CN113848356A - Probe module and preparation method thereof - Google Patents
Probe module and preparation method thereof Download PDFInfo
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- CN113848356A CN113848356A CN202111238754.7A CN202111238754A CN113848356A CN 113848356 A CN113848356 A CN 113848356A CN 202111238754 A CN202111238754 A CN 202111238754A CN 113848356 A CN113848356 A CN 113848356A
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- 239000000523 sample Substances 0.000 title claims abstract description 265
- 238000002360 preparation method Methods 0.000 title abstract description 6
- 238000000034 method Methods 0.000 claims description 11
- 241001136800 Anas acuta Species 0.000 claims description 10
- 238000002788 crimping Methods 0.000 claims description 10
- 238000007781 pre-processing Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 4
- 238000000227 grinding Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention discloses a probe module and a preparation method thereof, and belongs to the technical field of probes. The probe module comprises a fixed seat and a plurality of probe sheets. In the probe sheet interval arrangement fixing seat, two end parts of each probe sheet are respectively arranged in two parallel planes at intervals, and the interval between one end parts of any two adjacent probe sheets is larger than the interval between the other end parts of the two probe sheets. Each probe piece all includes probe piece board and a plurality of probe, and a plurality of probe interval arrangement in proper order is on the probe piece board, and probe piece board cartridge is in the fixing base, and all links together through the insulating part between probe piece board and a plurality of probe, and the interval between the one end of two arbitrary adjacent probes is greater than the interval between the other end of two probes. The probe module provided by the embodiment of the invention can increase the arrangement distance between one ends of the probes, thereby realizing the conduction of the test points on the PCB/FPC and further realizing the conduction of the product.
Description
Technical Field
The invention belongs to the technical field of probes, and particularly relates to a probe module and a preparation method thereof.
Background
The panel, integrated circuit, products such as semiconductor, in order to guarantee the product quality, can carry on various tests in the course of production, in these test processes, need use various crimping units, the test point of the probe module one end contact product on these crimping units, the test point on the other end contact PCB/FPC etc., PCB/FPC etc. are connected with other transmission units or test equipment again, thus realize the conduction to the product.
At present, the refinement degree of products such as panels, integrated circuits and semiconductors is higher and higher, the size is smaller and smaller, the distance between the corresponding test points on the PCB/FPC is smaller and smaller, and due to the limitation of the self processing and manufacturing process, the processing difficulty is high, so that the distance between the test points on the PCB/FPC is larger, and the PCB/FPC cannot be matched with the distance between the test points on the products such as panels, integrated circuits and semiconductors, and the products cannot be conducted.
Disclosure of Invention
Aiming at the defects or the improvement requirements of the prior art, the invention provides a probe module and a preparation method thereof, aiming at increasing the arrangement space between one ends of probes so as to realize the conduction of test points on a PCB/FPC and further realize the conduction of products.
In a first aspect, the present invention provides a probe module, which includes a fixing base and a plurality of probe sheets;
the plurality of probe sheets are arranged in the fixing seat at intervals, each probe sheet is of a Z-shaped structure, two end parts of each probe sheet are respectively arranged in two parallel planes at intervals, and for the plurality of probe sheets, the interval between one end parts of any two adjacent probe sheets is larger than the interval between the other end parts of the two probe sheets;
each probe piece all includes probe piece board and a plurality of probe, for arbitrary probe piece, a plurality of the probe is in proper order the interval arrangement on probe piece board, probe piece board cartridge is in the fixing base, and all link together through the insulating part between probe piece board and a plurality of the probe, the interval between the one end of arbitrary two adjacent probes is greater than the interval between the other end of two probes.
Optionally, each probe sheet plate includes two plate bodies arranged at intervals, the plurality of probes are symmetrically arranged between the two plate bodies, and the two plate bodies and the plurality of probes are bonded together by insulating glue.
Optionally, the two end portions of each plate body are provided with a limiting portion, the fixing seat is provided with a plurality of limiting grooves, the plurality of limiting portions correspond to the plurality of limiting grooves one to one, and each limiting portion is inserted into the corresponding limiting groove.
Optionally, the fixing seat is of a square structure, a square hole is formed in the fixing seat, and the plurality of limiting grooves are respectively arranged on two sides of the square hole.
Optionally, one end of each probe is sequentially connected with an elastic part and a needle tail, and the elastic part is of an elastic structure.
Optionally, the probe module further includes a cover plate, the cover plate has a plurality of through holes, the through holes correspond to the pin tails one by one, and each pin tail is inserted into the corresponding through hole and protrudes out of the cover plate.
In a second aspect, the present invention provides a crimping jig, which includes the probe module according to the first aspect.
In a third aspect, the present invention provides a crimping test apparatus, which includes the probe module according to the first aspect.
In a fourth aspect, the present invention provides a method for preparing a probe module, the method being based on the probe module of the first aspect, the method comprising:
preprocessing a plurality of probe panels to obtain a plurality of primary probe sheets, wherein each primary probe sheet comprises a probe sheet plate, a plurality of probes and connecting ribs, and the probe sheet plate and the plurality of probes are connected together through the connecting ribs;
inserting a plurality of primary probe sheets into the fixed seat, and connecting the probe sheet plate and the plurality of probes in each primary probe sheet together through an insulating part;
and grinding the connecting ribs, and processing a plurality of primary probe sheets into a plurality of probe sheets so as to obtain the probe module.
Optionally, the preprocessing the plurality of probe panels to obtain a plurality of primary probe tiles includes:
etching a plurality of probe panels;
and bending the etched probe panels to obtain a plurality of primary probe sheets.
The technical scheme provided by the embodiment of the invention has the following beneficial effects:
for the probe module provided by the embodiment of the invention, the probe sheet plates of the probe sheets are inserted into the fixing seat in parallel, so that the probe sheets are inserted into the fixing seat, and the distance between the bottoms of the probe sheets is ensured to be larger than the distance between the tops of the probe sheets (in the Y-axis direction). In addition, the bottom and the top of the probe of each probe sheet are respectively arranged in two spaced planes, wherein the top of the probe can be used for communicating with a test point of a product, the bottom of the probe can be used for connecting a PCB/FPC, and the insulating part plays an insulating role between the probes.
For a plurality of probes in each probe piece, the distance between the bottoms of the probes is larger than the distance between the tops of the probes (in the X-axis direction), so that the distances between the bottoms of the probes in the X-axis direction and the Y-axis direction in a plane are larger than the distances between the tops of the probes in the X-axis direction and the Y-axis direction in the plane, the distance between the bottoms of the probes can be increased, the requirement for setting the distance between the test points on the PCB/FPC is reduced, the processing difficulty of the PCB/FPC is reduced, and the conduction of a product is met.
That is to say, the probe module provided by the embodiment of the invention can increase the arrangement distance between one ends of the probes, thereby realizing conduction of the test points on the PCB/FPC and further realizing conduction of the product.
Drawings
Fig. 1 is a first view of a probe module according to an embodiment of the present invention;
FIG. 2 is a second view of a probe module according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a probe sheet according to an embodiment of the present invention;
FIG. 4 is an enlarged view of a portion of FIG. 1;
FIG. 5 is an enlarged view of a portion of FIG. 2;
FIG. 6 is a side view of a probe tile provided by an embodiment of the present invention;
FIG. 7 is an enlarged view of a portion of FIG. 3;
FIG. 8 is a flowchart illustrating a method for fabricating a probe module according to an embodiment of the present invention;
FIG. 9 is a schematic structural diagram of a primary probe tile provided in accordance with an embodiment of the present invention;
fig. 10 is a partially enlarged view of fig. 9.
The symbols in the drawings represent the following meanings:
1. a fixed seat; 11. a square hole; 2. a probe sheet; 21. a probe sheet plate; 211. a plate body; 212. a limiting part; 22. a probe; 221. an elastic portion; 222. needle tail; 23. a first end portion; 24. an intermediate portion; 25. a second end portion; 3. a cover plate; 31. a through hole; 4. a primary probe tile; 41. and connecting ribs.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Fig. 1 is a first view of a probe module according to an embodiment of the present invention, and fig. 2 is a second view of a probe module according to an embodiment of the present invention, as shown in fig. 1 and 2, the probe module includes a holder 1 and a plurality of probe tiles 2.
Fig. 3 is a schematic structural diagram of a probe sheet according to an embodiment of the present invention, as shown in fig. 3, in a fixing base 1 in which a plurality of probe sheets 2 are arranged at intervals, each probe sheet 2 is a Z-shaped structure, two end portions of each probe sheet 2 are respectively arranged at intervals in two parallel planes, and for the plurality of probe sheets 2, an interval between one end portions of any two adjacent probe sheets 2 is greater than an interval between the other end portions of two probe sheets 2.
Each probe piece 2 all includes probe piece board 21 and a plurality of probe 22, and to arbitrary probe piece 2, a plurality of probe 22 interval arrangement in proper order are on probe piece board 21, and probe piece board 21 cartridge is in fixing base 1, and all links together through the insulating part between probe piece board 21 and a plurality of probe 22, and the interval between the one end of arbitrary two adjacent probe 22 is greater than the interval between the other end of two probe 22.
For the probe module provided by the embodiment of the invention, the probe sheet plate 21 of each probe sheet 2 is inserted into the fixing base 1 in parallel, so that a plurality of probe sheets 2 are inserted into the fixing base 1, and the distance M between the bottoms of the probe sheets 2 is ensured2Is larger than the distance M between the tops of the probe sheets 21(in the Y-axis direction). In addition, the bottom and the top of the probe 22 of each probe sheet 2 are respectively arranged in two spaced planes, wherein the top of the probe 22 can be used for communicating with the test point of the product, the bottom of the probe 22 can be used for connecting the PCB/FPC, and the insulating member plays a role of insulating the probe 22.
And for the plurality of probes 22 in each probe sheet 2, the pitch L of the bottom of each probe 222Greater than the spacing L of the tips of the probes 221In this way, the distance between the bottom of the probe 22 in the X-axis direction and the distance between the top of the probe 22 in the Y-axis direction are both greater than the distance between the bottom of the probe 22 in the X-axis direction and the top of the probe 22 in the Y-axis direction (see fig. 4 and 5), so that the increase of the distance between the bottoms of the probes 22 can be increased, the requirement of the distance between the test points on the PCB/FPC is reduced, the processing difficulty of the PCB/FPC is reduced, and the conduction of products is satisfied.
That is to say, the probe module provided by the embodiment of the present invention can increase the arrangement distance between the ends of the probes 22, so as to implement conduction to the test points on the PCB/FPC, and further implement conduction to the product.
Note that the probe sheet plate 21 and the plurality of probes 22 are arranged in a Z-shape.
In addition, in the probe module, the number of the probe sheets 2 varies from several to several hundred, and the number of the probes 22 included in each probe sheet 2 varies from several to several hundred; the number of probe chips 2 in each probe module and the number of probes 22 distributed in each probe chip 2 need to be designed according to the number and distribution of test points of the tested product.
It is easy to understand that, when assembling, assembling one probe sheet 2 means that a plurality of probes 22 are assembled, and the structural mode of the probe sheet 2 greatly reduces the assembly difficulty and workload of the probes 22, and greatly improves the assembly efficiency.
Illustratively, each of the probe sheet plate 21 and each of the probes 22 includes a first end portion 23, an intermediate portion 24, and a second end portion 25, the first end portion 23 and the second end portion 25 are arranged vertically, both ends of the intermediate portion 24 are connected to the first end portion 23 and the second end portion 25, respectively, and the intermediate portion 24 may be arranged horizontally or obliquely (see fig. 6).
Illustratively, the spacing (M) between the bottoms of the probes 222And L2) Is 0.2mm, the spacing (M) between the tips of the probes 221And L1) The accuracy of (3) is 0.05 mm.
Referring to fig. 3 again, each probe sheet plate 21 includes two plate bodies 211 arranged at intervals, the plurality of probes 22 are symmetrically arranged between the two plate bodies 211, and the two plate bodies 211 and the plurality of probes 22 are bonded together by insulating glue.
In the above embodiment, the two plate bodies 211 support the probe 22 more stably. The insulating member may be an insulating adhesive, so that the probes 22 are independent bodies, are not connected to each other, and are respectively connected to different test points for switching conduction.
Exemplarily, both ends of each plate body 211 are provided with a plurality of limiting portions 212, the fixing base 1 is provided with a plurality of limiting grooves, the plurality of limiting portions 212 correspond to the plurality of limiting grooves one to one, and each limiting portion 212 is inserted into the corresponding limiting groove.
In the above embodiment, the limiting groove has a limiting function on the limiting portion 212, so as to facilitate stable arrangement of each probe sheet 2 in the fixing base 1.
Specifically, fixing base 1 is square structure, and has quad slit 11 in the fixing base 1, and a plurality of spacing grooves are arranged respectively in quad slit 11's both sides to realize arranging of spacing groove.
It should be noted that, in the present embodiment, the top diameter of each square hole 11 is smaller than the bottom diameter.
In other embodiments of the present invention, the fixing base 1 may also have a circular structure.
Fig. 7 is a partial enlarged view of fig. 3, and as shown in fig. 7, an elastic portion 221 and a needle tail 222 are sequentially connected to one end of each probe 22, and the elastic portion 221 has an elastic structure.
In the above embodiment, the elastic portion 221 can be compressed to generate an elastic force, so as to prevent the pin tail 222 from being in hard contact with the test point of the PCB/FPC.
In this embodiment, the probe module further includes a cover plate 3, the cover plate 3 has a plurality of through holes 31, the plurality of through holes 31 correspond to the plurality of pin tails 222 one by one, and each pin tail 222 is inserted into the corresponding through hole 31 and protrudes out of the cover plate 3.
In the above embodiment, the conduction on the cover plate 3 may guide the pin tails 222, and reduce the shaking amount of the pin tails 222, so that the pin tails 222 and the test points on the PCB/FPC are completely contacted.
The invention also provides a crimping jig which comprises the probe module.
The invention also provides a crimping test device which comprises the probe module.
Fig. 8 is a flowchart of a method for manufacturing a probe module according to an embodiment of the present invention, the method for manufacturing the probe module is based on the above-mentioned probe module, and the method for manufacturing the probe module includes:
s801, preprocessing the probe panels to obtain a plurality of primary probe sheets 4, wherein each primary probe sheet 4 includes a probe sheet plate 21, a plurality of probes 22 and a connecting rib 41, and the probe sheet plate 21 and the plurality of probes 22 are connected together by the connecting rib 41 (see fig. 9 and 10).
Illustratively, the number of the connecting ribs 41 is 2, and the top and the bottom of each probe 22 are connected respectively.
S802, inserting the plurality of primary probe sheets 4 into the fixing base 1, and connecting the probe sheet plate 21 and the plurality of probes 22 in each primary probe sheet 4 together through an insulating piece.
S803, the connecting ribs 41 are ground off, and the plurality of primary probe chips 4 are processed into a plurality of probe chips 2, thereby obtaining a probe module.
In the above embodiment, the assembly of the primary probe tile 4 can be achieved by the connecting ribs 41, thereby facilitating the quick assembly of each probe 22 into the holder 1. The insulating member serves to connect and insulate the plurality of probes 22, and may also be supported by the insulating member after the bonding ribs 41 are ground away.
It should be noted that the connecting ribs 41 can communicate with each probe 22, and therefore should be ground off after assembly.
Optionally, pre-processing the plurality of probe panels to obtain a plurality of primary probe tiles 4 comprises:
a. and etching the probe panels.
b. And bending the etched probe panels to obtain a plurality of primary probe sheets 4.
In the above embodiment, the primary probe sheet 4 can be directly prepared from the probe panel by etching and bending, and the probe sheet plate 21, the plurality of probes 22 and the connecting ribs 41 are not connected by welding, so that the preparation efficiency of the primary probe sheet 4 is improved.
It should be noted that the probe panel is etched to form a gap, so that the probe sheet plate 21, the plurality of probes 22 and the connecting ribs 41 (see fig. 9) can be obtained.
In addition, the probe module of the probe 22 of the present invention adopts the etching equipment, the grinding machine and other equipment widely used in China at present for the production and processing of all the accessories, and the process is mature, so the manufacturing cost can be greatly reduced, and the production period can be shortened.
It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. The probe module is characterized by comprising a fixed seat (1) and a plurality of probe sheets (2);
the plurality of probe sheets (2) are arranged in the fixing seat (1) at intervals, each probe sheet (2) is of a Z-shaped structure, two end parts of each probe sheet (2) are arranged in two parallel planes at intervals respectively, and for the plurality of probe sheets (2), the interval between one end parts of any two adjacent probe sheets (2) is larger than the interval between the other end parts of the two probe sheets (2);
each probe piece (2) comprises a probe piece plate (21) and a plurality of probes (22), for any one probe piece (2), the probes (22) are sequentially arranged on the probe piece plate (21) at intervals, the probe piece plate (21) is inserted into the fixing seat (1), the probe piece plate (21) and the probes (22) are connected together through an insulating part, and the interval between one ends of any two adjacent probes (22) is larger than the interval between the other ends of the two probes (22).
2. The probe module as claimed in claim 1, wherein each probe sheet plate (21) comprises two plate bodies (211) arranged at intervals, the plurality of probes (22) are symmetrically arranged between the two plate bodies (211), and the two plate bodies (211) and the plurality of probes (22) are bonded together by an insulating adhesive.
3. The probe module according to claim 2, wherein two end portions of each plate body (211) are respectively provided with a limiting portion (212), the fixing base (1) is provided with a plurality of limiting grooves, the plurality of limiting portions (212) are in one-to-one correspondence with the plurality of limiting grooves, and each limiting portion (212) is inserted into the corresponding limiting groove.
4. The probe module according to claim 3, wherein the fixing base (1) has a square structure, and the fixing base (1) has a square hole (11), and a plurality of the limiting grooves are respectively disposed on two sides of the square hole (11).
5. The probe module as claimed in claim 1, wherein one end of each probe (22) is sequentially connected with an elastic part (221) and a needle tail (222), and the elastic part (221) is an elastic structure.
6. The probe module as claimed in claim 5, further comprising a cover plate (3), wherein the cover plate (3) has a plurality of through holes (31), the plurality of through holes (31) and the plurality of pin tails (222) are in one-to-one correspondence, and each pin tail (222) is inserted into the corresponding through hole (31) and arranged to protrude from the cover plate (3).
7. A crimping jig, characterized in that, the crimping jig includes the probe module set according to any one of claims 1-6.
8. A crimping test device, characterized in that the crimping test device comprises a probe module according to any one of claims 1 to 6.
9. A method for preparing a probe module according to any one of claims 1 to 6, comprising:
preprocessing a plurality of probe panels to obtain a plurality of primary probe sheets (4), wherein each primary probe sheet (4) comprises a probe sheet plate (21), a plurality of probes (22) and connecting ribs (41), and the probe sheet plate (21) and the probes (22) are connected together through the connecting ribs (41);
inserting a plurality of primary probe sheets (4) into the fixing seat (1), and connecting the probe sheet plate (21) and a plurality of probes (22) in each primary probe sheet (4) together through an insulating piece;
and grinding the connecting ribs (41), and processing a plurality of primary probe sheets (4) into a plurality of probe sheets (2) so as to obtain the probe module.
10. The method for preparing a probe module according to claim 9, wherein the pre-processing a plurality of probe panels to obtain a plurality of primary probe sheets (4) comprises:
etching a plurality of probe panels;
and bending the etched probe panels to obtain a plurality of primary probe sheets (4).
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CN202111238754.7A CN113848356B (en) | 2021-10-25 | 2021-10-25 | Probe module and preparation method thereof |
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CN202111238754.7A CN113848356B (en) | 2021-10-25 | 2021-10-25 | Probe module and preparation method thereof |
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CN113848356B CN113848356B (en) | 2024-05-03 |
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW533309B (en) * | 1999-06-22 | 2003-05-21 | Nihon Micronics Kk | Probe device |
CN2802510Y (en) * | 2003-05-08 | 2006-08-02 | 雅马哈株式会社 | Probe device |
TW200700733A (en) * | 2005-06-21 | 2007-01-01 | Kodi S Co Ltd | Flat-type probe apparatus for inspecting flat panel display device |
TWI285269B (en) * | 2005-06-21 | 2007-08-11 | Kodi S Co Ltd | Pin typed probe apparatus for inspecting FPD |
CN201203631Y (en) * | 2008-05-21 | 2009-03-04 | 安玧泰 | Probe component |
CN212622729U (en) * | 2020-08-07 | 2021-02-26 | 深圳市瑞能创新科技有限公司 | Probe fixing mechanism and test needle bed |
CN214201560U (en) * | 2021-08-19 | 2021-09-14 | 武汉精毅通电子技术有限公司 | Crimping tool and crimping testing arrangement |
CN216209350U (en) * | 2021-10-25 | 2022-04-05 | 武汉精毅通电子技术有限公司 | Probe module, crimping tool and crimping testing arrangement |
-
2021
- 2021-10-25 CN CN202111238754.7A patent/CN113848356B/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW533309B (en) * | 1999-06-22 | 2003-05-21 | Nihon Micronics Kk | Probe device |
CN2802510Y (en) * | 2003-05-08 | 2006-08-02 | 雅马哈株式会社 | Probe device |
TW200700733A (en) * | 2005-06-21 | 2007-01-01 | Kodi S Co Ltd | Flat-type probe apparatus for inspecting flat panel display device |
TWI285269B (en) * | 2005-06-21 | 2007-08-11 | Kodi S Co Ltd | Pin typed probe apparatus for inspecting FPD |
CN201203631Y (en) * | 2008-05-21 | 2009-03-04 | 安玧泰 | Probe component |
CN212622729U (en) * | 2020-08-07 | 2021-02-26 | 深圳市瑞能创新科技有限公司 | Probe fixing mechanism and test needle bed |
CN214201560U (en) * | 2021-08-19 | 2021-09-14 | 武汉精毅通电子技术有限公司 | Crimping tool and crimping testing arrangement |
CN216209350U (en) * | 2021-10-25 | 2022-04-05 | 武汉精毅通电子技术有限公司 | Probe module, crimping tool and crimping testing arrangement |
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