CN113798037A - Raw material pretreatment process suitable for chip packaging materials with different attributes - Google Patents
Raw material pretreatment process suitable for chip packaging materials with different attributes Download PDFInfo
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- CN113798037A CN113798037A CN202111069101.0A CN202111069101A CN113798037A CN 113798037 A CN113798037 A CN 113798037A CN 202111069101 A CN202111069101 A CN 202111069101A CN 113798037 A CN113798037 A CN 113798037A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C21/00—Disintegrating plant with or without drying of the material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2/00—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
- B01J2/20—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic by expressing the material, e.g. through sieves and fragmenting the extruded length
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
- B03C—MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
- B03C1/00—Magnetic separation
- B03C1/02—Magnetic separation acting directly on the substance being separated
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Food Science & Technology (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a raw material pretreatment process suitable for chip packaging materials with different attributes, which comprises the following raw materials in parts: raw materials of the chip packaging material, an accelerator, a diluent, a coupling agent, a thixotropic agent and conductive adhesive. According to the raw material pretreatment process suitable for the chip packaging materials with different attributes, the particle size of the raw materials of the chip packaging materials after the pre-crushing treatment can be finer, the particle size distribution is narrow, the chemical composition is accurate and uniform, the chemical degree is high, the particles are close to spherical, the surface area of the raw materials is increased, the surface activity is high, the molecules are diffused, the dynamic process of the prepared chip packaging materials is greatly influenced, the service performance of the chip is improved, original impurities in the raw materials can be removed through impurity removal treatment of the raw materials, if the impurities are not removed, the impurities can influence the processing efficiency of the raw materials, the ball milling time is prolonged, and the products are easy to generate defects.
Description
Technical Field
The invention relates to the field of raw material pretreatment of chip packaging materials, in particular to a raw material pretreatment process suitable for chip packaging materials with different attributes.
Background
The chip packaging material is prepared before the final processing is completed, the chip packaging refers to a shell which is arranged on a semiconductor integrated circuit chip and is a bridge for communicating the internal world of the chip with an external circuit, a connection point on the chip is connected to pins of the packaging shell through a lead on a printed board, the pins are connected with other devices through leads on the printed board, the existing chips have different efficacies, the matched requirements on heat resistance and electric conduction are different, and when the chip packaging material is selected, the material matched with the chip packaging material needs to be selected.
Disclosure of Invention
The invention mainly aims to provide a raw material pretreatment process suitable for chip packaging materials with different attributes, which can effectively solve the problems in the background art.
In order to achieve the purpose, the invention adopts the technical scheme that:
comprises the following raw materials in parts by weight: the chip packaging material comprises raw materials, an accelerator, a diluent, a coupling agent, a thixotropic agent and a conductive adhesive, wherein the raw materials comprise 55-64% of the chip packaging material, 1-3% of the accelerator, 3-5% of the diluent, 1-6% of the coupling agent, 1-3% of the thixotropic agent and 30-44% of the conductive adhesive.
Preferably, the proportion of the raw material of the chip packaging material is 56%, the proportion of the accelerator is 2%, the proportion of the diluent is 4%, the proportion of the coupling agent is 2%, the proportion of the thixotropic agent is 2%, and the proportion of the conductive adhesive is 34%.
Preferably, the proportion of the raw material of the chip packaging material is 60%, the proportion of the accelerator is 2.6%, the proportion of the diluent is 3.5%, the proportion of the coupling agent is 2.3%, the proportion of the thixotropic agent is 1.6%, and the proportion of the conductive adhesive is 30%.
Preferably, the pre-crushing treatment of the raw material of the chip packaging material comprises the following steps: processing raw materials, putting the large raw materials into a jaw crusher for crushing to 3-5mm, after crushing, putting the 3-5mm raw materials into a Raymond mill for further grinding to 0.1-3mm, and standing for later use.
Preferably, the homogenization treatment of the raw materials of the chip packaging material comprises the following steps: putting the raw materials which are cracked to be 0.1-3mm into a stirring granulator to work, stirring and mixing the raw materials by a stirring impeller and a scraper of the granulator, extruding pug into granules, discharging the granules out of the granulator, and transferring the discharged raw material granules into a staling bin for storage.
Preferably, the impurity removal treatment of the raw materials of the chip packaging material: removing large blocks of impurities or blocky raw materials with concentrated impurities in the raw materials by using a manual selection mode, then absorbing magnetic coloring oxides such as iron in the raw materials by using magnetic force, placing a permanent magnet in the raw materials in the magnetic separation process, then periodically manually taking out and cleaning, placing the raw materials in a calcining furnace with the temperature of 1200-1300 ℃ for calcining after the magnetic separation is finished, and then crushing and screening to remove graphite schists in the raw materials, wherein the principle can be used for manufacturing the raw materials of the chip packaging materials.
Preferably, the treatment of the accelerator: taking out a certain amount of imidazole and its salt, phosphorus-containing compound, guanidine derivative and organic urea, placing them into a culture dish, sealing and storing, combining all the reactions together, and placing them for standby.
Preferably, the treatment of the diluent: taking out 10% of isopropanol, 40% of toluene and 50% of butanone, placing the mixture into a reagent bottle, completely sealing the reagent bottle, shaking the reagent bottle to completely fuse the reagent bottle together, and placing the reagent bottle for later use.
Preferably, the treatment with the coupling agent: taking out a certain amount of amino, sulfydryl, vinyl, epoxy, cyano and methacryloxy, placing the amino, sulfydryl, vinyl, epoxy, cyano and methacryloxy into a test tube, stirring, standing the test tube after stirring, and standing the test tube for later use.
Preferably, the treatment of the thixotropic agent: and (3) combusting a certain amount of silicon tetrachloride and air to obtain the silicon dioxide thixotropic agent.
Preferably, the treatment of the epoxy resin and the bisphenol a-epichlorohydrin type epoxy resin: placing a certain amount of epoxy resin, bisphenol A-epichlorohydrin epoxy resin and an accelerator together, stirring uniformly, grinding the epoxy resin and the accelerator by using a grinder, adding a diluent into the ground material, stirring and mixing the diluent, adding a coupling agent, stirring and mixing the coupling agent and the thixotropic agent, adding the coupling agent and the thixotropic agent, stirring and mixing the coupling agent and the thixotropic agent, and placing the obtained material for later use.
Preferably, the pretreatment of the raw materials of the chip packaging material: and mixing the mixed material with the raw material of the chip packaging material to manufacture the chip package.
Compared with the prior art, the invention has the following beneficial effects:
in the invention, the particle size of the raw material of the chip packaging material after the pre-crushing treatment can be finer, the particle size distribution is narrow, the chemical composition is accurate and uniform, the chemical degree is high, the particles are close to spherical, the surface area of the raw material is increased, the surface activity is high, the surface and interface properties are greatly changed, the diffusion of molecules is realized, the dynamic process of the prepared chip packaging material is greatly influenced, the service performance of a chip is improved, the impurities in the raw material can be removed through the impurity removal treatment of the raw material, if the impurities are not removed, the processing efficiency of the raw material can be influenced, the ball milling time is prolonged, the product is easy to generate defects, the curing temperature can be reduced and the curing rate can be controlled through coating the accelerant on the surface of the chip packaging material, the operability of the conductive adhesive coated on the chip packaging material can be improved through coating the diluent, the coated thixotropic agent can ensure that the chip packaging material can keep certain fluidity and can also be quickly solidified to keep certain shape, so that the chip packaging material can not generate precipitation in the storage process.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
the invention relates to a raw material pretreatment process suitable for chip packaging materials with different attributes, which comprises the following raw materials in parts: the chip packaging material comprises raw materials, an accelerator, a diluent, a coupling agent, a thixotropic agent and a conductive adhesive, wherein the raw materials comprise 55-64% of the chip packaging material, 1-3% of the accelerator, 3-5% of the diluent, 1-6% of the coupling agent, 1-3% of the thixotropic agent and 30-44% of the conductive adhesive.
The proportion of the raw materials of the chip packaging material is 56%, the proportion of the accelerator is 2%, the proportion of the diluent is 4%, the proportion of the coupling agent is 2%, the proportion of the thixotropic agent is 2%, and the proportion of the conductive adhesive is 34%.
The method comprises the following manufacturing steps:
s1: pre-crushing raw materials of the chip packaging material: processing raw materials, putting the large raw materials into a jaw crusher for crushing to 3-5mm, after crushing, putting the 3-5mm raw materials into a Raymond mill for further grinding to 0.1-3mm, and standing for later use.
S2: homogenizing raw materials of the chip packaging material: putting the raw materials which are cracked to be 0.1-3mm into a stirring granulator to work, stirring and mixing the raw materials by a stirring impeller and a scraper of the granulator, extruding pug into granules, discharging the granules out of the granulator, and transferring the discharged raw material granules into a staling bin for storage.
S3: impurity removal treatment of raw materials of the chip packaging material: removing large blocks of impurities or blocky raw materials with concentrated impurities in the raw materials by using a manual selection mode, then absorbing magnetic coloring oxides such as iron in the raw materials by using magnetic force, placing a permanent magnet in the raw materials in the magnetic separation process, then periodically manually taking out and cleaning, placing the raw materials in a calcining furnace with the temperature of 1200-1300 ℃ for calcining after the magnetic separation is finished, and then crushing and screening to remove graphite schists in the raw materials, wherein the principle can be used for manufacturing the raw materials of the chip packaging materials.
S4: treatment of the accelerator: taking out a certain amount of imidazole and its salt, phosphorus-containing compound, guanidine derivative and organic urea, placing them into a culture dish, sealing and storing, combining all the reactions together, and placing them for standby.
S5: treatment of the diluent: taking out 10% of isopropanol, 40% of toluene and 50% of butanone, placing the mixture into a reagent bottle, completely sealing the reagent bottle, shaking the reagent bottle to completely fuse the reagent bottle together, and placing the reagent bottle for later use.
S6: treatment of a coupling agent: taking out a certain amount of amino, sulfydryl, vinyl, epoxy, cyano and methacryloxy, placing the amino, sulfydryl, vinyl, epoxy, cyano and methacryloxy into a test tube, stirring, standing the test tube after stirring, and standing the test tube for later use.
S7: treatment of thixotropic agent: and (3) combusting a certain amount of silicon tetrachloride and air to obtain the silicon dioxide thixotropic agent.
S8: treatment of epoxy resin and bisphenol a-epichlorohydrin type epoxy resin: placing a certain amount of epoxy resin, bisphenol A-epichlorohydrin epoxy resin and an accelerator together, stirring uniformly, grinding by using a grinder, adding a diluent into the ground material, stirring and mixing, adding a coupling agent, stirring and mixing, adding the coupling agent and a thixotropic agent, stirring and mixing, and placing the obtained material for later use.
S9: pretreating raw materials of a chip packaging material: and mixing the mixed material with the raw material of the chip packaging material to manufacture the chip package.
The second embodiment is as follows:
on the basis of the first embodiment, the invention relates to a raw material pretreatment process suitable for chip packaging materials with different attributes, which comprises the following raw materials in parts: the chip packaging material comprises raw materials, an accelerator, a diluent, a coupling agent, a thixotropic agent and a conductive adhesive, wherein the raw materials comprise 55-64% of the chip packaging material, 1-3% of the accelerator, 3-5% of the diluent, 1-6% of the coupling agent, 1-3% of the thixotropic agent and 30-44% of the conductive adhesive.
The proportion of the raw materials of the chip packaging material is 60%, the proportion of the accelerator is 2.6%, the proportion of the diluent is 3.5%, the proportion of the coupling agent is 2.3%, the proportion of the thixotropic agent is 1.6%, and the proportion of the conductive adhesive is 30%.
The method comprises the following manufacturing steps:
s1: pre-crushing raw materials of the chip packaging material: processing raw materials, putting the large raw materials into a jaw crusher for crushing to 3-5mm, after crushing, putting the 3-5mm raw materials into a Raymond mill for further grinding to 0.1-3mm, and standing for later use.
S2: homogenizing raw materials of the chip packaging material: putting the raw materials which are cracked to be 0.1-3mm into a stirring granulator to work, stirring and mixing the raw materials by a stirring impeller and a scraper of the granulator, extruding pug into granules, discharging the granules out of the granulator, and transferring the discharged raw material granules into a staling bin for storage.
S3: impurity removal treatment of raw materials of the chip packaging material: removing large blocks of impurities or blocky raw materials with concentrated impurities in the raw materials by using a manual selection mode, then absorbing magnetic coloring oxides such as iron in the raw materials by using magnetic force, placing a permanent magnet in the raw materials in the magnetic separation process, then periodically manually taking out and cleaning, placing the raw materials in a calcining furnace with the temperature of 1200-1300 ℃ for calcining after the magnetic separation is finished, and then crushing and screening to remove graphite schists in the raw materials, wherein the principle can be used for manufacturing the raw materials of the chip packaging materials.
S4: treatment of the accelerator: taking out a certain amount of imidazole and its salt, phosphorus-containing compound, guanidine derivative and organic urea, placing them into a culture dish, sealing and storing, combining all the reactions together, and placing them for standby.
S5: treatment of the diluent: taking out 10% of isopropanol, 40% of toluene and 50% of butanone, placing the mixture into a reagent bottle, completely sealing the reagent bottle, shaking the reagent bottle to completely fuse the reagent bottle together, and placing the reagent bottle for later use.
S6: treatment of a coupling agent: taking out a certain amount of amino, sulfydryl, vinyl, epoxy, cyano and methacryloxy, placing the amino, sulfydryl, vinyl, epoxy, cyano and methacryloxy into a test tube, stirring, standing the test tube after stirring, and standing the test tube for later use.
S7: treatment of thixotropic agent: and (3) combusting a certain amount of silicon tetrachloride and air to obtain the silicon dioxide thixotropic agent.
S8: treatment of epoxy resin and bisphenol a-epichlorohydrin type epoxy resin: placing a certain amount of epoxy resin, bisphenol A-epichlorohydrin epoxy resin and an accelerator together, stirring uniformly, grinding by using a grinder, adding a diluent into the ground material, stirring and mixing, adding a coupling agent, stirring and mixing, adding the coupling agent and a thixotropic agent, stirring and mixing, and placing the obtained material for later use.
S9: pretreating raw materials of a chip packaging material: and mixing the mixed material with the raw material of the chip packaging material to manufacture the chip package.
The particle size of the raw material of the chip packaging material after the pre-crushing treatment can be finer, the particle size distribution is narrow, the chemical composition is accurate and uniform, the chemical degree is high, the particles are close to spherical, the surface area of the raw material is increased, the surface activity is high, the surface and interface properties are greatly changed, the diffusion of molecules is realized, the dynamic process of the prepared chip packaging material is greatly influenced, the service performance of a chip is improved, the impurities in the raw material can be removed through the impurity removal treatment of the raw material, if the impurities are not removed, the processing efficiency of the raw material can be influenced, the ball milling time is prolonged, the product is easy to generate defects, the curing temperature can be reduced and the curing rate can be controlled through coating the accelerant on the surface of the chip packaging material, the operability of the conductive adhesive coated on the chip packaging material can be improved through coating the diluent, the coating thixotropic agent can keep the chip packaging material in certain fluidity and can also be quickly solidified to keep certain shape, so that the chip packaging material can not be precipitated in the storage process.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. A raw material pretreatment process suitable for chip packaging materials with different attributes is characterized by comprising the following steps of: comprises the following raw materials in parts by weight: the chip packaging material comprises raw materials, an accelerator, a diluent, a coupling agent, a thixotropic agent and a conductive adhesive, wherein the raw materials comprise 55-64% of the chip packaging material, 1-3% of the accelerator, 3-5% of the diluent, 1-6% of the coupling agent, 1-3% of the thixotropic agent and 30-44% of the conductive adhesive.
2. The raw material pretreatment process suitable for the chip packaging materials with different properties according to claim 1, wherein the raw material pretreatment process comprises the following steps: the proportion of the raw materials of the chip packaging material is 56%, the proportion of the accelerator is 2%, the proportion of the diluent is 4%, the proportion of the coupling agent is 2%, the proportion of the thixotropic agent is 2%, and the proportion of the conductive adhesive is 34%.
3. The raw material pretreatment process suitable for the chip packaging materials with different properties according to claim 1, wherein the raw material pretreatment process comprises the following steps: the chip packaging material comprises 60% of raw materials, 2.6% of accelerator, 3.5% of diluent, 2.3% of coupling agent, 1.6% of thixotropic agent and 30% of conductive adhesive.
4. The raw material pretreatment process suitable for the chip packaging materials with different properties according to claim 1, wherein the raw material pretreatment process comprises the following steps: the method comprises the following steps:
s1: pre-crushing raw materials of the chip packaging material: processing the raw materials, namely putting the large raw materials into a jaw crusher for crushing to enable the large raw materials to be crushed to 3-5mm, putting the raw materials with the size of 3-5mm into a Raymond mill for further grinding to enable the raw materials to be crushed to 0.1-3mm, and standing for later use;
s2: homogenizing raw materials of the chip packaging material: putting the raw materials which are crushed to 0.1-3mm into a stirring granulator to work, stirring and mixing the raw materials by a stirring impeller and a scraper of the granulator, extruding pug into granules, discharging the granules out of the granulator, and transferring the discharged raw material granules into a staling bin for storage;
s3: impurity removal treatment of raw materials of the chip packaging material: removing large blocks of impurities or blocky raw materials with concentrated impurities in the raw materials by manual selection, absorbing magnetic coloring oxides such as iron in the raw materials by magnetic force, placing a permanent magnet in the raw materials in the magnetic separation process, periodically manually taking out the raw materials and cleaning the raw materials, placing the raw materials in a calcining furnace at the temperature of 1200-1300 ℃ for calcining after the magnetic separation is finished, and then crushing and screening the raw materials to remove graphite schists in the raw materials, wherein the principle can be used for manufacturing the raw materials of the chip packaging materials;
s4: treatment of the accelerator: taking out a certain amount of imidazole and salts thereof, phosphorus-containing compounds, guanidine derivatives and organic urea, placing the imidazole and salts thereof, the phosphorus-containing compounds, the guanidine derivatives and the organic urea in a culture dish, sealing and storing the imidazole and salts, the phosphorus-containing compounds, the guanidine derivatives and the organic urea, and placing the imidazole and salts, the phosphorus-containing compounds, the guanidine derivatives and the organic urea for standby after all the imidazole and salts thereof react and are combined together;
s5: treatment of the diluent: taking out 10% of isopropanol, 40% of toluene and 50% of butanone, placing the mixture into a reagent bottle, completely sealing the reagent bottle, shaking the reagent bottle to completely fuse the reagent bottle and the reagent bottle for later use;
s6: treatment of a coupling agent: taking out a certain amount of amino, sulfydryl, vinyl, epoxy, cyano and methacryloxy, placing the amino, sulfydryl, vinyl, epoxy, cyano and methacryloxy into a test tube, stirring, standing the test tube after stirring, and standing the test tube for later use;
s7: treatment of thixotropic agent: burning a certain amount of silicon tetrachloride and air to obtain a silicon dioxide thixotropic agent;
s8: and (3) treating the conductive adhesive: preparing 100 parts of bisphenol A epoxy resin, 85 parts of 4-methylhexahydrophthalic anhydride curing agent and 1 part of imidazole catalyst to form matrix resin, firstly uniformly mixing the epoxy resin and the anhydride curing agent, then adding the surface-treated micron silver sheet, uniformly mixing, finally adding the curing catalyst, continuously stirring until the materials are uniformly mixed, and standing for later use;
s9: pretreating raw materials of a chip packaging material: mixing an accelerator, a diluent, a coupling agent and a thixotropic agent with the raw materials of the chip packaging material according to the parts, and then coating the conductive adhesive on the surface of the raw materials.
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