CN113784499A - Finished circuit board and method for module heat dissipation - Google Patents
Finished circuit board and method for module heat dissipation Download PDFInfo
- Publication number
- CN113784499A CN113784499A CN202110896267.3A CN202110896267A CN113784499A CN 113784499 A CN113784499 A CN 113784499A CN 202110896267 A CN202110896267 A CN 202110896267A CN 113784499 A CN113784499 A CN 113784499A
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- Prior art keywords
- copper
- module
- pcb
- area
- heat dissipation
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 65
- 229910052802 copper Inorganic materials 0.000 claims abstract description 65
- 239000010949 copper Substances 0.000 claims abstract description 65
- 238000005476 soldering Methods 0.000 claims abstract description 15
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000004519 grease Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 229920001296 polysiloxane Polymers 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract description 2
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 6
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses a finished circuit board and a method for module heat dissipation, and belongs to the field of finished circuit board processing and manufacturing. The finished circuit board comprises a module and a first PCB; the method comprises the steps of opening ink to expose copper on a BOTTOM layer of a module chip corresponding to a PCB, opening ink to expose copper at a corresponding position of a first PCB, and welding and fixing two copper-exposed areas by adopting a reflow soldering process to solve the problem of module heat dissipation. Compared with the traditional method of adding metal radiating fins, heat-conducting silicone grease and the like, the method solves the module radiating problem, and has the remarkable advantages of reducing the product volume and reducing the cost.
Description
Technical Field
The invention belongs to the technical field of finished circuit board processing and manufacturing, and particularly relates to a finished circuit board and a method for module heat dissipation.
Background
With the rapid development of smart homes, various smart products are in the middle of the family life of people. The intelligent household product can be generally internally provided with a wireless communication module, and a user can control a Bluetooth module, a WIFI Bluetooth dual-mode module, a zigbee module and the like in the intelligent product through an external mobile terminal (such as a mobile phone, a tablet computer, a remote controller and the like) and an intelligent sound box. When the module operates at a high speed, because the power consumption of the chip is large, the heat dissipation under natural conditions can not meet the requirement of the working temperature of the chip, at present, the heat dissipation problem of the intelligent products is generally solved by adding metal heat dissipation fins, heat conduction silicone grease and other methods, and the method not only increases the volume of the products, but also improves the production cost.
Aiming at the problem that the existing heat dissipation method can not reduce the product volume and the production cost in the prior art, an effective technical scheme is not provided at present.
Disclosure of Invention
Aiming at the technical problems, the technical scheme adopted by the application is as follows:
in a first aspect, the present application provides a finished circuit board for module heat dissipation, including: the module comprises a first PCB board;
the module comprises at least one chip and a second PCB; the first PCB is divided into a first TOP layer and a first BOTTOM layer, and the module is fixed at the first TOP layer of the first PCB;
the second PCB is divided into a second TOP layer and a second BOTTOM layer, and the chip is fixed on the second TOP layer;
arranging a first copper exposure area at the position, corresponding to the chip, of the second BOTTOM layer; arranging a second copper exposing area at the position of the first TOP layer corresponding to the first copper exposing area;
the second copper exposing area is completely overlapped and covered or partially covered on the first copper exposing area.
The first copper exposing area and the second copper exposing area are consistent with the shape of the fixing surface of the chip.
And the first copper exposing area and the second copper exposing area are fixed by soldering through soldering paste.
The soldering and fixing through the soldering paste is performed by using a reflow soldering process.
And each pin of the chip is insulated from the first copper exposing area, or a grounding pin or a power supply pin of the chip is conducted with the first copper exposing area.
The chip is fixed on the second TOP layer in a mode of comprising an insert or a patch.
The area of the first PCB is larger than that of the second PCB.
The modules include, but are not limited to, the following: bluetooth module, WIFI bluetooth bimodulus module, zigbee module.
And the first copper exposing area and the second copper exposing area expose copper in an ink opening mode.
In a second aspect, the present application provides a method for module heat dissipation, comprising the steps of:
providing a PCB as a first PCB;
providing a module, wherein the module comprises at least one chip and a second PCB board;
arranging a first copper exposing area at the position of the second PCB corresponding to the chip, and exposing copper by opening printing ink;
arranging a second copper exposing area at the position of the first PCB corresponding to the first copper exposing area, and exposing copper by using printing ink;
and welding and fixing the first copper exposing area and the second copper exposing area by adopting a reflow soldering process.
Technical effects
The application provides a finished product circuit board and a method for module heat dissipation, when a chip on a module generates heat, the chip can quickly conduct heat to a second PCB, the module and a first PCB are welded together, the area of the first PCB is larger than that of the second PCB, the heat on the second PCB can be quickly dissipated through the first PCB, and then the problem of module heat generation is solved.
This application does not need additional metal fin, materials such as heat conduction silicone grease, just can solve the heat dissipation problem, has reduced electronic product's volume to product cost has been reduced.
Drawings
FIG. 1 is a schematic diagram of a structure of a finished circuit board according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of the module assembly according to an embodiment of the present disclosure;
FIG. 3 is a schematic diagram illustrating a position of a copper exposed area of a first PCB according to an embodiment of the present disclosure;
fig. 4 is a flowchart of a method for dissipating heat of a module according to an embodiment of the present disclosure;
the PCB comprises an A-module, a B-first PCB, a B-1-first TOP layer, a B-2-first BOTTOM layer, a 1-chip, a 2-second PCB, a 2-1-second TOP layer, a 2-2-second BOTTOM layer, a 3-first copper exposure area and a 4-second copper exposure area.
Detailed Description
The present application is further described with reference to the following detailed description and the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present application is not limited thereby.
In a first aspect, as shown in fig. 1, fig. 2, and fig. 3, the present application provides a finished circuit board for module heat dissipation, which at least includes a module a and a first PCB B, where the module a is composed of a chip 1 and a second PCB 2.
The first PCB B is divided into a first TOP layer B-1 and a first BOTTOM layer B-2, and the module A is fixed at the first TOP layer B-1 of the first PCB B;
the second PCB 2 is divided into a second TOP layer 2-1 and a second BOTTOM layer 2-2, and the chip 1 is fixed on the second TOP layer 2-1;
the first PCB B is provided with a second copper exposing area 4 convenient for the heat dissipation connection module A, and the second copper exposing area 4 is completely overlapped and covered or partially covered on the first copper exposing area 3; the chip 1 is mounted and fixed on the second TOP layer 2-1 of the second PCB 2, and is set as a first copper exposing area 3 corresponding to the second BOTTOM layer 2-2 under the chip 1, as can be understood, the copper exposing area is not communicated with the pin of the chip 1, or the GND or power pin of the chip 1 and the first copper exposing area 3 are the same network, and generally, the first copper exposing area 3 is mostly a GND network.
Preferably, the first and second copper exposed areas 3 and 4 are soldered together by solder paste using a reflow soldering process using the above operation, and the first PCB B is made larger in area than the second PCB 2.
When chip 1 generates heat in module A, chip 1 can be fast on second PCB board 2 of being connected with it is conducted to the heat, because second PCB board 2 and first PCB board B have welded together, the heat on second PCB board 2 is conducted first PCB board B fast, and because the relation that first PCB board B area is greater than the second PCB board to realized quick heat dissipation, solved the module problem of generating heat.
Module a includes, but is not limited to, the following modules: bluetooth module, WIFI bluetooth bimodulus module, zigbee module etc.
In a second aspect, the present application provides a method for module heat dissipation, as shown in fig. 4, the steps are as follows:
step S1: providing a PCB as a first PCB B;
step S2: providing a module A, wherein the module A comprises at least one chip 1 and a second PCB 2;
step S3: arranging a first copper exposing area 3 at the position of the second PCB 2 corresponding to the chip 1, and exposing copper by opening printing ink;
step S4: arranging a second copper exposing area 4 at the position of the first PCB B corresponding to the first copper exposing area 3, and exposing copper by using printing ink; the area of the second copper-exposed area and the area of the first copper-exposed area are slightly different from the area of the fixing surface of the chip 1, and the areas may be equal, slightly larger or slightly smaller, and are slightly different due to different processes and different PCB routing.
Step S5: and the first copper exposing area 3 and the second copper exposing area 4 are fixedly welded by adopting a reflow soldering process.
The soldering and fixing by the soldering paste is performed by adopting a reflow soldering process.
The effect of the heat dissipation scheme is superior to that of the traditional heat dissipation mode in order to more intuitively highlight the heat dissipation scheme. Table 1 shows the temperature data of the chip surface by different heat dissipation methods, which are obtained by performing the experiment under the same conditions and recording the temperature data, wherein the heat dissipation method comprises the following steps: when not doing treatment, traditional method (adding radiating fin) and this application heat dissipation scheme:
TABLE 1 comparative test data
As shown in table 1, the heat dissipation effect is related to the area of the first PCB, and the larger the area of the first PCB is, the better the heat dissipation effect is. When no treatment is carried out, the surface temperature of the chip reaches 65 ℃, the chip runs under a high-temperature state for a long time, the service life of the chip is shortened, and the chip is easy to damage, so that the surface temperature of the chip is maintained at 52 ℃ by adding radiating fins in the traditional method, the surface temperature of the chip can be maintained at about 51 ℃ (when the area of the first PCB is 70x40 mm) by adopting the method, the radiating effect is better and better along with the continuous increase of the area of the first PCB, and the surface temperature of the chip is reduced to 45 ℃ when the area of the first PCB is 90x60mm, and the radiating effect is more obvious.
Those skilled in the art know that the module of the conventional heat dissipation method with heat dissipation fins also needs a PCB bottom plate, and in addition, metal heat dissipation fins, heat-conducting silicone grease and the like are needed, and the scheme only needs a bottom plate. This also demonstrates the obvious cost advantages of the present application.
In summary, compared with the background art, the PCB is connected with the exposed copper in the corresponding radiating chip area, the heat of the working module can be effectively conducted and dissipated by the first PCB radiating method and the circuit board applying the method, so that the stable work of the module can be ensured, the service performance can be ensured, the cost is saved, the design is simple, and the installation and the use are convenient.
The present applicant has described and illustrated embodiments of the present invention in detail with reference to the accompanying drawings, but it should be understood by those skilled in the art that the above embodiments are merely preferred embodiments of the present invention, and the detailed description is only for the purpose of helping the reader to better understand the spirit of the present invention, and not for limiting the scope of the present invention, and on the contrary, any improvement or modification made based on the spirit of the present invention should fall within the scope of the present invention.
Claims (10)
1. The utility model provides a to radiating finished product circuit board of module which characterized in that includes: a module (A), a first PCB board (B);
the module (A) comprises: at least one chip (1) and a second PCB board (2); the first PCB (B) is divided into a first TOP layer (B-1) and a first BOTTOM layer (B-2), and the module (A) is fixed at the first TOP layer (B-1) of the first PCB (B);
the second PCB (2) is divided into a second TOP layer (2-1) and a second BOTTOM layer (2-2), and the chip (1) is fixed on the second TOP layer (2-1);
arranging a first copper-exposed area (3) at the position of the second BOTTOM layer (2-2) corresponding to the chip (1); arranging a second copper exposing area (4) at the position of the first TOP layer (B-1) corresponding to the first copper exposing area (3);
the second copper exposed area (4) is completely overlapped and covered or partially covered on the first copper exposed area (3).
2. The finished circuit board for module heat dissipation according to claim 1, wherein the first exposed copper region (3) and the second exposed copper region (4) are in the same shape as the fixing surface of the chip (1).
3. The finished circuit board for module heat dissipation according to claim 1, wherein the first exposed copper area (3) and the second exposed copper area (4) are fixed by soldering with solder paste.
4. The finished wiring board for module heat dissipation of claim 3, wherein said soldering with solder paste is by a reflow process.
5. The finished circuit board for module heat dissipation according to claim 1, wherein each pin of the chip (1) is insulated from the first copper exposed region (3), or a ground pin or a power pin of the chip (1) is conducted with the first copper exposed region (3).
6. The finished wiring board for module heat dissipation according to claim 1, wherein the chip (1) is fixed on the second TOP layer (2-1) in a manner including a plug-in or a patch.
7. The finished wiring board for module heat dissipation of claim 1, wherein the first PCB board (B) has an area larger than the area of the second PCB board (2).
8. The finished wiring board for module heat dissipation according to claim 1, wherein the module (a) includes but is not limited to the following modules: bluetooth module, WIFI bluetooth bimodulus module, zigbee module.
9. The finished circuit board for module heat dissipation according to claim 1, wherein the first copper exposing area (3) and the second copper exposing area (4) are exposed by means of ink.
10. A method for module heat dissipation is characterized by comprising the following steps:
providing a PCB as a first PCB (B);
providing a module (a), wherein the module (a) comprises at least one chip (1) and a second PCB board (2);
arranging a first copper exposing area (3) at the position of the second PCB (2) corresponding to the chip (1), and exposing copper by opening printing ink;
arranging a second copper exposing area (4) at the position of the first PCB (B) corresponding to the first copper exposing area (3), and exposing copper by using printing ink;
and the first copper exposing area (3) and the second copper exposing area (4) are welded and fixed by adopting a reflow soldering process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110896267.3A CN113784499A (en) | 2021-08-05 | 2021-08-05 | Finished circuit board and method for module heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110896267.3A CN113784499A (en) | 2021-08-05 | 2021-08-05 | Finished circuit board and method for module heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113784499A true CN113784499A (en) | 2021-12-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110896267.3A Pending CN113784499A (en) | 2021-08-05 | 2021-08-05 | Finished circuit board and method for module heat dissipation |
Country Status (1)
| Country | Link |
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| CN (1) | CN113784499A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0955392A (en) * | 1995-08-10 | 1997-02-25 | Sanken Electric Co Ltd | Soldering method for semiconductor device |
| US20020172025A1 (en) * | 2000-11-15 | 2002-11-21 | Mohamed Megahed | Structure and method for fabrication of a leadless chip carrier with embedded inductor |
| US6611055B1 (en) * | 2000-11-15 | 2003-08-26 | Skyworks Solutions, Inc. | Leadless flip chip carrier design and structure |
| US20070013045A1 (en) * | 2005-07-14 | 2007-01-18 | Via Technologies Inc. | Printed circuit board for thermal dissipation and electronic device using the same |
| US20100020499A1 (en) * | 2008-07-25 | 2010-01-28 | Samsung Electro-Mechanics Co., Ltd. | Electronic chip module |
| US20180241285A1 (en) * | 2017-02-23 | 2018-08-23 | Schaft Inc. | Cooling a heat-generating electronic device |
| CN210272335U (en) * | 2019-07-30 | 2020-04-07 | 江门市川琪科技有限公司 | Chip heat radiation structure |
| CN213880402U (en) * | 2021-01-21 | 2021-08-03 | 长沙莫之比智能科技有限公司 | Heat radiation assembly of small laminated PCB |
-
2021
- 2021-08-05 CN CN202110896267.3A patent/CN113784499A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0955392A (en) * | 1995-08-10 | 1997-02-25 | Sanken Electric Co Ltd | Soldering method for semiconductor device |
| US20020172025A1 (en) * | 2000-11-15 | 2002-11-21 | Mohamed Megahed | Structure and method for fabrication of a leadless chip carrier with embedded inductor |
| US6611055B1 (en) * | 2000-11-15 | 2003-08-26 | Skyworks Solutions, Inc. | Leadless flip chip carrier design and structure |
| US20070013045A1 (en) * | 2005-07-14 | 2007-01-18 | Via Technologies Inc. | Printed circuit board for thermal dissipation and electronic device using the same |
| US20100020499A1 (en) * | 2008-07-25 | 2010-01-28 | Samsung Electro-Mechanics Co., Ltd. | Electronic chip module |
| US20180241285A1 (en) * | 2017-02-23 | 2018-08-23 | Schaft Inc. | Cooling a heat-generating electronic device |
| CN210272335U (en) * | 2019-07-30 | 2020-04-07 | 江门市川琪科技有限公司 | Chip heat radiation structure |
| CN213880402U (en) * | 2021-01-21 | 2021-08-03 | 长沙莫之比智能科技有限公司 | Heat radiation assembly of small laminated PCB |
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Application publication date: 20211210 |
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| RJ01 | Rejection of invention patent application after publication |