CN113766823B - BGA ball mounting device and method based on SMT repair station - Google Patents
BGA ball mounting device and method based on SMT repair station Download PDFInfo
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- CN113766823B CN113766823B CN202111059831.2A CN202111059831A CN113766823B CN 113766823 B CN113766823 B CN 113766823B CN 202111059831 A CN202111059831 A CN 202111059831A CN 113766823 B CN113766823 B CN 113766823B
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- 230000008439 repair process Effects 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 25
- 229910000679 solder Inorganic materials 0.000 claims abstract description 185
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 93
- 239000010959 steel Substances 0.000 claims abstract description 93
- 238000005476 soldering Methods 0.000 claims abstract description 45
- 238000007639 printing Methods 0.000 claims abstract description 37
- 230000000007 visual effect Effects 0.000 claims abstract description 9
- 238000011084 recovery Methods 0.000 claims description 42
- 238000003466 welding Methods 0.000 claims description 9
- 230000000903 blocking effect Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- -1 polytetrafluoroethylene Polymers 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 230000008901 benefit Effects 0.000 abstract description 4
- 238000004806 packaging method and process Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 238000002513 implantation Methods 0.000 description 3
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- 238000004458 analytical method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
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- 238000009826 distribution Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09836—Oblique hole, via or bump
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a BGA ball mounting device based on an SMT repair table, which comprises: a solder paste printing fixture for printing a solder paste array on a pad of the BGA device; ball planting frock for put the solder ball, include: the ball-leakage steel sheet is provided with openings in an array manner, and the positions of the openings correspond to solder paste printed on the solder pads of the BGA device; the limiting frame is used for fixing the ball-leakage steel sheet; the ball carrying main body is nested in the limit frame and positioned below the ball leaking steel sheet and is used for receiving the solder balls falling from the holes of the ball leaking steel sheet; and the SMT repair table is used for attaching ball to be planted BGA devices printed with soldering paste to the solder balls placed by the ball planting tool in a one-to-one correspondence manner through visual alignment. The BGA ball mounting method comprises the following steps: printing soldering paste, placing solder balls, positioning the solder balls and the soldering paste, and reflow soldering. The invention has the advantages of high accuracy, strong universality and high stability.
Description
Technical Field
The invention relates to the field of BGA assembly repair, in particular to a BGA ball mounting device and method based on an SMT repair table.
Background
With the development of large-scale integrated circuits and ultra-large-scale integrated circuits, the miniaturization trend of products is more and more obvious, and ball grid array packaging elements (BGA) are generated, so that the BGA has the characteristics of small packaging volume, large pin number, good electrical performance and the like. In the packaging batch production, ball placement of the BGA device is realized through special ball placement equipment, and a tool jig is required to be customized. On the SMT (Surface Mounted Technology, surface mount technology) production line, most manufacturers have multiple varieties and small batches of product characteristics. Because the welding spots of the BGA packaging device are hidden under the packaging, the quality of the patch is difficult to control, and in the actual production process, the welding defects such as short circuit or cold joint of the BGA chip can be caused by reasons such as heated warpage of a printed board, inconsistent design of a welding pad, poor printing of soldering paste, insufficient welding temperature and the like. In order to save the cost and shorten the production period, the BGA packaging device needs to be manually subjected to ball-planting operation under the condition of no special ball-planting equipment.
At present, two main methods are adopted in each SMT production line at home and abroad:
manually planting balls: using tweezers, matching with a filter screen, operating under a microscope, placing solder balls one by one on the bottom bonding pads of the BGA device to be ball-mounted, and then passing through a reflow oven or carrying out reflow soldering on a hot platform. The disadvantages of this method are apparent: the ball implantation efficiency is low, when the number of the solder balls is large, the operation is not easy, the manual alignment is greatly error, if the deviation of the placement position of the solder balls is caused by a little carelessness, the solder balls are bridged after reflow soldering, and the method cannot meet the BGA ball implantation with a large number of the solder balls or a small space between the solder balls.
Ball planting device ball planting: the common ball planter is generally composed of a small screen plate and a set of positioning clamps, the positions of openings of the small screen plate are matched with the matrix distribution of the pads at the bottom of the BGA, the diameters of the openings are larger than the diameters of the balls, and the thicknesses of the openings are generally larger than the diameters of the solder balls and smaller than the diameters of the solder balls. The fixture is used for fixing the small screen plate and the BGA device to enable the small screen plate and the BGA device to be in close fit, then the solder balls are spread on the small screen plate, the ball implanting device is shaken, the solder balls can roll into the holes of the small screen plate, after each hole of the small screen plate falls into one solder ball, redundant solder balls are collected to the edge of the small screen plate, the solder balls are poured out through the reserved holes on the positioning fixture, the ball implanting device is integrally placed into the reflow oven, and the ball implanting BGA is taken out from the ball implanting device after reflow soldering, so that ball implanting is completed. Compared with manual ball planting, the method is simple in operation, and the success rate of ball planting and the speed of ball planting are greatly improved. The method has the defects that different small screen boards are required to be manufactured aiming at different BAG packaging devices, the BAG packaging devices are more in packaging types, the production cost of the small screen boards is higher, and the manufacturing period is longer. In addition, the size of the BGA package is different, so that the fixing clamp has an influence on the fixing of the BGA device, the situation that a small steel plate and the BGA device cannot be accurately positioned can occur, the size of the opening of the small steel plate can also influence the effect of ball leakage, each opening can not be ensured to fall into one solder ball, the position of the solder ball is easily unfixed when the screen plate of the solder ball is demolded, and the situation that manual adjustment is still needed after the demolding is performed. During reflow soldering, the whole metal fixture is put into a reflow oven together, and the effect of solder ball reflow soldering is poor under a large heat capacity.
Disclosure of Invention
The invention aims to provide a BGA ball mounting device and method based on an SMT repair station, which are used for solving the problems of difficult placing operation, poor positioning precision, easiness in interference and the like of solder balls and have the advantages of high accuracy, strong universality and high stability.
In order to achieve the above object, the present invention provides a BGA ball mounting device based on an SMT rework station, comprising: a solder paste printing fixture for printing a solder paste array on a pad of the BGA device; ball planting frock for put the solder ball, include: the ball-leakage steel sheet is provided with openings in an array manner, and the positions of the openings correspond to solder paste printed on the solder pads of the BGA device; the limiting frame is used for fixing the ball-leakage steel sheet; a ball carrying body made of polytetrafluoroethylene material, which is nested in the limit frame and is positioned below the ball leaking steel sheet and used for receiving the solder balls falling from the holes of the ball leaking steel sheet; the ball carrying main body is provided with spherical grooves, the number of the spherical grooves is larger than that of solder balls of the BGA device to be actually planted, and the depth of the spherical grooves is 0.3mm; and the SMT repair table is used for attaching ball to be planted BGA devices printed with soldering paste to the solder balls placed by the ball planting tool in a one-to-one correspondence manner through visual alignment.
Wherein, the printing frock of soldering paste includes: the steel sheet bracket is used for fixing the steel sheet; a plurality of openings are formed in the steel sheet in an array manner; the fastening bolt is used for fixing the BGA device and the steel sheet, so that a bonding pad on the BGA device is aligned with the steel sheet; and the scraper is used for trowelling the soldering paste, so that the soldering paste is printed in the opening of the steel sheet, and the soldering paste is correspondingly attached to the bonding pads of the BGA device in an array form.
Wherein, SMT reprocesses platform includes: the PCB bracket is used for fixing the ball carrying main body with the solder balls; the alignment camera is arranged at the top of the SMT repairing table, is connected with a controller of the SMT repairing table through signals, and acquires and transmits image data of solder balls and soldering paste to the controller; the vacuum suction nozzle is fixedly connected with the SMT repair table and is connected with a controller of the SMT repair table through signals; the vacuum suction nozzle adsorbs the BGA device to move, so that the soldering paste on the BGA device is aligned with the solder balls on the ball carrying main body.
Preferably, the thickness range of the ball-leakage steel sheet is d/2 < thickness < d; the diameter range of the opening on the ball-leakage steel sheet is d less than or equal to the opening size less than or equal to 1.3d, and each opening can only accommodate one solder ball; where d is the diameter of the solder ball.
Preferably, the limit frame is provided with a recovery hole for recovering redundant solder balls; and the recovery hole is also provided with a screw for controlling the recovery hole to be opened or closed.
A BGA ball mounting method based on an SMT repair station comprises the following steps:
step S1, printing soldering paste on a pad of a BGA device by using a soldering paste printing tool;
s2, orderly placing the solder balls on the ball carrying main body by utilizing a ball planting tool;
s3, aligning solder paste formed by printing on the BGA device and the solder balls placed on the ball carrying body by using an SMT repair table with a visual alignment system, so that the solder balls are adsorbed on the solder paste of the BGA device in a one-to-one correspondence manner;
and S4, placing the BGA device with the solder balls absorbed into a reflow oven for welding.
Preferably, the solder paste printing in step S1 includes the steps of:
s11, centering and fixing a steel sheet on a steel sheet bracket, and connecting the BGA device with the steel sheet by using a fastening bolt;
step S12, printing soldering paste on the back surface of the steel sheet bracket, and trowelling the soldering paste by using a scraper, so that the soldering paste is attached to a bonding pad of the BGA device in an array form through a plurality of openings in the steel sheet;
and S13, after the printing of the soldering paste is finished, loosening the fastening bolt, taking down the steel sheet, and keeping the BGA device printed with the soldering paste still placed on the steel sheet bracket.
Preferably, the solder ball placement in step S2 specifically includes the following steps:
s21, fixing a ball-leaking steel sheet on a limiting frame, embedding a ball-carrying main body into the limiting frame, and installing the ball-carrying main body below the ball-leaking steel sheet;
s22, enabling the screw to penetrate through the recovery hole and lock, blocking a recovery channel of the recovery hole, then scattering the solder balls on the ball-leaking steel sheets, and shaking the limiting frame to enable the solder balls to fall into the spherical grooves of the ball-carrying main body in one-to-one correspondence through the ball-leaking steel sheets;
and S23, opening the recovery hole, loosening and detaching a screw above the recovery hole, opening a recovery channel of the recovery hole, and tilting the limiting frame to enable redundant solder balls to be poured out of the recovery hole.
Preferably, the aligning of the solder ball and the solder paste in the step S3 specifically includes the following steps:
step S31, placing the steel sheet bracket in the step S13 and the BGA device printed with the soldering paste on an SMT repair table, and ensuring that the surface of the BGA device printed with the soldering paste faces downwards;
step S32, fixing the ball carrying main body with the solder balls placed in the step S22 on the SMT reworked PCB bracket;
s33, using a positioning camera to identify and capture images of solder balls on the ball carrying main body, acquiring image data and transmitting the image data to an SMT repair station controller;
step S34, picking up the BGA device by using a vacuum suction nozzle, recognizing and grabbing an image of solder paste on the BGA device by using an alignment camera, obtaining image data and transmitting the image data to an SMT repair station controller;
step S35, comparing the image data of the solder balls and the solder paste obtained in the step S32 and the step S33, and moving the BGA device by the vacuum suction nozzle so that the solder paste corresponds to the solder balls one by one;
step S36, the vacuum suction nozzle drives the BGA device to move towards the ball carrying main body until the solder paste contacts with the solder balls, the manual handheld vacuum suction pen is used for picking up the BGA device with the adsorbed solder balls, and the step S4 is performed.
In summary, compared with the prior art, the BGA ball mounting device and method based on the SMT repair station provided by the invention have the following beneficial effects:
1. the invention changes the sequence of solder ball placement in the traditional manual ball placement process, positions the solder ball and the BGA device bonding pad by utilizing the repair table visual alignment system, and simultaneously realizes the adsorption effect of the solder paste on the solder ball due to the dead weight of the solder ball and the surface tension effect of the solder paste on the BGA device body, thereby achieving the purpose of efficiently, consistently and orderly placing the solder ball;
2. the ball mounting tool and the soldering paste printing tool have good universality, can be used for mounting balls of BGA devices with the same diameter and distance of the solder balls and different numbers of the solder balls;
3. the BGA ball-planting method based on the SMT repair station is suitable for ball-planting in small batches and multiple varieties on an SMT production line, and has high precision and high reliability.
Drawings
FIG. 1 is a schematic illustration of a BGA device fixedly connected to a steel plate prior to solder paste printing;
FIG. 2 is a schematic diagram of printing solder paste using a doctor blade;
FIG. 3 is a schematic view of a ball leaking steel sheet fixed on a limiting frame;
FIG. 4 is a schematic view of solder balls being placed on a ball carrier body;
FIG. 5 is a schematic view of the ball carrying body secured to an SMT repair station;
FIG. 6 is a schematic diagram of acquiring solder ball image data from a position camera;
FIG. 7 is a schematic diagram of a vacuum nozzle picking up a BGA device;
FIG. 8 is a schematic diagram of placing a BGA device with a vacuum nozzle;
fig. 9 is a schematic diagram of the BGA device after the vacuum chuck picks up the adsorbed solder balls.
Description of the embodiments
The technical scheme, constructional features, achieved objects and effects of the embodiments of the present invention will be described in detail below with reference to fig. 1 to 9 in the embodiments of the present invention.
It should be noted that, the drawings are in very simplified form and all use non-precise proportions, which are only used for the purpose of conveniently and clearly assisting in describing the embodiments of the present invention, and are not intended to limit the implementation conditions of the present invention, so that the present invention has no technical significance, and any modification of structure, change of proportion or adjustment of size, without affecting the efficacy and achievement of the present invention, should still fall within the scope covered by the technical content disclosed by the present invention.
It should be noted that, in the present invention, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The invention provides a BGA ball-planting device based on an SMT repair station, which comprises: a solder paste printing jig for printing a solder paste array on pads of the BGA device 3; ball fixture, it is used for putting the solder ball 9, as shown in fig. 3, includes: the ball-leaking steel sheet 7 is provided with openings in an array manner, and the positions of the openings correspond to solder paste printed on the bonding pads of the BGA device 3; the limiting frame 6 is used for fixing the ball leakage steel sheet 7; a ball carrying body 8 nested in the limit frame 6 and located below the ball leaking steel sheet 7 for receiving the solder balls 9 falling from the openings of the ball leaking steel sheet 7; the SMT repair table is provided with a visual alignment system and is used for attaching the ball to be planted BGA device 3 printed with soldering paste to the solder balls 9 which are put in advance through a ball planting tool.
Wherein, as shown in fig. 4, the diameter of the solder ball 9 is d, and the thickness range of the ball-leaking steel sheet 7 is d/2 < thickness < d; meanwhile, the size range of the opening on the ball-leakage steel sheet 7 is d less than or equal to the size of the opening less than or equal to 1.3d, so that the solder balls 9 can just fall into the openings and cannot shake in a large range, and only one solder ball 9 is ensured to fall into each opening.
When the BGA ball planting device is used for ball planting, the solder balls 9 are spread in the limiting frame 6 fixed with the ball-leaking steel sheet 7, the limiting frame 6 is rocked to enable the solder balls 9 to fall into all openings of the ball-leaking steel sheet 7 in one-to-one correspondence, and redundant solder balls 9 are recovered through recovery holes 17 formed in the limiting frame 6.
Further, as shown in fig. 3 and 4, the recovery hole 17 is further provided with a screw 18 for controlling the recovery hole 17 to be opened or closed; when the recovery hole 17 needs to be closed, the screw 18 passes through the recovery hole 17 and is locked, so that a recovery channel of the recovery hole 17 is blocked, and the blocking of the solder ball 9 is realized; when it is necessary to open the recovery hole 17, the screw 18 above the recovery hole 17 is loosened and removed, and the recovery passage of the recovery hole 17 is opened so that the excess solder ball 9 can be poured out of the recovery hole 17.
As shown in fig. 4, the ball-carrying body 8 is provided with spherical grooves 10, and the number of the spherical grooves 10 is greater than the number of the solder balls 9 of the BGA device to be actually planted, so as to achieve a general effect; in this embodiment, the ball carrying body 8 is a plate made of polytetrafluoroethylene material, on which a plurality of spherical grooves 10 with a diameter of 0.65mm and a depth of 0.3mm are milled; the ball carrying main body 8 is assembled into the limit frame 6 in use and is positioned below the ball leaking steel sheet 7, so that the spherical grooves 10 are in one-to-one correspondence with the holes on the ball leaking steel sheet 7, and the solder balls 9 which are uniformly placed through the ball leaking steel sheet 7 are received in the spherical grooves 10 of the ball carrying main body 8, thereby realizing orderly placement of the solder balls 9, as shown in fig. 5.
As shown in fig. 1 and fig. 2, the solder paste printing tool includes: a steel sheet bracket 1 for fixing a steel sheet 4; a plurality of openings are formed in the steel sheet 4 in an array manner; a fastening bolt 2 for fixedly connecting the BGA device 3 with the steel sheet 4 so that the bonding pad on the BGA device 3 is aligned with the steel sheet 4; a doctor blade 5 for screeding the solder paste, which is printed in the openings of the steel sheet 4, i.e. attached to the pads of the BGA device 3 in a corresponding array.
When the BGA device 3 and the steel plate 4 are not fixed, the bonding pad of the BGA device 3 faces downward, the steel plate 4 is first fixed on the steel plate bracket 1, then the BGA device 3 is pressed on the steel plate 4 by the fastening bolt 2, then the whole solder paste printing tool is turned over 180 degrees to make the bonding pad of the BGA device 3 face upward, finally the solder paste is printed on the reverse side of the steel plate 4, the solder paste is spread by the doctor blade 5, the solder paste is attached to the bonding pad of the BGA device 3 in an array form through a plurality of openings of the steel plate 4, the fastening bolt 2 is loosened after the printing is completed, and the printed BGA device 3 together with the steel plate bracket 1 is placed on the SMT repair table.
As shown in fig. 7, the SMT rework station with the visual alignment system includes: a PCB bracket 11 for fixing the ball carrier body 8 with the solder balls 9; an alignment camera 12 disposed on top of the SMT rework station; a vacuum nozzle 14 fixedly connected with the SMT repair station; the alignment camera 12 and the vacuum nozzle 14 are both in signal connection with a controller contained in the SMT rework station.
It should be further noted that, as shown in fig. 6, after the ball carrier body 8 with the solder balls 9 placed thereon is fixed on the PCB support 11, the alignment camera 12 performs position and image recognition and analysis on the solder balls 9 on the ball carrier body 8, image data of the solder balls 9 are obtained and transmitted to the controller, then the SMT rework station automatically picks up the BGA device 3 placed on the SMT rework station through the vacuum suction nozzle 14, the alignment camera 12 performs position and image recognition and analysis on the solder paste 13 on the BGA device 3, image data of the solder paste 13 is obtained and transmitted to the controller, the controller compares and calculates the solder balls 9 and the image data of the solder paste 13, the vacuum suction nozzle 14 moves the BGA device 3, so that the solder paste 13 on the BGA device 3 corresponds to the solder balls 9 on the ball carrier body 8 one by one, and finally the vacuum suction nozzle 14 drives the BGA device 3 to move toward the ball carrier body 8 until the solder paste 13 contacts the solder balls 9 one by one, as shown in fig. 8.
Finally, as shown in fig. 9, the BGA device 3 placed on the ball carrier body 8 is picked up by using a manual vacuum suction pen 15, and the solder paste 13 has a certain surface tension to absorb the contacted solder balls 9, so that the solder balls 9 are pulled up by the solder paste 13 and sequentially attached to the pads of the BGA device 3. And (3) setting a temperature curve of a reflow oven, and sending the BGA device 3 with the solder balls 9 attached to the reflow oven for welding to finish reflow welding operation and realize the ball implantation process of the BGA.
It should be noted that, the method for implanting balls by using the BGA ball implanting device based on the SMT repair station comprises the following steps:
step S1, printing solder paste 13 on a pad of the BGA device 3 by using a solder paste printing tool;
s2, orderly placing the solder balls 9 on the ball carrying main body 8 by utilizing a ball planting tool;
s3, aligning solder balls 9 which are arranged on the ball carrying main body 8 with solder paste 13 formed by printing on the BGA device 3 by using an SMT repair table with a visual alignment system, so that the solder balls 9 are adsorbed on the solder paste 13 of the BGA device 3 in a one-to-one correspondence;
and S4, placing the BGA device 3 with the absorbed solder balls 9 into a reflow furnace for welding.
The solder paste printing in step S1 specifically includes the following steps:
step S11, centering and fixing the steel sheet 4 on the steel sheet bracket 1, and connecting the BGA device 3 with the steel sheet 4 by using the fastening bolt 2;
step S12, printing soldering paste on the back surface of the steel sheet bracket 1, and trowelling the soldering paste by using a scraper 5, so that the soldering paste is attached to the bonding pads of the BGA device 3 in an array form through a plurality of openings in the steel sheet 4;
step S13, after the printing of the soldering paste is finished, the fastening bolt 2 is loosened, the steel sheet 4 is taken down, and the BGA device 3 with the soldering paste printed is still placed on the steel sheet bracket 1.
The solder ball placement in step S2 specifically includes the following steps:
step S21, fixing the ball-leaking steel sheet 7 on the limiting frame 6, embedding the ball-carrying main body 8 into the limiting frame 6, and arranging the ball-leaking steel sheet 7 below the ball-leaking steel sheet;
step S22, a screw 18 passes through the recovery hole 17 and is locked to block a recovery channel of the recovery hole 17, then the solder balls 9 are scattered on the ball-leaking steel sheet 7, and the limiting frame 6 is rocked to enable the solder balls 9 to fall into the spherical grooves 10 on the ball-carrying main body 8 through the ball-leaking steel sheet 7 in a one-to-one correspondence;
in step S23, the recovery hole 17 is opened, the screw 18 above the recovery hole 17 is loosened and removed, the recovery passage of the recovery hole 17 is opened, and the spacer frame 6 is tilted to pour the excess solder ball 9 from the recovery hole 17.
The aligning of the solder ball 9 and the solder paste 13 in step S3 specifically includes the following steps:
step S31, placing the steel sheet bracket 1 and the BGA device 3 printed with the soldering paste in the step S13 on an SMT repair table, and ensuring that the surface of the BGA device 3 printed with the soldering paste faces downwards;
step S32, fixing the ball carrying main body 8 with the solder balls 9 placed in the step S22 on the SMT reworked PCB bracket 11;
step S33, using the alignment camera 12 to identify and grab the image of the solder ball 9 on the ball carrying main body 8, obtaining image data and transmitting the image data to the SMT repair station controller;
step S34, picking up the BGA device 3 by using the vacuum suction nozzle 14, and carrying out image recognition and grabbing on the soldering paste 13 on the BGA device 3 by using the alignment camera 12 to obtain image data and transmitting the image data to the SMT repair station controller;
step S35 of moving the BGA device 3 by the vacuum nozzle 14 so that the solder paste 13 corresponds to the solder balls 9 one by comparing the image data of the solder balls 9 and the solder paste 13 obtained in the step S32 and the step S33;
step S36, the vacuum suction nozzle 14 drives the BGA device 3 to move towards the ball carrying main body 8 until the solder paste 13 contacts with the solder balls 9, the manual handheld vacuum suction pen 15 is used for picking up the BGA device 3 with the adsorbed solder balls 9, and the step S4 is performed.
In summary, compared with the prior art, the BGA ball mounting device and the method based on the SMT repair table solve the problems of difficult solder ball placement operation, poor positioning precision, easy interference and the like, and have the advantages of strong adaptability, high economic benefit, strong operability, high reliability and the like.
While the present invention has been described in detail through the foregoing description of the preferred embodiment, it should be understood that the foregoing description is not to be considered as limiting the invention. Many modifications and substitutions of the present invention will become apparent to those of ordinary skill in the art upon reading the foregoing. Accordingly, the scope of the invention should be limited only by the attached claims.
Claims (8)
1. BGA ball mounting device based on SMT reprocesses platform, its characterized in that includes:
a solder paste printing fixture for printing an array of solder paste (13) on pads of the BGA device (3); the solder paste printing tool comprises: a steel sheet bracket (1) for fixing the steel sheet (4); a plurality of openings are formed in the steel sheet (4) in an array manner; a fastening bolt (2) for fixing the BGA device (3) with the steel sheet (4) so that the bonding pad on the BGA device (3) is aligned with the steel sheet (4); a scraper (5) for trowelling the solder paste (13) so that the solder paste (13) is printed in the opening of the steel sheet (4) and correspondingly attached to the bonding pads of the BGA device (3) in an array form;
ball fixture for put solder ball (9), include:
the ball-leaking steel sheet (7) is provided with openings in an array manner, and the positions of the openings correspond to solder paste (13) printed on a bonding pad of the BGA device (3);
the limiting frame (6) is used for fixing the ball leakage steel sheet (7);
a ball carrying body (8) made of polytetrafluoroethylene material, which is nested in the limit frame (6) and is positioned below the ball leaking steel sheet (7) and is used for receiving the solder balls (9) falling from the holes of the ball leaking steel sheet (7); the ball carrying main body (8) is provided with spherical grooves (10), the number of the spherical grooves (10) is larger than that of the solder balls (9) of the BGA device to be actually planted, and the depth of the spherical grooves (10) is 0.3mm;
and the SMT repair table is used for attaching ball to be planted BGA devices (3) printed with soldering paste to the solder balls (9) placed through the ball planting tool in a one-to-one correspondence manner through visual alignment.
2. The SMT rework station based BGA ball mounting device of claim 1, wherein said SMT rework station comprises:
the PCB bracket (11) is used for fixing the ball carrying main body (8) with the solder balls (9);
the alignment camera (12) is arranged at the top of the SMT repair table, is connected with a controller of the SMT repair table through signals, acquires image data of the solder balls (9) and the solder paste (13) and transmits the image data to the controller;
the vacuum suction nozzle (14) is fixedly connected with the SMT repair table and is connected with a controller of the SMT repair table through signals; the vacuum suction nozzle (14) sucks the BGA device (3) to move so that the solder paste (13) on the BGA device (3) is aligned with the solder balls (9) on the ball carrying body (8).
3. The BGA ball mounting device based on the SMT rework station of claim 2, wherein the thickness range of the ball-leaking steel sheet (7) is d/2 < thickness < d; the diameter range of the opening on the ball-leakage steel sheet (7) is d less than or equal to the opening size less than or equal to 1.3d, and each opening can only accommodate one solder ball (9); wherein d is the diameter of the solder ball (9).
4. A BGA ball mounting device based on an SMT rework station as claimed in claim 3, wherein the limit frame (6) is provided with a recovery hole (17) for recovering the redundant solder balls (9); the recovery hole (17) is also provided with a screw (18) for controlling the recovery hole (17) to be opened or closed.
5. A BGA ball mounting method based on an SMT rework station, implemented by using the BGA ball mounting device based on an SMT rework station as claimed in any one of claims 1 to 4, comprising the steps of:
step S1, printing solder paste (13) on a pad of a BGA device (3) by using a solder paste printing tool;
s2, orderly placing the solder balls (9) on the ball carrying main body (8) by utilizing a ball planting tool;
s3, utilizing an SMT repair table with a visual alignment system to align solder paste (13) formed by printing on the BGA device (3) and the solder balls (9) placed on the ball carrying main body (8), so that the solder balls (9) are adsorbed on the solder paste of the BGA device (3) in one-to-one correspondence;
and S4, placing the BGA device (3) with the absorbed solder balls (9) into a reflow furnace for welding.
6. The BGA ball mounting method based on the SMT rework station of claim 5, wherein the solder paste printing of step S1 comprises the steps of:
step S11, centering and fixing the steel sheet (4) on the steel sheet bracket (1), and connecting the BGA device (3) with the steel sheet (4) by using the fastening bolt (2);
step S12, printing soldering paste (13) on the back surface of the steel sheet bracket (1), and trowelling the soldering paste by using a scraper (5), so that the soldering paste is attached to the bonding pads of the BGA device (3) in an array form through a plurality of openings in the steel sheet (4);
and S13, after the printing of the soldering paste is finished, loosening the fastening bolt (2), taking down the steel sheet (4), and keeping the BGA device (3) after the printing of the soldering paste still placed on the steel sheet bracket (1).
7. The BGA ball mounting method of claim 6, wherein the solder ball placement of step S2 comprises the steps of:
s21, fixing a ball-leaking steel sheet (7) on a limiting frame (6), embedding a ball-carrying main body (8) into the limiting frame (6), and installing the ball-carrying main body below the ball-leaking steel sheet (7);
s22, enabling the screw (18) to penetrate through the recovery hole (17) and be locked, blocking a recovery channel of the recovery hole (17), then scattering the solder balls (9) on the ball-leaking steel sheet (7), and shaking the limiting frame (6) to enable the solder balls (9) to fall into the spherical grooves (10) of the ball-carrying main body (8) in one-to-one correspondence through the ball-leaking steel sheet (7);
and S23, opening the recovery hole (17), loosening and removing the screw (18) above the recovery hole (17), opening a recovery channel of the recovery hole (17), and tilting the limit frame (6) to enable the superfluous solder balls (9) to be poured out of the recovery hole (17).
8. The BGA ball mounting method based on the SMT rework station of claim 7, wherein the aligning of the solder ball (9) and the solder paste (13) in step S3 specifically comprises the steps of:
step S31, placing the steel sheet bracket (1) and the BGA device (3) printed with the soldering paste in the step S13 on an SMT repair table, and ensuring that the surface of the BGA device (3) printed with the soldering paste faces downwards;
step S32, fixing the ball carrying main body (8) with the solder balls (9) placed in the step S22 on the SMT reworked PCB bracket (11);
s33, performing image recognition and grabbing on the solder balls (9) on the ball carrying main body (8) by using the alignment camera (12), acquiring image data and transmitting the image data to the SMT repair station controller;
step S34, picking up the BGA device (3) by using a vacuum suction nozzle (14), recognizing and grabbing an image of the soldering paste (13) on the BGA device (3) by using a counterpoint camera (12), obtaining image data and transmitting the image data to an SMT repair station controller;
step S35, comparing the image data of the solder balls (9) and the solder paste (13) obtained in the step S32 and the step S33, and moving the BGA device (3) by the vacuum suction nozzle (14) so that the solder paste (13) corresponds to the solder balls (9) one by one;
step S36, the vacuum suction nozzle (14) drives the BGA device (3) to move towards the ball carrying main body (8) until the solder paste (13) is contacted with the solder balls (9), the manual handheld vacuum suction pen (15) is used for picking up the BGA device (3) with the adsorbed solder balls (9), and the step S4 is performed.
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| CN202111059831.2A CN113766823B (en) | 2021-09-10 | 2021-09-10 | BGA ball mounting device and method based on SMT repair station |
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| CN202111059831.2A CN113766823B (en) | 2021-09-10 | 2021-09-10 | BGA ball mounting device and method based on SMT repair station |
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| CN114980558B (en) * | 2022-05-13 | 2023-11-14 | 中国电子科技集团公司第二十四研究所 | BGA ball mounting method and ball mounting device |
| CN118737892B (en) * | 2024-06-04 | 2025-02-28 | 技感半导体设备(南通)有限公司 | A method for improving bulb implantation |
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