary to shield and dissipate electrical signals from components. But the shielding effect and the heat dissipation effect are not good at present.
Disclosure of Invention
In view of this, the present application provides in a first aspect a circuit board assembly comprising:
the circuit board is provided with components;
the shielding part is provided with a shielding space, the shielding part is arranged on the circuit board, at least part of the components are arranged in the shielding space, and the shielding part is also provided with a through hole communicated with the shielding space;
the heat conduction piece is connected to one side of the shielding piece, which is far away from the shielding space, and covers the through hole; and
and at least part of the heat conduction connecting piece is arranged in the through hole, and the two opposite ends of the heat conduction connecting piece are respectively connected with the component and the heat conduction piece.
The circuit board assembly that this application first aspect provided is through seting up the through-hole that communicates shielding space on the shielding part to make the heat-conducting member locate the shielding part outside and correspond the one side setting of seting up the through-hole. And then the components and the heat conducting pieces can be connected only by arranging at least part of the heat conducting connecting pieces in the through holes and respectively connecting the components and the heat conducting pieces at the two opposite ends of the heat conducting connecting pieces. This application only need adopt a heat conduction connecting piece alright be connected components and parts with heat-conducting piece, and the heat that components and parts distribute this moment can directly be followed heat conduction connecting piece and transmitted for heat-conducting piece and dispel the heat. And the heat conduction piece can be reached without the need of firstly transferring the heat to one heat conduction connecting piece, then transferring the heat to the heat conduction piece and finally transferring the heat to the other heat conduction connecting piece in the related technology, so that the heat transfer path is reduced and the heat conduction efficiency is improved. And because this application only needs to adopt a heat conduction connecting piece, still can reduce the assembly degree of difficulty and cost.
The second aspect of the present application provides an electronic device, including casing, display screen, and like the circuit board assembly that the first aspect of the present application provided, the display screen install in the casing, the casing has accommodating space, circuit board assembly locates in the accommodating space, just circuit board assembly electricity is connected the display screen.
The electronic equipment that this application second aspect provided through the circuit board assembly who adopts this application first aspect to provide, can improve heat conduction efficiency, still can reduce the assembly degree of difficulty and cost.
Drawings
In order to more clearly explain the technical solution in the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be described below.
Fig. 1 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present disclosure.
Fig. 2 is a schematic structural diagram of a circuit board assembly according to another embodiment of the present disclosure.
Fig. 3 is a schematic structural diagram of a circuit board assembly according to another embodiment of the present application.
Fig. 4 is a schematic structural diagram of a circuit board assembly according to another embodiment of the present application.
Fig. 5 is a schematic structural diagram of a circuit board assembly according to yet another embodiment of the present application.
Fig. 6 is a schematic structural diagram of a circuit board assembly according to yet another embodiment of the present application.
Fig. 7 is a schematic diagram of an electronic device according to an embodiment of the present application.
Description of reference numerals:
the circuit board assembly comprises a circuit board assembly-1, electronic equipment-2, a circuit board-10, a component-11, a shielding part-20, a shielding space-21, a through hole-22, a top wall-23, a side wall-24, a groove-25, a heat conducting part-30, a heat conducting connecting part-40, an elastic connecting part-50, a shell-60, a containing space-61 and a display screen-70.
Detailed Description
The following is a preferred embodiment of the present application, and it should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present application, and these improvements and modifications are also considered as the protection scope of the present application.
Before the technical solutions of the present application are introduced, the technical problems in the related art will be described in detail.
In the field of circuit boards, various components are generally mounted on a circuit board to operate, thereby enabling electronic devices to realize various functions. However, with the continuous development of electronic devices, the functions implemented by the electronic devices are more and more diverse and complex, resulting in increased power consumption of components. Therefore, it is necessary to shield the components from the electrical signals and prevent interference with nearby components. And with the increase of the power consumption of the components, the heat emitted by the components is also increasing continuously, so that the heat needs to be timely and effectively led out to prevent the performance and the service life of the components from being influenced.
Therefore, it is generally necessary to shield and dissipate the electrical signals of the components. Shielding and heat dissipation are usually performed by adding a shielding member and a heat conducting member. For example, some shield members mounted on a circuit board are covered with components to perform a shielding function, and heat conducting members are disposed on the shield members to conduct heat. Meanwhile, in order to transfer heat dissipated by the components to the heat conducting member, a heat conducting connecting member needs to be arranged between the components and the shielding member, and a heat conducting connecting member is arranged between the shielding member and the heat conducting member.
However, if the heat of the component is to be transferred to the heat conducting member, the heat needs to be transferred to the heat conducting member through a heat conducting connecting member, a shielding member and a heat conducting connecting member. This results in too much material in the heat dissipation system, too long a heat transfer path, and a decrease in heat transfer efficiency. And the heat conductivity coefficient of each part is different, so that heat blockage is easily caused, and the high-power-consumption heat source is quickly heated to obtain the maximum value. In addition, the heat dissipation system is made of too much material, so that the assembly difficulty and the cost are increased.
Based on this, in order to solve the above-mentioned problem, the present application provides a circuit board assembly. Specifically, please refer to fig. 1, in which fig. 1 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present disclosure. The present embodiment provides a circuit board assembly 1 including a circuit board 10, a shield member 20, a heat conductive member 30, and a heat conductive connecting member 40. The circuit board 10 is provided with a component 11. The shielding part 20 is provided with a shielding space 21, the shielding part 20 is arranged on the circuit board 10, at least part of the component 11 is arranged in the shielding space 21, and the shielding part 20 is also provided with a through hole 22 communicated with the shielding space 21. The heat conducting member 30 is connected to a side of the shielding member 20 away from the shielding space 21, and the heat conducting member 30 covers the through hole 22. At least a portion of the heat conductive connector 40 is disposed in the through hole 22, and opposite ends of the heat conductive connector 40 are respectively connected to the component 11 and the heat conductive member 30.
The Circuit Board Assembly 1 (PCBA) according to the present embodiment can be applied to various electronic devices. The electronic device can be applied to a mobile phone, a tablet, a computer, a smart watch or various devices needing to be electrically controlled, and various functions can be realized for the electronic device.
The circuit board assembly 1 provided in this embodiment includes a circuit board 10, and the circuit board 10 is considered as a base of an electronic device because it can fix each assembly in place and because copper wires are engraved on the circuit board 10, it can electrically connect each component 11 together to make the electronic device work as intended. Alternatively, the Circuit Board 10 includes, but is not limited to, a Printed Circuit Board 10 (PCB), a Flexible Circuit Board 10 (FPCB), or the like. And various components 11 may be disposed on the circuit board 10, and the components 11 may radiate electromagnetic waves and may radiate heat when operating. And with the development of technology and the increasing demand of users, the number and intensity of the electromagnetic waves emitted from the component 11 gradually increase, and the amount of heat emitted also gradually increases. In the present embodiment, the type and number of the components 11 are not limited, and the number of the components 11 may be one or more. The Circuit Board 10 and the component 11 provided on the Circuit Board 10 are generally collectively referred to as a finished Circuit Board (PCBA). The PCBA is a finished product formed by a PCB bare board after Surface Mount Technology (SMT) chip mounting, dual in-line package technology (DIP) plug-in and PCBA testing, quality inspection assembly and the like, and is called PCBA for short.
The circuit board assembly 1 provided by the present embodiment further includes a shielding member 20, where the shielding member 20 is used to shield each component 11, so as to prevent electromagnetic wave signals generated by the component 11 during operation from affecting other components 11. The shielding member 20 is disposed on the circuit board 10, and the shielding member 20 has a shielding space 21. Alternatively, a recess 25 may be formed on one side surface of the shielding member 20 to form a shielding space 21, so that at least a part of the component 11 is disposed in the shielding space 21. Here, when the shielding member 20 is directly connected to the circuit board 10, the shielding member 20 may cooperate with the circuit board 10 to form the above-mentioned shielding space 21, and the components 11 may be entirely disposed in the shielding space 21. Alternatively, if the shielding element 20 is indirectly connected to the circuit board 10 through another component (e.g., the elastic connecting element 50 or the adhesive element), the shielding element 20, the other component, and the circuit board 10 form a new shielding space 21 (as shown in fig. 6), so that only a part of the components 11 is disposed in the shielding space 21 formed by the shielding element 20, and the rest is disposed in the space formed by the other component and the circuit board 10.
Alternatively, the shielding member 20 includes, but is not limited to, a die casting (Diecasting), which is a workpiece integrally formed by a die casting process, and a shielding space 21 is naturally die-cast by the die casting, which does not form a shielding cover (sheiding) for shielding the space 21 by bending as in the related art. Therefore, the die casting does not have air holes or bending unfilled corners caused by bending, and the shielding effect of the shielding member 20 can be further improved.
The circuit board assembly 1 according to this embodiment further includes a heat conducting member 30, wherein the heat conducting member 30 is used to dissipate heat transferred to the heat conducting member 30 to the air as soon as possible, so as to achieve the purpose of dissipating heat of the component 11. In this embodiment, the heat conducting member 30 may be disposed on the shielding member 20, and the heat conducting member 30 is disposed outside the shielding space 21, that is, the heat conducting member 30 is disposed on a side of the shielding member 20 away from the shielding space 21, so that the heat of the heat conducting member 30 is better dissipated into the air. And the heat-conducting member 30 may be disposed corresponding to the through-hole 22, i.e., the heat-conducting member 30 covers the through-hole 22. It will also be understood that the orthographic projection of the thermal conductor 30 on the shield 20 covers the through hole 22. This not only facilitates the connection of the subsequent heat conductive connector 40, but also allows the heat conductive member 30 to seal the shielding space 21 regardless of the extent of the through hole 22 occupied by the subsequent heat conductive connector 40, i.e., the through hole 22 is not filled with the heat conductive connector 40, since the heat conductive member 30 is connected to the shielding member 20. In other words, in the present embodiment, a closed shielding space 21 is finally formed only under the cooperation of the shielding element 20, the circuit board 10, the heat conducting element 30, and even the heat conducting connecting element 40, so that the electromagnetic wave signal emitted by the component 11 is not propagated to affect other components 11, and the shielding effect of the shielding element 20 is improved.
The type of the heat conductor 30 is not limited to the embodiment. For example, the heat conducting member 30 may be a Heatsink block (Heatsink), i.e., the Heatsink block includes a Heatsink body and a plurality of fins disposed on the Heatsink body at intervals. Or the heat conductive member 30 may further include a Vapor Chamber (VC). Alternatively, the present embodiment may employ a vapor chamber for heat dissipation. Because the soaking plate has good temperature equalizing effect, namely when heat is transferred to the soaking plate, the heat can be rapidly transferred to other areas of the soaking plate, so that the whole heat dissipation system can dissipate heat uniformly without causing the phenomenon of local over-rapid temperature rise, and the heat dissipation effect is improved.
In addition, the circuit board assembly 1 provided in this embodiment further includes a heat conductive connecting member 40, at least a portion of the heat conductive connecting member 40 is disposed in the through hole 22, and opposite ends of the heat conductive connecting member 40 are respectively connected to the component 11 and the heat conductive member 30. When the height of the component 11 is low or the height of the shielding space 21 is high, the heat conductive connector 40 needs to be partially disposed in the shielding space 21 and connected to the component 11. In this embodiment, the component 11 and the heat conducting member 30 can be connected by only using one heat conducting connecting member 40, and at this time, the heat emitted from the component 11 can be directly transferred from the heat conducting connecting member 40 to the heat conducting member 30 for heat dissipation. The heat conduction member 30 can be reached without transferring the heat to one heat conduction connecting member 40, then transferring the heat to the heat conduction member 30 and finally transferring the heat to the other heat conduction connecting member 40 like in the related art, so that the heat transfer path is reduced, and the heat conduction efficiency is improved. And because this application only needs to adopt a heat conduction connecting piece 40, still can reduce assembly degree of difficulty and cost.
Alternatively, the thermally conductive connection 40 includes, but is not limited to, a thermally conductive gel (thermal gel) or a thermally conductive pad (thermal pad), etc.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a circuit board assembly according to another embodiment of the present disclosure. In this embodiment, the periphery of the heat conductive connector 40 is also connected to the sidewall 24 of the through hole 22.
In this embodiment, the outer periphery of the heat conductive and heat conductive connector 40 can be connected to the sidewall 24 of the through hole 22, in other words, the heat conductive and heat conductive connector 40 can fill the through hole 22, that is, the through hole 22 can be sealed by the heat conductive and heat conductive connector 40, so as to form the enclosed shielding space 21, and further improve the shielding effect of the shielding circuit board assembly 1.
Referring to fig. 1 again, in the present embodiment, the shielding element 20 includes a top wall 23 and a side wall 24 connected to a periphery of the top wall 23 in a bending manner, the top wall 23 and the side wall 24 enclose the shielding space 21, the side wall 24 is disposed on the circuit board 10, and the through hole 22 is disposed on the top wall 23.
In this embodiment, the shielding element 20 specifically includes a top wall 23 and a side wall 24, where the side wall 24 is connected to the periphery of the top wall 23 in a bending manner, that is, the side wall 24 is bent from the top wall 23, so that the top wall 23 and the side wall 24 can enclose the shielding space 21, and the side of the side wall 24 away from the top wall 23 is disposed on the circuit board 10, so that the shielding element 20 is connected to the circuit board 10. In addition, in the present embodiment, the through holes 22 are formed in the top wall 23, which not only facilitates the subsequent arrangement of the heat conducting members 30, but also facilitates the arrangement of a plurality of shielding members 20 and the formation of the through holes 22 in the top wall 23, or the formation of the through holes 22 in the top wall 23 on one shielding member, if a plurality of components 11 need to be shielded and heat-conducted, so that one heat conducting member 30 can be used to dissipate heat for a plurality of components 11, thereby simplifying the structure of the circuit board assembly 1, reducing the cost, and improving the heat dissipation performance.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a circuit board assembly according to another embodiment of the present application. In this embodiment, the side wall 24 is further disposed on one side of the top wall 23 close to the circuit board 10, the top wall 23 and the side wall 24 may enclose a plurality of shielding spaces 21, and the through hole 22 is disposed on the top wall 23 corresponding to each shielding space 21.
As can be seen from the above, if a plurality of components 11 need to be shielded, in one embodiment, one shielding member 20 may be provided for each component 11, and the through holes 22 may be opened and connected to the heat-conducting members 30. In another embodiment, a plurality of top walls 23 may be further disposed at intervals on a side of the top wall 23 close to the circuit board 10, a side wall 24 of the top wall 23 close to the circuit board 10 and a side wall 24 connected to a peripheral edge of the top wall 23 are used to partition a plurality of shielding spaces 21 disposed at intervals, and each component 11 is disposed in one shielding space 21. This allows shielding of a plurality of components 11 by means of one shielding element 20, which further simplifies the construction of the circuit board assembly 1.
In addition, in the present embodiment, the through hole 22 may be formed in the top wall 23 corresponding to each shielding space 21, so that the plurality of components 11 may be connected by using one heat conducting member 30, and the plurality of components 11 may be radiated by using one heat conducting member 30.
Optionally, in the present embodiment, the top wall 23 and the side wall 24 are of a unitary structure. Thereby avoiding air holes or bending unfilled corners at the connection part of the top wall 23 and the side wall 24 and further improving the shielding effect of the shielding part 20.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a circuit board assembly according to another embodiment of the present disclosure. In this embodiment, a recess 25 is formed on a side of the shielding member 20 away from the shielding space 21, and at least a portion of the heat conducting member 30 is disposed in the recess 25. The height of the circuit board assembly 1 can be reduced by providing the shielding member 20 with a recess 25 for receiving at least a portion of the heat conductive member 30.
Referring to fig. 5, fig. 5 is a schematic structural diagram of a circuit board assembly according to another embodiment of the present application. In this embodiment, the surface of the heat conducting member 30 facing away from the shielding space 21 is flush with the surface of the shielding member 20 where the groove 25 is formed. This embodiment also allows the upper surface of the circuit board assembly 1 to be flush, i.e., the surface formed by the upper surface of the thermal conductor member 30 and the upper surface of the shielding member 20, thereby facilitating subsequent formation of other structures thereon.
Referring to fig. 6, fig. 6 is a schematic structural diagram of a circuit board assembly according to another embodiment of the present disclosure. In this embodiment, the circuit board assembly 1 further includes an elastic connector 50, one end of the elastic connector 50 is connected to one side of the shielding member 20 close to the circuit board 10, and the other end is connected to the circuit board 10.
In addition to the above-mentioned components, the present embodiment may further include an elastic connector 50, where the elastic connector 50 is disposed between the shielding member 20 and the circuit board 10, and one end of the elastic connector 50 is connected to the shielding member 20 near the circuit board 10 and the other end is connected to the circuit board 10. That is, the shield member 20 and the circuit board 10 are connected together by the elastic connection member 50, so that the connection performance of the shield member 20 and the circuit board 10 is improved, and the shielding effect of the shield member 20 is further improved.
Alternatively, when the shield 20 is die cast, the resilient connector 50 may be provided at the long rib site and/or the rib site of the die cast. Optionally, the elastic connecting member 50 comprises conductive adhesive, the conductive adhesive can be dotted on the long rib position and/or the rib position of the die casting, and the conductive adhesive can be compressed after being cured, so that good contact between the circuit board 10 and the die casting is ensured, no gap exists, and the shielding effect is improved.
Referring to fig. 6 again, in the present embodiment, when the elastic connector 50 connects the shielding element 20 and the circuit board 10, at least a portion of the elastic connector 50 is in a compressed state. When the elastic connector 50 is used to connect the shielding element 20 and the circuit board 10, since the elastic connector 50 is in a compressed state, the elastic connector 50 can fill up the gap between the elastic connector 50 and the shielding element 20 and the gap between the elastic connector 50 and the circuit board 10 by its resilience, thereby further improving the shielding effect.
Referring to fig. 6 again, in the present embodiment, the shielding member 20, the heat conducting member 30, and the elastic connecting member 50 are an integral structure. This embodiment allows the shield member 20, the heat conductive member 30, and the elastic connection member 50 to be provided in an assembly form. For example, the thermal conductor 30 is first attached to the shield 20, and optionally, the attachment may be performed by solder paste. Next, the elastic connector 50 is disposed on the shielding element 20, so that the three components can form an assembly, and then the assembly can be completed only by one step, i.e., the side provided with the elastic connector 50 is connected to the circuit board 10, and the component 11 on the circuit board 10 is disposed in the shielding space 21. The shielding member 20, the heat conducting member 30 and the elastic connecting member 50 are integrated, so that the production line operation steps can be reduced, the assembly difficulty is reduced, and the assembly cost is reduced.
Optionally, the circuit board assembly 1 may further include screws (screws), and screw holes are formed in the circuit board 10 and the shielding element 20, and the circuit board 10 and the shielding element 20 are connected together by using the screws and the screw holes, so as to further improve the connection performance between the shielding element 20 and the circuit board 10.
Referring to fig. 7, fig. 7 is a schematic view of an electronic device according to an embodiment of the present disclosure. The present embodiment provides an electronic device 2, including a housing 60, a display screen 70, and a circuit board assembly 1 provided as in the above embodiments of the present application, wherein the display screen 70 is installed on the housing 60, the housing 60 has an accommodating space 61, the circuit board assembly 1 is disposed in the accommodating space 61, and the circuit board assembly 1 is electrically connected to the display screen 70.
The electronic device 2 provided by the embodiment can improve the heat conduction efficiency and reduce the assembly difficulty and cost by adopting the circuit board assembly 1 provided by the embodiment of the application. Optionally, the electronic device 2 provided in this embodiment includes, but is not limited to, an electronic device 2 with an electronic function, such as a mobile phone, a smart watch, a bluetooth headset, a tablet computer, a notebook computer, a palm computer, and the like.
The foregoing detailed description has provided for the embodiments of the present application, and the principles and embodiments of the present application have been presented herein for purposes of illustration and description only and to facilitate understanding of the methods and their core concepts; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (11)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111224988.6A CN113923966A (en) | 2021-10-20 | 2021-10-20 | Circuit board assembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111224988.6A CN113923966A (en) | 2021-10-20 | 2021-10-20 | Circuit board assembly and electronic equipment |
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| CN113923966A true CN113923966A (en) | 2022-01-11 |
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| CN202111224988.6A Pending CN113923966A (en) | 2021-10-20 | 2021-10-20 | Circuit board assembly and electronic equipment |
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| CN206181696U (en) * | 2016-10-28 | 2017-05-17 | 中科创达软件科技（深圳）有限公司 | Cell -phone shielding heat radiation structure of low thermal resistance and cell -phone that has this structure |
| CN108617082A (en) * | 2018-06-11 | 2018-10-02 | Oppo广东移动通信有限公司 | A heat dissipation component and an electronic device |
| CN110325019A (en) * | 2019-07-02 | 2019-10-11 | 华为技术有限公司 | A kind of electronic equipment |
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