CN113873755A

CN113873755A - Positioning device, integrated module and positioning method for electronic component

Info

Publication number: CN113873755A
Application number: CN202010619036.3A
Authority: CN
Inventors: 刘青; 胡志鹏
Original assignee: Delphi Electrical Centers Shanghai Co Ltd
Current assignee: Delphi Electrical Centers Shanghai Co Ltd
Priority date: 2020-06-30
Filing date: 2020-06-30
Publication date: 2021-12-31

Abstract

The disclosure provides a positioning device, an integrated module and a positioning method for electronic components. The positioning device may include: first locating part and second locating part, first locating part has the top, the thickness direction of top perpendicular to first locating part includes at least one location portion, and at least one location portion is in run through the top of first locating part on the thickness direction to allow at least one first electronic components's stitch to extend outside the top of first locating part, the second locating part has the inner chamber with external intercommunication, is used for holding at least one first electronic components, and first locating part is used for assembling on the second locating part along its thickness direction. The positioning device provided by the disclosure can reduce flying line connection of electronic components, and reduces the possibility of misloading and neglected loading of the electronic components.

Description

Positioning device, integrated module and positioning method for electronic component

Technical Field

The present invention relates to electrical connections for electronic components, and more particularly to positioning, assembly, and integration of electronic components.

Background

At present, the market of new energy automobiles develops rapidly, and a vehicle-mounted charger serving as a key part of the new energy automobile also develops rapidly. The vehicle-mounted charger is internally provided with a plurality of electronic components, wherein the electronic components comprise semiconductor devices, magnetic devices and the like.

Inside the vehicle charger, many electronic components need to be assembled and connected to the circuit board. In the assembling and connecting process, because the number of semiconductor devices is large, and magnetic devices such as transformers and voltage devices are mostly connected by using flying wires, the phenomena of missing installation and wrong installation are easy to occur.

In addition, because these electronic components can produce the heat in the course of the work, and then influence on the performance of on-vehicle machine that charges, consequently need to charge the machine to dispel the heat to on-vehicle. The current assembly method used in the car charger for heat dissipation is to solder the semiconductor device such as the diode on the circuit board, and then fix the diode on the cold plate with the water-cooled heat sink by the clip, so as to dissipate the heat generated by the diode during the operation. However, this assembly method may cause a large amount of stress to be generated on the solder feet of the semiconductor device, causing the semiconductor device to be disconnected from the circuit board, thereby reducing the service life of the vehicle-mounted charger.

Therefore, there is a need for an improved vehicle-mounted charger that reduces the neglected and misloading of electronic components and/or provides a more suitable assembly.

Disclosure of Invention

The technical scheme provided by the invention aims to solve the problems of neglected installation and wrong installation of the electronic components in the prior art and/or eliminate hidden troubles caused by an assembly mode in the prior art.

In one aspect of the present invention, there is provided a positioning device for an electronic component, the positioning device including: the first positioning piece is provided with a top which is perpendicular to the thickness direction of the first positioning piece, and the first positioning piece comprises at least one positioning part which penetrates through the top of the first positioning piece in the thickness direction so as to allow pins of at least one first electronic component to extend out of the top of the first positioning piece.

In at least one embodiment of one aspect of the present invention, the positioning device further includes a second positioning member having an inner cavity communicating with the outside for accommodating the at least one first electronic component, and the first positioning member is configured to be fitted to the second positioning member in a thickness direction thereof.

In at least one embodiment of one aspect of the present invention, the first positioning member has an open area at the top for exposing at least a portion of the at least one first electronic component, each of the at least one positioning member includes at least one of a positioning through hole and a positioning buckle, wherein the positioning buckle extends into the open area for holding the pins of the at least one first electronic component.

In at least one embodiment of one aspect of the present invention, the positioning device further includes a second positioning element, the second positioning element has an inner cavity communicated with the outside for accommodating the at least one first electronic component, the first positioning element has a side wall along the thickness direction, the second positioning element has a step on the outer periphery, the bottom of the side wall of the first positioning element is used for being placed on the step of the second positioning element, wherein the inner surface of the side wall of the first positioning element is matched with the outer surface of the side wall of the second positioning element in shape, and the side wall of the first positioning element has at least one side window for accommodating at least a part of the main body portion of the at least one second electronic component and allowing the pin of the at least one second electronic component to extend above the top of the first positioning element.

In at least one embodiment of one aspect of the present invention, the positioning device further includes a third positioning element, and the third positioning element is configured to hold the main body portion of the at least one second electronic component in the corresponding side window of the first positioning element.

In at least one embodiment of one aspect of the present invention, the third positioning element includes at least one elastic clip, each of the at least one elastic clip has a fixing portion and at least one pressing portion, wherein the fixing portion is fixed on the second positioning element, and the at least one pressing portion is configured to enable the at least one second electronic component located in the corresponding side window to abut against an outer surface of a side wall of the second positioning element.

In at least one embodiment of one aspect of the present invention, the at least one pressing portion includes a plurality of pressing portions, the pressing portions are zigzag or S-shaped, the fixing portion and the pressing portions are configured to be interdigitated, and each of the pressing portions makes the second electronic component located in the corresponding side window abut against an outer surface of a side wall of the second positioning member.

In at least one embodiment of one aspect of the present invention, the third positioning element includes at least one elastic clip, each of the at least one elastic clip has a fixing portion and a plurality of pressing portions, wherein the pressing portions are zigzag or S-shaped, the fixing portion and the plurality of pressing portions are configured to be connected in series, the fixing portion is fixed on the first positioning element, and each of the plurality of pressing portions causes the second electronic component located in the corresponding side window to abut against an outer surface of a side wall of the second positioning element.

In at least one embodiment of one aspect of the present invention, the second positioning member is made of a thermally conductive material.

In another aspect of the present invention, there is provided an integrated module for electronic components, the integrated module including: the positioning device of any of the preceding paragraphs, further comprising: the first positioning piece is assembled on the second positioning piece along the thickness direction of the first positioning piece; and the at least one first electronic component is positioned in the inner cavity of the second positioning piece.

In at least one embodiment of another aspect of the present invention, the integration module comprises: a positioning device as described in any of the preceding paragraphs; at least one first electronic component located in the inner cavity of the second positioning member; and at least one second electronic component, wherein at least one part of the main body part of each second electronic component is positioned in the corresponding side window on the side wall of the first positioning piece.

In at least one embodiment of another aspect of the present invention, the at least one first electronic component includes a magnetic device, and the pins of the magnetic device are formed by wetting leads of the magnetic device with tin; and the at least one second electronic component comprises a semiconductor device.

In at least one embodiment of another aspect of the present invention, the second positioning member is made of a thermally conductive material.

In yet another aspect of the present invention, there is provided a method for connecting an electronic component to a circuit board, the method comprising: providing a positioning device as described in any of the preceding paragraphs; enabling the pins of the at least one first electronic component to penetrate through the at least one positioning part and extend out of the top of the first positioning part; and soldering the pins of the at least one first electronic component to predetermined locations on the circuit board.

In at least one embodiment of yet another aspect of the present invention, providing the positioning device comprises: providing a second positioning piece, wherein the second positioning piece is provided with an inner cavity communicated with the outside; placing the at least one first electronic component in an inner cavity of a second positioning piece; and fitting the first positioning member to the second positioning member in a thickness direction thereof.

In at least one embodiment of yet another aspect of the present invention, providing the positioning device further comprises: and encapsulating the at least one first electronic component in the inner cavity of the second positioning piece through heat-conducting encapsulating glue.

In at least one embodiment of yet another aspect of the present invention, the assembling the first positioning member to the second positioning member includes: and mutually matching and installing at least one first connecting part of the first positioning piece and at least one second connecting part of the second positioning piece.

In at least one embodiment of the further aspect of the present invention, the first connecting portion and the second connecting portion are hollow structures, and the assembling the first positioning member to the second positioning member includes: placing at least a portion of the second connection portion within the hollow structure of the first connection portion.

In at least one embodiment of yet another aspect of the present invention, the first positioning member has a sidewall along the thickness direction, the sidewall having at least one side window, the method further comprising: placing at least a portion of a body portion of at least one second electronic component within a corresponding one of the at least one side window; abutting the main body portion of the at least one second electronic component against an outer surface of a sidewall of the second positioning member using a third positioning member as described in any of the preceding paragraphs; and welding the pins of the at least one second electronic component to other preset positions on the circuit board.

In at least one embodiment of yet another aspect of the present invention, the at least one first electronic component includes a magnetic device and the at least one second electronic component includes a semiconductor device, the method further comprising: and tin dipping the lead of the magnetic device to form the pin.

In at least one embodiment of still another aspect of the present invention, the second positioning member has a step on an outer circumference thereof, and fitting the first positioning member to the second positioning member includes: and placing the bottom of the side wall of the first positioning piece on the step of the second positioning piece, wherein the inner surface of the side wall of the first positioning piece is matched with the outer surface of the side wall of the second positioning piece in shape.

In at least one embodiment of yet another aspect of the present invention, the second positioning member is made of a thermally conductive material.

Compared with the prior art, the technical scheme provided by the invention has one or more of the following advantages:

(1) the lead of the magnetic device is welded to the circuit board after being positioned by forming a stitch, so that the flying line connection is reduced, and the possibility of neglected installation and wrong installation of electronic components is reduced;

(2) the semiconductor device is positioned on the first positioning piece in advance, so that the possibility of neglected loading and wrong loading of the semiconductor device is reduced;

(3) the heating electronic component is in good contact with the second positioning piece made of the heat conduction material, so that heat can be effectively dissipated;

(4) the semiconductor device is positioned on the second positioning piece made of the heat conduction material and then subjected to wave soldering with the circuit board, so that pin stress generated in the process of subsequently assembling the semiconductor device on the cold plate is reduced, and the service life is prolonged;

(5) the first positioning piece is an integral part for positioning and assembling a plurality of electronic components, so that assembly errors caused by assembly among a plurality of positioning parts are reduced;

(6) the electronic components which can only be individually installed in the external shell in the prior art are firstly gathered together to form an integrated module, and then the integrated module is installed in the external shell, so that the integrated module is simple to assemble, is operable in process, and has no wrong installation and neglected installation risks.

Drawings

To further clarify the above and other advantages and features of embodiments of the present invention, a more particular description of embodiments of the present invention will be rendered by reference to the appended drawings. It is appreciated that these drawings depict only typical embodiments of the invention and are therefore not to be considered limiting of its scope as claimed.

Fig. 1 shows an exploded view of an integrated module for electronic components according to an embodiment of the invention.

Fig. 2 shows a top view of a first retainer in an integrated module according to one embodiment of the invention.

Fig. 3 shows a schematic view of an assembled integrated module according to an embodiment of the invention.

Fig. 4 shows a schematic view of an integrated module assembled with a circuit board according to an embodiment of the invention.

Fig. 5 shows a flow diagram of a method for connecting an electronic component to a circuit board according to an embodiment of the invention.

Detailed Description

While the invention will be described in further detail in connection with specific embodiments and with reference to the accompanying drawings, the following description sets forth numerous details for a thorough understanding of the invention, it will be readily apparent that the invention may be embodied in many other forms other than those described herein, and it will be readily apparent to those skilled in the art that the invention may be practiced with many modifications and alterations without departing from the spirit of the invention, and the scope of the invention should not be limited by the contents of this detailed embodiment.

This application uses specific words to describe embodiments of the application. Reference to "one embodiment," "another embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic described in connection with at least one embodiment of the application. Therefore, it is emphasized and should be appreciated that two or more references to "one embodiment" or "another embodiment" or "some embodiments" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, some features, structures, or characteristics of one or more embodiments of the present application may be combined as appropriate.

It should be noted that in the foregoing description of embodiments of the present application, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure aiding in the understanding of one or more of the embodiments. This method of disclosure, however, is not intended to require more features than are expressly recited in the claims. Indeed, the embodiments may be characterized as having less than all of the features of a single embodiment disclosed above.

Referring to fig. 1, fig. 1 shows an exploded view of an integrated module 100 for electronic components according to one embodiment of the invention. As shown in fig. 1, the integrated module 100 may include a first positioning element 110, a second positioning element 120, a third positioning element 130, a plurality of first electronic components 140, and a plurality of second electronic components 150. The first positioning element 110 may be configured to position a plurality of first electronic components 140 and a plurality of second electronic components 150, the second positioning element 120 may be configured to accommodate the plurality of first electronic components 140 and/or dissipate heat generated by the first electronic components 140 and the second electronic components 150 during operation, and the third positioning element 130 may be configured to fix the plurality of second electronic components 150 and enable the plurality of second electronic components 150 to be tightly attached to the second positioning element 120 so as to dissipate heat. The first electronic component 140 may be a magnetic device such as a transformer, an inductor, etc., and the second electronic component 150 may be a semiconductor device such as a diode, a transistor, etc.

Referring to fig. 1, the first positioning member 110 has a thickness, and may have a top and a sidewall. The top has a rim and is perpendicular to the thickness direction of the first positioning member 110, and the sidewalls extend downward from the top in the thickness direction. FIG. 1 illustrates the top bezel as a straight bezel, but in other embodiments, the bezel may be curved, or a mixture of straight and curved. At least one side window may be provided in the side wall, each side window being adapted to receive a second electronic component 150. When a semiconductor device such as a diode or a transistor is placed, a part of a body thereof may be accommodated in the side window, and the rest may be exposed outside the side window. Although the shape of the side window illustrated in fig. 1 is rectangular, in other embodiments, the shape of the side window may vary depending on the shape of the second electronic component 150. In some embodiments, the first positioning member 110 may not have a sidewall.

With continued reference to fig. 1, there may be one or more first connecting portions 112 near the corner locations of the first positioning member 110, the first connecting portions 112 may be hollow structures, and the hollow portions in the hollow structures may extend up to the top of the first positioning member 110 and down to the bottom of the first positioning member 110, i.e., completely through. In other embodiments, the first connection portion 112 may be located at a distance from a corner position of the first positioning member 110, such as at any position on the bezel between two adjacent corner positions. As described below with reference to fig. 2, the first positioning element 110 may further include positioning through holes or positioning snaps, so that the pins of the first electronic component 140 extend out of the top of the first positioning element 110, and the pins are fixed in corresponding positions.

With continued reference to fig. 1, the second positioning member 120 may have an inner cavity 121 in communication with the outside for accommodating at least one first electronic component 140. In some embodiments, the first electronic component 140 may be a magnetic device, such as a transformer, an inductor, or the like. As shown in fig. 1, the second positioning member 120 may further have one or more second connecting portions 122, and the second connecting portions 122 are installed to cooperate with the first connecting portions 112 of the first positioning member 110. In one embodiment, the second connection portion 122 may be a hollow structure, and a hollow portion in the hollow structure may extend upward to the top of the second connection portion 122 and downward to the bottom of the second connection portion 122, i.e., completely penetrate. As shown in fig. 1, the outer wall of the second connecting portion 122 may have a shape matching the inner wall of the first connecting portion 112, so that the first connecting portion 112 and the second connecting portion 122 are installed in a matching manner. As also shown in fig. 1, the outer surface of the sidewall of the second positioning member 120 may be configured to match the shape of the inner surface of the sidewall of the first positioning member 110, so that the first positioning member 110 is fitted to the second positioning member 120 in the thickness direction thereof. In the embodiment shown in fig. 1, the outer circumference of the second positioning member 120 may further have a step 123 for the bottom of the sidewall of the first positioning member 110 to rest thereon. In other embodiments, the outer circumference of the second positioning member 120 may not have a step, and the bottom of the first positioning member 110 may be above, flush with, or below the bottom of the second positioning member 120.

With continued reference to fig. 1, the third positioning member 130 may have a fixing portion 131 and at least one pressing portion 132 for fixing a main body portion of at least one second electronic component 150, such as a tube body of a semiconductor device, in the corresponding side window 111 of the first positioning member 110. In the embodiment shown in fig. 1, the third positioning element 130 is an elastic clip, each of which may have a plurality of parallel pressing portions 132, and the plurality of parallel pressing portions 132 and the fixing portion 131 are formed integrally and configured in an interdigital shape. In some embodiments, the fixing portion 131 can be fixed on the second positioning member 120 by a bolt connection, a welding connection, a riveting connection, an adhesive connection, or the like. For example, the fixing portion 131 may be fixed on the sidewall below the step 123, and each of the pressing portions 132 may be configured in a zigzag or S shape to elastically make the second electronic component 150 located in the corresponding side window 111 abut against the outer surface of the sidewall of the second positioning member 120. In other embodiments, the fixing portion 131 may be fixed to the first positioning member 110, for example, below a side window of the first positioning member 110. In still other embodiments, the fixing portion 131 and the pressing portion 132 may be configured to be connected in series, wherein the fixing portion 131 may be fixed on the first positioning member 110 by a bolt connection, a welding connection, a riveting connection, an adhesive connection, or the like. For example, the fixing portion 131 may be fixed to the side of the side window 111. The pressing portions 132 may be a plurality of continuous zigzag shapes or S shapes, so that the second electronic component 150 located in the corresponding side window 111 abuts against the outer surface of the sidewall of the second positioning member 120 by elasticity. Although 3 elastic clips are shown in fig. 1, 3 elastic clips are all of an interdigitated configuration, and the number of the pressing portions 132 in each elastic clip is 4 or 2, in other embodiments, elastic clips that are all of a serial connection configuration, or elastic clips that have both of an interdigitated configuration and a serial connection configuration may be employed, and the number of elastic clips and the number of pressing portions 132 in each elastic clip may be set according to the distribution of the second electronic components 150. For example, the number of the resilient clips may be 1, 2, 4, 5 or other numbers, and the number of the pressing portions 132 in each resilient clip may be 1, 3, 5 or other numbers.

Described below with particular reference to fig. 2, fig. 2 shows a top view of the first positioning element 110 in the integrated module 100 of fig. 1.

As shown in fig. 2, the first positioning member 110 may have at least one positioning part and at least one open region 113 at the top. The opening region 113 aligns with and exposes the second electronic component 140 placed in the inner cavity 121 of the second positioning member 120. The open area 113 facilitates heat dissipation from the second electronic component 140. As shown in fig. 2, the positioning portion may penetrate through the top of the first positioning member 110 in the thickness direction of the first positioning member 110, and may be a positioning through hole 114 or a positioning buckle 115. In the embodiment shown in fig. 2, the positioning tabs 115 extend through the arms 116 into the open area 113 to snappingly retain pins of the at least one first electronic component 140. In other embodiments, the positioning tabs 115 may be disposed at the periphery of the open area 113, in communication with the open area 113. In the embodiment shown in fig. 2, the positioning through-holes 114 are located at positions on the periphery of the top opening region 113. However, in other embodiments, the positioning through-hole 114 may also extend into the open area 113 through the arm 116. In another embodiment, the positioning through hole 114 and the positioning catch 115 extend into the open area 113 through the same arm 116, so that one positioning part can have both the positioning through hole 114 and the positioning catch 115.

Fig. 3 shows a schematic view of the assembled integrated module 100. As shown in fig. 3, the first electronic component 140 is located in the inner cavity 121 of the second positioning member 120. In some embodiments, the first electronic component 140 is encapsulated in the inner cavity of the second positioning member 120 by a heat conducting potting adhesive, and the second positioning member 120 may be an aluminum die casting or may be made of other heat conducting materials, so that heat generated by the first electronic component 140 during operation can be well conducted away, and the first electronic component 140 can be stably fixed in the inner cavity of the second positioning member 120 by using the heat conducting potting adhesive, thereby providing effective shock resistance and vibration resistance.

With continued reference to fig. 3, the pins of the first electronic component 140 extend out of the top through the positioning through holes 114 or the positioning fasteners 115 of the first positioning members 110, so that the first electronic component 140 can be soldered to the circuit board through the pins, and at least a portion of the first electronic component 140 is exposed through the opening area 113, so that heat generated by the first electronic component 140 during operation can be dissipated through the opening area 113. In one embodiment, the pins of the first electronic component 140 are formed by tinning the leads of the first electronic component 140.

With continued reference to fig. 3, the bottom of the sidewall of the first positioning element 110 is disposed on the step 123 of the second positioning element 120, at least a portion of the second connecting portion 122 of the second positioning element 120 is disposed in the hollow structure of the first connecting portion 112 of the first positioning element 110, the main body of the second electronic component 150 is disposed in the side window 111 of the first positioning element 110, and at least a portion of the pins of the second electronic component 150 extends to the top of the first positioning element 110, so that the second electronic component 150 can be soldered to the circuit board through the pins. In the embodiment shown in fig. 3, the second electronic component 150 is held in the corresponding side window 111 of the first positioning element 110 by the third positioning element 130, wherein the fixing portion 131 of the third positioning element 130 is fixed to the side wall below the step 124 of the second positioning element 120 by a bolt connection, and the pressing portion 132 of the third positioning element 130 applies a pressure to the second electronic component 150 in the side window 111 by an elastic force, so that the second electronic component 150 abuts against the outer surface of the side wall of the second positioning element 120. This may in one aspect enable the second electronic component 150 to be stably positioned within the corresponding side window 111 of the first positioning member 110; on the other hand, the second electronic component 150 can be tightly attached to the outer surface of the sidewall of the second positioning member 120, so that heat generated by the second electronic component 150 during operation can be better conducted away through the second positioning member 120 made of a heat conductive material.

In some embodiments, the first positioning member 110 may be a plastic integrated piece, so that a plurality of electronic components may be positioned by the same first positioning member, which reduces assembly errors caused by assembly between a plurality of positioning parts.

The integrated module 100 described above with reference to fig. 1 to 3 may include a first positioning element 110, a second positioning element 120, a third positioning element 130, a first electronic component 140, and a second electronic component 150. However, in other embodiments, the integrated module may include the first positioning member 110, the second positioning member 120, and the first electronic component 140, but not the second electronic component 150. Accordingly, the first positioning member 110 may not have a sidewall or side window 111. In still other embodiments, the integrated module may include the first positioning member 110, the second positioning member 120, and the second electronic component 150, but not the first electronic component 140. Accordingly, the first positioning member 110 may not have a sidewall, and a portion of the main body of the second electronic component 150 and the third positioning member 130 may be selectively disposed on an inner sidewall or an outer sidewall of the second positioning member 120.

In some embodiments, the integrated module 100 assembled as a single unit may be mounted to a circuit board, as shown in fig. 4. For example, the pins of the first electronic component 140 and the second electronic component 150 in the integrated module 100 are respectively passed through the preset positions on the circuit board, and then the pins of the first electronic component 140 and/or the second electronic component 150 are soldered by wave soldering. Further, in one embodiment, the integrated module 100 may be further connected to an external case through the second connection part 122 of the second positioning member 120 before welding. In the embodiment of the present invention, the electronic components that can only be individually installed in the external housing in the prior art are firstly collected together to form the integrated module 100, and then the integrated module 100 is installed in the external housing, so that the integrated module 100 is simple to assemble, is technically operable, and has no misassembly and neglected assembly risks.

The various examples of the first positioning member 110 and the second positioning member 120 described above with respect to the integrated module 100 may be formed as positioning devices, alone or in combination. In some embodiments, the first positioning element 110 may be provided separately as a positioning device for positioning pins of the electronic component. In other embodiments, the first positioning member 110 and the second positioning member 120 may be provided together to serve as a positioning device for positioning pins of the electronic component. The lead of the magnetic device is dipped with tin to form a pin, and the pin of the magnetic device is positioned by the first positioning piece 110, so that the magnetic device can be allowed to be welded to a preset position on the circuit board through the pin, the flying wire connection is reduced, and the possibility of misassembly and neglected assembly is reduced.

A method 500 for connecting electronic components to a circuit board will be described below with reference to fig. 5. Fig. 5 shows a flow diagram of a method 500 for connecting electronic components to a circuit board, in accordance with one embodiment of the present invention.

At step 502, a first electronic component is placed within a second positioning member. In some embodiments, a plurality of first electronic components 140 may be disposed in the interior cavity 121 of the second positioning member 120 as described above in connection with fig. 1. In one embodiment, the first electronic component 140 may be encapsulated in the inner cavity 121 of the second positioning member 120 by a heat conductive potting adhesive. The second positioning member 120 may be made of a heat conductive material, for example, aluminum die casting.

At step 504, pins of the first electronic component are positioned by the first positioning member. In some embodiments, after the first electronic component 140 is placed in the second positioning member 120, the first positioning member 110 may be assembled to the second positioning member 120 along the thickness direction thereof, and the pins of the first electronic component 140 pass through the positioning portions of the first positioning member 110, such as the positioning through holes 114 or the positioning buckles 115, and extend out of the top of the first positioning member 110. For example, the pins to be passed through the positioning portion may be selected as required, so that each pin of the first electronic component 140 can be soldered to a predetermined position of the circuit board after being positioned. In one embodiment, the first electronic component 140 may be a magnetic device such as a transformer, an inductor, etc., and the pins may be formed by soldering the leads of the magnetic device. Various possible configurations of the first positioning element 110 and the second positioning element 120 are described above with reference to fig. 1-3, for example, the first positioning element 110 has a first connecting portion and the second positioning element 120 has a second connecting portion, the first positioning element 110 has a side wall or does not have a side wall, the second positioning element 120 has a step 123 or does not have a step 123, and so on, and the first positioning element 110 can be assembled to the second positioning element 120 according to different configurations of the first positioning element 110 and the second positioning element 120, and will not be described herein again.

Step 506, positioning the second electronic component. In some embodiments, as described above in connection with fig. 1, the first positioning member 110 may have a sidewall along a thickness direction thereof, and the sidewall may have at least one side window 111, and the positioning of the second electronic component 150 may be achieved by placing at least a portion of the body portions of the plurality of second electronic components 150 in the corresponding side window 111. For example, the second electronic components 150 to be received in the side windows 111 may be selected as desired so that after each second electronic component 150 is positioned, its pins extending above the top of the first positioning member 110 can be soldered to predetermined locations on the circuit board. In one embodiment, the second electronic component 150 may be a diode, a transistor, or other semiconductor device, and the main body may be a body of the semiconductor device. By pre-positioning the semiconductor device on the first positioning member 110, the possibility of misloading and misloading of the semiconductor device is reduced.

And step 508, fixing the second electronic component. In some embodiments, the third positioning member 130 as described above in connection with fig. 1 may be further used to abut the main body portions of the plurality of second electronic components 150 against the outer surface of the sidewall of the second positioning member 120. In one embodiment, the second positioning member 120 may be made of a thermally conductive material, for example, aluminum die casting. The second electronic component 150 is pressed by the third positioning member 130 to be tightly attached to the outer surface of the sidewall of the second positioning member 120 made of a heat conductive material, so that the thermal contact resistance can be reduced, and the heat dissipation efficiency can be improved. In addition, since the second electronic component 150 is positioned and fixed to the second positioning member 120 made of a heat conductive material before the pins thereof are soldered to the circuit board, stress generated at the pins when the pins are soldered and then mounted to the cold plate is greatly reduced compared to the prior art, thereby prolonging the service life.

At step 510, the pins are soldered to the circuit board. In one embodiment, the pins of the first and second

electronic components

140, 150 may be soldered to predetermined locations on the circuit board. For example, after the pins of the first and second

electronic components

140 and 150 are mounted on the printed circuit board, the pins are wave-soldered.

The above steps are exemplary and not intended to be limiting. One skilled in the art may add one or more steps, or delete one or more of the above steps, or combine or replace one or more of the above steps, or adjust the order of one or more of the above steps according to his needs. For example, in some embodiments,

steps

506 and 508 may be eliminated, i.e., only the first electronic component 140 is positioned and soldered to the circuit board. In other embodiments,

steps

502, 506, and 508 may be eliminated by simply locating and soldering pins of the first electronic component 140 to the circuit board. In still other embodiments,

steps

502 and 504 may be eliminated by positioning only the second electronic component 150 and soldering its pins to the circuit board.

The preferred embodiments of the present invention have been described above in detail. It will, however, be appreciated that various embodiments and modifications may be made thereto without departing from the broader spirit and scope of the invention. Many modifications and variations will be apparent to those of ordinary skill in the art in light of the above teachings without undue experimentation. Therefore, the technical solutions available to those skilled in the art through logic analysis, reasoning and limited experiments based on the prior art according to the concept of the present invention should fall within the scope of protection defined by the claims of the present invention.

The terms and expressions which have been employed herein are used as terms of description and not of limitation, and there is no intention, in the use of such terms and expressions, of excluding any equivalents of the features shown and described (or portions thereof), it being recognized that various modifications are possible within the scope of the claims. Accordingly, the claims are intended to cover all such equivalents.

Claims

1. A positioning device for an electronic component, the positioning device comprising:

a first positioning member having a top perpendicular to a thickness direction thereof, and

the first positioning piece comprises at least one positioning part, and the at least one positioning part penetrates through the top of the first positioning piece in the thickness direction to allow pins of at least one first electronic component to extend out of the top of the first positioning piece.

2. The positioning device according to claim 1, further comprising a second positioning member having an internal cavity communicating with the outside for accommodating the at least one first electronic component, and

the first positioning member is configured to be fitted to the second positioning member in a thickness direction thereof.

3. The positioning device according to claim 1 or 2,

the first positioning member has an open area at the top for exposing at least a portion of the at least one first electronic component,

each of the at least one positioning portion comprises at least one of a positioning through hole and a positioning buckle, wherein the positioning buckle extends into the opening area for holding the pin of the at least one first electronic component.

4. The positioning device according to claim 3, further comprising a second positioning member having an inner cavity communicating with the outside for accommodating the at least one first electronic component,

the first positioning piece is provided with a side wall along the thickness direction, the periphery of the second positioning piece is provided with a step,

the bottom of the side wall of the first positioning piece is used for being placed on the step of the second positioning piece, the inner surface of the side wall of the first positioning piece is matched with the outer surface of the side wall of the second positioning piece in shape,

the side wall of the first positioning piece is provided with at least one side window for accommodating at least one part of the main body part of at least one second electronic component and allowing the pin of the at least one second electronic component to extend to the top of the first positioning piece.

5. The positioning device according to claim 4, further comprising a third positioning member, wherein the third positioning member is used for holding the main body of the at least one second electronic component in the corresponding side window of the first positioning member.

6. The positioning device according to claim 5, wherein the third positioning member comprises at least one elastic clip, each of the at least one elastic clip has a fixing portion and at least one pressing portion, wherein the fixing portion is fixed on the second positioning member, and the at least one pressing portion is configured to press the at least one second electronic component located in the corresponding side window against an outer surface of a side wall of the second positioning member.

7. The positioning device according to claim 6, wherein the at least one pressing portion includes a plurality of pressing portions, the pressing portions are zigzag or S-shaped, the fixing portion and the plurality of pressing portions are interdigital, and each of the plurality of pressing portions causes the second electronic component located in the corresponding side window to abut against an outer surface of a side wall of the second positioning member.

8. The positioning device according to claim 5, wherein the third positioning member includes at least one elastic clip, each of the at least one elastic clip has a fixing portion and a plurality of pressing portions, wherein the pressing portions have a zigzag shape or an S shape, the fixing portion and the plurality of pressing portions are configured to be connected in series, the fixing portion is fixed on the first positioning member, and each of the plurality of pressing portions causes the second electronic component located in the corresponding side window to abut against an outer surface of a side wall of the second positioning member.

9. The positioning apparatus of claim 4, wherein said second positioning member is made of a thermally conductive material.

10. An integrated module for electronic components, the integrated module comprising:

the positioning device of claim 3 or 9, further comprising:

the first positioning piece is assembled on the second positioning piece along the thickness direction of the first positioning piece; and

at least one first electronic component, at least one first electronic component is located in the inner chamber of second setting element.

11. An integrated module of electronic components, the integrated module comprising:

the positioning device of any one of claims 4-8;

at least one first electronic component located in the inner cavity of the second positioning member; and

at least one second electronic component, at least one part of the main body part of each of the at least one second electronic component is positioned in the corresponding side window on the side wall of the first positioning piece.

12. The integrated module of claim 11,

the at least one first electronic component comprises a magnetic device, and the pin of the magnetic device is formed by tin dipping of a lead of the magnetic device; and is

The at least one second electronic component includes a semiconductor device.

13. The integrated module of claim 11, wherein the second positioning member is made of a thermally conductive material.

14. A method for connecting an electronic component to a circuit board, the method comprising:

providing a positioning device as recited in claim 1;

enabling the pins of the at least one first electronic component to penetrate through the at least one positioning part and extend out of the top of the first positioning part; and

and welding the pins of the at least one first electronic component to preset positions on the circuit board.

15. The method of claim 14, wherein providing the positioning device comprises:

providing a second positioning piece, wherein the second positioning piece is provided with an inner cavity communicated with the outside;

placing the at least one first electronic component in an inner cavity of a second positioning piece; and

and assembling the first positioning piece to the second positioning piece along the thickness direction of the first positioning piece.

16. The method of claim 15, wherein providing the positioning device further comprises:

and encapsulating the at least one first electronic component in the inner cavity of the second positioning piece through heat-conducting encapsulating glue.

17. The method of claim 16, wherein fitting the first positioning member to the second positioning member comprises: and mutually matching and installing at least one first connecting part of the first positioning piece and at least one second connecting part of the second positioning piece.

18. The method of claim 17, wherein the first and second connecting portions are hollow structures, and fitting the first positioning member to the second positioning member comprises:

placing at least a portion of the second connection portion within the hollow structure of the first connection portion.

19. The method of any of claims 16-18, wherein the first locator has a sidewall along the thickness direction, the sidewall having at least one side window, the method further comprising:

placing at least a portion of a body portion of at least one second electronic component within a corresponding one of the at least one side window;

abutting the main body portion of the at least one second electronic component against an outer surface of a sidewall of the second positioning member using a third positioning member as claimed in claim 6; and

and welding the pins of the at least one second electronic component to other preset positions on the circuit board.

20. The method of claim 19, wherein the at least one first electronic component comprises a magnetic device and the at least one second electronic component comprises a semiconductor device, the method further comprising:

and tin dipping the lead of the magnetic device to form the pin.

21. The method of claim 19, wherein the outer periphery of the second positioning member has a step,

fitting the first positioning member to the second positioning member includes: and placing the bottom of the side wall of the first positioning piece on the step of the second positioning piece, wherein the inner surface of the side wall of the first positioning piece is matched with the outer surface of the side wall of the second positioning piece in shape.

22. The method of claim 19, wherein the second positioning member is made of a thermally conductive material.