CN113861913A - High-thermal-conductivity eugenol modified epoxy resin pouring sealant and preparation method and application thereof - Google Patents
High-thermal-conductivity eugenol modified epoxy resin pouring sealant and preparation method and application thereof Download PDFInfo
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- CN113861913A CN113861913A CN202111133111.6A CN202111133111A CN113861913A CN 113861913 A CN113861913 A CN 113861913A CN 202111133111 A CN202111133111 A CN 202111133111A CN 113861913 A CN113861913 A CN 113861913A
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- epoxy resin
- eugenol
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a high-thermal-conductivity eugenol modified epoxy resin pouring sealant as well as a preparation method and application thereof, wherein the high-thermal-conductivity eugenol modified epoxy resin pouring sealant consists of A B two components, wherein the component A comprises the following raw materials in parts by weight: bisphenol A diglycidyl ether type epoxy resin, epoxy-terminated modified silicone oil, eugenol modified epoxy resin and epoxy phenyl silicone oil; the component B comprises the following raw materials in parts by weight: heat-conducting inorganic filler, aminosilane coupling agent, organic silicon modified fatty amine and amino silicone oil. The pouring sealant prepared by the invention has excellent thermal conductivity and good mechanical property, is not easy to crack, and can be used for the aspects of packaging and filling of relays, power supplies, magnetic amplifiers, transformers, fiber optical waveguide coatings, circuit boards, electric and electronic, packaging of PACK packages of new energy automobile batteries and the like.
Description
Technical Field
The invention relates to the field of high-thermal-conductivity electrical insulating materials, in particular to a high-thermal-conductivity eugenol modified epoxy resin pouring sealant and a preparation method and application thereof.
Background
Epoxy resin is a generic name of a compound having two or more epoxy groups in a molecule, and is one of three thermosetting resin materials most commonly used in modern industries. Because the epoxy resin has the advantages of high mechanical strength, good adhesive property, stable chemical property, excellent electrical insulation property, wider curing temperature range, corrosion resistance and the like, the epoxy resin is widely applied to various aspects of chemical industry, electronic packaging, plastics, coating industry, machinery, national defense, large-scale water conservancy engineering, civil engineering and building industry and the like.
Due to the structural particularity of the epoxy resin material, the internal stress of the material is large. Has the defects of brittleness, serious high-temperature degradation and the like, so that the application of the high-temperature-resistant high-performance high. Meanwhile, the common epoxy resin has low thermal conductivity, and cannot meet the heat dissipation requirements of related fields such as electronic appliances, microelectronics and the like. The epoxy resin prepared by the traditional industry can not meet the development requirements of various industries, so that modification research on the epoxy resin material is urgently needed, and the epoxy resin material has more excellent comprehensive performance.
Disclosure of Invention
Aiming at the defects of the prior art and solving the problems of brittleness, serious high-temperature degradation and low thermal conductivity of the traditional epoxy resin after curing, the invention provides the high-thermal conductivity eugenol modified epoxy resin pouring sealant which can meet the use requirements of relays, power supplies, magnetic amplifiers, transformers, fiber optical waveguide coatings, circuit boards, electric and electronic packaging and filling, packaging of new energy automobile battery PACK packages and the like.
In order to achieve the purpose, the invention provides the following technical scheme: the high-thermal-conductivity eugenol modified epoxy resin pouring sealant is characterized by comprising two components, namely AB, in parts by weight,
the component A consists of the following components:
the component B consists of the following components:
in a preferred embodiment of the present invention, the terminal epoxy modified silicone oil has the following structure:
wherein n is 1-50, and an integer is taken; the viscosity of the epoxy-terminated modified silicone oil is 45-2000 cs, and the epoxy value is 0.040-0.1 mol/100 g.
As a preferred embodiment of the present invention, the eugenol-modified epoxy resin has the following structure:
wherein n is 1-20, and an integer is taken; the eugenol modified epoxy resin can be obtained by carrying out chemical reaction on eugenol, epoxy chloropropane, hydrogen-containing silicone oil and other raw materials, wherein the eugenol modified epoxy resin has the viscosity of 30-5000 cs and the epoxy value of 0.040-0.1 mol/100 g.
In a preferred embodiment of the present invention, the epoxyphenyl silicone oil has the following structure:
wherein m is 0-20, n is an integer of 1-30, the epoxy equivalent value is 120-400 g/equ, and the viscosity at 25 ℃ is 60-500 cst.
As a preferable scheme of the invention, the heat-conducting inorganic filler is selected from one or more of metal/nonmetal oxides and nitrides (such as silicon dioxide microspheres, boron nitride whiskers, aluminum nitride powder, aluminum oxide powder, silicon carbide powder and zinc oxide powder);
the particle size distribution of the heat-conducting inorganic filler is D90＝3～5μm，D100＝8～10μm。
In a preferred embodiment of the present invention, the aminosilane coupling agent is an alkoxysilane containing a plurality of amino groups.
Preferably, the aminosilane coupling agent is one or a mixture of N-beta- (aminoethyl) -gamma-aminopropyltrimethoxysilane, N-beta- (aminoethyl) -gamma-aminopropyldimethoxysilane, vinylbenzylaminoethyl aminopropyltrimethoxysilane, hexamethylenetetraminomethyltriethoxysilane and methyl (N-beta aminoethyl-gamma-aminopropyl) dimethoxysilane.
As a preferred embodiment of the present invention, the silicone-modified fatty amine has the following structure:
wherein n is 0-4, and is an integer.
In a preferred embodiment of the present invention, the amino silicone oil is a linear or branched modified polysiloxane containing at least two terminal amino groups, and has a viscosity of 500 to 10000cst and an amine value of 0.1 to 1.4.
The invention also provides a preparation method of the high-thermal-conductivity eugenol modified epoxy resin pouring sealant, which comprises the following steps:
1) preparation of epoxy resin A component:
s1, putting 20-60 parts of heat-conducting inorganic filler, 0.1-30 parts of aminosilane coupling agent, 15-25 parts of organic silicon modified fatty amine and 10-20 parts of amino silicone oil into a high-speed stirrer, stirring at high speed, mixing uniformly, and removing bubbles in a vacuum box of-0.1 Mpa to obtain a component B;
s2, stirring 40-80 parts of bisphenol A diglycidyl ether type epoxy resin, 10-15 parts of epoxy-terminated modified silicone oil, 5-19 parts of eugenol modified epoxy resin and 10-15 parts of epoxy phenyl silicone oil at 80-100 ℃ for 20-90 min to react to obtain colorless transparent liquid, namely the component A;
s3 when in use, the component A and the component B are mixed and stirred uniformly according to the weight ratio of 2-3: 1 and then are used for encapsulation.
The invention also provides application of the high-thermal-conductivity eugenol modified epoxy resin pouring sealant in the packaging and filling of relays, power supplies, magnetic amplifiers, transformers, fiber optical waveguide coatings, circuit boards, electric and electronic and packaging of PACK packages of new energy automobile batteries.
Compared with the prior art, the invention has the beneficial effects that: the inorganic oxide with specific size is taken as the heat-conducting filler, so that the inorganic oxide can form a heat-conducting path in a curing system conveniently, the heat conductivity is improved, and the thermal resistance is reduced.
The amino silane coupling agent, the organic silicon modified fatty amine and the amino silicone oil are used as surface treating agents, so that the inorganic heat-conducting filler, the amino silane coupling agent, the organic silicon modified fatty amine and the amino silicone oil form chemical bonding, and the problems that the inorganic heat-conducting filler is easy to structurize, poor in later-stage leveling effect, uneven in system dispersion, easy to agglomerate and easy to settle are solved.
The bisphenol A type diglycidyl ether epoxy resin, the epoxy-terminated modified silicone oil, the eugenol modified epoxy resin and the epoxy phenyl silicone oil are used as curing main bodies, so that the traditional bisphenol A type diglycidyl ether epoxy resin and the epoxy modified organosilicon flexible chain form a segmented net-shaped stereo copolymer, and the defects of large internal stress and brittleness after curing of the traditional epoxy resin are overcome by introducing the organosilicon flexible chain segment.
The use of the modified raw material containing the phenyl group epoxy greatly improves the high temperature resistance and the mechanical property of the system.
Almost all raw materials participate in the reaction in the curing process of the epoxy adhesive obtained according to the formula, the curing speed is uniform, and low molecules are not separated out in the curing process, so that the problems of stress concentration and bubble generation caused by nonuniform curing in the using process are solved.
Detailed Description
The present invention will be described in further detail with reference to examples.
Example 1
Putting the components of the component B into a high-speed stirrer according to the mass shown in the table, stirring and mixing uniformly at a high speed, and removing bubbles in a vacuum box of-0.1 Mpa for 1.5h to obtain the component B;
putting the components A into a three-neck flask according to the mass shown in the table, and stirring and reacting for 90min at 80-100 ℃ to obtain colorless (light yellow) transparent liquid, namely the component A;
mixing the component A and the component B according to the weight ratio of 2.5:1 at room temperature, stirring uniformly, putting into a sample bar mold, curing at room temperature for 48h, and measuring the mechanical property and the thermal conductivity.
Example 2
Putting the components of the component B into a high-speed stirrer according to the mass shown in the table, stirring and mixing uniformly at a high speed, and removing bubbles in a vacuum box of-0.1 Mpa for 1.5h to obtain the component B;
putting the components A into a three-neck flask according to the mass shown in the table, and stirring and reacting for 90min at 80-100 ℃ to obtain colorless (light yellow) transparent liquid, namely the component A;
mixing the component A and the component B according to the weight ratio of 3:1 at room temperature, stirring uniformly, putting into a sample bar mold, curing at room temperature for 48h, and measuring the mechanical property and the thermal conductivity of the mixture.
Example 3
Putting the components of the component B into a high-speed stirrer according to the mass shown in the table, stirring and mixing uniformly at a high speed, and removing bubbles in a vacuum box of-0.1 Mpa for 1.5h to obtain the component B;
putting the components A into a three-neck flask according to the mass shown in the table, and stirring and reacting for 90min at 80-100 ℃ to obtain colorless (light yellow) transparent liquid, namely the component A;
mixing the component A and the component B according to the weight ratio of 3:1 at room temperature, stirring uniformly, putting into a sample bar mold, curing at room temperature for 48h, and measuring the mechanical property and the thermal conductivity of the mixture.
Example 4
Putting the components of the component B into a high-speed stirrer according to the mass shown in the table, stirring and mixing uniformly at a high speed, and removing bubbles in a vacuum box of-0.1 Mpa for 1.5h to obtain the component B;
putting the components A into a three-neck flask according to the mass shown in the table, and stirring and reacting for 90min at 80-100 ℃ to obtain colorless (light yellow) transparent liquid, namely the component A;
mixing the component A and the component B according to the weight ratio of 3:1 at room temperature, stirring uniformly, putting into a sample bar mold, curing at room temperature for 48h, and measuring the mechanical property and the thermal conductivity of the mixture.
Example 5
Putting the components of the component B into a high-speed stirrer according to the mass shown in the table, stirring and mixing uniformly at a high speed, and removing bubbles in a vacuum box of-0.1 Mpa for 1.5h to obtain the component B;
putting the components A into a three-neck flask according to the mass shown in the table, and stirring and reacting for 90min at 80-100 ℃ to obtain colorless (light yellow) transparent liquid, namely the component A;
mixing the component A and the component B according to the weight ratio of 3:1 at room temperature, stirring uniformly, putting into a sample bar mold, curing at room temperature for 48h, and measuring the mechanical property and the thermal conductivity of the mixture.
Example 6
Putting the components of the component B into a high-speed stirrer according to the mass shown in the table, stirring and mixing uniformly at a high speed, and removing bubbles in a vacuum box of-0.1 Mpa for 1.5h to obtain the component B;
putting the components A into a three-neck flask according to the mass shown in the table, and stirring and reacting for 90min at 80-100 ℃ to obtain colorless (light yellow) transparent liquid, namely the component A;
mixing the component A and the component B according to the weight ratio of 3:1 at room temperature, stirring uniformly, putting into a sample bar mold, curing at room temperature for 48h, and measuring the mechanical property and the thermal conductivity of the mixture.
Performance testing
Thermal conductivity: measured by using QTM-500 model rapid thermal conductivity meter (KEM Co., Japan). A PD-11 standard probe is selected, self-contained SOFT-QTM5EW thin plate testing software of the instrument and polyethylene, silicon rubber and quartz standard plates are used as references, and the heating current is selected to be 2.0 or 3.0A.
Shear strength: preparing a sample sheet by using the high-toughness bi-component epoxy structural adhesive. After being placed for 7 days, the lap shear strength is measured according to GB/T71242008 determination of tensile shear strength of adhesives.
T peel strength: preparing a sample sheet by using the high-toughness bi-component epoxy structural adhesive. After standing for 7d, the DC04 steel was tested for T peel strength with reference to GB/T2791.
Impact peel strength: preparing a sample sheet by using the high-toughness bi-component epoxy structural adhesive. After standing for 7d, the impact peel strength of the DC01 steel was tested with reference to GB/T36877.
The performance of examples 1-6 was tested and the results are shown in Table 1.
TABLE 1
The eugenol modified epoxy resin pouring sealant obtained by the formula has excellent thermal conductivity and mechanical property, and can meet the use requirements of relays, power supplies, magnetic amplifiers, transformers, fiber optical waveguide coatings, circuit boards, electric and electronic packaging and filling, new energy automobile battery PACK package packaging and the like.
The present invention is not limited to the above-described embodiments, and it will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the principle of the present invention, and such modifications and improvements are also considered to be within the scope of the present invention. Those not described in detail in this specification are within the skill of the art.
Claims (10)
1. The high-thermal-conductivity eugenol modified epoxy resin pouring sealant is characterized by comprising two components, namely AB, in parts by weight,
the component A consists of the following components:
2. the high thermal conductivity eugenol modified epoxy resin pouring sealant according to claim 1, wherein the epoxy-terminated modified silicone oil has the following structure:
wherein n is 1-50, and an integer is taken; the viscosity of the epoxy-terminated modified silicone oil is 45-2000 cs, and the epoxy value is 0.040-0.1 mol/100 g.
3. The high thermal conductivity eugenol modified epoxy resin pouring sealant according to claim 1, wherein the eugenol modified epoxy resin has the following structure:
wherein n is 1-20, and an integer is taken; the eugenol modified epoxy resin has the viscosity of 30-5000 cs and the epoxy value of 0.040-0.1 mol/100 g.
4. The high-thermal-conductivity eugenol modified epoxy resin pouring sealant as claimed in claim 1, wherein the epoxy group phenyl silicone oil has the following structure:
wherein m is 0-20, n is an integer of 1-30, the epoxy equivalent value is 120-400 g/equ, and the viscosity at 25 ℃ is 60-500 cst.
5. The high-thermal-conductivity eugenol modified epoxy resin pouring sealant as claimed in claim 1, wherein the thermal-conductivity inorganic filler is selected from one or more of metal/nonmetal oxides and nitrides;
the particle size distribution of the heat-conducting inorganic filler is D90＝3～5μm，D100＝8～10μm。
6. The high thermal conductivity eugenol modified epoxy resin pouring sealant according to claim 1, wherein the aminosilane coupling agent is an alkoxysilane containing a plurality of amino groups.
7. The high thermal conductivity eugenol modified epoxy resin pouring sealant according to claim 1, wherein the organic silicon modified fatty amine has the following structure:
wherein n is 0-4, and is an integer.
8. The high thermal conductivity eugenol modified epoxy resin pouring sealant as claimed in claim 1, wherein the amino silicone oil is a straight chain type or branched chain type modified polysiloxane containing at least two terminal amino groups, the viscosity is 500-10000 cst, and the amine value is 0.1-1.4.
9. The preparation method of the high-thermal-conductivity eugenol modified epoxy resin pouring sealant as claimed in any one of claims 1 to 8, which is characterized by comprising the following steps:
1) preparation of epoxy resin A component:
s1, putting 20-60 parts of heat-conducting inorganic filler, 0.1-30 parts of aminosilane coupling agent, 15-25 parts of organic silicon modified fatty amine and 10-20 parts of amino silicone oil into a high-speed stirrer, stirring at high speed, mixing uniformly, and removing bubbles in a vacuum box of-0.1 Mpa to obtain a component B;
s2, stirring 40-80 parts of bisphenol A diglycidyl ether type epoxy resin, 10-15 parts of epoxy-terminated modified silicone oil, 5-19 parts of eugenol modified epoxy resin and 10-15 parts of epoxy phenyl silicone oil at 80-100 ℃ for 20-90 min to react to obtain colorless transparent liquid, namely the component A;
s3 when in use, the component A and the component B are mixed and stirred uniformly according to the weight ratio of 2-3: 1 and then are used for encapsulation.
10. The high thermal conductivity eugenol modified epoxy resin pouring sealant as claimed in any one of claims 1 to 9, is applied to the packaging and filling of relays, power supplies, magnetic amplifiers, transformers, fiber optical waveguide coatings, circuit boards, electric and electronic and the packaging of new energy automobile battery PACK packages.
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| CN202111133111.6A CN113861913A (en) | 2021-09-27 | 2021-09-27 | High-thermal-conductivity eugenol modified epoxy resin pouring sealant and preparation method and application thereof |
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| CN106753205A (en) * | 2017-01-11 | 2017-05-31 | 湖南博翔新材料有限公司 | A kind of low viscosity, the epoxy modified silicone casting glue of high heat conduction and its application |
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