CN113802157A - Acid copper-plated MVF350 blind hole filling liquid medicine - Google Patents
Acid copper-plated MVF350 blind hole filling liquid medicine Download PDFInfo
- Publication number
- CN113802157A CN113802157A CN202111175004.XA CN202111175004A CN113802157A CN 113802157 A CN113802157 A CN 113802157A CN 202111175004 A CN202111175004 A CN 202111175004A CN 113802157 A CN113802157 A CN 113802157A
- Authority
- CN
- China
- Prior art keywords
- blind hole
- hole filling
- mvf350
- plated
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000011049 filling Methods 0.000 title claims abstract description 68
- 239000007788 liquid Substances 0.000 title claims abstract description 18
- 239000003814 drug Substances 0.000 title claims abstract description 17
- 239000002253 acid Substances 0.000 title claims abstract description 9
- 238000007747 plating Methods 0.000 claims abstract description 75
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical class [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 61
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims abstract description 39
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910052802 copper Inorganic materials 0.000 claims abstract description 37
- 239000010949 copper Substances 0.000 claims abstract description 37
- 239000003112 inhibitor Substances 0.000 claims abstract description 28
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 26
- 238000007733 ion plating Methods 0.000 claims abstract description 11
- 229920001223 polyethylene glycol Polymers 0.000 claims description 34
- 239000002202 Polyethylene glycol Substances 0.000 claims description 30
- -1 chlorine ions Chemical class 0.000 claims description 27
- ZXSQEZNORDWBGZ-UHFFFAOYSA-N 1,3-dihydropyrrolo[2,3-b]pyridin-2-one Chemical compound C1=CN=C2NC(=O)CC2=C1 ZXSQEZNORDWBGZ-UHFFFAOYSA-N 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 20
- 229910001958 silver carbonate Inorganic materials 0.000 claims description 20
- LKZMBDSASOBTPN-UHFFFAOYSA-L silver carbonate Substances [Ag].[O-]C([O-])=O LKZMBDSASOBTPN-UHFFFAOYSA-L 0.000 claims description 20
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 18
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 18
- 230000002378 acidificating effect Effects 0.000 claims description 17
- 238000002156 mixing Methods 0.000 claims description 13
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 12
- 229910052708 sodium Inorganic materials 0.000 claims description 11
- 239000011734 sodium Substances 0.000 claims description 11
- 229910052799 carbon Inorganic materials 0.000 claims description 10
- 238000009713 electroplating Methods 0.000 claims description 10
- 238000012545 processing Methods 0.000 claims description 9
- 238000004132 cross linking Methods 0.000 claims description 7
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 6
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 6
- 239000002168 alkylating agent Substances 0.000 claims description 6
- 229940100198 alkylating agent Drugs 0.000 claims description 6
- 230000033228 biological regulation Effects 0.000 claims description 6
- 239000007795 chemical reaction product Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 6
- 229920001577 copolymer Polymers 0.000 claims description 6
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 6
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 6
- 239000012153 distilled water Substances 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000011068 loading method Methods 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 239000000460 chlorine Substances 0.000 claims description 5
- 229910052801 chlorine Inorganic materials 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 2
- 150000002391 heterocyclic compounds Chemical class 0.000 claims 1
- 239000006210 lotion Substances 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- FRTIVUOKBXDGPD-UHFFFAOYSA-M sodium;3-sulfanylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CCCS FRTIVUOKBXDGPD-UHFFFAOYSA-M 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 15
- 239000002245 particle Substances 0.000 abstract description 7
- 230000005764 inhibitory process Effects 0.000 abstract description 6
- 238000002310 reflectometry Methods 0.000 abstract description 6
- 230000002195 synergetic effect Effects 0.000 abstract description 6
- 239000013078 crystal Substances 0.000 description 9
- 230000009286 beneficial effect Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- KSMWLICLECSXMI-UHFFFAOYSA-N sodium;benzene Chemical compound [Na+].C1=CC=[C-]C=C1 KSMWLICLECSXMI-UHFFFAOYSA-N 0.000 description 5
- 238000005282 brightening Methods 0.000 description 4
- ZCYAYDMGVNGKJC-UHFFFAOYSA-N sulfanyl propane-1-sulfonate Chemical compound CCCS(=O)(=O)OS ZCYAYDMGVNGKJC-UHFFFAOYSA-N 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- 238000009736 wetting Methods 0.000 description 4
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229910021607 Silver chloride Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- SUVIGLJNEAMWEG-UHFFFAOYSA-N propane-1-thiol Chemical compound CCCS SUVIGLJNEAMWEG-UHFFFAOYSA-N 0.000 description 1
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses a liquid medicine for acid copper plating MVF350 blind hole filling, which belongs to the technical field of circuit copper plating and comprises the following components in parts by weight: 2-5 parts of accelerator, 30-50 parts of inhibitor, 1-5 parts of leveling agent and 40-60 parts of chloride ion plating solution. According to the invention, the electric reflectivity of electrode potential can be increased through the synergistic effect of the inhibition effect and the chloride ions, the compactness of copper particles precipitated from a cathode can be effectively improved, a copper plating layer is smoother, the effective control of the chloride ions in a copper plating solution is met by adjusting the addition amount of the modified activated carbon in the chloride ion solution, a good hole filling effect is further achieved, the ductility and reliability of the copper plating layer are effectively improved, and the application requirements of the printed circuit board industry are met.
Description
Technical Field
The invention belongs to the technical field of circuit copper plating, and particularly relates to a liquid medicine for acid copper plating MVF350 blind hole filling.
Background
With the rapid development of electronic devices, high-density, light-weight and high-integration printed circuit boards are necessary requirements of the industry. This demand has been accompanied by higher demands on the plating solutions used for filling the blind micro vias with electrolytic copper plating. Due to the higher dispersing ability of the high acid, low copper plating bath, there are great advantages in terms of quality and thickness of the deposited copper layer.
In the blind hole metallization process, a copper filling structure is adopted to improve the conduction performance between circuit board layers, improve the thermal conductivity of a product, reduce holes in the holes and reduce the loss of transmission signals, so that the reliability and stability of an electronic product are effectively improved, the copper filling structure means that the deposition rate of the bottom of each micropore is higher than that of the surface in the hole metallization process, and finally, the super-equal-angle deposition effect is achieved, Chinese patent document CN112030203A discloses a through hole electroplating hole filling method and a preparation method of a printed circuit board, and the method comprises the following steps: s1, performing reverse pulse electroplating on the substrate to be plated with the through hole by using the pulse electroplating solution; s2, carrying out hole filling processing on the through hole processed in the step S1; the pulse electroplating solution contains metal ions to be plated, halogen ions and an accelerator, wherein the accelerator comprises organic sulfonate, but in actual use, the addition of the organic sulfonate cannot accelerate the bottom of a blind hole, but can inhibit the deposition of metal copper, and the adjustment and control of the filling uniformity of the blind hole can be realized by matching with chloride ions, but the processing control of the chloride ions in production can only be realized by integrally blending tank liquor, so that the adjustment cost is high, and the control precision of the blind hole filling is influenced.
Disclosure of Invention
The invention aims to: the acid copper plating MVF350 blind hole filling liquid medicine is provided for solving the problem that the processing control of chloride ions can only be realized by integrally preparing a tank liquor, so that the adjustment cost is high.
In order to achieve the purpose, the invention adopts the following technical scheme:
a liquid medicine for acidic copper-plated MVF350 blind hole filling comprises the following components in parts by weight: 2-5 parts of accelerator, 30-50 parts of inhibitor, 1-5 parts of leveling agent and 40-60 parts of chloride ion plating solution.
As a further description of the above technical solution:
the chloride ion solution comprises chloride ions, copper sulfate, sulfuric acid, distilled water and modified activated carbon.
As a further description of the above technical solution:
the modified activated carbon is loaded with silver carbonate ions through polyethylene glycol.
As a further description of the above technical solution:
the accelerator is one of phenyl sodium polydithio-propane sulfonate, sodium polydithio-dipropyl sulfonate and 3-mercapto propane sulfonate.
As a further description of the above technical solution:
the inhibitor is a copolymer of ethylene glycol and propylene glycol.
As a further description of the above technical solution:
the leveler is the reaction product of a nitrogen-containing heterocyclic compound with acrylamide and an alkylating agent.
As a further description of the above technical solution:
the blind hole filling method using the acidic copper-plated MVF350 blind hole filling liquid medicine comprises the following steps: the method specifically comprises the following steps:
s101, stirring and mixing the chloride ion solution with the formula amount through a magnetic stirrer, sequentially adding an accelerator, an inhibitor and a leveling agent, fully and uniformly mixing to obtain a hole-filling plating solution, and reserving for later use;
s102, after the pressed circuit board is drilled, filling the prepared hole filling plating solution into the blind hole of the circuit board to be plated, and performing electroplating hole filling through regulation and control of a pulse circuit;
and S103, obtaining the printed circuit board after subsequent processing.
As a further description of the above technical solution:
modified load treatment of modified activated carbon: the modified active carbon is prepared by fully grinding and crushing the active carbon by a crusher, adding polyethylene glycol according to the formula ratio, adding silver carbonate ions, fully rolling the plate after heating, crosslinking with the polyethylene glycol, continuously adding the active carbon for loading after cooling, and granulating by a granulator.
As a further description of the above technical solution:
the weight ratio of the activated carbon to the polyethylene glycol to the silver carbonate is 3:2: 0.1-0.25.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
according to the invention, modification change of active carbon chloride ions is realized by crosslinking the polyethylene glycol and the silver carbonate to the active carbon, when the chloride ions in the copper plating solution are excessive, the crosslinked silver carbonate particles in the micropores of the active carbon can be replaced by the chloride ions to silver chloride and loaded into the active carbon to be separated out, the replaced carbonate ions can synchronously improve the replacement acceleration reaction, the polyethylene glycol can reflect the electric reflectivity for increasing the electrode potential through the synergistic effect of the inhibition effect and the chloride ions, the compactness of copper particles separated out from the cathode can be effectively improved, the copper plating layer is smoother, the effective control of the chloride ions in the copper plating solution is met by adjusting the addition amount of the modified active carbon in the chloride ion solution, a good hole filling effect is further achieved, the ductility and reliability of the copper plating layer are effectively improved, and the application requirements of the printed wiring board industry are met.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
the invention provides a technical scheme that: a liquid medicine for acidic copper-plated MVF350 blind hole filling comprises the following components in parts by weight: 2 parts of accelerator, 30 parts of inhibitor, 1 part of leveling agent and 40 parts of chloride ion plating solution;
the chlorine ion solution comprises chlorine ions, copper sulfate, sulfuric acid, distilled water and modified activated carbon, wherein the modified activated carbon is loaded with silver carbonate ions through polyethylene glycol, the accelerator is one of phenyl sodium polydithio propane sulfonate, sodium polydithio dipropyl sulfonate and 3-sodium mercaptopropane sulfonate, the inhibitor is a copolymer of ethylene glycol and propylene glycol, and the leveling agent is a reaction product of a nitrogen-containing heterocyclic compound, acrylamide and an alkylating agent;
the blind hole filling method using the acidic copper-plated MVF350 blind hole filling liquid medicine comprises the following steps: the method specifically comprises the following steps:
s101, stirring and mixing the chloride ion solution with the formula amount through a magnetic stirrer, sequentially adding an accelerator, an inhibitor and a leveling agent, fully and uniformly mixing to obtain a hole-filling plating solution, and reserving for later use;
s102, after the pressed circuit board is drilled, filling the prepared hole filling plating solution into the blind hole of the circuit board to be plated, and performing electroplating hole filling through regulation and control of a pulse circuit, wherein the hole filling rate is more than 90%, and the hole filling effect can be well achieved when the energization amount of the plating solution is within 200 A.h/L;
s103, obtaining a printed circuit board after subsequent processing;
modified load treatment of modified activated carbon: fully grinding and crushing the activated carbon by a crusher, adding polyethylene glycol according to the formula amount, adding silver carbonate ions, fully rolling the plate after heating, crosslinking with the polyethylene glycol, continuously adding the activated carbon for loading after cooling, and granulating by a granulator to obtain modified activated carbon;
the weight ratio of the activated carbon to the polyethylene glycol to the silver carbonate is 3:2: 0.1-0.25.
The implementation mode is specifically as follows: by adding the polyethylene glycol as the surfactant, the surface tension of the plating solution can be reduced, the wetting property of the plating solution can be more easily introduced into the blind hole, the exchange between the plating solution and the plating solution in the plating bath is improved, the synergistic effect of the inhibition effect and the chloride ions is reflected, the PEG is found to have the main effect of increasing the electric reflectivity of the electrode potential, the compactness of copper particles separated out from a cathode can be effectively improved by the characteristic, a copper plating layer is smoother, the surface tension of the plating solution can be reduced by the accelerator, the inhibitor and the leveling agent as well as the chloride ion plating solution, the dispersing capacity and the deep plating capacity of the plating solution are improved, the electrode process is improved, the plating quality is improved, the inhibitor can be beneficial to the formation of crystal nuclei, the crystal nuclei are more densely distributed, the copper plating layer is enabled to be smoother and reflect light, and the brightener is also called as a brightening agent.
Example 2:
the invention provides a technical scheme that: a liquid medicine for acidic copper-plated MVF350 blind hole filling comprises the following components in parts by weight: 3 parts of an accelerator, 40 parts of an inhibitor, 3 parts of a leveling agent and 45 parts of a chloride ion plating solution;
the chlorine ion solution comprises chlorine ions, copper sulfate, sulfuric acid, distilled water and modified activated carbon, wherein the modified activated carbon is loaded with silver carbonate ions through polyethylene glycol, the accelerator is one of phenyl sodium polydithio propane sulfonate, sodium polydithio dipropyl sulfonate and 3-sodium mercaptopropane sulfonate, the inhibitor is a copolymer of ethylene glycol and propylene glycol, and the leveling agent is a reaction product of a nitrogen-containing heterocyclic compound, acrylamide and an alkylating agent;
the blind hole filling method using the acidic copper-plated MVF350 blind hole filling liquid medicine comprises the following steps: the method specifically comprises the following steps:
s101, stirring and mixing the chloride ion solution with the formula amount through a magnetic stirrer, sequentially adding an accelerator, an inhibitor and a leveling agent, fully and uniformly mixing to obtain a hole-filling plating solution, and reserving for later use;
s102, after the pressed circuit board is drilled, filling the prepared hole filling plating solution into the blind hole of the circuit board to be plated, and performing electroplating hole filling through regulation and control of a pulse circuit;
s103, obtaining a printed circuit board after subsequent processing;
modified load treatment of modified activated carbon: fully grinding and crushing the activated carbon by a crusher, adding polyethylene glycol according to the formula amount, adding silver carbonate ions, fully rolling the plate after heating, crosslinking with the polyethylene glycol, continuously adding the activated carbon for loading after cooling, and granulating by a granulator to obtain modified activated carbon;
the weight ratio of the activated carbon to the polyethylene glycol to the silver carbonate is 3:2: 0.1-0.25.
The implementation mode is specifically as follows: by adding the polyethylene glycol as the surfactant, the surface tension of the plating solution can be reduced, the wetting property of the plating solution can be more easily introduced into the blind hole, the exchange between the plating solution and the plating solution in the plating bath is improved, the synergistic effect of the inhibition effect and the chloride ions is reflected, the PEG is found to have the main effect of increasing the electric reflectivity of the electrode potential, the compactness of copper particles separated out from a cathode can be effectively improved by the characteristic, a copper plating layer is smoother, the surface tension of the plating solution can be reduced by the accelerator, the inhibitor and the leveling agent as well as the chloride ion plating solution, the dispersing capacity and the deep plating capacity of the plating solution are improved, the electrode process is improved, the plating quality is improved, the inhibitor can be beneficial to the formation of crystal nuclei, the crystal nuclei are more densely distributed, the copper plating layer is enabled to be smoother and reflect light, and the brightener is also called as a brightening agent.
Example 3:
the invention provides a technical scheme that: a liquid medicine for acidic copper-plated MVF350 blind hole filling comprises the following components in parts by weight: 5 parts of accelerator, 50 parts of inhibitor, 5 parts of leveling agent and 60 parts of chloride ion plating solution;
the chlorine ion solution comprises chlorine ions, copper sulfate, sulfuric acid, distilled water and modified activated carbon, wherein the modified activated carbon is loaded with silver carbonate ions through polyethylene glycol, the accelerator is one of phenyl sodium polydithio propane sulfonate, sodium polydithio dipropyl sulfonate and 3-sodium mercaptopropane sulfonate, the inhibitor is a copolymer of ethylene glycol and propylene glycol, and the leveling agent is a reaction product of a nitrogen-containing heterocyclic compound, acrylamide and an alkylating agent;
the blind hole filling method using the acidic copper-plated MVF350 blind hole filling liquid medicine comprises the following steps: the method specifically comprises the following steps:
s101, stirring and mixing the chloride ion solution with the formula amount through a magnetic stirrer, sequentially adding an accelerator, an inhibitor and a leveling agent, fully and uniformly mixing to obtain a hole-filling plating solution, and reserving for later use;
s102, after the pressed circuit board is drilled, filling the prepared hole filling plating solution into the blind hole of the circuit board to be plated, and performing electroplating hole filling through regulation and control of a pulse circuit;
s103, obtaining a printed circuit board after subsequent processing;
modified load treatment of modified activated carbon: fully grinding and crushing the activated carbon by a crusher, adding polyethylene glycol according to the formula amount, adding silver carbonate ions, fully rolling the plate after heating, crosslinking with the polyethylene glycol, continuously adding the activated carbon for loading after cooling, and granulating by a granulator to obtain modified activated carbon;
the weight ratio of the activated carbon to the polyethylene glycol to the silver carbonate is 3:2: 0.1-0.25.
The implementation mode is specifically as follows: by adding the polyethylene glycol as the surfactant, the surface tension of the plating solution can be reduced, the wetting property of the plating solution can be more easily introduced into the blind hole, the exchange between the plating solution and the plating solution in the plating bath is improved, the synergistic effect of the inhibition effect and the chloride ions is reflected, the PEG is found to have the main effect of increasing the electric reflectivity of the electrode potential, the compactness of copper particles separated out from a cathode can be effectively improved by the characteristic, a copper plating layer is smoother, the surface tension of the plating solution can be reduced by the accelerator, the inhibitor and the leveling agent as well as the chloride ion plating solution, the dispersing capacity and the deep plating capacity of the plating solution are improved, the electrode process is improved, the plating quality is improved, the inhibitor can be beneficial to the formation of crystal nuclei, the crystal nuclei are more densely distributed, the copper plating layer is enabled to be smoother and reflect light, and the brightener is also called as a brightening agent.
Example 4:
the invention provides a technical scheme that: a liquid medicine for acidic copper-plated MVF350 blind hole filling comprises the following components in parts by weight: 3.8 parts of an accelerator, 35 parts of an inhibitor, 3.6 parts of a leveling agent and 50 parts of a chloride ion plating solution;
the chlorine ion solution comprises chlorine ions, copper sulfate, sulfuric acid, distilled water and modified activated carbon, wherein the modified activated carbon is loaded with silver carbonate ions through polyethylene glycol, the accelerator is one of phenyl sodium polydithio propane sulfonate, sodium polydithio dipropyl sulfonate and 3-sodium mercaptopropane sulfonate, the inhibitor is a copolymer of ethylene glycol and propylene glycol, and the leveling agent is a reaction product of a nitrogen-containing heterocyclic compound, acrylamide and an alkylating agent;
the blind hole filling method using the acidic copper-plated MVF350 blind hole filling liquid medicine comprises the following steps: the method specifically comprises the following steps:
s101, stirring and mixing the chloride ion solution with the formula amount through a magnetic stirrer, sequentially adding an accelerator, an inhibitor and a leveling agent, fully and uniformly mixing to obtain a hole-filling plating solution, and reserving for later use;
s102, after the pressed circuit board is drilled, filling the prepared hole filling plating solution into the blind hole of the circuit board to be plated, and performing electroplating hole filling through regulation and control of a pulse circuit;
s103, obtaining a printed circuit board after subsequent processing;
modified load treatment of modified activated carbon: fully grinding and crushing the activated carbon by a crusher, adding polyethylene glycol according to the formula amount, adding silver carbonate ions, fully rolling the plate after heating, crosslinking with the polyethylene glycol, continuously adding the activated carbon for loading after cooling, and granulating by a granulator to obtain modified activated carbon;
the weight ratio of the activated carbon to the polyethylene glycol to the silver carbonate is 3:2: 0.1-0.25.
The implementation mode is specifically as follows: by adding the polyethylene glycol as the surfactant, the surface tension of the plating solution can be reduced, the wetting property of the plating solution can be more easily introduced into the blind hole, the exchange between the plating solution and the plating solution in the plating bath is improved, the synergistic effect of the inhibition effect and the chloride ions is reflected, the PEG is found to have the main effect of increasing the electric reflectivity of the electrode potential, the compactness of copper particles separated out from a cathode can be effectively improved by the characteristic, a copper plating layer is smoother, the surface tension of the plating solution can be reduced by the accelerator, the inhibitor and the leveling agent as well as the chloride ion plating solution, the dispersing capacity and the deep plating capacity of the plating solution are improved, the electrode process is improved, the plating quality is improved, the inhibitor can be beneficial to the formation of crystal nuclei, the crystal nuclei are more densely distributed, the copper plating layer is enabled to be smoother and reflect light, and the brightener is also called as a brightening agent.
The pore-filling samples of examples 1-4 were subjected to metallographic microtomy analysis, surface smoothness analysis and copper phase ductility and tensile strength testing by an electronic universal tester to give the following table:
as can be seen from the above table, the amount of the inhibitor and the accelerator added in examples 1 to 4 has a large influence on the hole filling effect, and the accelerator alone cannot accelerate the bottom of the blind hole, but can inhibit the deposition of the copper metal, and only in the composite addition can accelerate the deposition of the copper at the bottom of the blind hole, so as to facilitate the formation of crystal nuclei, and the copper layer thickness, the force elongation, the tensile strength and the surface smoothness in example 4 are good, which is a preferred embodiment of the present invention.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (9)
1. The liquid medicine for acidic copper-plated MVF350 blind hole filling is characterized by comprising the following components in parts by weight: 2-5 parts of accelerator, 30-50 parts of inhibitor, 1-5 parts of leveling agent and 40-60 parts of chloride ion plating solution.
2. The chemical solution for acidic copper-plating MVF350 blind hole filling as claimed in claim 1, wherein the chlorine ion solution comprises chlorine ions, copper sulfate, sulfuric acid, distilled water and modified activated carbon.
3. The acidic copper-plated MVF350 blind hole filling liquid medicine as claimed in claim 2, wherein the modified activated carbon is loaded with silver carbonate ions through polyethylene glycol.
4. The acidic copper-plated MVF350 blind hole filling chemical solution as claimed in claim 1, wherein the accelerator is one of sodium phenyl polydithio propane sulfonate, sodium polydithio dipropyl sulfonate and sodium 3-mercaptopropane sulfonate.
5. The acidic copper-plated MVF350 blind hole filling lotion as claimed in claim 1, wherein the inhibitor is a copolymer of ethylene glycol and propylene glycol.
6. The chemical solution for acidic copper plating MVF350 blind via filling of claim 1, wherein the leveling agent is a reaction product of a heterocyclic compound containing nitrogen with acrylamide and an alkylating agent.
7. The acid copper-plated MVF350 blind hole filling chemical solution as claimed in any one of claims 1 to 5, further comprising a blind hole filling method using the acid copper-plated MVF350 blind hole filling chemical solution: the method specifically comprises the following steps:
s101, stirring and mixing the chloride ion solution with the formula amount through a magnetic stirrer, sequentially adding an accelerator, an inhibitor and a leveling agent, fully and uniformly mixing to obtain a hole-filling plating solution, and reserving for later use;
s102, after the pressed circuit board is drilled, filling the prepared hole filling plating solution into the blind hole of the circuit board to be plated, and performing electroplating hole filling through regulation and control of a pulse circuit;
and S103, obtaining the printed circuit board after subsequent processing.
8. The acid copper-plated MVF350 blind hole filling chemical solution as claimed in claim 3, further comprising a modified load treatment on the modified activated carbon: the modified active carbon is prepared by fully grinding and crushing the active carbon by a crusher, adding polyethylene glycol according to the formula ratio, adding silver carbonate ions, fully rolling the plate after heating, crosslinking with the polyethylene glycol, continuously adding the active carbon for loading after cooling, and granulating by a granulator.
9. The chemical liquid for acidic copper-plating MVF350 blind hole filling as claimed in claim 8, wherein the weight ratio of the activated carbon, the polyethylene glycol and the silver carbonate is 3:2: 0.1-0.25.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111175004.XA CN113802157A (en) | 2021-10-09 | 2021-10-09 | Acid copper-plated MVF350 blind hole filling liquid medicine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111175004.XA CN113802157A (en) | 2021-10-09 | 2021-10-09 | Acid copper-plated MVF350 blind hole filling liquid medicine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113802157A true CN113802157A (en) | 2021-12-17 |
Family
ID=78897420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111175004.XA Pending CN113802157A (en) | 2021-10-09 | 2021-10-09 | Acid copper-plated MVF350 blind hole filling liquid medicine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113802157A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105441993A (en) * | 2015-12-22 | 2016-03-30 | 苏州禾川化学技术服务有限公司 | Electroplating solution and electroplating method for electroplating through holes and blind holes of circuit boards |
| CN106000119A (en) * | 2016-06-06 | 2016-10-12 | 西北大学 | Polyethylene glycol desulphurization composite film filled with active carbon and preparation method thereof |
-
2021
- 2021-10-09 CN CN202111175004.XA patent/CN113802157A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105441993A (en) * | 2015-12-22 | 2016-03-30 | 苏州禾川化学技术服务有限公司 | Electroplating solution and electroplating method for electroplating through holes and blind holes of circuit boards |
| CN106000119A (en) * | 2016-06-06 | 2016-10-12 | 西北大学 | Polyethylene glycol desulphurization composite film filled with active carbon and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AU640169B2 (en) | Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same | |
| US20190100848A1 (en) | Copper Electroplating Solution and Copper Electroplating Process | |
| CN112899736A (en) | PCB high-longitudinal-transverse-through-hole electro-coppering additive and preparation method thereof | |
| EP1897973A1 (en) | Deposition of conductive polymer and metallization of non-conductive substrates | |
| EP2447296B1 (en) | Compostion and method for the deposition of conductive polymers on dielectric substrates | |
| KR100738824B1 (en) | A solution for copper electroplating for the metallization of micron or sub-micron dimensioned trenches or vias for a semiconductor device and a process for the metallization using the solution | |
| CN110424030B (en) | Cyanide-free alkaline copper electroplating solution, preparation thereof and application thereof in flexible printed circuit board | |
| US5171417A (en) | Copper foils for printed circuit board applications and procedures and electrolyte bath solutions for electrodepositing the same | |
| CN114150351A (en) | High-speed copper electroplating solution and ceramic substrate pattern electroplating method thereof | |
| Guo et al. | Electroplated copper additives for advanced packaging: a review | |
| CN111455416B (en) | Preparation process of high-mechanical-property electrolytic copper foil of high-precision circuit board | |
| KR20040073974A (en) | Electroplating composition | |
| EP1897974B1 (en) | Deposition of conductive polymer and metallization of non-conductive substrates | |
| CN112877739B (en) | Electroplating solution and electroplating method and application thereof | |
| US3812020A (en) | Electrolyte and method for electroplating an indium-copper alloy and printed circuits so plated | |
| CN113802157A (en) | Acid copper-plated MVF350 blind hole filling liquid medicine | |
| TW201910565A (en) | Electrolytic copper plating anode and electrolytic copper plating device using same | |
| EP3288990A1 (en) | Reaction products of bisanhydrids and diamines as additives for electroplating baths | |
| CN112899737A (en) | Blind hole filling copper electroplating solution and application thereof | |
| Yeh et al. | Micro via filling plating technology for IC substrate applications | |
| Nikolova et al. | Innovatve acid copper process for simultaneously filling vias and plating through holes | |
| Ganesan et al. | Innovative advances in copper electroplating for IC Substrate manufacturing | |
| EP1897975B1 (en) | Deposition of conductive polymer and metallization of non-conductive substrates | |
| US20240183052A1 (en) | A process for electrochemical deposition of copper with different current densities | |
| Yen et al. | Next generation electroplating technology for high planarity, minimum surface deposition microvia filling |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211217 |