CN113787276A - Packaging machine welding head capable of adaptively adjusting levelness - Google Patents
Packaging machine welding head capable of adaptively adjusting levelness Download PDFInfo
- Publication number
- CN113787276A CN113787276A CN202111168348.8A CN202111168348A CN113787276A CN 113787276 A CN113787276 A CN 113787276A CN 202111168348 A CN202111168348 A CN 202111168348A CN 113787276 A CN113787276 A CN 113787276A
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- CN
- China
- Prior art keywords
- welding head
- adjusting
- sensor
- coil
- magnetostrictive material
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 title claims abstract description 57
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 32
- 238000005538 encapsulation Methods 0.000 claims description 2
- 230000003044 adaptive effect Effects 0.000 claims 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/02—Carriages for supporting the welding or cutting element
- B23K37/0252—Steering means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention discloses a packaging machine welding head capable of adaptively adjusting levelness, which comprises: the device comprises a welding head, adjusting devices, a sensor and a controller, wherein at least three adjusting devices are arranged on the side surface of the welding head, each adjusting device comprises a shell, a magnetostrictive material body, a coil and an adjusting rod, the magnetostrictive material bodies are arranged in the shells, the coils are sleeved on the magnetostrictive material bodies, and the adjusting rods are connected to the magnetostrictive material bodies; the sensor is arranged on the welding head and used for sensing the distance between the welding head and a part to be welded; the controller is connected with the sensor and the coil in a control mode, and the controller controls the current on the coil through the distance measured by the sensor. According to the invention, the problem that the welding head cannot adaptively adjust the flatness can be solved by arranging the plurality of adjusting devices on the side surface of the welding head.
Description
Technical Field
The invention belongs to the technical field of welding, and particularly relates to a welding head of a packaging machine capable of adaptively adjusting levelness.
Background
The packaging machine is a key device in a semiconductor packaging production line, and has a very wide application in chip packaging. With the progress of technology, the demand for bonding accuracy of a bonding head of a packaging machine has been increasing, and in a part of a process of mounting a chip (semiconductor chip) on a substrate such as a wiring substrate or a lead frame and packaging the chip, a chip bonding process of attaching the chip to the substrate by suction from a wafer is currently performed.
Disclosure of Invention
The invention aims to: in order to solve the problem that the welding head cannot adaptively adjust the levelness, the welding head of the packaging machine is provided with the levelness which can be adaptively adjusted.
In order to achieve the above object, the present invention provides a bonding head of an encapsulation machine capable of adaptively adjusting levelness, comprising: the device comprises a welding head, adjusting devices, a sensor and a controller, wherein at least three adjusting devices are arranged on the side surface of the welding head, each adjusting device comprises a shell, a magnetostrictive material body, a coil and an adjusting rod, the magnetostrictive material bodies are arranged in the shells, the coils are sleeved on the magnetostrictive material bodies, and the adjusting rods are connected to the magnetostrictive material bodies; the sensor is arranged on the welding head and used for sensing the distance between the welding head and a part to be welded; the controller is connected with the sensor and the coil in a control mode, and the controller controls the current on the coil through the distance measured by the sensor.
As a further description of the above technical solution:
the three adjusting devices are arranged and are not arranged on the same side face of the welding head.
As a further description of the above technical solution:
the number of the sensors corresponds to the number of the adjusting devices, and the sensors are not in the same straight line.
As a further description of the above technical solution:
the adjusting rod is provided with a spring.
As a further description of the above technical solution:
the sensor is a laser ranging sensor.
As a further description of the above technical solution:
the two sides of the magnetostrictive material body are symmetrically provided with coil fixing frames, the coil fixing frames are fixedly connected to the shell, and the coils are wound on the coil fixing frames.
As the technical scheme is adopted, the invention has the beneficial effects that:
1. the invention can self-adaptively adjust the flatness of the welding head by arranging three adjusting devices on different sides of the welding head, particularly, when the welding head works, three laser ranging sensors measure the position heights of three points (the distance between the welding head and a workpiece to be welded), a controller receives data information sent by the laser ranging sensors and controls the coils on the corresponding adjusting devices to be electrified, the current on the coils is controlled by the controller according to the distance measured by the laser ranging sensors, the large current is large in distance, after the coils are electrified, the magnetic field is changed, so that the magnetostrictive material body is vertically deformed, the magnetostrictive material body pushes the adjusting rod to move, the adjustment of the distance from the welding head to the workpiece to be welded is realized, the welding head is completely contacted with the workpiece to be welded, and no gap is reserved.
2. According to the invention, the coil currents are different in magnitude, and the generated magnetic fields are also different, so that the deformation amplitudes of the magnetostrictive material bodies are different, the moving distances of the adjusting rods are also different, the deformation response time of the magnetostrictive material bodies is in the microsecond order, and the magnetostrictive material bodies can quickly react during adjustment, thereby enhancing the stability of a welding head during working condition change and improving the welding quality.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a welding head of an encapsulating machine capable of adaptively adjusting levelness.
Fig. 2 is a schematic structural diagram of an adjusting device in a welding head of an encapsulating machine for adaptively adjusting levelness.
Fig. 3 is a state diagram of the adjustment of the welding head of the packaging machine for self-adaptive adjustment of levelness.
Fig. 4 is a schematic diagram of control connections of a controller in a welding head of a packaging machine for adaptively adjusting levelness.
Illustration of the drawings:
1. welding a head; 2. an adjustment device; 21. a housing; 22. a body of magnetostrictive material; 23. a coil; 24. adjusting a rod; 3. a sensor; 4. a controller; 5. a coil fixing frame.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the embodiments of the present invention, it should be noted that the terms "upper", "inner", and the like refer to orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that are conventionally arranged when the products of the present invention are used, and are used only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-4, the present invention provides a bonding head of a packaging machine capable of adaptively adjusting levelness, comprising: the device comprises a welding head 1, adjusting devices 2, a sensor 3 and a controller 4, wherein at least three adjusting devices 2 are arranged on the side surface of the welding head 1, each adjusting device 2 comprises a shell 21, a magnetostrictive material body 22, a coil 23 and an adjusting rod 24, the magnetostrictive material body 22 is arranged in the shell 21, the coil is sleeved on the magnetostrictive material body 22, and the adjusting rod 24 is connected to the magnetostrictive material body 22; the sensor 3 is arranged on the welding head 1, and the sensor 3 is used for sensing the distance between the welding head 1 and a part to be welded; the controller 4 is in control connection with the sensor 3 and the coil 23, and the controller 4 controls the current on the coil 23 through the distance measured by the sensor 3.
The number of the adjusting devices 2 is three, and the three adjusting devices 2 are not arranged on the same side face of the welding head 1. The three adjusting devices can ensure the flatness of the welding surface of the welding head, and the more the adjusting devices are, the higher the adjusting precision is, so that the number of the adjusting devices can be installed according to actual requirements. The adjusting device is mainly finely adjusted through deformation of the magnetostrictive material body, so that the corresponding adjusting device can be formed by using piezoelectric ceramic materials, and the purpose of adjusting the distance can be achieved.
The number of the sensors 3 corresponds to the number of the adjusting devices 2, and a plurality of the sensors 3 are not in the same line.
A spring is arranged on the adjusting rod 24. The adjusting rod can be reset after the coil is powered off.
The sensor 3 is a laser ranging sensor.
The two sides of the magnetostrictive material body 22 are symmetrically provided with coil fixing frames 5, the coil fixing frames 5 are fixedly connected to the shell 21, and the coil 23 is wound on the coil fixing frames 5. The coil and the magnetostrictive material body can be separated, so that heat dissipation is facilitated, and safety is improved.
The working principle is as follows: the three adjusting devices are arranged on different side surfaces of the welding head, the flatness of the welding head can be adjusted in a self-adaptive mode, specifically, when the welding head works, the three laser ranging sensors measure the position heights of three points (the distance between the welding head and a piece to be welded), the controller receives data information sent by the laser ranging sensors and controls the coils on the corresponding adjusting devices to be electrified, the magnitude of current on the coils is controlled by the controller according to the distance measured by the laser ranging sensors, the distance large current is large, after the coils are electrified, a magnetic field changes, the magnetostrictive material body deforms in the vertical direction, and the magnetostrictive material body pushes the adjusting rods to move, so that the distance between the welding head and the piece to be welded is adjusted, the welding head and the piece to be welded are in complete contact, and no gap is reserved; the coil current is different in magnitude, the generated magnetic fields are different, so that the deformation amplitude of the magnetostrictive material bodies is different, the moving distance of the adjusting rod is different, the deformation response time of the magnetostrictive material bodies is in the microsecond order, the magnetostrictive material bodies can react quickly during adjustment, the stability of a welding head during working condition change can be enhanced, and the welding quality is improved.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (6)
1. A packaging machine welding head capable of adaptively adjusting levelness is characterized by comprising: the device comprises a welding head (1), adjusting devices (2), a sensor (3) and a controller (4), wherein at least three adjusting devices (2) are arranged on the side face of the welding head (1), each adjusting device (2) comprises a shell (21), a magnetostrictive material body (22), a coil (23) and an adjusting rod (24), the magnetostrictive material bodies (22) are arranged in the shells (21), the coil is sleeved on the magnetostrictive material bodies (22), and the adjusting rods (24) are connected to the magnetostrictive material bodies (22); the sensor (3) is arranged on the welding head (1), and the sensor (3) is used for sensing the distance between the welding head (1) and a part to be welded; the controller (4) is in control connection with the sensor (3) and the coil (23), and the controller (4) controls the current on the coil (23) through the distance measured by the sensor (3).
2. -a welding head of packaging machines adapted to adjust the levelness adaptively according to claim 1, characterised in that said adjustment means (2) are provided in three, three of said adjustment means (2) not being on the same side of the welding head (1).
3. -a welding head for a packaging machine for the adaptive adjustment of levelness according to claim 2, characterised in that the number of said sensors (3) corresponds to the number of said adjustment means (2) and in that a plurality of said sensors (3) are not collinear.
4. The adaptive levelness adjusting welding head of an encapsulating machine according to claim 1, characterised in that said adjusting rod (24) is provided with a spring.
5. -a packaging machine welding head with adaptive levelling according to claim 1, characterized in that the sensor (3) is a laser ranging sensor.
6. The welding head of an encapsulation machine for adaptive levelness adjustment according to claim 1, wherein the magnetostrictive material body (22) is symmetrically provided with coil holders (5) on both sides, the coil holders (5) are fixedly connected to the housing (21), and the coils (23) are wound on the coil holders (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111168348.8A CN113787276A (en) | 2021-09-30 | 2021-09-30 | Packaging machine welding head capable of adaptively adjusting levelness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111168348.8A CN113787276A (en) | 2021-09-30 | 2021-09-30 | Packaging machine welding head capable of adaptively adjusting levelness |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113787276A true CN113787276A (en) | 2021-12-14 |
Family
ID=79184570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111168348.8A Pending CN113787276A (en) | 2021-09-30 | 2021-09-30 | Packaging machine welding head capable of adaptively adjusting levelness |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113787276A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114274518A (en) * | 2021-12-17 | 2022-04-05 | 海鹰企业集团有限责任公司 | An ultrasonic welding probe using magnetostrictive material as driving source |
Citations (9)
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|---|---|---|---|---|
| JPH02224887A (en) * | 1989-02-28 | 1990-09-06 | Komatsu Ltd | Laser processing device |
| JP2004079926A (en) * | 2002-08-22 | 2004-03-11 | Asuriito Fa Kk | Heating and pressurizing device and method for adjusting flatness of pressure contact surface |
| JP2005158894A (en) * | 2003-11-21 | 2005-06-16 | Olympus Corp | Semiconductor bonding equipment |
| JP2006237395A (en) * | 2005-02-25 | 2006-09-07 | Toshiba Mach Co Ltd | Transfer device |
| CN101188874A (en) * | 2007-12-14 | 2008-05-28 | 邸怀玉 | Magnetism driven telescopic driver |
| JP2010034585A (en) * | 2009-11-06 | 2010-02-12 | Toray Eng Co Ltd | Method for adjusting parallelism in chip mounting device |
| US20120214258A1 (en) * | 2011-02-18 | 2012-08-23 | Hitachi High-Tech Instruments Co., Ltd | Die Bonder and Semiconductor Manufacturing Method |
| CN207358354U (en) * | 2017-09-07 | 2018-05-15 | 李求兰 | A kind of energy-storage resistance welder |
| CN111055149A (en) * | 2020-01-06 | 2020-04-24 | 上海应用技术大学 | Ultra-magnetostrictive micro-feeding device |
-
2021
- 2021-09-30 CN CN202111168348.8A patent/CN113787276A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02224887A (en) * | 1989-02-28 | 1990-09-06 | Komatsu Ltd | Laser processing device |
| JP2004079926A (en) * | 2002-08-22 | 2004-03-11 | Asuriito Fa Kk | Heating and pressurizing device and method for adjusting flatness of pressure contact surface |
| JP2005158894A (en) * | 2003-11-21 | 2005-06-16 | Olympus Corp | Semiconductor bonding equipment |
| JP2006237395A (en) * | 2005-02-25 | 2006-09-07 | Toshiba Mach Co Ltd | Transfer device |
| CN101188874A (en) * | 2007-12-14 | 2008-05-28 | 邸怀玉 | Magnetism driven telescopic driver |
| JP2010034585A (en) * | 2009-11-06 | 2010-02-12 | Toray Eng Co Ltd | Method for adjusting parallelism in chip mounting device |
| US20120214258A1 (en) * | 2011-02-18 | 2012-08-23 | Hitachi High-Tech Instruments Co., Ltd | Die Bonder and Semiconductor Manufacturing Method |
| CN207358354U (en) * | 2017-09-07 | 2018-05-15 | 李求兰 | A kind of energy-storage resistance welder |
| CN111055149A (en) * | 2020-01-06 | 2020-04-24 | 上海应用技术大学 | Ultra-magnetostrictive micro-feeding device |
Non-Patent Citations (1)
| Title |
|---|
| 冯显英等: "《微纳运动实现技术》", 华中科技大学出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114274518A (en) * | 2021-12-17 | 2022-04-05 | 海鹰企业集团有限责任公司 | An ultrasonic welding probe using magnetostrictive material as driving source |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211214 |
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| RJ01 | Rejection of invention patent application after publication |