CN113764546A - Mini-LED device, LED display module and manufacturing method thereof - Google Patents
Mini-LED device, LED display module and manufacturing method thereof Download PDFInfo
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- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- H—ELECTRICITY
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- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
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Abstract
本发明涉及LED技术领域，尤其涉及一种Mini‑LED器件、LED显示模块及其制作方法。包括以下步骤：S1：将LED芯片通过顶针转移方式粘于玻璃板的下表面；S2：将粘于玻璃板的LED芯片压合于基板上，并通过激光固晶将LED芯片固定于基板上；S3：将基板粘合于载板的上表面进行模压，完成LED芯片封装；S4：将模压在载板上的基板进行切割，分割成单颗Mini‑LED器件；S5：将分割后的单颗Mini‑LED器件进行点测分选，并固定于蓝膜上。通过顶针转移方法可以快速转移LED芯片，且定位准确，所转移的LED芯片无需事先进行点测分选，而在封装后进行点测分选；因此，本发明提供的一种Mini‑LED器件、LED显示模块及其制作方法中提升了固晶精度、降低了成本、提升了显示质量和Mini‑LED器件的良率。
The invention relates to the technical field of LEDs, and in particular, to a Mini-LED device, an LED display module and a manufacturing method thereof. It includes the following steps: S1: sticking the LED chip on the lower surface of the glass plate by means of thimble transfer; S2: pressing the LED chip stuck on the glass plate on the substrate, and fixing the LED chip on the substrate by laser bonding; S3: Adhere the substrate to the upper surface of the carrier board for molding to complete the LED chip packaging; S4: Cut the substrate molded on the carrier board and divide it into single Mini-LED devices; S5: Divide the divided single chip The Mini-LED devices are spot-sorted and fixed on the blue film. The thimble transfer method can quickly transfer the LED chips, and the positioning is accurate, and the transferred LED chips do not need to be spot-measured and sorted in advance, but spot-measured and sorted after packaging; therefore, the present invention provides a Mini-LED device, In the LED display module and the manufacturing method thereof, the die-bonding precision is improved, the cost is reduced, and the display quality and the yield rate of the Mini-LED device are improved.
Description
Technical Field
The invention relates to the technical field of LEDs, in particular to a Mini-LED device, an LED display module and a manufacturing method thereof.
Background
The LED industry is one of the most active industries today, and LED display screen products gradually move into various fields of social life. Meanwhile, with the innovation and development of the LED display screen technology, the small-distance LED display screen module with high unit area resolution has become a mainstream product of the LED display screen, can display graphic images and videos with higher definition, can display more videos and image pictures, and can realize arbitrary large-area splicing particularly in the aspect of image splicing.
In the current production process of the LED display screen, two kinds are provided, one is COB (chip on board), and the other is SMD (surface mounted device); generally, COB has the best display effect, but the prior art has low die bonding yield, difficult repair, high product cost and high selling price; the SMD display screen product adopts mature technology, has lower cost, heavier granular sensation, low contrast and general display quality.
Disclosure of Invention
The invention aims to provide a Mini-LED device, an LED display module and a manufacturing method thereof, and aims to solve the problems of low die bonding yield, low contrast, general display quality and the like in the conventional LED display screen production process.
The invention provides a method for manufacturing a Mini-LED device, which comprises the following steps:
s1: adhering the LED chip to the lower surface of the glass plate in a thimble transferring mode;
s2: pressing the LED chip adhered on the glass plate on the substrate, and fixing the LED chip by laser die bonding
Is fixed on the substrate;
s3: bonding the substrate on the upper surface of the carrier plate for mould pressing to finish the packaging of the LED chip;
s4: cutting the substrate molded on the carrier plate, and dividing the substrate into single Mini-LED devices;
s5: and carrying out point measurement and sorting on the single divided Mini-LED devices, and fixing the single divided Mini-LED devices on a blue film.
Further, the lower surface of glass board is pasted and is had the double faced adhesive tape, the below of LED chip is provided with the soft glued membrane, it specifically does to glue the LED chip in the lower surface of glass board through thimble transfer mode:
the soft rubber film is fixed on the tensioning ring, the LED chips are adhered on the soft rubber film, the ejector pins are located below the soft rubber film, and the ejector pins are in top contact with the soft rubber film to enable the LED chips to be adhered on the double-sided adhesive one by one.
Further, the upper surface of carrier plate is stained with the colloid, the base plate is stained with the upper surface of carrier plate and is moulded specifically:
and placing the substrate on the colloid adhered to the upper surface of the carrier plate, and then manufacturing the packaging layer on the substrate and the LED chip by adopting a thermosetting or UV-cured material by using a mould pressing process.
Further, the cutting of the substrate molded on the carrier plate specifically includes:
the substrate pressed on the carrier plate is cut by using a water jet cutter, the cutting channels penetrate through the packaging layer and the substrate to a certain depth from the outer sides of the periphery of the LED chip to the colloid, then the transfer film is pasted on the top of the LED device, the colloid is irradiated from the back by using UV light, the colloid is de-glued, and a plurality of single Mini-LED devices fixed on the transfer film are formed after the colloid and the carrier plate are removed.
Further, the LED chip is a flip blue light Mini-LED chip, a flip green light Mini-LED chip or a flip red light Mini-LED chip.
The invention also provides a manufacturing method of the Mini-LED device, which comprises the following steps:
s1: providing a substrate;
s2: transferring and fixing the LED chip on the substrate in a die bonder transfer and reflow soldering manner, and then completing routing of the LED chip fixed on the substrate in a wire bonding manner;
s3: packaging the LED chip fixed on the substrate by a packaging layer manufactured by a mould pressing process to finish the packaging of the LED chip;
s4: cutting the substrate subjected to the LED chip packaging, and dividing the substrate into single Mini-LED devices;
s5: and carrying out point measurement and sorting on the single divided Mini-LED devices, and fixing the single divided Mini-LED devices on a blue film.
Further, the LED chip is a positively mounted red light Mini-LED chip, a positively mounted blue light Mini-LED chip or a positively mounted green light Mini-LED chip.
The invention also provides an LED display module, which comprises a substrate, and a pixel, a dam and a black matrix which are arranged on the upper surface of the substrate and are composed of the Mini-LED devices manufactured by the manufacturing method; the lower surface of the substrate comprises an input interface and a driving chip for driving the Mini-LED device; the dam is arranged at the edge of the upper surface of the substrate; polarizing films are arranged on the Mini-LED devices and the top of the box dam; the top of the black matrix is lower than the top of the Mini-LED device.
Further, each pixel of the display module corresponds to a group of light-emitting devices, and each group of light-emitting devices comprises a blue sub-pixel, a red sub-pixel and a green sub-pixel; the blue sub-pixel is a blue Mini-LED device, the red sub-pixel is a red Mini-LED device, and the green sub-pixel is a green Mini-LED device.
The invention also provides a manufacturing method of the LED display module, which is used for manufacturing any LED display module and comprises the following steps:
s1: moving the Mini-LED device fixed on the blue film to the substrate by a die bonder, and reflowing
Welding the Mini-LED device on the substrate;
s2: setting a dam made by dispensing at the edge of the upper surface of the substrate, and baking or UV irradiating
Curing after the shooting is finished;
s3: and arranging a black matrix made in a dispensing mode around the Mini-LED device on the substrate, and baking or carrying out UV irradiation to finish curing.
According to the Mini-LED device, the LED display module and the manufacturing method thereof, the LED chips can be quickly transferred through the thimble transfer method, the positioning is accurate, the transferred LED chips do not need to be subjected to point measurement and sorting in advance, the point measurement and sorting are carried out after the LED chips are packaged, and the point measurement is higher in light splitting precision, higher in speed and easier; a single Mini-LED device is fixed on the blue film, and a die bonder can be used in the die bonding process, so that the productivity can be ensured, the equipment investment can be reduced, and the die bonding precision can be improved; therefore, the Mini-LED device, the LED display module and the manufacturing method thereof provided by the invention have the advantages that the die bonding precision is improved, the cost is reduced, and the display quality and the yield of the Mini-LED device are improved.
Drawings
Fig. 1 is a schematic view of the entire manufacturing flow of the method for manufacturing a Mini-LED device according to an embodiment of the present invention.
Fig. 2 is a schematic view 1 of the whole manufacturing process of the method for manufacturing a Mini-LED device according to the embodiment of the present invention.
Fig. 3 is a schematic view 2 of the whole manufacturing process of the method for manufacturing the Mini-LED device according to the embodiment of the present invention.
Fig. 4 is a schematic view 3 of the whole manufacturing process of the method for manufacturing the Mini-LED device according to the embodiment of the present invention.
Fig. 5 is a schematic view 4 of the whole manufacturing process of the method for manufacturing the Mini-LED device according to the embodiment of the present invention.
Fig. 6 is a schematic view 5 of the whole manufacturing process of the method for manufacturing the Mini-LED device according to the embodiment of the present invention.
Fig. 7 is a schematic view 6 of the whole manufacturing process of the method for manufacturing the Mini-LED device according to the embodiment of the present invention.
Fig. 8 is a schematic view 7 of the whole manufacturing process of the method for manufacturing the Mini-LED device according to the embodiment of the present invention.
Fig. 9 is a schematic view 8 of the whole manufacturing process of the method for manufacturing the Mini-LED device according to the embodiment of the present invention.
Fig. 10 is a schematic view 9 of the whole manufacturing process of the method for manufacturing the Mini-LED device according to the embodiment of the present invention.
Fig. 11 is a schematic diagram of a Mini-LED device manufactured by the method for manufacturing a Mini-LED device according to the embodiment of the present invention.
Fig. 12 is a schematic view of the whole manufacturing flow of another manufacturing method of the Mini-LED device according to the embodiment of the present invention.
Fig. 13 is a schematic diagram of the Mini-LED device of fig. 12.
Fig. 14 is a schematic structural diagram of an LED display module according to an embodiment of the present invention.
Fig. 15 is a schematic view of the entire manufacturing process of the method for manufacturing an LED display module according to the embodiment of the present invention.
Fig. 16 is a schematic view of the whole manufacturing process of the method for manufacturing an LED display module according to the embodiment of the present invention 1.
Fig. 17 is a schematic view 2 of the whole manufacturing process of the method for manufacturing an LED display module according to the embodiment of the present invention.
Fig. 18 is a schematic view 3 of the whole manufacturing process of the method for manufacturing an LED display module according to the embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In order to explain the technical means of the present invention, the following description will be given by way of specific examples.
Referring to fig. 1 to 11, in an embodiment of the invention, a method for manufacturing a Mini-LED device is provided,
the method comprises the following steps:
s1: adhering the LED chip 200 to the lower surface of the glass plate 101 in a thimble transferring manner;
s2: pressing the LED chip 200 adhered to the glass plate 101 on the substrate 100, and fixing the LED chip 200 on the substrate 100 through laser die bonding; firstly, pressing the LED chip 200 on the substrate 100, and then irradiating the LED chip 200 from the upper part of the glass plate 101 by using laser 600 to make the LED chip 200 and the substrate 100 be in hard connection; the substrate 100 is a PCB, such as a BT substrate;
s3: adhering the substrate 100 to the upper surface of the carrier plate 102 for mold pressing to complete the packaging of the LED chip 200;
s4: cutting the substrate 100 molded on the carrier plate 102 into single Mini-LED devices 300, wherein the single Mini-LED devices 300 are single-color devices; the structure of the LED device 300 is shown in fig. 10, 130 is a device electrode, 120 is a PCB circuit, and 140 is a PCB conductive via;
s5: the single Mini-LED devices 300 divided into the pieces are subjected to point measurement and sorting and are fixed on the blue film 400; performing point measurement on the single Mini-LED device 300 to obtain the optical and electrical characteristics of each single Mini-LED device 300, as shown in fig. 9; sorting is performed according to optical and electrical characteristics using a pick-and-place machine, and the reverse film is transferred onto the blue film 400, as shown in fig. 11.
In the first embodiment of the present invention, referring to fig. 2, the double-sided adhesive tape 103 is adhered to the lower surface of the glass plate 101, the soft adhesive film 104 is disposed below the LED chip 200, and the adhering of the LED chip 200 to the lower surface of the glass plate 101 by the thimble transferring method specifically includes:
fixing the soft adhesive film 104 on the tension ring, adhering the LED chips 200 on the soft adhesive film 104, and positioning the ejector pin 110 below the soft adhesive film 104, so that the upper top of the ejector pin 110 contacts the soft adhesive film 104 to adhere the LED chips 200 on the double-sided adhesive tape 103 one by one; the positioning precision of the thimble transferring method can be as high as 5-10 μm, which is much higher than the 20 μm precision of the conventional pick-and-place die bonder, and the transferring speed can exceed 40 kUPH.
In the first embodiment of the present invention, referring to fig. 4 to 6, the adhesive 105 is adhered to the upper surface of the carrier 102, and the step of adhering the substrate 100 to the upper surface of the carrier 102 for molding specifically includes:
placing the substrate 100 on a colloid 105 adhered to the upper surface of the carrier plate 102, and then manufacturing a packaging layer 106 on the substrate 100 and the LED chip 200 by using a molding process and using a thermosetting or UV-curing material, wherein the colloid 105 is made of a UV adhesive 105; the material of the encapsulation layer 106 is a thermosetting or UV-curable resin material, and the resin material may contain one or more of scattering powder, dispersant, carbon black, melanin, and the like. The encapsulated structure is shown in fig. 4.
In the first embodiment of the present invention, referring to fig. 7, fig. 8 and fig. 10, the cutting of the substrate 100 molded on the carrier 102 specifically includes:
cutting the substrate 100 pressed on the carrier plate 102 by using a water jet cutter, wherein a cutting path is arranged on the outer side of the periphery of the LED chip 200 and penetrates through the packaging layer 106 and the substrate 100 to a certain depth from the colloid 105, so as to ensure that an independent single Mini-LED device 300 is obtained, and the device is fixed in the cutting process without splashing, offset and the like in the cutting process; the transfer film 500 is attached to the top of the Mini-LED device 300, then the colloid 105 is irradiated from the back side by using the UV light 700, the colloid is debonded, the adhesive force of the colloid is far smaller than that of the transfer film 500, and a plurality of single Mini-LED devices 300 fixed on the transfer film are formed after the colloid 105 and the carrier plate 102 are removed.
In the first embodiment of the present invention, the LED chip 200 is a flip blue Mini-LED chip, a flip green Mini-LED chip, or a flip red Mini-LED chip.
The manufacturing method of the Mini-LED device provided by the first embodiment of the invention has the following advantages:
the thimble transferring method can rapidly transfer the LED chips 200, the positioning is accurate, the transferred LED chips 200 can be as small as 0305(75x125 mu m), the LED chips 200 on the BT substrate 100 (frequently used for high-precision substrates) can be densely arranged, the BT substrate is saved, and the cost is reduced; the BT substrate is a single-layer plate, and a support required by a conventional packaging process is not used, so that the cost is further reduced; the transferred LED chips do not need to be subjected to point measurement and sorting in advance, and the incoming material cost of the LED chips is reduced. The point measurement and sorting are carried out after the packaging, on one hand, the reliability of the packaged LED chip is greatly improved, on the other hand, the poor LED chip can be screened out, the area of a bonding pad can be increased, and the push-pull force after welding is increased; furthermore, the point measurement sorting equipment is universal equipment and is suitable for devices with various sizes, and the light splitting braider is only suitable for one or more devices with fixed sizes; finally, the point measurement is higher in light splitting precision, higher in speed and easier in comparison with the conventional point measurement; the single Mini-LED device 300 is fixed on the blue film instead of being braided, so that a wafer bonder (P & P) can be used in the subsequent wafer bonding process instead of a traditional chip mounter (SMD), the productivity can be guaranteed, the equipment investment can be reduced, and the wafer bonding precision can be improved.
Referring to fig. 12 to 13, in a second embodiment of the present invention, the present invention further provides a method for manufacturing a Mini-LED device, including the following steps:
s1: providing a substrate 100, wherein the substrate is made of a BT substrate;
s2: the LED chip 200 is transferred and fixed on the substrate 100 through a die bonder transfer and reflow soldering manner, and then the LED chip 200 fixed on the substrate 100 is wire-bonded through a wire bonding manner;
s3: packaging the LED chip 200 fixed on the substrate 100 by the packaging layer 106 manufactured by a mould pressing process to complete the packaging of the LED chip 200;
s4: cutting the substrate 100 subjected to the LED chip 200 packaging, and dividing the substrate into single Mini-LED devices 300;
s5: the individual Mini-LED devices 300 divided into individual pieces were spot-tested and sorted and fixed on the blue film 400. In the second embodiment of the present invention, referring to fig. 13, the LED chip 200 is a red Mini-LED chip, a blue Mini-LED chip or a green Mini-LED chip.
Referring to fig. 14, in a third embodiment of the present invention, the invention further provides an LED display module, which includes a substrate 810, and a pixel, a dam 830 and a black matrix 840, which are disposed on the upper surface of the substrate 810 and are composed of the Mini-LED device 300 manufactured by any one of the above-mentioned manufacturing methods; the substrate 810 is a PCB made of FR-4, and the lower surface of the substrate 810 includes an input interface 850 and a driving chip 860 for driving the Mini-LED device 300; the dam 830 is disposed at the edge of the upper surface of the substrate 810; polarizing films 870 are arranged on the tops of the Mini-LED devices 300 and the dam 830; the top of the black matrix 840 is lower than the top of the Mini-LED device 300, and in fig. 14, 150 is an LED electrode pad, and 811 is a PCB pad.
In the third embodiment of the present invention, each pixel of the display module corresponds to a group of light emitting devices 821, each group of light emitting devices includes a blue sub-pixel, a red sub-pixel, and a green sub-pixel; the blue sub-pixel is a blue Mini-LED device, the red sub-pixel is a red Mini-LED device, and the green sub-pixel is a green Mini-LED device.
Referring to fig. 15 to 18, in a fourth embodiment of the present invention, the present invention further provides a method for manufacturing an LED display module, where the method for manufacturing the LED display module includes the following steps:
s1: moving the Mini-LED device 300 fixed on the blue film 400 to the substrate 810 through a die bonder, and welding the Mini-LED device 300 on the substrate 810 in a reflow soldering mode; the substrate 810 is a PCB, and the conventional processing object of the die bonder is an LED, not the single Mini-LED device 300 of the present application;
s2: arranging a dam 830 made by dispensing on the edge of the upper surface of the substrate 810, and baking or performing UV irradiation to complete curing;
s3: a black matrix 840 made by dispensing is disposed around the Mini-LED device 300 on the substrate 810, and baking or UV irradiation is performed to complete curing.
The manufacturing method of the LED display module provided by the fourth embodiment of the invention has the following advantages:
the use of a die bonder (pick and place, P & P) instead of a traditional chip mounter (SMD) can ensure the productivity, reduce the equipment investment and further improve the die bonding precision; the manufactured dam 840 can prevent collapse of the polarizing film 870 at the module edge; the polarizing film 870 can filter stray light and has a better display effect; the obtained display module has excellent ink color consistency; the pad pitch on the PCB is large (this pad pitch corresponds to the pad pitch on the Mini-LED device 300 rather than the pad pitch on the LED chip 200), and an HDI board is not needed, thereby greatly reducing the cost.
In the first to fourth embodiments of the invention, the Mini-LED device, the LED display module and the manufacturing method thereof provided by the invention improve die bonding accuracy, reduce cost, and improve display quality and yield of the Mini-LED device.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A method for manufacturing a Mini-LED device is characterized by comprising the following steps:
s1: adhering the LED chip to the lower surface of the glass plate in a thimble transferring mode;
s2: pressing the LED chip adhered to the glass plate on the substrate, and fixing the LED chip on the substrate through laser die bonding;
s3: bonding the substrate on the upper surface of the carrier plate for mould pressing to finish the packaging of the LED chip;
s4: cutting the substrate molded on the carrier plate, and dividing the substrate into single Mini-LED devices;
s5: and carrying out point measurement and sorting on the single divided Mini-LED devices, and fixing the single divided Mini-LED devices on a blue film.
2. The method for manufacturing a Mini-LED device according to claim 1, wherein the double-sided adhesive tape is adhered to the lower surface of the glass plate, the soft adhesive film is disposed below the LED chip, and the adhering the LED chip to the lower surface of the glass plate by means of the thimble transferring method specifically includes:
the soft rubber film is fixed on the tensioning ring, the LED chips are adhered on the soft rubber film, the ejector pins are located below the soft rubber film, and the ejector pins are in top contact with the soft rubber film to enable the LED chips to be adhered on the double-sided adhesive one by one.
3. The method for manufacturing a Mini-LED device according to claim 1, wherein the adhesive is adhered to the upper surface of the carrier, and the step of adhering the substrate to the upper surface of the carrier for molding specifically comprises:
and placing the substrate on the colloid adhered to the upper surface of the carrier plate, and then manufacturing the packaging layer on the substrate and the LED chip by adopting a thermosetting or UV-cured material by using a mould pressing process.
4. The method for manufacturing a Mini-LED device according to claim 1, wherein the step of cutting the substrate molded on the carrier plate comprises:
the substrate pressed on the carrier plate is cut by using a water jet cutter, the cutting channels penetrate through the packaging layer and the substrate to a certain depth from the outer sides of the periphery of the LED chip to the colloid, then the transfer film is pasted on the top of the LED device, the colloid is irradiated from the back by using UV light, the colloid is de-glued, and a plurality of single Mini-LED devices fixed on the transfer film are formed after the colloid and the carrier plate are removed.
5. The method of manufacturing a Mini-LED device according to claim 1, wherein the LED chip is a flip blue Mini-LED chip, a flip green Mini-LED chip, or a flip red Mini-LED chip.
6. A method for manufacturing a Mini-LED device is characterized by comprising the following steps:
s1: providing a substrate;
s2: transferring and fixing the LED chip on the substrate in a die bonder transfer and reflow soldering manner, and then completing routing of the LED chip fixed on the substrate in a wire bonding manner;
s3: packaging the LED chip fixed on the substrate by a packaging layer manufactured by a mould pressing process to finish the packaging of the LED chip;
s4: cutting the substrate subjected to the LED chip packaging, and dividing the substrate into single Mini-LED devices;
s5: and carrying out point measurement and sorting on the single divided Mini-LED devices, and fixing the single divided Mini-LED devices on a blue film.
7. The method of claim 6, wherein the LED chip is a red-front-mounted Mini-LED chip, a blue-front-mounted Mini-LED chip, or a green-front-mounted Mini-LED chip.
8. An LED display module, comprising a substrate, and pixels, dams and black matrixes formed by Mini-LED devices manufactured by the manufacturing method of claims 1 to 7 and arranged on the upper surface of the substrate; the lower surface of the substrate comprises an input interface and a driving chip for driving the Mini-LED device; the dam is arranged at the edge of the upper surface of the substrate; polarizing films are arranged on the Mini-LED devices and the top of the box dam; the top of the black matrix is lower than the top of the Mini-LED device.
9. The LED display module of claim 8, wherein each pixel of the display module corresponds to a group of light emitting devices, each group of the light emitting devices comprising a blue sub-pixel, a red sub-pixel, and a green sub-pixel; the blue sub-pixel is a blue Mini-LED device, the red sub-pixel is a red Mini-LED device, and the green sub-pixel is a green Mini-LED device.
10. A method for manufacturing an LED display module, for manufacturing the LED display module according to claim 8 or 9, the method comprising the steps of:
s1: moving the Mini-LED device fixed on the blue film to the substrate through a die bonder, and welding the Mini-LED device on the substrate through a reflow soldering mode;
s2: arranging a dam manufactured in a dispensing mode at the edge of the upper surface of the substrate, and baking or performing UV irradiation to finish curing;
s3: and arranging a black matrix made in a dispensing mode around the Mini-LED device on the substrate, and baking or carrying out UV irradiation to finish curing.
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| RJ01 | Rejection of invention patent application after publication |