CN113857495A - Copper plate/copper-clad plate manufacturing device and method, copper foil and manufacturing method thereof - Google Patents
Copper plate/copper-clad plate manufacturing device and method, copper foil and manufacturing method thereof Download PDFInfo
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- CN113857495A CN113857495A CN202111183526.4A CN202111183526A CN113857495A CN 113857495 A CN113857495 A CN 113857495A CN 202111183526 A CN202111183526 A CN 202111183526A CN 113857495 A CN113857495 A CN 113857495A
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 175
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 68
- 239000010949 copper Substances 0.000 title claims abstract description 68
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 45
- 239000011889 copper foil Substances 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000000843 powder Substances 0.000 claims abstract description 143
- 230000007246 mechanism Effects 0.000 claims abstract description 85
- 238000010276 construction Methods 0.000 claims abstract description 39
- 239000011248 coating agent Substances 0.000 claims abstract description 26
- 238000000576 coating method Methods 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims description 31
- 238000005253 cladding Methods 0.000 claims description 30
- 238000005056 compaction Methods 0.000 claims description 16
- 239000007789 gas Substances 0.000 claims description 16
- 239000002245 particle Substances 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011261 inert gas Substances 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- 238000003892 spreading Methods 0.000 claims description 8
- 230000007480 spreading Effects 0.000 claims description 8
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/37—Process control of powder bed aspects, e.g. density
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/50—Treatment of workpieces or articles during build-up, e.g. treatments applied to fused layers during build-up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/80—Data acquisition or data processing
- B22F10/85—Data acquisition or data processing for controlling or regulating additive manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F8/00—Manufacture of articles from scrap or waste metal particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
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- Plasma & Fusion (AREA)
- Powder Metallurgy (AREA)
Abstract
The application discloses a copper plate/copper-clad plate manufacturing device and a manufacturing method, a copper foil and a manufacturing method thereof; belongs to the technical field of copper foil production; the technical key points are as follows: the method comprises the following steps: the device comprises a construction mechanism, a powder feeding mechanism, a powder coating device, a compacting device, a control device, a vacuum device, a gas protection device and an energy output device. The application aims at a manufacturing device and a manufacturing method of a copper plate/copper-clad plate, a copper foil and a manufacturing method thereof, which can quickly produce special-shaped pieces, greatly save time and reduce production cost.
Description
Technical Field
The application relates to the technical field of copper foil production, in particular to a copper plate/copper-clad plate manufacturing device, a copper plate/copper-clad plate manufacturing method and a copper foil.
Background
The copper foil can be attached to different materials, such as conductive materials, insulating materials, and the like, and can be applied to the fields of electromagnetism and electricity. The thickness of the copper foil can also be adjusted according to the use requirements, typically in the order of microns. In recent years, with the rapid development of economy in China, the usage amount of micron-sized copper foil is increased day by day, products are widely applied to the fields of computers, communication equipment, household appliances, automobile electronics and the like, people have more and more demands on the copper foil, and the requirements on quality and cost control are higher and higher.
At present, the copper foil is generally prepared by an electrolytic method.
The utility model CN201922262457 discloses a copper foil coiling device and an electrolytic copper foil system, wherein the adopted devices are a drying box and a winding roller which are sequentially arranged along the transmission direction of a copper foil; be equipped with the transmission in the drying cabinet the guide roll and the tensioning of copper foil the correction roller of copper foil, the lower part of drying cabinet is equipped with a heating cabinet that produces vapor, the heating cabinet is equipped with at least one guide vapor and gets into the first exhaust port of drying cabinet can high temperature heating copper foil rapidly, carries out the drying simultaneously, promotes copper foil stress release, and recrystallization accelerates, guarantees the rolling of copper foil under a stable state, reduces the copper foil fold, improves the quality that the copper foil was rolled up. The copper foil is wound by adopting a winding device.
CN201880041068 provides an apparatus for electrolyzing copper foil on copper foil, comprising: an electrolytic cell containing an electrolytic solution; an inner drum mounted to be partially immersed in the electrolyte; an outer drum in contact with a surface of the inner drum; a counter electrode positioned in the electrolytic cell and positioned to be spaced apart from the inner drum by a predetermined distance; and a power supply unit electrically connected between the inner drum and the counter electrode, precipitating metal in the form of a thin film on the surface of the electrode by allowing current to flow between the two electrodes, and separating the precipitated metal from the electrode, thereby obtaining a metal thin film.
As can be seen from the above prior art, the emphasis on the preparation method of copper foil is generally on the electrolytic method and the study on the surface quality of copper foil, however, the electrolytic method has great environmental pollution and the waste material is difficult to recycle or degrade.
Disclosure of Invention
The present application aims to provide a copper plate/copper clad laminate manufacturing apparatus, a copper plate/copper clad laminate manufacturing method, and a copper foil, which are directed to the deficiencies of the prior art.
The technical scheme of the application is as follows: the copper plate/copper-clad plate manufacturing device comprises a construction mechanism, a powder feeding mechanism, a powder coating mechanism, a compacting mechanism, a control system, a vacuum mechanism, a gas protection device and an energy output device, wherein the construction mechanism comprises a construction platform and a lifting mechanism, and the powder feeding mechanism comprises an upper powder feeding bin and a lower powder feeding bin.
Further, the particle size of the copper powder stored in the upper powder conveying bin is 1-5 microns, and the particle size of the copper powder stored in the lower powder conveying bin is 10-15 microns.
Furthermore, the device also comprises a temperature measuring device.
Furthermore, the lifting mechanism is a double-oil-cylinder mechanism.
Further, the building platform is also provided with a heating device.
The invention also provides a method for manufacturing the copper plate, which comprises the following steps: (1) calculating the total mass of the copper powder: inputting the thickness of the copper plate into a computer program of a control system, and calculating the total mass of the required copper powder according to the size of the constructed platform; (2) gas protection: before forming, a vacuum device is adopted for vacuumizing, and inert gas is filled in; (3) powder spreading: when each layer is formed, small-particle-size copper powder in an upper material bin is paved twice, a control system controls the upper material bin to firstly uniformly pave half of the mass of the required small-particle-size copper powder on a construction platform, then a powder coating device is adopted to pave large-particle-size copper powder in a lower material bin on the upper layer of the small-particle-size copper powder, and then the upper material bin uniformly paves the residual small-particle-size copper powder on the large-particle-size copper powder of the construction platform; (4) fusing and molding: scanning and cladding the powder layer by using an energy beam; (5) compacting: monitoring a cladding copper layer in real time by a temperature measuring device, and compacting by a compacting mechanism when the temperature is in a certain interval; (6) and (5) circularly reciprocating the steps (3) to (5) to obtain the copper plate.
Further, the powder discharging amount of the feeding bin is as follows: the powder output of the blanking bin is (1-3): 10 the copper powder distribution is carried out,
further, the temperature of the copper layer during compaction is 800-1000 ℃.
Further, the compaction time is 5-10 s.
Furthermore, in the compaction procedure, the pressure applied by each cladding copper layer is different, and the pressure formula is FN＝k-1·(1+N％)FFirst stageThe applied pressure is related to the temperature of the cladding layer and the number of layers, and the value of k is the ratio of the temperature of the cladding layer to the melting point before compaction, e.g. Tm is the measured temperature of the first cladding layer, the temperature coefficient k is 1, F isFirst stageFor the first layer pressure irrespective of temperature, the pressure of the Nth layer is (1+ N%) FFirst stageThe applicant obtains the formula through long-term tests, and finds that if the pressure value does not accord with the formula, the equipment is damaged if the pressure value is too large, and if the pressure value is too small, the compaction effect is not obvious, and pores still exist in the copper plate.
The beneficial effect of this application lies in:
(1) the basic idea (i.e. the first invention) of the present invention is: by the additive manufacturing method, according to the using amount of the copper foil, the copper plate with a certain thickness is prepared and then rolled, so that the using amount of the copper powder can be effectively controlled.
(2) The second invention of the present invention is that fine powder screened from additive manufacturing powder is used and classified, and by matching the coarse powder, although the reflectance of the fine powder is high and the energy absorption rate is low, the small-particle-size copper powder is rapidly melted after being irradiated with an energy beam as compared with the case of a solid phase, and at this time, the small-particle-size copper powder melted and increased in temperature is kept warm and heats the large-particle-size copper powder in contact with the irradiated surface, so that the absorption rate of the energy beam is increased by the large-particle-size copper powder, and the large-particle-size powder is melted in a short time. Therefore, the fine particle powder can be recycled, and the high energy absorption rate can be kept.
(3) In the copper foil production industry, for example, large amounts of copper powder are produced in the slitting process. The copper powder is currently discarded as waste. By adopting the scheme, the superfine copper powder in the waste can be effectively utilized again, the cost is saved, and the method has positive significance for protecting the environment.
(4) The copper-clad plate is prepared by adopting an additive manufacturing mode, and the copper-clad plate with a complex shape can be formed by one-step forming, so that the cost is saved.
(5) The invention adopts the compaction mechanism, extracts the compaction pressure formula according to the actual production experience, can effectively eliminate the pores inside and between layers in the manufacturing process, effectively improves the compactness of the copper plate and improves the product quality.
Drawings
The present application will be described in further detail with reference to the following examples, which are not intended to limit the scope of the present application.
Fig. 1 is a manufacturing flowchart of the copper plate of the present application.
Fig. 2 is a design view of the copper plate manufacturing apparatus of the present application (only a part of the members are illustrated).
Fig. 3 is a design view of a copper foil rolling apparatus according to the present invention.
Fig. 4 is a flow chart of the operation of the apparatus of the present application.
The reference numerals are explained below:
the powder coating machine comprises an energy output device 1, an upper powder feeding bin 2, a compacting mechanism 3, a lower powder feeding bin 4, a constructing mechanism 5, a recovery device 6, a gas protection device 7 and a powder coating mechanism 8.
The specific implementation mode is as follows:
example 1: a copper plate manufacturing apparatus.
As shown in fig. 2, the device comprises a construction mechanism 5, a powder feeding mechanism, a powder coating mechanism 8, a compacting mechanism 3, a control system, a vacuum mechanism, a gas protection device 7 and an energy output device 1, wherein the construction mechanism is used for forming a workpiece and is positioned below a manufacturing device, the powder feeding mechanism is divided into an upper powder feeding bin and a lower powder feeding bin which are respectively positioned above and below a component mechanism, the powder coating mechanism 8 is used for laying powder on the component mechanism, the compacting mechanism 3 can move in the X-axis direction and the Y-axis direction above the component mechanism and is used for compacting molten metal powder, the device further comprises a vacuum system, the vacuum system is positioned outside the gas protection device 7 and is used for providing a vacuum state of the manufacturing device, and the energy output device 1 is positioned above the construction mechanism 5 and is used for melting copper powder on the component mechanism 5.
When only one copper material is adopted, material powder is loaded into the lower powder feeding bin 4, a vacuum system vacuumizes a forming cavity in the gas protection device 7, inert gas is charged, the construction platform descends to a certain height, the lifting device at the lower part of the lower powder feeding bin 4 ascends to a certain height according to the required powder amount, the height of the lifting device corresponds to the descending height of the construction platform, the powder coating mechanism 8 conveys the powder ascending to a certain height onto the construction platform, then the powder is clad by the energy output device 1, the powder is compacted by the compacting mechanism 3 within a certain time period after cladding is completed, the defects of bubbles, hollowness and the like are reduced, the energy output device 1 and the compacting mechanism 3 work alternately, and the steps are repeated circularly until a workpiece is formed.
When different materials are adopted, one material powder is loaded into a lower powder feeding bin 4, the other material powder is loaded into an upper powder feeding bin 2, a vacuum system vacuumizes a forming cavity in a gas protection device 7, inert gas is charged, a construction platform descends to a certain height, a lifting device at the lower part of the powder feeding bin 4 ascends to a certain height according to the required powder amount, the total powder feeding amount of the powder feeding bin 2 added with the single powder feeding amount corresponds to the descending height of the construction platform, a powder coating mechanism 8 feeds the powder with a certain ascending height onto the construction platform, a powder coating mechanism 8 returns to the original position, the upper powder feeding bin 2 feeds the other material onto the platform, the powder coating mechanism 8 feeds the other material onto the construction platform, cladding is carried out on the material by using an energy output device 1, and the compacting mechanism 3 is used for compacting the material in a certain time period after cladding is finished to reduce bubbles, Hollow, etc., wherein the energy output device 1 and the compacting mechanism 3 work alternately, and the steps are repeated circularly until the workpiece is formed.
Firstly, construct the mechanism including constructing platform, elevating system, heating device, elevating system is located and constructs the platform below for go up and down to construct the platform, and heating device sets up in constructing the platform, is used for heating the platform.
Secondly, the powder feeding mechanism comprises an upper powder feeding bin and/or a lower powder feeding bin, and the lower powder feeding bins are used for storing powder; the upper powder feeding bin is used for storing powder or resin, and the lower powder feeding bin is used for storing powder.
Thirdly, the powder coating mechanism can be a powder spreading roller or a scraper, and the compacting mechanism can move and operate in a staggered mode with the energy output device.
Fourthly, inert gas is input into the gas protection device.
Fifth, the energy output device includes an output plasma, a laser, or an electron beam.
The construction mechanism, the powder feeding mechanism, the powder coating mechanism, the compacting mechanism, the vacuum system, the gas protection device and the energy output device are controlled by the control system;
the powder particle sizes of the upper powder feeding bin and the lower powder feeding bin are different.
Wherein, the cooperation design of constructing mechanism, powder feeding mechanism lies in:
the lifting mechanism of the construction mechanism descends by a certain height, the upper powder feeding bin 2 or the lower powder feeding bin 4 supplies powder with specific content to the processing platform, the powder coating mechanism 8 moves to the recovery device 6 along the processing platform from left to right, the powder is paved on the construction platform, the energy output device scans the molten powder on the processing plane of the construction platform according to the processing track, the current layer is processed, the powder coating mechanism 8 returns to the initial position, the steps are repeated continuously, and the copper plate is stacked from two-dimensional forming to three-dimensional forming.
The recovery device 6 may be divided into two parts, and the resin or copper powder is recovered separately.
Copper powder has high activity in air and is very easy to oxidize after being heated, so that inert gas is added for protection after vacuum pumping.
The powder feeding device comprises an upper powder feeding bin, a lower powder feeding bin, a lifting oil cylinder, a powder spreading roller, a scraper and the like, wherein the upper powder feeding bin adopts an upper powder feeding mode, powder falls at a constant speed under the control of a moving mechanism, the lower powder feeding mode is adopted by the lower powder feeding bin, a lifting oil cylinder is adopted to lift upwards for a certain thickness when each layer is formed, then a powder coating device, such as the powder spreading roller and the scraper, is adopted to spread copper powder on a building platform, the particle size of the copper powder stored in the upper powder feeding bin is smaller than that of the copper powder in the lower powder feeding bin, the particle size of the copper powder stored in the upper powder feeding bin is 1-5 mu m, the particle size of the copper powder stored in the lower powder feeding bin is 10-15 mu m, and after powder spreading, the copper powder with small particle size can fill gaps above and below the copper powder with large particle size, and a melting channel is formed in the melting process to surround the copper powder with large particle size.
The temperature measuring device is arranged right above the construction platform and used for monitoring the cladding copper layer in real time. The lifting mechanism is a double-oil-cylinder mechanism, and can provide enough supporting force for the construction platform in the compaction process, so that the construction platform does not shake.
The construction platform is also provided with a heating device for insulating the copper plate layer or slowly cooling the copper plate layer to eliminate thermal stress.
The working method of the device comprises the following steps:
and S1, opening the gas protection device 7, fixing the substrate on the construction platform, adjusting the substrate to be horizontal through the substrate leveling mechanism, sealing the gas protection device 7 and starting a vacuum system for sucking air in the processing chamber to reach a vacuum state.
And S2, importing the STL file of the part to be molded into an industrial control computer, obtaining the slicing data of the part, and generating an energy beam processing track of each layer.
S3, a heating device in the construction platform is opened to preheat the substrate, the powder is conveyed to the left side of the construction platform according to a set amount by an upper powder conveying bin or a lower powder conveying bin, the construction platform descends by a slice height through a lifting mechanism, the powder coating mechanism 8 moves to the recovery device 6 from left to right, the powder is tiled on the substrate, the energy output device 1 emits energy beams, a focusing light spot is controlled to move on a processing plane according to a processing track, the current layer processing is realized, the powder coating mechanism 8 returns to an initial position, the recovery device 6 can be divided into two parts, resin or copper powder is recovered respectively, a cover plate is arranged above the two recovery devices 6 and is opened and closed according to requirements.
S4, compacting: monitoring the cladding powder layer in real time by a temperature measuring device, and compacting by a compacting mechanism when the temperature is within a certain interval (less than the melting point of copper within the range of 10-50 ℃ or in a semi-solidified state of resin);
s5, the upper powder feeding bin or the lower powder feeding bin sends powder to the left side of the construction platform according to a set amount, the construction platform descends by a slice height through the lifting mechanism, the powder coating mechanism 8 moves from left to right to the recovery device 6, a layer of new powder is uniformly paved on the deposited copper layer, the energy output device 1 emits energy beams, and the focusing light spots are controlled to move on the processing plane according to the processing track, so that the processing of the current layer is realized.
And S6, repeating the steps S3, S4 and S5 continuously to realize the accumulation of the copper plates from two-dimensional forming to three-dimensional forming.
And S7, after the copper plate is obtained, heat treatment can be carried out on the copper plate to eliminate the processing stress.
Example 2: a method of manufacturing a copper plate.
The present invention also provides a method of manufacturing a copper plate, as shown in fig. 1, comprising the steps of:
(1) calculating the total mass of the copper powder: inputting the thickness of the copper plate into a computer program of a control system, and calculating the total mass of the required copper powder according to the size of the constructed platform;
(2) gas protection: before forming, a vacuum device is adopted for vacuumizing, and inert gas is filled in;
(3) powder spreading: when each layer is formed, small-particle-size copper powder in an upper material bin is paved twice, a control system controls the upper material bin to firstly uniformly pave half of the mass of the required small-particle-size copper powder on a construction platform, then a powder coating device is adopted to pave large-particle-size copper powder in a lower material bin on the upper layer of the small-particle-size copper powder, and then the upper material bin uniformly paves the residual small-particle-size copper powder on the large-particle-size copper powder of the construction platform;
(4) fusing and molding: scanning and cladding the powder layer by using an energy beam;
(5) compacting: monitoring a cladding copper layer in real time by a temperature measuring device, and compacting by a compacting mechanism when the temperature is in a certain interval;
(6) and (5) circularly reciprocating the steps (3) to (5) to obtain the copper plate.
When energy beam cladding is carried out, the compaction mechanism is moved out of the range of the processing area through the translation device, and when single-layer cladding is finished, the compaction mechanism is moved to the position above the processing area through the translation device.
Powder discharging amount of a feeding bin: the powder output of the blanking bin is (1-3): 10, copper powder distribution is carried out, the small-particle-size copper powder is too little to achieve the bridging effect during melting, and the small-particle-size copper powder is too much to achieve the poor melting effect due to the influence of the reflectivity of the superfine metal powder.
After each layer of cladding is finished, in order to ensure that no pore exists in the copper plate, a compacting device can be adopted to compact the copper layer, the temperature of the copper layer is too high during compacting, the copper layer can be adhered to a pressing plate, and the compacting effect is not good when the temperature is too low, so that the compacting temperature is 800-1000 ℃.
Further, the compaction time is 5-10 s.
Example 3: a method for preparing copper foil.
As in the rolling apparatus of fig. 3, the copper sheet obtained by the method of example 2 was rolled by a rolling mechanism to obtain a copper foil having a desired thickness.
In addition, as shown in fig. 2, in view of the advantages of additive manufacturing, when the required copper foil is a special-shaped piece, the shape of the copper plate can be set through a computer program, the deformation amount of the copper plate is calculated, and then the special-shaped copper foil is obtained through rolling, and the process is saved through one-step processing and forming.
The specific processing process of the copper foil is as follows:
(1) screening superfine copper powder with the particle size of 1-5 microns and 10-15 microns, and respectively putting the superfine copper powder into an upper material bin and a lower material bin for later use;
(2) inputting the dimensions of the special-shaped copper plate into a computer program of a control system, and preparing modeling work on a 3D printing device: creating a copper plate three-dimensional model by UG three-dimensional software, then exporting created three-dimensional model files in an STL format, and performing layered slicing by adopting layered software;
(3) setting cladding parameters;
(4) firstly, vacuumizing by adopting a vacuum device, and then filling inert gas; the controller controls the upper material bin to uniformly lay half of the mass of the required small-particle-size copper powder on the construction platform, then the powder coating device is adopted to lay the large-particle-size copper powder in the lower material bin on the upper layer of the small-particle-size copper powder, and then the controller controls the upper material bin to uniformly lay the residual small-particle-size copper powder on the large-particle-size copper powder on the construction platform;
(5) after the layer is laid, applying an energy beam for cladding;
(6) after cladding, measuring the temperature of the copper layer by a temperature measuring device, and compacting by a compacting device within a temperature range;
(7) after the compaction is finished, preparing the next copper layer, compacting again, and repeating the steps to obtain a copper plate;
(8) taking the copper plate down from the construction platform, and finally thinning the copper plate by adopting a rolling device to obtain a copper foil;
(9) and (4) post-treating the copper foil.
The special-shaped copper foil formed by the method can be formed in one step, raw materials are not wasted, the cost is greatly saved, and the output efficiency is improved.
The copper foil is generally used for preparing a copper clad laminate, is called a copper clad laminate, and is applied to printed circuit boards with different forms and different functions by soaking electronic glass fiber cloth or other reinforced materials with resin and coating copper foil on one surface or two surfaces. Along with the maturity and perfection of additive manufacturing technology, the composite material is more convenient to manufacture, and the copper-clad plate with composite use requirements is manufactured by simply modifying a copper plate manufacturing device.
The specific processing process of the copper-clad plate is as follows:
(1) putting resin particles into an upper material bin, and putting copper powder into a lower material bin for later use;
(2) inputting the copper layer size and the resin size into a computer program of a control device respectively, and preparing modeling work on a 3D printing device: creating a copper plate three-dimensional model by UG three-dimensional software, then exporting created three-dimensional model files in an STL format, and performing layered slicing by adopting layered software;
(3) setting cladding parameters;
(4) firstly, vacuumizing by adopting a vacuum device, and then filling inert gas; firstly, laying a resin layer; cladding the alloy by adopting laser, and compacting by adopting a pressing plate in a semi-solid state;
(5) after the resin layer is formed, circularly laying a copper layer, and cladding the copper layer until the thickness of the copper layer is reached;
(6) after the copper layer is cladded, measuring the temperature of the copper layer by a temperature measuring device, and compacting by a compacting device within a temperature range;
(7) and after the compaction is finished, separating the resin part of the copper-clad plate from the substrate by adopting a cutting device.
The cut portion thickness is taken into account when modeling the resin layer. By the method, the special-shaped copper-plated plate can be rapidly prepared, the processing procedure is simplified, the cost is saved, and the method is suitable for production of non-standard parts.
The un-fused copper powder on the build platform can be re-used by sieving.
The above-mentioned embodiments are merely preferred embodiments of the present application, which are not intended to limit the present application in any way, and it will be understood by those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the present application.
Claims (10)
1. The utility model provides a manufacturing installation of copper board/copper-clad plate which characterized in that includes: the device comprises a construction mechanism, a powder feeding mechanism, a powder coating mechanism, a compaction mechanism, a control system, a vacuum mechanism, a gas protection device and an energy output device;
wherein the build mechanism comprises: constructing a platform, a lifting mechanism and a heating device;
wherein, powder feeding mechanism includes: an upper powder feeding bin and/or a lower powder feeding bin;
wherein the powder coating mechanism is a powder spreading roller or a scraper;
wherein the compacting mechanism is movable and operates offset from the energy output device;
wherein the gas protection device inputs inert gas;
wherein, the energy output device comprises output plasma, laser and electron beam;
the construction mechanism, the powder feeding mechanism, the powder coating mechanism, the compacting mechanism, the vacuum system, the gas protection device and the energy output device are all connected with the control system and are all controlled by the control system;
the powder in the upper powder feeding bin is different from that in the lower powder feeding bin.
2. The manufacturing apparatus according to claim 1, wherein: the particle sizes of the powder in the upper powder conveying bin and the powder in the lower powder conveying bin are different, the particle size of the copper powder stored in the upper powder conveying bin is smaller than that of the copper powder in the lower powder conveying bin, the particle size of the copper powder stored in the upper powder conveying bin is 1-5 mu m, and the particle size of the copper powder stored in the lower powder conveying bin is 10-15 mu m.
3. The manufacturing apparatus according to claim 1, wherein: when the copper-clad plate is manufactured, the powder materials of the upper powder feeding bin and the lower powder feeding bin are different, the upper powder feeding bin stores resin, and the lower powder feeding bin stores copper powder.
4. The manufacturing apparatus according to claim 1, wherein: the lifting mechanism is a double-oil-cylinder mechanism.
5. The manufacturing apparatus according to claim 1, wherein: the build platform also has a heating device.
6. The manufacturing apparatus according to claim 1, wherein: the pressure used by the compacting mechanism meets the following conditions: pressure formula is FN＝k-1·(1+N％)FFirst stageK is the ratio of the temperature of the cladding layer to the melting point before compaction, e.g. Tm is the measured temperature of the first cladding layer, the temperature coefficient k is 1, FFirst stageIn order to obtain the first layer pressure without considering the temperature factor, N is the number of the cladding layers.
7. A method for manufacturing a copper plate using the manufacturing apparatus as claimed in any one of claims 1 to 4, characterized by comprising the steps of:
(1) calculating the total mass of the copper powder: inputting the thickness of the copper plate into a computer program of a control system, and calculating the total mass of the required copper powder according to the size of the constructed platform;
(2) filling protective gas: before forming, a vacuum device is adopted for vacuumizing, and inert gas is filled in;
(3) powder spreading: when each layer is formed, small-particle-size copper powder in an upper material bin is paved twice, a control system controls the upper material bin to firstly uniformly pave half of the mass of the required small-particle-size copper powder on a construction platform, then a powder coating device is adopted to pave large-particle-size copper powder in a lower material bin on the upper layer of the small-particle-size copper powder, and then the upper material bin uniformly paves the residual small-particle-size copper powder on the large-particle-size copper powder of the construction platform;
(4) fusing and molding: scanning and cladding the powder layer by using an energy beam;
(5) compacting: monitoring a cladding copper layer in real time by a temperature measuring device, and compacting by a compacting mechanism when the temperature is in a certain interval;
(6) and (5) circularly reciprocating the steps (3) to (5) to obtain the copper plate.
8. The method of claim 6, wherein: the powder output of the feeding bin and the powder output of the discharging bin are as follows (1-3): copper powder partitioning is performed 10.
9. The method of claim 6, wherein: the pressure used in the pressing process meets the following conditions: pressure formula is FN＝k-1·(1+N％)FFirst stageK is the ratio of the temperature of the cladding layer to the melting point before compaction, e.g. Tm is the measured temperature of the first cladding layer, the temperature coefficient k is 1, FFirst stageIn order to obtain the first layer pressure without considering the temperature factor, N is the number of the cladding layers.
10. A copper foil rolled to a desired thickness using the copper plate obtained by the method as claimed in any one of claims 6 to 9.
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