CN113891198A - Microphone structure - Google Patents
Microphone structure Download PDFInfo
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- CN113891198A CN113891198A CN202010635254.6A CN202010635254A CN113891198A CN 113891198 A CN113891198 A CN 113891198A CN 202010635254 A CN202010635254 A CN 202010635254A CN 113891198 A CN113891198 A CN 113891198A
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- substrate
- space
- microphone
- accommodating space
- chip
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- 239000000758 substrate Substances 0.000 claims abstract description 122
- 230000005540 biological transmission Effects 0.000 claims abstract description 61
- 238000005192 partition Methods 0.000 claims abstract description 20
- 125000006850 spacer group Chemical group 0.000 claims abstract description 6
- 238000007789 sealing Methods 0.000 claims description 22
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims 5
- 230000002093 peripheral effect Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 230000035945 sensitivity Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 230000000994 depressogenic effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
一种麦克风结构，包含基板、分隔件、盖体、特定应用芯片及麦克风芯片。基板具有相对的第一侧及第二侧。第一侧具有凹入结构从第一侧的表面凹入形成凹陷空间。分隔件在基板的第二侧形成容置空间。盖体罩设分隔件，盖体与基板共同形成传声空间。盖体上设有进音孔连通传声空间。特定应用芯片设置在容置空间中且电性连接基板。麦克风芯片设置在容置空间中且电性连接基板与特定应用芯片。基板具有第一传通孔及第二传通孔。第一传通孔连通传声空间与凹陷空间，第二传通孔连通容置空间与凹陷空间。麦克风芯片设置在对准第二传通孔的位置。本公开的麦克风结构的基板可直接与应用端部件共同形成传声通道，使得麦克风结构同时具有前进音功能及大背腔的优点。
A microphone structure includes a substrate, a spacer, a cover, a specific application chip and a microphone chip. The substrate has opposing first and second sides. The first side has a concave structure that is concave from a surface of the first side to form a concave space. The spacer forms an accommodating space on the second side of the substrate. The cover body is covered with a partition, and the cover body and the base plate together form a sound transmission space. The cover body is provided with a sound inlet hole to communicate with the sound transmission space. The application-specific chip is disposed in the accommodating space and is electrically connected to the substrate. The microphone chip is arranged in the accommodating space and is electrically connected to the substrate and the specific application chip. The substrate has a first through hole and a second through hole. The first transmission hole communicates with the sound transmission space and the concave space, and the second transmission hole communicates with the accommodating space and the concave space. The microphone chip is arranged at a position aligned with the second through hole. The substrate of the microphone structure of the present disclosure can directly form a sound transmission channel together with the application end component, so that the microphone structure has the advantages of a forward sound function and a large back cavity at the same time.
Description
Technical Field
The present disclosure relates to microphone structures, and more particularly to a microphone structure with a back-to-back sound characteristic.
Background
The existing microphone structure is mainly divided into a front-sound type microphone structure and a rear-sound type microphone structure. The common forward-sound microphone structure mainly uses the space where the sound enters the microphone chip and the application-specific chip from the upper cover as a front cavity, and when the sound enters the front cavity and passes through the microphone chip, the cavity of the microphone chip is a back cavity.
However, the sensitivity of sound is mainly determined by the volume of the back cavity, so when the cavity of the microphone chip itself is used as the back cavity, the problem of low sensitivity often occurs because the volume of the back cavity is too small.
Disclosure of Invention
It is therefore an object of embodiments of the present disclosure to provide a microphone structure. The substrate structure design of the microphone structure can directly form a sound transmission channel together with the application end part, so that the microphone structure has the function of front sound advancing and has the advantage of a large back cavity for back sound advancing.
In accordance with the above objects of embodiments of the present disclosure, a microphone structure is proposed. The microphone structure is configured to be connected to an application terminal. The microphone structure comprises a substrate, a separator, a cover body, an application specific chip and a microphone chip. The substrate is provided with a first side and a second side which are opposite, wherein the first side is provided with a concave structure which is concave from the surface of the first side to form a concave space. The partition is configured to form an accommodating space at the second side of the substrate. The cover body covers the separating piece, and the cover body and the substrate form a sound transmission space together, wherein the cover body is provided with a sound inlet hole communicated with the sound transmission space. The specific application chip is arranged in the accommodating space and is electrically connected with the substrate. The microphone chip is arranged in the accommodating space and electrically connected with the substrate and the specific application chip. The substrate is provided with a first transmission through hole and a second transmission through hole, wherein the first transmission through hole is communicated with the sound transmission space and the concave space, the second transmission through hole is communicated with the accommodating space and the concave space, and the microphone chip is arranged at a position aligned with the second transmission through hole.
According to an embodiment of the present disclosure, the partition is a retaining wall, the retaining wall encloses the specific application chip and the microphone chip, and a space enclosed by the retaining wall is an accommodating space. The cover body is a plate body and is arranged on the baffle wall, and the cover body is covered with an accommodating space and a sound transmission space.
According to an embodiment of the present disclosure, the accommodating space is formed by being recessed from the second side surface of the substrate. The first through hole penetrates from the second side of the substrate to the recessed space of the substrate to form a sound transmission space. The partition is defined as a part of the substrate separating the accommodating space and the sound transmission space. The cover body is a plate body and is provided with an accommodating space and a sound transmission space.
According to an embodiment of the present disclosure, the partition is a cover disposed on the second side of the substrate and forms an accommodating space with the substrate. The cover body has an n-shaped cross section and is arranged outside the cover body to form a sound transmission space with the substrate.
According to an embodiment of the disclosure, a first sealing ring is disposed at a position of the substrate corresponding to the cover, and the cover is joined to the first sealing ring by a conductive adhesive or a non-conductive adhesive. The position of the substrate corresponding to the cover body is provided with a second sealing ring, and the cover body is jointed to the second sealing ring through conductive adhesive or non-conductive adhesive.
According to an embodiment of the present disclosure, the substrate is a ceramic substrate, a printed circuit board or a resin substrate.
According to an embodiment of the present disclosure, the second side of the substrate is provided with at least one pad located in the accommodating space, and the first side of the substrate is provided with at least one pad adjacent to the recessed structure. The bonding pad and the bonding pad are electrically connected with each other through the conductive structure penetrating through the substrate.
According to an embodiment of the present disclosure, the recessed structure on the first side of the substrate is provided with a seal ring structure, and the seal ring structure is connected to another seal ring structure on the application terminal member by a conductive adhesive.
In view of the above, the present disclosure mainly changes the structure itself of the substrate of the microphone structure and the relative position configuration between the substrate and the microphone chip, so that when the microphone structure is installed in an application product, the microphone structure can simultaneously maintain the front sound function of the microphone structure and have a large back cavity volume. Specifically, the present disclosure forms an open space on the substrate by providing a concave structure on one side of the substrate, and forms two non-communicating accommodating spaces and sound transmission spaces on the other side of the substrate. Then, the first through hole and the second through hole are formed in the substrate to enable the concave space to be communicated to the accommodating space and the sound transmission space respectively, so that the sound transmission path of the microphone structure is changed, and the microphone structure can have the effects of a sound advancing function and a large back cavity space.
Drawings
For a more complete understanding of the embodiments and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:
fig. 1 is an external view schematically showing a microphone structure according to a first embodiment of the present disclosure;
fig. 2 is a schematic cross-sectional view showing a microphone structure according to a first embodiment of the present disclosure;
fig. 3 is an exploded schematic view showing a microphone structure according to a first embodiment of the present disclosure;
fig. 4 is a schematic bottom surface angle diagram illustrating a substrate of a microphone structure according to a first embodiment of the present disclosure;
fig. 5 is an external view schematically showing a microphone structure according to a second embodiment of the present disclosure;
fig. 6 is a schematic cross-sectional view showing a microphone structure according to a second embodiment of the present disclosure;
fig. 7 is an exploded schematic view showing a microphone structure according to a second embodiment of the present disclosure; and
fig. 8 is a schematic bottom surface angle diagram illustrating a microphone structure according to a second embodiment of the present disclosure.
Description of reference numerals:
100: microphone structure
110: substrate
111: first side
111 a: recessed structure
112: second side
120: separator
130: cover body
131: sound inlet hole
140: application specific chip
150: microphone chip
200: application end component
301: bonding pad
302: bonding pad
303: conductive structure
400: microphone structure
410: substrate
411: first side
411 a: recessed structure
412: second side
420: separator
430: cover body
431: sound inlet hole
440: application specific chip
450: microphone chip
501: bonding pad
502: bonding pad
A1: depressed space
A2: containing space
A3: sound transmission space
A4: depressed space
A5: containing space
A6: sound transmission space
S1: sealing ring structure
S2: sealing ring structure
S3: first sealing ring
S4: second sealing ring
S5: sealing ring structure
T1: first through hole
T2: second transmission through hole
T3: first through hole
T4: second transmission through hole
Detailed Description
Referring to fig. 1 and fig. 2, wherein fig. 1 and fig. 2 respectively show an external view and a cross-sectional view of a microphone structure according to a first embodiment of the present disclosure. The microphone structure 100 of the present embodiment is configured to be connected to the application terminal assembly 200, and can directly form a sound transmission space with the application terminal assembly 200, which can be used as the microphone structure 100. In the present embodiment, the microphone structure 100 mainly includes a substrate 110, a spacer 120, a cover 130, an asic 140, and a microphone chip 150. In an embodiment, the substrate 110 may be a ceramic substrate, a printed circuit substrate, or a resin substrate, but is not limited to these examples. The asic 140 and the microphone chip 150 are electrically connected to the substrate 110, and the asic 140 is mainly used for detecting the structural deformation of the microphone chip 150, converting the structural deformation into an electrical signal, and transmitting the electrical signal to a related processing element, such as a baseband processor or an amplifier.
Referring to fig. 2 to 4, fig. 3 is an exploded view illustrating a microphone structure according to a first embodiment of the disclosure, and fig. 4 is a bottom view illustrating a substrate of the microphone structure according to the first embodiment of the disclosure. The substrate 110 has a first side 111 and a second side 112 opposite to each other, wherein the first side 111 of the substrate 110 has a concave structure 111a, and the concave structure 111a is recessed from a surface of the first side 111 to form a recessed space a 1.
As shown in fig. 2, the partition 120 is configured to form an accommodating space a2 at the second side 112 of the substrate 110. In the present embodiment, the partition 120 is a retaining wall, and the specific application chip 140 and the microphone chip 150 are surrounded by the partition 120. In some examples, the dam may be formed in various ways, for example, the dam may directly surround the asic 140 and the microphone chip 150 on the second side 112 of the substrate 110 by a standing method, so that the asic 140 and the microphone chip 150 are located in the accommodating space a2 surrounded by the dam. In other embodiments, the accommodating space a2 may be a space formed by a groove formed on the surface of the second side 112 of the substrate 110, and the inner wall of the groove may be defined as a retaining wall.
As shown in fig. 2 to 4, the substrate 110 has a first through hole T1 and a second through hole T2. The first through hole T1 penetrates from the second side 112 of the substrate 110 to the recess space a1 of the substrate 110 to form the sound transmission space A3, and the recess space a1 and the sound transmission space A3 are connected to each other. The second through hole T2 penetrates from the surface of the substrate 110 located in the accommodating space a2 to the recessed space a1 of the substrate 110, such that the accommodating space a2 and the recessed space a1 of the substrate 110 are communicated with each other. As shown in fig. 2, the accommodating space a2 and the sound transmission space A3 are not communicated with each other, but are separated by the partition 120. That is, the partition 120 may also be part of the substrate 110 for separating the accommodating space a2 and the sound transmission space A3.
Referring to fig. 2 to 4, in the present embodiment, the asic 140 and the microphone chip 150 are disposed in the accommodating space a2, and the microphone chip 150 is disposed at a position aligned with the second through hole T2 of the substrate 110. The cover 130 covers the partition 120, and the cover 130 covers the accommodation space a2 and the sound transmission space A3. In one embodiment, the cover 130 may be bonded to the substrate 110 by a conductive adhesive or a non-conductive adhesive. The sound inlet hole 131 is disposed on the cover 130 and is communicated with the sound transmission space A3, but not communicated with the accommodating space a2, so that external sound waves can enter the sound transmission space A3 from the sound inlet hole 131 and then enter the concave space a1, and further pass through the second through hole T2 and are transmitted to the cavity of the microphone chip 150. Therefore, the cavity of the microphone chip 150 is a front cavity of the microphone structure 100, and the accommodating space a2 where the microphone chip 150 is located is a back cavity of the microphone structure 100.
That is, by providing the open type concave structure 111a on the substrate 110, when the substrate 110 is coupled to the application end part 200 as shown in fig. 1, so that sound waves enter the microphone structure 100 from the sound inlet hole 131 of the cover 130, the concave space a1 of the concave structure 111a can directly communicate with the sound transmission space A3 to form a sound transmission channel, so as to guide the sound waves to the microphone chip 150, thereby maintaining the sound inlet function of the microphone structure 100. The accommodating space a2 on the substrate 110 can be directly used as the back cavity of the microphone structure 100, so that the front-tone microphone structure 100 has a large back cavity volume, thereby improving the sensitivity of the microphone structure 100.
As shown in fig. 2 and 4, a seal ring structure S1 is disposed around the periphery of the concave structure 111a on the first side 111 of the substrate 110, and the seal ring structure S1 is connected to another seal ring structure S2 on the application terminal 200 shown in fig. 1 by conductive adhesive. As shown in fig. 2, the substrate 110 has at least one pad 301 disposed in the accommodating space a2, and the first side 111 of the substrate 110 has at least one pad 302 disposed adjacent to the concave structure 111 a. The pads 301 and the pads 302 are electrically connected to each other through the conductive structures 303 penetrating through the substrate 110, so as to guide the electrical signal to the outside of the product.
In the present disclosure, the substrate of the microphone structure may have different structural designs. Referring to fig. 5 to 8, fig. 5 and 6 respectively show an external view and a cross-sectional view of a microphone structure according to a second embodiment of the present disclosure. Fig. 7 is an exploded schematic view showing a microphone structure according to a second embodiment of the present disclosure. Fig. 8 is a schematic bottom surface angle diagram illustrating a microphone structure according to a second embodiment of the present disclosure.
As shown in fig. 5 and 6, the microphone structure 400 mainly includes a substrate 410, a spacer 420, a cover 430, an application specific chip 440, and a microphone chip 450. The ASIC 440 and the microphone ASIC 450 are disposed on the substrate 410 and electrically connected to the substrate 410. In the present embodiment, the substrate 410 is a flat plate.
As shown in fig. 5 to 8, the substrate 410 has a first side 411 and a second side 412 opposite to each other, wherein the first side 411 of the substrate 410 has a concave structure 411a, and the concave structure 411a is recessed from a surface of the first side 411 to form a recessed space a 4. In the embodiment, the partition 420 is a cover structure with a n-shaped cross section, and the partition 420 is disposed on the second side 412 of the substrate 410 and forms an accommodating space a5 together with the substrate 410. As shown in fig. 7, a first sealing ring S3 is disposed on the second side 412 of the substrate 410 corresponding to the position of the partition 420 (cover), and the partition 420 can be bonded to the substrate 410 by using a conductive adhesive or a non-conductive adhesive. In one embodiment, the material of the separator 420 (cover) can be PCB, metal, or glass. In the present embodiment, the asic 440 and the microphone chip 450 are disposed on the second side 412 of the substrate 410 and located in the accommodating space a 5.
As shown in fig. 6 and 7, in the present embodiment, the cover 430 is a u-shaped structure and covers the partition 420, and the cover 430 and the substrate 410 together form a sound transmission space a 6. In one embodiment, a second sealing ring S4 is disposed at a position of the substrate 410 corresponding to the cover 430, and the cover 430 is bonded to the second sealing ring S4 by a conductive adhesive or a non-conductive adhesive. In addition, the substrate 410 has a first through hole T3 and a second through hole T4. The first through hole T3 penetrates from the surface of the substrate 410 in the sound transmission space a6 to the recessed space a4 of the substrate 410, so that the recessed space a4 and the sound transmission space a6 communicate with each other. The second through hole T4 penetrates from the surface of the substrate 410 located in the accommodating space a5 to the recessed space a4 of the substrate 410, such that the accommodating space a5 and the recessed space a4 of the substrate 410 are communicated with each other. As shown in fig. 6, the accommodation space a5 and the sound transmission space a6 are not communicated with each other, but are separated by a partition 420.
As shown in fig. 6 and 7, the asic 440 and the microphone chip 450 are disposed in the accommodating space a5, and the microphone chip 450 is disposed at a position aligned with the second through hole T4 of the substrate 410. In the embodiment, the sound inlet hole 431 is disposed on the cover 430 and is communicated with the sound transmission space a6, but not communicated with the accommodating space a5, so that external sound waves can enter the sound transmission space a6 from the sound inlet hole 431, enter the concave space a4 from the first through hole T3, and then are transmitted to the cavity of the microphone chip 450 through the second through hole T4. Therefore, the cavity of the microphone chip 450 is a front cavity of the microphone structure 400, and the accommodating space a5 where the microphone chip 450 is located is a back cavity of the microphone structure 400.
That is, by providing the open type concave structure 411a on the substrate 410, when the substrate 410 is coupled to the application end part 200 as shown in fig. 1, so that sound waves enter the microphone structure 400 from the sound inlet hole 431 of the cover 430, the concave space a4 of the concave structure 411a can directly communicate with the sound transmission space a6 to form a sound transmission channel, so as to guide the sound waves to the microphone chip 450, thereby maintaining the sound inlet function of the microphone structure 400. The accommodating space a5 on the substrate 410 can be directly used as the back cavity of the microphone structure 400, so that the front-tone microphone structure 400 has a large back cavity volume, thereby improving the sensitivity of the microphone structure 400.
As shown in fig. 6 and 8, a sealing ring structure S5 is disposed around the periphery of the recessed structure 411a on the first side 411 of the substrate 410, and the sealing ring structure S5 is connected to another sealing ring structure S2 on the application terminal 200 shown in fig. 1 by conductive adhesive. As shown in fig. 6, the substrate 410 is provided with at least one pad 501 in the accommodating space a5, and the first side 411 of the substrate 410 is provided with at least one pad 502 adjacent to the concave structure 411 a. The pad 501 and the pad 502 are electrically connected to each other through a conductive structure (not shown) penetrating through the substrate 410, so as to guide an electrical signal to the outside of the product.
In view of the above, the present disclosure mainly changes the structure of the substrate of the microphone structure and the relative position configuration between the substrate and the microphone chip, so that when the microphone structure is installed in an application product, the microphone structure can simultaneously maintain the front sound function of the microphone structure and have a large back cavity volume. Specifically, the present disclosure forms an open space on the substrate by providing a concave structure on one side of the substrate, and forms two non-communicating accommodating spaces and sound transmission spaces on the other side of the substrate. Then, the first through hole and the second through hole are formed in the substrate to enable the concave space to be communicated to the accommodating space and the sound transmission space respectively, so that the sound transmission path of the microphone structure is changed, and the microphone structure can have the effects of a sound advancing function and a large back cavity space.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010635254.6A CN113891198A (en) | 2020-07-03 | 2020-07-03 | Microphone structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010635254.6A CN113891198A (en) | 2020-07-03 | 2020-07-03 | Microphone structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113891198A true CN113891198A (en) | 2022-01-04 |
Family
ID=79013248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010635254.6A Withdrawn CN113891198A (en) | 2020-07-03 | 2020-07-03 | Microphone structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113891198A (en) |
Citations (10)
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|---|---|---|---|---|
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| JP2008092183A (en) * | 2006-09-29 | 2008-04-17 | Matsushita Electric Works Ltd | Microphone device and acoustic device |
| CN201403198Y (en) * | 2009-02-27 | 2010-02-10 | 比亚迪股份有限公司 | Micro-electro-mechanical system microphone |
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| CN202488703U (en) * | 2011-12-17 | 2012-10-10 | 歌尔声学股份有限公司 | Mems microphone |
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| TWM461146U (en) * | 2013-05-23 | 2013-09-01 | Harmony Electronics Corp | Cascode packing structure for microphone |
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| US20160165358A1 (en) * | 2014-12-05 | 2016-06-09 | Industrial Technology Research Institute | Mems microphone package |
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-
2020
- 2020-07-03 CN CN202010635254.6A patent/CN113891198A/en not_active Withdrawn
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Application publication date: 20220104 |