CN113764455B - Splicing display panel and splicing display device - Google Patents

Abstract

The application discloses a spliced display panel and a spliced display device, wherein the spliced display panel comprises at least two spliced units, each spliced unit is provided with a display area and a binding area adjacent to the display area, and each spliced unit comprises: a substrate base plate, a plurality of LED chips and a flip-chip film; defining one side of the LED chip facing the substrate as a light emitting side, and defining one side of the LED chip far away from the substrate as a backlight side; when two adjacent splicing units are spliced, the flip chip film of one splicing unit extends to the backlight side of the other splicing unit. By changing the spliced display panel to emit light from one side of the substrate, all the flip chip films can be hidden to the backlight side, so that seamless splicing is realized, and the problem of yield reduction caused by excessive bending of the flip chip films can be avoided.

Description

Splicing display panel and splicing display device

technical field

The present application relates to the field of display technology, in particular to a spliced display panel and a spliced display device including the spliced display panel.

Background technique

In recent years, LED (light-emitting diode, light-emitting diode) displays have developed rapidly, and as pixel sizes continue to decrease, application scenarios have become wider. From the original indoor and outdoor large-scale long-distance advertising screens to indoor and outdoor short-distance high-definition display screens, LED displays will become the mainstream of indoor and outdoor large-screen high-definition displays in the future.

At present, large-screen LED displays mainly use module splicing technology, that is, small-sized LED modules are spliced into large screens of any size. At present, the LED modules that have been commercialized are all based on PCB (Printed Circuit Board, printed circuit board). The process precision is low, and it is difficult to achieve smaller pixels. Therefore, the glass-based LED display module gradually highlights its advantages. It has the advantages of using AM (active matrix) drive, less IC chips, better heat dissipation, high process precision, and can achieve a pixel size below 0.6mm. However, glass-based LED modules need to use COF (Chip On Film, chip-on-film) bonding technology. If splicing according to the conventional bonding method, it is necessary to sandwich the COF in the middle of the seam and bend the COF at a large angle. , it is easy to cause COF cracks and lead to a drop in yield, and it is impossible to achieve true seamless splicing.

Therefore, it is urgent to improve on the defects existing in the prior art.

Contents of the invention

The purpose of the present application is to provide a spliced display panel and a spliced display device, so as to realize the seamless splicing between the spliced display panels and avoid the problem of yield reduction caused by excessive bending of the chip-on-chip film.

An embodiment of the present application provides a splicing display panel, which includes at least two splicing units, each splicing unit has a display area and a binding area adjacent to the display area, and the splicing unit includes : a base substrate; a plurality of LED chips, the LED chips are arranged on the base substrate and located in the display area; a chip-on-chip film is arranged on the base substrate and located in the binding In a certain area; wherein, the side of the LED chip facing the base substrate is defined as the light-emitting side, and the side of the LED chip away from the base substrate is defined as the backlight side; when two adjacent splicing When the units are spliced, the COF of one of the spliced units extends to the backlight side of the other spliced unit.

Optionally, in some embodiments of the present application, the at least two splicing units include a first splicing unit and a second splicing unit; when the first splicing unit and the second splicing unit are spliced, the The COF of the binding area of the first splicing unit extends to the backlight side of the LED chip in the display area of the second splicing unit; The COF extends to the backlight side of the LED chip in the display area of the first splicing unit.

Optionally, in some embodiments of the present application, the base substrate is a transparent substrate, including a glass substrate or a polyimide substrate.

Optionally, in some embodiments of the present application, each of the splicing units further includes: an encapsulation layer covering the LED chip and the base substrate, and located in the display area, when two adjacent When two splicing units are spliced, the chip-on-film of one splicing unit is overlapped to the side of the encapsulation layer of the other splicing unit away from the LED chip.

Optionally, in some embodiments of the present application, the material of the encapsulation layer includes: epoxy resin or optical glue.

Optionally, in some embodiments of the present application, each splicing unit further includes: a light-shielding matrix disposed on the light-emitting side of the LED chip and exposing the LED chip.

Optionally, in some embodiments of the present application, the LED chip is a three-color LED chip, including: a red LED chip, a green LED chip, and a blue LED chip; the LED chip is flip-chip fixed on the substrate on the substrate.

Optionally, in some embodiments of the present application, the LED chip further includes a reflective layer, and the reflective layer is disposed on the backlight side of the LED chip.

Optionally, in some embodiments of the present application, the reflective layer includes: a distributed Bragg reflective film or a metal reflective film.

Correspondingly, an embodiment of the present application also provides a spliced display device including the spliced display panel described in any of the above embodiments, and the spliced display device further includes: at least two assembling mechanisms, each of which corresponds to It is arranged on the splicing unit to fix the splicing unit on a frame.

Compared with the prior art, the embodiment of the present application provides a splicing display panel, which includes at least two splicing units, namely a first splicing unit and a second splicing unit; when the first splicing unit and When the second splicing unit is spliced, the chip-on-film located in the bonding area of the first splicing unit extends to the backlight side of the LED chip in the display area of the second splicing unit; The COF in the bonding area of the second splicing unit extends to the backlight side of the LED chip in the display area of the first splicing unit. On the one hand, such setting can avoid the problem that the chip-on-chip film is bent at a large angle and cause a decrease in yield; on the other hand, the edges of the base substrate of the first splicing unit and the second splicing unit can be Complete contact, so as to realize seamless splicing, and improve the display effect of the spliced display panel.

Further, a reflective layer is provided on the backlight side of the LED chip, and the reflective layer can effectively improve the luminous effect of the LED chip and improve the brightness of the spliced display panel. The setting of the encapsulation layer can provide protection for the LED chip on the one hand, prevent the failure problem of the LED chip caused by the interference of the external environment, and on the other hand can provide protection for the covering of the adjacent splicing unit. The extension of the crystal film provides a flat support surface. Since the light-emitting side is on one side of the substrate, the metal traces on the substrate will reflect ambient light and affect the contrast of the environment. In this application, a light-shielding matrix is provided on the light-emitting side of the LED chip, which can effectively shield the metal traces. lines, and expose the LED chip at the same time, without affecting the light emitting effect of the spliced display panel, the contrast of the spliced display panel is improved, thereby improving the display effect.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained based on these drawings without any creative effort.

Fig. 1 is a schematic structural diagram of the spliced display panel described in the embodiment of the present application;

Fig. 2 is a schematic plan view of the spliced display panel described in the embodiment of the present application;

Fig. 3 is another schematic plan view of the spliced display panel described in the embodiment of the present application;

Fig. 4 is another schematic plan view of the spliced display panel described in the embodiment of the present application;

Fig. 5 is a schematic plan view of the structure of the spliced display device in the embodiment of the present application.

Explanation of main reference signs:

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application. In addition, it should be understood that the specific implementations described here are only used to illustrate and explain the present application, and are not intended to limit the present application. In this application, unless stated otherwise, the used orientation words such as "up", "down", "left" and "right" may refer to the direction of the actual use or working state of the device, or refer to the The drawing direction in the figure may also refer to two opposite directions; while "inside" and "outside" refer to the outline of the device.

The embodiment of the present application provides a spliced display panel 10, the spliced display panel 10 includes at least two spliced units 100, each spliced unit has a display area 11 and a binding area 12 adjacent to the display area 11 , each splicing unit 100 includes: a base substrate 110; a plurality of LED chips 120, the LED chips 120 are arranged on the base substrate 110 and located in the display area 11; a chip-on-chip film 130, set on the base substrate 110 and located in the bonding area 12; where the side of the LED chip 120 facing the base substrate 110 is defined as the light output side, and the LED chip 120 is defined as The side away from the base substrate 110 is the backlight side. Wherein, the light output side refers to the light output side of the LED chip 120 , may also refer to the light output side of the splicing unit 100 , or may refer to the light output side of the spliced display panel 10 . When two adjacent splicing units 100 are spliced, the COF 130 of one of the splicing units 100 extends to the backlight side of the other splicing unit 100 .

Specifically, please refer to FIG. 1 and FIG. 2. In one embodiment, the spliced display panel 10 includes two splicing units 100, namely a first splicing unit 101 and a second splicing unit 102; when the first splicing unit When the unit 101 is spliced with the second splicing unit 102, the chip-on-chip film 130 located in the bonding area 12 of the first splicing unit 101 extends to the LED in the display area 11 of the second splicing unit 102 The backlight side of the chip 120 ; the COF 130 located in the bonding area 12 of the second splicing unit 102 extends to the backlight side of the LED chip 120 in the display area 11 of the first splicing unit 101 . At this time, the base substrate 110 of the first splicing unit 101 is seamlessly attached to the base substrate 110 of the second splicing unit 102, and the binding region 12 of the first splicing unit 101 is bonded to the base substrate 110 of the second splicing unit 102. The bonding area 12 of the second splicing unit 102 is seamlessly bonded, which improves the display effect of the spliced display panel, and can also avoid the problem that the chip-on-chip film 130 is bent at a large angle and causes a decrease in yield.

In one embodiment, when the COF 130 located in the bonding area 12 of the second splicing unit 102 extends to the backlight side of the LED chip 120 in the display area 11 of the first splicing unit 101, The COF 130 located in the bonding area 12 of the second splicing unit 102 is fixed on the backlight side of the LED chip 120 in the display area 11 of the first splicing unit 101, and the fixing method includes but not Limited to optical glue fixation, adhesive tape fixation, etc.

In one embodiment, each splicing unit 100 further includes: an encapsulation layer 140 covering the LED chip 120 and the base substrate 110, and located in the display area 11, when two adjacent When the splicing units 100 are spliced, the COF 130 of one of the splicing units 100 is overlapped to the side of the encapsulation layer 140 of the other splicing unit 100 away from the LED chip 120 . The material of the encapsulation layer 140 includes: epoxy resin or optical glue. The setting of the encapsulation layer 140 can provide protection for the LED chip 120 on the one hand, and prevent the failure of the LED chip 120 caused by the interference of the external environment, such as: water vapor, oxygen, etc.; The extension of the COF 130 adjacent to the splicing unit 100 provides a flat supporting surface.

In one embodiment, since the light-emitting side is on one side of the base substrate 110, the metal traces on the base substrate 110 will reflect ambient light and affect the contrast of the environment, and each splicing unit 100 further includes: a The light shielding matrix 150 is disposed on the light emitting side of the LED chips 120 and exposes the LED chips 120 . Specifically, the light-shielding matrix 150 can be set on the side of the base substrate 110 facing the LED chip 120, or on the side of the base substrate 110 away from the LED chip 120, as long as the setting requirements are satisfied. It only needs to be on the light emitting side of the LED chip 120 . In the present application, the light-shielding matrix 150 is provided on the light-emitting side of the LED chip 120, which can effectively shield the metal wiring and expose the LED chip 120 at the same time, without affecting the light-emitting effect of the spliced display panel 10. , improving the contrast of the spliced display panel 10, thereby improving the display effect.

In this application, the LED chip 120 is a three-color LED chip, including: a red LED chip 121, a green LED chip 122, and a blue LED chip 123; the LED chip 120 is flip-chip fixed on the base substrate 110 , so that the light-emitting side faces the base substrate 110, so that the edges of the base substrate 110 of the first splicing unit 101 and the second splicing unit 102 can be in full contact, thereby realizing seamless splicing and improving The display effect of the mosaic display panel. In one embodiment, the LED chip 120 further includes a reflective layer 124 disposed on the backlight side of the LED chip 120 . The reflective layer 124 includes a distributed Bragg reflective film or a metal reflective film, such as a silver film, an aluminum film, and the like. The reflective layer 124 can effectively improve the luminous effect of the LED chip 120 and improve the brightness of the spliced display panel 10 .

In this application, the base substrate 110 is a transparent substrate, including a glass substrate or a polyimide substrate, and the transparent substrate can make the light-emitting side of the LED chip face the side of the base substrate 110, It provides possibility for seamless splicing of the splicing unit 100 . In one embodiment, due to the seamless splicing of the splicing unit 100, the edges of the base substrates 110 can be strengthened or softened accordingly to prevent two adjacent base substrates 110 from being seamlessly spliced. Cracking of the base substrate 110 due to interference.

Please refer to FIG. 1 and FIG. 3. In one embodiment, the spliced display panel 10 includes at least two splicing units 100, which are respectively a first splicing unit 101 and a second splicing unit 102. In this embodiment, the first splicing unit 100 Four second splicing units 102 are respectively spliced around the splicing unit 101, and the base substrate 110 of the first splicing unit 101 is all adjacent to the substrates of the four second splicing units 102. The substrate 110 is seamlessly attached; and the binding area 12 of the first splicing unit 101 is arranged around the display area 11, and the first splicing unit 101 is surrounded by the chip-on-chip film 130, and Respectively extend to the backlight side of the LED chip 120 of the display area 11 of the other four second splicing units 102; The bonding regions 12 are all provided with the COF 130 , and respectively extend to the backlight side of the LED chip 120 of the display region 11 of the first splicing unit 101 . It can be understood that, in this embodiment, the second splicing unit 102 can also serve as the first splicing unit 101, that is, when one of the second splicing units 102 is spliced with four other fourth splicing units 102 If there are two splicing units 102, the second splicing unit 102 in the middle acts as the first splicing unit 101. Therefore, the splicing units 100 of the splicing display panel 10 can be combined freely, and are not limited to the splicing methods shown in FIGS. 2 to 3 .

Please refer to FIG. 1 and FIG. 4 , in one embodiment, the splicing display panel 10 includes four splicing units 100 , which are the first splicing unit 101 , the second splicing unit 102 , the third splicing unit 103 and the fourth splicing unit 100 . unit 104; when the four splicing units 100 are spliced, the chip-on-film 130 located in the binding area 12 of the first splicing unit 101 extends to all the display areas 11 of the second splicing unit 102 respectively The backlight side of the LED chip 120 and the backlight side of the LED chip 120 of the display area 11 of the third splicing unit 103; the chip-on-film 130 located in the binding area 12 of the second splicing unit 102 extending to the backlight side of the LED chip 120 of the display area 11 of the first splicing unit 101 and the backlight side of the LED chip 120 of the display area 11 of the fourth splicing unit 104; The COF 130 of the bonding area 12 of the unit 103 extends to the backlight side of the LED chip 120 of the display area 11 of the first splicing unit 101 and the display area 11 of the fourth splicing unit 104 respectively. The backlight side of the LED chip 120; the chip-on-film 130 located in the binding area 12 of the fourth splicing unit 104 respectively extends to the LED chip 120 of the display area 11 of the second splicing unit 102 The backlight side and the backlight side of the LED chips 120 of the display area 11 of the third splicing unit 103 . At this time, the base substrate 110 of the first splicing unit 101 and the fourth splicing unit 104 are respectively connected with the base substrate 110 of the second splicing unit 102 and the third splicing unit 103 The base substrate 110 is seamlessly bonded; the binding regions 12 of the first splicing unit 101 and the fourth splicing unit 104 are respectively bound to the second splicing unit 102 and the third splicing unit 103 The fixed area 12 is seamlessly bonded to improve the display effect of the tiled display panel, and can also avoid the problem that the chip-on-chip film 130 is bent at a large angle, resulting in a decrease in yield.

Correspondingly, please refer to FIG. 5 , the embodiment of the present application also provides a spliced display device 1 including the spliced display panel 10 described in any of the above embodiments, and the spliced display device 1 further includes: at least two spliced mechanisms 20 Each of the splicing mechanisms 20 is set corresponding to each of the splicing units 100, so as to fix the splicing units 100 on a frame, so as to realize a stable connection between a plurality of the splicing display panels 10, so that multiple The multiple small-sized spliced display panels 10 are integrated into a whole large-sized display panel, and due to the seamless splicing between each small-sized spliced display panel 10, the display of the integrated large-sized display panel can be The effect is better, and the market competitiveness of the product is improved.

To sum up, the embodiment of the present application provides a splicing display panel 10, the splicing display panel 10 includes at least two splicing units 100, namely the first splicing unit 101 and the second splicing unit 102; when the first splicing unit 101 is spliced with the second splicing unit 102, the chip-on-chip film 130 located in the bonding area 12 of the first splicing unit 101 extends to the LED chip in the display area 11 of the second splicing unit 102 120 on the backlight side; the COF 130 located in the bonding area 12 of the second splicing unit 102 extends to the backlight side of the LED chip 120 in the display area 11 of the first splicing unit 101 . On the one hand, such setting can avoid the problem that the chip-on-chip film 130 is bent at a large angle and cause a decrease in yield; on the other hand, the base substrate of the first splicing unit 101 and the second splicing unit 102 The edges of 110 can be in full contact, so as to realize seamless splicing and improve the display effect of the spliced display panel 10 .

Further, the backlight side of the LED chip 120 is provided with a reflective layer 124 , the reflective layer 124 can effectively improve the luminous effect of the LED chip 120 and enhance the brightness of the spliced display panel 10 . The setting of the encapsulation layer 140 can provide protection for the LED chip 120 on the one hand, prevent the failure problem of the LED chip 120 caused by the interference of the external environment, and on the other hand can provide protection for the LED chip 120 adjacent to the splicing unit 100 The extension of the COF 130 provides a flat supporting surface. Since the light-emitting side is on the side of the base substrate 110, the metal traces on the base substrate 110 will reflect ambient light and affect the environmental contrast. In this application, a light-shielding matrix 150 is provided on the light-emitting side of the LED chip 120, which can effectively The metal traces are shielded and the LED chips 120 are exposed at the same time, without affecting the light emitting effect of the spliced display panel 10, the contrast of the spliced display panel 10 is improved, thereby improving the display effect.

In the foregoing embodiments, the descriptions of each embodiment have their own emphases, and for parts not described in detail in a certain embodiment, reference may be made to relevant descriptions of other embodiments.

The technical solutions provided by the embodiments of the present application have been introduced in detail above. In this paper, specific examples have been used to illustrate the principles and implementation methods of the present application. The descriptions of the above embodiments are only used to help understand the methods and cores of the present application. At the same time, for those skilled in the art, according to the idea of this application, there will be changes in the specific implementation and application scope. In summary, the content of this specification should not be construed as limiting the application.

Claims (9)

1. A splicing display panel, characterized in that: the splicing display panel includes at least two splicing units, each splicing unit has a display area and a binding area adjacent to the display area, and the splicing unit include: a base substrate; A plurality of LED chips, the LED chips are arranged on the base substrate and located in the display area; A chip-on-chip film disposed on the base substrate and located in the bonding area; Wherein, the side of the LED chip facing the base substrate is defined as the light output side, and the side of the LED chip away from the base substrate is defined as the backlight side; the at least two splicing units include a first splicing unit unit and the second splicing unit, when the first splicing unit is spliced with the second splicing unit, the chip-on-film located in the bonding area of the first splicing unit extends to the second splicing unit On the backlight side of the LED chip in the display area, the chip-on-film located in the bonding area of the second splicing unit extends to the backlight of the LED chip in the display area of the first splicing unit side. 2. The spliced display panel according to claim 1, wherein the base substrate is a transparent substrate, including a glass substrate or a polyimide substrate. 3. The splicing display panel according to claim 1, wherein the splicing unit further comprises: An encapsulation layer, covering the LED chip and the base substrate, and located in the display area, when two adjacent splicing units are spliced, the chip-on-chip film of one of the splicing units overlaps To the side of the encapsulation layer of another splicing unit away from the LED chip. 4. The spliced display panel according to claim 3, wherein the material of the encapsulation layer comprises: epoxy resin or optical glue. 5. The splicing display panel according to claim 1, wherein the splicing unit further comprises: A light-shielding matrix is arranged on the light-emitting side of the LED chip and exposes the LED chip. 6. The spliced display panel according to claim 1, wherein the LED chip is a three-color LED chip, including: a red LED chip, a green LED chip and a blue LED chip; the LED chip is flip-chip fixed on on the base substrate. 7. The spliced display panel according to claim 6, wherein the LED chip further comprises a reflective layer, and the reflective layer is disposed on the backlight side of the LED chip. 8. The spliced display panel according to claim 7, wherein the reflective layer comprises: a distributed Bragg reflective film or a metal reflective film. 9. A spliced display device, characterized in that it comprises the spliced display panel according to any one of claims 1 to 8, and the spliced display device further comprises: At least two assembling mechanisms are arranged corresponding to the splicing unit, so as to fix the splicing unit on a frame.