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CN113811122B - Housing, preparation method and electronic device - Google Patents

Housing, preparation method and electronic device Download PDF

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Publication number
CN113811122B
CN113811122B CN202111094425.XA CN202111094425A CN113811122B CN 113811122 B CN113811122 B CN 113811122B CN 202111094425 A CN202111094425 A CN 202111094425A CN 113811122 B CN113811122 B CN 113811122B
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China
Prior art keywords
sub
mold
thickness
main body
side part
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CN202111094425.XA
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CN113811122A (en
Inventor
韩泽
左州全
邱惊龙
张涛
吴磊
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Priority to CN202111094425.XA priority Critical patent/CN113811122B/en
Publication of CN113811122A publication Critical patent/CN113811122A/en
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0217Mechanical details of casings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C49/00Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
    • B29C49/42Component parts, details or accessories; Auxiliary operations
    • B29C49/48Moulds
    • B29C49/4823Moulds with incorporated heating or cooling means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C49/00Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
    • B29C49/42Component parts, details or accessories; Auxiliary operations
    • B29C49/48Moulds
    • B29C49/4823Moulds with incorporated heating or cooling means
    • B29C2049/4825Moulds with incorporated heating or cooling means for cooling moulds or mould parts

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

The application provides a shell, a preparation method thereof and electronic equipment. The housing of the present application includes a body portion including a first surface; and the side part is arranged around the outer periphery of the main body part, the side part is connected with the main body part in a bending way and is of an integral structure, the main body part and the side part enclose into a containing space, the first surface faces the containing space, the side part comprises a second surface, the second surface surrounds the containing space, and the angle between the first surface and the second surface ranges from 40 degrees to 90 degrees. The shell of the application can integrate the front cover with the middle frame or the rear cover with the middle frame when being applied to electronic equipment.

Description

壳体、其制备方法及电子设备Housing, preparation method and electronic device

技术领域Technical field

本申请涉及电子领域,具体涉及一种壳体、其制备方法及电子设备。The present application relates to the field of electronics, and specifically to a housing, its preparation method and electronic equipment.

背景技术Background technique

随着技术的发展及生活水平的提高,人们对于电子设备的外观视觉效果提出了更高的要求,当前电子设备的壳体(例如玻璃前盖或玻璃后盖)的难以做到弯折角度超过90°的大角度弯折,因此,电子设备的前盖、中框及后盖通常是分开制备,在组装到一起,难以做到将前盖与中框,或后盖与中框做到一体化。With the development of technology and the improvement of living standards, people have put forward higher requirements for the appearance and visual effects of electronic equipment. Currently, it is difficult for the casing of electronic equipment (such as glass front cover or glass back cover) to bend at an angle exceeding Bending at a large angle of 90°, therefore, the front cover, middle frame and back cover of electronic equipment are usually prepared separately. When assembled together, it is difficult to integrate the front cover and middle frame, or the back cover and middle frame. change.

发明内容Contents of the invention

针对上述问题,本申请实施例提供一种壳体,其应用于电子设备时,可以将前盖与中框或后盖与中框一体化。To address the above problems, embodiments of the present application provide a housing that, when used in electronic equipment, can integrate the front cover and the middle frame or the back cover and the middle frame.

本申请实施例提供了一种壳体,其包括:The embodiment of the present application provides a housing, which includes:

主体部,所述主体部包括第一表面;以及a body portion including a first surface; and

侧部,所述侧部环绕所述主体部的外周缘设置,所述侧部与所述主体部弯折相连且为一体结构,所述主体部与所述侧部围合成容置空间,所述第一表面面向所述容置空间,所述侧部包括第二表面,所述第二表面环绕所述容置空间,所述第一表面与所述第二表面之间的角度的范围为40°至90°。The side portion is arranged around the outer periphery of the main body portion. The side portion is bent and connected with the main body portion and is an integral structure. The main body portion and the side portion enclose an accommodation space. The first surface faces the accommodation space, the side portion includes a second surface, the second surface surrounds the accommodation space, and the angle between the first surface and the second surface ranges from 40° to 90°.

此外,本申请实施例还提供了一种壳体的制备方法,其包括:In addition, the embodiment of the present application also provides a method for preparing a shell, which includes:

制备胚体,所述胚体具有通孔;以及Preparing an embryo body, the embryo body having through holes; and

将所述胚体设置于吹塑模具中,在所述通孔中通入气体,进行吹塑成型,以使所述胚体形成弯折相连且为一体结构的主体部及侧部,所述主体部包括第一表面;所述侧部环绕所述主体部的外周缘设置,所述主体部与所述侧部围合成容置空间,所述第一表面面向所述容置空间,所述侧部包括第二表面,所述第二表面环绕所述容置空间,所述第一表面与所述第二表面之间的角度的范围为40°至90°,从而得到所述壳体。The embryo body is placed in a blow mold, gas is introduced into the through hole, and blow molding is performed, so that the embryo body forms a main body and side parts that are bent and connected and have an integrated structure. The main body part includes a first surface; the side part is arranged around the outer periphery of the main body part, the main body part and the side part enclose an accommodation space, the first surface faces the accommodation space, and the The side portion includes a second surface surrounding the accommodation space, and an angle between the first surface and the second surface ranges from 40° to 90°, thereby obtaining the housing.

此外,本申请还实施例提供一种电子设备,其包括:In addition, an embodiment of this application provides an electronic device, which includes:

显示组件,用于显示;Display component, used for display;

本申请实施例所述的壳体,所述壳体具有容置空间,所述壳体用于承载所述显示组件;以及The housing according to the embodiment of the present application, the housing has an accommodation space, and the housing is used to carry the display component; and

电路板组件,所述电路板组件设置于所述容置空间,且与所述显示组件电连接,用于控制所述显示组件进行显示。A circuit board assembly is provided in the accommodation space and is electrically connected to the display assembly for controlling the display assembly to display.

本申请实施例壳体的主体部的第一表面与侧部的第二表面之间的角度的范围为40°至90°,作为电子设备的前盖或后盖时,可以与中框一体化设计,前盖与中框一体化设计或者后盖与中框一体化设计,且使用时,壳体与后盖、或壳体与前盖之间不存在间隙,这样可以使得电子设备的外观更为美观,密封性及防水性能更好。此外,当前盖与中框一体化设计时,还可以使电子设备可以应用于侧面屏幕显示。The angle between the first surface of the main part and the second surface of the side part of the case of the embodiment of the present application ranges from 40° to 90°. When used as a front cover or a back cover of an electronic device, it can be integrated with the middle frame. design, the front cover and the middle frame are integrated, or the back cover and the middle frame are integrated, and when used, there is no gap between the shell and the back cover, or the shell and the front cover, which can make the appearance of the electronic device more beautiful. For aesthetics, better sealing and waterproof performance. In addition, when the front cover and the middle frame are integrated, electronic devices can also be used for side screen display.

附图说明Description of the drawings

为了更清楚地说明本申请实施例的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without exerting creative efforts.

图1是本申请一实施例的壳体的俯视结构示意图。Figure 1 is a schematic top structural view of a housing according to an embodiment of the present application.

图2是本申请一实施例的壳体沿图1中A-A方向的剖视图。FIG. 2 is a cross-sectional view of the housing along the direction A-A in FIG. 1 according to an embodiment of the present application.

图3是本申请又一实施例的壳体沿图1中A-A方向的剖视图。FIG. 3 is a cross-sectional view of the housing along the direction A-A in FIG. 1 according to another embodiment of the present application.

图4是本申请又一实施例的壳体的俯视结构示意图。Figure 4 is a schematic top structural view of a housing according to yet another embodiment of the present application.

图5是本申请图1实施例的壳体沿A-A方向的剖视图(a)及沿B-B方向的剖视图(b)。FIG. 5 is a cross-sectional view (a) along the A-A direction and a cross-sectional view (b) along the B-B direction of the housing of the embodiment of FIG. 1 of the present application.

图6是本申请又一实施例的壳体的俯视结构示意图。Figure 6 is a schematic top structural view of a housing according to yet another embodiment of the present application.

图7是本申请图6实施例的壳体沿A-A方向的剖视图(a)及沿B-B方向的剖视图(b)。FIG. 7 is a cross-sectional view (a) along the A-A direction and a cross-sectional view (b) along the B-B direction of the housing of the embodiment of FIG. 6 of the present application.

图8是本申请又一实施例的壳体沿图1中A-A方向的局部剖视图。FIG. 8 is a partial cross-sectional view of the housing along the direction A-A in FIG. 1 according to another embodiment of the present application.

图9是本申请又一实施例的壳体沿图1中A-A方向的局部剖视图。FIG. 9 is a partial cross-sectional view of the housing along the direction A-A in FIG. 1 according to yet another embodiment of the present application.

图10是本申请一实施例的壳体的制备方法的流程示意图。FIG. 10 is a schematic flowchart of a method for manufacturing a casing according to an embodiment of the present application.

图11是本申请一实施例的胚体的结构示意图。Figure 11 is a schematic structural diagram of an embryonic body according to an embodiment of the present application.

图12是本申请又一实施例的胚体的结构示意图。Figure 12 is a schematic structural diagram of an embryo body according to another embodiment of the present application.

图13是本申请图12实施例中C-C方向的剖视图。Figure 13 is a cross-sectional view along the C-C direction in the embodiment of Figure 12 of the present application.

图14是本申请一实施例的壳体的制备方法制得的回转体外壳。Figure 14 is a rotary body shell produced by a shell preparation method according to an embodiment of the present application.

图15是本申请一实施例的吹塑模具的结构示意图。Figure 15 is a schematic structural diagram of a blow mold according to an embodiment of the present application.

图16是本申请一实施例的胚体设置于吹塑模具时的结构示意图。Figure 16 is a schematic structural diagram of the embryo body being placed in a blow mold according to an embodiment of the present application.

图17是本申请一实施例的第一子模或第二子模沿图16中D-D方向的剖视结构示意图。Figure 17 is a schematic cross-sectional structural diagram of the first sub-mold or the second sub-mold along the D-D direction in Figure 16 according to an embodiment of the present application.

图18是本申请又一实施例的壳体的制备方法的流程示意图。Figure 18 is a schematic flowchart of a method for manufacturing a casing according to another embodiment of the present application.

图19是本申请实施例的电子设备的结构示意图。Figure 19 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

图20是本申请实施例的电子设备的部分爆炸结构示意图。Figure 20 is a schematic diagram of a partially exploded structure of an electronic device according to an embodiment of the present application.

图21是本申请实施例的电子设备的电路框图。Figure 21 is a circuit block diagram of an electronic device according to an embodiment of the present application.

附图标记说明:Explanation of reference symbols:

100-壳体 1301-弯曲部100-Housing 1301-Bending part

101-容置空间 1303-平直部101-accommodation space 1303-straight part

10-壳体本体 30-第一遮光部10-Casing body 30-First light shielding part

11-主体部 50-装饰部11-Main part 50-Decoration part

111-第一表面 70-第二遮光部111-First surface 70-Second light shielding part

113-第三表面 300-胚体113-Third surface 300-Embryo body

13-侧部 301-通孔13-Side 301-Through hole

131-第二表面 310-第一部131-Second Surface 310-Part One

133-弯曲面 311-第一子部133-Curved Surface 311-First Subpart

135-端面 312-第二子部135-End face 312-Second subpart

137-第四表面 313-第三子部137-Fourth Surface 313-Third Subpart

139-弧面 314-第四子部139-Curved surface 314-Fourth subpart

132-第一子侧部 330-第二部132-The first sub-side 330-The second part

134-第二子侧部 331-第五子部134-Second sub-side 331-Fifth sub-part

136-第三子侧部 332-第六子部136-Third sub-side 332-Sixth sub-part

138-第四子侧部 330’-筒体138-Fourth side 330’-cylinder

400-吹塑模具 430-第二子模400-Blow mold 430-Second sub-mold

401-模腔 431-第二模面401-Mold cavity 431-Second mold surface

403-冷却通道 600-电子设备403-Cooling channel 600-Electronic equipment

410-第一子模 610-显示组件410-First sub-mold 610-Display component

411-第一模面 630-电路板组件411-First mold surface 630-Circuit board assembly

4111-第一子模面 631-处理器4111-First sub-mold surface 631-Processor

4112-第二子模面 633-存储器4112-Second sub-mold surface 633-Memory

4113-第三子模面4113-The third sub-mold surface

具体实施方式Detailed ways

为了使本技术领域的人员更好地理解本申请方案,下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。In order to enable those in the technical field to better understand the solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only These are part of the embodiments of this application, but not all of them. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.

本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别不同对象,而不是用于描述特定顺序。此外,术语“包括”和“具有”以及它们任何变形,意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、系统、产品或设备没有限定于已列出的步骤或单元,而是可选地还包括没有列出的步骤或单元,或可选地还包括对于这些过程、方法、产品或设备固有的其他步骤或单元。The terms "first", "second", etc. in the description and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than describing a specific sequence. Furthermore, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes Other steps or units inherent to such processes, methods, products or devices.

下面将结合附图,对本申请实施例中的技术方案进行描述。The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

需要说明的是,为便于说明,在本申请的实施例中,相同的附图标记表示相同的部件,并且为了简洁,在不同实施例中,省略对相同部件的详细说明。It should be noted that, for convenience of description, in the embodiments of the present application, the same reference numerals represent the same components, and for the sake of simplicity, detailed descriptions of the same components in different embodiments are omitted.

相关技术中,当电子设备需要制备3D结构的壳体(即四周都弯折的壳体,例如前盖、后盖)时,通常采用热弯成型的方式形成具有3D结构的壳体。然而,热弯成型采用凹模和凸模压合壳体基材,将壳体基材弯折成具有一定弯折角度的壳体,为了使热弯后,凹模和凸模能够顺利脱模,凹模和凸模的平面部及弯折部的角度必需小于或等于90°,这样使得制得的壳体的弯折角度无法达到设置超过90°(即平面部与弯折部的角度大于90°,无法实现小于90°或者说倒扣角),目前即使凹模和凸模的平面部及弯折部的角度设置为90°,制得的壳体的弯折角度的极限值也只能达到88°。因此,难以应用于前盖与中框一体或中框与后盖一体的情形,即使将采用热弯成型制得前盖与中框一体或中框与后盖一体的壳体,应用于电子设备时,壳体与后盖、或壳体与前盖之间存在间隙,影响电子设备的美观,且影响整机的密封性和防水性。In the related art, when an electronic device needs to prepare a casing with a 3D structure (that is, a casing that is bent on all sides, such as a front cover and a back cover), hot bending molding is usually used to form the casing with a 3D structure. However, hot bending uses a concave mold and a convex mold to press the shell base material, and bend the casing base material into a shell with a certain bending angle. In order to enable the concave mold and the convex mold to be smoothly demoulded after hot bending, The angle between the flat part and the bent part of the female mold and the punch must be less than or equal to 90°, so that the bending angle of the produced shell cannot exceed 90° (that is, the angle between the flat part and the bent part is greater than 90° °, it is impossible to achieve an undercut angle less than 90°). Currently, even if the angle between the flat part and the bending part of the concave mold and the punch is set to 90°, the limit value of the bending angle of the produced shell can only be reaches 88°. Therefore, it is difficult to apply the case where the front cover and the middle frame are integrated or the middle frame and the back cover are integrated. Even if the front cover and the middle frame are integrated or the middle frame and the back cover are integrated by hot bending, it can be used in electronic equipment. When the electronic device is installed, there is a gap between the casing and the back cover, or the casing and the front cover, which affects the appearance of the electronic device and affects the sealing and waterproofness of the entire machine.

请参见图1至图3,本申请实施例提供了一种壳体100,其包括:主体部11以及侧部13,所述主体部11包括第一表面111,所述侧部13环绕所述主体部11的外周缘设置,所述侧部13与所述主体部11弯折相连且为一体结构,所述主体部11与所述侧部13围合成容置空间101,所述第一表面111面向所述容置空间101,所述侧部13包括第二表面131,所述第二表面131环绕所述容置空间101,所述第一表面111与所述第二表面131之间的角度α(如图2所示)的范围为40°至90°。Referring to Figures 1 to 3, an embodiment of the present application provides a housing 100, which includes: a main body 11 and a side portion 13. The main body 11 includes a first surface 111, and the side portion 13 surrounds the The outer periphery of the main body 11 is provided. The side portion 13 is bent and connected to the main body 11 and forms an integrated structure. The main body 11 and the side portion 13 enclose a receiving space 101. The first surface 111 faces the accommodation space 101, the side portion 13 includes a second surface 131, the second surface 131 surrounds the accommodation space 101, and the distance between the first surface 111 and the second surface 131 is The angle α (shown in Figure 2) ranges from 40° to 90°.

应该理解的是,所述第一表面111与所述第二表面131之间的角度α可以为40°至90°之间的任意数值,具体地,可以为但不限于为40°、45°、50°、55°、60°、65°、70°、75°、80°、85°、90°等。当第一表面111与第二表面131之间的角度α小于40°时,当壳体100应用于电子设备时,会增加壳体100组装工艺的难度。It should be understood that the angle α between the first surface 111 and the second surface 131 can be any value between 40° and 90°. Specifically, it can be, but is not limited to, 40° or 45°. , 50°, 55°, 60°, 65°, 70°, 75°, 80°, 85°, 90°, etc. When the angle α between the first surface 111 and the second surface 131 is less than 40°, when the housing 100 is applied to electronic equipment, the difficulty of the assembly process of the housing 100 will be increased.

需要说明的是,所述第一表面111与所述第二表面131之间的角度α的范围为40°至90°可以理解为第二表面131相较于第一表面111的弯折角度为90°至140°。所述第一表面111与所述第二表面131之间的角度α指的是垂直于第一表面111的平面与第一表面111及第二表面131的相交线之间的角度。It should be noted that the angle α between the first surface 111 and the second surface 131 ranges from 40° to 90°, which can be understood as the bending angle of the second surface 131 compared to the first surface 111 is 90° to 140°. The angle α between the first surface 111 and the second surface 131 refers to the angle between a plane perpendicular to the first surface 111 and the intersection line of the first surface 111 and the second surface 131 .

需要说明的是,侧部13与主体部11为一体结构可以为侧部13与主体部11在同一制程中形成;或者侧部13与主体部11在同一步骤中形成;或者侧部13与主体部11之间不具有相界面。It should be noted that the side part 13 and the main part 11 have an integrated structure. The side part 13 and the main part 11 may be formed in the same process; or the side part 13 and the main part 11 may be formed in the same step; or the side part 13 and the main part 11 may be formed in the same process. There is no phase interface between the parts 11 .

本申请的壳体100可以应用于手机、平板电脑笔记本电脑、台式电脑、智能手环、智能手表、电子阅读器、游戏机等便携式电子设备。可选地,本申请实施例的壳体100为3D结构。本申请实施例的壳体100的主体部11可以作为电子设备的前盖或后盖,侧部13可以作为电子设备的中框。The housing 100 of the present application can be applied to portable electronic devices such as mobile phones, tablets, laptops, desktop computers, smart bracelets, smart watches, e-readers, and game consoles. Optionally, the housing 100 in the embodiment of the present application has a 3D structure. The main part 11 of the housing 100 in the embodiment of the present application can be used as the front cover or the back cover of the electronic device, and the side part 13 can be used as the middle frame of the electronic device.

本申请实施例壳体100的主体部11的第一表面111与侧部13的第二表面131之间的角度的范围为40°至90°,作为电子设备的前盖或后盖时,可以与中框一体化设计,前盖与中框一体化设计或者后盖与中框一体化设计,且使用时,壳体100与后盖、或壳体100与前盖之间不存在间隙,这样可以使得电子设备的外观更为美观,密封性及防水性能更好。此外,当前盖与中框一体化设计时,还可以使电子设备可以应用于侧面屏幕显示。In the embodiment of the present application, the angle between the first surface 111 of the main body 11 and the second surface 131 of the side part 13 of the housing 100 ranges from 40° to 90°. When used as a front cover or a back cover of an electronic device, it can be Integrated design with the middle frame, front cover and middle frame, or back cover and middle frame, and when in use, there is no gap between the housing 100 and the back cover, or the housing 100 and the front cover, so It can make the appearance of electronic equipment more beautiful, with better sealing and waterproof performance. In addition, when the front cover and the middle frame are integrated, electronic devices can also be used for side screen display.

在一些实施例中,壳体100的材质可以为但不限于为无机玻璃或树脂中的一种或多种。可选地,树脂可以为聚甲基丙烯酸甲酯(PMMA)、聚碳酸酯(PC)、聚对苯二甲酸乙二醇酯(PET)等中的一种或多种。可选地,壳体100是透光的,壳体100的透光率可以大于或等于85%,进一步地,壳体100的透光率可以大于或等于90%;具体地,壳体100的透光率可以为但不限于为85%、88%、90%、93%、95%、97%、98%、99%等。当壳体100应用于电子设备的前盖及中框时,壳体100的透光率越高越好,透光率越高,电子设备的显示效果越好。In some embodiments, the material of the housing 100 may be, but is not limited to, one or more of inorganic glass or resin. Alternatively, the resin may be one or more of polymethylmethacrylate (PMMA), polycarbonate (PC), polyethylene terephthalate (PET), and the like. Optionally, the housing 100 is light-transmissive, and the light transmittance of the housing 100 can be greater than or equal to 85%. Further, the light transmittance of the housing 100 can be greater than or equal to 90%; specifically, the light transmittance of the housing 100 can be greater than or equal to 90%. The light transmittance may be, but is not limited to, 85%, 88%, 90%, 93%, 95%, 97%, 98%, 99%, etc. When the housing 100 is applied to the front cover and middle frame of an electronic device, the higher the light transmittance of the housing 100, the better. The higher the light transmittance, the better the display effect of the electronic device.

可选地,所述壳体100为吹塑成型的壳体,换言之,所述壳体100是通过先将制备壳体100的材料例如无机玻璃板等进行熔融挤出制得胚体300后,再对所述胚体300进行吹塑成型制得的。可以理解,所述主体部11及所述侧部13均通过在胚体300上进行吹塑成型得到。关于壳体100的制备方法,下文会通过具体的实施例进行详细描述。Optionally, the housing 100 is a blow-molded housing. In other words, the housing 100 is made by first melting and extruding the material for preparing the housing 100, such as an inorganic glass plate, to obtain the embryonic body 300. The embryo body 300 is then blow molded. It can be understood that the main body part 11 and the side part 13 are both obtained by blow molding on the embryo body 300 . The preparation method of the housing 100 will be described in detail below through specific embodiments.

请再次参见图2和图3,在一些实施例中,所述主体部11还包括第三表面113,所述第三表面113与所述第一表面111相背设置。所述主体部11厚度均匀,所述主体部11的厚度为0.3mm至1mm;换言之,所述第一表面111与所述第三表面113平行,所述第一表面111与所述第三表面113之间的垂直距离为0.3mm至1mm。具体地,主体部11的厚度可以为但不限于为0.3mm、0.4mm、0.5mm、0.6mm、0.7mm、0.8mm、0.9mm、1mm等。当主体部11太薄时,不能很好的起到支撑和保护作用,且机械强度不能很好的满足电子设备壳体100的要求,当主体部11的太厚时,则增加电子设备的重量,影响电子设备的手感,用户体验不好。Please refer to FIG. 2 and FIG. 3 again. In some embodiments, the main body part 11 further includes a third surface 113 , and the third surface 113 is arranged opposite to the first surface 111 . The thickness of the main body part 11 is uniform, and the thickness of the main body part 11 is 0.3 mm to 1 mm; in other words, the first surface 111 and the third surface 113 are parallel, and the first surface 111 and the third surface The vertical distance between 113 is 0.3mm to 1mm. Specifically, the thickness of the main body part 11 may be, but is not limited to, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, etc. When the main body 11 is too thin, it cannot provide good support and protection, and the mechanical strength cannot well meet the requirements of the electronic device housing 100. When the main body 11 is too thick, the weight of the electronic device is increased. , affecting the feel of electronic devices and causing poor user experience.

请再次参见图2和图3,在一些实施例中,所述侧部13包括还弯曲面133,所述弯曲面133面向所述容置空间101,所述弯曲面133的相对两端分别与所述第一表面111和所述第二表面131相连,所述弯曲面133的曲率半径为1mm至10mm;具体地,可以为但不限于为1mm、2mm、4mm、5mm、6mm、8mm、9mm、10mm等。可选地,所述弯曲面133可以为圆弧面、椭圆弧面等。弯曲面133的曲率半径大,侧部13相较于主体部11倒扣效果不明显;弯曲面133的曲率半径太小,壳体与电子设备例如电子设备的屏幕贴合难度会增加。Please refer to Figures 2 and 3 again. In some embodiments, the side portion 13 includes a curved surface 133 facing the accommodating space 101, and the opposite ends of the curved surface 133 are respectively in contact with the accommodating space 101. The first surface 111 and the second surface 131 are connected, and the curvature radius of the curved surface 133 is 1 mm to 10 mm; specifically, it can be but is not limited to 1 mm, 2 mm, 4 mm, 5 mm, 6 mm, 8 mm, or 9 mm. , 10mm, etc. Optionally, the curved surface 133 may be a circular arc surface, an elliptical arc surface, etc. The curvature radius of the curved surface 133 is large, and the undercut effect of the side part 13 is not obvious compared with the main part 11; the curvature radius of the curved surface 133 is too small, and it will be more difficult to fit the housing to the electronic device, such as the screen of the electronic device.

可以理解,第一表面111、弯曲面133及第二表面131依次相连,第一表面111、弯曲面133及第二表面131围合成所述容置空间101。It can be understood that the first surface 111 , the curved surface 133 and the second surface 131 are connected in sequence, and the first surface 111 , the curved surface 133 and the second surface 131 enclose the accommodation space 101 .

请再次参见图2和图3,在一些实施例中,所述侧部13还包括端面135,所述端面135连接所述第二表面131远离所述弯曲面133的一端,所述端面135位于所述侧部13远离所述主体部11的一端,所述端面135与所述第一表面111平行。所述端面135与所述第一表面111平行时,方便后续进行计算机数字化控制精密机械加工(CNC加工),且有利于后续在端面135上形成装饰部(如丝印镜面银)。Please refer to Figures 2 and 3 again. In some embodiments, the side portion 13 further includes an end surface 135. The end surface 135 is connected to an end of the second surface 131 away from the curved surface 133. The end surface 135 is located One end of the side portion 13 is away from the main body portion 11 , and the end surface 135 is parallel to the first surface 111 . When the end surface 135 is parallel to the first surface 111, it facilitates subsequent computer numerical control precision machining (CNC machining) and facilitates the subsequent formation of a decorative portion (such as silk screen mirror silver) on the end surface 135.

可选地,所述侧部13还包括第四表面137及弧面139,所述第四表面137与所述弧面139均位于所述侧部13远离所述容置空间101的表面,所述第四表面137连接所述端面135远离所述第二表面131的一端,所述弧面139的相对两端分别连接所述第三表面113和所述第四表面137。所述第四表面137为平面,所述弧面139可以为圆弧面139、椭圆弧面139等。可以理解,所述弯曲面133、第二表面131、端面135、第四表面137及弧面139依次相连,形成所述侧部13的表面。Optionally, the side portion 13 further includes a fourth surface 137 and an arcuate surface 139. The fourth surface 137 and the arcuate surface 139 are both located on the surface of the side portion 13 away from the accommodation space 101, so The fourth surface 137 is connected to one end of the end surface 135 away from the second surface 131 , and the opposite ends of the arcuate surface 139 are connected to the third surface 113 and the fourth surface 137 respectively. The fourth surface 137 is a plane, and the arc surface 139 can be a circular arc surface 139, an elliptical arc surface 139, etc. It can be understood that the curved surface 133 , the second surface 131 , the end surface 135 , the fourth surface 137 and the arcuate surface 139 are connected in sequence to form the surface of the side portion 13 .

在一些实施例中,第四表面137与第三表面113之间角度β可以为40°至90°;具体地,可以为但不限于为40°、45°、50°、55°、60°、65°、70°、75°、80°、85°、90°等。在另一些实施例中,第四表面137与第三表面113之间角度β也可以大于90°。相较于第四表面137与第三表面113之间角度β大于90°,当第四表面137与第三表面113之间角度β为40°至90°,即第四表面137相较于第三表面113的弯折角度大于或等于90°(为90°至140°)时,这样第四表面137更向主体部11的方向弯折,可以使得得到的壳体100沿主体部11的延伸方向具有更小的宽度。角度β与角度α可以相等也可以不相等,当角度β与角度α相等时,可以进一步简化壳体100的制备工艺。In some embodiments, the angle β between the fourth surface 137 and the third surface 113 may be 40° to 90°; specifically, it may be, but is not limited to, 40°, 45°, 50°, 55°, or 60°. , 65°, 70°, 75°, 80°, 85°, 90°, etc. In other embodiments, the angle β between the fourth surface 137 and the third surface 113 may also be greater than 90°. Compared with the angle β between the fourth surface 137 and the third surface 113 being greater than 90°, when the angle β between the fourth surface 137 and the third surface 113 is 40° to 90°, that is, the angle β between the fourth surface 137 and the third surface 113 is greater than 90°. When the bending angle of the three surfaces 113 is greater than or equal to 90° (ranging from 90° to 140°), the fourth surface 137 is bent further toward the main body 11 , so that the resulting housing 100 extends along the main body 11 direction has a smaller width. The angle β and the angle α may or may not be equal. When the angle β and the angle α are equal, the manufacturing process of the housing 100 can be further simplified.

可选地,所述弧面139的曲率半径为1mm至10mm;具体地,可以为但不限于为1mm、2mm、4mm、5mm、6mm、8mm、9mm、10mm等。弧面139与弯曲面133的曲率半径可以相同,也可以不相同,本申请不作具体限定。弧面139的曲率半径大,侧部13相较于主体部11倒扣效果不明显;弧面139的曲率半径太小,壳体与电子设备例如电子设备的屏幕贴合难度会增加。Optionally, the radius of curvature of the arc surface 139 is 1 mm to 10 mm; specifically, it may be but is not limited to 1 mm, 2 mm, 4 mm, 5 mm, 6 mm, 8 mm, 9 mm, 10 mm, etc. The curvature radii of the arc surface 139 and the curved surface 133 may be the same or different, and are not specifically limited in this application. The curvature radius of the arcuate surface 139 is large, and the undercut effect of the side portion 13 is not obvious compared with the main body portion 11; the curvature radius of the arcuate surface 139 is too small, and it will be more difficult to fit the housing to the electronic device, such as the screen of the electronic device.

在一些实施例中,至少部分所述侧部13远离所述主体部11的一端的厚度大于所述侧部13连接所述主体部11的一端的厚度。这样可以使得壳体100的侧部13具有晶莹剔透的视觉效果,相较于树脂材质,当壳体100的材质为无机玻璃时,壳体100的侧部13的晶莹剔透的视觉效果更好。此外,当壳体100应用于电子设备时,所述侧部13作为电子设备的中框,通常电子设备跌落或碰撞时,中框受到撞击的几率最大,至少部分所述侧部13远离所述主体部11的一端的厚度大于所述侧部13连接所述主体部11的一端的厚度,这样可以使得制得的壳体100具有更好的机械强度,受到撞击时更不易损坏。In some embodiments, the thickness of at least part of the end of the side portion 13 away from the main body portion 11 is greater than the thickness of the end of the side portion 13 connecting to the main body portion 11 . This allows the side portion 13 of the housing 100 to have a crystal clear visual effect. Compared with resin material, when the housing 100 is made of inorganic glass, the crystal clear visual effect of the side portion 13 of the housing 100 is better. In addition, when the casing 100 is applied to an electronic device, the side portion 13 serves as the middle frame of the electronic device. Usually when the electronic device is dropped or collided, the middle frame is most likely to be hit. At least part of the side portion 13 is away from the middle frame. The thickness of one end of the main body part 11 is greater than the thickness of one end of the side part 13 connected to the main body part 11 , so that the manufactured housing 100 has better mechanical strength and is less likely to be damaged when hit.

请一并参见图1、图4及图5,在一些实施例中,所述侧部13包括依次首尾相连的第一子侧部132、第二子侧部134、第三子侧部136及第四子侧部138,所述第二子侧部134及所述第四子侧部138的厚度与所述主体部11的厚度相等,所述第一子侧部132远离所述主体部11的一端的厚度大于所述侧部13连接所述主体部11的一端的厚度;且所述第三子侧部136远离所述主体部11的一端的厚度大于所述侧部13连接所述主体部11的一端的厚度。这样可以使得壳体100的第一子侧部132和第三子侧部136具有晶莹剔透的视觉效果,且具有较好的机械强度,从而受到撞击时更不易损坏。可选地,所述第一子侧部132及所述第三子侧部136的长度可以均大于所述第二子侧部134及所述第四子侧部138的长度;或者所述第一子侧部132及所述第三子侧部136的长度可以均大于所述第二子侧部134及所述第四子侧部138的长度;或者第一子侧部132、第二子侧部134、第三子侧部136及第四子侧部138的长度均相等,对此本申请不作具体限定。Please refer to Figure 1, Figure 4 and Figure 5 together. In some embodiments, the side portion 13 includes a first sub-side portion 132, a second sub-side portion 134, a third sub-side portion 136 and a first sub-side portion 132 connected end to end. The thickness of the fourth sub-side part 138 , the second sub-side part 134 and the fourth sub-side part 138 is equal to the thickness of the main body part 11 , and the first sub-side part 132 is away from the main body part 11 The thickness of one end of the third sub-side portion 136 is greater than the thickness of the end of the side portion 13 connected to the main body portion 11; and the thickness of the end of the third sub-side portion 136 away from the main body portion 11 is greater than the thickness of the side portion 13 connected to the main body. The thickness of one end of part 11. This allows the first sub-side portion 132 and the third sub-side portion 136 of the housing 100 to have a crystal clear visual effect and have better mechanical strength, so that they are less likely to be damaged when hit. Optionally, the lengths of the first sub-side part 132 and the third sub-side part 136 may both be greater than the lengths of the second sub-side part 134 and the fourth sub-side part 138; The lengths of one sub-side part 132 and the third sub-side part 136 may both be greater than the lengths of the second sub-side part 134 and the fourth sub-side part 138; or the first sub-side part 132 and the second sub-side part 136 The lengths of the side portion 134, the third sub-side portion 136 and the fourth sub-side portion 138 are all equal, which is not specifically limited in this application.

请参见图6及图7,在另一些实施例中,所述侧部13包括依次首尾相连的第一子侧部132、第二子侧部134、第三子侧部136及第四子侧部138,所述第一子侧部132、第二子侧部134、第三子侧部136及第四子侧部138远离所述主体部11的一端的厚度均大于所述第一子侧部132、第二子侧部134、第三子侧部136及第四子侧部138靠近所述主体部11的一端。这样可以使得壳体100的四周(即侧部13的第一子侧部132、第二子侧部134、第三子侧部136及第四子侧部138)均具有晶莹剔透的视觉效果,且具有较好的机械强度,从而受到撞击时更不易损坏。Please refer to Figures 6 and 7. In other embodiments, the side portion 13 includes a first sub-side portion 132, a second sub-side portion 134, a third sub-side portion 136 and a fourth sub-side that are connected end to end. part 138. The thickness of the end of the first sub-side part 132, the second sub-side part 134, the third sub-side part 136 and the fourth sub-side part 138 away from the main body part 11 is greater than that of the first sub-side. The portion 132 , the second sub-side portion 134 , the third sub-side portion 136 and the fourth sub-side portion 138 are close to one end of the main body portion 11 . In this way, the surroundings of the housing 100 (that is, the first sub-side 132, the second sub-side 134, the third sub-side 136 and the fourth sub-side 138 of the side 13) all have a crystal clear visual effect. And it has good mechanical strength, making it less likely to be damaged when hit.

可选地,所述侧部13连接所述主体部11的一端的厚度等于所述主体部11的厚度;至少部分所述侧部13远离所述主体部11的一端的厚度与所述侧部13连接所述主体部11的一端的厚度之差为0.5mm至2.5mm;具体地,可以为但不限于为0.5mm、0.8mm、1.0mm、1.3mm、1.5mm、1.8mm、2.0mm、2.2mm、2.5mm等。当至少部分所述侧部13远离所述主体部11的一端的厚度与所述侧部13连接所述主体部11的一端的厚度之差小于0.5mm时,侧部13与主体部11的不等厚效果不明显,侧部13的晶莹剔透的视觉效果不明显,当至少部分所述侧部13远离所述主体部11的一端的厚度与所述侧部13连接所述主体部11的一端的厚度之差大于2.5mm时,制得的壳体100太重,从而增加了使用该壳体100的电子设备的重量,不利于电子设备的轻薄化。Optionally, the thickness of one end of the side portion 13 connected to the main body portion 11 is equal to the thickness of the main body portion 11 ; at least part of the thickness of the end of the side portion 13 away from the main body portion 11 is equal to the thickness of the side portion 13 . 13 The difference in thickness between one end connecting the main body 11 is 0.5mm to 2.5mm; specifically, it can be but is not limited to 0.5mm, 0.8mm, 1.0mm, 1.3mm, 1.5mm, 1.8mm, 2.0mm, 2.2mm, 2.5mm, etc. When the difference between the thickness of at least part of the end of the side portion 13 away from the main body portion 11 and the thickness of the end of the side portion 13 connecting to the main body portion 11 is less than 0.5 mm, the difference between the side portion 13 and the main body portion 11 The equal thickness effect is not obvious, and the crystal clear visual effect of the side portion 13 is not obvious when at least part of the thickness of the end of the side portion 13 away from the main body portion 11 is connected to the end of the side portion 13 connected to the main body portion 11 When the difference in thickness is greater than 2.5 mm, the produced housing 100 is too heavy, thereby increasing the weight of the electronic device using the housing 100, which is not conducive to the thinning of the electronic device.

请参见图5、图7及图8,在一些实施例中,至少部分所述侧部13的厚度自靠近所述主体部11的一端向远离所述主体部11的一端逐渐增加(如图8所示)。在另一些实施例中,至少部分所述侧部13的厚度自靠近所述主体部11的一端向远离所述主体部11的一端先逐渐增加,后保持不变(如图7所示)。在一具体实施例中,所述侧部13包括弯曲部1301及平直部1303,所述弯曲部1301的相对两端分别连接所述主体部11及所述平直部1303;所述弯曲部1301包括所述弯曲面133及弧面139,所述平直部1303包括所述第一表面111、所述端面135及所述第二表面131。所述平直部1303的厚度均匀,至少部分所述弯曲部1301的厚度自连接所述主体部11的一端向连接所述平直部1303的一端,由所述主体部11的厚度逐渐增大至所述平直部1303的厚度。换言之,至少部分所述弯曲部1301的厚度自连接所述主体部11的一端向远离所述主体部11的一端,由所述主体部11的厚度逐渐增大至所述平直部1303的厚度。Please refer to Figures 5, 7 and 8. In some embodiments, the thickness of at least part of the side portion 13 gradually increases from an end close to the main body portion 11 to an end far away from the main body portion 11 (as shown in Figure 8 shown). In other embodiments, the thickness of at least part of the side portion 13 gradually increases from an end close to the main body portion 11 to an end far away from the main body portion 11 , and then remains unchanged (as shown in FIG. 7 ). In a specific embodiment, the side portion 13 includes a curved portion 1301 and a straight portion 1303, and the opposite ends of the curved portion 1301 are respectively connected to the main body portion 11 and the straight portion 1303; the curved portion 1301 includes the curved surface 133 and the arc surface 139 , and the straight portion 1303 includes the first surface 111 , the end surface 135 and the second surface 131 . The thickness of the straight portion 1303 is uniform, and the thickness of at least part of the curved portion 1301 gradually increases from the end connected to the main body 11 to the end connected to the straight portion 1303 . to the thickness of the straight portion 1303. In other words, the thickness of at least part of the curved portion 1301 gradually increases from the end connected to the main body 11 to the end far away from the main body 11 from the thickness of the main body 11 to the thickness of the straight portion 1303 .

请参见图9,在一些实施例中,本申请实施例的壳体100还包括第一遮光部30、装饰部50及第二遮光部70。所述第一遮光部30覆盖于所述侧部13的所述第二表面131及所述弯曲面133上,用于遮挡电子设备内部的元器件,防止从侧部13可以看到电子设备内部的元器件,所述第一遮光部30还用于使壳体100的第三表面113侧可以看到黑色的边框,从而具有良好的视觉效果。所述装饰部50覆盖于所述侧部13的至少部分所述端面135上,装饰部50用于使壳体100的侧部13具有不同颜色的装饰效果。所述第二遮光部70至少覆盖于所述装饰部50且与所述第一遮光部30至少部分叠合,用于遮挡电子设备内部的元器件,防止从壳体100的第三表面113侧的边缘透光,可以看到电子设备内部的元器件。Referring to FIG. 9 , in some embodiments, the housing 100 of the embodiment of the present application further includes a first light-shielding part 30 , a decorative part 50 and a second light-shielding part 70 . The first light-shielding portion 30 covers the second surface 131 and the curved surface 133 of the side portion 13 to block components inside the electronic device and prevent the inside of the electronic device from being visible from the side portion 13 As a component, the first light shielding part 30 is also used to make the black frame visible on the third surface 113 side of the housing 100, thereby having a good visual effect. The decorative portion 50 covers at least part of the end surface 135 of the side portion 13 . The decorative portion 50 is used to provide decorative effects of different colors to the side portion 13 of the housing 100 . The second light shielding part 70 at least covers the decorative part 50 and is at least partially overlapped with the first light shielding part 30 , and is used to shield the components inside the electronic device from entering the third surface 113 of the housing 100 . The edges are transparent and the components inside the electronic device can be seen.

可以理解的是,装饰部50可以覆盖于所述侧部13的整个端面135上,还可以仅覆盖与侧部13的部分端面135上,例如,仅在侧部13厚度大于主体部11的对应位置上设置装饰部50。还可以理解的是,第二遮光部70可以装饰部50及部分第一遮光部30,也可以覆盖整个装饰部50及整个第一遮光部30,只要第一遮光部30及第二遮光部70配合,可以防止壳体100的侧部13透光即可。It can be understood that the decorative part 50 may cover the entire end surface 135 of the side part 13 , or may only cover part of the end surface 135 of the side part 13 , for example, only when the side part 13 is thicker than the main part 11 . A decorative part 50 is provided at the position. It can also be understood that the second light-shielding portion 70 can decorate the portion 50 and part of the first light-shielding portion 30 , or can cover the entire decorative portion 50 and the entire first light-shielding portion 30 , as long as the first light-shielding portion 30 and the second light-shielding portion 70 It suffices to cooperate to prevent the side portion 13 of the housing 100 from transmitting light.

可选地,所述第一遮光部30可以为黑色光刻胶层,例如,可以为黑色负性光刻胶层。第一遮光部30可以由负性光刻胶经曝光、显影、硬烤等步骤获得,此外,第一遮光部30还可以为黑色油墨层,由黑色油墨经打印、印刷、喷涂等工艺形成。可选地,所述第一遮光部30的宽度可以为0.5mm至3mm,具体地,可以为但不限于为0.5mm、0.8mm、1mm、1.5mm、2mm、2.5mm、3mm等。第一遮光部30的宽度太小在壳体100的外周形成的黑框的视觉效果不好,第一遮光部30的宽度太大在壳体100的外周形成的黑框的视觉效果也不好,且作为电子设备的前盖时,会影响电子设备的全屏显示。在一些实施例中,第一子侧部132和第三子侧部136为长边,第二子侧部134和第四子侧部138为短边,换言之,第一子侧部132及第三子侧部136的长度均大于第二子侧部134和第四子侧部138的长度,第一子侧部132及第三子侧部136上的第一遮光部30的宽度的范围均为2mm至3mm;第二子侧部134和第四子侧部138上的第一遮光部30的宽度的范围均为0.5mm至1mm,这样可以使得制得的壳体100具有比例尺寸更协调,具有更好的视觉效果。Optionally, the first light shielding part 30 may be a black photoresist layer, for example, a black negative photoresist layer. The first light-shielding part 30 can be obtained by exposure, development, hard baking and other steps of negative photoresist. In addition, the first light-shielding part 30 can also be a black ink layer, formed by black ink through printing, printing, spraying and other processes. Optionally, the width of the first light shielding part 30 may be 0.5 mm to 3 mm, specifically, but not limited to, 0.5 mm, 0.8 mm, 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, etc. If the width of the first light shielding part 30 is too small, the visual effect of the black frame formed on the outer periphery of the housing 100 is not good. If the width of the first light shielding part 30 is too large, the visual effect of the black frame formed on the outer periphery of the housing 100 is also bad. , and when used as the front cover of an electronic device, it will affect the full-screen display of the electronic device. In some embodiments, the first sub-side portion 132 and the third sub-side portion 136 are long sides, and the second sub-side portion 134 and the fourth sub-side portion 138 are short sides. In other words, the first sub-side portion 132 and the third sub-side portion 138 are short sides. The lengths of the three sub-side parts 136 are all greater than the lengths of the second sub-side part 134 and the fourth sub-side part 138 , and the width ranges of the first light shielding part 30 on the first sub-side part 132 and the third sub-side part 136 are all the same. The width of the first light-shielding portion 30 on the second sub-side portion 134 and the fourth sub-side portion 138 is both in the range of 0.5 mm to 1 mm, which can make the manufactured housing 100 have a more coordinated proportional size. , with better visual effects.

可选地,装饰部50可以为镜面银,以使得壳体100的第三表面113侧可以观看到壳体100的至少部分侧部13具有镜面银的晶莹剔透的视觉效果。可选地,装饰部50还可以为具有珠光粉等闪光效果的油墨层,或者具有红色、橙色、黄色、绿色、蓝色等颜色中的一种或多种。具体颜色可以根据壳体100的第三表面113侧对应装饰部50的位置想获得的视觉效果进行选择,本申请不作具体限定。Optionally, the decorative portion 50 may be mirror silver, so that the third surface 113 side of the housing 100 can view at least part of the side portion 13 of the housing 100 to have a crystal clear visual effect of mirror silver. Optionally, the decorative part 50 may also be an ink layer with a glittering effect such as pearlescent powder, or one or more colors such as red, orange, yellow, green, blue, etc. The specific color can be selected according to the desired visual effect of the position of the decorative portion 50 on the third surface 113 side of the housing 100, and is not specifically limited in this application.

可选地,所述第二遮光部70均可以为黑色油墨层,由黑色油墨经打印、印刷、喷涂等工艺形成。在一些实施例中,所述第二遮光部70还覆盖于所述第一遮光部30。可选地,第二遮光部70的厚度为15μm至20μm,具体地,可以为但不限于为15μm、16μm、17μm、19μm、19μm、20μm等。Optionally, the second light-shielding portion 70 can be a black ink layer, which is formed by black ink through printing, printing, spraying and other processes. In some embodiments, the second light-shielding part 70 also covers the first light-shielding part 30 . Optionally, the thickness of the second light-shielding portion 70 is 15 μm to 20 μm, specifically, but is not limited to, 15 μm, 16 μm, 17 μm, 19 μm, 19 μm, 20 μm, etc.

本申请上述各实施例的壳体100可以通过以下各实施例的制备方法进行制备。下面将详细介绍本申请实施例的壳体100的制备方法。The housing 100 of the above-mentioned embodiments of the present application can be prepared by the preparation methods of the following embodiments. The preparation method of the housing 100 in the embodiment of the present application will be introduced in detail below.

相关设计中,采用热弯成型制备3D结构的壳体100,例如制备3D玻璃壳体100时,除了无法实现壳体100的第一表面111与第二表面131的角度小于或等于90°(即热弯成型制得的壳体100的第一表面111与第二表面131的角度最小极限为102°)外,其热弯模具通常为石墨材质,在玻璃的熔融温度下例如在700℃至800℃下,热弯模具表面很容易掉灰粘到壳体100的表面,热弯后往往需要通过凹面抛光及凸面抛光将壳体100的凹面(对应本申请的第一表面111、弯曲面133及第二表面131)和凸面(对应本申请的第三表面113、弧面139及第四表面137)的石墨模具印给去除,使得壳体100的制备工艺更为复杂、成本提高。此外,市面上市售的玻璃基材通常为等厚度的,当需要制得3D结构不等厚的壳体100时(主体部11与侧部13不等厚),需要先将玻璃基材对应主体部11的位置先进行减薄,加工时容易在表面留下刀纹印,使得制得的壳体100表面具有刀纹印。再者,若采用热弯成型工艺制备不等厚的3D结构的壳体100,则增加模具的复杂程度,从而增加了热弯成型工艺的复杂程度,提高了壳体100的制备成本。In related designs, hot bending is used to prepare the housing 100 with a 3D structure. For example, when preparing the 3D glass housing 100, it is impossible to realize that the angle between the first surface 111 and the second surface 131 of the housing 100 is less than or equal to 90° (i.e. In addition to the angle between the first surface 111 and the second surface 131 of the housing 100 produced by hot bending (the minimum limit is 102°), the hot bending mold is usually made of graphite. At the melting temperature of glass, for example, between 700°C and 800°C. ℃, the surface of the hot-bending mold is easy to shed dust and stick to the surface of the housing 100. After hot-bending, it is often necessary to polish the concave surface of the housing 100 (corresponding to the first surface 111, the curved surface 133 and the convex surface of the present application). The graphite mold marks on the second surface 131) and the convex surface (corresponding to the third surface 113, the arc surface 139 and the fourth surface 137 of the present application) are removed, making the preparation process of the housing 100 more complex and increasing the cost. In addition, the glass substrates available on the market are usually of the same thickness. When it is necessary to produce a casing 100 with a 3D structure of unequal thickness (the main part 11 and the side part 13 are not unequal in thickness), the glass substrate needs to be matched to the main body first. The position of the portion 11 is first thinned, and it is easy to leave knife marks on the surface during processing, so that the surface of the produced casing 100 has knife marks. Furthermore, if the hot bending forming process is used to prepare the casing 100 with a 3D structure of unequal thickness, the complexity of the mold will be increased, thereby increasing the complexity of the hot bending forming process and increasing the preparation cost of the casing 100 .

请一并参见图10至图15,本申请实施例还提供一种壳体100的制备方法,所述壳体100包括弯折相连的主体部11及侧部13,所述主体部11与所述侧部13围合成容置空间101,所述主体部11具有第一表面111,所述第一表面111面向所述容置空间101,所述侧部13具有第二表面131,所述第二表面131面向所述容置空间101,所述第二表面131为平面,所述第一表面111与所述第二表面131之间的角度α的范围为40°至90°;所述方法包括:Please refer to Figures 10 to 15 together. The embodiment of the present application also provides a method for preparing a housing 100. The housing 100 includes a main body part 11 and a side part 13 that are bent and connected. The main body part 11 and the The side portion 13 encloses an accommodation space 101. The main body portion 11 has a first surface 111 facing the accommodation space 101. The side portion 13 has a second surface 131. Two surfaces 131 face the accommodation space 101, the second surface 131 is a plane, and the angle α between the first surface 111 and the second surface 131 ranges from 40° to 90°; the method include:

S201,制备胚体300,所述胚体300具有通孔301;以及S201, prepare an embryo body 300, which has a through hole 301; and

可选地,提供胚料,将胚料加热至熔融温度以上,采用注塑成型或挤出成型工艺进行成型,以制得具有通孔301的胚体300。Optionally, a blank material is provided, heated to above the melting temperature, and molded using an injection molding or extrusion molding process to produce a blank body 300 with a through hole 301 .

可选地,胚料可以为树脂粒料,例如PMMA、PC或PET等中的一种或多种;也可以为市售无机玻璃板,例如四川旭虹光电科技有限公司的Panda-1681,其应变点为550℃,软化点为770℃。Alternatively, the embryo can be resin granules, such as one or more of PMMA, PC or PET; it can also be a commercially available inorganic glass plate, such as Panda-1681 from Sichuan Xuhong Optoelectronics Technology Co., Ltd. The strain point is 550°C and the softening point is 770°C.

在一具体实施例中,胚料为无机玻璃板,将无机玻璃板加热至850℃至900℃,以使得无机玻璃板熔融为熔融液,采用带有口模和芯模的机头进行挤出成型,制得胚体300。加热温度过低,无机玻璃板无法完全熔融,温度过高,要求模具具有更高的耐温性,或者模具材质无法承受相应温度。In a specific embodiment, the blank material is an inorganic glass plate. The inorganic glass plate is heated to 850°C to 900°C to melt the inorganic glass plate into a molten liquid. A machine head with a die and a core die is used for extrusion. After forming, the embryo body 300 is obtained. If the heating temperature is too low, the inorganic glass plate cannot be completely melted. If the temperature is too high, the mold is required to have higher temperature resistance, or the mold material cannot withstand the corresponding temperature.

请参见图11,可选地,所述胚体300包括第一部310和第二部330,所述第一部310的厚度大于所述第二部330的厚度;进行吹塑成型后,所述第一部310形成至少部分所述侧部13,所述第二部330至少形成所述主体部11。这样可以使得制得的壳体100的至少部分所述侧部13远离所述主体部11的一端的厚度大于所述侧部13连接所述主体部11的一端的厚度。从而使得壳体100的所述至少部分侧部13具有晶莹剔透的视觉效果,且具有更好的机械强度,受到撞击时更不易损坏。Referring to Figure 11, optionally, the embryo body 300 includes a first part 310 and a second part 330, and the thickness of the first part 310 is greater than the thickness of the second part 330; after blow molding, the The first part 310 forms at least part of the side part 13 , and the second part 330 at least forms the main body part 11 . In this way, the thickness of at least part of the end of the side portion 13 away from the main body portion 11 of the manufactured housing 100 can be greater than the thickness of the end of the side portion 13 connecting to the main body portion 11 . As a result, at least part of the side portion 13 of the housing 100 has a crystal clear visual effect, has better mechanical strength, and is less likely to be damaged when hit.

请参见图11,在一些实施例中,所述第一部310包括第一子部311及第二子部312,所述第一子部311及第二子部312分别设置于所述第二部330相对两端,所述通孔301依次贯穿所述第一子部311、第二部330及第二子部312,所述第一子部311及所述第二子部312的厚度均大于所述第二部330的厚度,所述侧部13包括依次首尾相连的第一子侧部132、第二子侧部134、第三子侧部136及第四子侧部138,进行吹塑成型后,所述第一子部311形成所述第一子侧部132、所述第二子部312形成所述第三子侧部136;所述第二部330形成所述主体部11及所述第二子侧部134及所述第四子侧部138;其中,所述第一子侧部132远离所述主体部11的一端的厚度大于所述侧部13连接所述主体部11的一端的厚度;且所述第三子侧部136远离所述主体部11的一端的厚度大于所述侧部13连接所述主体部11的一端的厚度。这样可以使得壳体100的第一子侧部132和第三子侧部136具有晶莹剔透的视觉效果,且具有较好的机械强度,从而受到撞击时更不易损坏。Please refer to Figure 11. In some embodiments, the first part 310 includes a first sub-part 311 and a second sub-part 312, and the first sub-part 311 and the second sub-part 312 are respectively disposed on the second The through hole 301 penetrates the first sub-part 311, the second part 330 and the second sub-part 312 in sequence at opposite ends of the part 330. The thickness of the first sub-part 311 and the second sub-part 312 is uniform. Greater than the thickness of the second part 330, the side part 13 includes a first sub-side part 132, a second sub-side part 134, a third sub-side part 136 and a fourth sub-side part 138 connected end to end in order. After molding, the first sub-part 311 forms the first sub-side part 132 and the second sub-part 312 forms the third sub-side part 136; the second part 330 forms the main body part 11 And the second sub-side part 134 and the fourth sub-side part 138; wherein, the thickness of the end of the first sub-side part 132 away from the main body part 11 is greater than the thickness of the side part 13 connecting the main body part. and the thickness of one end of the third sub-side portion 136 away from the main body portion 11 is greater than the thickness of one end of the side portion 13 connecting to the main body portion 11 . This allows the first sub-side portion 132 and the third sub-side portion 136 of the housing 100 to have a crystal clear visual effect and have better mechanical strength, so that they are less likely to be damaged when hit.

请参见图12及图13,在另一些实施例中,所述第一部310包括第一子部311、第二子部312、第三子部313及第四子部314,所述第二部330包括第五子部331及第六子部332,所述第三子部313、第五子部331、第四子部314及第六子部332依次首尾相连形成筒体330’,所述第一子部311及所述第二子部312分别设置于所述筒体330’的相对两端,所述通孔301依次贯穿所述第一子部311、筒体330’及第二子部312;所述第一子部311、第三子部313、第二子部312及第四子部314的厚度均大于所述第五子部331的厚度且均大于所述第六子部332的厚度;所述侧部13包括依次首尾相连的第一子侧部132、第二子侧部134、第三子侧部136及第四子侧部138,进行吹塑成型后,所述第一子部311形成所述第一子侧部132、所述第三子部313形成所述第二子侧部134;所述第二子部312形成所述第三子侧部136、所述第四子部314形成所述第四子侧部138;所述第二部330形成所述主体部11;所述第一子侧部132、第二子侧部134、第三子侧部136及第四子侧部138远离所述主体部11的一端的厚度均大于所述第一子侧部132、第二子侧部134、第三子侧部136及第四子侧部138靠近所述主体部11的一端。这样可以使得壳体100的四周(即侧部13的第一子侧部132、第二子侧部134、第三子侧部136及第四子侧部138)均具有晶莹剔透的视觉效果,且具有较好的机械强度,从而受到撞击时更不易损坏。Please refer to Figures 12 and 13. In other embodiments, the first part 310 includes a first sub-part 311, a second sub-part 312, a third sub-part 313 and a fourth sub-part 314. The second The part 330 includes a fifth sub-part 331 and a sixth sub-part 332. The third sub-part 313, the fifth sub-part 331, the fourth sub-part 314 and the sixth sub-part 332 are connected end to end in order to form the cylinder 330'. The first sub-part 311 and the second sub-part 312 are respectively provided at opposite ends of the cylinder 330', and the through hole 301 penetrates the first sub-part 311, the cylinder 330' and the second sub-portion 330'. Sub-part 312; the thickness of the first sub-part 311, the third sub-part 313, the second sub-part 312 and the fourth sub-part 314 are all greater than the thickness of the fifth sub-part 331 and are all greater than the thickness of the sixth sub-part 312. The thickness of the part 332; the side part 13 includes a first sub-side part 132, a second sub-side part 134, a third sub-side part 136 and a fourth sub-side part 138 connected end to end in sequence. After blow molding, the The first sub-part 311 forms the first sub-side part 132, the third sub-part 313 forms the second sub-side part 134; the second sub-part 312 forms the third sub-side part 136, The fourth sub-part 314 forms the fourth sub-side part 138; the second part 330 forms the main body part 11; the first sub-side part 132, the second sub-side part 134 and the third sub-side part The thickness of the end of the portion 136 and the fourth sub-side portion 138 away from the main body portion 11 is greater than that of the first sub-side portion 132 , the second sub-side portion 134 , the third sub-side portion 136 and the fourth sub-side portion 138 One end close to the main body 11 . In this way, the surroundings of the housing 100 (that is, the first sub-side 132, the second sub-side 134, the third sub-side 136 and the fourth sub-side 138 of the side 13) all have a crystal clear visual effect. And it has good mechanical strength, making it less likely to be damaged when hit.

S202,将所述胚体300设置于吹塑模具400中,在所述通孔301中通入气体,进行吹塑成型,以使所述胚体形成弯折相连且为一体结构的主体部11及侧部13,所述主体部11包括第一表面111;所述侧部13环绕所述主体部11的外周缘设置,所述主体部11与所述侧部13围合成容置空间101,所述第一表面111面向所述容置空间101,所述侧部13包括第二表面131,所述第二表面131环绕所述容置空间101,所述第一表面111与所述第二表面131之间的角度的范围为40°至90°,从而得到所述壳体100。S202, the embryo body 300 is placed in the blow mold 400, gas is introduced into the through hole 301, and blow molding is performed, so that the embryo body forms the main body portion 11 that is bent, connected and has an integrated structure. and the side part 13. The main part 11 includes a first surface 111; the side part 13 is arranged around the outer periphery of the main part 11, and the main part 11 and the side part 13 enclose a receiving space 101, The first surface 111 faces the accommodating space 101. The side portion 13 includes a second surface 131. The second surface 131 surrounds the accommodating space 101. The first surface 111 is connected to the second surface 131. The angle between the surfaces 131 ranges from 40° to 90°, resulting in the housing 100 .

可选地,将步骤S201得到的热的胚体300放入吹塑模具400中,采用通气杆(通气杆表面设有均匀的通气槽),往胚体300的通孔301中通入冷空气(气体),以使所述胚体300膨胀,直至胚体300的四周挤压吹塑模具400的内壁,冷却定型后得到回转体外壳(如图14所示),再将回转体外壳进行激光切割(激光器波长1064nm)一分为二,得到2个具有3D结构的壳体100。热弯成型,一次只能出一个壳体100,因此,采用吹塑成型,壳体100的制备效率更好。Optionally, put the hot embryo 300 obtained in step S201 into the blow mold 400, and use a ventilation rod (the surface of the ventilation rod is provided with uniform ventilation grooves) to introduce cold air into the through hole 301 of the embryo 300. (gas) to expand the embryo body 300 until the inner wall of the blow mold 400 is squeezed around the embryo body 300. After cooling and shaping, the rotary body shell is obtained (as shown in Figure 14), and then the rotary body shell is laser-processed. Cut (laser wavelength 1064 nm) into two to obtain two shells 100 with 3D structures. Only one housing 100 can be produced at a time through hot bending molding. Therefore, the production efficiency of the housing 100 is better when blow molding is used.

可选地,吹塑成型时的气压为10MPA至15MPA;具体地,可以为但不限于10MPA、11MPA、12MPA、13MPA、14MPA、15MPA等。吹塑成型时气压太小(小于10Mpa),壳体100不易成型;吹塑成型时气压太大(大于15Mpa),容易在制得的壳体100的第三表面131(靠近吹塑模具400的第一模面411及第二模面431的表面)上产生过多毛刺。Optionally, the air pressure during blow molding is 10MPA to 15MPA; specifically, it can be but is not limited to 10MPA, 11MPA, 12MPA, 13MPA, 14MPA, 15MPA, etc. When the air pressure is too small (less than 10Mpa) during blow molding, the shell 100 is difficult to mold; when the air pressure is too high (more than 15Mpa) during blow molding, it is easy to cause damage to the third surface 131 (near the blow mold 400) of the produced shell 100. Excessive burrs are generated on the surfaces of the first mold surface 411 and the second mold surface 431).

可选地,所述吹塑模具400的材质为钢材,例如可以为0Cr25Ni20模具钢。相较于采用石墨,采用钢材作为吹塑模具400的材质,钢材具有更好的切削特性及耐高温性。且采用钢材作为吹塑模具400,即使经过高温,也不会有掉灰粘到壳体100的表面。Optionally, the blow mold 400 is made of steel, such as OCr25Ni20 mold steel. Compared with using graphite, steel is used as the material of the blow mold 400. Steel has better cutting characteristics and high temperature resistance. And by using steel as the blow mold 400, even after high temperature, there will be no dust sticking to the surface of the casing 100.

请参见图15和图16,可选地,所述吹塑模具400包括第一子模410及第二子模430,所述第一子模410与所述第二子模430围合形成模腔401,所述模腔401用于设置所述胚体300。这样通过设计第一子模410及第二子模430的内部模腔401的结构,就可以调整制得的壳体100的主体部11与侧部13的弯折角度,换言之,调整第一表面111与第二表面131的角度,以使得制得的壳体100的第一表面111及第二表面131之间的角度处于40°至90°。使得壳体100的整个制备工艺更为简化,且容易实现。Referring to Figures 15 and 16, optionally, the blow mold 400 includes a first sub-mold 410 and a second sub-mold 430. The first sub-mold 410 and the second sub-mold 430 are enclosed to form a mold. Cavity 401, the mold cavity 401 is used to place the embryo body 300. In this way, by designing the structure of the internal mold cavity 401 of the first sub-mold 410 and the second sub-mold 430, the bending angle of the main body part 11 and the side part 13 of the produced housing 100 can be adjusted. In other words, the first surface can be adjusted. 111 and the second surface 131 such that the angle between the first surface 111 and the second surface 131 of the manufactured housing 100 is between 40° and 90°. This makes the entire preparation process of the housing 100 simpler and easier to implement.

可选地,所述第一子模410及所述第二子模430中的至少一个具有冷却通道403,所述冷却通道403用于通冷却液例如水,以对所述第一子模410及所述第二子模430进行冷却。相较于在模具的外围设置冷却系统,所述第一子模410及所述第二子模430中的至少一个设置冷却通道403,可以更快的对吹塑模具400进行降温,具有更好的冷却效果。Optionally, at least one of the first sub-mold 410 and the second sub-mold 430 has a cooling channel 403. The cooling channel 403 is used to pass cooling liquid, such as water, to cool the first sub-mold 410. and the second sub-mold 430 is cooled. Compared with arranging a cooling system around the mold, at least one of the first sub-mold 410 and the second sub-mold 430 is provided with a cooling channel 403, so that the blow mold 400 can be cooled down faster and has better performance. cooling effect.

可选地,所述第一子模410及所述第二子模430位于所述模腔401内的表面为镜面抛光表面。可选地,所述第一子模410包括第一模面411,所述第二子模430包括第二模面431,当第一子模410及第二子模430闭合时,所述第一模面411与所述第二模面431围合成所述模腔401,所述第一模面411与所述第二模面431均为镜面抛光表面。这样可以使得制得的壳体100的第三表面113、弧面139及第四表面137具有较好的表面光洁度(即表面粗糙度更小),且不会留下明显的磨具印,制得的壳体100无需再进行表面抛光。通过热弯成型形成的3D壳体100即使采用进行镜面抛光的钢材热弯模具,由于凹模和凸模对壳体100相对两侧的相向挤压,也容易使制得的壳体100表面产生折痕等缺陷。而本申请吹塑成型制得的3D结构的壳体100只有一个表面贴合模具,形成的壳体100表面更不易产生折痕等缺陷。Optionally, the surfaces of the first sub-mold 410 and the second sub-mold 430 located in the mold cavity 401 are mirror polished surfaces. Optionally, the first sub-mold 410 includes a first mold surface 411, and the second sub-mold 430 includes a second mold surface 431. When the first sub-mold 410 and the second sub-mold 430 are closed, the A mold surface 411 and the second mold surface 431 enclose the mold cavity 401, and both the first mold surface 411 and the second mold surface 431 are mirror polished surfaces. In this way, the third surface 113, the arc surface 139 and the fourth surface 137 of the produced housing 100 can have a better surface finish (that is, a smaller surface roughness) without leaving obvious abrasive marks. The resulting housing 100 does not require surface polishing. Even if a mirror-polished steel hot-bending mold is used to form the 3D casing 100 through hot bending, the surface of the casing 100 will be easily damaged due to the mutual extrusion of the concave mold and the convex mold on the opposite sides of the casing 100. Defects such as creases. However, the 3D structure casing 100 produced by blow molding in this application only has one surface that fits the mold, and the surface of the casing 100 formed is less likely to have defects such as creases.

可选地,第一模面411的粗糙度Ra为50nm至200nm;具体地,可以为但不限于为50nm、80nm、100nm、120nm、150nm、180nm、200nm等。当第一模面411的粗糙度过小(小于50nm)时,则会增加吹塑模具400的抛光时间,从而增加吹塑模具400的制备成本,当第一模面411的粗糙度过大(大于200nm)时,则制得的壳体100的表面粗糙度较大,达不到要求。Optionally, the roughness Ra of the first mold surface 411 is 50 nm to 200 nm; specifically, it may be but is not limited to 50 nm, 80 nm, 100 nm, 120 nm, 150 nm, 180 nm, 200 nm, etc. When the roughness of the first mold surface 411 is too small (less than 50 nm), the polishing time of the blow mold 400 will be increased, thereby increasing the preparation cost of the blow mold 400. When the roughness of the first mold surface 411 is too large ( When the thickness is greater than 200 nm), the surface roughness of the produced shell 100 is relatively large and cannot meet the requirements.

可选地,第二模面431的粗糙度Ra为50nm至200nm;具体地,可以为但不限于为50nm、80nm、100nm、120nm、150nm、180nm、200nm等。当第二模面431的粗糙度过小(小于50nm)时,则会增加吹塑模具400的抛光时间,从而增加吹塑模具400的制备成本,当第二模面431的粗糙度过大(大于200nm)时,则制得的壳体100的表面粗糙度较大,达不到要求。Optionally, the roughness Ra of the second mold surface 431 is 50 nm to 200 nm; specifically, it may be but is not limited to 50 nm, 80 nm, 100 nm, 120 nm, 150 nm, 180 nm, 200 nm, etc. When the roughness of the second mold surface 431 is too small (less than 50 nm), the polishing time of the blow mold 400 will be increased, thereby increasing the preparation cost of the blow mold 400. When the roughness of the second mold surface 431 is too large ( When the thickness is greater than 200 nm), the surface roughness of the produced shell 100 is relatively large and cannot meet the requirements.

请参见图17,在一些实施例中,所述第一模面411及所述第二模面431具有相同的结构,以下以第一模面411为例进行详细说明。第一模面411包括依次连接的第一子模面4111、第二子模面4112及第三子模面4113,所述第二子模面4112环绕所述第一子模面4111的外周缘设置,所述第三子模面4113环绕所述第二子模面4112的外周设置,所述第一子模面4111与所述第三子模面4113之间的角度γ的范围为40°至90°,以使得采用第一子模410及所述第二子模430对胚体300进行吹塑成型时,得到的壳体100的第一表面111及第二表面131之间的角度α处于40°至90°。具体地,所述第一子模面4111与所述第三子模面4113之间的角度γ可以为但不限于为40°、45°、50°、55°、60°、65°、70°、75°、80°、85°、90°等。所述第一子模面4111与所述第三子模面4113之间的角度可以根据需要获得的壳体100的第一表面111及第二表面131之间的角度进行设计。Referring to FIG. 17 , in some embodiments, the first mold surface 411 and the second mold surface 431 have the same structure. The first mold surface 411 is taken as an example for detailed description below. The first mold surface 411 includes a first sub-mold surface 4111, a second sub-mold surface 4112 and a third sub-mold surface 4113 connected in sequence. The second sub-mold surface 4112 surrounds the outer periphery of the first sub-mold surface 4111. The third sub-mold surface 4113 is arranged around the outer circumference of the second sub-mold surface 4112, and the range of the angle γ between the first sub-mold surface 4111 and the third sub-mold surface 4113 is 40°. to 90°, so that when the first sub-mold 410 and the second sub-mold 430 are used to blow mold the embryonic body 300, the angle α between the first surface 111 and the second surface 131 of the shell 100 is obtained. at 40° to 90°. Specifically, the angle γ between the first sub-mold surface 4111 and the third sub-mold surface 4113 may be, but is not limited to, 40°, 45°, 50°, 55°, 60°, 65°, 70 °, 75°, 80°, 85°, 90°, etc. The angle between the first sub-mold surface 4111 and the third sub-mold surface 4113 can be designed according to the desired angle between the first surface 111 and the second surface 131 of the housing 100 .

需要说明的是,所述第一子模面4111与所述第三子模面4113之间的角度指的是垂直于第一子模面4111的平面与第一子模面4111及所述第三子模面4113的相交线之间的角度。It should be noted that the angle between the first sub-mold surface 4111 and the third sub-mold surface 4113 refers to the plane perpendicular to the first sub-mold surface 4111 and the first sub-mold surface 4111 and the third sub-mold surface 4111. The angle between the intersection lines of the three sub-mold surfaces.

可选地,所述吹塑模具400的材质为钢材,例如可以为0Cr25Ni20模具钢。相较于采用石墨,采用钢材作为吹塑模具400的材质,钢材具有更好的切削特性及耐烧性,制备吹塑模具400时更好加工,且进行计算机数字化控制精密机械加工(CNC加工)时更不容易损坏(石墨加工特性不好,进行CNC加工制备吹塑模具400时,容易崩,导致磨具损坏)。Optionally, the blow mold 400 is made of steel, such as OCr25Ni20 mold steel. Compared with using graphite, steel is used as the material of the blow mold 400. Steel has better cutting characteristics and burning resistance. It is easier to process when preparing the blow mold 400, and computer digital controlled precision machining (CNC machining) is performed. It is less likely to be damaged (graphite processing characteristics are not good, and it is easy to collapse when CNC processing is used to prepare the blow mold 400, resulting in damage to the abrasive tool).

在一些实施例中,本申请实施例的壳体100的制备方法还包括:对所述壳体100进行CNC加工及抛光。In some embodiments, the method for preparing the housing 100 in the embodiment of the present application further includes: CNC machining and polishing the housing 100 .

可选地,使用带探针的精雕机对激光切割后的壳体100进行去毛刺及精修,刀具采用独特设计的扇形砂轮棒,去毛刺使用400#,进给量为1200mm/min,转速40000rpm,Z向(壳体100厚度方向)切深0.3mm;精修使用100#,进给量为1400mm/min,转速34000rpm,Z向切深0.04mm。再采用混合毛刷(0.3mm直径的白色尼龙丝,加75硬度的磨皮条,混合比例1:1),对侧部13进行抛光,去除CNC后留下的刀纹印,抛光盘上盘转速160rpm至190rpm,抛光盘下盘转速35rpm至50rpm,抛光压力100Kg至120kg,抛光时间20min至30min。Optionally, use an engraving machine with a probe to deburr and finish the laser-cut housing 100. The tool uses a uniquely designed fan-shaped grinding wheel bar. Use 400# for deburring, and the feed rate is 1200mm/min. The rotating speed is 40000rpm, the depth of cut in the Z direction (100 thickness direction of the shell) is 0.3mm; 100# is used for finishing, the feed rate is 1400mm/min, the rotating speed is 34000rpm, and the depth of cut in the Z direction is 0.04mm. Then use a mixed brush (0.3mm diameter white nylon filament, plus 75 hardness grinding strip, mixing ratio 1:1) to polish side 13 to remove the knife mark left after CNC. The upper disk speed of the polishing disk 160rpm to 190rpm, the rotating speed of the lower plate of the polishing disc is 35rpm to 50rpm, the polishing pressure is 100Kg to 120kg, and the polishing time is 20min to 30min.

在一些实施例中,所述壳体100的材质为玻璃,本申请实施例的壳体100的制备方法还包括:对所述壳体100进行化学强化。In some embodiments, the housing 100 is made of glass. The method for preparing the housing 100 in the embodiment of the present application further includes: chemically strengthening the housing 100 .

可选地,所述对所述壳体100进行化学强化,包括:第一强化以及第二强化。第一强化包括将壳体100于370℃至390℃预热60min,于温度为430℃至450℃的硝酸钠(NaNO3)熔融液中进行化学强化,时间为70min至180min;所述第二强化包括将壳体100于370℃至390℃预热60min,于温度为410℃至450℃的硝酸钾(KNO3)熔融液中进行化学强化,时间为70min至150min,以使玻璃基材变为钢化玻璃,提高壳体100的各项机械性能,例如强度及硬度。可选地,第一强化的温度可以为但不限于为430℃、435℃、440℃、445℃、450℃等。第一强化的时间为70min、80min、100min、120min、140min、160min、180min等。可选地,第二强化的温度可以为但不限于为410℃、420℃、430℃、435℃、440℃、445℃、450℃等。第二强化的时间为70min、80min、100min、120min、140min、150min等。Optionally, the chemical strengthening of the housing 100 includes: first strengthening and second strengthening. The first strengthening includes preheating the shell 100 at 370°C to 390°C for 60 minutes, and performing chemical strengthening in a sodium nitrate (NaNO3) melt at a temperature of 430°C to 450°C for a time of 70min to 180min; the second strengthening It includes preheating the shell 100 at 370°C to 390°C for 60 minutes, and chemically strengthening it in a potassium nitrate (KNO3) melt at a temperature of 410°C to 450°C for a time of 70min to 150min, so that the glass substrate becomes tempered. Glass improves various mechanical properties of the housing 100, such as strength and hardness. Alternatively, the temperature of the first strengthening may be, but is not limited to, 430°C, 435°C, 440°C, 445°C, 450°C, etc. The first strengthening time is 70min, 80min, 100min, 120min, 140min, 160min, 180min, etc. Alternatively, the temperature of the second strengthening may be, but is not limited to, 410°C, 420°C, 430°C, 435°C, 440°C, 445°C, 450°C, etc. The second strengthening time is 70min, 80min, 100min, 120min, 140min, 150min, etc.

本实施例与上述实施例相同特征部分的详细描述请参见上述实施例,在此不再赘述。For a detailed description of the same features of this embodiment and the above-mentioned embodiment, please refer to the above-mentioned embodiment and will not be described again here.

本申请的壳体100的制备方法采用吹塑成型进行制备,其可以获得超过90°弯折角度的壳体,即获得所述第一表面111与所述第二表面131之间的角度α的范围为40°至90°的壳体100,从而使得壳体100应用于电子设备时,可以将前盖与中框一体化或中框与后盖一体化;且使用时,壳体100与后盖、或壳体100与前盖之间不存在间隙,可以使得电子设备的外观更为美观,密封性及防水性能更好。此外,当前盖与中框一体化设计时,还可以使电子设备可以应用于侧面屏幕显示。再者,当需要制备不等厚壳体100时,相较于热弯成型,使用吹塑成型制备的壳体100的工艺更为简便、制备成本更低。The preparation method of the housing 100 of the present application adopts blow molding, which can obtain a housing with a bending angle exceeding 90°, that is, the angle α between the first surface 111 and the second surface 131 can be obtained. The housing 100 ranges from 40° to 90°, so that when the housing 100 is used in electronic equipment, the front cover and the middle frame can be integrated or the middle frame and the back cover can be integrated; and when used, the housing 100 and the back cover can be integrated. There is no gap between the cover or the casing 100 and the front cover, which can make the appearance of the electronic device more beautiful, and the sealing and waterproof performance are better. In addition, when the front cover and the middle frame are integrated, electronic devices can also be used for side screen display. Furthermore, when it is necessary to prepare the shell 100 with unequal thicknesses, the shell 100 prepared by blow molding has a simpler process and lower manufacturing cost than hot bending molding.

请参见图18,本申请实施例还提供一种壳体100的制备方法,所述壳体100包括壳体本体10、第一遮光部30、装饰部50及第二遮光部70;所述壳体本体10包括弯折相连的所述主体部11及所述侧部13,所述主体部11与所述侧部13围合成容置空间101,所述主体部11包括第一表面111,所述侧部13包括第二表面131、弯曲面133及端面135,所述弯曲面133的相对两端分别连接所述第一表面111及所述第二表面131,所述第一表面111、弯曲面133及所述第二表面131围合成所述容置空间101,所述端面135连接所述第二表面131远离所述弯曲面133的一端,所述第一遮光部30覆盖于所述侧部13的所述第二表面131及所述弯曲面133上;所述装饰部50覆盖于所述侧部13的至少部分所述端面135上;所述第二遮光部70至少覆盖于所述装饰部50且与所述第一遮光部30至少部分叠合。所述方法包括:Referring to Figure 18, an embodiment of the present application also provides a method of preparing a housing 100. The housing 100 includes a housing body 10, a first light-shielding part 30, a decorative part 50 and a second light-shielding part 70; The main body 10 includes the main body part 11 and the side parts 13 that are bent and connected. The main body part 11 and the side parts 13 enclose a receiving space 101. The main body part 11 includes a first surface 111. The side portion 13 includes a second surface 131, a curved surface 133 and an end surface 135. The opposite ends of the curved surface 133 are connected to the first surface 111 and the second surface 131 respectively. The surface 133 and the second surface 131 enclose the accommodation space 101. The end surface 135 connects an end of the second surface 131 away from the curved surface 133. The first light shielding part 30 covers the side surface 133 and the second surface 131. on the second surface 131 and the curved surface 133 of the side part 13; the decorative part 50 covers at least part of the end surface 135 of the side part 13; the second light-shielding part 70 covers at least the The decorative part 50 is at least partially overlapped with the first light-shielding part 30 . The methods include:

S501,制备胚体300,所述胚体300具有通孔301;S501, prepare an embryo body 300, which has a through hole 301;

S502,将所述胚体300设置于吹塑模具400中,在所述通孔301中通入气体,进行吹塑成型,以使所述胚体形成弯折相连且为一体结构的主体部11及侧部13,所述主体部11包括第一表面111;所述侧部13环绕所述主体部11的外周缘设置,所述主体部11与所述侧部13围合成容置空间101,所述第一表面111面向所述容置空间101,所述侧部13包括第二表面131,所述第二表面131环绕所述容置空间101,所述第一表面111与所述第二表面131之间的角度的范围为40°至90°,从而得到所述壳体本体10;S502, the embryo body 300 is placed in the blow mold 400, gas is introduced into the through hole 301, and blow molding is performed, so that the embryo body forms the main body portion 11 that is bent, connected and has an integrated structure. and the side part 13. The main part 11 includes a first surface 111; the side part 13 is arranged around the outer periphery of the main part 11, and the main part 11 and the side part 13 enclose a receiving space 101, The first surface 111 faces the accommodating space 101. The side portion 13 includes a second surface 131. The second surface 131 surrounds the accommodating space 101. The first surface 111 is connected to the second surface 131. The angle between the surfaces 131 ranges from 40° to 90°, thereby obtaining the housing body 10;

S503,对所述壳体本体10进行CNC加工、抛光及化学强化;S503, perform CNC machining, polishing and chemical strengthening on the housing body 10;

步骤S501及步骤S503的详细描述请参见上述实施例对应部分的描述,在此不再赘述。For detailed descriptions of step S501 and step S503, please refer to the description of the corresponding parts of the above embodiment, and will not be described again here.

S504,在所述侧部13的所述第二表面131及所述弯曲面133上形成第一遮光部30;S504, form the first light shielding portion 30 on the second surface 131 and the curved surface 133 of the side portion 13;

可选地,将黑色负性光刻胶涂覆与壳体本体10面向容置空间101的表面上形成光刻胶层,设置掩膜板,对第二表面131及第一遮光部30上对应的光刻胶层进行曝光,用显影液进行显影,将未曝光区域的光刻胶层显影掉,留下曝光区域的光刻胶层,经过硬烤后,形成第一遮光部30。Optionally, apply black negative photoresist to the surface of the housing body 10 facing the accommodation space 101 to form a photoresist layer, and set a mask to correspond to the second surface 131 and the first light-shielding portion 30 The photoresist layer is exposed and developed with a developer to develop away the photoresist layer in the unexposed area, leaving the photoresist layer in the exposed area. After hard baking, the first light-shielding portion 30 is formed.

S505,在至少部分所述端面135上形成装饰部50;以及S505, form the decorative portion 50 on at least part of the end surface 135; and

可选地,采用低张力的钢丝网版(10-15N),刮刀采用70-80度的硅胶,在至少部分所述端面135(例如不等厚区域)上进行丝印,形成装饰部50。可选地,装饰部50可以为镜面银,具有珠光粉等闪光效果的油墨层,或者具有红色、橙色、黄色、绿色、蓝色等颜色中的一种或多种。Optionally, use a low-tension steel mesh (10-15N) and a scraper using 70-80 degree silicone to perform silk printing on at least part of the end surface 135 (for example, an area of unequal thickness) to form the decorative portion 50 . Optionally, the decorative part 50 may be mirror silver, an ink layer with a glittering effect such as pearlescent powder, or one or more colors such as red, orange, yellow, green, blue, etc.

S506,在所述装饰部50上形成第二遮光部70,并使所述第二遮光部70与所述第一遮光部30至少部分叠合。S506: Form a second light-shielding portion 70 on the decorative portion 50, and make the second light-shielding portion 70 at least partially overlap the first light-shielding portion 30.

可选地,对无需设置第二遮光部70的部分采用保护膜进行保护,露出要形成第二遮光部70的区域,进行喷涂或印刷油墨,形成第二遮光部70。Optionally, a protective film is used to protect the portion where the second light shielding portion 70 is not required, the area where the second light shielding portion 70 is to be formed is exposed, and ink is sprayed or printed to form the second light shielding portion 70 .

本实施例与上述实施例相同特征部分的详细描述请参见上述实施例,在此不再赘述。For a detailed description of the same features of this embodiment and the above-mentioned embodiment, please refer to the above-mentioned embodiment and will not be described again here.

请参见图19至图21,本申请实施例还提供一种电子设备600,其包括:显示组件610、本申请实施例所述的壳体100以及电路板组件630。所述显示组件610用于显示;所述壳体100具有容置空间101,所述壳体100用于承载所述显示组件610;所述电路板组件630设置于所述容置空间101,且与所述显示组件610电连接,用于控制所述显示组件610进行显示。在一些实施例中,所述显示组件610还用于闭合所述容置空间101;换言之,所述壳体100与所述显示组件610围合成闭合的容置空间101。Referring to Figures 19 to 21, an embodiment of the present application further provides an electronic device 600, which includes: a display component 610, the housing 100 described in the embodiment of the present application, and a circuit board assembly 630. The display component 610 is used for display; the housing 100 has an accommodating space 101, and the housing 100 is used to carry the display component 610; the circuit board assembly 630 is disposed in the accommodating space 101, and It is electrically connected to the display component 610 and used to control the display component 610 to display. In some embodiments, the display component 610 is also used to close the accommodating space 101; in other words, the housing 100 and the display component 610 form a closed accommodating space 101.

本申请实施例的电子设备600可以为但不限于为手机、平板电脑、笔记本电脑、台式电脑、智能手环、智能手表、电子阅读器、游戏机等便携式电子设备。The electronic device 600 in the embodiment of the present application may be, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a desktop computer, a smart bracelet, a smart watch, an e-reader, a game console and other portable electronic devices.

关于壳体100的详细描述,请参见上述实施例对应部分的描述,在此不再赘述。For detailed description of the housing 100, please refer to the description of the corresponding parts of the above embodiment, and details will not be described again here.

可选地,所述显示组件610可以为但不限于为液晶显示组件、发光二极管显示组件(LED显示组件)、微发光二极管显示组件(MicroLED显示组件)、次毫米发光二极管显示组件(MiniLED显示组件)、有机发光二极管显示组件(OLED显示组件)等中的一种或多种。Optionally, the display component 610 may be, but is not limited to, a liquid crystal display component, a light emitting diode display component (LED display component), a micro light emitting diode display component (MicroLED display component), or a sub-millimeter light emitting diode display component (MiniLED display component). ), one or more of organic light-emitting diode display components (OLED display components), etc.

请一并参见图21,可选地,电路板组件630可以包括处理器631及存储器633。所述处理器631分别与所述显示组件610及存储器633电连接。所述处理器631用于控制所述显示组件610进行显示,所述存储器633用于存储所述处理器631运行所需的程序代码,控制显示组件610所需的程序代码、显示组件610的显示内容等。Referring also to FIG. 21 , optionally, the circuit board assembly 630 may include a processor 631 and a memory 633 . The processor 631 is electrically connected to the display component 610 and the memory 633 respectively. The processor 631 is used to control the display component 610 to display, and the memory 633 is used to store the program code required for the operation of the processor 631, the program code required for controlling the display component 610, and the display of the display component 610. Content etc.

可选地,处理器631包括一个或者多个通用处理器631,其中,通用处理器631可以是能够处理电子指令的任何类型的设备,包括中央处理器(Central Processing Unit,CPU)、微处理器、微控制器、主处理器、控制器以及ASIC等等。处理器631用于执行各种类型的数字存储指令,例如存储在存储器633中的软件或者固件程序,它能使计算设备提供较宽的多种服务。Optionally, the processor 631 includes one or more general-purpose processors 631, where the general-purpose processor 631 can be any type of device capable of processing electronic instructions, including a central processing unit (CPU), a microprocessor , microcontrollers, main processors, controllers, ASICs, etc. The processor 631 is used to execute various types of digital storage instructions, such as software or firmware programs stored in the memory 633, which can enable the computing device to provide a wide variety of services.

可选地,存储器633可以包括易失性存储器(Volatile Memory),例如随机存取存储器(Random Access Memory,RAM);存储器633也可以包括非易失性存储器(Non-VolatileMemory,NVM),例如只读存储器(Read-Only Memory,ROM)、快闪存储器(FlashMemory,FM)、硬盘(Hard Disk Drive,HDD)或固态硬盘(Solid-State Drive,SSD)。存储器633还可以包括上述种类的存储器的组合。Optionally, the memory 633 may include volatile memory (Volatile Memory), such as random access memory (Random Access Memory, RAM); the memory 633 may also include non-volatile memory (Non-Volatile Memory, NVM), such as only Read-Only Memory (ROM), Flash Memory (FM), Hard Disk Drive (HDD) or Solid-State Drive (SSD). Memory 633 may also include a combination of the types of memory described above.

在本申请中提及“实施例”“实施方式”意味着,结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的各个位置出现所述短语并不一定均是指相同的实施例,也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是,本申请所描述的实施例可以与其它实施例相结合。此外,还应该理解的是,本申请各实施例所描述的特征、结构或特性,在相互之间不存在矛盾的情况下,可以任意组合,形成又一未脱离本申请技术方案的精神和范围的实施例。Reference in this application to "an embodiment" or "an implementation" means that a particular feature, structure or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of recited phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments. In addition, it should also be understood that the features, structures or characteristics described in the embodiments of the present application can be arbitrarily combined to form another one without departing from the spirit and scope of the technical solution of the present application, provided there is no contradiction between them. embodiment.

最后应说明的是,以上实施方式仅用以说明本申请的技术方案而非限制,尽管参照以上较佳实施方式对本申请进行了详细说明,本领域的普通技术人员应当理解,可以对本申请的技术方案进行修改或等同替换都不应脱离本申请技术方案的精神和范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and are not limiting. Although the present application has been described in detail with reference to the above preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present application can be modified. Any modification or equivalent substitution of the solution shall not depart from the spirit and scope of the technical solution of this application.

Claims (13)

1.一种壳体的制备方法,其特征在于,包括:1. A method for preparing a shell, characterized in that it includes: 制备胚体,所述胚体具有通孔;以及Preparing an embryo body, the embryo body having through holes; and 将所述胚体设置于吹塑模具中,所述吹塑模具包括第一子模及第二子模,所述第一子模与所述第二子模围合形成模腔,所述模腔用于设置所述胚体,在所述通孔中通入气体,进行吹塑成型并进行冷却定型,以使所述胚体形成弯折相连且为一体结构的主体部及侧部,所述主体部包括第一表面;所述侧部环绕所述主体部的外周缘设置,所述主体部与所述侧部围合成容置空间,所述第一表面面向所述容置空间,所述侧部包括第二表面,所述第二表面环绕所述容置空间,所述第一表面与所述第二表面之间的角度的范围为40°至90°,从而得到所述壳体。The embryo body is placed in a blow mold. The blow mold includes a first sub-mold and a second sub-mold. The first sub-mold and the second sub-mold are enclosed to form a mold cavity. The mold The cavity is used to set the embryo body. Gas is introduced into the through hole for blow molding and cooling and shaping, so that the embryo body forms a main body and side parts that are bent and connected and have an integrated structure. The main body part includes a first surface; the side part is arranged around the outer periphery of the main body part, the main body part and the side part enclose an accommodation space, and the first surface faces the accommodation space, so The side portion includes a second surface surrounding the accommodation space, and an angle between the first surface and the second surface ranges from 40° to 90°, thereby obtaining the housing. . 2.根据权利要求1所述的壳体的制备方法,其特征在于,所述胚体包括第一部和第二部,所述第一部的厚度大于所述第二部的厚度;进行吹塑成型后,所述第一部形成至少部分所述侧部,所述第二部至少形成所述主体部。2. The method of preparing a shell according to claim 1, wherein the embryo body includes a first part and a second part, and the thickness of the first part is greater than the thickness of the second part; After molding, the first part forms at least part of the side part, and the second part forms at least the main body part. 3.根据权利要求2所述的壳体的制备方法,其特征在于,所述第一部包括第一子部及第二子部,所述第一子部及第二子部分别设置于所述第二部相对两端,所述通孔依次贯穿所述第一子部、第二部及第二子部,所述第一子部及所述第二子部的厚度均大于所述第二部的厚度,所述侧部包括依次首尾相连的第一子侧部、第二子侧部、第三子侧部及第四子侧部,进行吹塑成型后,所述第一子部形成所述第一子侧部、所述第二子部形成所述第三子侧部;所述第二部形成所述主体部及所述第二子侧部及所述第四子侧部;3. The method of manufacturing a casing according to claim 2, wherein the first part includes a first sub-part and a second sub-part, and the first sub-part and the second sub-part are respectively arranged on the At opposite ends of the second part, the through holes penetrate the first sub-part, the second part and the second sub-part in sequence, and the thickness of the first sub-part and the second sub-part is greater than that of the third sub-part. The thickness of the two parts. The side parts include a first sub-side part, a second sub-side part, a third sub-side part and a fourth sub-side part that are connected end to end. After blow molding, the first sub-part The first sub-side portion is formed, and the second sub-side portion forms the third sub-side portion; the second portion forms the main body portion, the second sub-side portion and the fourth sub-side portion. ; 或者,or, 所述第一部包括第一子部、第二子部、第三子部及第四子部,所述第二部包括第五子部及第六子部,所述第三子部、第五子部、第四子部及第六子部依次首尾相连形成筒体,所述第一子部及所述第二子部分别设置于所述筒体的相对两端,所述通孔依次贯穿所述第一子部、筒体及第二子部;所述第一子部、第三子部、第二子部及第四子部的厚度均大于所述第五子部的厚度且均大于所述第六子部的厚度;所述侧部包括依次首尾相连的第一子侧部、第二子侧部、第三子侧部及第四子侧部,进行吹塑成型后,所述第一子部形成所述第一子侧部、所述第三子部形成所述第二子侧部;所述第二子部形成所述第三子侧部、所述第四子部形成所述第四子侧部;所述第二部形成所述主体部。The first part includes a first sub-part, a second sub-part, a third sub-part and a fourth sub-part, the second part includes a fifth sub-part and a sixth sub-part, the third sub-part, the third sub-part and the fourth sub-part. The fifth sub-section, the fourth sub-section and the sixth sub-section are connected end to end in sequence to form a cylinder. The first sub-part and the second sub-part are respectively provided at opposite ends of the cylinder, and the through holes are sequentially Penetrating the first sub-part, the cylinder and the second sub-part; the thickness of the first sub-part, the third sub-part, the second sub-part and the fourth sub-part is greater than the thickness of the fifth sub-part and are greater than the thickness of the sixth sub-part; the side part includes a first sub-side part, a second sub-side part, a third sub-side part and a fourth sub-side part connected end to end in sequence. After blow molding, The first sub-part forms the first sub-side part, and the third sub-part forms the second sub-side part; the second sub-part forms the third sub-side part, the fourth sub-side part The second part forms the fourth sub-side part; the second part forms the main body part. 4.根据权利要求1-3任一项所述的壳体的制备方法,其特征在于,所述第一子模及所述第二子模中的至少一个具有冷却通道,所述冷却通道用于通冷却液,以对所述第一子模及所述第二子模进行冷却;所述吹塑模具的材质为钢材;所述第一子模包括第一模面,所述第二子模包括第二模面,当所述第一子模及所述第二子模闭合时,所述第一模面与所述第二模面围合成所述模腔,所述第一模面与所述第二模面均为镜面抛光表面。4. The method for preparing a shell according to any one of claims 1 to 3, characterized in that at least one of the first sub-mold and the second sub-mold has a cooling channel, and the cooling channel is Coolant is passed through to cool the first sub-mold and the second sub-mold; the blow mold is made of steel; the first sub-mold includes a first mold surface, and the second sub-mold The mold includes a second mold surface. When the first sub-mold and the second sub-mold are closed, the first mold surface and the second mold surface enclose the mold cavity. The first mold surface Both the second mold surface and the second mold surface are mirror polished surfaces. 5.根据权利要求4所述的壳体的制备方法,其特征在于,所述第一模面及所述第二模面均包括依次连接的第一子模面、第二子模面及第三子模面,所述第二子模面环绕所述第一子模面的外周缘设置,所述第三子模面环绕所述第二子模面的外周设置,所述第一子模面与所述第三子模面之间的角度的范围为40°至90°。5. The method for preparing a shell according to claim 4, wherein the first mold surface and the second mold surface each include a first sub-mold surface, a second sub-mold surface and a third sub-mold surface connected in sequence. Three sub-mold surfaces, the second sub-mold surface is arranged around the outer periphery of the first sub-mold surface, the third sub-mold surface is arranged around the outer periphery of the second sub-mold surface, the first sub-mold surface is The angle between the surface and the third sub-mold surface ranges from 40° to 90°. 6.一种壳体,其特征在于,所述壳体由权利要求1-5任一项所述的方法进行制备。6. A shell, characterized in that the shell is prepared by the method according to any one of claims 1-5. 7.根据权利要求6所述的壳体,其特征在于,至少部分所述侧部远离所述主体部的一端的厚度大于所述侧部连接所述主体部的一端的厚度。7. The housing according to claim 6, wherein at least part of the thickness of an end of the side portion away from the main body portion is greater than a thickness of an end of the side portion connected to the main body portion. 8.根据权利要求7所述的壳体,其特征在于,所述侧部包括弯曲部及平直部,所述弯曲部的相对两端分别连接所述主体部及所述平直部;至少部分所述弯曲部的厚度自连接所述主体部的一端向连接所述平直部的一端,由所述主体部的厚度逐渐增大至所述平直部的厚度。8. The housing according to claim 7, wherein the side portion includes a curved portion and a straight portion, and opposite ends of the curved portion are respectively connected to the main body portion and the straight portion; at least The thickness of part of the curved portion gradually increases from the end connected to the main body portion to the end connected to the straight portion, from the thickness of the main body portion to the thickness of the straight portion. 9.根据权利要求6所述的壳体,其特征在于,所述侧部包括依次首尾相连的第一子侧部、第二子侧部、第三子侧部及第四子侧部,所述第二子侧部及所述第四子侧部的厚度与所述主体部的厚度相等,所述第一子侧部远离所述主体部的一端的厚度大于所述侧部连接所述主体部的一端的厚度;且所述第三子侧部远离所述主体部的一端的厚度大于所述侧部连接所述主体部的一端的厚度;9. The housing according to claim 6, wherein the side portions include a first sub-side portion, a second sub-side portion, a third sub-side portion and a fourth sub-side portion that are connected end to end in sequence, so The thickness of the second sub-side part and the fourth sub-side part is equal to the thickness of the main body part, and the thickness of the end of the first sub-side part away from the main body part is greater than the thickness of the side part connecting the main body. The thickness of one end of the third sub-side part away from the main body part is greater than the thickness of one end of the side part connected to the main body part; 或者;or; 所述侧部包括依次首尾相连的第一子侧部、第二子侧部、第三子侧部及第四子侧部,所述第一子侧部、第二子侧部、第三子侧部及第四子侧部远离所述主体部的一端的厚度均大于所述第一子侧部、第二子侧部、第三子侧部及第四子侧部靠近所述主体部的一端。The side part includes a first sub-side part, a second sub-side part, a third sub-side part and a fourth sub-side part that are connected end to end. The first sub-side part, the second sub-side part and the third sub-side part are connected in sequence. The thickness of one end of the side part and the fourth sub-side part away from the main part is greater than the thickness of the first sub-side part, the second sub-side part, the third sub-side part and the fourth sub-side part close to the main part. One end. 10.根据权利要求6-9任一项所述的壳体,其特征在于,所述主体部的厚度均匀,所述侧部连接所述主体部的一端的厚度等于所述主体部的厚度;至少部分所述侧部远离所述主体部的一端的厚度与所述侧部连接所述主体部的一端的厚度之差为0.5mm至2.5mm。10. The shell according to any one of claims 6 to 9, characterized in that the thickness of the main body part is uniform, and the thickness of one end of the side part connected to the main body part is equal to the thickness of the main body part; The difference between the thickness of at least part of the end of the side part away from the main part and the thickness of the end of the side part connected to the main part is 0.5 mm to 2.5 mm. 11.根据权利要求6-9任一项所述的壳体,其特征在于,所述侧部还包括端面及弯曲面,所述端面连接所述第二表面,所述端面位于所述侧部远离所述主体部的一端,所述端面与所述第一表面平行;所述弯曲面面向所述容置空间,所述弯曲面的相对两端分别与所述第一表面和所述第二表面相连,所述弯曲面的曲率半径为1mm至10mm。11. The housing according to any one of claims 6 to 9, wherein the side portion further includes an end surface and a curved surface, the end surface is connected to the second surface, and the end surface is located on the side portion. One end away from the main body part, the end surface is parallel to the first surface; the curved surface faces the accommodation space, and the opposite ends of the curved surface are respectively in contact with the first surface and the second surface. The surfaces are connected, and the radius of curvature of the curved surface is 1 mm to 10 mm. 12.根据权利要求11所述的壳体,其特征在于,所述壳体还包括:12. The housing according to claim 11, wherein the housing further comprises: 第一遮光部,所述第一遮光部覆盖于所述侧部的所述第二表面及所述弯曲面上;a first light-shielding part covering the second surface and the curved surface of the side part; 装饰部,所述装饰部覆盖于所述侧部的至少部分所述端面上;及a decorative portion covering at least part of the end surface of the side portion; and 第二遮光部,所述第二遮光部至少覆盖于所述装饰部且与所述第一遮光部至少部分叠合。A second light-shielding part covers at least the decorative part and at least partially overlaps with the first light-shielding part. 13.一种电子设备,其特征在于,包括:13. An electronic device, characterized in that it includes: 显示组件,用于显示;Display component, used for display; 权利要求6至12任一项所述的壳体,所述壳体具有容置空间,所述壳体用于承载所述显示组件;以及The housing according to any one of claims 6 to 12, the housing having a receiving space, the housing being used to carry the display component; and 电路板组件,所述电路板组件设置于所述容置空间,且与所述显示组件电连接,用于控制所述显示组件进行显示。A circuit board assembly is provided in the accommodation space and is electrically connected to the display assembly for controlling the display assembly to display.
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