CN113860871B - 一种低温烧结改性NiO-Ta2O5基微波介质陶瓷材料及其制备方法 - Google Patents
一种低温烧结改性NiO-Ta2O5基微波介质陶瓷材料及其制备方法 Download PDFInfo
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Abstract
本发明属于电子陶瓷及其制造领域,具体为一种低温烧结改性NiO‑Ta2O5基微波介质陶瓷材料及其制备方法。是以离子掺杂改性为指导依据,不仅考虑到以相近半径的离子进行取代,如Zn2+取代Ni2+离子,V5+取代Ta5+离子;同时选择的掺杂氧化物仍具有低熔点的性质。因此可以实现改善NiO‑Ta2O5基陶瓷材料微波介电性能的同时仍能降低适宜的烧结温度。在本发明中,通过调节各原料的摩尔含量,直接一次合成了具有低温烧结、温度稳定且微波介电性能优异的NiO‑Ta2O5基陶瓷材料,可广泛应用于LTCC技术领域。
Description
技术领域
本发明属于电子陶瓷及其制造领域,涉及一种低温烧结改性NiO-Ta2O5基微波介质陶瓷材料及其制备方法。
背景技术
随着移动通讯不断向高频化方向发展,电子元器件诸如介质滤波器、介质谐振器天线、介质波导等的重要性凸显,而微波介质陶瓷能够在300MHz~300GHz范围内发挥功能性,是目前被广泛用于制备上述电子元器件的关键基础性材料。
传统的微波设备重量大且昂贵,通讯行业发展至今,要求电路系统所占空间要尽可能小。作为一种新型的三维集成封装互联技术,低温共烧陶瓷(LTCC)技术因其满足高频应用,为制备内嵌电极的陶瓷模块或整体电路提供了可靠的解决方案,因此开发应用于LTCC技术的陶瓷体系成为该领域研究的重点。
具有四方Tri-rutile晶体结构的NiO-Ta2O5陶瓷材料在1400℃下的微波介电性能为:εr= 25,Q×f=31200GHz,τf=26ppm/℃,但由于过高的烧结温度导致无法与LTCC技术中的 Ag或Cu电极共烧(与Ag电极共烧需不超过950℃;与Cu电极共烧需不超过1000℃且在还原气氛下进行),且谐振频率温度系数τf值也较大(τf值介于±10ppm/℃代表温度稳定性优异)。截至目前也并未发现有针对NiO-Ta2O5陶瓷的低温烧结探索。因此,降低NiO-Ta2O5基陶瓷的烧结温度并保持微波介电性能是亟需关注的重点。
发明内容
针对上述存在的问题或不足,为解决现有NiO-Ta2O5陶瓷因烧结温度过高导致无法与 LTCC技术中的Ag或Cu电极共烧的问题,本发明提供了一种低温烧结改性NiO-Ta2O5基微波介质陶瓷材料及其制备方法,在保持优异的微波介电性能的同时实现了低温烧结,其温度稳定,可广泛应用于LTCC技术领域。
本发明提供的一种低温烧结改性NiO-Ta2O5基微波介质陶瓷材料,其化学通式为:
(1.587y-0.198xy)ZnO-(2.597y-0.324xy)CuO-(1-x)NiO-(1.855y-0.231xy)B2O3-3xSnO2-(1-x)Ta2 O5-(0.284y-0.035xy)V2O5;其中0.1≤x≤0.2;0.03≤y≤0.09;经由固相法制备获得;晶体类型为 NiTa2O6结构;
该微波介质陶瓷材料的烧结温度为875~950℃,850~900℃大气气氛中预烧;介电常数为 17~21,品质因数Q×f值为14000~23000GHz,谐振频率温度系数为5~10ppm/℃。
作为优选,当x=0.15且y=0.06时,在925℃烧结温度下材料的介电常数为20.2,品质因数Q×f值为22417GHz,谐振频率温度系数为8.7ppm/℃,可广泛用于LTCC技术领域。
上述低温烧结改性NiO-Ta2O5基微波介质陶瓷材料的制备方法,包括以下步骤:
步骤1:将ZnO、CuO、NiO、B2O3、SnO2、Ta2O5与V2O5粉料按化学通式 (1.587y-0.198xy)ZnO-(2.597y-0.324xy)CuO-(1-x)NiO-(1.855y-0.231xy)B2O3-3xSnO2-(1-x)Ta2O5-(0 .284y-0.035xy)V2O5;(x=0.1~0.2;y=0.03~0.09)进行配料;
步骤2:将步骤1配好的粉体装入球磨罐,以氧化锆球和去离子水,按照粉料:氧化锆球:去离子水质的量比为1:5~7:3~5进行球磨,行星球磨6~8小时,取出后在80~120℃烘箱中烘干,以40~60目筛网过筛,后在850~900℃大气气氛中预烧3~5小时;
步骤3:将步骤2预烧后的粉体,再次按照粉体:锆球:去离子水质量比为1:4~6:1~3进行球磨,行星球磨混合3~6小时,取出烘干后,向得到的粉体中添加聚乙烯醇溶液进行剂造粒;
步骤4:将步骤3制得陶瓷生料压制成型,在600~650℃排胶后在875~950℃大气气氛中烧结4~6小时后,即可制得低温烧结的改性NiO-Ta2O5基微波介质陶瓷材料。
本发明不同于现有领域报道技术:也即通过向预烧后的NiO-Ta2O5材料中添加CuO、V2O5、B2O3等氧化物作为烧结助剂,在液相作用下实现低温烧结成瓷的目的,而是以离子掺杂改性为指导依据,不仅考虑到以相近半径的离子进行取代以实现固溶体陶瓷的制备,如Zn2+取代Ni2+离子,V5+取代Ta5+离子,(Ni1/3Ta2/3)4+复合离子被Sn4+取代,不同离子之间的协同作用反而使综合微波介电性能得到提升;同时选择的掺杂氧化物仍具有低熔点的性质,因此可以实现改善较低温度下合成NiO-Ta2O5材料主晶相的目的,并使该陶瓷材料保持优异微波介电性能的同时仍能降低烧结温度。
本发明提供一种可低温烧结的改性NiO-Ta2O5基陶瓷材料,其化学通式为(1.587y-0.198xy)ZnO-(2.597y-0.324xy)CuO-(1-x)NiO-(1.855y-0.231xy)B2O3-3xSnO2-(1-x)Ta2O5-(0 .284y-0.035xy)V2O5,通过调节各原料的摩尔含量,直接一次合成了具有低温烧结、温度稳定且微波介电性能优异的NiO-Ta2O5基陶瓷材料,可广泛应用于LTCC技术领域。
附图说明
图1对应实施例3的XRD衍射图谱;
图2对应实施例3的SEM形貌图。
具体实施方式
下面结合附图和实施例对本发明做进一步的详细说明。
步骤1、将ZnO、CuO、NiO、B2O3、SnO2、Ta2O5与V2O5粉料按化学通式(1.587y-0.198xy)ZnO-(2.597y-0.324xy)CuO-(1-x)NiO-(1.855y-0.231xy)B2O3-3xSnO2-(1-x)Ta2O5-(0.284y-0.035xy)V2O5(x=0.15;y=0.06),采用摩尔比进行配料;
步骤2、将步骤1称量好的粉料混合并置于球磨罐中,在氧化锆球以及去离子水中按照粉料:氧化锆球:去离子水质量比1:6:3行星球磨6小时,然后在100℃的烘箱中烘干,以60 目筛网过筛,随后在900℃大气气氛中预烧3小时;
步骤3、将预烧后的粉料放入球磨罐中进行二次球磨,以粉体:氧化锆球:去离子水质量比1:6:2进行4小时的行星球磨,再取出烘干后向得到的粉料加入聚乙烯醇溶液进行造粒;
步骤4、将造粒好的粉体放入的模具中在20MPa压力下干压成为圆柱体,随后将圆柱块体在650℃下保温2小时以除去粘结剂,然后升至875℃~950℃下保温4小时,最终制得低温烧结条件下的改性NiO-Ta2O5基微波介质陶瓷材料,其化学式的摩尔配比分别为:ZnO-CuO-NiO-B2O3-SnO2-Ta2O5-V2O5(3.7:6.1:33.7:4.3:17.8:33.7:0.7mol%)。
为更好的阐述本发明的效果,按照上述步骤制作了4份实施例样品。图1为实施例3的 XRD衍射图谱,经过检索陶瓷的物相组成与NiTa2O6的标准卡片JCPDS card No.32-0702对应,此时体系中并未发现第二相衍射峰的存在,则说明该类型陶瓷属于NiTa2O6结构的固溶体。
图2为实施例3的SEM形貌图,可以看出陶瓷试样的晶粒生长充分,晶界清晰可见,说明其低温烧结特性良好,但此时微观气孔仍存在。
各实施例样的成分和微波介电性能如下:
表1为各实施例样品组的成分
表2为各实施例样品的微波介电性能
从表1、表2展示的数据可以看出在x=0.15且y=0.06时,当烧结温度介于875~925℃范围内,改性NiO-Ta2O5基陶瓷材料的介电常数与Q×f值呈现出先增加后降低的趋势,并在925℃时取得最佳值:εr=20.2,tanδ=4.1×10-4,Q×f=22417GHz,τf=8.7ppm/℃,与现有文献报道相比烧结温度得到大幅度降低的同时保持了优异的温度稳定性以及微波介电特性,可广泛应用于LTCC技术领域。
Claims (3)
1.一种低温烧结改性NiO-Ta2O5基微波介质陶瓷材料,其特征在于,所述低温烧结改性NiO-Ta2O5基微波介质陶瓷材料化学通式为:
(1.587y-0.198xy)ZnO-(2.597y-0.324xy)CuO-(1-x)NiO-(1.855y-0.231xy)B2O3-3xSnO2-(1-x)Ta2O5-(0.284y-0.035xy)V2O5;其中0.1≤x≤0.2;0.03≤y≤0.09;经由固相法制备获得;晶体类型为NiTa2O6结构;
该微波介质陶瓷材料的烧结温度为875~950℃,850~900℃大气气氛中预烧;介电常数为17~21,品质因数Q×f值为14000~23000GHz,谐振频率温度系数为5~10ppm/℃。
2.根据权利要求1所述的一种低温烧结改性NiO-Ta2O5基微波介质陶瓷材料,其特征在于:当x=0.15且y=0.06时,在925℃烧结温度下材料的介电常数为20.2,品质因数Q×f值为22417GHz,谐振频率温度系数为8.7ppm/℃。
3.一种低温烧结改性NiO-Ta2O5基微波介质陶瓷材料的制备方法,其特征在于:包括以下步骤:
步骤1:将ZnO、CuO、NiO、B2O3、SnO2、Ta2O5与V2O5粉料按化学通式(1.587y-0.198xy)ZnO-(2.597y-0.324xy)CuO-(1-x)NiO-(1.855y-0.231xy)B2O3-3xSnO2-(1-x)Ta2O5-(0.284y-0.035xy)V2O5进行配料;其中0.1≤x≤0.2;0.03≤y≤0.09;
步骤2:将步骤1配好的粉体装入球磨罐,以氧化锆球和去离子水,按照粉料:氧化锆球:去离子水质的量比为1:5~7:3~5进行球磨,行星球磨6~8小时,取出后在80~120℃烘箱中烘干,以40~60目筛网过筛,后在850~900℃大气气氛中预烧3~5小时;
步骤3:将步骤2预烧后的粉体,再次按照粉体:锆球:去离子水质量比为1:4~6:1~3进行球磨,行星球磨混合3~6小时,取出烘干后,向得到的粉体中添加聚乙烯醇溶液进行剂造粒;
步骤4:将步骤3制得陶瓷生料压制成型,在600~650℃排胶后在875~950℃大气气氛中烧结4~6小时后,即可制得低温烧结的改性NiO-Ta2O5基微波介质陶瓷材料。
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