CN113840465B - Double-sided covering film laminating machine - Google Patents
Double-sided covering film laminating machine Download PDFInfo
- Publication number
- CN113840465B CN113840465B CN202111114737.2A CN202111114737A CN113840465B CN 113840465 B CN113840465 B CN 113840465B CN 202111114737 A CN202111114737 A CN 202111114737A CN 113840465 B CN113840465 B CN 113840465B
- Authority
- CN
- China
- Prior art keywords
- laminating
- covering film
- module
- circuit board
- modules
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000010030 laminating Methods 0.000 title claims abstract description 99
- 230000007246 mechanism Effects 0.000 claims abstract description 118
- 230000033001 locomotion Effects 0.000 claims abstract description 16
- 239000010408 film Substances 0.000 claims description 98
- 239000013039 cover film Substances 0.000 claims description 89
- 238000005520 cutting process Methods 0.000 claims description 27
- 230000000712 assembly Effects 0.000 claims description 14
- 238000000429 assembly Methods 0.000 claims description 14
- 238000001514 detection method Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 9
- 238000004804 winding Methods 0.000 claims description 2
- 230000008901 benefit Effects 0.000 abstract description 4
- 210000003128 head Anatomy 0.000 description 24
- 206010040844 Skin exfoliation Diseases 0.000 description 14
- 238000007599 discharging Methods 0.000 description 14
- 238000003475 lamination Methods 0.000 description 12
- 230000007306 turnover Effects 0.000 description 8
- 230000009286 beneficial effect Effects 0.000 description 5
- 238000003825 pressing Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 239000011324 bead Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 210000002489 tectorial membrane Anatomy 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012787 coverlay film Substances 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
本发明涉及一种双面覆盖膜贴合机，包括电路板上下料模块、两个覆盖膜供料模块和两个贴合模块，两个覆盖膜供料模块用于分别向两个贴合模块供给片状覆盖膜。贴合模块包括：贴合翻转平台，用于吸附固定电路板；翻转驱动机构，用于驱动贴合翻转平台在水平状态和竖直状态之间翻转；贴装头组件，用于从覆盖膜供料模块吸取片状覆盖膜，并将片状覆盖膜贴合到电路板上；贴合驱动机构，用于驱动贴装头组件作水平及升降运动；其中，当两个贴合模块的贴合翻转平台处于竖直状态时，电路板能够从第一个贴合模块的贴合翻转平台吸附转移至第二个贴合模块的贴合翻转平台。本发明不仅可以高效率地实现电路板的双面贴膜，而且具有设备体积小及贴合质量高的优点。
The present invention relates to a double-sided covering film laminating machine, comprising a circuit board loading and unloading module, two covering film feeding modules and two laminating modules, wherein the two covering film feeding modules are used to supply sheet covering films to the two laminating modules respectively. The laminating module comprises: a laminating flipping platform, used to adsorb and fix the circuit board; a flipping driving mechanism, used to drive the laminating flipping platform to flip between a horizontal state and a vertical state; a mounting head assembly, used to absorb the sheet covering film from the covering film feeding module and to attach the sheet covering film to the circuit board; a laminating driving mechanism, used to drive the mounting head assembly to perform horizontal and lifting movements; wherein, when the laminating flipping platforms of the two laminating modules are in a vertical state, the circuit board can be adsorbed and transferred from the laminating flipping platform of the first laminating module to the laminating flipping platform of the second laminating module. The present invention can not only efficiently realize the double-sided laminating of the circuit board, but also has the advantages of small equipment size and high laminating quality.
Description
Technical Field
The invention relates to a double-sided covering film laminating machine.
Background
In the production of circuit boards, particularly flexible circuit boards, it is often necessary to attach cover films to both surfaces thereof, which can be various films temporarily or permanently attached to the surface of a circuit board semi-finished product or finished product, such as a developed dry film, a solder resist dry film, or the like.
Existing laminating equipment for laminating double-sided laminating cover films of sheet-shaped circuit boards is generally provided with a turnover mechanism between two laminating mechanisms. The first laminating mechanism is used for laminating the covering film on the first surface of the circuit board, the turnover mechanism is used for turning over the circuit board, and the second laminating mechanism is used for laminating the covering film on the second surface of the circuit board. The prior art double-sided covering film laminating machine is complex in equipment structure, large in size and low in laminating efficiency due to the fact that a turnover mechanism is arranged between laminating mechanisms, and improvement is needed.
Disclosure of Invention
The invention mainly aims to provide a double-sided covering film laminating machine capable of efficiently realizing double-sided laminating of a circuit board.
In order to achieve the above main purpose, the invention provides a double-sided covering film laminating machine, which comprises a circuit board feeding and discharging module, two covering film feeding modules and two laminating modules, wherein the two covering film feeding modules are used for respectively feeding sheet-shaped covering films to the two laminating modules, and the laminating modules comprise:
the laminating overturning platform is used for adsorbing and fixing the circuit board;
The overturning driving mechanism is used for driving the attaching overturning platform to overturn between a horizontal state and a vertical state;
The mounting head assembly is used for sucking the sheet-shaped cover film from the cover film feeding module and attaching the sheet-shaped cover film to the circuit board;
The attaching driving mechanism is used for driving the attaching head assembly to do horizontal and lifting movements;
Wherein, laminating upset platform of two laminating modules is face-to-face under vertical state and is pressed close to or contact for the circuit board can adsorb the laminating upset platform that shifts to the laminating upset platform of second laminating module from the laminating upset platform of first laminating module.
According to the technical scheme, the overturning platform in the two attaching modules overturns between the horizontal state and the vertical state, so that the circuit board can be directly transferred and overturned between the two attaching modules, and the overturning mechanism is not required to be arranged outside the attaching mechanism as in the prior art, so that the attaching efficiency can be improved, the equipment structure is also facilitated to be simplified, the equipment volume is also facilitated to be reduced, further, the circuit board can be directly transferred between the two attaching modules, the problem that the surface of the circuit board is easy to be stained with impurities such as dust when the overturning mechanism is adopted for overturning in the prior art can be solved, and the product quality is further improved.
According to one specific embodiment of the invention, the overturning driving mechanism comprises a mounting base, a driving gear, a driven gear, a first supporting connecting rod and a second supporting connecting rod, wherein the driving gear and the driven gear are meshed with each other, the first ends of the first supporting connecting rod and the second supporting connecting rod are mutually hinged, the second end of the first supporting connecting rod is hinged with the attaching overturning platform, the second end of the second supporting connecting rod is hinged with the mounting base, the driving gear is mounted on the mounting base, the driven gear is mounted on a rotating shaft of the attaching overturning platform, and the attaching overturning platform is driven to overturn around the rotating shaft when the driving gear rotates. Wherein, upset actuating mechanism adopts gear drive, has laminating upset platform upset process steady advantage.
According to another specific embodiment of the invention, the laminating and overturning platform is provided with a rotating shaft, the overturning driving mechanism comprises a mounting base, a first connecting rod, a second connecting rod and a jacking component, the first ends of the first connecting rod and the second connecting rod are mutually hinged, the second end of the first connecting rod is hinged with the laminating and overturning platform, the second end of the second connecting rod is hinged with the mounting base, the jacking component is hinged with the middle part of the second connecting rod, and when the jacking component moves upwards, the laminating and overturning platform can be driven to overturn around the rotating shaft through the second connecting rod and the first connecting rod.
According to the technical scheme, the overturning driving mechanism adopts the connecting rod structure, so that the overturning of the attaching overturning platform between the horizontal state and the vertical state can be realized under the condition that the stroke of the jacking component is small, and the miniaturization of equipment is facilitated.
Further, the first end of the first connecting rod is provided with a force receiving part, and when the jacking component starts to drive the second connecting rod to rotate upwards, the first end of the second connecting rod upwards abuts against the force receiving part, so that the second end of the first connecting rod rotates upwards. Wherein, set up the atress portion at the first end of first connecting rod, when guaranteeing that the first end of second connecting rod begins upwards to rotate, the second end of first connecting rod will upwards rotate equally to can avoid the dead condition of card that link mechanism probably appears.
According to one specific embodiment of the invention, the laminating driving mechanism comprises a translation bracket, a translation module and a lifting module, wherein the translation module and the lifting module are arranged on the translation bracket, the translation bracket is arranged on the frame in a sliding mode along a first horizontal direction, the translation module is used for driving the lifting module to move along a second horizontal direction perpendicular to the first horizontal direction, and the mounting head assembly is connected with the lifting module and is driven by the lifting module to do lifting motion.
In the technical scheme, the laminating driving mechanism is configured to drive the mounting head assembly to move at any position in the horizontal plane, so that the laminating accuracy of the covering film is guaranteed.
Preferably, the mounting head assemblies of the two fitting modules are respectively arranged on two different translation brackets, so that the two fitting modules can operate relatively independently. Wherein, can set up the detection camera on the translation support, detect the position that the camera can be used for detecting the circuit board, realize the accurate counterpoint of tectorial membrane and circuit board, can also be used for checking the tectorial membrane laminating quality, for example inspect the bubble that probably appears after the laminating. Wherein, in the first horizontal direction, the detection camera and the mounting head assembly are preferably positioned at two opposite sides of the translation bracket, so that the movement of the mounting head assembly is not affected.
According to one specific embodiment of the invention, the cover film feeding module comprises an unreeling mechanism, a peeling mechanism, a cutting mechanism, a reeling mechanism and a cover film feeding platform, wherein the unreeling mechanism is used for supplying a film comprising a cover film and a release film, the peeling mechanism is used for peeling the cover film and the release film, the cutting mechanism is used for cutting the cover film peeled from the release film into a preset length, and the cover film feeding platform is used for adsorbing the cut flaky cover film.
In the technical scheme, the cutting mechanism cuts the cover film stripped from the release film, is favorable for guaranteeing the cutting quality of the cover film, and has relatively low requirement on the motion control precision of the cutting mechanism. In contrast, in the prior art, the cover film is usually cut (half-cut) before the cover film and the release film are peeled off, and the movement accuracy control of the cutting mechanism is extremely high, and the cover film is liable to be cut incompletely or the release film is liable to be cut off.
The film feeding mechanism comprises a film feeding path, a film feeding mechanism, a film unreeling mechanism and a film unreeling mechanism, wherein the film feeding mechanism comprises a discharging wheel, a first guide roller, a second guide roller and a self-adjusting roller, and the self-adjusting roller is arranged between the first guide roller and the second guide roller and can do free lifting movement in the unreeling process.
According to the technical scheme, the unreeling mechanism comprises the self-adjusting roller capable of freely lifting, the discharging wheel keeps a stable discharging state when the covering film is cut, the self-adjusting roller moves downwards under the action of gravity along with continuous discharging of the discharging wheel, and when the film is fed to the cutting mechanism, enough film is buffered between the first guide roller and the second guide roller, so that the film can be fed to the cutting mechanism at a feeding speed faster than the linear speed of the discharging wheel (the self-adjusting roller moves upwards at the moment), and the cutting efficiency is improved.
Further, the cover film feeding module further comprises a cover film clamping and transferring mechanism, wherein the cover film clamping and transferring mechanism is used for clamping the front end of the cover film and pulling the cover film to be cut forward. The cover film clamping and transferring mechanism can improve the flatness and cutting precision of the cover film during cutting, and is also beneficial to enabling the cut sheet-shaped cover film to be accurately adsorbed on the cover film feeding platform.
According to one embodiment of the invention, the circuit board loading and unloading module comprises a loading and unloading manipulator and at least two circuit board stacking assemblies, wherein the circuit board stacking assemblies comprise:
Drawing the tray;
The material box is arranged on the drawing tray in a removable way and is used for accommodating the circuit board, and a lifting carrier plate used for bearing the circuit board is arranged in the material box;
The jacking mechanism comprises a driving module and a jacking block connected with the driving module;
the bottom of the drawing tray and the bottom of the material box are respectively provided with an avoidance hole for the top block to pass through, and the driving module drives the top block to pass through the avoidance holes and then to prop against the lifting carrier plate.
In the technical scheme, the placement and removal of the stacked circuit boards can be realized through the mounting/removing operation of the material box, so that the placement and removal efficiency of the circuit boards is improved, and the circuit boards can be prevented from being damaged in the placement and removal process. Further, the cartridge is disposed on the drawing tray and can be moved out of the laminator along with the drawing tray, thereby facilitating the mounting/removing operation of the cartridge.
According to one specific embodiment of the invention, the two laminating modules are arranged side by side along the second horizontal direction, wherein in the first horizontal direction perpendicular to the second horizontal direction, the two circuit board stacking assemblies of the circuit board feeding and discharging modules are respectively arranged on the first sides of the two laminating modules, and the two cover film feeding modules are respectively arranged on the second sides of the two laminating modules. By the arrangement, the whole layout of the equipment is more compact and reasonable, and efficient matching can be formed among the modules.
The objects, technical solutions and advantages of the present invention will be more clearly described below, and the present invention will be further described in detail with reference to the accompanying drawings and the detailed description.
Drawings
FIG. 1 is a front view of an embodiment of a double-sided coverlay film laminator of the invention;
FIG. 2 is a perspective view of an embodiment of a double-sided coverlay laminator of the invention;
FIG. 3 is a top view of an embodiment of a double-sided coverlay laminator of the invention;
FIG. 4 is a first perspective view of embodiment 1 of the flip-over platform and flip drive mechanism with the flip-over platform in a horizontal position;
FIG. 5 is a second perspective view of embodiment 1 of the flip-over platform and flip drive mechanism with the flip-over platform in an upright position;
FIG. 6 is a front view of embodiment 1 of the flip-over platform and flip drive mechanism with the flip-over platform in an upright position;
FIG. 7 is a first perspective view of embodiment 2 of the flip-over platform and flip drive mechanism with the flip-over platform in a horizontal position;
FIG. 8 is a second perspective view of embodiment of the flip-over platform and flip drive mechanism embodiment 2 with the flip-over platform in an upright position;
FIG. 9 is a front view of embodiment 2 of the flip-over platform and flip drive mechanism with the flip-over platform in an upright position;
fig. 10 is a perspective view of a mounting head assembly and a bonding driving mechanism portion in the embodiment;
FIG. 11 is a front view of a cover film supply module in an embodiment of the invention;
FIG. 12 is a perspective view of a cover film supply module in an embodiment of the invention;
FIG. 13 is a perspective view of a portion of the peeling mechanism in an embodiment of a cover film supply module;
FIG. 14 is a perspective view of a portion of a release film clamping and transfer mechanism in an embodiment of a cover film feed module;
fig. 15 is a first structural exploded view of an embodiment of a circuit board stack assembly;
fig. 16 is a second structural exploded view of an embodiment of a circuit board stack assembly.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the application, but the application may be practiced with other variations or alternatives based upon the teachings. Therefore, other embodiments that may be known to those skilled in the art based on the described embodiments of the present application are within the scope of the present application.
As shown in fig. 1 to 3, the double-sided coverlay laminator of the embodiment of the invention includes two lamination modules 100, two coverlay feeding modules 200, a circuit board loading and unloading module 300 and a frame 400, wherein the two coverlay feeding modules 200 are used for respectively feeding sheet-shaped coverlay to the two lamination modules 100, the circuit board loading and unloading module 300 includes a loading and unloading manipulator 310 and two circuit board stacking assemblies 320, the loading and unloading manipulator 310 is used for supplying a circuit board to be laminated, which is stacked on one of the circuit board stacking assemblies 320, to one of the lamination modules 100, and stacking the circuit board, which is completed with double-sided lamination, from the other lamination module 100 to the other circuit board stacking assembly 320.
Specifically, as shown in fig. 3, the two lamination modules 100 are a first lamination module 100a and a second lamination module 100b, and the two cover film supply modules 200 are a first cover film supply module 200a and a second cover film supply module 200b, respectively. The first laminating module 100a and the second laminating module 100b are arranged side by side in the second horizontal direction Y, and in the first horizontal direction X perpendicular to the second horizontal direction Y, two circuit board stacking assemblies 320 are respectively arranged on the first sides of the first laminating module 100a and the second laminating module 100b, and the first cover film feeding module 200a and the second cover film feeding module 200b are respectively arranged on the second sides of the first laminating module 100a and the second laminating module 100b, so that the whole equipment forms a compact and reasonable layout, and efficient matching is formed among the modules.
The bonding module 100 includes a bonding flip platform 110, a flip drive mechanism 120, a head assembly 130, and a bonding drive mechanism 140. The attaching and overturning platform 110 of the two attaching and overturning modules 100 is preferably connected to two independent negative pressure generating systems so as to control the adsorption state of the two attaching and overturning platforms 110.
The flip drive mechanism 120 drives the conforming flip platform 110 to flip between a horizontal state as shown in fig. 4 and a vertical state as shown in fig. 5. The mounting head assembly 130 may attach the sucked sheet-like cover film to the circuit board while the attach flip stage 110 is in a horizontal state. When the bonding flip platforms 110 of the two bonding modules 100 are in a flipped-to-upright state, as shown in fig. 5 and 6, the two bonding flip platforms 110 are in face-to-face proximity or contact, such that the circuit board can be adsorbed and transferred from the bonding flip platform of the first bonding module to the bonding flip platform of the second bonding module. For example, when the two attaching and overturning platforms 110 are in the vertical state, the negative pressure adsorption of the first attaching and overturning platform 110a is controlled to be closed, the negative pressure adsorption of the second attaching and overturning platform 110b is opened, so that the circuit board can be directly transferred from the first attaching and overturning platform 110a to the second attaching and overturning platform 110b, and conversely, the circuit board can be adsorbed and transferred from the second attaching and overturning platform 110b to the first attaching and overturning platform 110a.
In the invention, the two attaching and overturning platforms 110 can realize the direct transfer and overturning of the circuit board between the two attaching modules 100 by overturning between the horizontal and vertical states, and an overturning mechanism is not required to be arranged outside the attaching mechanism as in the prior art, so that the attaching efficiency can be improved, the equipment structure can be simplified, the equipment volume can be reduced, and further, the circuit board can be directly transferred between the two attaching modules 100, the problem that the surface of the circuit board is easy to be stained with impurities such as dust when the overturning mechanism is adopted for overturning in the prior art can be avoided, and the product quality can be improved.
In an alternative embodiment, as shown in fig. 4 to 6, a connection part 401 is installed on the frame 400, and the conforming and overturning platform 110 has a rotation shaft 111 rotatably connected to the connection part 401. The turnover driving mechanism 120 includes a mounting base 121, a first link 122, a second link 123, a jacking member 124, and a jacking cylinder 125, first ends of the first link 122 and the second link 123 are hinged to each other, a second end of the first link 122 is hinged to the attaching turnover platform 110, a second end of the second link 123 is hinged to the mounting base 121, and the jacking member 124 is hinged to a middle portion (a position between hinge points of both ends) of the second link 123. Wherein the jacking member 124 may be connected to or formed as part of a piston rod of the jacking cylinder 125, the cylinder body of the jacking cylinder 125 may be mounted below the mounting base 121, and the piston rod passes upwardly through the mounting base 121.
When the jacking cylinder 125 drives the jacking member 124 to move upwards, the second connecting rod 123 and the first connecting rod 122 drive the laminating and overturning platform 110 to overturn from a horizontal state to a vertical state around the rotating shaft 111. Conversely, when the jacking cylinder 125 drives the jacking member 124 to move downward, the second connecting rod 123 and the first connecting rod 122 drive the laminating and overturning platform 110 to overturn from the vertical state to the horizontal state around the rotating shaft 111.
Preferably, as shown in fig. 5, a force receiving portion 1221 is disposed at a first end of the first link 122, when the jacking member 124 starts to drive the second link 123 to rotate upwards, the first end of the second link 123 abuts against the force receiving portion 1221 upwards, so that the second end of the first link 122 rotates upwards, and the link mechanism is prevented from being blocked, thereby ensuring that the attaching and overturning platform 110 overturns upwards around the rotation shaft 111. Further, a restricting portion 1222 may be provided at the first end of the first link 122, and when the bonding flip platform 110 is flipped to the vertical state, the restricting portion 1222 may abut against the second link 123 from below, so that the bonding flip platform 110 may be stably maintained in the vertical state.
In other embodiments of the present invention, other driving sources other than air cylinders may be used to drive the lifting member 124 for lifting movement, and the present invention is not limited in this regard. Further, one or more turning driving mechanisms may be disposed on each of the attaching and turning platforms 110, for example, two turning driving mechanisms 120 are disposed on each of the attaching and turning platforms 110 in the embodiment shown in fig. 4-6, so that the turning process is smoother.
In other embodiments of the present invention, one or more flip driving mechanisms may also simultaneously drive two of the bonding flip platforms 110 to flip. For example, the jacking members 124 of the two conforming inverter drives in the embodiment of fig. 4-6 may be connected to the same jacking drive source by a linkage, thereby forming an integral inverter drive mechanism to simultaneously invert the two conforming inverter platforms 110.
In the above embodiment, the overturning driving mechanism 120 adopts a link structure, so that the overturning of the attaching overturning platform 100 between the horizontal state and the vertical state can be realized under the condition that the stroke of the jacking member 124 is small, thereby being beneficial to the miniaturization of the equipment. It will be appreciated that other driving mechanisms for turning the flip platform 100 may be used, and the invention is not limited in this regard.
Fig. 7 to 9 show a tilting drive mechanism 1120 according to another embodiment of the present invention. As shown in fig. 7 to 9, the turnover driving mechanism 1120 includes a mounting base 1121, a driving gear 1122 and a driven gear 1123 which are engaged with each other, wherein the driving gear 1122 is mounted on the mounting base 1121, the driven gear 1123 is mounted on the rotating shaft 111 of the laminated turnover platform 110, the rotating shaft 111 is rotatably connected with the mounting base 1121, and the driving gear 1122 drives the laminated turnover platform 110 to turn around the rotating shaft 111 between a horizontal state as shown in fig. 7 and a vertical state as shown in fig. 8 when rotating. In this embodiment, the overturning driving mechanism 1120 adopts gear transmission, and has the advantage of stable overturning process of the attaching overturning platform 110.
In an alternative embodiment, a lifting cylinder 1124 is arranged below the mounting base 1121, a rack 1128 meshed with the driving gear 1122 is connected to a piston rod of the lifting cylinder 1124, and the lifting cylinder 1124 drives the rack 1128 to perform lifting motion, so as to drive the driving gear 1122 to rotate. In other embodiments, other driving means/mechanisms, such as a motor, may be used to drive the drive gear 1122 in rotation, as the invention is not limited in this regard, and each of the conforming flip platforms 110 may have one or more (e.g., two) flip drive mechanisms 1120.
Preferably, the tumble drive 1120 further comprises a first support link 1125 and a second support link 1126. Wherein, the first ends of first support link 1125 and second support link 1126 are articulated each other, and the second end of first support link 1125 is articulated with laminating upset platform 110, and the second end of second support link 1126 is articulated with installation base 1121 to can provide reliable support for laminating upset platform 110 in the upset process. Further, a first end of the first support link 1125 may be provided with a restricting portion 1127, and when the bonding flip platform 110 is flipped to a vertical state, the restricting portion 1127 abuts against the second support link 1126 from below, so that the bonding flip platform 110 may be stably maintained in a vertical state.
The attaching driving mechanism 140 is used for driving the mounting head assembly 130 to perform horizontal and lifting movements, so that the mounting head assembly 130 can suck the sheet-shaped cover film from the cover film feeding module 200 and attach the sheet-shaped cover film to the circuit board. Specifically, the mounting head assembly 130 of the first bonding module 100a suctions the sheet-like cover film from the first cover film supply module 200a, and the mounting head assembly 130 of the second bonding module 100b suctions the sheet-like cover film from the second cover film supply module 200 b.
In an alternative embodiment, as shown in fig. 1-3 and 10, the attaching driving mechanism 140 includes a translation bracket 141, a translation module 142 and a lifting module 143 disposed on the translation bracket 141, wherein the translation bracket 141 is disposed on a sliding rail 402 of the frame 400 and can be driven to slide along a first horizontal direction X, the translation module 142 is used for driving the lifting module 143 to move along a second horizontal direction Y, and the attaching head assembly 130 is connected with the lifting module 143 and performs lifting motion under the driving of the lifting module 143. Thus, the mounting head assembly 130 can move at any position in the horizontal plane, which is beneficial to ensuring the position accuracy of laminating the cover film.
In some embodiments of the present invention, as shown in fig. 2 and 3, the placement head assemblies 130 of two lamination modules 100 are each disposed on two different translation brackets 141. In other embodiments of the present invention, the mounting head assemblies 130 of the two bonding modules 100 may be disposed on the same translation bracket, and only two translation modules and two lifting modules need to be disposed on the translation bracket.
In the embodiment of the present invention, the structures of the translation module 142 and the lifting module 143 may be the same as those in the prior art, for example, a ball screw mechanism may be adopted, which is not described herein. The mounting head assembly 130 includes a mounting head 131 having a negative pressure suction surface and provided with a heating mechanism so as to be able to attach a sheet-like cover film to a circuit board in a heated platen manner, and a negative pressure control cylinder 132 for controlling the negative pressure suction on or off of the mounting head 131.
Further, as shown in fig. 10, the translation bracket 141 is provided with a detection camera 150, and the detection camera 150 may be a line scan camera. The detecting camera 150 can be used for detecting the position of the circuit board, realizing accurate alignment of the cover film and the circuit board, and can also be used for checking the lamination quality of the cover film, such as checking bubbles possibly occurring after lamination. Wherein, in the first horizontal direction X, the inspection camera 150 and the mounting head assembly 130 are preferably located at opposite sides of the translation bracket 141 so as not to affect the movement of the mounting head assembly 130.
Fig. 11 and 12 show the structure of the cover film feeding module 200 in the embodiment. Specifically, the cover film feeding module 200 includes an unreeling mechanism 210, a peeling mechanism 220, a cutting mechanism 230, a reeling mechanism 240 and a cover film feeding platform 250, wherein the unreeling mechanism 210 is used for supplying a film including a cover film and a release film, the cover film and the release film which are output from the unreeling mechanism 210 and are bonded together are peeled off by the peeling mechanism 220, the peeled release film is reeled by the reeling mechanism 240, the cover film is cut into a predetermined length by the cutting mechanism 230, and the cut sheet-shaped cover film is absorbed by the cover film feeding platform 250 under negative pressure.
In the above embodiment, the cutting mechanism 230 cuts the cover film peeled from the release film, which is beneficial to ensuring the cutting quality of the cover film, and has relatively low requirement on the motion control precision of the cutting mechanism 230. In contrast, in the prior art, the cover film is usually cut (half-cut) before the cover film and the release film are peeled off, and the movement accuracy control of the cutting mechanism is extremely high, and the cover film is liable to be cut incompletely or the release film is liable to be cut off.
In an alternative embodiment, the unreeling mechanism 210 comprises a discharging wheel 211 for mounting the film roll, a separating paper collecting wheel 218 for collecting separating paper in the film roll, a first guiding roller 212, a second guiding roller 213 and a self-adjusting roller 214, wherein the self-adjusting roller 214 is arranged between the first guiding roller 212 and the second guiding roller 213 on the film conveying path and can freely move up and down in the unreeling process.
Specifically, as shown in fig. 11, two ends of the self-adjusting roller 214 are respectively provided with a lifting connecting seat 215 rotatably connected with the self-adjusting roller, and the lifting connecting seats 215 are slidably arranged on the lifting guide rod 216. A gravity block may also be provided on the elevating connection base 215 as needed. As shown in fig. 12, a sensor 217 is provided at a position corresponding to the bottom dead center of the self-adjusting roller 214, and when the sensor 217 detects that the self-adjusting roller 214 moves to the bottom dead center, a discharge motor (not shown) connected to the discharge roller 214 stops operating, so that the discharge roller 211 stops discharging.
Since the self-adjusting roller 214 is freely moved up and down during unreeling, the discharging roller 211 maintains a stable discharging state while cutting the cover film, and the self-adjusting roller 214 is moved downward by gravity as the discharging roller 211 continuously discharges, and when feeding the film to the cutting mechanism 230, since enough film is buffered between the first guide roller 212 and the second guide roller 213, the film can be fed to the cutting mechanism 230 at a feeding speed faster than the linear speed of the discharging roller 211 (at this time, the self-adjusting roller 211 is moved upward), thereby improving the cutting efficiency.
In an alternative embodiment, as shown in fig. 13, the peeling mechanism 220 includes a peeling stage 221, and the front end of the peeling stage 221 forms a peeling blade 222 for peeling the cover film and the release film. A movable pressing strip 223 is arranged above the peeling platform 221, the movable pressing strip 223 is connected with a lifting cylinder 224, and when the cover film is cut, the lifting cylinder 224 drives the movable pressing strip 223 to descend so as to press the film on the peeling platform 221. Preferably, the lower surface of the movable bead 223 may be provided with an elastic pad to increase friction between the movable bead 223 and the film and to prevent the formation of an indentation on the cover film.
Further, the cover film feeding module 200 may further include a cover film clamping and transferring mechanism 260, and the cover film peeled from the release film is clamped by the cover film clamping and transferring mechanism 260 and is transferred forward along the first horizontal direction X, and then is cut into a sheet shape by the cutting mechanism 230, and is then sucked by the cover film feeding platform 250 under negative pressure. Preferably, the cover film supply platform 250 is configured to move in the first horizontal direction X to adjust the discharge position of the sheet-like cover film, so that the mounting head assembly 130 can draw the sheet-like cover film from the cover film supply platform 250.
As shown in fig. 12, the cover film clamping and transferring mechanism 260 includes a cover film clamping assembly 261 and a moving base 262 connected to two ends of the cover film clamping assembly 261, wherein a clamping cylinder 263 is disposed on the moving base 262, and the clamping cylinder 263 is used for driving the cover film clamping assembly 261 to clamp the front end of the cover film. The moving base 262 is slidably disposed on the horizontal guide rod 264 and connected to a translation module, which may include a belt connected to the moving base 262 to drive the moving base 262 to slide on the horizontal guide rod 263, so that the cover film clamping assembly 261 moves along the first horizontal direction X to pull the cover film forward. When cutting, the movable pressing strip 223 presses the film on the peeling platform 221, and the cover film clamping assembly 261 tightens the cover film, so that the evenness of the cover film can be ensured.
In other embodiments of the present invention, the cover film supply module may not have a cutting structure, but may directly use a cut cover film, for example, a roll of a cover film that is half-cut, and the typical structure of the cover film supply module may refer to a film supply commonly used in the prior art.
In an alternative embodiment, as shown in fig. 11, the winding mechanism 240 includes a receiving roller 241, a third guiding roller 242, and a fourth guiding roller 243, and the release film peeled from the cover film is wound up by the receiving roller 241 after bypassing the third guiding roller 242 and the fourth guiding roller 243. Further, a release film sandwiching transfer mechanism 270 may be provided between the third guide roller 242 and the fourth guide roller 243.
As shown in fig. 14, the release film clamping and transferring mechanism 270 includes an upper clamping bar 272 disposed above the release film, a lower clamping bar 271 disposed below the release film, and a clamping cylinder 273 mounted at the end of the lower clamping bar 271, wherein the upper clamping bar 272 is connected with the clamping cylinder 273, and the clamping cylinder 273 can drive the upper clamping bar 272 to move downward to clamp the release film. The lower clamping bar 271 is connected to a translation module that drives the release film clamping and transferring mechanism 270 to move along the first horizontal direction X, thereby realizing clamping and transferring of the release film.
Fig. 15 and 16 show the structure of the circuit board stack assembly 320. As shown in fig. 15 and 16, the circuit board stack assembly 320 includes a rail assembly 321, a drawing tray 322, a magazine 323, and a jacking mechanism 324. Wherein, the drawing tray 322 is slidably disposed on the rail assembly 321, and the magazine 323 is removably disposed on the drawing tray 322 and is moved out of the laminator along with the drawing tray 322, thereby facilitating the mounting/removing operation of the magazine 323. Through the mounting/removing operation of the magazine 323, the overall placement and removal of the stacked circuit boards can be realized, which is not only beneficial to improving the placement and removal efficiency of the circuit boards, but also can avoid the damage of the circuit boards caused by the placement and removal process.
Specifically, as shown in fig. 15, the track assembly 321 includes a track base plate 3211 and two side-by-side sliding rails 3212, where the sliding rails 3212 are mounted above the track base plate 3211 by support columns 3213. The drawing tray 322 includes a tray bottom plate 3221, tray side plates 3222 connected to the left and right sides of the tray bottom plate 3221, and a drawing plate 3223 connected to the rear end of the tray bottom plate 3221, wherein the tray bottom plate 3221 is slidably connected to the slide rail 3212. In use, an operator may push/pull the pull tray 322 into/out of the laminator by pushing/pulling the pull plate 3223.
The magazine 323 is for accommodating circuit boards. The material box 323 is provided with a lifting carrier plate 3235, and the circuit boards are stacked and supported on the lifting carrier plate 3235. In an alternative embodiment, the cartridge 323 includes a cartridge bottom plate 3231 and cartridge side plates 3232 connected to left and right sides of the cartridge bottom plate 3231, and the front ends of the two cartridge side plates 3232 are connected by a front baffle 3233 and the rear ends are connected by a rear baffle 3234.
As shown in fig. 16, the rear end of the drawing tray 322 has a guide plate 3224 provided obliquely, the guide plate 3224 being for guiding the magazine 323 to move forward to a predetermined position on the drawing tray 322. The front end of the tray bottom plate 3221 has a limit slot 3225, the front end of the cartridge bottom plate 3231 has a limited portion 3236, and after the cartridge 323 moves forward to a predetermined position on the drawing tray 322, the limited portion 3236 is inserted into the limit slot 3225 to limit the position of the cartridge 323 on the drawing tray 322.
Further, the tray bottom plate 3221 includes a first plate body, and first bending portions 3226 are disposed on left and right sides of the first plate body and are recessed downward, so as to enhance structural strength of the drawing tray 322, where the first bending portions 3226 are slidably connected with the sliding rails 3212. The cartridge bottom plate 3231 includes a second plate body, and both the left and right sides of the second plate body are provided with second bent portions 3237 recessed downward to enhance the structural strength of the cartridge 323. After the magazine 323 is mounted to the drawing tray 322, the second folded portion 3237 is disposed within the first folded portion 3226 and is carried by the first folded portion 3226. Preferably, the first plate body and the second plate body are disposed at intervals, so that the contact area and friction force between the cartridge bottom plate 3231 and the tray bottom plate 3221 when the cartridge 323 is mounted/removed are reduced, and the mounting/removing operation of the cartridge 323 is facilitated.
The lifting mechanism 324 is used for adjusting the height of the lifting carrier plate 3235 arranged in the magazine 323, so that the lifting carrier plate 3235 is lifted up/down to a position convenient for the up-down manipulator 310 to pick up/put a circuit board. The jacking mechanism 324 includes a driving module 3242 and a top block 3241 connected to the driving module 3242, where the tray bottom plate 3221 and the cartridge bottom plate 3231 have an avoidance hole (for example, the avoidance hole 3227 on the tray bottom plate 3221 shown in fig. 15) through which the top block 3241 passes, and the driving module 3242 drives the top block 3241 to pass through the avoidance hole and then abut against the lifting carrier plate 3235. The number of the top blocks 3241 may be one or more, for example, two as shown in fig. 15 and 16, so as to improve the lifting stability of the lifting carrier plate 3235.
Further, the circuit board stack assembly 320 may configure a correlation photosensor 3251 that detects the circuit board stack height. In an alternative embodiment, as shown in fig. 15, each of the left and right sides of the track assembly 321 has a detection support plate 3252, the detection support plates 3252 are vertically mounted on the track base plate 3211, the emitting end and the receiving end of the opposite-type photoelectric sensor 3251 are oppositely disposed at the upper ends of the two detection support plates 3252, and the middle part of the upper end of the cartridge side plate 3232 may have a detection port 3238 for passing detection light.
In the embodiment of the present invention, one of the two circuit board stacking assemblies 320 is used as a feeding device for stacking circuit boards to be film-pasted, and the other is used as a receiving device for stacking circuit boards with double-sided film pasting. When the film laminating machine is used as a material receiving device, the lifting carrier plate 3235 is lifted to a height suitable for the upper and lower manipulators 310 to stack the film laminated circuit boards thereon, and then gradually descends to stack the film laminated circuit boards sequentially.
As shown in fig. 2-3, the loading and unloading manipulator 310 is slidably disposed on a sliding rail 402 of the rack 400, and is used for adsorbing and supplying the circuit board to be laminated stacked on one of the circuit board stacking assemblies 320 to one of the laminating and overturning platforms 110 (circuit board loading), and stacking the circuit board with double-sided lamination completed on the other laminating and overturning platform 110 to the other circuit board stacking assembly 320 (circuit board unloading). The same manipulator is used for realizing the loading and unloading operation of the circuit board, and the device structure is facilitated to be simplified.
It is easy to understand that the double-sided cover film laminating machine of the present invention may also use other circuit board loading and unloading modules, for example, the loading and unloading operations of the circuit board may also be performed by two manipulators, which is not limited in this invention.
Although the invention has been described with reference to the above embodiments, it will be understood by those skilled in the art that equivalent modifications to those according to the invention are intended to be covered by the scope of the invention without departing from the scope of the invention.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111114737.2A CN113840465B (en) | 2021-09-23 | 2021-09-23 | Double-sided covering film laminating machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111114737.2A CN113840465B (en) | 2021-09-23 | 2021-09-23 | Double-sided covering film laminating machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113840465A CN113840465A (en) | 2021-12-24 |
| CN113840465B true CN113840465B (en) | 2025-02-07 |
Family
ID=78969323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111114737.2A Active CN113840465B (en) | 2021-09-23 | 2021-09-23 | Double-sided covering film laminating machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113840465B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118139309B (en) * | 2024-04-16 | 2025-03-07 | 深圳市恒力天科技有限公司 | Automatic film sticking machine and film sticking method based on negative pressure suction |
| CN118870686B (en) * | 2024-09-24 | 2025-02-11 | 深圳市邦正精密机械股份有限公司 | Full-automatic double-sided covering film laminating machine |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109515878A (en) * | 2019-01-16 | 2019-03-26 | 深圳市诺峰光电设备有限公司 | A kind of two-sided automatic film applicator of list and its film coating process |
| CN110817434A (en) * | 2019-11-25 | 2020-02-21 | 广州市心鉴智控科技有限公司 | Watch lens turnover device |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012227194A (en) * | 2011-04-15 | 2012-11-15 | Hitachi High-Technologies Corp | Fpd module assembly device and time recognition method |
| CN202480518U (en) * | 2012-02-22 | 2012-10-10 | 周俊雄 | Automatic film sticking machine for flexible-packaging lithium batteries |
| CN106304650B (en) * | 2016-09-14 | 2019-07-19 | 广东思沃精密机械有限公司 | Laminator |
| CN106428744B (en) * | 2016-10-26 | 2020-02-21 | 江苏比微曼智能科技有限公司 | Automatic film pasting mechanism and method |
| CN107351372B (en) * | 2017-08-08 | 2019-09-13 | 吴良盛 | A kind of automatic film covering make-up machine |
| CN212910235U (en) * | 2020-03-16 | 2021-04-06 | 珠海奇川精密设备有限公司 | Full-automatic two-sided laminating equipment |
| CN213117007U (en) * | 2020-06-19 | 2021-05-04 | 天津市鼎泰昊铝制品有限公司 | Automatic numerical control of turn-over closes and pastes lathe |
| CN113247351A (en) * | 2021-06-15 | 2021-08-13 | 郑少华 | Screen glass film pasting overturning device and method and film pasting equipment |
-
2021
- 2021-09-23 CN CN202111114737.2A patent/CN113840465B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109515878A (en) * | 2019-01-16 | 2019-03-26 | 深圳市诺峰光电设备有限公司 | A kind of two-sided automatic film applicator of list and its film coating process |
| CN110817434A (en) * | 2019-11-25 | 2020-02-21 | 广州市心鉴智控科技有限公司 | Watch lens turnover device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113840465A (en) | 2021-12-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109514969B (en) | Automatic soft-to-soft flexible laminating machine and laminating process thereof | |
| CN113772383B (en) | Double-sided film pasting equipment and method | |
| CN109533455B (en) | Two-in-one linkage film pasting production line and production process thereof | |
| CN113840465B (en) | Double-sided covering film laminating machine | |
| KR101933298B1 (en) | Adhesive sheet attaching apparatus for adhesive film | |
| CN209633979U (en) | An automatic soft-to-soft flexible laminating machine | |
| CN112040647B (en) | A film laminating machine | |
| CN211195251U (en) | Full-automatic net cage laminating machine | |
| CN116413935A (en) | Display screen processing production line | |
| CN112421084A (en) | Lamination device for membrane electrodes | |
| CN114093267B (en) | A fully automatic special-shaped polarizer laminating machine and laminating process thereof | |
| JP2005289522A (en) | Slip sheet discharge device | |
| CN108557495B (en) | PCB board feeding machine | |
| CN213936280U (en) | Laminating device for membrane electrode | |
| CN117979677A (en) | FPC auxiliary material attaching machine | |
| CN112193873A (en) | Material stripping device and feeding and discharging equipment | |
| CN218368534U (en) | Film pasting mechanism and automatic film pasting device | |
| CN115180262B (en) | Flexible side pasting mechanism for backlight LED lamp strip glue of vehicle-mounted display screen | |
| CN116477113A (en) | Automatic film laminating equipment | |
| CN213707152U (en) | Material stripping device and feeding and discharging equipment | |
| CN213560984U (en) | Feeding and discharging equipment | |
| CN115490074A (en) | A kind of FPC automatic board machine | |
| CN114161810A (en) | High-efficient automatic dyestripping machine | |
| CN210260608U (en) | Cover membrane reinforcement machine | |
| CN116408964B (en) | Wireless earphone charging box iron sheet and protective film assembly machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |